Robot for synchronized substrate transfer

Abstract

An exemplary substrate processing system may include a transfer area housing defining a transfer area, and includes a substrate support and a transfer device. The transfer device may include a central hub having a housing and including a first axis and a second axis. The housing may be coupled to the second axis and may define an internal housing volume. The transfer device may include a plurality of arms, the plurality of arms being equal to the number of substrate supports in the plurality of substrate supports. Each of the plurality of arms may be coupled around the exterior of the housing. The transfer device may include a plurality of arm hubs disposed within the internal housing volume. Each of the plurality of arm hubs may be coupled to an arm in the plurality of arms through the housing. The arm hub may be coupled to the first axis of the central hub.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Patent Application No. 62 / 873,432, filed on July 12, 2019, the contents of which are incorporated herein in their entirety for all purposes.

[0003] The present technology is related to the following applications, all of which were filed concurrently on July 12, 2019, and are entitled: “ROBOTFOR SIMULTANEOUS SUBSTRATE TRANSFER” (U.S. Provisional Application No. 62 / 873,400), “ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER” (U.S. Provisional Application No. 62 / 873,458), “ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER” (U.S. Provisional Application No. 62 / 873,480), “MULTI-LID STRUCTURE FOR SEMICONDUCTOR PROCESSING SYSTEMS” (U.S. Provisional Application No. 62 / 873,518), and “HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS (High Density Substrate Processing System and Method)" (U.S. Provisional Application No. 62 / 873,503). Each of these applications is incorporated herein by reference in its entirety for all purposes. Technical Field

[0004] The present technology relates to semiconductor processes and equipment, and more particularly, to substrate processing systems. Background Art

[0005] Semiconductor processing systems often utilize cluster tools to integrate multiple processing chambers together. This configuration can facilitate the performance of several sequential processing operations without removing the substrate from the controlled processing environment, or can allow similar processes to be performed on multiple substrates at once in varying chambers. These chambers may include, for example, degassing chambers, pre-processing chambers, transfer chambers, chemical vapor deposition chambers, physical vapor deposition chambers, etching chambers, metrology chambers, and other chambers. The combination of chambers in a cluster tool, as well as the operating conditions and parameters under which these chambers are run, are selected to fabricate specific structures using specific process recipes and process flows.

[0006] Cluster tools typically process many substrates by passing the substrates continuously through a series of chambers and performing processing operations. The processing recipes and sequences are typically programmed into a microprocessor controller that will direct, control and monitor the processing of each substrate passing through the cluster tool. Once an entire wafer cassette has been successfully processed through a cluster tool, the cassette can be passed to yet another cluster tool or a stand-alone tool, such as a chemical mechanical polisher, for further processing.

[0007] Robots are often used to transfer wafers through various processing and holding chambers. The amount of time required for each process and handling operation directly affects the substrate throughput per unit time. The substrate throughput in a cluster tool may be directly related to the speed of the substrate handling robot positioned in the transfer chamber. As the processing chamber configurations further evolve, conventional wafer transfer systems may not be sufficient.

[0008] Therefore, there is a need for improved systems and methods that can be used to efficiently guide substrates within a cluster tool environment. These and other needs are addressed by the present technology. Summary of the invention

[0009] An exemplary substrate processing system may include a transfer area housing defining a transfer area. The sidewall of the transfer area housing may define a sealable inlet and outlet for providing and receiving substrates. The system may include a plurality of substrate supports disposed within the transfer area. The system may also include a transfer device. The transfer device may include a central hub including a first axis and a second axis extending around the first axis and concentric with the first axis. The central hub may have a housing positioned within the transfer area and coupled to the second axis. The housing may define an internal housing volume. The transfer device may include a plurality of arms, the plurality of arms being equal to the number of substrate supports in the plurality of substrate supports. Each of the plurality of arms may be coupled around the exterior of the housing. The transfer device may include a plurality of arm hubs disposed within the internal housing volume. Each of the plurality of arm hubs may be coupled to an arm in the plurality of arms through the housing. The arm hub may be coupled to the first axis of the central hub.

[0010] In some embodiments, the plurality of substrate supports may include at least four substrate supports. The arm hubs may be distributed around the central axis of the central hub near the radial edge of the internal housing volume. The arm hubs may rotate independently of the housing coupled to the plurality of arms. The first shaft may extend within the internal housing volume. One or more connecting rods may couple each of the plurality of arm hubs to the first shaft within the internal housing volume. The rotation of the first shaft may be configured to simultaneously rotate each of the plurality of arm hubs. Each arm hub may be characterized in that the central axis deviates radially from the central axis of the central hub, and the rotation of each of the plurality of arm hubs may be configured to rotate the corresponding arm of the plurality of arms around the central axis of the associated arm hub. The one or more connecting rods may include one or more belts extending around each of the plurality of arm hubs and the first shaft. The one or more connecting rods may include a plurality of gears coupled between the first shaft and the plurality of arm hubs, and each of the plurality of gears may be disposed between the first shaft and the arm hubs of the plurality of arm hubs and in contact with both the first shaft and the arm hubs of the plurality of arm hubs. Each substrate support of the plurality of substrate supports may include a set of lifting rods accessible through the substrate support, and each set of lifting rods may be characterized by a vertical length different from each other lifting rod. The central hub may be vertically translatable along a central axis of the central hub. The transport apparatus may also include a third axis and a plurality of aligners. Each aligner may be positioned proximate to a distal end of an associated arm of the plurality of arms. Each aligner may rotate independently of the plurality of arms and the housing.

[0011] Some embodiments of the present technology may encompass methods of transferring substrates. The method may include receiving a substrate at a first substrate support within a transfer region of a substrate processing system. The substrate processing system may include a transfer device, the transfer device including a central hub having a first axis and a second axis extending around the first axis and concentric with the first axis. The central hub may have a housing. The transfer device may include a plurality of arms, each of the plurality of arms coupled around an exterior of the housing. The transfer device may include a plurality of arm hubs, each of the plurality of arm hubs coupled to an arm of the plurality of arms. The arm hub may be coupled to the first axis of the central hub. The method may include engaging the substrate with an arm of the plurality of arms. The method may include rotating the first axis in a first direction around a central axis of the central hub. The method may include rotating the second axis in a second direction around a central axis of the central hub. The method may include rotating the first axis and the second axis together in the second direction around the central axis to reposition the substrate. The method may include delivering the substrate to a second substrate support of the substrate processing system.

[0012] In some embodiments, the method may include converting the transfer device by further rotating the second shaft in a second direction about the central axis and rotating the first shaft in a first direction about the central axis. The method may include rotating the first shaft in a second direction about the central axis and rotating the second shaft in a first direction about the central axis. The method may include lifting the substrate from the first substrate support by vertically translating the transfer device in the transfer area after engaging the substrate. The method may include recessing the first substrate support from the substrate after engaging the substrate. Each arm of the plurality of arms may include an aligner that can rotate independently of the arm. When the substrate is engaged by an arm of the plurality of arms, the substrate may be resting on the aligner. The transfer area may include at least four substrates, and engaging the substrate may include engaging the at least four substrates with the arms of the plurality of arms individually or simultaneously. The method may include disengaging the at least four substrates, which may place the at least four substrates to the associated substrate supports individually or simultaneously. The method may include delivering the substrate to an alignment hub located between the first substrate support and the second substrate support before delivering the substrate to the second substrate support.

