Method of manufacturing an electronic device

Abstract

A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes the following steps: providing a substrate; bonding an electronic component on the substrate, wherein the electronic component is mainly driven by a reverse bias in an operating mode; applying a forward bias to the electronic component, and determining whether the electronic component is normal or damaged; and transporting the substrate provided with the electronic component determined as normal to a next production station, or repairing the electronic component determined as damaged. Therefore, the manufacturing method of the electronic device of the present disclosure can effectively test whether the electronic component formed in the electronic device is normal or damaged during the manufacturing process.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a manufacturing method of an electronic device. BACKGROUND

[0002] The existing electronic device including a variable capacitor is tested after manufacturing by applying a reverse bias to the variable capacitor to test whether the variable capacitor is normal or damaged. The existing variable capacitor bonding on the substrate is difficult to test. Moreover, the existing test is a product function test performed after a plurality of variable capacitors are bonded on the substrate, and cannot locate a single damaged condition. SUMMARY

[0003] The present disclosure is directed to a manufacturing method of an electronic device, which can automatically determine whether an electronic component in the electronic device is damaged during manufacturing to repair the electronic component determined to be damaged during manufacturing.

[0004] According to an embodiment of the present disclosure, the manufacturing method of the electronic device includes the steps of: providing a substrate; bonding at least one electronic component on the substrate, wherein the at least one electronic component is mainly driven by a reverse bias in a working mode; applying a forward bias to the at least one electronic component, and determining whether the at least one electronic component is normal or damaged; and transporting the at least one electronic device determined to be normal to a next production site, or repairing the at least one electronic component determined to be damaged.

[0005] The manufacturing method of the electronic device of the present disclosure can accurately and conveniently determine whether the electronic component is normal or damaged by applying a forward bias to the electronic component and detecting whether the electronic component emits light through a testing device.

[0006] In order to make the above features and advantages of the present disclosure more apparent, specific embodiments are described below in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 is a structural schematic diagram of an electronic device of an embodiment of the present disclosure;

[0008] Figure 2 is a flowchart of a manufacturing method of an electronic device of an embodiment of the present disclosure;

[0009] Figure 3 is a structural schematic diagram of an electronic device of an embodiment of the present disclosure;

[0010] Figure 4 is a structural schematic diagram of an electronic device of an embodiment of the present disclosure;

[0011] Figure 5FIG. 1 is a structural schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0012] Figure 6 FIG. 2 is a structural schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0013] Figure 7 FIG. 3 is a structural schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0014] Figure 8 FIG. 4 is a circuit schematic diagram of an electronic element according to an embodiment of the present disclosure;

[0015] Figure 9 FIG. 5 is a circuit schematic diagram of an electronic element according to an embodiment of the present disclosure;

[0016] Figure 10 FIG. 6 is a circuit schematic diagram of an electronic element according to an embodiment of the present disclosure;

[0017] Figure 11 FIG. 7 is a circuit schematic diagram of an electronic element according to an embodiment of the present disclosure;

[0018] Figure 12 FIG. 8 is a circuit schematic diagram of an electronic element according to an embodiment of the present disclosure;

[0019] Figure 13 FIG. 9 is a flowchart of a manufacturing method of an electronic device according to another embodiment of the present disclosure.

[0020] BRIEF DESCRIPTION OF DRAWINGS

[0021] 100, 300, 400, 500, 600, 700: electronic device;

[0022] 101, 301, 401, 501, 601, 701: substrate;

[0023] 102: active region;

[0024] 103: peripheral region;

[0025] 110, 310, 410, 510, 610, 710, 810, 910_1, 910_2: electronic element;

[0026] 120, 130, 320, 330, 420, 430, 520, 530, 620, 630: driving circuit;

[0027] 140, 341, 342, 441, 442, 541, 542, 641, 642, 741, 742: test pad;

[0028] 801, 901, 1001, 1101, 1201: test device;

[0029] 811, 911, 1011, 1111, 1211: Variable capacitors;

[0030] 912, 1012, 1112, 1212: Light-emitting diodes (LEDs);

[0031] 950, 1050, 1150, 1250: Circuit elements;

[0032] S210~S240, S1301~S1309: Steps. Detailed Implementation

[0033] Reference will now be made in detail to the exemplary embodiments disclosed herein, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

[0034] Throughout this specification and the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same components. This document is not intended to distinguish between components that function identically but have different names. In the following specification and claims, words such as "containing" and "comprising" are open-ended terms and should therefore be interpreted as meaning "containing but not limited to...".

