A bonding construction process evaluation method, device, equipment and storage medium

Abstract

The present invention discloses a bonding construction process assessment method, device, equipment and computer-readable storage medium, which are applied to the field of equipment manufacturing technology, comprising: obtaining basic bonding information and process parameters of each bonding element to be assessed based on the bonding process to be assessed; determining the detection method corresponding to the bonding element to be assessed based on a pre-established correspondence between the assessment element combination and the detection method; for each bonding element to be assessed, using the detection method corresponding to the bonding element to be assessed to detect the sample to obtain the detection result; the sample is made based on the process parameters of the relevant bonding element to be assessed; based on the detection result corresponding to each bonding element to be assessed, a bonding process assessment of the bonding process to be assessed is generated; thereby completing the bonding process assessment. The present invention can achieve standardization of bonding process assessment, effectively avoid the problem of missing items or duplication, and improve the accuracy and completeness of the assessment.

Description

Technical Field

[0001] The present invention relates to the technical field of equipment manufacturing, and in particular to a bonding construction process evaluation method, device, equipment and computer-readable storage medium. Background Art

[0002] Bonding process assessment is an important step before bonding production and is a test method to support the effectiveness of the bonding process. The existing technology does not evaluate the bonding process. It is mainly done by bonding engineers conducting bonding strength tests based on the bonding structure. The factors affecting the construction process are not analyzed item by item, and the corresponding assessment test specifications are not formulated, which is insufficient to support the formulation of the bonding process and causes hidden dangers in bonding quality.

[0003] In view of the problems in the existing technology such as non-standard process assessment methods, inconsistent result evaluation, repeated or missing verification items, and insufficient support for process regulations, how to provide an assessment method, device, equipment and computer-readable storage medium for bonding construction processes has become a problem that technical personnel in this field need to solve. Summary of the Invention

[0004] The purpose of the embodiments of the present invention is to provide a bonding construction process assessment method, device, equipment and computer-readable storage medium, which can achieve standardization of bonding process assessment during use, effectively avoid omissions or duplications, and improve the accuracy and completeness of the assessment.

[0005] To solve the above technical problems, an embodiment of the present invention provides a method for evaluating a bonding construction process, comprising:

[0006] Obtaining basic bonding information and process parameters of each bonding element to be assessed based on the bonding process to be assessed;

[0007] Based on the pre-established correspondence between the evaluation factor combination and the detection method, determining the detection method corresponding to the bonding factor to be evaluated;

[0008] For each bonding element to be evaluated, a test method corresponding to the bonding element to be evaluated is used to test the prepared sample to obtain a test result; the prepared sample is produced based on the process parameters of the relevant bonding element to be evaluated;

[0009] A bonding process evaluation of the bonding process to be evaluated is generated based on the detection results corresponding to each bonding element to be evaluated.

[0010] Optionally, the combination of assessment factors includes adhesive type, bonding form, construction environment conditions and surface treatment information;

[0011] Then, the determination of the detection method corresponding to the bonding element to be evaluated based on the pre-established correspondence between the combination of evaluation elements and the detection method includes:

[0012] When the adhesive type is an elastic adhesive, and the bonding form is any one of a rigid-rigid bonding form, a rigid-flexible bonding form, and a flexible-flexible bonding form, the detection method is a strip peeling test;

[0013] When the adhesive type is other than elastic adhesive and the bonding form is rigid-rigid bonding, the testing method is tensile shear testing;

[0014] When the adhesive type is other than elastic adhesive and the bonding form is rigid and flexible bonding, the detection method is 180° peeling test;

[0015] When the adhesive type is other than elastic adhesive and the bonding form is flexible to flexible bonding, the detection method is T-peeling detection.

[0016] Optionally, when the detection method is a tensile shear test, the test result includes an area percentage of substrate cohesive failure CF or substrate failure SCF, and whether the test is qualified is determined based on the area percentage;

[0017] When the testing method is tensile shear testing, the test results include the test strength value of the adhesive joint, the area percentage of substrate cohesive failure CF, or the substrate failure SCF. The test is qualified when the test strength value is greater than a preset strength value, and the area percentage of substrate cohesive failure CF is greater than a preset percentage, or substrate failure SCF exists.

