A microphone

Abstract

The present application discloses a microphone, comprising: a shell structure and a vibration pickup portion, wherein the vibration pickup portion generates vibrations in response to the vibration of the shell structure; a vibration transmission portion, configured to transmit the vibrations generated by the vibration pickup portion; and an acoustic-to-electric conversion element, configured to receive the vibrations transmitted by the vibration transmission portion and generate an electrical signal; wherein a vacuum cavity is formed between at least a portion of the structure of the vibration pickup portion and the vibration transmission portion, and the acoustic-to-electric conversion element is located in the vacuum cavity.

Description

Technical Field

[0001] The present application relates to the technical field of microphone devices, and in particular to a microphone. Background Art

[0002] A microphone is a transducer that converts sound signals into electrical signals. Taking an air conduction microphone as an example, the external sound signal enters the acoustic cavity of the air conduction microphone through the hole in the shell structure and is transmitted to the acoustic-to-electric conversion element. The acoustic-to-electric conversion element generates vibration based on the sound signal and converts the vibration signal into an electrical signal for output. The acoustic cavity of the microphone contains a gas (for example, air) with a certain air pressure, which will cause a large noise to be generated in the process of the sound signal being transmitted from the acoustic cavity of the microphone to the acoustic-to-electric conversion element, thereby reducing the sound quality output by the microphone. On the other hand, when the acoustic-to-electric conversion element of the microphone vibrates upon receiving the sound signal, the acoustic-to-electric conversion element will rub against the gas in the acoustic cavity, increasing the air damping of the acoustic cavity of the microphone, thereby reducing the Q value of the microphone.

[0003] Therefore, it is desirable to provide a microphone with low noise floor and high Q value. Summary of the Invention

[0004] An embodiment of the present application provides a microphone, which includes: a shell structure and a vibration pickup portion, wherein the vibration pickup portion generates vibrations in response to the vibration of the shell structure; a vibration transmission portion, configured to transmit the vibrations generated by the vibration pickup portion; and an acoustic-to-electric conversion element, configured to receive the vibrations transmitted by the vibration transmission portion and generate an electrical signal; wherein a vacuum cavity is formed between at least a portion of the structure of the vibration pickup portion and the vibration transmission portion, and the acoustic-to-electric conversion element is located in the vacuum cavity.

[0005] In some embodiments, the vacuum degree inside the vacuum chamber is less than 100 Pa.

[0006] In some embodiments, the vacuum degree inside the vacuum chamber is 10 -6 Pa-100 Pa.

[0007] In some embodiments, the vibration pickup portion and the shell structure limit form at least one acoustic cavity, and the at least one acoustic cavity includes a first acoustic cavity; the shell structure includes at least one hole portion, and the at least one hole portion is located at the side wall of the shell structure corresponding to the first acoustic cavity, and the at least one hole portion connects the first acoustic cavity with the outside; wherein, the vibration pickup portion generates vibration in response to the external sound signal transmitted through the at least one hole portion, and the sound-to-electric conversion element respectively receives the vibration of the vibration pickup portion to generate an electrical signal.

[0008] In some embodiments, the vibration picking part includes a first vibration picking part and a second vibration picking part arranged in sequence from top to bottom, and a vibration transmission part with a tubular structure is provided between the first vibration picking part and the second vibration picking part; the vacuum cavity is restricted to form between the vibration transmission part, the first vibration picking part and the second vibration picking part, and the first vibration picking part and the second vibration picking part are connected to the shell structure through their circumferential sides; wherein, at least part of the structure of the first vibration picking part and the second vibration picking part vibrates in response to the external sound signal.

[0009] In some embodiments, the first vibration picking part or the second vibration picking part includes an elastic part and a fixed part, the fixed part of the first vibration picking part and the fixed part of the second vibration picking part and the vibration transmission part limit the formation of the vacuum cavity, and the elastic part is connected between the fixed part and the inner wall of the shell structure; wherein, the elastic part generates vibration in response to the external sound signal.

[0010] In some embodiments, the stiffness of the fixing portion is greater than the stiffness of the elastic portion.

[0011] In some embodiments, the Young's modulus of the fixing portion is greater than 50 GPa.

[0012] In some embodiments, the microphone further includes a reinforcement member, and the reinforcement member is located on the upper surface or the lower surface of the first vibration pickup portion and the second vibration pickup portion corresponding to the vacuum cavity.

[0013] In some embodiments, the vibration picking part includes a first vibration picking part, a second vibration picking part and a third vibration picking part, the first vibration picking part and the second vibration picking part are arranged opposite to each other in an upper and lower direction, and a vibration transmission part with a tubular structure is provided between the first vibration picking part and the second vibration picking part, and the vacuum cavity is formed between the vibration transmission part, the first vibration picking part and the second vibration picking part; the third vibration picking part is connected between the vibration transmission part and the inner wall of the shell structure; wherein, the third vibration picking part generates vibration in response to the external sound signal.

[0014] In some embodiments, stiffness of the first vibration pickup portion and the second vibration pickup portion is greater than stiffness of the third vibration pickup portion.

[0015] In some embodiments, the Young's modulus of the first vibration pickup portion and the second vibration pickup portion is greater than 50 GPa.

[0016] In some embodiments, the acoustic-to-electric conversion element includes a cantilever beam structure, one end of the cantilever beam structure is connected to the inner wall of the acoustic-to-electrical vibration transmission portion, and the other end of the cantilever beam structure is suspended in the vacuum cavity; wherein the cantilever beam structure deforms based on the vibration signal to convert the vibration signal into an electrical signal.

[0017] In some embodiments, the cantilever beam structure includes a first electrode layer, a piezoelectric layer, a second electrode layer, an elastic layer, and a base layer. The first electrode layer, the piezoelectric layer, and the second electrode layer are arranged in sequence from top to bottom. The elastic layer is located on the upper surface of the first electrode layer or the lower surface of the second electrode layer, and the base layer is located on the upper surface or the lower surface of the elastic layer.

[0018] In some embodiments, the cantilever beam structure includes at least one elastic layer, an electrode layer and a piezoelectric layer; the at least one elastic layer is located on the surface of the electrode layer; the electrode layer includes a first electrode and a second electrode, wherein the first electrode is bent into a first comb-tooth structure, and the second electrode is bent into a second comb-tooth structure, and the first comb-tooth structure and the second comb-tooth structure cooperate to form the electrode layer, and the electrode layer is located on the upper surface or lower surface of the piezoelectric layer; the first comb-tooth structure and the second comb-tooth structure extend along the length direction of the cantilever beam structure.

[0019] In some embodiments, the sound-to-electric conversion element includes a first cantilever beam structure and a second cantilever beam structure, the first cantilever beam structure and the second cantilever beam structure are arranged opposite to each other, and the first cantilever beam structure and the second cantilever beam structure have a first distance; wherein the first distance between the first cantilever beam structure and the second cantilever beam structure changes based on the vibration signal to convert the vibration signal into an electrical signal.

[0020] In some embodiments, one end of the first cantilever beam structure and the second cantilever beam structure corresponding to the sound-to-electric conversion element are connected to the inner wall of the vibration transmission part, and the other end of the first cantilever beam structure and the second cantilever beam structure are suspended in the vacuum cavity.

[0021] In some embodiments, the stiffness of the first cantilever beam structure is different from the stiffness of the second cantilever beam structure.

[0022] In some embodiments, the microphone includes at least one membrane structure, and the at least one membrane structure is located on the upper surface and / or the lower surface of the acoustic-to-electric conversion element.

[0023] In some embodiments, the at least one membrane structure fully or partially covers the upper surface and / or lower surface of the acoustic-to-electric conversion element.

[0024] In some embodiments, the microphone includes at least one supporting structure, one end of the at least one supporting structure is connected to the first vibration picking portion of the vibration picking portion, the other end of the supporting structure is connected to the second vibration picking portion of the vibration picking portion, and the free ends of the at least two acoustic-to-electric conversion elements have a second distance from the supporting structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present application will be further described in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, like numbers represent like structures, wherein:

[0026] Figure 1 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0027] Figure 2 is a schematic structural diagram of another microphone according to some embodiments of the present application;

[0028] Figure 3 is a schematic diagram of a spring-mass-damper system of an acoustic-to-electric conversion element according to some embodiments of the present application;

[0029] Figure 4 is a schematic diagram of an exemplary normalized displacement resonance curve of a spring-mass-damper system according to some embodiments of the present application;

[0030] Figure 5 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0031] Figure 6 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0032] Figure 7 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0033] Figure 8A yes Figure 5 Schematic diagram of the cross section of the middle microphone along the AA direction;

[0034] Figure 8B yes Figure 5 Schematic diagram of the cross section of the microphone along the direction perpendicular to AA;

[0035] Figure 9A is a schematic diagram of cantilever beam structure distribution according to some embodiments of the present application;

[0036] Figure 9B is a schematic diagram of cantilever beam structure distribution according to some embodiments of the present application;

[0037] Figure 10 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0038] Figure 11 is a schematic diagram of a frequency response curve of a microphone according to some embodiments of the present application;

[0039] Figure 12 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0040] Figure 13 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0041] Figure 14 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0042] Figure 15 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0043] Figure 16 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0044] Figure 17 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0045] Figure 18A is a schematic cross-sectional view of a microphone according to some embodiments of the present application;

[0046] Figure 18B is a schematic cross-sectional view of a microphone according to some embodiments of the present application;

[0047] Figure 19A is a schematic cross-sectional view of a microphone according to some embodiments of the present application;

[0048] Figure 19B is a schematic cross-sectional view of a microphone according to some embodiments of the present application;

[0049] Figure 20 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0050] Figure 21 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0051] Figure 22 Schematic diagram of the structure of a microphone according to some embodiments of the present application. DETAILED DESCRIPTION

[0052] To more clearly illustrate the technical solutions of the embodiments of this application, the following is a brief introduction to the drawings required for describing the embodiments. Obviously, the drawings described below are merely examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without inventive effort. Unless otherwise apparent from the context or otherwise noted, the same reference numerals in the figures represent the same structure or operation.

[0053] It should be understood that the terms "system," "device," "unit," and / or "module" used herein are a method for distinguishing different components, elements, parts, portions, or assemblies at different levels. However, if other terms can achieve the same purpose, the terms may be replaced by other expressions.

[0054] As used in this application and the claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not intended to refer to the singular but may include the plural. Generally speaking, the terms "comprises" and "include" only indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list. A method or apparatus may also include other steps or elements.

[0055] Flowcharts are used in this application to illustrate the operations performed by the systems according to the embodiments of the present application. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, the steps may be processed in reverse order or simultaneously. Furthermore, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0056] This specification describes a microphone. A microphone is a transducer that converts sound signals into electrical signals. In some embodiments, the microphone may be a dynamic microphone, a ribbon microphone, a condenser microphone, a piezoelectric microphone, an electret microphone, an electromagnetic microphone, a carbon microphone, etc., or any combination thereof. In some embodiments, the microphone may include a bone conduction microphone and an air conduction microphone, distinguished by the way of sound collection. The microphone described in the embodiment of this specification may include a shell structure, a vibration pickup part, a vibration transmission part and an acoustic-to-electric conversion element. Among them, the shell structure may be configured to carry the vibration pickup part, the vibration transmission part and the acoustic-to-electric conversion element. In some embodiments, the shell structure may be an internally hollow structure, the shell structure may independently form an acoustic cavity, and the vibration pickup part, the vibration transmission part and the acoustic-to-electric conversion element may be located in the acoustic cavity of the shell structure. In some embodiments, the vibration pickup part may be connected to the side wall of the shell structure, and the vibration pickup part may generate vibration in response to an external sound signal transmitted to the shell structure. In some embodiments, the vibration transmission part can be connected to the vibration pickup part, the vibration transmission part can receive the vibration of the vibration pickup part, and transmit the vibration signal to the acoustic-electric conversion element, and the acoustic-electric conversion element converts the vibration signal into an electrical signal. In some embodiments, a vacuum cavity can be limited to be formed between the vibration transmission part and at least part of the structure of the vibration pickup part (for example, the fixing part), and the acoustic-electric conversion element is located in the vacuum cavity. In the microphone provided by the embodiment of this specification, the acoustic-electric conversion element is located in the vacuum cavity formed by the vibration pickup part and the vibration transmission part, and the external sound signal enters the acoustic cavity of the shell structure through the hole part, causing the air in the acoustic cavity to vibrate. The vibration pickup part and the vibration transmission part transmit the vibration to the acoustic-electric conversion element in the vacuum cavity, avoiding contact between the acoustic-electric conversion element and the air in the acoustic cavity, thereby solving the influence of the air vibration of the acoustic cavity in the acoustic-electric conversion process of the acoustic-electric conversion element, that is, solving the problem of large background noise of the microphone. On the other hand, the acoustic-to-electric conversion element is located in the vacuum cavity, which can avoid friction between the acoustic-to-electric conversion element and the gas during vibration, thereby reducing the air damping inside the vacuum cavity of the microphone and improving the Q value of the microphone.