[0035] In some embodiments disclosed herein, the terms "joining" and "connection," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact, with other structures disposed between them. Furthermore, the terms "joining" and "connection" may also include situations where both structures are movable or both structures are fixed. Additionally, the terms "electrical connection" and "coupling" include any direct or indirect electrical connection means.

[0036] The ordinal numbers used in the specification and claims, such as "first," "second," etc., to modify elements, do not in themselves imply or represent that element, or that those elements have any preceding ordinal numbers, nor do they represent the order of one element with another, or the order of manufacturing methods. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; therefore, a first element in the specification may be a second element in the claims. It should be understood that the following embodiments can be implemented by substituting, recombining, or mixing features from several different embodiments to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0037] Figure 1is a structural schematic diagram of an electronic device of an embodiment of the present disclosure. Referring to Figure 1 , Figure 1 may be a top view of the electronic device 100. The electronic device 100 includes a substrate 101, a plurality of electronic elements 110, driving circuits 120, 130, and a plurality of test pads 140. In the present embodiment, the plurality of electronic elements 110 are disposed in an active area 102 of the substrate 101, and the driving circuits 120, 130 and the plurality of test pads 140 are disposed in a peripheral area 103 outside the active area 102. In the present embodiment, the plurality of electronic elements 110 are disposed in the active area 102 of the substrate 101 in an array arrangement, and are electrically connected to the driving circuits 120, 130 and the plurality of test pads 140 through a plurality of traces. In other embodiments, the plurality of electronic elements 110 can also be disposed in the active area 102 of the substrate 101 in a random arrangement and connected manner.

[0038] In the present embodiment, the driving circuits 120, 130 can be respectively disposed in the peripheral area of the substrate 101 and close to positions of two adjacent side edges of the substrate 101, but the present disclosure is not limited thereto. In an embodiment, the driving circuits 120, 130 can also be respectively disposed in positions of two opposite side edges or positions of the same side edge of the substrate 101. In the present embodiment, the plurality of test pads 140 can be disposed in the peripheral area of the substrate 101 and along a position of a side edge of the substrate 101 different from the driving circuits 120, 130, but the present disclosure is not limited thereto. In an embodiment, the plurality of test pads 140 can also be disposed along positions of two side edges of the substrate 101 different from the driving circuits 120, 130 or along a position of a side or multiple sides of the substrate 101 same as the driving circuits 120, 130.

[0039] In the present embodiment, the electronic device 100 can be a tuning device, such as an antenna device, which can include an antenna assembly, but is not limited thereto. However, the present disclosure is not limited thereto. In an embodiment, the electronic device 100 can be a display device, a sensor device, a touch display, a curved display, or a free shape display, but is not limited thereto. The antenna device can include an antenna assembly, but is not limited thereto. In addition, the substrate and the carrier plate of the embodiments of the present disclosure can be a circuit substrate, a glass substrate, or a flexible substrate, etc.

[0040] In the present embodiment, the plurality of electronic elements 110 can include variable capacitances (or varicap diodes) and / or light emitting diodes. In the present embodiment, the driving circuits 120, 130 can be source driving circuits and gate driving circuits, respectively, and are used to drive the plurality of electronic elements 110, but the present disclosure is not limited thereto. In the present embodiment, the plurality of test pads 140 can be used to test whether the plurality of electronic elements 110 are normal or fail during the manufacturing process of the electronic device 100, so as to repair the failed electronic elements during the manufacturing process of the electronic device 100.

[0041] Figure 2 is a flowchart of a manufacturing method of an electronic device according to an embodiment of the present disclosure. Referring to Figure 1 and Figure 2 , Figure 1 The electronic device 100 of the present embodiment can be manufactured by performing the following steps S210-S240. In step S210, a substrate 101 is provided. Circuit traces can be formed on the substrate 101 in advance. In step S220, the electronic element(s) 110 are bonded to the substrate 101. The positions of the electronic elements 110 on the substrate 101 can be determined based on the circuit traces formed in advance. In the present embodiment, the electronic elements 110 can include variable capacitances, and the variable capacitances of the electronic elements 110 can be mainly driven by reverse bias (or reverse current) in the working mode (driven by the signals provided by the driving circuits 120, 130) to perform the capacitance modulation function through the electron depletion region of the variable capacitances.