[0013] Some embodiments of the present technology may also encompass a substrate processing system, which may include a transfer area housing defining a transfer area. The sidewall of the transfer area housing may define a sealable access port for providing and receiving a substrate. The system may include a plurality of substrate supports disposed within the transfer area. The system may include a transfer device. The transfer device may include a central hub, the central hub including a first axis, a second axis, and a third axis, the second axis extending around and concentric with the first axis, the third axis extending around and concentric with the second axis. The central hub may have a housing positioned within the transfer area and coupled to the third axis. The housing may define an internal housing volume. The transfer device may include a plurality of arms, each of the plurality of arms coupled around an exterior of the housing at a proximal end of the arm. The transfer device may include a plurality of arm hubs disposed within the internal housing volume, each of the plurality of arm hubs coupled to an arm of the plurality of arms through the housing. The arm hub may be coupled to the first axis of the central hub. The transfer device may include a plurality of aligners, each of the plurality of aligners coupled to an arm of the plurality of arms at a distal end of the arm. The delivery device may include a plurality of aligner hubs disposed within the internal housing volume, each of the plurality of aligner hubs being concentric with an arm hub of the plurality of arm hubs. Each of the plurality of aligner hubs may be coupled to an aligner of the plurality of aligners through the housing. The aligner hub may be coupled to a second axis of the central hub.

[0014] This technology can provide several benefits over conventional systems and techniques. For example, the processing system can provide increased transfer speeds compared to conventional designs. In addition, the processing system can accommodate a transfer area with multiple rows of substrates. These and other embodiments and their many advantages and features are described in more detail in conjunction with the following description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] A further understanding of the nature and advantages of the disclosed technology may be realized by reference to the remainder of the specification and the accompanying drawings.

[0016] Figure 1A A schematic top plan view of an exemplary processing system in accordance with some embodiments of the present technology is shown.

[0017] Figure 1B A schematic partial cross-sectional view of an exemplary chamber system according to some embodiments of the present technology is shown.

[0018] Figure 2 A schematic perspective view of a transfer area of ​​an exemplary chamber system according to some embodiments of the present technology is shown.

[0019] Figure 3A-3B A schematic cross-sectional view of an exemplary conveying apparatus according to some embodiments of the present technology is shown.

[0020] Figure 3C-3D Schematic top plan views of exemplary conveying apparatus components are shown in accordance with some embodiments of the present technology.

[0021] Figure 4 Exemplary operations in a method of transferring a substrate according to some embodiments of the present technology are shown.

[0022] Figures 5A-5H A schematic top plan view of a conveyed substrate is shown in accordance with some embodiments of the present technology.

[0023] Figure 6 A schematic cross-sectional view of an exemplary delivery device according to some embodiments of the present technology is shown.

[0024] Figure 7 A schematic cross-sectional elevation view of a transfer portion of an exemplary substrate processing system is shown in accordance with some embodiments of the present technology.

[0025] Several of the drawings are included as schematic diagrams. It should be understood that the drawings are for illustrative purposes and should not be considered to be to actual size or scale unless specifically described as being to actual size or scale. Furthermore, as schematic diagrams, the drawings are provided to aid understanding and may not include all aspects or information compared to actual representations and may include exaggerated material for illustrative purposes.

[0026] In the drawings, similar components and / or features may have the same reference number. In addition, various components of the same type may be distinguished by following the reference number with a letter that distinguishes between similar components. If only the first reference number is used in the specification, the description may apply to any of the similar components having the same first reference number, regardless of the letter. DETAILED DESCRIPTION

[0027] Substrate processing may include time-intensive operations for adding, removing, or otherwise modifying materials on a wafer or semiconductor substrate. Efficient movement of substrates can reduce queue time and increase substrate throughput. In order to increase the number of substrates processed in a cluster tool, additional chambers may be incorporated into the mainframe. Although transfer robots and processing chambers can be added continuously by lengthening the tool, this may become space inefficient as the footprint of the cluster tool expands. Therefore, the present technology may include a cluster tool with an increased number of processing chambers within a limited footprint. In order to accommodate the limited footprint of the transfer robot, the present technology may increase the number of processing chambers laterally outward from the robot. For example, some conventional cluster tools may include one or two processing chambers positioned around a portion of a centrally located transfer robot to maximize the number of chambers radially surrounding the robot. The present technology may expand on this concept by incorporating additional chambers laterally outward as another row or another group of chambers. For example, the present technology may be applied with a cluster tool including three, four, five, six or more processing chambers accessible at each of one or more robot access locations.

[0028] However, due to the addition of additional processing positions, it may no longer be feasible to access these positions from the central robot without additional transport functions at each position. Some conventional techniques may include a wafer carrier on which the substrate is held during transfer. However, the wafer carrier may cause thermal non-uniformity and particle contamination on the substrate. The present technology overcomes these problems by combining a transfer portion vertically aligned with the processing chamber area and a disc conveyor or a transfer device that can cooperate with the central robot to access additional wafer positions. In some embodiments, the present technology may not use a traditional wafer carrier, and a specific wafer may be transferred from one substrate support to another substrate support within the transfer area. Although the remaining disclosure will conventionally identify specific structures that can adopt the present structure and method, such as a four-position transfer area, it will be easily understood that the system and method are also applicable to any number of structures and devices that may benefit from the explained transfer function. Therefore, the technology should not be considered to be limited to use with any specific structure. Moreover, although the exemplary tool system will be described as providing the basis of the present technology, it should be understood that the present technology can be combined with any number of semiconductor processing chambers and tools that can benefit from some or all of the operations and systems to be described.

[0029] Figure 1A A top view of one embodiment of a substrate processing tool or processing system 100 of deposition, etching, baking and curing chambers according to some embodiments of the present technology is shown. In the figure, a set of front-opening standard cabins 102 provide substrates of various sizes, which are received by robots 104a and 104b in a factory interface 103 and placed into a load lock or low pressure holding area 106, and then delivered to one of the substrate processing areas 108 located in a chamber system or quadruple section 109a-c, each of which can be a substrate processing system with a transfer area fluidly coupled to multiple processing areas 108. Although a quadruple system is shown, it should be understood that platforms including independent chambers, dual chambers and other multi-chamber systems are also covered by the present technology. A second robot 110 housed in a transfer chamber 112 can be used to transfer substrate wafers from the holding area 106 to the quadruple section 109 and back, and the second robot 110 can be housed in a transfer chamber, and each quadruple section or processing system can be connected to the transfer chamber. Each substrate processing area 108 can be configured to perform a number of substrate processing operations, including any number of deposition processes (including cyclic layer deposition, atomic layer deposition, chemical vapor deposition, physical vapor deposition) as well as etching, pre-cleaning, annealing, plasma treatment, degassing, orientation and other substrate processes.

[0030] Each quadruple portion 109 may include a transfer area that can receive a substrate from a second robot 110 and deliver the substrate to the second robot 110. The transfer area of ​​the chamber system may be aligned with a transfer chamber having a second robot 110. In some embodiments, the transfer area may be accessible laterally to a robot. In subsequent operations, components of the transfer portion may translate the substrate vertically into an overlying processing region 108. Similarly, the transfer area may also be operable to rotate the substrate between positions within each transfer area. The substrate processing region 108 may include any number of system components for depositing, annealing, curing and / or etching a film of material on a substrate or wafer. In one configuration, two groups of processing areas (such as the processing areas in quadruple portions 109a and 109b) may be used to deposit material on a substrate, and a third group of processing chambers (such as the processing chambers or areas in quadruple portion 109c) may be used to cure, anneal or process the deposited film. In another configuration, all three groups of chambers (such as all twelve chambers shown) may be configured to deposit and / or cure both films on a substrate.

