114results about "Standard structures" patented technology

Protective containers for electronic equipment, and methods of testing and manufacture thereof, are provided. Enclosure systems and methods for protecting telecommunications equipment from electromagnetic fields include cabinets having a maximum width dimension that does not exceed about 26 inches and a maximum depth dimension that does not exceed about 22⅜ inches. The cabinets provide a HEMP protection level to electronic equipment housed therein that meets a HEMP protection level according to MIL-STD-188-125-1.

Housings for electrical or electronic components made using braid or woven fabric sheets having multiple sections treated with different materials as well as processes and materials for making such housings are disclosed.

An RF management system especially suitable for use in CATV head end environments is disclosed. The system is characterized by a basic rack-mountable chassis component that can be configured for both front and rear mount applications, for different cable management solutions and for accepting eighteen passive RF modules or nine active RF modules or a combination of passive and active RF circuit modules. The active configuration of the chassis has an integrated power bus with at least nine connectors for receiving up to nine active RF circuit modules. The active RF circuit modules, such as power supplies and amplifiers are each provided with a “floating” connector for ease in connecting the power supply module or amplifier module to the power bus. The RF power supply module is capable of supplying power to all the active RF modules in the chassis as well as to active RF modules mounted in one or more other chassis in the rack.

Protective containers for electronic equipment, and methods of testing, use, and / or manufacture thereof, are provided. The cabinets provide a HEMP protection level to electronic equipment housed therein that meets a HEMP protection level according to MIL-STD-188-125-1.

An electronics module comprises a housing; and a plurality of electronic and electrical components for example fans. The module includes electromagnetic shielding for example perforated panels side walls etc. that is associated with the housing and / or the electronic components, and which provides a Faraday cage for the electronic components. The shielding is constructed so that one or more of the components can be removed from the module while the module is in operation substantially without affecting the integrity of the Faraday cage. The module enables certain components thereof to be replaced without adding to the downtime of the system or increasing electromagnetic interference.

The invention discloses a modularized cabinet, and the cabinet comprises a cabinet frame. The cabinet frame is formed by the combination of an upper integrated guide rail, a lower integrated guide rail, a left side plate, and a right side plate. The front of the cabinet frame is provided with a front panel, and the back of the cabinet frame is provided with a rear panel. A plurality of function modules are inserted between the upper and lower integrated guide rails. The front and back panels, the upper and lower integrated guide rails and the left and right side plates jointly form an isolation cavity, and the isolation cavity is used for the electromagnetic shielding and salt mist isolation for a function module. Cover plates are disposed above the upper integrated guide rail and below the lower integrated guide rail. Cooling channels are formed between the cover plates and the upper and lower integrated guide rails, and are used for the circulating of cooling air flows, so as to cool the function module.

A circuit pack housing for providing EMI protection for a circuit pack which may be inserted into an electronics system such as a telecommunications base station cabinet. The circuit pack housing has a single piece plastic design which surrounds the enclosed circuit pack. The internal walls of the circuit pack housing are metalized, and the inner surface of the housing comprises one or more grounding tabs with metalized surfaces. The metalized plastic circuit pack housing also comprises two opposite living hinges and a self latching mechanism, such that when the circuit pack is placed inside the housing and the housing is closed on itself (i.e., with use of the living hinges), the circuit pack is sealed within the housing and protected from EMI thereby. Moreover, the housing may include protruding flexible tabs at the ends thereof, which advantageously seals around the connector which energizes the circuit pack.

An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.

An avionics chassis comprises a composite housing, a radio wave shield, and a lightning strike conductive path, wherein the radio wave shield attenuates electromagnetic interference entering and leaving the housing, and the lightning strike conductive path directs the current from a lightning strike away from an interior of the housing.

Housings for electrical or electronic components made using braid or woven fabric sheets having multiple sections treated with different materials as well as processes and materials for making such housings are disclosed.