[0042] In step S230, a forward bias (or forward current) is applied to the electronic elements 110 by a testing device, and the electronic elements 110 are determined to be normal or fail. The testing device can provide a forward bias to the variable capacitances of the electronic elements 110 through the test pads 140, so that the variable capacitances realize the diode function to emit light (electromagnetic waves) with a specific wavelength (e.g., 0.2-1000 microns (um)). In the present embodiment, whether the electronic elements 110 emit light with a specific wavelength can be detected by a light detecting element to determine whether the variable capacitances of the electronic elements 110 are normal or fail. The light with a specific wavelength is emitted from the variable capacitances. Alternatively, in an embodiment, whether the variable capacitances of the electronic elements 110 have normal thermal characteristics (thermal distribution) can be detected by an infrared imager to determine whether the variable capacitances of the electronic elements 110 are normal or fail (including determining whether the variable capacitances and the circuit traces are normally electrically connected).

[0043] At step S240, the substrate 101 provided with the electronic components judged to be normal is transported, or the electronic components judged to be damaged are repaired. In this regard, when the electronic components with damage are judged, the manufacturing personnel or manufacturing equipment can be notified to replace or repair the damaged electronic components. When all the electronic components 110 are normal, the next manufacturing procedure (e.g., forming the driving circuits 120, 130) of the electronic device 100 can be performed or the electronic device 100 can be packaged, and the present disclosure is not limited thereto. Thus, the manufacturing method of the present embodiment can automatically judge whether the electronic components 110 in the electronic device 100 are damaged during the manufacturing process, so that the electronic components judged to be damaged can be repaired during the manufacturing process, thereby effectively improving the manufacturing yield of the electronic device 100.

[0044] Figure 3 is a structural schematic diagram of an electronic device of an embodiment of the present disclosure. Refer to Figure 3 , Figure 3 may be a top view of the electronic device 300, and can represent the (product) structure of the electronic device 300 after the manufacturing process is completed. In the present embodiment, the electronic device 300 includes a substrate 301, a plurality of electronic components 310, driving circuits 320, 330, and a plurality of test pads 341, 342. In the present embodiment, the plurality of electronic components 310 are arranged in an array on the substrate 301, and are electrically connected to the driving circuits 320, 330 and the plurality of test pads 341, 342 through a plurality of traces. Compared with the prior art, the plurality of test pads 341, 342 of the present embodiment are respectively formed on the substrate 301 and are located at positions different from the two side edges of the driving circuits 320, 330. In addition, it is worth noting that the driving circuits 320, 330 and the plurality of test pads 341, 342 are formed on the substrate 301. When the electronic device 300 is completed and passes the test of step S230 as described in the above embodiment, the plurality of test pads 341, 342 can remain on the substrate 301. Figure 1 Figure 2

[0045] Figure 4 is a structural schematic diagram of an electronic device of an embodiment of the present disclosure. Refer to Figure 4 , Figure 4 may be a top view of the electronic device 400, and can represent the (product) structure of the electronic device 400 after the manufacturing process is completed. In the present embodiment, the electronic device 400 includes a substrate 401, a plurality of electronic components 410, driving circuits 420, 430, and a plurality of test pads 441, 442. In the present embodiment, the plurality of electronic components 410 are arranged in an array on the substrate 401, and are electrically connected to the driving circuits 420, 430 and the plurality of test pads 441, 442 through a plurality of traces. Compared with the prior art, the plurality of test pads 441, 442 of the present embodiment are respectively formed on the substrate 401 and are located at positions different from the two side edges of the driving circuits 420, 430. In addition, it is worth noting that the driving circuits 420, 430 and the plurality of test pads 441, 442 are formed on the substrate 401. When the electronic device 400 is completed and passes the test of step S230 as described in the above embodiment, the plurality of test pads 441, 442 can remain on the substrate 401. Figure 3 ​​, based on the requirement of product specification (i.e. limited by the substrate area requirement), the electronic device 400 is completed and passed the test of step S230 as described in the above embodiments, the plurality of test pads 441, 442 will be removed. In other words, the plurality of test pads 441, 442 can be formed on the substrate 401 or other substrates before the substrate cutting is performed. Figure 2 After the electronic device 500 is completed and passed the test of step S230 as described in the above embodiments, the plurality of test pads 541, 542 can remain on the substrate 501.

