Double-sided electromagnetic shielding structure and shielding structure manufacturing method

Abstract

The present disclosure provides a double-sided electromagnetic shielding structure and a method for manufacturing the shielding structure, and relates to the field of semiconductor packaging technology. The double-sided electromagnetic shielding structure includes a substrate, a plurality of first grounding pads, and a connecting wire. The first surface of the substrate is provided with a first element, and the second surface is provided with a second element; a through hole is provided on the substrate; a plurality of first grounding pads are provided on the surface of the substrate, and are located on both sides of the through hole; the connecting wire electrically connects the first grounding pads on both sides of the through hole, and the connecting wire passes through the through hole from one side of the substrate to the other side; the connecting wire forms a cage-like structure around the first element and the second element. Among them, the highest point of the connecting wire protruding from the first surface is higher than the side of the first element away from the substrate, and the highest point of the connecting wire protruding from the second surface is higher than the side of the second element away from the substrate. Double-sided electromagnetic shielding can be achieved by wire bonding, and the structure is reliable, the process is simple, and the packaging efficiency is high.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a double-sided electromagnetic shielding structure and a method for manufacturing the shielding structure. Background Art

[0002] In the prior art, for double-sided packaging structures that require electromagnetic shielding, metal layers are usually provided on the outer sides of the plastic packaging bodies on both sides, and grounding terminals are provided on the plastic packaging bodies, and the grounding terminals are electrically connected to the metal layers to achieve the electromagnetic shielding function. Since the plastic packaging bodies on both sides are made separately, the thermal expansion coefficients are inconsistent, which easily leads to warping of the packaging structure, thereby reducing the bonding force between the metal layer and the plastic packaging body, and the metal layer is easy to fall off, resulting in electromagnetic shielding failure. Summary of the invention

[0003] The objectives of the present invention include, for example, providing a double-sided electromagnetic shielding structure and a method for manufacturing the shielding structure, which can achieve double-sided electromagnetic shielding with simple process steps and improve the reliability of electromagnetic shielding and packaging efficiency.

[0004] The embodiments of the present invention can be implemented as follows:

[0005] In a first aspect, the present invention provides a double-sided electromagnetic shielding structure, comprising:

[0006] A substrate, the substrate comprising a first surface and a second surface arranged opposite to each other, the first surface being provided with a first element, the second surface being provided with a second element; and the substrate being provided with a through hole;

[0007] A plurality of first grounding pads, wherein the plurality of first grounding pads are disposed on the surface of the substrate and located on both sides of the through hole;

[0008] A connecting wire, wherein the connecting wire is electrically connected to the first grounding pads on both sides of the through hole, and the connecting wire is passed through the through hole from one side of the substrate to the other side; the connecting wire forms a cage-like structure around the first element and the second element; wherein the highest point of the connecting wire protruding from the first surface is higher than the side of the first element away from the substrate, and the highest point of the connecting wire protruding from the second surface is higher than the side of the second element away from the substrate.

[0009] In an optional embodiment, a plastic package is further included, wherein the plastic package fills the through hole and covers the substrate, the first element, the second element and the connecting line.

[0010] In an optional embodiment, a first groove and / or a second groove is formed on the plastic package body; wherein the first groove is used to accommodate the third element, and the second groove is used to expose the connecting wire.

[0011] In an optional embodiment, the connecting line includes a first arc and a second arc connected in sequence, wherein one end of the first arc is connected to a first grounding pad on one side of the through hole and located on the first surface, and the other end passes through the through hole and protrudes from the second surface of the substrate; one end of the second arc is connected to an end of the first arc away from the first grounding pad, and the other end is folded back along the through hole to the first surface and connected to the first grounding pad on the other side of the through hole.

[0012] In an optional embodiment, the substrate is provided with a second grounding pad electrically connected to the first grounding pad, and the second grounding pad is used to connect a solder ball.

[0013] In an optional embodiment, the device further comprises a substrate, on which a third ground pad and a third element are provided, the base plate is stacked on the substrate, the third element is located in the first groove, and the lowest point of the connecting line is lower than a side surface of the third element away from the substrate;

[0014] The third grounding pad is electrically connected to the solder ball, and / or the third grounding pad is electrically connected to the connection line in the second groove.

[0015] In an optional embodiment, a protective glue is provided on a side of the substrate close to the base plate to protect the third component and the solder ball.