[0057] Figure 1 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 1As shown, the microphone 100 may include a housing structure 110, an acoustic-to-electrical conversion element 120, and a processor 130. The microphone 100 may generate deformation and / or displacement based on an external signal, for example, a sound signal (such as a sound wave), a mechanical vibration signal, etc. The deformation and / or displacement may be further converted into an electrical signal by the acoustic-to-electrical conversion element 120 of the microphone 100. In some embodiments, the microphone 100 may be an air conduction microphone or a bone conduction microphone. An air conduction microphone refers to a microphone in which sound waves are conducted through air. A bone conduction microphone refers to a microphone in which sound waves are conducted in a solid (e.g., bone) in the form of mechanical vibrations.

[0058] The shell structure 110 can be a structure with a hollow interior. The shell structure 110 can independently form an acoustic cavity 140, and the acoustic-to-electric conversion element 120 and the processor 130 are located in the acoustic cavity 140. In some embodiments, the material of the shell structure 110 can include but is not limited to one or more of metals, alloy materials, polymer materials (for example, acrylonitrile-butadiene-styrene copolymer, polyvinyl chloride, polycarbonate, polypropylene, etc.). In some embodiments, one or more holes 111 can be opened on the side wall of the shell structure 110, and the one or more holes 111 can introduce external sound signals into the acoustic cavity 140. In some embodiments, the external sound signal can enter the acoustic cavity 140 of the microphone 100 through the hole 111 and cause the air in the acoustic cavity 140 to vibrate. The acoustic-to-electric conversion element 120 can receive the vibration signal and convert the vibration signal into an electrical signal for output.

[0059] The acoustic-to-electric conversion element 120 is used to convert an external signal into a target signal. In some embodiments, the acoustic-to-electric conversion element 120 can be a laminated structure. In some embodiments, at least a portion of the laminated structure is physically connected to the housing structure. The "connection" described in this application can be understood as a connection between different parts of the same structure, or after preparing different components or structures separately, each independent component or structure is fixedly connected by welding, riveting, clamping, bolting, adhesive bonding, etc., or during the preparation process, a first component or structure is deposited on a second component or structure by physical deposition (e.g., physical vapor deposition) or chemical deposition (e.g., chemical vapor deposition). In some embodiments, at least a portion of the laminated structure can be fixed to the side wall of the housing structure. For example, the laminated structure can be a cantilever beam, which can be a plate-like structure, one end of the cantilever beam is connected to the side wall of the housing structure where the cavity is located, and the other end of the cantilever beam is not connected to or in contact with the base structure, so that the other end of the cantilever beam is suspended in the cavity of the housing structure. For another example, the microphone may include a diaphragm layer (also called a vibration pickup portion), the vibration pickup portion is fixedly connected to the shell structure, and the laminated structure is arranged on the upper surface or lower surface of the vibration pickup portion structure. It should be noted that the "located in the cavity" or "suspended in the cavity" mentioned in this application may mean suspended inside, below or above the cavity. In some embodiments, the acoustic-to-electric conversion element 120 may also be connected to the shell structure 110 through other components (for example, a vibration pickup portion, a vibration transmission portion).

[0060] In some embodiments, the laminate structure may include a vibration unit and an acoustic transducer unit. The vibration unit refers to the portion of the laminate structure that is susceptible to deformation due to external forces. The vibration unit can be used to transmit the deformation caused by external forces to the acoustic transducer unit. The acoustic transducer unit refers to the portion of the laminate structure that converts the deformation of the vibration unit into an electrical signal. Specifically, an external sound signal enters the acoustic cavity 140 through the hole 111, causing the air within the acoustic cavity 140 to vibrate. The vibration unit deforms in response to the vibration of the air within the acoustic cavity 140; the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit. It should be noted that the description of the vibration unit and the acoustic transducer unit here is merely for the purpose of explaining the operating principle of the laminate structure and does not limit the actual composition and structure of the laminate structure. In fact, the vibration unit is not required; its function can be fully performed by the acoustic transducer unit. For example, by making certain structural changes to the acoustic transducer unit, the acoustic transducer unit can generate an electrical signal directly in response to the vibration of the base structure.

[0061] In some embodiments, the vibration unit and the acoustic transducer unit overlap to form a stacked structure. The acoustic transducer unit can be located on an upper layer of the vibration unit, or the acoustic transducer unit can be located on a lower layer of the vibration unit.

[0062] In some embodiments, the acoustic transducer unit may include at least two electrode layers (e.g., a first electrode layer and a second electrode layer) and a piezoelectric layer, wherein the piezoelectric layer may be located between the first electrode layer and the second electrode layer. A piezoelectric layer refers to a structure that can generate a voltage at its two end surfaces when subjected to an external force. In some embodiments, the piezoelectric layer can generate a voltage under the deformation stress of the vibration unit, and the first electrode layer and the second electrode layer can collect the voltage (electrical signal).

[0063] The processor 130 can obtain the electrical signal from the acoustic-to-electric conversion element 120 and perform signal processing. In some embodiments, the processor 130 can be directly connected to the acoustic-to-electric conversion element 120 via a wire 150 (e.g., a gold wire, a copper wire, an aluminum wire, etc.). In some embodiments, the signal processing can include frequency modulation processing, amplitude modulation processing, filtering processing, noise reduction processing, etc. In some embodiments, the processor 130 can include but is not limited to a microcontroller, a microprocessor, an application-specific integrated circuit (ASIC), an application-specific instruction set processor (ASIP), a central processing unit (CPU), a physical processing unit (PPU), a digital signal processor (DSP), a field programmable gate array (FPGA), an advanced reduced instruction set computer (ARM), a programmable logic device (PLD), etc., or other types of processing circuits or processors.

[0064] In some embodiments, when the microphone 100 is used as an air conduction microphone (for example, an air conduction microphone), the acoustic cavity 140 can be acoustically connected to the outside of the microphone 100 through the hole 111, so that there is gas (for example, air) at a certain pressure in the acoustic cavity 140. The gas inside the acoustic cavity 140 will cause the air inside the acoustic cavity 140 to vibrate during the process of the sound signal being transmitted from the hole 111 through the acoustic cavity 140 to the acoustic-to-electric conversion element 120. This vibration acts on the acoustic-to-electric conversion element 120 to generate vibration, and will bring a large background noise to the microphone 100. On the other hand, when the acoustic-to-electric conversion element 120 receives the sound signal and generates vibration, the acoustic-to-electric conversion element 120 will rub against the gas inside the acoustic cavity 140, increase the air damping in the acoustic cavity 140, and thereby reduce the Q value of the microphone 100. In order to solve the above problems, a microphone is provided in the embodiments of the present specification. For the specific content of the microphone, please refer to the following content.

[0065] Figure 2 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 2 As shown, the microphone 200 may include a housing structure 210 , an acoustic-to-electric conversion element 220 and a processor 230 . Figure 2 The microphone 200 shown can be used with Figure 1The microphone 100 shown is the same as or similar to the microphone 100 shown. For example, the housing structure 210 of the microphone 200 is the same as or similar to the housing structure 110 of the microphone 100. For another example, the acoustic-to-electrical conversion element 220 of the microphone 200 is the same as or similar to the acoustic-to-electrical conversion element 120 of the microphone 100. For more information about the structure of the microphone 200 (e.g., the processor 230, the wire 270, etc.), please refer to Figure 1 and its related descriptions.

[0066] In some embodiments, microphone 200 differs from microphone 100 in that microphone 200 further includes a vibration pickup portion 260. Vibration pickup portion 260 is located within the acoustic cavity of housing structure 210. The periphery of vibration pickup portion 260 may be connected to the sidewalls of housing structure 210, thereby dividing the acoustic cavity into a first acoustic cavity 240 and a second acoustic cavity 250. In some embodiments, microphone 200 may include one or more holes 211. Holes 211 may be located in the sidewalls of housing structure 210 corresponding to the first acoustic cavity 240. Holes 211 connect the first acoustic cavity 240 to the outside of microphone 200. External sound signals can enter the first acoustic cavity 240 through holes 211, causing the air within the first acoustic cavity 240 to vibrate. Vibration pickup portion 260 can pick up the air vibrations within the first acoustic cavity 240 and transmit the vibration signals to the acoustic-to-electrical transducer element 220. The acoustic-to-electrical conversion element 220 receives the vibration signal from the vibration pickup portion 260 and converts the vibration signal into an electrical signal.

[0067] In some embodiments, the material of the vibration pickup unit 260 may include, but is not limited to, one or more of semiconductor materials, metal materials, metal alloys, organic materials, and the like. In some embodiments, semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, metal materials may include, but are not limited to, copper, aluminum, chromium, titanium, gold, and the like. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, aluminum alloys, and the like. In some embodiments, organic materials may include, but are not limited to, polyimide, parylene, PDMS, silicone gel, silicone gel, and the like. In some embodiments, the structure of the vibration pickup unit 260 may be a plate-like structure, a columnar structure, and the like.

[0068] In some embodiments, the acoustic-to-electric conversion element 220 and the processor 230 may be located in the second acoustic cavity 250. The second acoustic cavity 250 is a vacuum cavity. In some embodiments, the acoustic-to-electric conversion element 220 is located in the second acoustic cavity 250, which avoids the acoustic-to-electric conversion element 220 from contacting the air in the second acoustic cavity 250, thereby solving the impact of the acoustic-to-electric conversion element 220 on the vibration of the air inside the second acoustic cavity 250 during the acoustic-to-electric conversion process, that is, solving the problem of the large background noise of the microphone 200. On the other hand, the acoustic-to-electric conversion element 220 is located in the second acoustic cavity 250, which can avoid the acoustic-to-electric conversion element 220 from rubbing against the air inside the second acoustic cavity 250 during the vibration process, thereby reducing the air damping inside the second acoustic cavity 250 and improving the Q value of the microphone 200. In some embodiments, the vacuum degree inside the second acoustic cavity 250 may be less than 100Pa. In some embodiments, the vacuum degree inside the second acoustic cavity 250 may be 10 - 6 Pa-100 Pa. In some embodiments, the vacuum degree inside the second acoustic cavity 250 can be 10 -7 Pa-100 Pa.

[0069] To facilitate understanding of the acoustic-to-electrical conversion element, in some embodiments, the acoustic-to-electrical conversion element of a microphone can be approximately equivalent to a spring-mass-damper system. When the microphone is operating, the spring-mass-damper system may vibrate under the influence of an excitation source (e.g., vibration of the vibration pickup portion). Figure 3 Schematic diagram of a spring-mass-damper system of an acoustic-to-electric conversion element according to some embodiments of the present application. Figure 3 As shown, the spring-mass-damper system can be moved according to the differential equation (1):

[0070]

[0071] Where M represents the mass of the spring-mass-damper system, x represents the displacement of the spring-mass-damper system, R represents the damping of the spring-mass-damper system, K represents the elastic constant of the spring-mass-damper, F represents the amplitude of the driving force, and ω represents the circular frequency of the external force.

[0072] The differential equation (1) can be solved to obtain the displacement in the steady state (2):

[0073] x=x a cos(ωt-θ), (2)

[0074] Where x represents the deformation of the spring-mass-damper system when the microphone is working, which is equal to the value of the output electrical signal. Medium x arepresents the output displacement, Z represents the mechanical impedance, and θ represents the oscillation phase.

[0075] The normalized displacement amplitude ratio A can be described as equation (3):

[0076]

[0077] in, Medium x a0 represents the displacement amplitude in steady state (or the displacement amplitude when ω = 0), middle Indicates the ratio of external force frequency to natural frequency, ω0=K / M where ω0 represents the circumferential frequency of vibration. Middle Q m Represents the mechanical quality factor.