[0046] Figure 5 is a structural schematic diagram of an electronic device according to an embodiment of the present disclosure. Refer to Figure 5 , Figure 5 may be a top view of the electronic device 500, and can represent the (product) structure after the electronic device 500 is completed the manufacturing process. In the present embodiment, the electronic device 500 includes a substrate 501, a plurality of electronic elements 510, driving circuits 520, 530, and a plurality of test pads 541, 542. In the present embodiment, the plurality of electronic elements 510 are arranged in an array on the substrate 501, and are electrically connected to the driving circuits 520, 530 and the plurality of test pads 541, 542 through a plurality of traces. Compared to Figure 1 , the plurality of test pads 541, 542 of the present embodiment are respectively formed on the substrate 501 and at positions same as the two side edges of the driving circuits 520, 530, and are electrically connected to the plurality of electronic elements 510 through the driving circuits 520, 530. It is worth noting that the driving circuits 520, 530 and the plurality of test pads 541, 542 are formed on the substrate 501. When the electronic device 500 is completed and passed the test of step S230 as described in the above embodiments, the plurality of test pads 541, 542 can remain on the substrate 501. Figure 2

[0047] Figure 6 is a structural schematic diagram of an electronic device according to an embodiment of the present disclosure. Refer to Figure 6 , Figure 6 may be a top view of the electronic device 600, and can represent the (product) structure after the electronic device 600 is completed the manufacturing process. In the present embodiment, the electronic device 600 includes a substrate 601, a plurality of electronic elements 610, driving circuits 620, 630, and a plurality of test pads 641, 642. In the present embodiment, the plurality of electronic elements 610 are arranged in an array on the substrate 601, and are electrically connected to the driving circuits 620, 630 and the plurality of test pads 641, 642 through a plurality of traces. Compared to Figure 5 , based on the requirement of product specification (i.e. limited by the substrate area requirement), when the electronic device 600 is completed and passed the test of step S230 as described in the above embodiments, the plurality of test pads 641, 642 will be removed. In other words, the plurality of test pads 641, 642 can be formed on the substrate 601 or other substrates before the substrate cutting is performed. Figure 2 ​After the testing of step S230 of the embodiments, the plurality of test pads 641, 642 will be removed. In other words, the plurality of test pads 641, 642 can be formed on the substrate 601 or other substrates before the substrate cutting has been performed.

[0048] Figure 7 is a structural schematic diagram of an electronic device of an embodiment of the present disclosure. Refer to Figure 7 , Figure 7 may be a top view of the electronic device 700, and can represent the (product) structure of the electronic device 700 after the manufacturing process is completed. In the embodiment, the electronic device 700 includes a substrate 701, a plurality of electronic elements 710, and a plurality of test pads 741, 742. In the embodiment, the plurality of electronic elements 710 are arranged in an array on the substrate 701, and are electrically connected to the plurality of test pads 741, 742 through a plurality of traces. Compared to Figure 1 , the plurality of test pads 741, 742 of the embodiment are respectively formed on the substrate 701 and correspond to the positions of the driving circuit. It is worth noting that when the electronic device 700 is completed and passes the testing as described above Figure 2 After the testing of step S230 of the embodiments, the plurality of test pads 741, 742 can be used as bonding pads to remain on the substrate 701, and the driving circuit is formed on the plurality of test pads 741, 742. The driving circuit can be electrically connected to the plurality of electronic elements 710 through the plurality of test pads 741, 742. In other words, the bonding pads formed on the electronic device 700 during the manufacturing process for bonding the driving circuit can be used to test whether the plurality of electronic elements 710 are normal or damaged, and then used to bond the substrate 701 when the driving circuit is formed on the substrate 701 to be electrically connected to the plurality of electronic elements 710 through the corresponding circuit traces.