[0018] When the test method is a 180° peel test, the test results include the test strength value of the adhesive joint, the area percentage of the substrate cohesive failure CF, or the substrate failure SCF. The test is qualified when the test strength value is greater than a preset strength value, and the area percentage of the substrate cohesive failure CF is greater than a preset percentage, or there is a substrate failure SCF.

[0019] When the detection method is T-peel detection, the detection results include the detection strength value of the bonding joint, the area percentage of the substrate cohesive failure CF or the substrate failure SCF situation, and the detection is qualified when the detection strength value is greater than the preset strength value, and the area percentage of the substrate cohesive failure CF is greater than the preset percentage or there is substrate failure SCF.

[0020] Optionally, before determining the detection method corresponding to the bonding element to be evaluated based on the pre-established correspondence between the evaluation element combination and the detection method, the method further includes:

[0021] Based on each bonding element to be evaluated, determine whether there is a bonding process evaluation in the pre-stored bonding process evaluations whose evaluation elements are consistent with each of the bonding elements to be evaluated. If so, output the bonding process evaluation as the bonding process evaluation of the bonding process to be evaluated; if not, execute the step of determining the detection method corresponding to the bonding element to be evaluated based on the correspondence between the pre-established evaluation elements and the detection method.

[0022] Optionally, when it is determined that there is no bonding process evaluation in the pre-stored bonding process evaluations whose evaluation factors are consistent with the bonding factors to be evaluated, the method further includes:

[0023] Based on the pre-established bonding process assessment coverage rules and in combination with each of the bonding elements to be assessed, determine whether there is a bonding process assessment that meets the bonding process assessment coverage rules among the pre-stored bonding process assessments; if so, output the bonding process assessment that meets the bonding process assessment coverage rules as the bonding process assessment of the bonding process to be assessed; if not, execute the step of determining the detection method corresponding to the bonding element to be assessed based on the correspondence between the pre-established assessment elements and the detection methods.

[0024] Optionally, the determining whether there is a bonding process assessment that meets the bonding process assessment coverage rule in the pre-established bonding process assessment coverage rule in combination with each bonding element to be assessed includes:

[0025] If there is a bonding process assessment among the pre-stored bonding process assessments whose bonding joint grade is higher than the bonding joint grade to be assessed and whose other assessment factors are consistent with the other assessment factors to be assessed, it is determined that the bonding process assessment meets the bonding process assessment coverage rule;

[0026] If there is a bonding process assessment among the pre-stored bonding process assessments, in which the metal substrate category is the same as the metal substrate category to be assessed, the metal substrate brand is different, and other assessment factors are all the same as the other assessment factors to be assessed, then it is determined that the bonding process assessment meets the bonding process assessment coverage rule;

[0027] If there is a bonding process assessment among the pre-stored bonding process assessments, in which the surface state of the coating substrate is consistent with the surface state of the coating substrate to be assessed, the brand of the coating substrate is different, and other assessment factors are consistent with the other assessment factors to be assessed, then it is determined that the bonding process assessment meets the bonding process assessment coverage rule;

[0028] If there is a bonding process assessment among the pre-stored bonding process assessments in which the plastic substrate category is consistent with the plastic substrate category to be assessed, the plastic substrate brand is different, and other assessment factors are consistent with other assessment factors to be assessed, then it is determined that the bonding process assessment meets the bonding process assessment coverage rules.

[0029] Optionally, also include:

[0030] The generated bonding process assessment is used to generate a bonding process assessment report based on a preset template.

[0031] The embodiment of the present invention further provides a bonding construction process evaluation device, comprising:

[0032] An acquisition module, used for acquiring basic bonding information and process parameters of each bonding element to be assessed based on the bonding process to be assessed;

[0033] a determination module for determining a detection method corresponding to the bonding element to be assessed based on a pre-established correspondence between a combination of assessment elements and a detection method;

[0034] a detection module, configured to detect the prepared sample using a detection method corresponding to each bonding element to be evaluated, and obtain a detection result; the prepared sample is produced based on the process parameters of the relevant bonding element to be evaluated;

[0035] A generating module is used to generate a bonding process evaluation of the bonding process to be evaluated based on the detection results corresponding to each bonding element to be evaluated.