[0031] As shown, the second robot 110 may include two arms for delivering and / or retrieving multiple substrates simultaneously. For example, each quadruple portion 109 may include two inlets and outlets 107 along the surface of the housing of the transfer area, which may be laterally aligned with the second robot. The inlet and outlet may be defined along the surface adjacent to the transfer chamber 112. In some embodiments such as shown, the first inlet and outlet may be aligned with the first substrate support of the multiple substrate supports of the quadruple portion. In addition, the second inlet and outlet may be aligned with the second substrate support of the multiple substrate supports of the quadruple portion. In some embodiments, the first substrate support may be adjacent to the second substrate support, and the two substrate supports may define a first row of substrate supports. As shown in the illustrated configuration, the second row of substrate supports may be located behind the first row of substrate supports, laterally outward from the transfer chamber 112. The two arms of the second robot 110 may be spaced apart to allow the two arms to enter the quadruple portion or chamber system at the same time to deliver or retrieve one or two substrates to the substrate supports in the transfer area.

[0032] Any one or more of the described transfer areas may be combined with additional chambers separate from the manufacturing systems shown in the different embodiments. It will be appreciated that the processing system 100 allows for additional configurations of deposition, etching, annealing and curing chambers for material films. In addition, any number of other processing systems may be used with the present technology, which may be combined with a transfer system for performing any of the specific operations such as substrate movement. In some embodiments, a processing system that can provide access to multiple processing chamber areas while maintaining a vacuum environment in various portions (such as the described holding and transfer areas) can allow operations to be performed in multiple chambers while maintaining a specific vacuum environment between discrete processes.

[0033] Figure 1B A schematic cross-sectional elevation view (such as through a chamber system) of one embodiment of an exemplary processing tool in accordance with some embodiments of the present technology is shown. Figure 1B A cross-sectional view through any two adjacent processing regions 108 in any quadruple section 109 may be shown. A front view may show the configuration or fluid coupling of one or more processing regions 108 with a transfer region 120. For example, a continuous transfer region 120 may be defined by a transfer region housing 125. The housing may define an open interior volume in which a plurality of substrate supports 130 may be disposed. For example, as Figure 1A As shown, an exemplary processing system may include four or more substrate supports 130, including a plurality of substrate supports distributed within a housing around a transfer region. As shown, the substrate support may be a pedestal, although many other configurations may be used. In some embodiments, the pedestal may be vertically translatable between the transfer region 120 and a processing region overlying the transfer region. The substrate support may be vertically translatable along a path between a first position and a second position within the chamber system along a central axis of the substrate support. Thus, in some embodiments, each substrate support 130 may be axially aligned with an overlying processing region 108 defined by one or more chamber components.

[0034] The open transfer area may provide a transfer device 135 (such as a carousel) with the ability to engage and move substrates between various substrate supports (such as rotationally). The transfer device 135 may rotate about a central axis. This may allow the substrate to be positioned for processing within any of the processing areas 108 within the processing system. The transfer device 135 may include one or more end effectors that may engage with the substrate from above, below, or may engage with the outer edge of the substrate to move around the substrate support. The transfer device may receive the substrate from a transfer chamber robot (such as the robot arm 110 described previously). The transfer device may then rotate the substrate to alternate substrate supports to facilitate the delivery of additional substrates.

[0035] Once positioned and awaiting processing, the conveyor device can position the end effector or arm between the substrate supports, which can allow the substrate supports to be lifted through the conveyor device 135 and deliver the substrates to the processing area 108, which can be vertically offset from the conveyor area. For example, and as shown, substrate support 130a can deliver the substrate to the processing area 108a, while substrate support 130b can deliver the substrate to the processing area 108b. This can occur in the other two substrate supports and processing areas, as well as in additional substrate supports and processing areas in embodiments that include additional processing areas. In this configuration, when operatively engaged to process a substrate, such as at a second position, the substrate supports can at least partially define the processing area 108 from below, and the processing area can be axially aligned with the associated substrate support. The processing area can be defined from above by the panel 140 and other cover stack components. In some embodiments, each processing area can have a separate cover stack component, although in some embodiments, the component can accommodate multiple processing areas 108. Based on this configuration, in some embodiments, each processing region 108 can be fluidly coupled to a transfer region while being fluidly isolated from above from each other processing region within a chamber system or quadruple section.

[0036] In some embodiments, the panel 140 can be used as an electrode of the system to generate a localized plasma within the processing region 108. As shown, each processing region can utilize or incorporate a separate panel. For example, the panel 140a can be included to define the processing region 108a from above, and the panel 140b can be included to define the processing region 108b from above. In some embodiments, the substrate support can be used as a companion electrode for generating a capacitively coupled plasma between the panel and the substrate support. Depending on the volume geometry, the pumping bushing 145 can at least partially radially or laterally define the processing region 108. Similarly, a separate pumping bushing can be used for each processing region. For example, the pumping bushing 145a can at least partially radially define the processing region 108a, and the pumping bushing 145b can at least partially radially define the processing region 108b. In an embodiment, the partition plate 150 can be located between the cover 155 and the panel 140, and a separate partition plate can again be included to facilitate fluid distribution within each processing region. For example, blocker plate 150a may be included for dispensing toward processing region 108a, and blocker plate 150b may be included for dispensing toward processing region 108b.

[0037] The cover 155 can be a separate component for each processing area, or can include one or more common aspects. In some embodiments such as shown, the cover 155 can be a single component defining a plurality of orifices 160 for delivering fluids to the various processing areas. For example, the cover 155 can define a first orifice 160a for delivering fluids to the processing area 108a, and the cover 155 can define a second orifice 160b for delivering fluids to the processing area 108b. When additional processing areas are included in each section, additional orifices can be defined for the additional processing areas in each section. In some embodiments, each quadruple section 109 or multi-processing area section that can accommodate more or less than four substrates may include one or more remote plasma units 165 for delivering plasma effluents to the processing chamber. In some embodiments, a separate plasma unit can be combined for each chamber processing area, although in some embodiments, fewer remote plasma units can be used. For example, as shown, a single remote plasma unit 165 can be used for multiple chambers, such as two, three, four or more chambers, up to all chambers of a specific quadruple section. In embodiments of the present technology, conduits may extend from the remote plasma unit 165 to each orifice 160 for delivering plasma effluent for processing or cleaning.

[0038] As noted, the processing system 100, or more particularly a quadruple section or chamber system in conjunction with the system 100 or other processing systems, may include a transfer section positioned below the illustrated processing chamber area. Figure 2 A schematic isometric view of an exemplary chamber system 200 according to some embodiments of the present technology is shown. The system shown may include a transfer region housing 205 defining an interior volume or transfer region, which may include a plurality of components. The transfer region may additionally be at least partially comprised of a process chamber such as a Figure 1A The transfer area housing 205 is defined from above by a processing chamber (shown as a quadruple portion 109 of the transfer area housing). The sidewalls of the transfer area housing can define one or more access locations 207 through which substrates can be delivered and retrieved (such as by the second robot 110 as described above). In some embodiments, the access location 207 can be a slit valve or other sealable access location, which can include a door or other sealing mechanism to provide an airtight environment within the transfer area housing 205. Although shown with two such access locations 207, it should be understood that in some embodiments, only a single access location 207 may be included. It should also be understood that the substrate processing system 200 can be sized to accommodate any substrate size, including 200 mm, 300 mm, 450 mm, or larger or smaller substrates, including substrates characterized by any number of geometries or shapes.

