The invention relates to a high-power chip heat dissipation structure of an automobile audio entertainment system host, Including top shell, extruded aluminum fin, heat sink cover plate, heat dissipate silica gel pad, a PCB board and a middle frame for mounting a high-power chip, Top shell, extruded aluminum fin, A PCB board is fixedly installed on the middle frame from top to bottom in turn, Thetop shell covers the top of the extruded aluminum fin, the cover plate covers the front and back sides of the extruded aluminum fin, the heat dissipation silica gel pad is arranged between the extruded aluminum fin and the high-power chip, the heat dissipation silica gel pad is pasted on the high-power chip, and the heat dissipation silica gel pad is extruded and fixed by the bottom of the extruded aluminum fin. The aluminum-extruded fin comprises a stepped mounting frame and a plurality of heat dissipation trapezoidal teeth, which are manufactured by an aluminum-extruding process, wherein thestepped mounting frame and the heat dissipation trapezoidal teeth are formed by an aluminum extrusion process. The whole structure design of the heat dissipation structure is ingenious, and the heatdissipation area is greatly increased through the special structure of the aluminum-extruded heat dissipation fin combined with the heat dissipation fin cover plate and the heat dissipation silica gelpad, so that the rapid heat dissipation of the high-power chip can be realized.