Cooling system and electronic components

Abstract

A heat dissipation system and an electronic component, the heat dissipation system is suitable for a heating element with a horizontal heat dissipation surface, the heat dissipation system includes a plurality of panels arranged in a stacked manner, the plurality of panels are perpendicular to the horizontal heat dissipation surface, a temperature equalizing plate and a heat dissipation component are arranged between the plurality of panels; the heat dissipation component is arranged adjacent to the temperature equalizing plate, at least part of the temperature equalizing plate is located at the bottom of the heat dissipation system in the vertical direction, and at least part of the heat dissipation component is located at the top of the heat dissipation system in the vertical direction; the heat dissipation component includes a refrigerant inlet, a refrigerant outlet and a microchannel, the refrigerant inlet and the refrigerant outlet are respectively located at the edges of the heat dissipation component that are relatively arranged; the microchannel is located between the refrigerant inlet and the refrigerant outlet, and the microchannel is interconnected with the refrigerant inlet and the refrigerant outlet. The present application has a good heat dissipation effect, and is particularly suitable for high-power heat dissipation components with a small-area horizontal heat dissipation surface.

Description

Technical Field

[0001] The present application relates to the technical field of electronic components, and in particular to a heat dissipation system and an electronic component. Background Art

[0002] A heat pipe is a component that uses the liquid phase change process to carry the latent heat of vaporization to improve the heat transfer capacity of the cooling system. Cooling systems with heat pipes have been widely used in the electronic engineering industry.

[0003] In the related art, a heat dissipation system with heat pipes includes a heat absorbing base plate, heat pipes and heat dissipation fins. The heat absorbing base plate is connected to the heat dissipation surface of the heat generating element. A plurality of heat pipes are arranged on the side of the heat absorbing base plate away from the heat dissipation surface. The heat absorbing ends of the plurality of heat pipes are all connected to the heat absorbing base plate. The heat dissipation ends of the plurality of heat pipes are all away from the heat generating element, and the heat dissipation fins are connected to the heat dissipation ends of the heat pipes.

[0004] However, the heat dissipation effect of the above heat dissipation system with heat pipes is relatively poor. Summary of the invention

[0005] In view of the above problems, the present application provides a heat dissipation system and an electronic component, which have good heat dissipation effect and are particularly suitable for high-power heating elements with small horizontal heat dissipation surfaces.

[0006] In order to achieve the above objectives, this application provides the following technical solutions:

[0007] A first aspect of an embodiment of the present application provides a heat dissipation system, which is applicable to a heat-generating element having a horizontal heat dissipation surface. The heat dissipation system comprises a plurality of panels arranged in a stacked manner, wherein the plurality of panels are perpendicular to the horizontal heat dissipation surface.

[0008] A temperature averaging plate and a heat dissipation component are arranged between the plurality of panels, the heat dissipation component is arranged adjacent to the temperature averaging plate, at least part of the temperature averaging plate is located at the bottom of the heat dissipation system in the vertical direction, and at least part of the heat dissipation component is located at the top of the heat dissipation system in the vertical direction;

[0009] The heat dissipation component includes a refrigerant inlet, a refrigerant outlet and a microchannel, wherein the refrigerant inlet and the refrigerant outlet are respectively located at opposite edges of the heat dissipation component; the microchannel is located between the refrigerant inlet and the refrigerant outlet, and the microchannel is interconnected with the refrigerant inlet and the refrigerant outlet.

[0010] In a feasible implementation, a plurality of microchannels are provided, the plurality of microchannels are arranged in parallel, and each of the microchannels is connected between the refrigerant inlet and the refrigerant outlet.

[0011] In a feasible implementation, a plurality of microchannels are provided, the plurality of microchannels are arranged in a mesh and interconnected, at least one of the microchannels is connected to the refrigerant inlet, and at least one of the microchannels is connected to the refrigerant outlet.

[0012] In an achievable implementation, the temperature homogenizing plate includes a condensate pool and a steam chamber, the condensate pool is located at the bottom of the heat dissipation system in the vertical direction, and the steam chamber is located at the top of the heat dissipation system in the vertical direction;

[0013] The extension plane of the condensate pool is parallel to the horizontal heat dissipation surface, the extension direction of the steam chamber is perpendicular to the extension plane of the condensate pool, and the bottom of the steam chamber along the vertical direction is connected to the condensate pool;

[0014] At least a portion of the heat dissipation component is located at the top of the heat dissipation system along the vertical direction, and the heat dissipation component and the steam chamber are adjacently arranged.

[0015] In an achievable implementation, the temperature homogenizing plate further includes a steam chamber micro-channel, and the steam chamber micro-channel is provided with a plurality of micro-channels, and the plurality of micro-channels are all located on the chamber wall of the steam chamber;

[0016] Each of the steam chamber microchannels extends along the extension direction of the steam chamber, and the bottom end of each of the steam chamber microchannels along the vertical direction is connected to the condensate pool.

[0017] In an achievable implementation, the steam chamber includes a plurality of sub-steam chambers, and the plurality of sub-steam chambers are arranged at intervals in a direction parallel to the horizontal heat dissipation surface;

[0018] The bottoms of the plurality of sub-steam chambers along the vertical direction are interconnected and connected to the condensate pool, and the tops of the plurality of sub-steam chambers along the vertical direction are interconnected.

[0019] In an achievable embodiment, at least part of the sub-steam chambers are located between part of the panels, part of the panels include a plurality of first sequence panels and a plurality of second sequence panels, and the plurality of first sequence panels and the plurality of second sequence panels are alternately distributed in sequence;

[0020] The first sequence panel is provided with a plurality of first longitudinal through holes spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid parts between adjacent first longitudinal through holes form a first longitudinal support;

[0021] The second sequence panel is provided with a plurality of second longitudinal through holes spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid parts between adjacent second longitudinal through holes form a second longitudinal support;

[0022] Along the thickness direction of the panel, the first longitudinal through hole and the second longitudinal through hole are interconnected; the first longitudinal support located in the middle of the first longitudinal through hole in the vertical direction and the second longitudinal support located in the middle of the second longitudinal through hole are interconnected; the first longitudinal support located at both ends of the first longitudinal through hole in the vertical direction and the second longitudinal support located at both ends of the second longitudinal through hole in the vertical direction are at least partially staggered.