[0039] Within the transfer area housing 205 may be a plurality of substrate supports 210 positioned around the transfer area volume. Although four substrate supports are shown, it should be understood that embodiments of the present technology similarly encompass any number of substrate supports. For example, according to embodiments of the present technology, greater than or about three, four, five, six, eight or more substrate supports 210 may be accommodated in the transfer area. In some embodiments, the second robot 110 may deliver the substrate to one or both of the substrate supports 210a or 210b through the inlet and outlet 207, and may deliver the substrate directly to the transfer device in the transfer area. Similarly, the second robot 110 may retrieve the substrate from these locations. The lifting rod may extend from the substrate support 210, or may be accessible through the substrate support, as will be discussed below, and may allow the robot to access the substrate below. In some embodiments, the lifting rod may be fixed to the substrate support, or fixed to a position where the substrate support may be recessed below, or the lifting rod may be additionally raised or lowered by the substrate support. The substrate support 210 may be vertically translatable and, in some embodiments, may extend to a processing chamber (such as the processing chamber 108 ) located above the transfer area housing 205 .

[0040] The transfer area housing 205 may provide access to an alignment system 215, which may include an aligner that may extend through an aperture in the transfer area as shown and may operate with a laser, camera, or other monitoring device that protrudes or transmits through an adjacent aperture and may determine whether a translated substrate is properly aligned. The transfer area housing 205 may also include a transfer device 220 that may operate in a variety of ways to position and move substrates between various substrate supports. Although exemplary operations will be described below, in one example, the transfer device 220 may move substrates on substrate supports 210a and 210b to substrate supports 210c and 210d, which may allow additional substrates to be delivered into the transfer area.

[0041] The transfer device 220 may include a central hub 225, which may include one or more shafts extending into the transfer area. The central hub 225 may include a housing 230 located at the center or other location of the transfer area housing 205. The housing 230 may define an internal housing volume, as will be described below, and additional components associated with the transfer device 220 may be disposed within the housing interior volume. The housing 230 may be decoupled from the bottom of the transfer area housing 205, which may allow the housing 230 to rotate within the transfer area. Coupled to the central hub may be a plurality of arms 235. The arms 235 may be coupled at radially outer locations around the housing 230, although in embodiments, the arms may be coupled closer toward the central axis of the central hub. By arranging the arms radially outward, the associated hub and linkage components may be more freely incorporated within the housing, as will be described below. The arms 235 may extend from the exterior of the housing, and although the arms may be fixedly coupled to the housing, in some embodiments, the arms may be coupled to the hub or an extension of the hub extending through the housing. This may allow the transfer apparatus to have additional degrees of rotation, thereby facilitating independent rotation of the arm 235 relative to the housing 230 .

[0042] Any number of arms 235 may be included in embodiments of the present technology. In some embodiments, the number of arms 235 may be similar or equal to the number of substrate supports 210 included in the chamber. Thus, as shown, for four substrate supports, the transfer device 220 may include four arms extending laterally or radially outward from the housing of the central hub. The arms may be characterized by any number of shapes and profiles, such as the straight profile shown, as well as an arcuate profile or different distal position shapes, as will be further discussed below. As will be further explained below, the arms may extend below one or more substrates 201 and may be used to individually adjust one or more of the substrates, as well as transfer substrates 201 to alternate substrate supports within the transfer region.

[0043] The arms of the conveyor, as well as the housing and other components, may be made of or include a variety of materials including conductive and / or insulating materials. In some embodiments, the material may be coated or plated to withstand contact with precursors or other chemicals that may enter the conveyor area from an overlying processing chamber. Materials may also be provided or selected to withstand other environmental characteristics, such as temperature. In some embodiments, the substrate support may be used to heat a substrate disposed on the support. The substrate support may be configured to increase the surface or substrate temperature to a temperature greater than or about 100°C, greater than or about 200°C, greater than or about 300°C, greater than or about 400°C, greater than or about 500°C, greater than or about 600°C, greater than or about 700°C, greater than or about 800°C, or more.

[0044] Any of these temperatures may be maintained during operation, and thus components of the transfer apparatus 220, including the arm 235 that may extend between the substrate support 210 and the substrate 201, may be exposed to any of these stated or covered temperatures. Thus, in some embodiments, any material may be selected to accommodate these temperature ranges, and may include materials such as ceramics and metals, which may be characterized by relatively low coefficients of thermal expansion or other beneficial properties. The component coupler may also be adapted to operate in high temperature and / or corrosive environments. For example, in some embodiments, where the arm and hub may each be ceramic, the coupler may include a press fit, a snap fit, or other fittings that do not include other materials, such as bolts, which may expand and contract with temperature and may cause the ceramic to crack, although in some embodiments, any number of fittings may be used with the components.

[0045] Some embodiments of the conveyor apparatus 220 may also include an aligner 240 coupled to the arm 235 around or near the distal end of the arm relative to the proximal connection relative to the housing 230. As will be discussed further below, the aligner 240 can provide a third aspect of rotation for substrates that are placed or repositioned during conveyance or other operations. In some embodiments, the aligner can extend directly in line between the substrate support and the substrate, which can expose the aligner and associated components including the connecting rod to the substrate support temperature. Therefore, these materials can be similarly selected to accommodate the environmental conditions to which the materials may be exposed. Any number of other materials that can facilitate operation or resistance during operation can be used, and the present technology similarly covers these materials.

[0046] The transfer device 220 may include a number of components and configurations that may facilitate movement of the arm independent of the housing, as will be further described below. FIG. 3A to FIG. 3B A schematic cross-sectional view of an exemplary transfer apparatus 220 is shown in accordance with some embodiments of the present technology, but it should be understood that the present technology similarly encompasses any other configuration that provides the independent rotational motion to be described.

[0047] The central hub 225 may include a first shaft 310 and a second shaft 320, and the second shaft 320 may be axially aligned with the first shaft 310. For example, the first shaft 310 and the second shaft 320 may be concentric about a central axis extending vertically through the central hub. In some embodiments, the first shaft 310 may extend through the second shaft 320 or all aspects of the second shaft 320. Figure 3AAs shown, the first axis 310 and the second axis 320 can be coaxial, although the two axes can be coupled to separate motors or drive systems. As shown, the first axis 310a can be coupled to the first drive system 312a, which can include a motor and can allow rotation around the central axis. This rotation can cause the connecting rod 330 to rotate in a first direction (or in a second direction opposite to the first direction), and the movement of the connecting rod can cause the arm hub 335 to rotate in the first direction (or in a second direction opposite to the first direction) around the central axis passing through each arm hub. Similarly, the second axis 320a can be coupled to the second drive system 314a, which can independently allow the housing 230 to rotate in the first direction or the second direction around the central axis. In some embodiments, a vertical translation drive 325 can be included, which can allow the conveyor device to translate vertically along the central axis. In some embodiments, this can facilitate lifting the substrate from the substrate support or lifting rod, although in some embodiments, the lifting rod and / or the substrate support can be used to raise and lower the substrate, and the conveyor device 220 may not include a vertical drive mechanism.

[0048] Shown within the volume defined by the housing 230 may be one or more arm hubs 335, including a plurality of arm hubs. The arm hubs may be at least partially disposed within the housing and may extend through the housing 230 to couple with the arm 235, or may include an extension post or link to couple with the arm 235. Each of the plurality of arms 235 may include a corresponding or associated arm hub 335 to facilitate rotation of the arm independent of rotation of the housing 230. The arm hubs 335 may be coupled individually or collectively to the first shaft 310 of the central hub, and this may allow the arm hubs 335 to rotate when the first shaft 310 rotates. The arm hubs 335 may be distributed around the central axis of the central hub and may be radially offset from the central axis. Each arm hub may be characterized in that a corresponding arm hub axis extends through the arm hub and defines an axis of rotation of an associated arm coupled to or coupled with the hub.

