The invention relates to a secondary mixing method of an epoxy resin composition for semiconductor encapsulation. The present invention is to prepare epoxy resin, phenolic resin curing agent, inorganic filler, release agent, low stress modifier, coloring agent, flame retardant, silane coupling agent and Put the inorganic ion scavenger into a high-speed mixer, after stirring evenly, melt and knead at a temperature of 70-100°C, press into tablets after kneading, cool, and pulverize into powder; then mix the obtained powder with a solidification accelerator in a high-speed mixer After stirring evenly in the medium, carry out secondary melting and kneading at a temperature of 70-100° C., after kneading, tablet, cool, and pulverize to obtain an epoxy resin composition for semiconductor encapsulation. The invention adopts the secondary mixing method to obtain the epoxy resin composition for semiconductor encapsulation with good fluidity, low insoluble matter content, excellent encapsulation moldability, reduced leak seal ratio and improved mold opening hardness.