The present invention discloses:a resin composition comprising, as essential components, 100 parts by
mass of a component (A) which is an
epoxy resin, 41 to 80 parts by
mass of a component (B) which is
thermoplastic resin particles, and 20 to 50 parts by
mass (in terms of diaminodiphenylsulfone) of a component (C) which is diaminodiphenylsulfone microencapsulated with a
coating agent, in which resin composition the
thermoplastic resin particles (B) comprise at least
thermoplastic resin particles (B1) having an average particle
diameter of 1 to 50 μm and thermoplastic resin particles (B2) having an average particle
diameter of 2 to 100 μm at a
mass ratio of 3:1 to 1:3 and the average particle
diameter ratio D2 / D1 of the average particle diameter D2 of the thermoplastic resin particles (B2) to the average particle diameter D1 of the thermoplastic resin particles (B1) is 2 or more, anda prepreg produced using the resin composition.