[0049] The arm hubs 335 may be positioned near the radial or lateral edges of the interior volume of the housing 230, which may limit interference between adjacent hubs when, for example, the number of hubs and arms is increased for a transfer zone including additional substrate supports. The arm hubs 335 may not be directly coupled to the housing 230, or may be rotatably coupled to the housing 230, which may facilitate independent rotation between the arm hubs and the housing, which may create multiple rotational aspects for the transfer device 220. The first shaft 310 may extend within the interior housing, and a certain amount of access may be provided for coupling connecting rods 330 around the first shaft. As shown, connecting rods may couple each of the plurality of arm hubs 335 to the first shaft 310 individually or collectively within the interior housing volume. Thus, when the first shaft 310 is rotated by the first drive system 312a, the connecting rods connecting the shafts to the arm hubs may cause the hubs to rotate similarly, and may cause the arm hubs to rotate simultaneously around separate hub central axes, which are radially offset from the central axis of the transfer device or central hub as described above. When the arm hub rotates with the rotation of the first shaft 310 , the arm 235 may also rotate in a direction corresponding to or associated with the rotation direction of the first shaft 310 and / or the arm hub 335 .

[0050] Figure 3B Another embodiment of a conveyor apparatus 220 is shown which may utilize a gearbox to facilitate reverse rotation of a first shaft 310b relative to a second shaft 320b. For example, the second shaft 320b may be coupled to a gearbox 331 including a gear set 332 having a first gear coupled to the first shaft 310b. As will be readily appreciated, driving the first gear in a first direction using a first drive system 312b will produce reverse rotation in a relative gear which may be coupled to the second shaft 320b and the housing 230. Additionally, a second drive system 314b may be coupled to a component to rotate the gearbox and the first shaft together which will facilitate the common rotation of the housing 230 and the arm 235, although further rotation of the first shaft 310b may also occur due to the difference in rotation ratio between the arm and the housing, although the first shaft 310b and the second shaft 320b may rotate in similar directions. The figures also illustrate an optional vertical translation drive 325 which may linearly move the conveyor apparatus up and down as described above. It should be appreciated that, Figures 3A to 3B Shown are any number of configurations and components that can be used to independently rotate the first and second shafts to provide separate control of the housing and the arm. Thus, in some embodiments, the first and second shafts can rotate together about the central axis at similar or different rotational speeds, or the two shafts can rotate in opposite directions relative to the other shaft, again at similar or different rotational speeds. This operation will be described in more detail below.

[0051] Figures 3C to 3DSchematic top plan views of exemplary components of a transfer device 220 according to some embodiments of the present technology are shown. Although only some aspects of the transfer device as previously described may be shown, it should be understood that these illustrations are not intended to be limiting and may include any of the components, materials, or characteristics of the aforementioned transfer device 220. In addition, the figures may show a connecting rod included in any of the previously described transfer devices or embodiments of the present technology.

[0052] As shown, the conveying device 220 may include a housing 230. Although the housing 230 may include a covered cover as previously shown, the cover is not shown in the illustration to facilitate the exemplary connecting rods covered by the present technology. The first shaft 310 can extend within the housing 230 and can be coupled with the arm hub 335, as previously described. Although only four arm hubs 335 are shown, it should be understood that any number of hubs can be included to match any number of associated arms. In one embodiment, a connecting rod 330a is shown, in which one or more belt couplers can be used, and the one or more belt couplers can extend around each arm hub 335 and the first shaft 310 in a variety of ways. The belt can extend in a groove or groove defined in each of the arm hub and the first shaft. For example, four separate grooves can be defined vertically along the first shaft 310 to accommodate each belt, and ensure that the belt remains offset to limit or prevent contact or interaction of the belts. Similarly, a groove or groove can be defined around each arm hub to maintain a set position of the belt.

[0053] Although a set of belts is shown in the figures, a single belt, such as a serpentine belt or a drive belt, may extend around each arm hub and the first shaft 310 to provide coupling. Additionally, twisted belts may be incorporated to reverse the rotation between the components. Although additional linkage systems may be similarly used, a single or multiple belts may be used in different embodiments. For example, as Figure 3D As shown, a gear set can be used to drive the arm hub shown. For example, the first shaft 310 can define a plurality of gear teeth along an area extending within the housing 230. The gear teeth can be interconnected with the teeth of the connecting rod gear 330b of each arm hub 335 of the conveying device. As shown, each of the multiple gears can be positioned to contact one or both of the first shaft 310 and the associated arm hub 335. Additional gears can also be incorporated in any number of configurations to facilitate rotation of the arm hub due to rotation of the first shaft 310. Likewise, although only four such arm hubs and connecting rod gears are shown, any number of connecting rods and hubs may be included in embodiments encompassed by the present technology. Similarly, Figure 3C and Figure 3D Two possible linkage systems contemplated by the present technology are shown, and the examples are not intended to be limiting.

[0054] Any number of other system component couplings configured to provide the described operations are similarly encompassed by the present technology. Moreover, because the linkage connection can include multiple gears, twisted belts, and other components that can cause the arm hub 335 to rotate in a direction similar to or different from the first shaft 310, it should be understood that any embodiment described throughout the present disclosure can take this effect into account. For example, a first direction of shaft rotation can cause the associated arm hub to rotate in either direction, and thus, when a first and second direction is described, either direction can actually be encompassed to accommodate the movement shown or described, and this can be interpreted as any type of actual linkage coupling encompassed in any single example.

[0055] Figure 4 4 shows exemplary operations in a method 400 for transferring a substrate according to some embodiments of the present technology. The method 400 may be performed in one or more transfer systems (such as the system 200), for example, the one or more transfer systems may be incorporated into the processing system 100. The method may include a number of optional operations as shown, which may or may not be specifically associated with some embodiments of the method according to the present technology. The method 400 describes FIG. 5A to FIG. 5H 5, which will be described in conjunction with the operations of method 400. It should be understood that FIG5 shows only a partial schematic diagram with limited detail, and in some embodiments, the system may include more or fewer substrate supports and other components, as well as alternative structural aspects that may still benefit from any aspect of the present technology.

[0056] Figure 5A The transfer area of ​​the substrate processing system 500 as previously described may be shown, and may include any features and aspects of the system 200 described above, including any drive components previously discussed with FIG. 3, and any other drive components that will be understood to be similarly covered by the present technology. In addition, the system 500 may be illustrated as having a plurality of substrates 501 disposed in a chamber, such as parked on a substrate support 510 as shown. The accompanying drawings may illustrate a configuration of the present technology after the initial operation of the method 400, which may include receiving a substrate at a first substrate support 510a (such as by an inlet and outlet robot as previously described) at operation 405. The robot may deliver one or two or more substrates to the transfer area 505, to a substrate support near an inlet and outlet or a slit valve. The transfer device 520 may rotate two substrates to an opposing substrate support, and may deliver two additional substrates. It should be understood that the same process may be performed with any number of substrates, including delivering one substrate to the processing chamber at a time. Figure 5AIt can be shown after four substrates have been positioned within the transfer area. Additionally, during delivery or subsequent transfer of the substrates, the transfer device 520 can be positioned in a recessed configuration, which can, for example, be coiled about the housing 530 of the central hub 525, or extend between the substrate supports 510. When a transfer operation is to be initiated for any number of substrates, the transfer device can perform one or more adjustments to extend the arm 535 at least partially under the substrate 501, as shown. These movements or adjustments can include any rotations as described below, as well as additional rotations or movements to accommodate components within the transfer area.