Electric or electronic modules may be carried by an electrically shielded module carrier that includes a cover element and a base element enclosing at least one mounting region which is divided into a front section and a rear section by an intermediate wall card. Holding elements for inserted flat modules are laterally provided in each section and include guiding gratings which face each other in pairs and are integrated into an electromagnetic shield. The cover element and the base element are connected to the guiding gratings of the front section in a fixed manner and are detachably connected to the guiding gratings of the rear section.

A module for containing a circuit is provided that attenuates emitted signals without the use of a cover. The module includes a housing and a receptacle. The housing has a front having a certain thickness and the receptacle is accessible from the front of the housing. The receptacle is shaped to receive a circuit component and forms a waveguide.

An electrical bridge is provided for electrically connecting first and second electronic modules that include first and second external chassis, respectively. The electrical bridge includes a rigid housing extending along a fixed path from a first end to a second end, and first and second electrical contacts held by the housing. The first and second electrical contacts are positioned at the first and second ends, respectively, of the housing. An electrical pathway is defined within the housing from the first electrical contact to the second electrical contact such that the first and second electrical contacts are electrically connected. The first and second ends of the housing are configured to be mounted to the first and second external chassis, respectively, such that the first and second electrical contacts are configured to mate with, and thereby electrically connect to, the first and second electronic modules, respectively.

A chassis arrangement includes different depth cards with associated Faraday cages. The chassis arrangement provides support for a first set of cards at a first depth and with a first set of fans, the chassis forming a Faraday cage with either set of cards. The second depth can be greater than the first depth, providing additional space for components to support additional functionality. Changing the first set of fans with the second set of fans and upgrading the first set of cards to the second set of cards is performed in-service, extending a life span of the chassis through in-service upgrades to multiple chassis configurations.

A rack-based information handling system (RIHS) includes: a rack chassis having a plurality of interconnected panels forming a volumetric space having a front section and a rear section, both with opposing side panels forming a front access space and a rear access space, respectively, between corresponding opposing side panels; one or more IT gear sleds that are inserted into the front section of the rack chassis; and a pair of front expansion panels that are added to the rack chassis and which extend past an end of the opposing side panels at the front section of the rack chassis to provide a deeper IT bay within the front section and enable insertion of longer-than-standard depth IT gear within the rack chassis. The front expansion panels are cable management panels that include at least one strap that is utilized to secure one or more cables extending from one or more IT gear inserted into the rack chassis.

A hybrid plastic-metal faceplate having reduced EMI emissions for use with electric circuit card rack systems. The faceplate uses an electrically conductive thermoplastic front plate that is simpler to construct. The faceplate also includes a first metal element in electrically conducting contact with the front plate and a second metal element in electrically conducting contact with the front plate. The plastic-metal faceplates have an EMI shielding effectiveness of 20 dB or greater across the range of frequencies of 0 MHz to 1.0 GHz. The faceplate may be used in a variety of different applications, such as electric circuit card rack systems, to reduce EMI (electromagnetic interference) emissions from the electric circuit card system.

A modem shelf is described in which internal dividers separate the interior of the shelf into individually isolated Faraday cages that effectively suppress EMI generated by circuit cards mounted within the shelf and isolate the circuit cards from EMI originating outside the shelf and from cards mounted within the shelf. The shelf enables high-speed data communications over a twisted pair network of about 10 Mbps or more. The top and bottom of the shelf are made of relatively thin sheet material, which maximizes the vertical dimension of the circuit cards mounted in the shelf and thus the area on which circuitry can be placed.

A rack-based information handling system (RIHS) includes: a rack chassis having a plurality of interconnected panels forming a volumetric space having a front section and a rear section, both with opposing side panels forming a front access space and a rear access space, respectively, between corresponding opposing side panels; one or more IT gear sleds that are inserted into the front section of the rack chassis; and a pair of front expansion panels that are added to the rack chassis and which extend past an end of the opposing side panels at the front section of the rack chassis to provide a deeper IT bay within the front section and enable insertion of longer-than-standard depth IT gear within the rack chassis. The front expansion panels are cable management panels that include at least one strap that is utilized to secure one or more cables extending from one or more IT gear inserted into the rack chassis.