[0036] The embodiment of the present invention further provides an evaluation device for bonding construction technology, comprising:

[0037] memory for storing computer programs;

[0038] A processor is used to implement the steps of the bonding construction process evaluation method as described above when executing the computer program.

[0039] An embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the bonding construction process evaluation method as described above are implemented.

[0040] An embodiment of the present invention provides a method, device, equipment and computer-readable storage medium for evaluating a bonding construction process. The method includes: obtaining basic bonding information and process parameters of each bonding element to be evaluated based on the bonding process to be evaluated; determining the detection method corresponding to the bonding element to be evaluated based on a pre-established correspondence between the combination of evaluation elements and the detection method; for each bonding element to be evaluated, using the detection method corresponding to the bonding element to be evaluated to detect the sample and obtain the detection result; the sample is made based on the process parameters of the relevant bonding element to be evaluated; and generating a bonding process evaluation of the bonding process to be evaluated based on the detection result corresponding to each bonding element to be evaluated.

[0041] It can be seen that in the embodiment of the present invention, basic bonding information and process parameters of each bonding element to be evaluated can be obtained according to the bonding process to be evaluated, and then according to the pre-established correspondence between the combination of evaluation elements and the detection method, the corresponding detection method can be further determined, and samples are prepared based on the process parameters of the relevant bonding elements to be evaluated, and the corresponding detection method is used to detect the prepared samples to obtain the detection results, and then the bonding process evaluation is further generated based on the detection results of each element to be evaluated, thereby completing the bonding process evaluation, realizing the standardization of the bonding process evaluation, effectively avoiding the problems of missing items or duplications, and improving the accuracy and completeness of the evaluation. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the prior art and the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0043] Figure 1 A schematic flow chart of a method for evaluating a bonding construction process provided by an embodiment of the present invention;

[0044] Figure 2 A schematic diagram of a strip peeling detection operation provided by an embodiment of the present invention;

[0045] Figure 3 A schematic diagram of a tensile shear detection operation provided by an embodiment of the present invention;

[0046] Figure 4 A schematic diagram of a 180° peeling detection operation provided by an embodiment of the present invention;

[0047] Figure 5 A schematic diagram of a T-peeling detection operation provided by an embodiment of the present invention;

[0048] Figure 6A schematic diagram of a flow chart of an evaluation device for a bonding construction process provided by an embodiment of the present invention;

[0049] Figure 7 A schematic diagram of a flow chart of an evaluation system for bonding construction technology provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0050] The embodiments of the present invention provide a bonding construction process assessment method, device, equipment and computer-readable storage medium, which can achieve standardization of bonding process assessment during use, effectively avoid omissions or duplications, and improve the accuracy and completeness of the assessment.

[0051] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0052] Please refer to Figure 1 , Figure 1 A schematic flow chart of a method for evaluating a bonding construction process provided by an embodiment of the present invention. The method includes:

[0053] S110: Obtaining basic bonding information and process parameters of each bonding element to be assessed based on the bonding process to be assessed;

[0054] It should be noted that, in the embodiment of the present invention, bonding process assessment content and bonding process assessment elements may be pre-set, wherein the bonding process assessment content may include basic information and basic items corresponding to each basic information. Please refer to Table 1 for details.

[0055] Table 1

[0056]

[0057] That is, the basic information may include joint information, construction environment information, surface treatment information, adhesive information and curing information, wherein the joint information may include substrate, bonding grade, bonding form, etc., the construction environment information may include construction temperature and construction humidity, etc., the surface treatment information may include auxiliary material model and auxiliary material process parameters, etc., the adhesive information may include adhesive model and adhesive process parameters, etc., wherein the adhesive type can be determined according to the adhesive model, and the curing information may include curing environment conditions, curing pressure and curing time.

[0058] Please refer to Table 2 for the bonding process assessment factors covered by each bonding process assessment in the embodiments of the present invention.