[0057] The transfer process may involve rotating the transfer device in a variety of ways. Method 400 may include engaging substrate 501 at operation 410. Engagement may occur simultaneously or separately until one or more substrates have been transferred from substrate support 510 (including lifting rods of substrate support) to arm 535 of transfer device 520. Depending on whether the transfer device has vertical movement capability, engagement and movement may or may not include raising or lowering one or both of the substrate or transfer device. Once the substrate has been engaged by the transfer device, a complete transfer of one or more substrates can be performed between the substrate support and the transfer device. For example, in some embodiments, the transfer device can lift the substrate from the substrate support or the lifting rod on which the substrate can be placed. For example, this can be performed by vertically moving the transfer device. In some embodiments, the substrate support can be recessed away from one or more substrates to complete the transfer.

[0058] After completing the transfer to the transfer device, the substrate can be rotated between substrate supports for further processing in a different chamber, or delivered to a substrate support accessible by a transfer robot (such as the second robot arm 110 as described above). Translation of one or more substrates can occur by causing one or more rotations of the first axis and the second axis, which can cause rotation of the arm and the housing, such as Figure 5B Although the figures illustrate counterclockwise rotation, it should be understood that in embodiments the base plate may be rotated in either direction about the central axis.

[0059] To begin translation of the substrate after the substrate is positioned on the arm 535 of the transfer device, the method may include rotating a first shaft of the central hub in a first direction about a central axis of the central hub at operation 415. Prior to, subsequently, or simultaneously, the method may include rotating a second shaft in a second direction about a central axis of the second hub at operation 420. The second direction may be an opposite rotation of the first direction as previously described. Figure 5BAs shown, when the arm 535 rotates back toward the housing 530, this reverse rotation can help to cause the substrate 501 to be recessed toward the central hub 525 during translation. Although not intended to be limiting, the rotation shown can illustrate aspects of translating the substrate 501 from the first substrate support 510a to the second substrate support 510b. In order to provide such rotation, the second axis of the central hub can be rotated in the translation direction (such as the counterclockwise direction as shown). When this occurs, the first axis can be rotated in a first direction opposite to the second axis, which can cause the arm to be recessed back toward the starting position as shown. As previously described, depending on the type of linkage used, the rotation direction can actually describe either direction of rotation to accommodate the illustrated movement relative to the type of linkage used.

[0060] The counter-rotation may occur at any position or degree, which may narrow the envelope in which rotation may occur. Subsequently, translation of one or more substrates may be performed at operation 425, in which the arm 535 and housing 530 may be rotated together about a second direction at the same rate or ratio toward the second substrate support 510b. As shown, the joint rotation may occur about the central axis along the second direction. Thus, the direction of rotation of the first axis may be reversed, while rotation of the second axis may continue in the same direction as used for engagement. Of course, if substrate translation is performed in the first direction, the direction of axis rotation will also be opposite. The arm 535 rotating about a radially offset axis separate from the housing 530 may further facilitate more direct translation of substrates between substrate supports, such as FIG. 5B to FIG. 5D As shown. For example, the present technology can provide a substantially linear path, or any degree of arcuate or angled travel by coordinating the rotation of the axis of the transfer device. In some embodiments, by providing a linear path that can directly transfer a substrate from a first substrate support to a second substrate support (such as in a straight line between the center of the first substrate support and the second substrate support), translation time can be reduced, and when expanded to hundreds or thousands of operations, queue time can be significantly reduced compared to conventional techniques.

[0061] As previously described, a substrate processing system according to embodiments of the present technology can have a monitoring and alignment system, including an alignment hub 540 positioned between each pair of substrate supports. Additional access ports 542 can allow a camera or laser to strike a substrate to identify misalignment, which can be based on a notch or other identifier on the substrate. In some embodiments, an optional alignment operation can be performed on each of the substrates at optional operation 430. Figure 5CAs shown, the substrate can be transferred to the alignment hub 540, which can be facilitated by the profile of the arm 535. As shown, the distal portion of the arm on which the substrate is supported can feature a hook, fork, or aperture through which the alignment hub 540 can extend. In different embodiments, the alignment hub 540 can be raised to transfer the substrate, or the substrate can be lowered to the alignment hub 540. Regardless, depending on how many substrates are to be translated, one or more aligners can receive the substrate. Alignment adjustments can be performed, and the transfer device can reengage the substrate.

[0062] like Figure 5D As shown, the transfer device may continue to rotate the substrate toward the substrate support to which the substrate 501 is to be delivered. Although delivery to an adjacent substrate support in a counterclockwise direction is shown, it should be understood that delivery to any other substrate support in either rotational direction may be similarly performed. At operation 435, the substrate may be delivered to a second substrate support, such as Figure 5E As shown, it can include retracting the arm 535 by reversing the rotation of the first axis. As the housing 530 continues to rotate, the arm can be withdrawn from the substrate support, and thus in some embodiments, the arm can extend outward near the desired delivery position to accommodate the lateral translation path with the rotating housing track. Once delivered, the transfer device can disengage the substrate from the transfer device. Similarly, the substrate can be lowered by the transfer device, and / or the substrate support or the lifting rods of the substrate support can engage the substrate to receive the substrate from the transfer device. As will be described below, the substrates can be individually placed on the corresponding substrate supports, which can facilitate further alignment of the substrates.

[0063] For example, because the substrate support or lifting rod can accommodate the individual delivery of the substrate, the conveying device can perform additional alignment actions before delivering the substrate. For example, when translating the substrate, a camera or monitoring system as described above can identify the offset of the substrate, which can cause the substrate to contact the pocket of the substrate support, and the substrate will be delivered to the pocket. The monitoring system can provide feedback through an associated control system, which can guide further manipulation of the conveying device. Although discrete lateral movements along the xy plane parallel to the surface of the substrate support may be limited due to the rotational characteristics of the conveying device, these movements can still be performed. By further rotating one or both of the housing or the arm, the intersecting arc path can be modified to adjust the position of the substrate laterally before delivery. Because each lifting rod group can be vertically offset from each other (as will be further described below), this modification can be performed on one or more of each substrate comprising the system.

[0064] Once each substrate has been delivered to the corresponding substrate support, the transfer device can be moved out from between the substrate and the substrate support. The present technology can also accommodate lift pins associated with the substrate support. For ease of illustration, Fig. 5F Only two substrates 501 are shown, with two additional bare substrate supports showing a lift pin set 545 that can extend between the substrate and the substrate support and can be avoided by the transport device after delivering the substrate. Although the translation and delivery can be performed laterally as previously described, the delivery can include raising the lift pins or lowering the transport device, which can align the lift pins with the transport path. Therefore, translating the transport device away from the substrate support can involve additional movement.

[0065] Reference Fig. 5F , switching the delivery device can involve continuing to rotate the second shaft in the second direction while more actively rotating the first shaft in the first direction, which can pull the arm 535 inward toward the central hub. As shown, this movement can cause the arm to be recessed away from the lifting rod, which can be located on either side of the arm after delivery. In addition, the rotation can occur in either direction, although the rotation can be performed toward the features of the arm as shown. Although the present technology encompasses any number of arm profiles and geometries, the hook shown can shorten the leading edge of the arm in the second direction, which can further help avoid contact with the lifting rod shown.