[0023] In an achievable implementation, the temperature homogenizing plate further includes an auxiliary steam chamber, and the auxiliary steam chamber is located between the heat dissipation component and the condensate pool;

[0024] The bottom of the auxiliary steam chamber along the vertical direction is communicated with the condensate pool, and the side of the auxiliary steam chamber is communicated with the steam chamber.

[0025] In a feasible implementation, the condensate pool includes a plurality of micro channels, the plurality of micro channels are parallel to each other in an extension plane of the condensate pool, and the plurality of micro channels are interconnected through the steam chamber and the auxiliary steam chamber.

[0026] In a feasible implementation, the heat dissipation components include two, and the two heat dissipation components are located on opposite sides of the extension direction of the steam chamber.

[0027] In an achievable implementation, it further includes a refrigerant inlet and a refrigerant outlet;

[0028] The refrigerant inlet is located on a side of the heat dissipation component close to the steam chamber; the refrigerant introduction port is located on the panel forming the steam chamber, and the refrigerant introduction port is located on a side of the temperature homogenizing plate close to the refrigerant inlet, and the refrigerant introduction port is connected to the refrigerant inlet;

[0029] The refrigerant outlet is located on a side of the heat dissipation component close to the steam chamber; the refrigerant lead-out port is located on the panel forming the steam chamber, and the refrigerant lead-out port is located on a side of the temperature equalizing plate close to the refrigerant inlet, and the refrigerant lead-out port is connected to the refrigerant outlet.

[0030] A second aspect of an embodiment of the present application provides an electronic component, including a heat generating element and the above-mentioned heat dissipation system, wherein the heat generating element has a horizontal heat dissipation surface, and the heat dissipation system is arranged on a side of the heat generating element close to the horizontal heat dissipation surface.

[0031] The embodiments of the present application provide a heat dissipation system and an electronic component, wherein the heat dissipation system is particularly suitable for high-power heating elements with a small horizontal heat dissipation surface. The heat dissipation system is provided with a temperature-averaging plate and a heat dissipation component, so that the end of the temperature-averaging plate relatively close to the horizontal heat dissipation surface forms an evaporation end to absorb the heat of the heating element, and the end of the temperature-averaging plate relatively far from the horizontal heat dissipation surface forms an evaporation end to dissipate heat through the adjacent heat dissipation component; by providing multiple panels perpendicular to the horizontal heat dissipation surface, the multiple panels form a layered structure, and the heat of the heating element flows along the layers on both sides of each panel, with smaller flow resistance, and the heat can be quickly diffused from the end close to the horizontal heat dissipation surface to the end far from the horizontal heat dissipation surface, with higher heat dissipation efficiency and better heat dissipation effect; by arranging the heat dissipation component on the panel and adjacent to the temperature-averaging plate, the temperature-averaging plate and the heat dissipation component are separated by only one wall, avoiding the contact thermal resistance and structural redundancy caused by the physical structure connection, so that the heat can be quickly diffused along the panel; by arranging a microchannel, the refrigerant flows through the microchannel to dissipate heat to the heating element through the temperature-averaging plate, and the structure of the microchannel prolongs the residence time of the refrigerant in the heat dissipation component, increases the heat that the refrigerant can take away, and improves the heat dissipation effect. The electronic component includes the above-mentioned heat dissipation system and has the same beneficial effect.

[0032] The construction of the present application as well as its other objects and beneficial effects will be more clearly understood through the description of the preferred embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 A brief schematic diagram of a heat dissipation system provided in an embodiment of the present application;

[0035] Figure 2 for Figure 1 A schematic diagram of the specific structure at A;

[0036] Figure 3 for Figure 1 A schematic diagram of the specific structure at B;

[0037] Figure 4 A schematic diagram of the structure of a first panel of a heat dissipation system provided in an embodiment of the present application;

[0038] Figure 5 A schematic diagram of the structure of a second panel of a heat dissipation system provided in an embodiment of the present application;

[0039] Figure 6 A schematic diagram of the structure of a third panel of the heat dissipation system provided in an embodiment of the present application;

[0040] Figure 7 A schematic diagram of the structure of a fourth panel of the heat dissipation system provided in an embodiment of the present application;

[0041] Figure 8 A schematic diagram of the structure of a fifth panel of the heat dissipation system provided in an embodiment of the present application;

[0042] Fig. 9 A schematic diagram of the structure of the sixth panel of the heat dissipation system provided in an embodiment of the present application;

[0043] Fig.10 A schematic diagram of the structure of a seventh panel of the heat dissipation system provided in an embodiment of the present application;

[0044] Fig.11 A schematic diagram of the structure of an eighth panel of the heat dissipation system provided in an embodiment of the present application;

[0045] Fig.12 A schematic diagram of the structure of a ninth panel of the heat dissipation system provided in an embodiment of the present application;

[0046] Fig.13 A schematic diagram of the structure of the tenth panel of the heat dissipation system provided in an embodiment of the present application;

[0047] Fig.14 A schematic diagram of the structure of an eleventh panel of the heat dissipation system provided in an embodiment of the present application;

[0048] Fig.15 A schematic diagram of the structure of the twelfth panel of the heat dissipation system provided in an embodiment of the present application;

[0049] Fig.16 A schematic diagram of the structure of the thirteenth panel of the heat dissipation system provided in an embodiment of the present application;

[0050] Fig.17 A schematic diagram of the structure of the fourteenth panel of the heat dissipation system provided in an embodiment of the present application.