[0078] Figure 4 Schematic diagram of an exemplary normalized displacement resonance curve of a spring-mass-damper system according to some embodiments of the present application. The horizontal axis may represent the ratio of the actual vibration frequency of the spring-mass-damper system to its natural frequency, and the vertical axis may represent the normalized displacement of the spring-mass-damper system. It is understood that Figure 4 The various curves in can respectively represent the displacement resonance curves of the spring-mass-damper system with different parameters. In some embodiments, the microphone can generate an electrical signal through the relative displacement between the acoustic-electric conversion element and the shell structure. For example, an electret microphone can generate an electrical signal based on the change in the distance between the deformed diaphragm and the substrate. As another example, a cantilever beam bone conduction microphone can generate an electrical signal based on the inverse piezoelectric effect caused by the deformed cantilever beam structure. In some embodiments, the greater the displacement of the cantilever beam structure deformation, the greater the electrical signal output by the microphone. As Figure 4 As shown in Figure 3, when the actual vibration frequency of the spring-mass-damper system is the same as or approximately the same as its natural frequency (i.e., the ratio ω / ω0 of the actual vibration frequency of the spring-mass-damper system to its natural frequency is equal to or approximately equal to 1), the larger the normalized displacement of the spring-mass-damper system, the narrower the 3dB bandwidth (which can be understood here as the resonant frequency range) of the resonance peak in the displacement resonance curve. Combined with equation (3), it can be seen that the larger the normalized displacement of the spring-mass-damper system, the greater the Q value of the microphone.

[0079] Figure 5 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 5As shown, the microphone 500 may include a shell structure 510, an acoustic-to-electric conversion element 520, a vibration pickup portion 522 and a vibration transmission portion 523. The shell structure 510 may be configured to carry the vibration pickup portion 522, the vibration transmission portion 523 and the acoustic-to-electric conversion element 520. In some embodiments, the shell structure 510 may be a regular structure such as a cuboid, a cylinder, a truncated cone or other irregular structure. In some embodiments, the shell structure 510 is an internally hollow structure, and the shell structure 510 may independently form an acoustic cavity, and the vibration pickup portion 522, the vibration transmission portion 523 and the acoustic-to-electric conversion element 520 may be located in the acoustic cavity. In some embodiments, the material of the shell structure 510 may include but is not limited to one or more of metals, alloy materials, polymer materials (for example, acrylonitrile-butadiene-styrene copolymer, polyvinyl chloride, polycarbonate, polypropylene, etc.), etc. In some embodiments, the peripheral side of the vibration pickup portion 522 can be connected to the side wall of the shell structure 510 , thereby separating the acoustic cavity formed by the shell structure 510 into multiple cavities, including a first acoustic cavity 530 and a second acoustic cavity 540 .

[0080] In some embodiments, one or more holes 511 may be defined on the sidewalls of the housing structure 510 corresponding to the first acoustic cavity 530. These holes 511 may be located within the first acoustic cavity 530 and direct external sound signals into the first acoustic cavity 530. In some embodiments, external sound signals may enter the first acoustic cavity 530 of the microphone 500 through the holes 511 and cause the air within the first acoustic cavity 530 to vibrate. The vibration pickup portion 522 may pick up the air vibration signal and transmit it to the acoustic-to-electrical conversion element 520, which receives the vibration signal and converts it into an electrical signal for output.

[0081] In some embodiments, the vibration pickup portion 522 may include a first vibration pickup portion 5221 and a second vibration pickup portion 5222, arranged sequentially from top to bottom. The first vibration pickup portion 5221 and the second vibration pickup portion 5222 may be connected to the housing structure 510 via their circumferential sides. At least portions of the first vibration pickup portion 5221 and the second vibration pickup portion 5222 may vibrate in response to sound signals entering the microphone 500 through the hole 511. In some embodiments, the material of the vibration pickup portion 522 may include, but is not limited to, one or more of semiconductor materials, metal materials, metal alloys, and organic materials. In some embodiments, semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, and silicon carbide. In some embodiments, metal materials may include, but are not limited to, copper, aluminum, chromium, titanium, and gold. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, and aluminum alloys. In some embodiments, organic materials may include, but are not limited to, polyimide, parylene, PDMS, silicone gel, and silicone. In some embodiments, the structure of the vibration pickup portion 522 may be plate-like or columnar.

[0082] In some embodiments, the vibration pickup portion 522 may include an elastic portion and a fixed portion. For example only, Figure 6 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 6 As shown, the first vibration pickup portion 5221 may include a first elastic portion 52211 and a first fixed portion 52212. One end of the first elastic portion 52211 is connected to the side wall of the housing structure 510, and the other end of the first elastic portion 52211 is connected to the first fixed portion 52212, so that the first elastic portion 52211 is connected between the first fixed portion 52212 and the inner wall of the housing structure 510. The second vibration pickup portion 5222 may include a second elastic portion 52221 and a second fixed portion 52222. One end of the second elastic portion 52221 is connected to the side wall of the housing structure 510, and the other end of the second elastic portion 52221 is connected to the second fixed portion 52222, so that the second elastic portion 52221 is connected between the second fixed portion 52222 and the inner wall of the housing structure 510.

[0083] In some embodiments, the vibration transmission portion 523 can be located between the first vibration pickup portion 5221 and the second vibration pickup portion 5222. The upper surface of the vibration transmission portion 523 is connected to the lower surface of the first vibration pickup portion 5221, and the lower surface of the vibration transmission portion 523 is connected to the upper surface of the second vibration pickup portion 5222. Specifically, the vibration transmission portion 523, the first fixing portion 52212 of the first vibration pickup portion 5221, and the second fixing portion 52222 of the second vibration pickup portion 5222 can define a vacuum cavity 550, and the acoustic-to-electric conversion element 520 can be located within the vacuum cavity 550. Specifically, one end of the acoustic-to-electric conversion element 520 can be connected to the inner wall of the vibration transmission portion 523, and the other end of the acoustic-to-electric conversion element 520 can be suspended in the vacuum cavity 550. In some embodiments, the vibration picked up by the vibration pickup portion 522 (for example, the first elastic portion 52211 of the first vibration pickup portion 5221, the second elastic portion 52221 of the second vibration pickup portion 5222) can be transmitted to the sound-to-electricity conversion element 520 through the vibration transmission portion 523. In some embodiments, the material of the vibration transmission portion 523 may include but is not limited to one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the material of the vibration transmission portion 523 may be the same as or different from the material of the vibration pickup portion 522. In some embodiments, the vibration transmission portion 523 and the vibration pickup portion 522 may be an integrally formed structure. In some embodiments, the vibration transmission portion 523 and the vibration pickup portion 522 may also be relatively independent structures. In some embodiments, the vibration transmission portion 523 may be a tubular structure, an annular structure, a quadrilateral, a pentagon or other regular and / or irregular polygonal structure.

[0084] The acoustic-to-electric conversion element 520 is disposed in the vacuum cavity 550, which can prevent the acoustic-to-electric conversion element 520 from contacting the air in the vacuum cavity 550, thereby solving the impact of the vibration of the air inside the vacuum cavity 550 during the vibration of the acoustic-to-electric conversion element 520, and further solving the problem of the large background noise of the microphone 500. On the other hand, the acoustic-to-electric conversion element 520 is located in the vacuum cavity 550, which can prevent the acoustic-to-electric conversion element 520 from rubbing against the air inside the vacuum cavity 550, thereby reducing the air damping inside the vacuum cavity 550 and improving the Q value of the microphone 500. In order to improve the output effect of the microphone 500, in some embodiments, the vacuum degree inside the vacuum cavity 550 can be less than 100Pa. In some embodiments, the vacuum degree inside the vacuum cavity 550 can be 10 -6 Pa-100 Pa. In some embodiments, the vacuum degree inside the vacuum chamber 550 can be 10 -7 Pa-100Pa.

[0085] In some embodiments, the material of the first fixing portion 52212 and the second fixing portion 52222 can be different from the material of the first elastic portion 52211 and the second elastic portion 52221. For example, in some embodiments, the rigidity of the fixing portion of the vibration pickup portion 522 can be greater than the rigidity of the elastic portion, that is, the rigidity of the first fixing portion 52212 can be greater than the rigidity of the first elastic portion 52211 and / or the rigidity of the second fixing portion 52222 can be greater than the rigidity of the second elastic portion 52221. The first elastic portion 52211 and / or the second elastic portion 52221 can vibrate in response to an external sound signal and transmit the vibration signal to the acoustic-to-electrical conversion element 520. The first fixing portion 52212 and the second fixing portion 52222 have a relatively high rigidity to ensure that the vacuum cavity 550 formed between the first fixing portion 52212, the second fixing portion 52222, and the vibration transmitting portion 523 is not affected by external air pressure. In some embodiments, to ensure that the vacuum chamber 550 is not affected by external air pressure, the Young's modulus of the fixed portion of the vibration pickup portion 522 (e.g., the first fixed portion 52212 and the second fixed portion 52222) can be greater than 60 GPa. In some embodiments, the Young's modulus of the fixed portion of the vibration pickup portion 522 (e.g., the first fixed portion 52212 and the second fixed portion 52222) can be greater than 50 GPa. In some embodiments, the Young's modulus of the fixed portion of the vibration pickup portion 522 (e.g., the first fixed portion 52212 and the second fixed portion 52222) can be greater than 40 GPa.

[0086] In some embodiments, to ensure that the vacuum cavity is not affected by external air pressure, the microphone may further include a reinforcement member, which may be located on the upper or lower surface of the vibration pickup portion corresponding to the vacuum cavity, thereby increasing the rigidity of the portion of the vibration pickup portion corresponding to the vacuum cavity. Figure 7 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 7 As shown, the microphone 500 may further include a reinforcement 560. The reinforcement 560 may be located on the upper surface or lower surface of the vibration pickup portion 522 corresponding to the vacuum cavity 550. Specifically, the reinforcement 560 may be located on the lower surface of the first vibration pickup portion 5221 and the upper surface of the second vibration pickup portion 5222, respectively, and the peripheral side of the reinforcement 560 is connected to the inner wall of the vibration transmission portion 523. In some embodiments, the structure of the reinforcement 560 may be a plate-like structure, a columnar structure, etc., and the structure of the reinforcement 560 may be adaptively adjusted according to the shape and structure of the vibration transmission portion 523. It should be noted that the position of the reinforcement 560 is not limited to Figure 7The interior of the vacuum chamber 550 shown can also be located at other locations. For example, the reinforcement 560 can also be located outside the vacuum chamber 550. Specifically, the reinforcement 560 can be located on the upper surface of the first vibration pickup portion 5221 and the lower surface of the second vibration pickup portion 5222. For another example, the reinforcement 560 can also be located both inside and outside the vacuum chamber 550. Specifically, the reinforcement 560 may be located on the upper surface of the first vibration pickup portion 5221 and the upper surface of the second vibration pickup portion 5222, or the reinforcement 560 may be located on the upper surface of the first vibration pickup portion 5221 and the lower surface of the second vibration pickup portion 5222, or the reinforcement 560 may be located on the lower surface of the first vibration pickup portion 5221 and the lower surface of the second vibration pickup portion 5222, or the reinforcement 560 may be located on the lower surface of the first vibration pickup portion 5221 and the upper surface of the second vibration pickup portion 5222, or the reinforcement 560 may be located on the upper and lower surfaces of the first vibration pickup portion 5221 and the upper and lower surfaces of the second vibration pickup portion 5222. The position of the reinforcement 560 is not limited to the above description, and any position that can ensure that the vacuum cavity is not affected by external air pressure is within the scope of protection of this specification.

[0087] In some embodiments, to ensure that the vacuum chamber 550 is not affected by external air pressure, the stiffness of the reinforcement 560 is greater than the stiffness of the vibration pickup portion 522. In some embodiments, the Young's modulus of the reinforcement 560 may be greater than 60 GPa. In some embodiments, the Young's modulus of the reinforcement 560 may be greater than 50 GPa. In some embodiments, the Young's modulus of the reinforcement 560 may be greater than 40 GPa. In some embodiments, the material of the reinforcement 560 may include, but is not limited to, one or more of semiconductor materials, metal materials, metal alloys, organic materials, and the like. In some embodiments, semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, metal materials may include, but are not limited to, copper, aluminum, chromium, titanium, gold, and the like. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, aluminum alloys, and the like. In some embodiments, organic materials may include, but are not limited to, polyimide, parylene, PDMS, silicone gel, silicone gel, and the like.

