A wafer uniform glue baking machine disclosed by the present invention comprises a rack, the upper surface of the rack is provided with a material receiving and supplying rack, a manipulator, a uniform glue module and a baking table, the material receiving and supplying rack is used for placing a wafer, the uniform glue module comprises a gluing mechanism and a uniform glue spin-drying mechanism, the gluing mechanism is used for gluing the wafer, the uniform glue spin-drying mechanism is used for uniformly smearing glue on the wafer, and the baking table is used for baking the wafer. The baking table is used for drying the glued wafer; according to the invention, after the wafer is taken out from the material receiving and supplying frame through the manipulator, the wafer is placed on the glue uniformizing module for glue coating and uniform smearing, the wafer is transferred to the baking table after glue coating is completed, and finally the dried wafer is placed in the material receiving and supplying frame, so that automatic glue coating, glue uniformizing and baking of the wafer are realized, the automation degree of the equipment is improved, and the production efficiency is improved. According to the photoresist coating device, the coating uniformity is guaranteed, meanwhile, the thickness of the photoresist on the surface meets the requirement, then the photoresist is dried through the baking table, the baking quality is guaranteed, and the photoresist coating uniformity is further improved.