[0059] Table 2

[0060]

[0061]

[0062] Among them, for each assessment factor, not all process assessments need to include all of the above assessment factors. The specific assessment factors need to be determined according to the adhesive type and application scenario, that is, the adhesive type and application scenario applicable to each assessment factor. For example: when the adhesive type is two-component adhesive, the bonding process assessment needs to include assessment factors such as construction environment conditions, surface treatment, application period, fixing time, curing environment conditions, curing pressure and curing time; when the adhesive type is contact adhesive, the corresponding bonding process assessment needs to include assessment factors such as construction environment conditions, surface treatment, open time, glue application amount, fixing time, curing environment conditions, curing pressure and curing time.

[0063] Therefore, when formulating a bonding process for a certain bonding joint, the above-mentioned pre-established table information can be referred to to determine the evaluation factors in the bonding process, and then corresponding process parameters can be formulated for each evaluation factor. In this way, when evaluating the bonding process to be evaluated, the basic bonding information and the process parameters of each bonding factor to be evaluated can be obtained based on the bonding process to be evaluated.

[0064] S120: Based on the pre-established correspondence between the evaluation factor combination and the detection method, determining the detection method corresponding to the bonding factor to be evaluated;

[0065] Specifically, since different combinations of evaluation factors may require different detection methods to detect and determine the samples, the embodiment of the present invention can pre-set the correspondence between the combination of evaluation factors and the detection method, and then further determine the detection method corresponding to the factor to be evaluated based on the correspondence.

[0066] It should also be noted that before determining the detection method corresponding to the bonding element to be evaluated, it is also possible to determine the various bonding evaluation elements that should be included based on the adhesive type and application scenario in the basic bonding information in the bonding process to be evaluated, and determine whether the various bonding elements to be evaluated obtained from the bonding process to be evaluated are all bonding evaluation elements that should be included. If they are, then the detection method corresponding to the bonding element to be evaluated is further determined based on the pre-established correspondence between the evaluation element combination and the detection method. If there are elements to be evaluated that are different from the various bonding evaluation elements that should be included, prompt information carrying the above-mentioned various bonding evaluation elements that should be included can be returned so that the staff can re-formulate the bonding process to be evaluated based on the various bonding evaluation elements that should be included.

[0067] S130: For each bonding element to be evaluated, the prepared sample is tested using a test method corresponding to the bonding element to be evaluated to obtain a test result; the prepared sample is produced based on the process parameters of the relevant bonding element to be evaluated;

[0068] Specifically, a sample is made based on the process parameters of the relevant bonding elements to be evaluated, and then the sample is tested using a testing method corresponding to the bonding elements to be evaluated to obtain a test result.

[0069] S140: Generate a bonding process assessment of the bonding process to be assessed based on the detection results corresponding to each bonding element to be assessed.

[0070] Specifically, a bonding process assessment of the bonding process to be assessed is generated based on the test results corresponding to each bonding element to be assessed. The generated bonding process assessment can also be used to generate a bonding process assessment report based on a preset template, and the process assessment report is output.

[0071] Furthermore, the aforementioned combination of assessment factors may include adhesive type, bonding method, construction environment conditions, and surface treatment information; wherein the construction environment boundary conditions specifically refer to construction environment boundary conditions, which may include parameter information such as high temperature, low temperature, or high humidity. Specifically, samples may be prepared based on the specific parameters of the construction environment conditions and in combination with the adhesive type and bonding method, as well as the boundary conditions of each parameter in the bonding factor to be assessed. As shown in Table 3, adhesive types may include elastic adhesives and other types of adhesives, and bonding methods may include rigid-rigid, rigid-flexible, and flexible-flexible.

[0072] Table 3

[0073]

[0074] Then, the process of determining the detection method corresponding to the bonding element to be evaluated based on the pre-established correspondence between the evaluation element combination and the detection method in S120 may specifically include:

[0075] When the adhesive type is an elastic adhesive and the bonding form is any one of rigid-rigid bonding, rigid-flexible bonding, and flexible-flexible bonding, the detection method is adhesive strip peeling detection;

[0076] Specifically, the strip peeling test is as follows Figure 2 Specifically, it may include:

[0077] (1) Use needle-nosed pliers to clamp one end of the adhesive strip, roll it up and pull it down in the peeling direction (angle 130-160°), and apply peeling force until cracks appear;

[0078] (2) When the adhesive breaks, use a sharp blade at about 45° to the peeling direction to cut obliquely to the substrate surface, while continuing to peel with needle-nose pliers. The peeling length should be at least 50 mm.