[0051] Description of reference numerals:

[0052] 100- Cooling system;

[0053] 101-first panel; 102-second panel; 103-third panel; 104-fourth panel; 105-fifth panel; 106-sixth panel; 107-seventh panel; 108-eighth panel; 109-ninth panel; 110-tenth panel; 111-eleventh panel; 112-twelfth panel; 113-thirteenth panel; 114-fourteenth panel;

[0054] 210- condensate pool; 211- micro channel;

[0055] 220 - steam chamber; 221 - sub-steam chamber; 222 - first longitudinal through hole; 223 - first transverse through hole; 224 - first connecting pin hole; 225 - second longitudinal through hole; 226 - second transverse through hole;

[0056] 227-second connecting pin hole;

[0057] 230- auxiliary steam chamber;

[0058] 240- refrigerant inlet;

[0059] 250-refrigerant outlet;

[0060] 310-Refrigerant inlet;

[0061] 320-refrigerant outlet;

[0062] 330-microchannel; 331-first micropore; 332-second micropore;

[0063] 400-screw holes;

[0064] Q-heat; L-refrigerant; Y-condensate; Z-steam. DETAILED DESCRIPTION

[0065] In the related art, a heat dissipation system with a heat pipe includes a heat absorbing base plate, a heat pipe and a heat dissipation fin. The heat absorbing base plate is connected to the heat dissipation surface of the heating element through an interface material that reduces the contact thermal resistance. A plurality of heat pipes are arranged on the side of the heat absorbing base plate away from the heat dissipation surface. Each heat pipe is U-shaped, and the two ends of the U-shaped heat pipe are a heat absorbing end and a heat dissipation end, respectively. The heat absorbing end of each U-shaped heat pipe is clamped on the heat absorbing base plate, and the heat dissipation end of each U-shaped heat pipe is located on the side away from the heating element and is spaced apart from the heat absorbing base plate. A plurality of heat dissipation fins are arranged, and the plurality of heat dissipation fins are spaced apart in parallel and are riveted to the heat dissipation end of the U-shaped heat pipe.

[0066] However, in the above technical solution, the manufacturing method of discretely connecting the heat sink fins and the heat pipes increases the contact thermal resistance between them, resulting in unnecessary material redundancy. Not only is the manufacturing process complicated and consuming, but the heat dissipation effect is also greatly reduced.

[0067] In order to solve the above technical problems, the embodiments of the present application provide a heat dissipation system and an electronic component. The heat dissipation system is particularly suitable for high-power heating elements with a small horizontal heat dissipation surface. The heat dissipation system is provided with a temperature-averaging plate and a heat dissipation component, so that the end of the temperature-averaging plate relatively close to the horizontal heat dissipation surface forms an evaporation end to absorb the heat of the heating element, and the end of the temperature-averaging plate relatively far from the horizontal heat dissipation surface forms an evaporation end to dissipate heat through the adjacent heat dissipation component; by providing multiple panels perpendicular to the horizontal heat dissipation surface, the multiple panels form a layered structure, and the heat of the heating element flows along the layers on both sides of each panel, with smaller flow resistance, and the heat can be quickly diffused from the end close to the horizontal heat dissipation surface to the end far from the horizontal heat dissipation surface, with higher heat dissipation efficiency and better heat dissipation effect; by arranging the heat dissipation component on the panel and adjacent to the temperature-averaging plate, the temperature-averaging plate and the heat dissipation component are separated by only one wall, avoiding the contact thermal resistance and structural redundancy caused by the physical structure connection, so that the heat can be quickly diffused along the panel; by arranging a microchannel, the refrigerant flows through the microchannel to dissipate heat to the heating element through the temperature-averaging plate, and the structure of the microchannel prolongs the residence time of the refrigerant in the heat dissipation component, increases the heat that the refrigerant can take away, and improves the heat dissipation effect. The electronic component includes the above-mentioned heat dissipation system and has the same beneficial effect.

[0068] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar parts or parts with the same or similar functions. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0069] The electronic components provided in the embodiments of the present application are described below.

[0070] An embodiment of the present application provides an electronic component, including a heating element and a heat dissipation system, wherein the heating element has a horizontal heat dissipation surface, and the heat dissipation system is arranged on a side of the heating element close to the horizontal heat dissipation surface.

[0071] The electronic component may include a circuit board, and the heating element may include a chip on the circuit board. The heating element may include not only a small-power, low-heat-flux heating element in a large space, but also a high-power, high-heat-flux heating element in a small space. For example, the circuit board may be a circuit board in a laser device or a radio frequency device, and the heat flux density of its chip is as high as 1000W / cm 2 Above, heat transfer per unit volume ≥10W / cm 3, heat exchange per unit weight ≥5kW / kg.

[0072] It is understandable that as the position and posture of the electronic component changes during use, the position and posture of the horizontal heat dissipation surface also change accordingly, that is, the horizontal heat dissipation surface can be tilted or vertical. The embodiment of the present application does not strictly limit the horizontal heat dissipation surface to always remain horizontal, but means that the horizontal heat dissipation surface can be horizontal under normal circumstances.

[0073] The following will refer to Figure 1-Figure 17 The heat dissipation system 100 provided in an embodiment of the present application is described.

[0074] The embodiment of the present application provides a heat dissipation system 100, which is applicable to a heat-generating element (not shown) having a horizontal heat dissipation surface. The heat dissipation system 100 includes a plurality of panels stacked in layers, and the plurality of panels are perpendicular to the horizontal heat dissipation surface.

[0075] A temperature equilibrium plate and a heat dissipation assembly are arranged between the multiple panels. The heat dissipation assembly is arranged adjacent to the temperature equilibrium plate. At least part of the temperature equilibrium plate is located at the bottom of the heat dissipation system 100 in the vertical direction, and at least part of the heat dissipation assembly is located at the top of the heat dissipation system 100 in the vertical direction.