[0016] In an optional embodiment, the connecting line has multiple peaks and at least two troughs, one trough is lower than the lower surface of the third element, and the other trough is lower than the lower surface of the second element; the minimum width W1 between the second element and the connecting line, the minimum width W2 between the hole wall on the side of the through hole close to the second element and the connecting line, W2 is smaller than W1, and W1 is smaller than the wavelength of the electromagnetic wave emitted by the third element or the wavelength of the electromagnetic wave coming from one side of the third element.

[0017] In a second aspect, the present invention provides a method for manufacturing a shielding structure, comprising:

[0018] A substrate is provided; wherein the substrate comprises a first surface and a second surface arranged opposite to each other; the substrate is provided with through holes, and first grounding pads are respectively provided on both sides of each through hole;

[0019] Mounting a first component on the first surface of the substrate, and mounting a second component on the second surface;

[0020] A connecting line is provided between the first grounding pads on both sides of the through hole; wherein the connecting line is provided along the through hole from one side of the substrate to the other side; the connecting line forms a cage-like structure around the first element and the second element; the highest point of the connecting line protruding from the first surface is higher than the side of the first element away from the substrate, and the highest point of the connecting line protruding from the second surface is higher than the side of the second element away from the substrate.

[0021] In an optional embodiment, the step of connecting a connection line between the first ground pads on both sides of the through hole includes:

[0022] The substrate is placed on a machine processing surface; wherein a carrier is provided between the machine processing surface and the substrate, and the first element or the second element is placed on the carrier;

[0023] A connecting line is formed between the first grounding pads on both sides of the through hole; wherein the distance between the lowest point of the connecting line and the processing surface of the machine platform is less than half of the thickness of the supporting platform.

[0024] In an optional embodiment, it also includes:

[0025] Plastic-encapsulating the substrate, the first component, the second component and the connecting wire to form a plastic-encapsulated body;

[0026] A first groove and / or a second groove are provided on the plastic package body; wherein the first groove is used to cover the third element, and the second groove is used to expose the connecting wire.

[0027] The beneficial effects of the embodiments of the present invention include, for example:

[0028] The double-sided electromagnetic shielding structure provided by the embodiment of the present invention has a through hole on the substrate, the connecting wire is grounded, and passes through the through hole from one side of the substrate to the other side, and the highest points of the connecting wire on both sides of the substrate are respectively higher than the surfaces of the first element and the second element, so that the connecting wire forms a cage-like structure around the first element and the second element, which plays an electromagnetic shielding role for the first element and the second element. Since the wire bonding method is adopted, the electrical connection is reliable, and a stable and reliable double-sided electromagnetic shielding effect can be achieved. And since the substrate is provided with a through hole, during double-sided packaging, the plastic packaging bodies on both sides can be formed at one time, which simplifies the process and improves the plastic packaging efficiency. And the thermal expansion coefficients of the plastic packaging bodies on both sides formed at one time are consistent, which can alleviate the warping problem during the packaging process.

[0029] The electromagnetic shielding structure manufacturing method provided by the embodiment of the present invention has a quick and convenient wire bonding operation and can achieve reliable double-sided electromagnetic shielding. The provision of through holes is conducive to one-time molding of the plastic sealing bodies on both sides of the substrate, which simplifies the process and improves the plastic sealing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 A schematic diagram of a first structure of a double-sided electromagnetic shielding structure provided by an embodiment of the present invention;

[0032] Figure 2 A second structural schematic diagram of a double-sided electromagnetic shielding structure provided by an embodiment of the present invention;

[0033] Figure 3 A third structural schematic diagram of a double-sided electromagnetic shielding structure provided by an embodiment of the present invention;

[0034] Figure 4 A fourth structural schematic diagram of a double-sided electromagnetic shielding structure provided by an embodiment of the present invention;

[0035] Figure 5 A fifth structural schematic diagram of the double-sided electromagnetic shielding structure provided by an embodiment of the present invention;

[0036] Figure 6 A sixth structural schematic diagram of a double-sided electromagnetic shielding structure provided by an embodiment of the present invention;

[0037] Figure 7 A seventh structural schematic diagram of a double-sided electromagnetic shielding structure provided by an embodiment of the present invention;

[0038] Figure 8 Schematic diagram of the manufacturing process of the double-sided electromagnetic shielding structure provided by the embodiment of the present invention Figure 1 ;

[0039] Fig. 9 Schematic diagram of the manufacturing process of the double-sided electromagnetic shielding structure provided by the embodiment of the present invention Figure 2 .