[0049] Figure 8 is a circuit schematic diagram of an electronic element of an embodiment of the present disclosure. Refer to Figure 8 The electronic element of each of the above embodiments can be implemented as Figure 8electronic component 810. In this embodiment, the electronic component 810 includes a variable capacitor 811. The testing device 801 can be electrically connected to the anode and the cathode of the variable capacitor 811 through the test pads, and can apply a forward bias to the variable capacitor 811 through the test pads, so that the variable capacitor 811 functions as a diode to emit light (electromagnetic wave) with a specific wavelength (e.g. 0.2-1000 micrometers (um)). In this embodiment, the electronic component 810 can further include other circuit traces (not shown) to be electrically connected to the driving circuit. In this embodiment, whether the variable capacitor 811 of the electronic component 810 emits light with the specific wavelength can be detected by a light detecting component, so as to determine whether the variable capacitor 811 of the electronic component 810 is normal or damaged. The light with the specific wavelength is emitted from the variable capacitor 811. Alternatively, in an embodiment, whether the circuit traces and the variable capacitor 811 of the electronic component 810 have normal thermal characteristics (thermal distribution) can be detected by an infrared imaging instrument, so as to determine whether the variable capacitor 811 of the electronic component 810 is normal or damaged (including determining whether the variable capacitor 811 and the circuit traces are electrically connected normally). The testing device 801 can be a device capable of providing testing voltage and / or testing current, and the testing device 801 can be configured to apply a forward bias and / or a reverse bias to the electronic component 810 based on the configuration of the traces, but the present disclosure is not limited to the configuration of the traces.

[0050] Figure 9 FIG. 1 is a circuit schematic diagram of an electronic component according to an embodiment of the present disclosure. Referring to FIG. 1, two adjacent electronic components of each of the above embodiments can be configured to function as a diode to emit light with a specific wavelength (e.g. 0.2-1000 micrometers (um)), as shown in FIG. 1. Figure 9 Figure 9 ​electronic elements 910_1, 910_2. In this embodiment, the electronic element 910_1 can include a variable capacitor 911. The electronic element 910_2 can include a light emitting diode 912. A circuit element 950 can also be included on the circuit trace between the electronic elements 910_1, 910_2. The variable capacitor 911, the light emitting diode 912, and the circuit element 950 can be electrically connected in series. The circuit element 950 can be composed of, for example, an inductor, a resistor, a transistor, and / or a capacitor, but the present disclosure is not limited thereto. The testing device 901 can be electrically connected to the variable capacitor 911 and the anode and cathode of the light emitting diode 912 through the test pads, and can apply a forward bias to the variable capacitor 911 and the light emitting diode 912 through the test pads, so that the variable capacitor 911 functions as a diode to emit light (electromagnetic waves) having a specific wavelength (for example, 0.2-1000 micrometers (um)), and the light emitting diode 912 can emit light having another wavelength (for example, 350-800 micrometers (um)). Alternatively, the testing device 901 can apply a reverse bias to the variable capacitor 911 through the test pads to test the capacitance modulation function of the variable capacitor 911. In this embodiment, the electronic element 910_1 can also include other circuit traces (not shown) to be electrically connected to the driving circuit.

[0051] In this embodiment, whether the variable capacitor 911 of the electronic element 910_1 emits light having a specific wavelength, or whether the light emitting diode 912 of the electronic element 910_2 emits light having another wavelength (if the light having the specific wavelength emitted by the variable capacitor 911 is not easily detectable), can be detected by a light detecting element to determine whether the variable capacitor 911 of the electronic element 910_1 is normal or damaged. Alternatively, in an embodiment, whether the variable capacitor 911 of the electronic element 910_1 has normal thermal characteristics (thermal distribution) can be detected by an infrared imaging instrument to determine whether the variable capacitor 911 of the electronic element 910_1 is normal or damaged (including determining whether the variable capacitor 911 and the circuit trace are electrically connected normally). The testing device 901 can be a device that can provide a test voltage and / or a test current, and the testing device 901 can be configured based on the trace and the circuit element 950 to apply a forward bias and / or a reverse bias to the electronic elements 910_1, 910_2, but the present disclosure is not limited to the specific configuration of the trace and the circuit element 950.