[0088] The internal air pressure of the vacuum cavity 550 is much lower than the external air pressure of the vacuum cavity 550. By providing a reinforcement 560 at the first vibration pickup portion 5221 and / or the second vibration pickup portion 5222 corresponding to the vacuum cavity 550, it is possible to ensure that the vacuum cavity 550 is not affected by the external air pressure. It can also be understood here that by providing the reinforcement 560, the rigidity of the first vibration pickup portion 5221 and the second vibration pickup portion 5222 corresponding to the vacuum cavity 550 can be increased to prevent the vibration pickup portion 522 corresponding to the vacuum cavity 550 from deforming due to the pressure difference between the external air pressure and the air pressure inside the vacuum cavity 550, thereby ensuring that the volume of the vacuum cavity 550 remains substantially constant when the microphone 500 is operating, thereby ensuring the normal operation of the acoustic-to-electrical conversion element 520 inside the vacuum cavity 550. It should be noted that during the production process, each component of the microphone 500 (for example, the first vibration pickup part 5221, the second vibration pickup part 5222, the vibration transmission part 523, and the sound-to-electricity conversion element 520) requires the packaging equipment to provide the required vacuum degree so that the vacuum degree inside the vacuum cavity 550 is within the required range.

[0089] It should be noted that, in an alternative embodiment, the vibration pickup portion 522 may only include a first vibration pickup portion 5221, the first vibration pickup portion 5221 is connected to the shell structure 510 through its circumferential side, and the sound-to-electric conversion element 520 may be directly connected or indirectly connected to the first vibration pickup portion 5221. For example, the sound-to-electric conversion element 520 may be located on the upper surface or lower surface of the first vibration pickup portion 5221. For another example, the sound-to-electric conversion element 520 may be connected to the first vibration pickup portion 5221 through other structures (for example, the vibration transfer portion 523). The first vibration pickup portion 5221 may generate vibrations in response to a sound signal entering the microphone 500 through the hole portion 511, and the sound-to-electric conversion element 520 may convert the vibrations of the first vibration pickup portion 5221 or the vibration transfer portion 523 into electrical signals.

[0090] In some embodiments, the acoustic-to-electric conversion element 520 may include one or more acoustic-to-electric conversion elements. In some embodiments, the plurality of acoustic-to-electric conversion elements 520 may be spaced apart on the inner wall of the vibration transmission portion 523. It should be noted that the spaced apart distribution here may refer to the horizontal direction (perpendicular to the Figure 5 AA direction shown in ) or vertical direction ( Figure 5 For example, when the vibration transmitting portion 523 is an annular tubular structure, the plurality of acoustic-to-electric conversion elements 520 may be spaced and distributed in sequence from top to bottom in the vertical direction. Figure 8A yes Figure 5 Schematic diagram of the cross section of the microphone along the AA direction. Figure 8AAs shown, the plurality of acoustic-to-electric conversion elements 520 may be sequentially and spaced apart on the inner wall of the vibration transmission portion 523 , and in the horizontal direction, the plurality of acoustic-to-electric conversion elements 520 spaced apart are on the same plane or approximately parallel. Figure 8B yes Figure 5 Schematic diagram of the cross section of the microphone perpendicular to the AA direction. Figure 8B As shown, in the horizontal direction, the fixed end of each acoustic-to-electric conversion element 520 and the vibration transmission part 523 can be spaced apart on the annular inner wall of the vibration transmission part 523. The fixed end of the acoustic-to-electric conversion element 520 and the vibration transmission part 523 can be approximately perpendicular. The other end of the acoustic-to-electric conversion element 520 (also referred to as the free end) extends toward the center of the vibration transmission part 523 and is suspended in the vacuum cavity 550, so that the acoustic-to-electric conversion elements 520 are distributed in an annular shape in the horizontal direction. In some embodiments, when the vibration transmission part 523 is a polygonal tubular structure (for example, a triangle, a pentagon, a hexagon, etc.), in the horizontal direction, the fixed ends of the multiple acoustic-to-electric conversion elements 520 can also be spaced apart along the side walls of the vibration transmission part 523. Figure 9A Schematic diagram of the horizontal distribution of the acoustic-to-electric conversion elements according to some embodiments of the present application. Figure 9A As shown, the vibration transmission part 523 has a quadrilateral structure, and the plurality of acoustic-to-electric conversion elements 520 may be alternately distributed on the four side walls of the vibration transmission part 523 . Figure 9B Schematic diagram of the distribution of acoustic-to-electric conversion elements according to some embodiments of the present application. Figure 9B As shown, the vibration transmission portion 523 has a hexagonal structure, and the multiple acoustic-to-electrical conversion elements 520 can be alternately distributed on the six side walls of the vibration transmission portion 523. In some embodiments, the multiple acoustic-to-electrical conversion elements 520 are alternately distributed on the inner wall of the vibration transmission portion 523 to improve the space utilization of the vacuum chamber 550, thereby reducing the overall volume of the microphone 500.

[0091] It should be noted that, in the horizontal or vertical direction, the multiple acoustic-to-electric conversion elements 520 are not limited to being distributed at intervals along all inner walls of the vibration transmission portion 523. The multiple acoustic-to-electric conversion elements 520 can also be arranged on one side wall or part of the side wall of the vibration transmission portion 523, or the multiple acoustic-to-electric conversion elements 520 can be on the same horizontal plane. For example, if the vibration transmission portion 523 is a rectangular parallelepiped structure, the multiple acoustic-to-electric conversion elements 520 can be simultaneously arranged on one side wall, on two opposite or adjacent side walls, or on any three side walls of the rectangular parallelepiped structure. The distribution of the multiple acoustic-to-electric conversion elements 520 can be adaptively adjusted according to their number or the size of the vacuum chamber 550, and is not further limited here.

[0092] In some embodiments, the acoustic-to-electric conversion element 520 may include a cantilever beam structure, one end of which may be connected to the inner wall of the vibration transmission portion 523 , and the other end of which may be suspended in the vacuum chamber 550 .

[0093] In some embodiments, the cantilever beam structure may include a first electrode layer, a piezoelectric layer, a second electrode layer, an elastic layer and a base layer. The first electrode layer, the piezoelectric layer and the second electrode layer may be arranged in sequence from top to bottom, the elastic layer may be located on the upper surface of the first electrode layer or the lower surface of the second electrode layer, and the base layer may be located on the upper surface or the lower surface of the elastic layer. In some embodiments, the external sound signal enters the first acoustic cavity 530 of the microphone 500 through the hole 511 and causes the air in the first acoustic cavity 530 to vibrate. The vibration pickup portion 522 (e.g., the first elastic portion 52211) may pick up the air vibration signal and transmit the vibration signal to the acoustic-to-electric conversion element 520 (e.g., the cantilever beam structure) through the vibration transmission portion 523, thereby causing the elastic layer in the cantilever beam structure to deform under the action of the vibration signal. In some embodiments, the piezoelectric layer may generate an electrical signal based on the deformation of the elastic layer, and the first electrode layer and the second electrode layer may collect the electrical signal. In some embodiments, the piezoelectric layer can generate a voltage (potential difference) under the deformation stress of the elastic layer based on the piezoelectric effect, and the first electrode layer and the second electrode layer can derive the voltage (electric signal).

[0094] In some embodiments, the cantilever beam structure may also include at least one elastic layer, an electrode layer, and a piezoelectric layer, wherein the elastic layer may be located on the surface of the electrode layer, and the electrode layer may be located on the upper surface or lower surface of the piezoelectric layer. In some embodiments, the electrode layer may include a first electrode and a second electrode. The first electrode and the second electrode may be bent into a first comb-tooth structure, and the first comb-tooth structure and the second comb-tooth structure may include multiple comb-tooth structures. There is a certain spacing between adjacent comb-tooth structures of the first comb-tooth structure and between adjacent comb-tooth structures of the first comb-tooth structure, and the spacing may be the same or different. The first comb-tooth structure and the second comb-tooth structure cooperate to form the electrode layer. Furthermore, the comb structure of the first comb-tooth structure may extend into the spacing of the second comb-tooth structure, and the comb structure of the second comb-tooth structure may extend into the spacing of the first comb-tooth structure, thereby cooperating with each other to form the electrode layer. The first comb-tooth structure and the second comb-tooth structure cooperate with each other so that the first electrode and the second electrode are arranged compactly but do not intersect. In some embodiments, the first comb-tooth structure and the second comb-tooth structure extend along the length direction of the cantilever arm (for example, from the fixed end to the free end).

[0095] In some embodiments, the elastic layer may be a membrane-like structure or a bulk structure supported by one or more semiconductor materials. In some embodiments, the semiconductor material may include, but is not limited to, silicon, silicon dioxide, silicon nitride, gallium nitride, zinc oxide, silicon carbide, etc. In some embodiments, the material of the piezoelectric layer may include piezoelectric crystal materials and piezoelectric ceramic materials. Piezoelectric crystal materials refer to piezoelectric single crystals. In some embodiments, the piezoelectric crystal material may include quartz, sphalerite, borate, tourmaline, zincite, GaAs, barium titanate and its derivative structure crystals, KH2PO4, NaKC4H4O6·4H2O (Rohi salt), etc., or any combination thereof. Piezoelectric ceramic material refers to a piezoelectric polycrystal composed of a random collection of fine grains obtained by solid-phase reaction and sintering between powders of different materials. In some embodiments, the piezoelectric ceramic material may include barium titanate (BT), lead zirconate titanate (PZT), lead barium lithium niobate (PBLN), modified lead titanate (PT), aluminum nitride (AIN), zinc oxide (ZnO), etc., or any combination thereof. In some embodiments, the piezoelectric layer material can also be a piezoelectric polymer material, such as polyvinylidene fluoride (PVDF). In some embodiments, the first electrode layer and the second electrode layer can be a conductive material structure. Exemplary conductive materials may include metals, alloy materials, metal oxide materials, graphene, etc., or any combination thereof. In some embodiments, metal and alloy materials may include nickel, iron, lead, platinum, titanium, copper, molybdenum, zinc, or any combination thereof. In some embodiments, alloy materials may include copper-zinc alloys, copper-tin alloys, copper-nickel-silicon alloys, copper-chromium alloys, copper-silver alloys, etc., or any combination thereof. In some embodiments, metal oxide materials may include RuO2, MnO2, PbO2, NiO, etc., or any combination thereof.

[0096] In some embodiments, the cantilever beam structure may further include a wire-binding electrode layer (PAD layer), which may be located on the first electrode layer and the second electrode layer, and the first electrode layer and the second electrode layer may be connected to an external circuit by means of external wires (for example, gold wires, aluminum wires, etc.), thereby leading the voltage signal between the first electrode layer and the second electrode layer to the back-end processing circuit. In some embodiments, the material of the wire-binding electrode layer may include copper foil, titanium, copper, etc. In some embodiments, the material of the wire-binding electrode layer may be the same as that of the first electrode layer (or the second electrode layer). In some embodiments, the material of the wire-binding electrode layer may be different from that of the first electrode layer (or the second electrode layer).

[0097] In some embodiments, the parameters of the cantilever beam structure (for example, the length, width, height, material, etc. of the cantilever beam structure) can be set so that different cantilever beam structures have different resonant frequencies, thereby generating different frequency responses to the vibration signal of the vibration transmission part 523. For example, cantilever beam structures of different lengths can be set so that cantilever beam structures of different lengths have different resonant frequencies. The multiple resonant frequencies corresponding to cantilever beam structures of different lengths can be in the range of 100 Hz-12000 Hz. Since the cantilever beam structure is sensitive to vibrations near its resonant frequency, it can be considered that the cantilever beam structure has a frequency selection characteristic for the vibration signal, that is, the cantilever beam structure will mainly convert the sub-band vibration signal of the vibration signal near its resonant frequency into an electrical signal. Therefore, in some embodiments, by setting it to different lengths, different cantilever beam structures can have different resonant frequencies, thereby forming sub-bands near each resonant frequency. For example, 11 sub-bands can be set within the human voice frequency range using multiple cantilever beam structures. The resonant frequencies of the cantilever beam structures corresponding to the 11 sub-bands can be respectively 500Hz-700Hz, 700Hz-1000Hz, 1000Hz-1300Hz, 1300Hz-1700Hz, 1700Hz-2200Hz, 2200Hz-3000Hz, 3000Hz-3800Hz, 3800Hz-4700Hz, 4700Hz-5700Hz, 5700Hz-7000Hz, and 7000Hz-12000Hz. It should be noted that the number of sub-bands set within the human voice frequency range using the cantilever beam structures can be adjusted according to the application scenario of the microphone 500 and is not further limited here.

