The invention discloses an LED
flip chip packaging device and a packaging process thereof, which relate to the technical field of LED
flip chip packaging. The LED
flip chip packaging device specifically comprises a substrate and a
chip, wherein the substrate is provided with a
copper foil, the
copper foil is plated with 10u silver, the outer wall of the top of the substrate is provided with a limiting ring, and
tin points are welded on the outer wall of the top of the substrate in the limiting ring; and
welding points are arranged on the surface of the
chip. The packaging process comprises thefollowing steps of preparing: preparing a
chip to be welded, and preparing a substrate with a limiting ring corresponding to the chip, and
die bonding: dispensing a
tin point in the limiting ring onthe substrate, fixing the flip chip on the substrate, and enabling the
welding point to correspond to the
tin point in position. The chip is reversely welded on the substrate through the
welding points and the tin points, no baking or wire welding is needed after
die bonding is completed,
reflow soldering is directly carried out, and the production efficiency is improved; due to the arrangement ofthe limiting ring, tin points and welding points can be conveniently positioned.