The invention provides a production method for manufacturing a 12-inch
wafer by using an 8-inch
wafer production line, and the method comprises the following steps: S1, taking a
wafer, obtaining a 12-inch wafer, and enabling the thickness of the 12-inch wafer to be 700 [mu] m; S2,
numbering: dividing the 12-inch wafer into four parts with the same size, and
numbering each part; S3,
slicing,
cutting each numbered part to equally divide the 12-inch wafer into four parts of sub-wafers; S4, trimming, trimming the two corners, far away from the circle center, of the sub-wafer; S5, performing
thinning, and
thinning the trimmed sub-wafers; S6, performing scribing, wherein scribing is carried out on the thinned sub-wafers; S7, wafer mounting, mounting the scribed sub-wafers, and packaging each sub-wafer into a 12-inch wafer according to the serial number; and in S4-S7,
processing by adopting an 8-inch wafer
production line. According to the production method, the purpose of manufacturing the 12-inch wafer on the 8-inch wafer
production line can be achieved, so that the
economic pressure of a small factory is effectively relieved, and the development of semiconductors and economy is promoted.