[0040] Icons: 100-double-sided electromagnetic shielding structure; 110-substrate; 111-first surface; 113-second surface; 115-first grounding pad; 117-second grounding pad; 118-tin ball; 120-through hole; 125-plastic package; 131-first component; 133-second component; 140-connecting line; 141-first arc; 143-second arc; 151-first groove; 153-second groove; 160-substrate; 161-third component; 165-third grounding pad; 170-protective glue; 181-machine processing surface; 183-vacuum fixture. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0042] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0044] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0045] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0046] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0047] First embodiment

[0048] Please refer to Figure 1 This embodiment provides a double-sided electromagnetic shielding structure 100, which can be applied in a three-dimensional stacking structure, has high component integration and reliable electromagnetic shielding, and is conducive to improving the quality and function of electronic products.

[0049] The double-sided electromagnetic shielding structure 100 includes a substrate 110, a plurality of first grounding pads 115 and a connecting wire 140. A first element 131 is provided on the first surface 111 of the substrate 110, and a second element 133 is provided on the second surface 113. A through hole 120 is provided on the substrate 110. A plurality of first grounding pads 115 are provided on the surface of the substrate 110 and are located on both sides of the through hole 120; the connecting wire 140 electrically connects the first grounding pads 115 on both sides of the through hole 120, and the connecting wire 140 passes through the through hole 120 from one side of the substrate 110 to the other side; the connecting wire 140 forms a cage-like structure around the periphery of the first element 131 and the second element 133. The highest point of the connecting wire 140 protruding from the first surface 111 is higher than the side of the first element 131 away from the substrate 110, and the highest point of the connecting wire 140 protruding from the second surface 113 is higher than the side of the second element 133 away from the substrate 110. It can be understood that a through hole 120 is provided on the substrate 110, and the connecting wire 140 is used to electrically connect at least two first grounding pads 115, that is, the connecting wire 140 has a grounding characteristic. And the connecting wire 140 passes through the through hole 120 from one side of the substrate 110 to the other side of the substrate 110, that is, the connecting wire 140 protrudes from the first surface 111 and the second surface 113 of the substrate 110 respectively. The highest points of the connecting wire 140 on both sides of the substrate 110 are respectively higher than the surface of the first element 131 and the second element 133 away from the substrate 110. In this way, the connecting wire 140 forms a cage-like structure around the periphery of the first element 131 and the second element 133, which plays an electromagnetic shielding role for the first element 131 and the second element 133. Due to the use of the wire bonding method, the electrical connection is reliable, and a stable and reliable double-sided electromagnetic shielding effect can be achieved. And because the substrate 110 is provided with a through hole 120, when double-sided packaging is performed, it is beneficial to form the plastic encapsulation body 125 on both sides at one time, simplify the process, and improve the plastic encapsulation efficiency. Furthermore, the thermal expansion coefficients of the plastic package bodies 125 on both sides formed at one time are consistent, which can alleviate the warping problem during the packaging process.

[0050] It should be noted that the multiple first grounding pads 115 located on both sides of the through hole 120 may be multiple first grounding pads 115 that are all located on the same surface of the substrate 110, such as all located on the first surface 111 or the second surface 113. In the present embodiment, the multiple first grounding pads 115 are all located on the first surface 111. The connecting line 140 is a multi-segment arc. Optionally, the connecting line 140 includes a first arc 141 and a second arc 143 that are connected in sequence, wherein one end of the first arc 141 is connected to the first grounding pad 115 located on the first surface 111 and on one side of the through hole 120, and the other end passes through the through hole 120 and protrudes from the second surface 113 of the substrate 110; one end of the second arc 143 is connected to one end of the first arc 141 away from the first grounding pad 115, and the other end folds back along the through hole 120 to the first surface 111 and is connected to the first grounding pad 115 on the other side of the through hole 120. In this way, Figure 1From the perspective of , two peaks and one trough are formed between the two first ground pads 115, the peak is higher than the upper surface of the first element 131, and the trough is lower than the lower surface of the second element 133, which can play an electromagnetic shielding role for both the first element 131 and the second element 133, that is, it has the effect of double-sided electromagnetic shielding.

[0051] Furthermore, the connection line 140 passes through the through hole 120, and no matter what the shape of the connection line 140 is, it can play an electromagnetic shielding role between the circuit layers inside the substrate 110. This is beneficial to the static discharge of the circuit layers inside the substrate 110, and at the same time, it is convenient to reduce the layout of the grounding circuit inside the substrate 110.

[0052] It should be understood that the through hole 120 in this embodiment can be a plurality of through holes 120 arranged at intervals on the periphery of the first element 131 and the second element 133, or a ring-shaped through hole 120 arranged on the periphery of the first element 131 and the second element 133, which is not specifically limited here. The wire bonding path of the connecting wire 140 is not limited to the shape shown in the figure, and the number of its crests and troughs can be more. The more crests and troughs there are, the denser the line arcs are, the more electromagnetic waves can be blocked, and the electromagnetic shielding effect is better.