[0076] The heat dissipation component includes a refrigerant inlet 310, a refrigerant outlet 320 and a microchannel 330. The refrigerant inlet 310 and the refrigerant outlet 320 are respectively located at the edges of the heat dissipation component that are relatively set; the microchannel 330 is located between the refrigerant inlet 310 and the refrigerant outlet 320, and the microchannel 330 is interconnected with the refrigerant inlet 310 and the refrigerant outlet 320.

[0077] The panel may include a ceramic part, a metal part or a composite material part. For example, the panel may be a copper alloy sheet or a stainless steel sheet. The multiple panels may have the same shape and size, so that the orthographic projections of the multiple panels on each other overlap with each other, and the multiple panels may be welded and fixed.

[0078] Multiple panels are perpendicular to the horizontal heat dissipation surface, so that multiple panels form a layered structure, and the heat Q of the heating element flows along the layers on both sides of each panel, with smaller flow resistance. The heat can quickly diffuse from the end close to the horizontal heat dissipation surface to the end far away from the horizontal heat dissipation surface, with higher heat dissipation efficiency and better heat dissipation effect.

[0079] The temperature spreader is a heat pipe structure formed in multiple panels. On the one hand, the temperature spreader has better heat transfer and heat dissipation effects by virtue of the panel being arranged perpendicular to the horizontal heat dissipation surface. On the other hand, at least part of the temperature spreader is located at the bottom of the heat dissipation system 100 in the vertical direction. The part of the temperature spreader that is relatively close to the horizontal heat dissipation surface forms an evaporation end to absorb the heat Q of the heating element, and the end of the temperature spreader that is relatively far from the horizontal heat dissipation surface forms a condensation end. The heat transferred to the condensation end is dissipated through the adjacent heat dissipation component.

[0080] The heat dissipation assembly is formed in multiple panels. On the one hand, the panels are arranged perpendicular to the horizontal heat dissipation surface, so that the heat dissipation assembly has a better heat transfer and heat dissipation effect. On the other hand, the heat dissipation assembly is arranged adjacent to the temperature plate, and the temperature plate and the heat dissipation assembly are separated by only one wall, which avoids the contact thermal resistance and structural redundancy caused by the physical structure connection, so that the heat can be quickly diffused along the panel.

[0081] The heat dissipation component is provided with a refrigerant inlet 310 and a refrigerant outlet 320 for introducing a refrigerant L for dissipating heat to the temperature equalizing plate. The refrigerant inlet 310 and the refrigerant outlet 320 can be respectively located at two edges of the heat dissipation component that are relatively arranged, or can be distributed on opposite sides of the edge of the heat dissipation component. The refrigerant L can include gas or liquid. The refrigerant flows through the microchannel 330 to dissipate heat to the temperature equalizing plate to take away the heat Q at the condensation end, promote the heat exchange cycle of the condensate in the temperature equalizing plate, and improve the heat dissipation effect on the heating element. The structure of the microchannel 330 can prolong the residence time of the refrigerant L in the heat dissipation component, enhance the heat exchange effect between the refrigerant and the condensate in the temperature equalizing plate, and improve the heat dissipation effect.

[0082] In the embodiment of the present application, a plurality of microchannels 330 are provided, and the plurality of microchannels 330 may include the following two arrangements:

[0083] In a first possible arrangement, Figure 2 As shown, the plurality of microchannels 330 are arranged in a mesh and are interconnected, at least one microchannel 330 is connected to the refrigerant inlet 310 , and at least one microchannel 330 is connected to the refrigerant outlet 320 .

[0084] In this way, a plurality of interconnected microchannel sections can be formed between the refrigerant inlet 310 and the refrigerant outlet 320, which can expand the heat dissipation area of ​​the microchannel 330, prolong the residence time of the refrigerant in the microchannel 330, and improve the heat dissipation effect. Moreover, this microchannel 330 structure is not only suitable for gas refrigerants, but also for liquid refrigerants.

[0085] In one possible embodiment, the microchannel 330 may be formed by Figure 5-Figure 14 The multiple panels shown are stacked and welded in sequence.

[0086] Taking the serial number in the panel name as a reference, the panel with an even serial number in the name is called an even panel, and the panel with an odd serial number in the name is called an odd panel. For example, the serial number of the second panel 102 is two, and the second panel 102 is called an even panel, and the serial number of the third panel 103 is three, and the third panel 103 is called an odd panel.

[0087] A plurality of first micropores 331 are provided on the even-numbered panels, each of which extends in a direction parallel to the horizontal heat dissipation surface, and the plurality of first micropores 331 are spaced apart in a direction perpendicular to the horizontal heat dissipation surface. A plurality of second micropores 332 are provided on the odd-numbered panels, each of which extends in a direction perpendicular to the horizontal heat dissipation surface, and the plurality of second micropores 332 are spaced apart in a direction parallel to the horizontal heat dissipation surface.

[0088] After the even-numbered panels and the odd-numbered panels are stacked in sequence, the first micropores 331 and the second micropores 332 are partially interconnected, and a mesh-shaped interconnected microchannel 330 is formed. In addition, the solid parts between the first micropores 331 on the even-numbered panels are interconnected with the solid parts between the second micropores 332 on the odd-numbered panels, which can ensure that the heat dissipation component has sufficient structural strength.

[0089] Among them, Figure 7-Figure 14 As shown, at the bottom of some even-numbered panels and some odd-numbered panels near the vertical direction, a part of the structure of the temperature equalization plate needs to be set, so that the extension lengths of the first micropores 331 and the second micropores 332 at the corresponding positions are slightly different, but it does not affect the first micropores 331 and the second micropores 332 at other positions to be connected to each other and form the microchannel 330. The embodiment of the present application does not limit the extension length of the first micropores 331 and the second micropores 332, as long as the first micropores 331 and the second micropores 332 staggered on the adjacent panels can be connected to each other and can provide a circulation channel for the refrigerant.