[0052] Figure 10 is a circuit schematic diagram of an electronic element of an embodiment of the present disclosure. Referring to Figure 10 The electronic elements of the above embodiments can achieve, for example, Figure 10electronic component 1010. In this embodiment, the electronic component 1010 can include a variable capacitor 1011 and a light emitting diode 1012 electrically connected in series to the variable capacitor 1011, and a circuit element 1050 can also be included on the circuit trace between the variable capacitor 1011 and the light emitting diode 1012. The variable capacitor 1011, the light emitting diode 1012, and the circuit element 1050 can be electrically connected in series. The testing device 1001 can be electrically connected to the anode and the cathode of the variable capacitor 1011 and the light emitting diode 1012 through the test pads, and a forward bias voltage can be applied to the variable capacitor 1011 and the light emitting diode 1012 through the test pads, so that the variable capacitor 1011 functions as a diode to emit light (electromagnetic wave) with a specific wavelength (e.g., 0.2-1000 micrometers (um)), and the light emitting diode 1012 can emit light with another wavelength (e.g., 350-800 micrometers (um)). Alternatively, the testing device 1001 can apply a reverse bias voltage to the variable capacitor 1011 through the test pads to test the function of the variable capacitor 1011 in adjusting the capacitance. In this embodiment, the electronic component 1010 can also include other circuit traces (not shown) to electrically connect to the driving circuit.

[0053] In this embodiment, whether the variable capacitor 1011 of the electronic component 1010 emits light with a specific wavelength, or whether the light emitting diode 1012 of the electronic component 1010 emits light with another wavelength (if the light with the specific wavelength emitted by the variable capacitor 1011 is not easy to detect) can be detected by a light detecting element to determine whether the variable capacitor 1011 of the electronic component 1010 is normal or damaged. Alternatively, in an embodiment, whether the variable capacitor 1011 of the electronic component 1010 has normal thermal characteristics (thermal distribution) can be detected by an infrared imaging instrument to determine whether the variable capacitor 1011 of the electronic component 1010 is normal or damaged (including determining whether the variable capacitor 1011 is electrically connected to the circuit trace normally). The testing device 1001 can be a device that can provide a testing voltage and / or a testing current, and the testing device 1001 can be configured based on the configuration of the traces and the circuit element 1050 to apply a forward bias voltage and / or a reverse bias voltage to the electronic component 1010, but the specific configuration of the traces and the circuit element 1050 is not limited in the present disclosure.

[0054] Figure 11 is a circuit schematic diagram of an electronic component of an embodiment of the present disclosure. Referring to Figure 11 two adjacent electronic components of each of the above embodiments can function as Figure 11electronic elements 1110_1, 1110_2. In this embodiment, the electronic element 1110_1 can include a variable capacitor 1111. The electronic element 1110_2 can include a light emitting diode 1112. A circuit element 1150 can also be included on the circuit trace between the electronic element 1110_1 and the electronic element 1110_2. The variable capacitor 1111, the light emitting diode 1112, and the circuit element 1150 can be electrically connected in parallel. The testing device 1101 can be electrically connected to the variable capacitor 1111 and the anode and cathode of the light emitting diode 1112 through the test pads, and can apply a forward bias to the variable capacitor 1111 and the light emitting diode 1112 through the test pads, so that the variable capacitor 1111 functions as a diode to emit light (electromagnetic waves) having a specific wavelength (e.g., 0.2-1000 micrometers (um)), and the light emitting diode 1112 can emit light having another wavelength (e.g., 350-800 micrometers (um)). Alternatively, the testing device 1101 can apply a reverse bias to the variable capacitor 1111 through the test pads to test the function of the capacitance modulation of the variable capacitor 1111. In this embodiment, the electronic element 1110_1 can also include other circuit traces (not shown) to be electrically connected to the driving circuit.