[0053] Combination Figure 2 In some embodiments, a portion of the first ground pad 115 is disposed on the first surface 111, and another portion of the first ground pad 115 is disposed on the second surface 113. In this way, the arc shape of the connecting line 140 can be other shapes, such as having one crest and two troughs, or having two crests or two troughs, etc., which is not specifically limited here.

[0054] Optionally, the double-sided electromagnetic shielding structure 100 further includes a plastic package 125, which fills the through hole 120 and covers the substrate 110, the first element 131, the second element 133 and the connecting line 140, thereby protecting the first element 131, the second element 133 and the connecting line 140.

[0055] The substrate 110 is provided with a second grounding pad 117 electrically connected to the first grounding pad 115. The second grounding pad 117 is used to set a solder ball 118. The substrate 110 is electrically connected to a circuit board or other structures through the solder ball 118. The second grounding pad 117 can be provided on the first surface 111 or the second surface 113 of the substrate 110. Optionally, in this embodiment, the first grounding pad 115 is provided on the first surface 111 of the substrate 110, and the second grounding pad 117 is provided on the second surface 113 of the substrate 110. The first grounding pad 115 and the second grounding pad 117 can be electrically connected through the internal circuit of the substrate 110.

[0056] The first element 131 and the second element 133 can be chips or components, respectively, which are not specifically limited here. It is easy to understand that the substrate 110 is also provided with a functional pad for electrically connecting to the chip, and the chip is mounted on the functional pad. The chip includes but is not limited to a face-up chip or a flip chip.

[0057] Combination Figure 3 and Figure 4 Optionally, a first groove 151 and / or a second groove 153 are provided on the plastic package body 125; wherein the first groove 151 is used to accommodate the third element 161, and the second groove 153 is used to expose the connecting wire 140. The setting of the first groove 151 and the second groove 153 can release part of the structural stress and alleviate the warping. And it is conducive to improving the heat dissipation performance. In addition, the connecting wire 140 is exposed from the second groove 153, and the exposed connecting wire 140 can be used as a grounding point, which can reduce the original grounding point setting. In other words, the grounding points of the double-sided electromagnetic shielding structure 100 can be increased, the grounding connection is more reliable, and the reliability of electromagnetic shielding is improved.

[0058] The first groove 151 accommodates the third element 161, which includes but is not limited to a chip or a component. This can improve the integration density of the components, while reducing the package volume and the package height. In addition, the connecting wire 140 forms a cage-like structure around the third element 161, which can also play an electromagnetic shielding role for the third element 161.

[0059] Further, the double-sided electromagnetic shielding structure 100 further includes a substrate 160, which includes but is not limited to a circuit board or other substrate 110. A third grounding pad 165 and a third element 161 are provided on the substrate 160, the substrate 110 is stacked on the substrate 160, the third element 161 is electrically connected to the substrate 160, and is located in the first groove 151, and the third grounding pad 165 is electrically connected to the solder ball 118. Alternatively, the third grounding pad 165 is electrically connected to the connecting wire 140 in the second groove 153.

[0060] Or, combined Figure 4 The number of the third grounding pads 165 is multiple, and they are electrically connected to the connecting wire 140 and the solder ball 118 respectively, so that the electrical connection is more reliable, which is conducive to improving the electromagnetic shielding effect. Optionally, the third grounding pad 165 connected to the connecting wire 140 is located in the second groove 153, and the space size of the second groove 153 is larger than the size of the third grounding pad 165, which is conducive to improving the heat dissipation effect.

[0061] Combination Figure 5, a first groove 151 is provided on the plastic package body 125, a third ground pad 165 and a third element 161 are provided on the substrate 160, the third ground pad 165 is electrically connected to the solder ball 118, and the third element 161 is electrically connected to the substrate 160 and is located in the first groove 151, which is conducive to achieving three-dimensional stacking and reducing the stacking height. In addition, the connecting wire 140 plays an electromagnetic shielding role for the third element 161. Optionally, the lowest point of the connecting wire 140 close to the substrate 160 is lower than the upper surface of the third element 161.

[0062] When the shape of the connecting line 140 has multiple crests and multiple troughs, as long as one of the multiple crests is higher than the upper surface of the first element 131, it can play an electromagnetic shielding role for the first element 131. As long as one of the multiple troughs is lower than the lower surface of the second element 133, it can play an electromagnetic shielding role for the second element 133. As long as one of the multiple troughs is lower than the lower surface of the third element 161, it can play an electromagnetic shielding role for the third element 161. In addition, the shape of multiple crests and multiple troughs can also play a role in separating chips or components of different layers, achieving a layered shielding effect.