[0066] Although in some embodiments the arm may be recessed between the substrate supports, during processing the recessing may continue to nest the arm about the housing. Once the arm has been initially recessed as shown, the transition may also include rotating the second shaft back in the first direction. During the initial rotation, the first shaft may be rotated to maintain the recess of the arm 535, which may include rotating the first shaft in the first direction with the second shaft, such as Figure 5G Subsequently, the first axis can be rotated in a direction opposite to the second axis to extend the arm 535 outward, as shown. Figure 5H For example, as shown, the first shaft can be rotated in the second direction, and the second shaft can be rotated in the first direction to extend the arm outward, which can position the arm in a holding position during substrate processing. In addition, when an alignment hub 540 is included, such a position can align the arm 535 on the alignment hub 540, for example, which can provide protection for the alignment hub to prevent particle accumulation.

[0067] Figure 6A schematic cross-sectional view of an exemplary conveyor device 600 according to some embodiments of the present technology is shown. The conveyor device 600 may include additional aligner components as previously described, which may further perform rotational alignment operations during conveyance. Therefore, unlike the alignment hub 540 described above, an integrated aligner on the conveyor device may further reduce conveyance time. For example, as previously described, when a substrate is translated on a monitoring device, information may be provided back to the conveyor device to indicate a rotational alignment adjustment, which may be performed during translation. This may remove additional disengagement and engagement operations by removing the alignment hub conveyance, which may further control minor offsets that may occur during conveyance and may provide higher substrate alignment accuracy than conventional techniques.

[0068] The conveyor device 600 may include any of the components, materials, configurations, or features of any other conveyor device described elsewhere, and a simplified schematic diagram may be shown to show possible couplings of alignment components. The conveyor device 600 may be incorporated into any of the conveyor regions including any number of substrate supports as described above, such as or including a conveyor region housing 205 containing a substrate support 210, and the conveyor device 600 may include common components having the previously indicated configurations. For example, the conveyor device 600 may include a central hub 630, the central hub 630 including a housing 632 that may define an internal housing volume, and a plurality of arms 635 extending outwardly from the housing, as described above. In any of the examples of the present technology, a housing may not be included, although including a housing may protect components disposed in the internal volume from exposure to effluent or other process materials by forming a separate volume, and facilitate cooling. The central hub 630 may include a first shaft 610, a second shaft 615, and a third shaft 620. The shafts may be coaxial around a central axis passing through the central hub 630. For example, the second axis 615 may extend around and be concentric with the first axis 610, and the third axis 620 may extend around and be concentric with the second axis 615. Each of the first axis 610, the second axis 615, and the third axis 620 may be configured to allow independent rotation of different elements of the transfer device.

[0069] For example, the housing 632 can be coupled to the third shaft 620 and can be rotated about the central axis by the third drive system 622, which can include any number of motors or drives (similar to any other system described elsewhere) and can allow rotation in either direction about the central axis. A plurality of arms 635 can be coupled about the exterior of the housing 632 and can include any features or characteristics of the arms previously described. The arms can be coupled near the housing at the proximal ends of the arms, and the distal ends of each arm can support an aligner 640 of a plurality of aligners. The coupling for the arms and aligners can include any number of linkage schemes as previously described, and the following examples are included only to facilitate understanding of the independent rotational control of the components, regardless of the specific linkage mechanism or mechanisms used.

[0070] As previously described, the first shaft 610 can be coupled to a plurality of arm hubs 645. The arm hubs 645 can be at least partially disposed within the internal housing volume, although a portion of the arm hub or an extension of the arm hub can extend through the housing to couple with the arm 635. As previously described, each of the plurality of arm hubs can be coupled to an arm of the plurality of arms. The arm hubs can be coupled to the first shaft 610 via a connecting rod 642, which can include any of the aforementioned connecting rods or mechanisms. The first shaft 610 can be operably coupled to a first drive system 612, which can facilitate independent rotation of the first shaft 610 and can provide rotational capability to the arm 635.

[0071] In some embodiments, each arm 635 can define an internal arm volume that can allow a coupler to enter and exit the aligner 640, although in some embodiments, the coupler can be implemented above, below, and along the outside of each arm 635. However, by providing an internal arm volume, the connecting rod can be prevented from being exposed to the processing material, and the thermal exposure of the components can be at least partially reduced. A plurality of aligner hubs 650 can be included in the internal housing volume and can be coupled to the second shaft 615 by a connecting rod 647. As shown, the aligner hub 650 can be concentric with the arm hub 645, and in some embodiments, the aligner hub 650 can extend through the arm hub 645 into the internal arm volume. Therefore, in some embodiments, no portion of the aligner hub 650 is exposed in the transmission area environment. The aligner hub 650 can be coupled to the second shaft 615 by a connecting rod 647 at a first end. At a second end of the aligner hub 650 opposite to the first end, a connecting rod 652 can further couple the aligner hub to the aligner 640. The second shaft 615 can be operably coupled to a second drive system 617 , which can facilitate independent rotation of the second shaft 615 and can provide rotational capability to the aligner 640 .

[0072] In some embodiments, a vertical translation driver 625 may be included, and the vertical translation driver 625 may allow the transfer device to vertically translate along a central axis. In some embodiments, this may facilitate lifting the substrate from the substrate support or lift rod, although in some embodiments, the lift rod and / or substrate support may be used to raise and lower the substrate, and the transfer device 600 may not include a vertical drive mechanism. By incorporating the third axis and drive system as shown, an additional degree of rotational freedom may be provided, which may facilitate the alignment operation of the substrate being transferred, and the queuing time may be further reduced by combining the alignment ability with the translation ability.

[0073] Figure 7 A schematic cross-sectional front view of an exemplary substrate processing system 700 in accordance with some embodiments of the present technology is shown. Figure 7 An interleaved lift rod configuration as described above is shown and may be included in either the transfer area or the substrate processing system as described above. For example, any of the previously described lift rods may include an interleaved height lift rod as shown. The substrate processing system 700 may include any one of the components, configurations, and features of any of the previously described embodiments, and similarly, any of the previously described systems may include the shown lift rod configuration. The system 700 may include a plurality of substrates 701 respectively located on lift rod sets 705 within the chamber. The system 700 may further include a transfer device 720, and the transfer device 720 may include any of the features of the previously described transfer devices, including an arm 735 extending from the transfer device.

[0074] The lift rod 705 may be a set of rods extending from a substrate support 710 to provide accessibility for delivering or retrieving the substrate 701, and each set may include any number of rods to accommodate the substrate. As shown, the lift rod sets 705 are staggered at four different heights, which may allow for the individual delivery and retrieval of the substrate. For example, the lift rod 705a may extend a first vertical length above the substrate support. The lift rod 705b may extend a second vertical length above the substrate support 710b shown in cross-section, and this may hide the substrate support from which the lift rod 705a may extend, although these substrate supports may be in a straight line. As shown, the second vertical length may be less than the first vertical length.

[0075] In addition, lift bar 705c can extend a third vertical length from substrate support 710c, and the third vertical length can be less than the second vertical length. Finally, lift bar 705d can extend a fourth vertical length from an associated substrate support, which can be hidden by substrate support 710c and in line with substrate support 710c. The fourth vertical length can be less than the third vertical length. By staggering the height of the lift bar group, each substrate can be individually adjusted before delivering or retrieving the substrate. For example, when set on the associated lift bar, substrate 701a can be accessible above substrate 702b, substrate 702b can be accessible above substrate 702c, and substrate 702c can be accessible above substrate 702d.