[0055] In this embodiment, whether the variable capacitor 1111 of the electronic element 1110_1 emits light having a specific wavelength, or whether the light emitting diode 1112 of the electronic element 1110_2 emits light having another wavelength (if the light having the specific wavelength emitted by the variable capacitor 1111 is not easy to detect) can be detected by a light detecting element to determine whether the variable capacitor 1111 of the electronic element 1110_1 is normal or damaged. Alternatively, in an embodiment, whether the variable capacitor 1111 of the electronic element 1110_1 has normal thermal characteristics (thermal distribution) can be detected by an infrared imaging instrument to determine whether the variable capacitor 1111 of the electronic element 1110_1 is normal or damaged (including determining whether the variable capacitor 1111 is normally electrically connected to the circuit trace). The testing device 1101 can be a device that can provide a test voltage and / or a test current, and the testing device 1101 can be configured based on the configuration of the traces and the circuit element 1150 to apply a forward bias and / or a reverse bias to the electronic elements 1110_1, 1110_2, but the specific configuration of the traces and the circuit element 1150 is not limited.

[0056] Figure 12 is a circuit schematic diagram of an electronic element of an embodiment of the present disclosure. Referring to Figure 12 The electronic elements of the above embodiments can achieve the functions as Figure 12electronic component 1210. In this embodiment, the electronic component 1210 can include a variable capacitor 1211 and a light emitting diode 1212, and a circuit element 1250 can be further included on the circuit trace between the variable capacitor 1211 and the light emitting diode 1212. The variable capacitor 1211, the light emitting diode 1212, and the circuit element 1250 can be electrically connected in parallel. The testing device 1201 can be electrically connected to the anode and the cathode of the variable capacitor 1211 and the light emitting diode 1212 through the test pads, and can apply a forward bias to the variable capacitor 1211 and the light emitting diode 1212 through the test pads, so that the variable capacitor 1211 functions as a diode to emit light (electromagnetic wave) having a specific wavelength (e.g., 0.2-1000 micrometers (um)), and the light emitting diode 1212 can emit light having another wavelength (e.g., 350-800 micrometers (um)). Alternatively, the testing device 1201 can apply a reverse bias to the variable capacitor 1211 through the test pads to test the function of the capacitance modulation of the variable capacitor 1211. In this embodiment, the electronic component 1210 can further include other circuit traces (not shown) to be electrically connected to the driving circuit.

[0057] In this embodiment, whether the variable capacitor 1211 of the electronic component 1210 emits light having a specific wavelength or whether the light emitting diode 1212 of the electronic component 1210 emits light having another wavelength (if the light having the specific wavelength emitted by the variable capacitor 1211 is not easy to detect) can be detected by a light detecting element to determine whether the variable capacitor 1211 of the electronic component 1210 is normal or damaged. Alternatively, in an embodiment, whether the variable capacitor 1211 of the electronic component 1210 has a normal thermal characteristic (thermal distribution) can be detected by an infrared imaging instrument to determine whether the variable capacitor 1211 of the electronic component 1210 is normal or damaged (including determining whether the variable capacitor 1211 is normally electrically connected to the circuit trace). The testing device 1201 can be a device capable of providing a testing voltage and / or a testing current, and the testing device 1201 can be configured based on the configuration of the traces and the circuit element 1250 to apply a forward bias and / or a reverse bias to the electronic component 1210, but the specific configuration of the traces and the circuit element 1250 is not limited in the present disclosure.

[0058] Figure 13 is a flowchart of a manufacturing method of an electronic device according to another embodiment of the present disclosure. The electronic device according to some embodiments described above can be manufactured by performing the following steps S1301-S1309. Referring to Figure 1 and Figure 13 to Figure 1The electronic device 100 of the embodiment is taken as an example. In step S1301, circuits are formed on the substrate 101. A plurality of circuit traces (metal traces) and the plurality of test pads 140 can be formed on the substrate 101 in advance. In step S1302, open / short circuit tests are performed on the circuits to determine whether the plurality of circuit traces and the plurality of test pads 140 are normally connected. In step S1303, the plurality of electronic elements 110 are formed on the substrate 101. The plurality of electronic elements 110 are electrically connected to the plurality of test pads 140 through the plurality of circuit traces. In step S1304, bias voltages are applied through the plurality of test pads 140 to test the plurality of electronic elements 110, and it is determined whether the electronic elements 110 pass the test. For this, the test details of step S1304 can be referred to the above description of step S204. Figure 2 The test related to the application of the forward bias voltage of step S230 of the embodiment is described, and thus no more description is given. If at least one of the plurality of electronic elements 110 fails the test, step S1305 is performed. In step S1305, the damaged electronic element can be repaired by the manufacturing personnel or manufacturing equipment. If all of the plurality of electronic elements 110 pass the test, step S1306 is performed. In step S1306, the driving circuits 120, 130 are formed on the substrate 101. The driving circuits 120, 130 are electrically connected to the plurality of electronic elements 110 through the plurality of circuit traces.