[0090] In some embodiments, in order to provide a heat dissipation component of sufficient thickness to form more microchannels 330, multiple groups of combination structures of adjacent even-numbered panels and odd-numbered panels may be provided. For example, 20 groups of combination structures of the second panel 102 and the third panel 103 may be provided, and then 3 groups of combination structures of the fourth panel 104 and the fifth panel 105 may be provided, and the two groups of combination structures may be stacked and welded.

[0091] In a second achievable arrangement, the plurality of microchannels 330 are arranged in parallel, and each microchannel 330 is connected between the refrigerant inlet 310 and the refrigerant outlet 320 .

[0092] In this way, a plurality of microchannels 330 are formed between the refrigerant inlet 310 and the refrigerant outlet 320, which have a higher heat transfer coefficient and can also improve the heat dissipation effect. Moreover, this microchannel 330 structure is not only suitable for liquid refrigerant, but also for gas refrigerant.

[0093] In a feasible implementation, first micropores 331 may be formed on multiple stacked panels, and the first micropores 331 on adjacent panels are interconnected to form multiple parallel microchannels 330. Moreover, the solid parts between the first micropores 331 on each panel are interconnected with the solid parts between the first micropores 331 on adjacent panels, which can ensure that the heat dissipation component has sufficient structural strength.

[0094] In one possible implementation, Fig.16 and Fig.17 As shown, the temperature homogenizing plate includes a condensate pool 210 and a steam chamber 220 . The condensate pool 210 is located at the bottom of the heat dissipation system 100 along the vertical direction, and the steam chamber 220 is located at the top of the heat dissipation system 100 along the vertical direction.

[0095] The extension plane of the condensate pool 210 is parallel to the horizontal heat dissipation surface, the extension direction of the steam chamber 220 is perpendicular to the extension plane of the condensate pool 210 , and the bottom of the steam chamber 220 along the vertical direction is connected to the condensate pool 210 .

[0096] At least a portion of the heat dissipation component is located at the top of the heat dissipation system 100 along the vertical direction, and the heat dissipation component and the steam chamber 220 are adjacently disposed.

[0097] The condensate pool 210 is arranged close to the horizontal heat dissipation surface, and the condensate Y in the condensate pool 210 absorbs the heat from the horizontal heat dissipation surface and undergoes a vaporization phase change to steam Z. The steam Z after the phase change enters the steam chamber 220 and flows toward the end of the steam chamber 220 away from the horizontal heat dissipation surface. During the flow, the steam Z absorbs the cold energy transferred from the heat dissipation component and changes into condensate. The condensate after the phase change flows back into the condensate pool 210 along the wall of the steam chamber 220, and so on, and the heat Q of the heating element is continuously dissipated through the heat dissipation component.

[0098] The extended plane of the condensate pool 210 is distributed over the entire horizontal heat dissipation surface, which can increase the contact area between the condensate and the horizontal heat dissipation surface, and form heat dissipation for each position of the horizontal heat dissipation surface. The heat dissipation component is arranged adjacent to the steam chamber 220, which can transfer cold to the steam chamber 220 to the greatest extent.

[0099] In a feasible implementation, the temperature homogenizing plate further includes a steam cavity micro-channel (not shown), and a plurality of steam cavity micro-channels are provided, and the plurality of steam cavity micro-channels are all located on the cavity wall of the steam cavity 220 .

[0100] Each steam chamber microchannel extends along the extension direction of the steam chamber 220 , and the bottom end of each steam chamber microchannel along the vertical direction is connected to the condensate pool 210 .

[0101] In this way, the condensate Y in the condensate pool 210 can enter the steam chamber 220 with the help of the steam microchannels, and the condensate Y in the steam microchannels can be heated and vaporized in the steam chamber 220, further increasing the heat dissipation area of ​​the condensate Y and improving the heat dissipation efficiency.

[0102] It can be understood that the steam micro-channels can be grooved in the middle of the panel in the thickness direction to form a micro-channel structure, and can also be grooved in the side of the panel in the thickness direction, and the micro-channel structure can be formed together with the help of adjacent panels.

[0103] In one possible implementation, Fig.16 and Fig.17 As shown, the steam chamber 220 includes a plurality of sub-steam chambers 221, and the plurality of sub-steam chambers 221 are arranged at intervals along a direction parallel to the horizontal heat dissipation surface.

[0104] The bottoms of the plurality of sub-steam chambers 221 along the vertical direction are all connected to each other and to the condensate pool 210 , and the tops of the plurality of sub-steam chambers 221 along the vertical direction are all connected to each other.

[0105] In this way, the steam chamber 220 is set as a structure in which multiple sub-steam chambers 221 are interconnected, which not only ensures that the steam formed by the condensate pool 210 diffuses rapidly along the sub-steam chamber 221, but also forms support in the solid part between adjacent sub-steam chambers 221. The supports on adjacent panels are interconnected, which can ensure the structural strength of the temperature equalizing plate.

[0106] In a feasible implementation, at least part of the sub-steam chambers 221 are located between some panels, and the some panels include a plurality of first sequence panels and a plurality of second sequence panels, and the plurality of first sequence panels and the plurality of second sequence panels are alternately distributed in sequence.

[0107] The first sequence panel is provided with a plurality of first longitudinal through holes 222 spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid parts between adjacent first longitudinal through holes 222 form first longitudinal supports.

[0108] The second sequence panel is provided with a plurality of second longitudinal through holes 225 spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid parts between adjacent second longitudinal through holes 225 form a second longitudinal support.

[0109] Along the thickness direction of the panel, the first longitudinal through hole 222 and the second longitudinal through hole 225 are interconnected. The first longitudinal support located in the middle of the first longitudinal through hole 222 in the vertical direction and the second longitudinal support located in the middle of the second longitudinal through hole 225 are interconnected. The first longitudinal supports located at both ends of the first longitudinal through hole 222 in the vertical direction and the second longitudinal supports located at both ends of the second longitudinal through hole 225 in the vertical direction are at least partially staggered.

[0110] In the embodiment of the present application, the steam chamber 220 can be composed of Fig.16 The thirteenth panel 113 (i.e., the first sequence panel) shown in FIG. Fig.17 The fourteenth panel 114 (ie, the second sequence panel) is stacked and welded.