[0098] Figure 10 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 10 As shown, the microphone 1000 may include a housing structure 1010 , an acoustic-to-electrical conversion element 1020 , a vibration pickup portion 1022 , and a vibration transmission portion 1023 . Figure 10 The microphone 1000 shown in FIG can be used with Figure 5 and Figure 6. For example, the housing structure 1010 of the microphone 1000 may be the same as or similar to the housing structure 510 of the microphone 500. For another example, the first acoustic cavity 1030, the second acoustic cavity 1040, and the vacuum cavity 1050 of the microphone 1000 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the vacuum cavity 550 of the microphone 500, respectively. For another example, the vibration pickup portion 1022 of the microphone 1000 (e.g., the first vibration pickup portion 10221 (e.g., the first elastic portion 102211, the first fixing portion 102212), the second vibration pickup portion 10222 (e.g., the second elastic portion 102221, the second fixing portion 102222)) can be the same as or similar to the vibration pickup portion 522 of the microphone 500 (e.g., the first vibration pickup portion 5221 (e.g., the first elastic portion 52211, the first fixing portion 52212), the second vibration pickup portion 5222 (e.g., the second elastic portion 52221, the second fixing portion 52222)). For more structures of the microphone 1000 (e.g., the hole portion 1011, the vibration transmitting portion 1023, etc.), please refer to Figure 5 and Figure 6 and its related descriptions.

[0099] In some embodiments, Figure 10 The microphone 1000 shown in FIG. Figure 5The main difference between the illustrated microphone 500 and the illustrated microphone 500 is that the acoustic-to-electrical transducer element 1020 of the microphone 1000 may include a first cantilever beam structure 10211 and a second cantilever beam structure 10212, where the first cantilever beam structure 10211 and the second cantilever beam structure 10212 are opposite to the two electrode plates. The fixed ends of the first and second cantilever beam structures 10211 and 10212 corresponding to the acoustic-to-electrical transducer element 1020 may be connected to the inner wall of the vibration transmission portion 1023, while the other ends (also called free ends) of the first and second cantilever beam structures 10211 and 10212 are suspended in the vacuum chamber 1050. In some embodiments, the first and second cantilever beam structures 10211 and 10212 may be arranged opposite each other, with the first and second cantilever beam structures 10211 and 10212 having a facing area. In some embodiments, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 are arranged vertically. In this case, the facing area can be understood as the area where the lower surface of the first cantilever beam structure 10211 is opposite to the upper surface of the second cantilever beam structure 10212. In some embodiments, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 may have a first spacing d1. After receiving the vibration signal of the vibration transmission part 1023, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 may respectively produce different degrees of deformation in their vibration direction (the extension direction of the first spacing d1), thereby causing the first spacing d1 to change. The first cantilever beam structure 10211 and the second cantilever beam structure 10212 may convert the received vibration signal of the vibration transmission part 1023 into an electrical signal based on the change of the first spacing d1.

[0100] In order to cause the first cantilever beam structure 10211 and the second cantilever beam structure 10212 to deform to different degrees in their vibration directions, in some embodiments, the stiffness of the first cantilever beam structure 10211 and the stiffness of the second cantilever beam structure 10212 can be different. Under the influence of the vibration signal of the vibration transmission unit 1023, the cantilever beam structure with less stiffness can produce a certain degree of deformation, while the cantilever beam structure with greater stiffness can be considered to produce no deformation or a deformation less than that of the cantilever beam structure with less stiffness. In some embodiments, when the microphone 1000 is in operation, the cantilever beam structure with less stiffness (e.g., the second cantilever beam structure 10212) can produce deformation in response to the vibration of the vibration transmission unit 1023, while the cantilever beam structure with greater stiffness (e.g., the first cantilever beam structure 10211) can vibrate along with the vibration transmission unit 1023 without producing deformation, thereby changing the first distance d1.

[0101] In some embodiments, the resonant frequency of the cantilever beam structure with smaller stiffness in the acoustic-to-electric conversion element 1020 may be within a frequency range within the human ear's hearing range (e.g., within 12,000 Hz). In some embodiments, the resonant frequency of the cantilever beam structure with larger stiffness in the acoustic-to-electric conversion element 1020 may be within a frequency range to which the human ear is insensitive (e.g., greater than 12,000 Hz). In some embodiments, the stiffness of the first cantilever beam structure 10211 (or the second cantilever beam structure 10212) in the acoustic-to-electric conversion element 1020 may be achieved by adjusting the material, length, width, or thickness of the first cantilever beam structure 10211 (or the second cantilever beam structure 10212). In some embodiments, by adjusting the parameters of each group of cantilever beam structures corresponding to the acoustic-to-electric conversion element 1020 (e.g., the material, thickness, length, width, etc. of the cantilever beam structure), different frequency responses corresponding to different resonant frequencies can be obtained.

[0102] Figure 11 Schematic diagram of the frequency response curve of the microphone according to some embodiments of the present application. Figure 11 As shown in FIG, the horizontal axis represents frequency in Hz, and the vertical axis represents the frequency response of the sound signal output by the microphone in dB. The microphone here may refer to microphone 500, microphone 1000, microphone 1200, microphone 1300, microphone 1500, microphone 1600, microphone 1700, microphone 2000, microphone 2100, microphone 2200, etc. Figure 11 The dotted lines in the figure represent the frequency response curves corresponding to the various acoustic-to-electric conversion elements of the microphone. Figure 11 It can be seen from the frequency response curves in that each acoustic-to-electric conversion element has its own resonant frequency (for example, the resonant frequency of frequency response curve 1120 is about 350Hz, and the resonant frequency of frequency response curve 1130 is about 1500Hz). When the external sound signal is transmitted to the microphone, different acoustic-to-electric conversion elements are more sensitive to the vibration signal near their own resonant frequency. Therefore, the electrical signal output by each acoustic-to-electric conversion element mainly includes the sub-band signal corresponding to its resonant frequency. In some embodiments, the output of each acoustic-to-electric conversion element at the resonant peak is much larger than its own flat area output. By selecting the frequency band close to the resonant peak in the frequency response curve of each acoustic-to-electric conversion component, it is possible to implement sub-band frequency division of the full-band signal corresponding to the sound signal. In some embodiments, Figure 11 By fusing the frequency response curves in

[11] , a flatter microphone frequency response curve 1110 with a high signal-to-noise ratio can be obtained. Furthermore, by providing different acoustic-to-electrical conversion elements (cantilever beam structures), resonance peaks in different frequency ranges can be added to the microphone system, improving the sensitivity of the microphone near multiple resonance peaks, thereby increasing the sensitivity of the microphone across the entire wide frequency band.

[0103] By setting up multiple acoustic-to-electrical conversion elements in the microphone and utilizing the characteristics of acoustic-to-electrical conversion elements (for example, cantilever beam structures) with different resonant frequencies, it is possible to filter and decompose the vibration signal in the frequency band, avoiding the complexity of the filtering circuit in the microphone and the high computing resources occupied by the software algorithm, which leads to signal distortion and noise introduction, thereby reducing the complexity and production cost of the microphone.

[0104] Figure 12 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 12 As shown, the microphone 1200 may include a housing structure 1210 , an acoustic-to-electrical conversion element 1220 , a vibration transmitting portion 1223 , and a vibration picking portion 1222 . Figure 12 The microphone 1200 shown in FIG. 1 can be used with Figure 5 and Figure 6 . For example, the housing structure 1210 of the microphone 1200 may be the same as or similar to the housing structure 510 of the microphone 500. For another example, the first acoustic cavity 1230, the second acoustic cavity 1240, and the vacuum cavity 1250 of the microphone 1200 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the vacuum cavity 550 of the microphone 500, respectively. For another example, the vibration pickup portion 1222 of the microphone 1200 (e.g., the first vibration pickup portion 12221 (e.g., the first elastic portion 122211, the first fixing portion 122212), the second vibration pickup portion 12222 (e.g., the second elastic portion 122221, the second fixing portion 122222)) can be the same as or similar to the vibration pickup portion 522 of the microphone 500 (e.g., the first vibration pickup portion 5221 (e.g., the first elastic portion 52211, the first fixing portion 52212), the second vibration pickup portion 5222 (e.g., the second elastic portion 52221, the second fixing portion 52222)). For more structures of the microphone 1200 (e.g., the hole portion 1211, the vibration transmitting portion 1223, the acoustic-to-electric conversion element 1220, etc.), please refer to Figure 5 and Figure 6 and its related descriptions.

[0105] In some embodiments, Figure 12 The microphone 1200 shown in FIG. Figure 5The main difference between the illustrated microphone 500 and the microphone 1200 is that the microphone 1200 may further include one or more membrane structures 1260. In some embodiments, the membrane structures 1260 may be located on the upper and / or lower surfaces of the acoustic-to-electrical transducer element 1220. For example, the membrane structure 1260 may be a single-layer membrane structure, located on either the upper or lower surface of the acoustic-to-electrical transducer element 1220. In another example, the membrane structure 1260 may be a double-layer membrane structure, including a first membrane structure and a second membrane structure, with the first membrane structure located on the upper surface of the acoustic-to-electrical transducer element 1220 and the second membrane structure located on the lower surface of the acoustic-to-electrical transducer element 1220. Providing the membrane structures 1260 on the surface of the acoustic-to-electrical transducer element 1220 allows for adjustment of the resonant frequency of the acoustic-to-electrical transducer element 1220. In some embodiments, the resonant frequency of the acoustic-to-electrical transducer element 1220 can be influenced by adjusting the material, dimensions (e.g., length, width), thickness, etc. of the membrane structures 1260. On the one hand, by adjusting the parameters of the membrane structure 1260 (e.g., material, size, thickness, etc.) and the acoustic-to-electrical transducer elements 1220 (e.g., cantilever beam structure), each acoustic-to-electrical transducer element 1220 can resonate within a desired frequency range. On the other hand, by providing the membrane structure 1260 on the surface of the acoustic-to-electrical transducer element 1220, damage to the acoustic-to-electrical transducer element 1220 can be avoided in the event of an overload of the microphone 1200, thereby improving the reliability of the microphone 1200.

[0106] In some embodiments, the membrane structure 1260 may fully or partially cover the upper surface and / or lower surface of the acoustic-to-electric conversion element 1220. For example, the upper surface or lower surface of each acoustic-to-electric conversion element 1220 is covered with a corresponding membrane structure 1260. The membrane structure 1260 may fully cover the upper surface or lower surface of the corresponding acoustic-to-electric conversion element 1220, or the membrane structure 1260 may partially cover the upper surface or lower surface of the corresponding acoustic-to-electric conversion element 1220. For another example, when multiple acoustic-to-electric conversion elements 1220 are simultaneously located on the same horizontal plane, one membrane structure 1260 may simultaneously fully cover the upper surface or lower surface of multiple acoustic-to-electric conversion elements 1220 on the same horizontal plane. For example, the membrane structure 1260 is connected to the inner wall of the vibration transmission portion 1223 via its circumferential side, thereby dividing the vacuum chamber 1250 into two independent upper and lower vacuum chambers. For another example, the shape of the membrane structure 1260 may be the same as the cross-sectional shape of the vibration transmitting portion 1223. The membrane structure 1260 is connected to the inner wall of the vibration transmitting portion 1223 through its peripheral side. The middle portion of the membrane structure 1260 may include a hole portion ( Figure 12 (not shown), the membrane structure 1260 can partially cover the upper surface or lower surface of multiple acoustic-to-electric conversion elements 1220 on the same horizontal plane at the same time, and the vacuum cavity 1250 can be divided into two upper and lower connected vacuum cavities by the membrane structure 1260.

[0107] In some embodiments, the material of the membrane structure 1260 may include, but is not limited to, one or more of semiconductor materials, metal materials, metal alloys, and organic materials. In some embodiments, semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, metal materials may include, but are not limited to, copper, aluminum, chromium, titanium, and gold. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, and aluminum alloys. In some embodiments, organic materials may include, but are not limited to, polyimide, parylene, PDMS, silicone gel, and silicone gel.