It is an object of the present invention to provide a cabinet capable of containing various devices and securely attaching / detaching an additional device thereto / therefrom, and to provide an additional device. In order to achieve the object, a cabinet according to the present invention includes: a conductive cylinder having an aperture into which the additional device is fitted by insertion and containing an electronic device, the aperture having a folded edge, the additional device operating in parallel with the electronic device; and a reinforcing member supported with a portion of an inner wall of the cylinder and disposed on a boundary between two areas inside the cylinder where the electronic device and the additional device are disposed respectively, the portion of the inner wall being more inside than the folded portion of the aperture.

Methods and apparatus for providing electromagnetic interference (EMI) shielding for a module receiving area within a computer server housing configured to receive an input / output (IO) module are disclosed. The module receiving area is covered with a door. EMI shielding is provided by transitioning the door from a closed position to an open position in response to a force applied by the IO module, maintaining contact between the IO module and the door while the door is open to provide EMI shielding for the module receiving area when the IO module is present, and transitioning the door from the open position to the closed position in response to removal of the force applied by the IO module when the IO module is withdrawn from the module receiving area to provide EMI shielding for the module receiving area when the IO module is not present.

An improved carrier comprises a tray, an EMC component, and a bezel. The EMC component comprises a top spring set and a bottom spring set. Each spring set comprises a plurality of spring biased contacts connected by a plate and a bar so that each spring set moves in unison when depressed or released. Each tray has a first flange and a second flange and each of the flanges has a cut out portion. When an improved carrier is moved out of an array enclosure, the flanges depress the top spring of the EMC component of the carrier below. When the improved carrier is moved into the array enclosure, the flanges depress the top spring set of the carrier below until the top spring set of the carrier below is released by the cut-out portions of the flanges. When released, the top spring set of the carrier below contacts the bottom spring set of the carrier above to form a continuous EMC shield.

A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.

A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit card and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a housing bezel, disposed relative to the cassette housing so as to be associated with the cable opening and translatable therein, the housing bezel is in electrical communication with the printed circuit card and translatable therewith when the printed circuit card is engaged and disengaged with a printed circuit board, and an EMC sealing device disposed between the housing bezel and the cassette housing, the EMC sealing device configured to provide a movable EMC seal proximate the cable opening while still allowing airflow therethrough while covering a portion of the cable opening created between the housing and the housing bezel upon translation of the bezel.

An RF management system especially suitable for use in CATV head end environments is disclosed. The system is characterized by a basic rack-mountable chassis component that can be configured for both front and rear mount applications, for different cable management solutions and for accepting eighteen passive RF modules or nine active RF modules or a combination of passive and active RF circuit modules. The active configuration of the chassis has an integrated power bus with at least nine connectors for receiving up to nine active RF circuit modules. The active RF circuit modules, such as power supplies and amplifiers are each provided with a “floating” connector for ease in connecting the power supply module or amplifier module to the power bus. The RF power supply module is capable of supplying power to all the active RF modules in the chassis as well as to active RF modules mounted in one or more other chassis in the rack.

An electronic apparatus includes a cabinet and a number of electronic devices mounted in the cabinet. The cabinet includes a bottom plate and a top plate. A top of each electronic device forms two flanges, and a bottom of each electronic device forms a number of first electromagnetic radiation shielding units. The top and bottom plates includes a number of second electromagnetic radiation shielding units for respectively resisting against the first shielding units and the flanges of the electronic elements adjacent to the top plate and bottom plate of the cabinet. The first electromagnetic radiation shielding units and the flanges of two neighboring electronic devices resist against each other.

Protective containers for electronic equipment, and methods of testing, use, and / or manufacture thereof, are provided. The cabinets provide a HEMP protection level to electronic equipment housed therein that meets a HEMP protection level according to MIL-STD-188-125-1.

An avionics chassis comprises a composite housing, a radio wave shield, and a lightning strike conductive path, wherein the radio wave shield attenuates electromagnetic interference entering and leaving the housing, and the lightning strike conductive path directs the current from a lightning strike away from an interior of the housing.