[0111] The thirteenth panel 113 is provided with a plurality of first longitudinal through holes 222. Each of the first longitudinal through holes 222 extends in a direction perpendicular to the horizontal heat dissipation surface, and a gap is provided between each of the first longitudinal through holes 222 and the condensate pool 210. The plurality of first longitudinal through holes 222 are distributed at intervals in a direction parallel to the horizontal heat dissipation surface.

[0112] Among them, the first longitudinal through hole 222 located in the odd-numbered column is provided with a first connecting pin hole 224 at the bottom in the vertical direction. The first connecting pin hole 224 extends toward the condensate pool 210 and is connected with the condensate pool 210. The first connecting pin hole 224 also extends toward the direction of the first longitudinal through hole 222 of the adjacent previous even-numbered column, and a gap is provided with the bottom of the first longitudinal through hole 222 of the previous even-numbered column in the vertical direction. Among them, the direction close to the side of the refrigerant inlet 310 is called the front, and the direction close to the side of the refrigerant outlet 320 is called the rear. Thus, the first longitudinal supports located at the bottom in the vertical direction are connected to each other in pairs, and one of the first longitudinal supports is connected to the bottom of the condensate pool 210.

[0113] The thirteenth panel 113 is also provided with a first transverse through hole 223. The first transverse through hole 223 is located at the top of each first longitudinal through hole 222 in the vertical direction, and the first transverse through hole 223 extends in a direction parallel to the horizontal heat dissipation surface. A gap is provided between the first transverse through hole 223 and the top of each first longitudinal through hole 222 in the vertical direction. Thus, each first longitudinal support located at the top in the vertical direction is sequentially connected to each other, and the two first longitudinal supports at both ends in the direction parallel to the horizontal heat dissipation surface are respectively connected to the entity part of the thirteenth panel 113.

[0114] The fourteenth panel 114 is provided with a plurality of second longitudinal through holes 225. Each second longitudinal through hole 225 extends in a direction perpendicular to the horizontal heat dissipation surface, and a gap is provided between each second longitudinal through hole 225 and the condensate pool 210. The plurality of second longitudinal through holes 225 are distributed at intervals in a direction parallel to the horizontal heat dissipation surface.

[0115] The second longitudinal through holes 225 located in the odd-numbered columns are provided with second connection pin holes 227. The second connection pin holes 227 extend toward the condensate pool 210 and are in communication with the condensate pool 210. The second connection pin holes 227 also extend toward the direction of the second longitudinal through holes 225 in the next even-numbered columns, and a gap is provided with the bottom of the second longitudinal through holes 225 in the next even-numbered columns in the vertical direction. Thus, the second longitudinal supports located at the bottom in the vertical direction are connected to each other in pairs, and one of the second longitudinal supports is connected to the bottom of the condensate pool 210.

[0116] The fourteenth panel 114 is also provided with a second transverse through hole 226. The second transverse through hole 226 is located at the top of each second vertical micro-hole in the vertical direction, and the second transverse through hole 226 extends in a direction parallel to the horizontal heat dissipation surface. A gap is provided between the second transverse through hole 226 and the top of each second longitudinal through hole 225 in the vertical direction. Thus, each second longitudinal support located at the top in the vertical direction is sequentially connected to each other, and the two second longitudinal supports at both ends in the direction parallel to the horizontal heat dissipation surface are respectively connected to the entity part of the fourteenth panel 114.

[0117] Between the thirteenth panel 113 and the fourteenth panel 114, in the middle along the vertical direction, each first longitudinal through hole 222 and each second longitudinal through hole 225 are interconnected to form a sub-steam chamber 221. At the bottom along the vertical direction, adjacent first longitudinal through holes 222 are interconnected through the first connecting pin hole 224 and the second longitudinal through hole 225, and adjacent second longitudinal through holes 225 are interconnected with the first longitudinal through hole 222 through the second connecting pin hole 227. At the top along the vertical direction, the distance between the second longitudinal through hole 225 and the condensate pool 210 is smaller than the distance between the first longitudinal through hole 222 and the condensate pool 210, and the orthographic projection of the second transverse through hole 226 on the thirteenth panel 113 covers the top of the first transverse through hole 223 and each first longitudinal through hole 222 along the vertical direction, so that each first longitudinal through hole 222 is interconnected through the second transverse through hole 226, and each second longitudinal through hole 225 is interconnected through the first longitudinal through hole 222 and the second transverse through hole 226.

[0118] In one possible implementation, Figure 9-Figure 15 As shown, the temperature vapor chamber further includes an auxiliary steam chamber 230 , and the auxiliary steam chamber 230 is located between the heat dissipation component and the condensate pool 210 .

[0119] The bottom of the auxiliary steam chamber 230 along the vertical direction is communicated with the condensate pool 210 , and the side of the auxiliary steam chamber 230 is communicated with the steam chamber 220 .

[0120] In this way, the steam chamber 220 can be arranged in the middle of the condensate pool 210, and a heat dissipation component can be arranged adjacent to the steam chamber 220, thereby reducing the volume of the heat dissipation system 100. The auxiliary steam chamber 230 can be arranged at the location where the heat dissipation component is arranged to connect with the steam chamber 220, so that the condensate pool 210 can be extended to the entire horizontal heat dissipation surface, thereby increasing the contact area between the condensate pool 210 and the horizontal heat dissipation surface.

[0121] The specific structure of the auxiliary steam chamber 230 provided on the multiple panels can refer to the bottom structure of the steam chamber 220 and be designed similarly.

[0122] In one possible implementation, Figure 9-Figure 17 As shown, the condensate pool 210 includes a plurality of micro channels 211 . The plurality of micro channels 211 are parallel to each other in an extension plane of the condensate pool 210 . The plurality of micro channels 211 are connected to each other through the steam chamber 220 and the auxiliary steam chamber 230 .