[0108] Figure 13 1 is a schematic structural diagram of a microphone according to some embodiments of the present application. Figure 13 The microphone 1300 shown can be used with Figure 10 The illustrated microphone 1000 is the same as or similar to the illustrated microphone 1000. For example, the first acoustic cavity 1330, the second acoustic cavity 1340, and the vacuum cavity 1350 of the microphone 1300 may be the same as or similar to the first acoustic cavity 1030, the second acoustic cavity 1040, and the vacuum cavity 1050 of the microphone 1000, respectively. For another example, the vibration pickup portion 1322 of the microphone 1300 (e.g., the first vibration pickup portion 13221 (e.g., the first elastic portion 132211, the first fixing portion 132212), the second vibration pickup portion 13222 (e.g., the second elastic portion 132221, the second fixing portion 132222)) can be the same as or similar to the vibration pickup portion 1022 of the microphone 1000 (e.g., the first vibration pickup portion 10221 (e.g., the first elastic portion 102211, the first fixing portion 102212), the second vibration pickup portion 10222 (e.g., the second elastic portion 102221, the second fixing portion 102222)). For more structures of the microphone 1300 (e.g., the shell structure 1310, the hole portion 1311, the vibration transmission portion 1323, the sound-to-electricity conversion element 1320, etc.), please refer to Figure 10 and its related descriptions.

[0109] In some embodiments, Figure 13 The microphone 1300 shown in FIG. Figure 10The main difference between the microphone 1200 shown is that the microphone 1300 may also include one or more membrane structures 1360. In some embodiments, the membrane structure 1360 may be located on the upper and / or lower surface of the cantilever beam structure (e.g., the second cantilever beam structure 13212) of the acoustic-to-electric conversion element 1320, which has a relatively low stiffness. For example, the membrane structure 1360 may be a single-layer membrane structure, located on the upper or lower surface of the second cantilever beam structure 13212. For another example, the membrane structure 1360 may be a double-layer membrane structure, including a first membrane structure and a second membrane structure, with the first membrane structure located on the upper surface of the second cantilever beam structure 13212 and the second membrane structure located on the lower surface of the second cantilever beam structure 13212. In some embodiments, the membrane structure 1360 may fully or partially cover the upper and / or lower surface of the second cantilever beam structure 13212. For example, the upper surface or lower surface of each second cantilever beam structure 13212 is covered with a corresponding membrane structure 1360. The membrane structure 1360 may completely cover the upper surface or lower surface of the corresponding second cantilever beam structure 13212, or the membrane structure 1360 may partially cover the upper surface or lower surface of the corresponding second cantilever beam structure 13212. For more information about whether the membrane structure 1360 completely or partially covers the upper surface and lower surface of the second cantilever beam structure 13212, please refer to Figure 12 and its related descriptions.

[0110] In some embodiments, the membrane structure 1360 may also be located on the upper and / or lower surfaces of a cantilever beam structure (e.g., the first cantilever beam structure 13211) having greater rigidity of the acoustic-to-electrical transducer element 1320. The manner in which the membrane structure 1360 is located on the upper and / or lower surfaces of the first cantilever beam structure 13211 is similar to the manner in which the membrane structure 1360 is located on the upper and / or lower surfaces of the second cantilever beam structure 13212, and is not further described here.

[0111] In some embodiments, the membrane structure 1360 may also be located simultaneously on the upper surface and / or lower surface of the cantilever beam structure with less rigidity (e.g., the second cantilever beam structure 13212) and the upper surface and / or lower surface of the cantilever beam structure with greater rigidity (e.g., the first cantilever beam structure 13211) of the acoustic-to-electric conversion element 1320. Figure 14 is a schematic structural diagram of a microphone according to some embodiments of the present application, such as Figure 14As shown, the membrane structure 1360 is located on both the upper surface of the first cantilever beam structure 13211 and the lower surface of the second cantilever beam structure 13212. In some embodiments, disposing the membrane structure 1360 on the upper and / or lower surface of the cantilever beam structure with greater rigidity (e.g., the first cantilever beam structure 13211) can prevent the cantilever beam structure with greater rigidity from deforming relative to the vibration transmitting portion 1323, thereby improving the sensitivity of the microphone 1300.

[0112] It should be noted that Figure 10 The microphone 1000 shown, Figure 12 The microphone 1200 and Figure 13 and Figure 14 The vibration pickup portions of the microphone 1300 shown are not limited to ensuring the stability of the vacuum cavity by providing fixed portions and elastic portions with different stiffnesses. In some embodiments, the stability of the vacuum cavity can also be ensured by providing a reinforcement member at the vibration pickup portion corresponding to the vacuum cavity. For a description of the fixing member, please refer to Figure 7 The relevant contents will not be elaborated here.

[0113] Figure 15 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 15 As shown, the microphone 1500 may include a housing structure 1510 , an acoustic-to-electrical conversion element 1520 , a vibration pickup portion 1522 , and a vibration transmission portion 1523 . Figure 15 The microphone 1500 shown in FIG can be used with Figure 5 For example, the first acoustic cavity 1530, the second acoustic cavity 1540, and the vacuum cavity 1550 of the microphone 1500 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the vacuum cavity 550 of the microphone 500, respectively. For more structures of the microphone 1500 (e.g., the housing structure 1510, the hole portion 1511, the vibration transmission portion 1523, the acoustic-to-electric conversion element 1520, etc.), please refer to Figure 5 and its related descriptions.

[0114] In some embodiments, Figure 15 The microphone 1500 shown in FIG. Figure 5The main difference of the illustrated microphone 500 lies in the vibration pickup portion 1522. In some embodiments, the vibration pickup portion 1522 may include a first vibration pickup portion 15221, a second vibration pickup portion 15222, and a third vibration pickup portion 15223. In some embodiments, the first vibration pickup portion 15221 and the second vibration pickup portion 15222 are arranged in a vertically opposed relationship with respect to the vibration transmission portion 1523, such that the vibration transmission portion 1523 is located between the first vibration pickup portion 15221 and the second vibration pickup portion 15222. Specifically, the lower surface of the first vibration pickup portion 15221 is connected to the upper surface of the vibration transmission portion 1523, and the upper surface of the second vibration pickup portion 15222 is connected to the lower surface of the vibration transmission portion 1523. In some embodiments, a vacuum cavity 1550 may be defined between the first vibration pickup portion 15221, the second vibration pickup portion 15222, and the vibration transmission portion 1523, and the acoustic-to-electrical conversion element 1520 is located within the vacuum cavity 1550. In some embodiments, the third vibration pickup portion 15223 is connected between the vibration transmission portion 1523 and the inner wall of the housing structure 1510. When the microphone 1500 is in operation, the sound signal can enter the first acoustic cavity 1530 through the hole 1511 and act on the vibration pickup portion 1522, causing the third vibration pickup portion 15223 to vibrate. The third vibration pickup portion 15223 then transmits the vibration to the sound-to-electricity conversion element 1520 through the vibration transmission portion 1523.

[0115] In some embodiments, the third vibration pickup portion 15223 may include one or more thin film structures that are compatible with the vibration transmitting portion 1523 and the housing structure 1510. For example, when the housing structure 1510 and the vibration transmitting portion 1523 are both cylindrical structures, the third vibration pickup portion 15223 may be an annular thin film structure, the outer wall of the annular thin film structure is connected to the housing structure 1510, and the inner wall of the annular thin film structure is connected to the vibration transmitting portion 1523. For another example, when the housing structure 1510 is a cylindrical structure and the vibration transmitting portion 1523 is a rectangular parallelepiped structure, the third vibration pickup portion 15223 may be a circular thin film structure with a rectangular hole in the center, the outer wall of the thin film structure is connected to the housing structure 1510, and the inner wall of the thin film structure is connected to the vibration transmitting portion 1523. It should be noted that the shape of the third vibration picking part 15223 is not limited to the aforementioned ring and rectangle, but can also be a thin film structure of other shapes, for example, regular and / or irregular shapes such as pentagons and hexagons. The shape and structure of the third vibration picking part 15223 can be adaptively adjusted according to the shape of the shell structure 1510 and the vibration transmission part 1523.

[0116] In some embodiments, the material of the third vibration pickup unit 15223 may include, but is not limited to, one or more of a semiconductor material, a metal material, a metal alloy, an organic material, and the like. In some embodiments, the semiconductor material may include, but is not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, the metal material may include, but is not limited to, copper, aluminum, chromium, titanium, gold, and the like. In some embodiments, the metal alloy may include, but is not limited to, copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, and the like. In some embodiments, the organic material may include, but is not limited to, polyimide, parylene, PDMS, silicone gel, silicone gel, and the like.

[0117] In some embodiments, the material of the first vibration pickup portion 15221 and the second vibration pickup portion 15222 is different from the material of the third vibration pickup portion 15223. For example, in some embodiments, the stiffness of the first vibration pickup portion 15221 and the stiffness of the second vibration pickup portion 15222 can be greater than the stiffness of the third vibration pickup portion 15223. In some embodiments, the third vibration pickup portion 15223 can generate vibrations in response to an external sound signal and transmit the vibration signal to the sound-to-electricity conversion element 1520. The first vibration pickup portion 15221 and the second vibration pickup portion 15222 have a relatively high stiffness to ensure that the vacuum cavity 1550 formed by the first vibration pickup portion 15221, the second vibration pickup portion 15222, and the vibration transmission portion 1523 is not affected by external air pressure. In some embodiments, to ensure that the vacuum cavity 1550 is not affected by external air pressure, the Young's modulus of the first vibration pickup portion 15221 and the second vibration pickup portion 15222 can be greater than 60 GPa. In some embodiments, the Young's modulus of the first vibration pickup portion 15221 and the second vibration pickup portion 15222 may be greater than 50 GPa. In some embodiments, the Young's modulus of the first vibration pickup portion 15221 and the second vibration pickup portion 15222 may be greater than 40 GPa.

[0118] In some embodiments, in order to ensure that the vacuum cavity 1550 is not affected by external air pressure, the microphone 1500 may further include a reinforcement (not shown in the figure), which may be located on the upper surface or lower surface of the vibration pickup portion 1522 (for example, the first vibration pickup portion 15221, the second vibration pickup portion 15222) corresponding to the vacuum cavity 1550. Specifically, the reinforcement may be located on the lower surface of the first vibration pickup portion 15221 and the upper surface of the second vibration pickup portion 15222, respectively, and the peripheral side of the reinforcement is connected to the inner wall of the vibration transmission portion 1523. For details on the structure, position, material, etc. of the reinforcement, please refer to Figure 7 In addition, the reinforcement member can also be used in other embodiments of this specification, for example, Figure 16 The microphone 1600 shown, Figure 17The microphone 1700 shown, Figure 20 The microphone 2000 shown, Figure 21 The microphone 2100 shown, Figure 22 Microphone 2200 is shown.

[0119] In some embodiments, the microphone 1500 may further include at least one membrane structure (not shown in the figure), and the at least one membrane structure may be located on the upper surface and / or lower surface of the acoustic-to-electric conversion element 1520. For details about the at least one membrane structure, please refer to Figure 12 The related descriptions are not repeated here.

[0120] Figure 16 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 16 As shown, the microphone 1600 may include a housing structure 1610 , an acoustic-to-electrical conversion element 1620 , a vibration pickup portion 1622 , and a vibration transmission portion 1623 . Figure 16 The microphone 1600 shown in FIG can be used with Figure 10 For example, the first acoustic cavity 1630, the second acoustic cavity 1640, and the vacuum cavity 1650 of the microphone 1600 may be the same as or similar to the first acoustic cavity 1030, the second acoustic cavity 1040, and the vacuum cavity 1050 of the microphone 1000, respectively. For more structures of the microphone 1600 (e.g., the housing structure 1610, the hole portion 1611, the vibration transmission portion 1623, the acoustic-to-electric conversion element 1620, etc.), please refer to Figure 10 and its related descriptions.