[0063] Combination Figure 6 , optionally, the connecting line 140 includes two troughs and three peaks. One of the two troughs is exposed from the second groove 153 and is lower than the lower surface of the third element 161. The other trough is lower than the lower surface of the second element 133, that is, there is a certain height difference between the two troughs. Among them, the minimum width W1 between the second element 133 and the connecting line 140, the minimum width W2 between the hole wall of the through hole 120 close to the side of the second element 133 and the connecting line 140, W2 is smaller than W1. In this way, the connecting line 140 can not only shield the clutter in the substrate 110, but also block the electromagnetic waves between the first element 131 and the second element 133, for example, a part of the electromagnetic waves can reach the second element 133, but cannot reach the first element 131, so as to realize the layered shielding between the first element 131 and the second element 133. Similarly, W1 is smaller than the wavelength of the electromagnetic wave emitted by the third element 161 or the wavelength of the electromagnetic wave coming from the side of the third element 161, so that the layered shielding between the third element 161 and the second element 133 can be realized.

[0064] It is easy to understand that multiple groups of connecting wires 140 form a cage-like structure around the first element 131, the second element 133 and the third element 161, and the distance between two adjacent groups of connecting wires 140 is less than a preset distance, which is the wavelength of the electromagnetic wave to be shielded. This can play a shielding role for the peripheral electromagnetic waves. Similarly, in the same or different groups of connecting wires 140, the distance between the peaks and the distance between the troughs are less than the preset distance, which is the wavelength of the electromagnetic wave to be shielded, so as to achieve a better electromagnetic shielding effect. Optionally, a protective glue 170 is provided on the side of the substrate 160 close to the substrate 110 to protect the third element 161 and the solder ball 118. The protective glue 170 can be an insulating glue or a plastic encapsulation material, which is not specifically limited here. The protective glue 170 has a protective effect on the solder ball 118, the substrate 160 and the structure on the substrate 160, and also has bonding, fixing, buffering and heat dissipation. In this embodiment, the third element 161 adopts a flip chip. The protective glue 170 is made of insulating glue, and plays an electromagnetic shielding role for the first element 131 , the second element 133 and the third element 161 through the connecting wire 140 .

[0065] Combination Figure 7 , the plastic package body 125 is provided with a first groove 151 and a second groove 153, the substrate 160 is provided with a third ground pad 165 and a third element 161, the third ground pad 165 is electrically connected to the solder ball 118, the third element 161 is electrically connected to the substrate 160 and is located in the first groove 151, and the connecting wire 140 is exposed from the second groove 153. Optionally, the lowest point of the connecting wire 140 close to the substrate 160 is lower than the upper surface of the third element 161. The connecting wire 140 plays an electromagnetic shielding role for the third element 161.

[0066] Further, the third ground pad 165 is not provided at the position corresponding to the second groove 153 on the substrate 160, and the distance between the lowest point of the connecting wire 140 close to the substrate 160 and the substrate 160 is H1, and the distance H1 is relatively small. When the protective glue 170 or the plastic encapsulation material is filled at the bottom of the substrate 110 (between the substrate 110 and the substrate 160), the capillary action of the connecting wire 140 on the colloid in the second groove 153 can be utilized to make the colloid or the plastic encapsulation material climb into the second groove 153 along the connecting wire 140. In addition, the capillary action of the first groove 151, the second groove 153 and the connecting wire 140 can be utilized to improve the filling property of the bottom of the third element 161 and the first groove 151. Moreover, the distance H1 is relatively small, and the connecting wire 140 can better play the electromagnetic shielding effect on the third element 161, and improve the heat dissipation effect. Optionally, the distance H1 is less than the wavelength of the electromagnetic wave that the third element 161 needs to shield. Providing the distance H1 can also prevent the connection line 140 from touching the substrate 160 , thereby protecting the connection line 140 .

[0067] The double-sided electromagnetic shielding structure 100 provided in this embodiment has double-sided electromagnetic shielding effect, high chip integration, reliable electromagnetic shielding effect, simple structure, and can alleviate the warping of the packaging structure. The first ground pad 115 on the same surface is connected by wire bonding, which has a higher electrical propagation rate and a good electromagnetic shielding effect.

