The invention provides a computer PCB heat dissipation spraying device. The device comprises a base, an
machine frame is arranged on the base, guide rails are arranged at the inner bottom of the
machine frame, carrying locking mechanisms are arranged on the guide rail, the carrying locking mechanisms are arranged on the two sides of the
machine frame; one side of the middle part of the machine frame is provided with a
servo motor and a driving wheel, the front part of the
servo motor is provided with a driving shaft, the driving shaft is arranged at the axial position of the driving wheel, theother side of the middle part of the rack is provided with a driven wheel, the driven wheel is installed on the other side of the middle part of the machine frame through a first installing shaft, arotating belt is wound between the driven wheel and the driving wheel; a
liquid storage bin is arranged at the lower part of the rotary belt, the
liquid storage bin is parallel to the longitudinal direction of the rotary belt, and a plurality of spray nozzles are arranged at the bottom of the
liquid storage bin; the spray nozzles are arranged above the guide rail; a heat dissipation paste
mixing tank is arranged at the top of the machine frame, and a lower liquid
pipe is connected to the bottom of the heat dissipation paste
mixing tank. According to the device, a layer of heat dissipation paste layer is formed on the surface of a computer PCB, so that the spraying efficiency is greatly improved.