[0059] In step S1307, bias voltages can be applied again through the plurality of test pads 140 to test the plurality of electronic elements 110 again, and it is determined whether the electronic elements 110 pass the test. For this, the test details of step S1304 can be referred to the above description of step S204. Figure 2 The test related to the application of the forward bias voltage of step S230 of the embodiment is described, and thus no more description is given. If at least one of the plurality of electronic elements 110 fails the test, step S1305 is performed. In step S1305, the damaged electronic element can be repaired by the manufacturing personnel or manufacturing equipment. If all of the plurality of electronic elements 110 pass the test, step S1306 is performed. In step S1306, the driving circuits 120, 130 are formed on the substrate 101. The driving circuits 120, 130 are electrically connected to the plurality of electronic elements 110 through the plurality of circuit traces.

[0060] In some embodiments of the present disclosure, the electronic device can be observed to be provided with a test pad and a light-emitting diode by an image sensing device (e.g., an optical microscope (OM) or a scanning electron microscope (SEM)), or can be observed to have a structure in which the light-emitting diode is inside the variable capacitor.

[0061] In summary, the manufacturing method of the electronic device of the present disclosure can accurately and conveniently determine whether the variable capacitor is normal or damaged by applying a forward bias to the electronic element and detecting whether the variable capacitor and / or the light-emitting diode emits light, or whether the electronic element and the wiring have a normal heat distribution. Furthermore, the manufacturing method of the electronic device of the present disclosure can also apply a reverse bias to the variable capacitor of the electronic element to test whether the capacitance modulation function of the variable capacitor is normal.

[0062] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present disclosure, and not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A manufacturing method of an electronic device, characterized by, Comprising: providing a substrate; bonding at least one electronic component to the substrate, wherein the at least one electronic component is primarily driven by a reverse bias in an operational mode to perform a capacitance modulation function of the at least one electronic component; applying a forward bias to the at least one electronic component to enable a diode function of the at least one electronic component, and determining the at least one electronic component as normal or defective based on light emitted by the at least one electronic component or a thermal characteristic of the at least one electronic component; and transporting the substrate with the at least one electronic component determined as normal to a next production site, or repairing the at least one electronic component determined as defective. 2.The method of manufacturing an electronic device according to claim 1, wherein Determining the at least one electronic component as normal or defective is based on light emitted by the at least one electronic component. 3.The method of manufacturing an electronic device according to claim 2, wherein The at least one electronic component includes a variable capacitance, and the light is emitted from the variable capacitance. 4.The method of manufacturing an electronic device according to claim 3, wherein The at least one electronic component includes a variable capacitance and a light emitting diode electrically connected in series to the variable capacitance, and the light is emitted from the light emitting diode. 5.The method of manufacturing an electronic device according to claim 3, wherein The at least one electronic component includes a variable capacitance and a light emitting diode electrically connected in parallel to the variable capacitance, and the light is emitted from the light emitting diode. 6.The method of fabricating an electronic device of claim 1, wherein The at least one electronic component is electrically connected in series to another electronic component, and determining the at least one electronic component as normal or defective is based on light emitted by the another electronic component. 7.The method of manufacturing an electronic device according to claim 1, wherein The at least one electronic component is electrically connected in parallel to another electronic component, and determining the at least one electronic component as normal or defective is based on light emitted by the another electronic component. 8.The method of manufacturing an electronic device according to claim 1, wherein Determining the at least one electronic component as normal or defective is based on the thermal characteristic of the at least one electronic component. 9.The method of manufacturing an electronic device according to claim 1, wherein Further comprising: forming a test pad, wherein the at least one electronic component is electrically connected to the test pad, and the at least one electronic component receives the forward bias through the test pad. 10.The method of manufacturing an electronic device according to claim 9, wherein Further comprising: using the test pad as a bond pad, and forming a drive circuit on the test pad, wherein the drive circuit is electrically connected to the at least one electronic component through the test pad.

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