[0068] Second embodiment

[0069] Combination Figure 8 and Fig. 9 , an embodiment of the present invention provides a method for manufacturing a shielding structure, comprising:

[0070] A substrate 110 is provided; wherein the substrate 110 includes a first surface 111 and a second surface 113 arranged opposite to each other; the substrate 110 is provided with through holes 120, and first grounding pads 115 are respectively provided on both sides of each through hole 120. Optionally, the first grounding pad 115 is provided on the first surface 111. The second surface 113 is provided with a second grounding pad 117. The first grounding pad 115 and the second grounding pad 117 are electrically connected through the internal circuit of the substrate 110. The substrate 110 can be a ceramic substrate 110, a silicon substrate 110, a glass substrate 110, etc.

[0071] The first component 131 is mounted on the first surface 111 of the substrate 110, and the second component 133 is mounted on the second surface 113. Optionally, the substrate 110 is flipped over first, and the second component 133 is mounted on the second surface 113. The substrate 110 is flipped over again, and the first component 131 is mounted on the first surface 111. Then, wire bonding is performed with the first component 131 facing upward. This can reduce the number of flipping times of the substrate 110 and improve production efficiency. Of course, in other embodiments, the first component 131 can also be mounted first, and then the second component 133 can be mounted, which is not specifically limited here. In this embodiment, the first component 131 and the second component 133 can be upright chips, flip chips or components, etc. Optionally, the first component 131 and the second component 133 are flip chips respectively, and the flip chips are fixedly connected to the functional pads of the substrate 110 by reflow soldering.

[0072] Connecting wires 140 are provided between the first ground pads 115 on both sides of the through hole 120; wherein the connecting wires 140 are provided from one side of the substrate 110 to the other side along the through hole 120; the highest point of the connecting wires 140 protruding from the first surface 111 is higher than the side of the first component 131 away from the substrate 110, and the highest point of the connecting wires 140 protruding from the second surface 113 is higher than the side of the second component 133 away from the substrate 110. Optionally, the step of connecting wires 140 between the first ground pads 115 on both sides of the through hole 120 includes:

[0073] The substrate 110 is placed on the machine processing surface 181; a carrier is provided between the machine processing surface 181 and the substrate 110, and the first component 131 or the second component 133 is placed on the carrier. The carrier is used to raise the distance between the substrate 110 and the machine processing surface 181, so that the connecting wire 140 can pass through the through hole 120. In this embodiment, the carrier adopts a vacuum fixture 183, which can not only play the role of raising the substrate 110, but also adsorb and position the substrate 110.

[0074] Optionally, the distance D between the lowest point of the connecting line 140 and the machine processing surface 181 is less than half the thickness of the supporting platform, so as to ensure that the lowest point of the connecting line 140 is lower than the side of the second element 133 away from the substrate 110, so as to achieve electromagnetic shielding of the second element 133. It should be noted that the highest point and the lowest point described in the text are relative positions. For example, the lowest point on one side of the second surface 113 can also be understood as the highest point of the connecting line 140 protruding from the second surface 113.

[0075] The connection line 140 includes two arcs as an example for description. The connection line 140 includes a first arc 141 and a second arc 143. The first arc 141 is firstly formed, starting from the first grounding pad 115 on the first surface 111, upward to the highest point protruding from the first surface 111, then bending downward to pass through the through hole 120, and reaching the lowest point protruding from the second surface 113. Then the second arc 143 is formed, starting from the end of the first arc 141, bending upward, passing through the through hole 120 to the highest point protruding from the first surface 111, and then bending downward to connect to the first grounding pad 115 on the other side of the through hole 120 and located on the first surface 111. The highest point of the connecting wire 140 on one side of the substrate 110 is higher than the surface of the first element 131 on the side away from the substrate 110, and the lowest point on the other side of the substrate 110 is lower than the surface of the second element 133 on the side away from the substrate 110. In this way, the connecting wire 140 forms a cage-like structure around the first element 131 and the second element 133, which plays an electromagnetic shielding role for the first element 131 and the second element 133. The above is only a description of a wire bonding path, and different wire bonding paths and wire bonding methods can be designed according to actual needs, which are not specifically limited here.