[0121] In some embodiments, Figure 16 The microphone 1600 shown in FIG. Figure 10The main difference of the illustrated microphone 1000 lies in the vibration pickup portion 1622. In some embodiments, the vibration pickup portion 1622 may include a first vibration pickup portion 16221, a second vibration pickup portion 16222, and a third vibration pickup portion 16223. In some embodiments, the first vibration pickup portion 16221 and the second vibration pickup portion 16222 may be arranged in an upper and lower position relative to the vibration transmitting portion 1623, such that the vibration transmitting portion 1623 is located between the first vibration pickup portion 16221 and the second vibration pickup portion 16222. Specifically, the lower surface of the first vibration pickup portion 16221 is connected to the upper surface of the vibration transmitting portion 1623, and the upper surface of the second vibration pickup portion 16222 is connected to the lower surface of the vibration transmitting portion 1623. In some embodiments, a vacuum cavity 1650 may be formed between the first vibration pickup portion 16221 , the second vibration pickup portion 16222 and the vibration transmission portion 1623 , and the acoustic-to-electric conversion element 1620 (for example, the first cantilever beam structure 16211 and the second cantilever beam structure 16212 ) is located in the vacuum cavity 1650 .

[0122] In some embodiments, the third vibration pickup portion 16223 is connected between the vibration transmission portion 1623 and the inner wall of the housing structure 1610. When the microphone 1600 is working, the sound signal can enter the first acoustic cavity 1630 through the hole 1611 and act on the third vibration pickup portion 16223 to vibrate. The third vibration pickup portion 16223 transmits the vibration to the sound-to-electricity conversion element 1620 through the vibration transmission portion 1623. For details about the third vibration pickup portion 16223, please refer to Figure 15 The related descriptions are not repeated here.

[0123] In some embodiments, the microphone 1600 may further include at least one membrane structure (not shown in the figure), and the at least one membrane structure may be located on the upper surface and / or lower surface of the acoustic-to-electric conversion element 1620. For details about the at least one membrane structure, please refer to Figure 12-14 The related descriptions are not repeated here.

[0124] Figure 17 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 17 As shown, the microphone 1700 may include a housing structure 1710 , an acoustic-to-electrical conversion element 1720 , a vibration pickup portion 1722 , and a vibration transmission portion 1723 . Figure 17 The microphone 1700 shown in FIG. 1 can be used with Figure 15. For example, the first acoustic cavity 1730, the second acoustic cavity 1740, and the vacuum cavity 1750 of the microphone 1700 may be respectively the same as or similar to the first acoustic cavity 1530, the second acoustic cavity 1540, and the cavity 1550 of the microphone 1500. For another example, the vibration pickup portion 1722 (e.g., the first vibration pickup portion 17221, the second vibration pickup portion 17222, and the third vibration pickup portion 17223) of the microphone 1700 may be the same as or similar to the vibration pickup portion 1522 (e.g., the first vibration pickup portion 15221, the second vibration pickup portion 15222, and the third vibration pickup portion 15223) of the microphone 1500. For more details about the structure of the microphone 1700 (eg, the housing structure 1710, the hole portion 1711, the vibration transmitting portion 1723, the acoustic-electric conversion element 1720, etc.), please refer to Figure 15 and its related descriptions.

[0125] In some embodiments, Figure 17 The microphone 1700 is shown with Figure 15 The main difference between the microphone 1500 shown is that the microphone 1700 may further include one or more support structures 1760. In some embodiments, the support structure 1760 may be disposed in the vacuum chamber 1750, and the upper surface of the support structure 1760 may be connected to the lower surface of the first vibration pickup portion 17221, and the lower surface of the support structure 1760 may be connected to the upper surface of the second vibration pickup portion 17222. On the one hand, by arranging a support structure 1760 in the vacuum cavity 1750, the support structure 1760 is respectively connected to the first vibration picking part 17221 and the second vibration picking part 17222, thereby further improving the stiffness of the first vibration picking part 17221 and the second vibration picking part 17222, so that the first vibration picking part 17221 and the second vibration picking part 17222 are not affected by the air vibration in the first acoustic cavity 1730 and are not deformed, thereby reducing the vibration mode of the internal components of the microphone 1700 (such as the first vibration picking part 17221 and the second vibration picking part 17222). At the same time, support structure 1760 increases the rigidity of first vibration pickup portion 17221 and second vibration pickup portion 17222, further ensuring that the volume of vacuum chamber 1750 remains substantially constant, thereby maintaining the vacuum level within vacuum chamber 1750 within a desired range (e.g., less than 100 Pa). This in turn reduces the effect of air damping within vacuum chamber 1750 on acoustic-to-electrical converter element 1720, thereby improving the Q factor of microphone 1700. Furthermore, support structure 1760, being connected to first vibration pickup portion 17221 and second vibration pickup portion 17222, respectively, also improves the reliability of microphone 1700 under overload conditions.

[0126] In some embodiments, the shape of support structure 1760 can be a regular and / or irregular structure, such as a plate-like structure, a cylinder, a truncated cone, a rectangular parallelepiped, a prism, or a hexahedron. In some embodiments, the material of support structure 1760 can include, but is not limited to, one or more of semiconductor materials, metal materials, metal alloys, and organic materials. In some embodiments, semiconductor materials can include, but are not limited to, silicon, silicon dioxide, silicon nitride, and silicon carbide. In some embodiments, metal materials can include, but are not limited to, copper, aluminum, chromium, titanium, and gold. In some embodiments, metal alloys can include, but are not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, and aluminum alloys. In some embodiments, organic materials can include, but are not limited to, polyimide, parylene, PDMS, silicone gel, and silicone.

[0127] Reference Figure 17 In some embodiments, the second distance d2 between the free end of the acoustic-to-electrical transducer element 1720 (i.e., the end suspended in the vacuum chamber 1750) and the support structure 1760 is no less than 2 μm to prevent collision between the acoustic-to-electrical transducer element 1720 and the support structure 1760 during vibration. Furthermore, when the second distance d2 is small (e.g., no greater than 20 μm), the overall volume of the microphone 1700 can be effectively reduced. In some embodiments, the second distance d2 between the free end of different acoustic-to-electrical transducer elements 1720 (e.g., cantilever beam structures of different lengths) and the support structure 1760 can vary. In some embodiments, by designing support structures 1760 of different shapes and sizes and adjusting their positions, multiple acoustic-to-electrical transducer elements 1720 (e.g., cantilever beam structures) can be densely arranged within the vacuum chamber 1750, thereby reducing the overall size of the microphone 1700. Figure 18A and Figure 18B is a schematic cross-sectional view of a microphone in different directions according to some embodiments of the present application, such as Figure 18A and Figure 18B As shown, when the support structure 1760 is an elliptical cylinder, the support structure 1760, the vibration transmission part 1723 and the vibration pickup part 1722 are restricted to form a ring-shaped or ring-like cavity in the vacuum cavity 1750, and multiple acoustic-to-electric conversion elements 1720 are located in the cavity and are distributed at intervals along the circumference of the support structure 1760.

[0128] In some embodiments, the support structure 1760 can be located in the center of the vacuum chamber 1750. For example, Figure 19A is a schematic cross-sectional view of a microphone according to some embodiments of the present application, such as Figure 19AAs shown, the support structure 1760 is located at the center of the vacuum chamber 1750. The center here can be the geometric center of the vacuum chamber 1750. In some embodiments, the support structure 1760 can also be set in the vacuum chamber 1750 near either end of the vibration transmission part 1723. For example, Figure 19B is a schematic cross-sectional view of a microphone according to some embodiments of the present application, such as Figure 19B As shown, the support structure 1760 is located in the vacuum chamber 1750 near the side wall L of the vibration transmission portion 1723. It should be noted that the shape, arrangement, position, material, etc. of the support structure 1760 can be adjusted according to the length, number, and distribution of the acoustic-to-electrical conversion elements 1720, and is not further limited here.

[0129] In some embodiments, the microphone 1700 may further include at least one membrane structure (not shown in the figure), and the at least one membrane structure may be provided on the upper surface and / or lower surface of the acoustic-electric conversion element 1720. In some embodiments, a hole portion for the support structure 1760 to pass through may be provided in the middle position of the membrane structure, and the hole portion may be the same as or different from the cross-sectional shape of the support structure. In some embodiments, the peripheral sidewalls of the support structure 1760 may be connected to the peripheral side portion of the hole portion in the membrane structure, or may not be connected to the peripheral side portion of the hole portion in the membrane structure. For more descriptions on the shape, material, structure, etc. of the membrane structure, please refer to Figure 12 and its related descriptions.

[0130] It should be noted that the support structure can also be applied to microphones in other embodiments, for example, Figure 5 The microphone 500 shown, Figure 10 The microphone 1000 shown, Figure 12 The microphone 1200 shown, Figure 13 The microphone 1300 shown, Figure 14 In the microphone 1200 shown, when the support structure is applied to other microphones, the shape, position, and material of the support structure can be adaptively adjusted according to specific circumstances.

[0131] Figure 20 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 20 As shown, the microphone 2000 may include a housing structure 2010 , an acoustic-to-electrical conversion element 2020 , a vibration pickup portion 2022 , and a vibration transmission portion 2023 . Figure 20 The microphone 2000 shown in FIG can be used with Figure 16. For example, the first acoustic cavity 2030, the second acoustic cavity 2040, and the vacuum cavity 2050 of the microphone 2000 may be respectively the same as or similar to the first acoustic cavity 1630, the second acoustic cavity 1640, and the vacuum cavity 1650 of the microphone 1600. For another example, the vibration pickup portion 2022 of the microphone 2000 (e.g., the first vibration pickup portion 20221, the second vibration pickup portion 20222, and the third vibration pickup portion 20223) may be the same as or similar to the vibration pickup portion 1622 of the microphone 1600 (e.g., the first vibration pickup portion 16221, the second vibration pickup portion 16222, and the third vibration pickup portion 16223). For more details about the structure of the microphone 2000 (eg, the housing structure 2010, the hole portion 2011, the vibration transmitting portion 2023, the acoustic-electric conversion element 2020, etc.), please refer to Figure 16 and its related descriptions.

[0132] In some embodiments, Figure 20 The microphone 2000 shown in FIG. Figure 16 The main difference between the microphone 1600 shown is that the microphone 2000 can also include a support structure 2060. In some embodiments, the upper surface of the support structure 2060 can be connected to the lower surface of the first vibration pickup portion 20221, and the lower surface of the support structure 2060 can be connected to the upper surface of the second vibration pickup portion 20222. In some embodiments, the free end (i.e., the end suspended in the vacuum chamber 2050) of the acoustic-to-electric conversion element 2020 (e.g., the first cantilever beam structure 20211, the second cantilever beam structure 20212) can have a second spacing d2 with the support structure 2060. For more description of the support structure 2060, please refer to Figure 17 and its related descriptions.

[0133] In some embodiments, the microphone 2000 may further include at least one membrane structure (not shown in the figure). A detailed description of the at least one membrane structure of the microphone 2000 including the support structure 2060 may be referred to. Figure 13 、 Figure 14 、 Figure 17 and its related descriptions.

[0134] Figure 21 Schematic diagram of the structure of the microphone according to some embodiments of the present application. In some embodiments, the microphone can be a bone conduction microphone, such as Figure 21 As shown, the bone conduction microphone 2100 may include a housing structure 2110 , an acoustic-to-electrical conversion element 2120 , a vibration pickup portion 2122 , and a vibration transmission portion 2123 . Figure 21 The components of the bone conduction microphone 2100 shown may be Figure 17The components of the microphone 1700 shown are the same or similar, for example, the acoustic-to-electric conversion element 2120, the first acoustic cavity 2130, the second acoustic cavity 2140, the vacuum cavity 2150, the vibration picking part 2122 (for example, the first vibration picking part 21221, the second vibration picking part 21222), the vibration transmission part 2123, the supporting structure 2160, etc.

[0135] In some embodiments, the bone conduction microphone 2100 is connected to Figure 17 The difference between the microphone 1700 shown is the vibration pickup method. The vibration pickup portion 1722 (e.g., the third vibration pickup portion 17223) of the microphone 1700 picks up the vibration signal transmitted through the hole 1711 to the air within the first acoustic cavity 1730. In contrast, the housing structure 2110 of the bone conduction microphone 2100 does not include a hole. Instead, the bone conduction microphone 2100 generates a vibration signal via the vibration pickup portion 2122 (e.g., the third vibration pickup portion 21223) in response to the vibration of the housing structure 2110. Specifically, the housing structure 2110 can generate vibrations based on an external sound signal, and the third vibration pickup portion 21223 can generate a vibration signal in response to the vibration of the housing structure 2110. The vibration signal is then transmitted to the acoustic-to-electrical converter 2120 via the vibration transmitting portion 2123. The acoustic-to-electrical converter 2120 converts the vibration signal into an electrical signal for output.