[0123] At least one micro-channel 211 may be formed on each panel, and both sidewalls of the micro-channel 211 are parallel to the horizontal heat dissipation surface, and the notch of the micro-channel 211 points to one of the adjacent panels. In the micro-channel 211 close to the steam chamber 220, at least one point on the sidewall of the micro-channel 211 away from the horizontal heat dissipation surface is connected to the steam chamber 220. In the micro-channel 211 close to the auxiliary steam chamber 230, at least one point on the sidewall of the micro-channel 211 away from the horizontal heat dissipation surface is connected to the auxiliary steam chamber 230. In this way, the micro-channels 211 on adjacent panels can be connected to each other through the steam chamber 220 and the auxiliary steam chamber 230, so that the condensate is distributed in each micro-channel 211.

[0124] The structure of the plurality of micro-channels 211 can form a micro-channel group, so that the condensate can be evenly distributed in the micro-channel group and the heat dissipation area between the condensate and the heating element can be expanded.

[0125] In order to further expand the heat dissipation area between the condensate and the heating element, the thickness of the panel formed with the micro-grooves 211 may range from 0.05 mm to 0.1 mm. For example, the thickness of the panel may range from 0.05 mm, 0.07 mm or 0.1 mm. In this way, the panel may have sufficient structural strength and may form as many micro-grooves 211 as possible within a certain thickness range. The thickness of other panels (such as the second panel 102, the third panel 103, the fourth panel 104 and the fifth panel 105) may range from 0.3 mm to 0.4 mm, which may meet the design requirements and save costs.

[0126] The micro-grooves 211 can be formed by a material removal process, for example, the micro-grooves 211 can be processed by a half-engraving technique, that is, a part of the thickness of the solid material at the corresponding position of the thin plate is removed by an etching liquid, and a part of the thickness of the solid material is retained, and the space of the removed material forms the micro-grooves 211. The cross-sectional shape of the micro-grooves 211 may include a triangle, a rectangle, a trapezoid or a polygon.

[0127] In a feasible implementation, the heat dissipation system 100 further includes a liquid injection port (not shown) with a sealing cover, and the liquid injection port is connected to the top end of the steam chamber 220 in the vertical direction.

[0128] In this way, supplementary condensate can be injected into the condensate pool 210 through the injection port.

[0129] In a feasible implementation, the heat dissipation components include two heat dissipation components, and the two heat dissipation components are located on opposite sides of the extension direction of the steam chamber 220 .

[0130] In this way, the heat dissipation component can transfer cold energy on both sides of the steam chamber 220 , take away the heat transferred by the steam chamber 220 , and improve the heat dissipation effect of the heat dissipation system 100 .

[0131] For example, in the embodiment of the present application, two left-right symmetrical heat dissipation components are arranged on both sides of the steam chamber 220. Figure 4-Figure 17 The multiple panels shown are stacked and welded in sequence to form the left half of the heat dissipation system 100 , and the right half is formed by welding these panels in reverse sequence in a left-right symmetrical manner.

[0132] In one possible implementation, Fig.16 and Fig.17 As shown, the heat dissipation system further includes a refrigerant inlet 240 and a refrigerant outlet 250 .

[0133] like Fig.13 and Fig.14 As shown, the refrigerant inlet 310 is located on the side of the heat dissipation component close to the steam chamber 220. The refrigerant inlet 240 is located on the panel forming the steam chamber 220, and the refrigerant inlet 240 is located on the side of the temperature equalizer close to the refrigerant inlet 310, and the refrigerant inlet 240 is connected to the refrigerant inlet 310.

[0134] like Fig.13 and Fig.14 As shown, the refrigerant outlet 320 is located on the side of the heat dissipation component close to the steam chamber 220. The refrigerant outlet 250 is located on the panel forming the steam chamber 220, and the refrigerant outlet 250 is located on the side of the temperature equalizing plate close to the refrigerant inlet 310, and the refrigerant outlet 250 is connected to the refrigerant outlet 320.

[0135] In this way, the refrigerant inlet 240 and the refrigerant inlet 310 form a refrigerant inlet relatively close to the center of the side of the heat dissipation system 100, and the refrigerant inlet 310 of the heat dissipation component is set on one side, so that the outer periphery of the refrigerant inlet of the heat dissipation system 100 retains a solid part, which is convenient for connecting the refrigerant introduction pipeline to the solid part. Similarly, the refrigerant outlet 250 and the refrigerant outlet 320 form a refrigerant outlet relatively close to the center of the side of the heat dissipation system 100, and the refrigerant outlet 320 of the heat dissipation component is set on one side, so that the outer periphery of the refrigerant outlet of the heat dissipation system 100 retains a solid part, which is convenient for connecting the refrigerant outlet pipeline to the solid part.

[0136] In one possible implementation, Figure 1 and Figure 2 Combination Figure 7-10 As shown, the heat dissipation system 100 further includes two groups of screw holes 400 , one group of screw holes 400 is located at the periphery of the refrigerant inlet 310 , and the other group of screw holes 400 is located at the periphery of the refrigerant outlet 320 .

[0137] Four screw holes 400 may be provided on the periphery of the refrigerant inlet 310, and the four screw holes 400 are formed by hollowing out and etching through holes or grooves on each panel at corresponding positions and stacking them. The group of screw holes 400 is connected to the refrigerant introduction pipe by screws.

[0138] Four screw holes 400 may be provided on the periphery of the refrigerant outlet 320, and the four screw holes 400 are formed by hollowing out and etching through holes or grooves on each panel at a corresponding position and stacking them. The group of screw holes 400 is connected to the refrigerant outlet pipe by screws.

[0139] In this way, there is no need to connect other structures, and the screw hole 400 is directly formed on the panel and the refrigerant pipeline is connected. The structure is simple and can avoid the contact thermal resistance and structural redundancy caused by the physical structure connection.