[0076] The plastic encapsulation substrate 110, the first component 131, the second component 133 and the connecting wire 140 form a plastic encapsulation body 125. Optionally, the plastic encapsulation body 125 can be poured into the side of the first surface 111 of the substrate 110, and the plastic encapsulation body 125 can be poured into the side of the second surface 113 through the through hole 120 on the substrate 110, so that double-sided plastic encapsulation can be completed at one time. Compared with the traditional double-sided plastic encapsulation, one side is first plastic encapsulated and then the other side is plastic encapsulated. This embodiment can improve the plastic encapsulation efficiency and simplify the process. In addition, the connecting wire 140 in the through hole 120 has a capillary effect on the plastic encapsulation body 125, which improves the filling property of the plastic encapsulation body 125 on the second surface 113 and the through hole 120. Of course, the plastic encapsulation body 125 can also be poured into the side of the second surface 113 of the substrate 110, and reach the first surface 111 after passing through the through hole 120, so as to achieve one-time double-sided plastic encapsulation. It is easy to understand that the double-sided plastic packaging is completed at one time, and the thermal expansion coefficients of the plastic packaging bodies 125 on both sides of the substrate 110 are consistent, which effectively alleviates the structural warping phenomenon and improves the packaging quality.

[0077] After plastic packaging, a solder ball 118 is placed on the second ground pad 117. Finally, the plastic packaging structure is cut and separated to form a single product.

[0078] Optionally, the manufacturing method further includes opening a first groove 151 and / or a second groove 153 on the plastic package 125; wherein the first groove 151 is used to cover the third element 161, and the second groove 153 is used to expose the connecting wire 140. In this embodiment, the first groove 151 and the second groove 153 are set on one side of the mounting surface of the double-sided electromagnetic shielding structure 100. According to the stacking requirements, the first groove 151 and the second groove 153 are selectively opened on one side of the plastic package 125. If both sides need to be stacked, the first groove 151 and the second groove 153 can be opened on the plastic package 125 on both sides, respectively. Among them, the first groove 151 and the second groove 153 can also be selectively set, or both are set.

[0079] The first groove 151 and the second groove 153 can be formed by laser grooving. Alternatively, a mold with a bump can be used during the plastic encapsulation process, and after the plastic encapsulation liquid is formed, a groove structure of the plastic encapsulation body 125 is formed. In this embodiment, the second groove 153 is grooved by laser so that the lowest point of the connecting line 140 leaks out of the plastic encapsulation body 125. The grooving process can be completed before cutting and separation, or it can be performed after cutting and separation.

[0080] Finally, the slotted plastic package structure is mounted on the substrate 160. The third element 161 is located in the first groove 151, and the third ground pad 165 on the substrate 160 is connected to the solder ball 118. The plastic package material or protective glue 170 is filled on the substrate 160 to protect the solder ball 118 and the third element 161 and other structures. The lowest point of the connecting wire 140 is lower than the side surface of the third element 161 away from the substrate 160. Optionally, the lowest point of the connecting wire 140 is roughly flush with the side of the third element 161 close to the substrate 160, so that the connecting wire 140 plays an electromagnetic shielding role for the third element 161.

[0081] Other contents not mentioned in this embodiment are similar to those described in the first embodiment and will not be described in detail here.

[0082] In summary, the double-sided electromagnetic shielding structure 100 and the method for manufacturing the electromagnetic shielding structure provided by the embodiments of the present invention have the following beneficial effects:

[0083] The double-sided electromagnetic shielding structure 100 provided by the embodiment of the present invention has a through hole 120 on the substrate 110, and the connecting wire 140 is grounded and passes through the through hole 120 from one side of the substrate 110 to the other side. The highest points of the connecting wire 140 on both sides of the substrate 110 are higher than the surfaces of the first element 131 and the second element 133, respectively. In this way, the connecting wire 140 forms a cage-like structure around the periphery of the first element 131 and the second element 133, and plays an electromagnetic shielding role for the first element 131 and the second element 133. Due to the use of the wire bonding method, the electrical connection is reliable, and a stable and reliable double-sided electromagnetic shielding effect can be achieved. And because the substrate 110 is provided with a through hole 120, during double-sided packaging, the plastic packaging bodies 125 on both sides can be formed at one time, simplifying the process and improving the plastic packaging efficiency. In addition, a first groove 151 is provided on the plastic packaging body 125 for accommodating the third element 161, reducing the packaging height, and the connecting wire 140 can also play an electromagnetic shielding role for the third element 161. By opening the second groove 153 to expose the connection line 140 , the grounding point can be increased, the electrical connection is more reliable, and the capillary effect can be fully exerted to improve the filling property of the colloid or the plastic packaging material.

[0084] The electromagnetic shielding structure manufacturing method provided by the embodiment of the present invention is quick and convenient in wire bonding operation, can achieve reliable double-sided electromagnetic shielding, and has better filling performance. The through hole 120 is provided, which is conducive to the one-time molding of the plastic packaging body 125 on both sides of the substrate 110, simplifies the process, and improves the efficiency of plastic packaging.