[0136] Figure 22 Schematic diagram of the structure of the microphone according to some embodiments of the present application. Figure 22 As shown, the bone conduction microphone 2200 may include a housing structure 2210 , an acoustic-to-electrical conversion element 2220 , a vibration pickup portion 2222 , and a vibration transmission portion 2223 . Figure 22 The components of the bone conduction microphone 2200 shown may be Figure 20 The components of the microphone 2000 shown are the same or similar, for example, the acoustic-to-electric conversion element 2220, the first acoustic cavity 2230, the second acoustic cavity 2240, the vacuum cavity 2250, the vibration picking-up part 2222 (for example, the first vibration picking-up part 22221, the second vibration picking-up part 22222), the vibration transmitting part 2223, the supporting structure 2260, etc.

[0137] In some embodiments, the bone conduction microphone 2200 is connected to Figure 20The difference between the microphone 2000 shown is that the vibration picking-up method is different. The vibration picking-up portion 2022 (for example, the third vibration picking-up portion 20223) of the microphone 2000 picks up the vibration signal of the air in the first acoustic cavity 2030 transmitted through the hole portion 2011, while the shell structure 2210 of the bone conduction microphone 2200 does not include a hole portion. The bone conduction microphone 2200 generates a vibration signal through the vibration picking-up portion 2222 (for example, the third vibration picking-up portion 22223) in response to the vibration of the shell structure 2210. In some embodiments, the shell structure 2210 can generate vibrations based on external sound signals, and the third vibration pickup portion 22223 can generate a vibration signal in response to the vibration of the shell structure 2210, and transmit the vibration signal to the sound-to-electric conversion element 2220 (for example, the first cantilever beam structure 22211, the second cantilever beam structure 22212) through the vibration transmission portion 2223. The sound-to-electric conversion element 2220 converts the vibration signal into an electrical signal and outputs it.

[0138] It should be noted that Figure 5 The microphone 500 shown, Figure 10 The microphone 1000 shown, Figure 12 The microphone 1200 shown, Figure 13 The microphone 1300 shown can also be used as a bone conduction microphone. For example, the microphone here may not be provided with a hole portion, the shell structure may generate vibrations based on an external sound signal, the first vibration pickup portion or the second vibration pickup portion may generate a vibration signal in response to the vibration of the shell structure, and transmit the vibration to the acoustic-electric conversion element through the vibration transmission portion, and the acoustic-electric conversion element converts the vibration signal into an electrical signal and outputs it.

[0139] The basic concepts have been described above. It will be apparent to those skilled in the art that the detailed disclosure above is merely illustrative and does not limit the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and amendments to the present application. Such modifications, improvements, and amendments are suggested in the present application and remain within the spirit and scope of the exemplary embodiments of the present application.

[0140] At the same time, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or multiple times in different locations in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

[0141] In addition, it will be understood by those skilled in the art that various aspects of the present application can be illustrated and described by a number of patentable categories or situations, including any new and useful process, machine, product or combination of substances, or any new and useful improvements thereto. Accordingly, various aspects of the present application can be performed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The above hardware or software may all be referred to as "data blocks", "modules", "engines", "units", "components" or "systems". In addition, various aspects of the present application may be represented as a computer product located in one or more computer-readable media, which includes computer-readable program code.

[0142] A computer storage medium may include a propagated data signal embodying the computer program code, for example, in baseband or as part of a carrier wave. The propagated signal may be in a variety of forms, including electromagnetic, optical, or any suitable combination thereof. A computer storage medium may be any computer-readable medium other than a computer-readable storage medium that can be connected to an instruction execution system, apparatus, or device to communicate, propagate, or transfer the program for use. The program code on the computer storage medium may be transmitted via any suitable medium, including radio, cable, fiber optic cable, RF, or similar media, or any combination of these.

[0143] The computer program code required for the operation of each part of the present application can be written in any one or more programming languages, including object-oriented programming languages ​​such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, etc., conventional procedural programming languages ​​such as C language, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages ​​such as Python, Ruby and Groovy, or other programming languages. The program code can be run entirely on the user's computer, or as a separate software package on the user's computer, or partly on the user's computer and partly on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer can be connected to the user's computer through any network form, such as a local area network (LAN) or a wide area network (WAN), or connected to an external computer (e.g., via the Internet), or in a cloud computing environment, or used as a service such as software as a service (SaaS).

[0144] In addition, unless expressly stated in the claims, the order of the processing elements and sequences described in this application, the use of alphanumeric characters, or the use of other names are not intended to limit the order of the processes and methods of this application. Although the above disclosure discusses some of the invention embodiments currently considered useful through various examples, it should be understood that such details are only for illustrative purposes, and the attached claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the essence and scope of the embodiments of this application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

[0145] Similarly, it should be noted that, in order to simplify the presentation of this application and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this application sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not mean that the subject matter of this application requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single embodiment disclosed above.

[0146] In some embodiments, numbers are used to describe the quantity of components and attributes. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise stated, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the description and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the settings of such numerical values ​​are as accurate as possible within the feasible range.

[0147] Each patent, patent application, patent application disclosure, and other materials, such as articles, books, specifications, publications, documents, etc., cited in this application is hereby incorporated by reference in its entirety. This includes application history documents that are inconsistent with or conflict with the content of this application, as well as documents (currently or subsequently attached to this application) that limit the broadest scope of the claims of this application. It should be noted that if the descriptions, definitions, and / or use of terms in the accompanying materials of this application are inconsistent or conflicting with the content of this application, the descriptions, definitions, and / or use of terms in this application shall prevail.

[0148] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other variations may also fall within the scope of this application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this application may be considered consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly introduced and described in this application.

Claims

1. A microphone, characterized in that: include: Shell structure; a vibration pickup portion that generates vibrations in response to an external sound signal transmitted to the housing structure; a vibration transmitting portion configured to transmit the vibration generated by the vibration pickup portion; as well as an acoustic-to-electric conversion element, configured to receive the vibration transmitted by the vibration transmitting portion and generate an electrical signal; Wherein, a vacuum cavity is formed between at least a portion of the structure of the vibration pickup portion and the vibration transmission portion, and the acoustic-to-electric conversion element is located in the vacuum cavity; The vibration pickup portion includes a first vibration pickup portion and a second vibration pickup portion arranged in sequence from top to bottom, a vibration transmission portion with a tubular structure is provided between the first vibration pickup portion and the second vibration pickup portion, the vacuum cavity is limitedly formed between the vibration transmission portion, the first vibration pickup portion and the second vibration pickup portion, the first vibration pickup portion and the second vibration pickup portion are connected to the shell structure through their circumferential sides, and at least part of the structure of the first vibration pickup portion and the second vibration pickup portion vibrates in response to an external sound signal transmitted to the shell structure; or, The vibration picking part includes a first vibration picking part, a second vibration picking part and a third vibration picking part. The first vibration picking part and the second vibration picking part are arranged opposite to each other in an upper and lower direction. A vibration transmission part with a tubular structure is provided between the first vibration picking part and the second vibration picking part. The vacuum cavity is formed by the vibration transmission part, the first vibration picking part and the second vibration picking part. The third vibration picking part is connected between the vibration transmission part and the inner wall of the shell structure. The third vibration picking part generates vibration in response to the external sound signal transmitted to the shell structure.

2. The microphone according to claim 1, wherein The vacuum degree inside the vacuum cavity is less than 100 Pa.

3. The microphone according to claim 1, wherein The vacuum degree inside the vacuum chamber is 10 -6 Pa-100 Pa.

4. The microphone according to claim 1, wherein The vibration pickup portion and the shell structure are limited to form at least one acoustic cavity, and the at least one acoustic cavity includes a first acoustic cavity; The shell structure includes at least one hole portion, the at least one hole portion is located at a side wall of the shell structure corresponding to the first acoustic cavity, and the at least one hole portion connects the first acoustic cavity with the outside; The vibration pickup portion generates vibration in response to the external sound signal transmitted through the at least one hole portion, and the sound-to-electricity conversion elements respectively receive the vibration of the vibration pickup portion to generate electrical signals.

5. The microphone according to claim 1, wherein The first vibration pickup part or the second vibration pickup part includes an elastic part and a fixed part, the fixed part of the first vibration pickup part and the fixed part of the second vibration pickup part and the vibration transmitting part are restricted to form the vacuum cavity, and the elastic part is connected between the fixed part and the inner wall of the housing structure; The elastic portion vibrates in response to the external sound signal.

6. The microphone according to claim 5, characterized in that The rigidity of the fixing portion is greater than the rigidity of the elastic portion.

7. The microphone according to claim 6, wherein The Young's modulus of the fixing portion is greater than 50 GPa.

8. The microphone according to claim 1, wherein The microphone further includes a reinforcement member, which is located on the upper surface or the lower surface of the first vibration pickup portion and the second vibration pickup portion corresponding to the vacuum cavity.

9. The microphone according to claim 1, wherein The stiffness of the first vibration pickup part and the second vibration pickup part is greater than the stiffness of the third vibration pickup part.

10. The microphone according to claim 9, wherein The Young's modulus of the first vibration pickup part and the second vibration pickup part is greater than 50 GPa.

11. The microphone according to claim 1, wherein The acoustic-to-electric conversion element includes a cantilever beam structure, one end of the cantilever beam structure is connected to the inner wall of the vibration transmission part, and the other end of the cantilever beam structure is suspended in the vacuum cavity; The cantilever beam structure is deformed based on the vibration signal to convert the vibration signal into an electrical signal.

12. The microphone according to claim 11, wherein The cantilever beam structure includes a first electrode layer, a piezoelectric layer, a second electrode layer, an elastic layer, and a substrate layer. The first electrode layer, the piezoelectric layer, and the second electrode layer are arranged in sequence from top to bottom. The elastic layer is located on the upper surface of the first electrode layer or the lower surface of the second electrode layer, and the substrate layer is located on the upper surface or the lower surface of the elastic layer.

13. The microphone according to claim 11, wherein The cantilever beam structure includes at least one elastic layer, an electrode layer and a piezoelectric layer; the at least one elastic layer is located on the surface of the electrode layer; the electrode layer includes a first electrode and a second electrode, wherein the first electrode is bent into a first comb-tooth structure, and the second electrode is bent into a second comb-tooth structure, and the first comb-tooth structure and the second comb-tooth structure cooperate to form the electrode layer, and the electrode layer is located on the upper surface or the lower surface of the piezoelectric layer; the first comb-tooth structure and the second comb-tooth structure extend along the length direction of the cantilever beam structure.

14. The microphone according to claim 1, wherein The sound-to-electricity conversion element includes a first cantilever beam structure and a second cantilever beam structure, wherein the first cantilever beam structure and the second cantilever beam structure are arranged opposite to each other, and a first distance is formed between the first cantilever beam structure and the second cantilever beam structure; Wherein, a first distance between the first cantilever beam structure and the second cantilever beam structure changes based on a vibration signal to convert the vibration signal into an electrical signal.

15. The microphone according to claim 14, wherein One end of the first cantilever beam structure and the second cantilever beam structure corresponding to the acoustic-to-electric conversion element are connected to the inner wall of the vibration transmission part, and the other end of the first cantilever beam structure and the second cantilever beam structure are suspended in the vacuum cavity.

16. The microphone according to claim 14, wherein The stiffness of the first cantilever beam structure is different from the stiffness of the second cantilever beam structure.

17. The microphone according to claim 1, wherein The microphone includes at least one membrane structure, and the at least one membrane structure is located on the upper surface and / or the lower surface of the acoustic-to-electric conversion element.

18. The microphone according to claim 17, wherein The at least one membrane structure entirely or partially covers the upper surface and / or lower surface of the acoustic-to-electric conversion element.

19. The microphone according to claim 1, wherein The microphone includes at least one supporting structure, one end of the at least one supporting structure is connected to the first vibration picking portion of the vibration picking portion, the other end of the supporting structure is connected to the second vibration picking portion of the vibration picking portion, and the free end of the acoustic-to-electric conversion element has a second distance from the supporting structure.

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