[0076] The present technology includes substrate processing systems that can accommodate additional substrate supports, as previously described, that may otherwise not be accessible by a centrally located transfer robot. By incorporating a transfer apparatus according to embodiments of the present technology, multiple substrate supports can be utilized and accessed during substrate processing. When the transfer apparatus includes an articulated arm that can rotate independently relative to a substrate housing, two axes of rotation can be provided, which can facilitate repositioning of the substrate to limit alignment differences that result in additional edge contact between the substrate and the substrate support. The system can also provide increased transfer speeds by providing more linear motion between the substrate supports, which can also help reduce the size of the transfer area.

[0077] In the foregoing description, for the purpose of explanation, many details have been set forth in order to provide an understanding of various embodiments of the present technology. However, it will be apparent to one skilled in the art that certain embodiments may be practiced without some of these details or with other details.

[0078] Several embodiments have been disclosed, and those skilled in the art will recognize that various modifications, alternative configurations, and equivalents may be used without departing from the spirit of the embodiments. In addition, in order to avoid unnecessary confusion of the present technology, many well-known processes and elements are not described. Therefore, the above description should not be considered to limit the scope of the present technology. In addition, the method or process may be described as sequential or step-by-step, but it should be understood that the operations may be performed simultaneously or in an order different from the order listed.

[0079] In the case of providing a range of values, it should be understood that, unless the context clearly specifies otherwise, each intermediate value between the upper and lower limits of the range is also specifically disclosed, up to the smallest part of the lower limit unit. Any narrower range between any clarified value or unclarified intermediate value in the clarified range and any other clarified value or intermediate value in the clarified range are covered. Those upper and lower limits of smaller ranges can be independently included in the range or excluded from the range, and any one, neither or both of the limits are included in each range of the smaller ranges are also covered in the present technology, subject to any specifically excluded limits in the clarified range. In the case where the clarified range includes one or both of the limits, the range excluding any one or both of those limits is also included.

[0080] As used herein and in the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a substrate" includes reference to a plurality of such substrates and reference to "an arm" includes reference to one or more arms and equivalents thereof known to those skilled in the art, and so forth.

[0081] Furthermore, when used in this specification and the appended claims, the words “comprise(s)”, “comprising”, “contain(s)”, “containing”, “include(s)” and “including” are intended to specify the presence of stated features, integers, components or operations, but they do not preclude the presence or addition of one or more other features, integers, components, operations, actions or groups.

Claims

1. A substrate processing system, comprising: a transfer zone housing defining a transfer zone, wherein a side wall of the transfer zone housing defines a sealable access port for providing and receiving a substrate; a plurality of substrate supports disposed within the transfer area; a plurality of alignment hubs disposed within the transfer area, wherein: a respective one of the plurality of alignment hubs positioned between each pair of adjacent substrate supports of the plurality of substrate supports; and Each alignment hub of the plurality of alignment hubs comprises a substrate receiving surface; and A transmission device, the transmission device comprising: a central hub including a first shaft and a second shaft extending about and concentric with the first shaft, the central hub having a housing positioned within the transfer region and coupled to the second shaft, wherein the housing defines an interior housing volume, a plurality of arms, the plurality of arms being equal to the number of substrate supports in the plurality of substrate supports, each arm in the plurality of arms being coupled around an exterior of the housing, and A plurality of arm hubs are disposed within the internal housing volume, each of the plurality of arm hubs being coupled to an arm of the plurality of arms through the housing, wherein the arm hubs are coupled to the first axis of the central hub.

2. The substrate processing system of claim 1 , wherein the arm hubs are distributed about a central axis of the central hub near a radial edge of the inner housing volume, and wherein the arm hubs are rotatable independently of the housing to which the plurality of arms are coupled.

3. The substrate processing system of claim 2, wherein the first shaft extends within the internal housing volume, wherein one or more connecting rods couple each of the plurality of arm hubs to the first shaft within the internal housing volume.

4. A substrate processing system as described in claim 3, wherein the rotation of the first axis is configured to simultaneously rotate each of the plurality of arm hubs, wherein each arm hub is characterized by a central axis radially deviating from the central axis of the central hub, and wherein the rotation of each of the plurality of arm hubs is configured to cause a corresponding arm of the plurality of arms to rotate around the central axis of the associated arm hub.

5. The substrate processing system of claim 3, wherein the one or more linkages include one or more belts extending around each of the plurality of arm hubs and the first shaft.

6. A substrate processing system as described in claim 3, wherein the one or more connecting rods include a plurality of gears coupled between the first shaft and the plurality of arm hubs, and wherein each of the plurality of gears is arranged between the first shaft and an arm hub among the plurality of arm hubs and contacts both the first shaft and the arm hub among the plurality of arm hubs.

7. The substrate processing system of claim 1, wherein each substrate support of the plurality of substrate supports comprises a set of lift pins accessible therethrough, and wherein each set of lift pins is characterized by a different vertical length than every other set of lift pins.

8. The substrate processing system of claim 1, wherein the transfer apparatus further comprises a third axis and a plurality of aligners, each aligner being located near a distal end of an associated arm of the plurality of arms, wherein each aligner is rotatable independently of the plurality of arms and the housing.

9. A method for conveying a substrate, the method comprising the following steps: A substrate is received at a first substrate support within a transfer region of a substrate processing system, the substrate processing system comprising a transfer apparatus, the transfer apparatus comprising: a central hub including a first shaft and a second shaft, the second shaft extending around the first shaft and being concentric with the first shaft, the central hub having a housing, a plurality of arms, each of the plurality of arms being coupled around an exterior of the housing, and a plurality of arm hubs, each arm hub of the plurality of arm hubs being coupled to an arm of the plurality of arms, wherein the arm hubs are coupled to the first axis of the central hub; engaging the substrate with an arm of the plurality of arms; rotating the first shaft in a first direction about a central axis of the central hub to move the arm of the plurality of arms to recess the substrate toward the housing of the central hub; rotating the second shaft about the central axis of the central hub in a second direction to rotate the housing of the central hub toward a second substrate support of the substrate processing system; rotating the first shaft and the second shaft together about the central axis in the second direction to reposition the substrate to rotate the housing of the central hub, the arms of the plurality of arms, and the substrate toward the second substrate support of the substrate processing system; and The substrate is delivered to the second substrate support of the substrate processing system.

10. The method for transferring a substrate according to claim 9, further comprising the steps of: The conveying device is converted by further rotating the second shaft in the second direction about the central axis and rotating the first shaft in the first direction about the central axis.

11. The method for transferring a substrate according to claim 10, further comprising the steps of: The first shaft is rotated about the central axis in the second direction, and the second shaft is rotated about the central axis in the first direction.

12. The method for transferring a substrate according to claim 9, further comprising the steps of: After engaging the substrate, the substrate is lifted from the first substrate support by vertically translating the transfer device within the transfer area.

13. The method for transferring a substrate according to claim 9, further comprising the steps of: After bonding the substrate, the first substrate support is recessed from the substrate.

14. The method of transferring a substrate of claim 9, wherein each of the plurality of arms further comprises an aligner rotatable independently of the arm, and wherein when the substrate is engaged by the arm of the plurality of arms, the substrate rests on the aligner.

15. The method for transferring a substrate according to claim 9, further comprising the steps of: Prior to delivering the substrate to the second substrate support, the substrate is delivered to an alignment hub located between the first substrate support and the second substrate support.

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