[0085] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A double-sided electromagnetic shielding structure, characterized in that: include: A substrate, the substrate comprising a first surface and a second surface arranged opposite to each other, the first surface being provided with a first element, the second surface being provided with a second element; and the substrate being provided with a through hole; A plurality of first grounding pads, wherein the plurality of first grounding pads are disposed on the surface of the substrate and are disposed on both sides of the through hole; A connecting wire, the connecting wire electrically connects the first ground pads on both sides of the through hole, and the connecting wire is arranged from one side of the substrate along the through hole to the other side; the connecting wire forms a cage-like structure around the first element and the second element; wherein the highest point of the connecting wire protruding from the first surface is higher than the side of the first element away from the substrate, and the highest point of the connecting wire protruding from the second surface is higher than the side of the second element away from the substrate; A plastic package body fills the through hole and covers the substrate, the first element, the second element and the connecting line.

2. The double-sided electromagnetic shielding structure according to claim 1, characterized in that: The plastic package body is provided with a first groove and / or a second groove; wherein the first groove is used to accommodate the third element, and the second groove is used to expose the connecting wire.

3. The double-sided electromagnetic shielding structure according to claim 1, characterized in that: The connecting line includes a first arc and a second arc connected in sequence, one end of the first arc is connected to a first grounding pad on one side of the through hole and located on the first surface, and the other end passes through the through hole and protrudes from the second surface of the substrate; one end of the second arc is connected to an end of the first arc away from the first grounding pad, and the other end is folded back along the through hole to the first surface and connected to the first grounding pad on the other side of the through hole.

4. The double-sided electromagnetic shielding structure according to claim 2, characterized in that: The substrate is provided with a second grounding pad electrically connected to the first grounding pad, and the second grounding pad is used for connecting a solder ball.

5. The double-sided electromagnetic shielding structure according to claim 4, characterized in that: It also includes a substrate, the plastic package body is provided with the first groove and the second groove; the substrate is provided with a third ground pad and a third element, the base plate is stacked on the substrate, the third element is located in the first groove, and the lowest point of the connecting line is lower than the side surface of the third element away from the substrate; The third grounding pad is electrically connected to the solder ball, and / or the third grounding pad is electrically connected to the connection line in the second groove.

6. The double-sided electromagnetic shielding structure according to claim 5, characterized in that: A protective glue is provided on one side of the substrate close to the base plate to protect the third element and the solder ball.

7. The double-sided electromagnetic shielding structure according to claim 2, characterized in that: The connecting line has multiple peaks and at least two troughs, one of which is lower than the lower surface of the third element, and the other is lower than the lower surface of the second element; the minimum width W1 between the second element and the connecting line, the minimum width W2 between the hole wall on the side of the through hole close to the second element and the connecting line, W2 is smaller than W1, and W1 is smaller than the wavelength of the electromagnetic wave emitted by the third element or the wavelength of the electromagnetic wave coming from one side of the third element.

8. A method for manufacturing a shielding structure, characterized in that: include: A substrate is provided; wherein the substrate comprises a first surface and a second surface arranged opposite to each other; the substrate is provided with through holes, and first grounding pads are respectively provided on both sides of each through hole; Mounting a first component on the first surface of the substrate, and mounting a second component on the second surface; Connecting wires between the first ground pads on both sides of the through hole; wherein the connecting wires are arranged along the through hole from one side of the substrate to the other side; the connecting wires form a cage-like structure around the first element and the second element; wherein the highest point of the connecting wires protruding from the first surface is higher than the side of the first element away from the substrate, and the highest point of the connecting wires protruding from the second surface is higher than the side of the second element away from the substrate; The substrate, the first component, the second component and the connecting wire are plastic-sealed to form a plastic-sealed body; wherein the plastic-sealed body completes the plastic-sealing of the first surface and the second surface of the substrate at one time through the through hole.

9. The method for manufacturing a shielding structure according to claim 8, characterized in that: The step of connecting a connection line between the first ground pads on both sides of the through hole comprises: The substrate is placed on a machine processing surface; wherein a carrier is provided between the machine processing surface and the substrate, and the first element or the second element is placed on the carrier; A connecting line is formed between the first grounding pads on both sides of the through hole; wherein the distance between the lowest point of the connecting line and the processing surface of the machine platform is less than half of the thickness of the supporting platform.

10. The method for manufacturing a shielding structure according to claim 8, characterized in that: Also includes: A first groove and / or a second groove are provided on the plastic package body; wherein the first groove is used to cover the third element, and the second groove is used to expose the connecting wire.

Images