[0140] It should be noted that in the embodiments of the present application, the "micro" in "micro-groove" means that the structural size of the groove is in the micron level, while for structures not explicitly shown, such as "through holes", their structural size can be in the millimeter level or in the micron level, and there is no limitation on this.

[0141] It should be noted that, in the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0142] In the description of the embodiments of the present application, the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the term "plurality" means two or more, unless otherwise precisely and specifically specified.

[0143] In the description of the embodiment of the present application, the terms "first", "second", "third", "fourth", etc. (if present) are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0144] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation system, characterized in that: Applicable to a heat-generating element with a horizontal heat-dissipating surface, the heat-dissipating system comprises a plurality of panels arranged in a stacked manner, and the plurality of panels are perpendicular to the horizontal heat-dissipating surface; A temperature averaging plate and a heat dissipation component are arranged between the plurality of panels, the heat dissipation component is arranged adjacent to the temperature averaging plate, at least part of the temperature averaging plate is located at the bottom of the heat dissipation system in the vertical direction, and at least part of the heat dissipation component is located at the top of the heat dissipation system in the vertical direction; The heat dissipation component includes a refrigerant inlet, a refrigerant outlet and a microchannel, wherein the refrigerant inlet and the refrigerant outlet are respectively located at opposite edges of the heat dissipation component; the microchannel is located between the refrigerant inlet and the refrigerant outlet, and the microchannel is interconnected with the refrigerant inlet and the refrigerant outlet; The temperature homogenizing plate includes a condensate pool and a steam chamber, wherein the condensate pool is located at the bottom of the heat dissipation system in the vertical direction, and the steam chamber is located at the top of the heat dissipation system in the vertical direction; The extension plane of the condensate pool is parallel to the horizontal heat dissipation surface, the extension direction of the steam chamber is perpendicular to the extension plane of the condensate pool, and the bottom of the steam chamber along the vertical direction is connected to the condensate pool; At least part of the heat dissipation component is located at the top of the heat dissipation system in the vertical direction, and the heat dissipation component and the steam chamber are arranged adjacent to each other; The temperature homogenizing plate further comprises a steam cavity micro-channel, wherein a plurality of the steam cavity micro-channels are provided, and the plurality of the steam cavity micro-channels are all located on the cavity wall of the steam cavity; Each of the steam chamber microchannels extends along the extension direction of the steam chamber, and the bottom end of each of the steam chamber microchannels along the vertical direction is connected to the condensate pool; The temperature homogenizing plate further comprises an auxiliary steam chamber, wherein the auxiliary steam chamber is located between the heat dissipation component and the condensate pool; The bottom of the auxiliary steam chamber in the vertical direction is in communication with the condensate pool, and the side of the auxiliary steam chamber is in communication with the steam chamber; The heat dissipation components include two, and the two heat dissipation components are located on opposite sides of the extension direction of the steam chamber.

2. The heat dissipation system according to claim 1, characterized in that: There are a plurality of microchannels, and the plurality of microchannels are arranged in parallel, and each of the microchannels is connected between the refrigerant inlet and the refrigerant outlet.

3. The heat dissipation system according to claim 1, characterized in that: There are multiple microchannels, which are arranged in a mesh and connected to each other. At least one microchannel is connected to the refrigerant inlet, and at least one microchannel is connected to the refrigerant outlet.

4. The heat dissipation system according to claim 1, characterized in that: The steam chamber comprises a plurality of sub-steam chambers, and the plurality of sub-steam chambers are arranged at intervals in a direction parallel to the horizontal heat dissipation surface; The bottoms of the plurality of sub-steam chambers along the vertical direction are interconnected and connected to the condensate pool, and the tops of the plurality of sub-steam chambers along the vertical direction are interconnected.

5. The heat dissipation system according to claim 4, characterized in that: At least part of the sub-steam chambers are located between part of the panels, part of the panels include a plurality of first sequence panels and a plurality of second sequence panels, and the plurality of first sequence panels and the plurality of second sequence panels are alternately distributed in sequence; The first sequence panel is provided with a plurality of first longitudinal through holes spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid parts between adjacent first longitudinal through holes form a first longitudinal support; The second sequence panel is provided with a plurality of second longitudinal through holes spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid parts between adjacent second longitudinal through holes form a second longitudinal support; Along the thickness direction of the panel, the first longitudinal through hole and the second longitudinal through hole are interconnected; the first longitudinal support located in the middle of the first longitudinal through hole in the vertical direction and the second longitudinal support located in the middle of the second longitudinal through hole are interconnected; the first longitudinal support located at both ends of the first longitudinal through hole in the vertical direction and the second longitudinal support located at both ends of the second longitudinal through hole in the vertical direction are at least partially staggered.

6. The heat dissipation system according to claim 1, characterized in that: The condensate pool includes a plurality of micro channels, the plurality of micro channels are parallel to each other in an extension plane of the condensate pool, and the plurality of micro channels are connected to each other through the steam chamber and the auxiliary steam chamber.

7. The heat dissipation system according to claim 1, characterized in that: It also includes a refrigerant inlet and a refrigerant outlet; The refrigerant inlet is located on a side of the heat dissipation component close to the steam chamber; the refrigerant introduction port is located on the panel forming the steam chamber, and the refrigerant introduction port is located on a side of the temperature homogenizing plate close to the refrigerant inlet, and the refrigerant introduction port is connected to the refrigerant inlet; The refrigerant outlet is located on a side of the heat dissipation component close to the steam chamber; the refrigerant lead-out port is located on the panel forming the steam chamber, and the refrigerant lead-out port is located on a side of the temperature equalizing plate close to the refrigerant inlet, and the refrigerant lead-out port is connected to the refrigerant outlet.

8. An electronic component, characterized in that: It comprises a heat-generating element and a heat-dissipating system as claimed in any one of claims 1 to 7, wherein the heat-generating element has a horizontal heat-dissipating surface, and the heat-dissipating system is arranged on a side of the heat-generating element close to the horizontal heat-dissipating surface.

Images