The invention discloses a butterfly-shaped semiconductor laser automatic coupling packaging device and relates to the automatic coupling packing field of an electronic device. The automatic coupling packaging device includes a column, a cross beam, and a fiber clamp, a lens clamp mechanism, a lower clamp device and a material disc mechanism arranged on a base, and a laser power meter, wherein thefiber clamp, the lens clamp mechanism and a fiber automatic angle adjusting welding device can be adjusted in position to realize accurate coupling and packaging of a butterfly-shaped semiconductor laser. The device is advantaged in that the structure design is reasonable, the whole subsequent operation from coupling, alignment and packaging can be automatically completed, compared with a traditional hand-operated production line, advantages of high automatic degree, simple and convenient operation, high production efficiency, low production cost and stable product quality are achieved.