The invention discloses an
electromagnetic interference (EMI) shielding film, a circuit board and a preparation method of the EMI shielding film. The EMI shielding film comprises a first shielding layer, a bonding layer, a second shielding layer, a third shielding layer and an
adhesive film layer, wherein the first shielding layer, the bonding layer and the second shielding layer are arranged sequentially in a stacked mode; bulges are arranged on the side, away from the bonding layer, of the second shielding layer; the third shielding layer is arranged on the side, provided with the bulges, ofthe second shielding layer, and protruding parts are formed at positions, covering the bulges, of the third shielding layer; and the
adhesive film layer is arranged on the side, away from the secondshielding layer, of the third shielding layer in a covering mode. According to the EMI shielding film, the protruding parts extend into the
adhesive film layer, so that when the protruding parts are press-fitted, it is guaranteed that the third shielding layer smoothly pierces through the adhesive film layer to make contact with a
ground layer of the circuit board; and then, it is guaranteed thatinterference charges are normally led out under cooperation of the first shielding layer, the bonding layer, the second shielding layer and the third shielding layer, and a shielding function is achieved.