[0079] Furthermore, when the detection method is tensile shear testing, the test results include the area percentage of substrate cohesive failure CF or substrate failure SCF, and whether the test is qualified is determined based on the area percentage. Specifically, the correspondence between the area percentage and the bonding grade can be determined in advance. The bonding grade can indicate the degree of qualification. The corresponding bonding grade is further determined based on the bonding area, and then whether the result is qualified is determined based on the bonding grade.

[0080] When the adhesive type is other than elastic adhesive and the bonding form is rigid-rigid bonding, the test method is tensile shear test;

[0081] Specifically, the tensile shear test is as follows Figure 3 As shown, the specific process may include: (1) using a tensile testing machine to clamp both ends of the sample substrate, with a clamping distance of at least 25 mm and a tensile rate of 18±2 mm / min.

[0082] Furthermore, when the detection method is tensile shear testing, the test results include the test strength value τ of the bonding joint, the area percentage of the substrate cohesive failure CF or the substrate failure SCF, and when the test strength value τ is greater than the preset strength value τ0, and the area percentage of the substrate cohesive failure CF is greater than the preset percentage (for example, 50%) or there is substrate failure SCF, the test is qualified; that is, τ≥τ0, and the failure mode is 50% CF or SCF.

[0083] When the adhesive type is other than elastic adhesive and the bonding form is rigid and flexible, the test method is 180° peel test;

[0084] Specifically, the 180° peel test is as follows Figure 4 As shown, the specific process may include: (1) using a tensile testing machine to fix the rigid substrate, and pulling the other end of the flexible substrate away from the rigid substrate in a 180° direction, with a peeling speed of (100±10) mm / min, a peeling length of more than 200 mm, and reading the peeling strength (N / mm).

[0085] Furthermore, when the detection method is 180° peeling detection, the detection results include the detection strength value τ of the bonding joint, the area percentage of the substrate cohesive failure CF or the substrate failure SCF situation, and when the detection strength value τ is greater than the preset strength value τ0, and the area percentage of the substrate cohesive failure CF is greater than the preset percentage (for example, 50%) or there is substrate failure SCF, the detection is qualified; that is, τ≥τ0, and the failure mode is 100% CF or SCF.

[0086] When the adhesive type is other than elastic adhesive and the bonding form is flexible to flexible bonding, the test method is T-peel test.

[0087] Specifically, the T peeling test is as follows Figure 5 As shown, it may include: 1) using a tensile testing machine to clamp the two active ends of the sample substrate respectively, peeling in opposite directions, with a peeling speed of (100±10) mm / min and a peeling length of more than 150 mm, and reading the peeling strength (N / mm).

[0088] Furthermore, when the T-peel test is used, the test results include the bond strength value τ, the area percentage of substrate cohesive failure (CF), or the presence of substrate failure (SCF). The test is considered qualified if the strength value τ is greater than a preset strength value τ0, the area percentage of substrate cohesive failure (CF) is greater than a preset percentage (e.g., 50%), or the presence of substrate failure (SCF). In other words, if τ ≥ τ0, the failure mode is 100% CF or SCF.

[0089] It should also be noted that the surface-free time or pot life is an inherent property of the adhesive itself. The surface-free time applies to single-component elastic adhesives, and the pot life applies to two-component structural adhesives. They are used to clarify the time after the adhesive can be applied or mixed.

[0090] Specifically, when the combination of assessment factors includes surface-free time or pot life, the testing method may include: applying the adhesive (a two-component adhesive mixed in proportion) to a clean surface under the boundary conditions of the construction environment (high temperature, high humidity, and low temperature); cleaning the finger with ethanol, and touching the adhesive surface with the finger at regular intervals (e.g., 2 minutes, referring to the adhesive TDS; if the interval is longer, the interval can be appropriately extended) to observe the adhesion of the adhesive on the finger surface. The principle for determining the surface-free time or pot life may include: when no adhesive is adhered to the finger, the last time the adhesive was adhered is the surface-free time or pot life of the adhesive.

[0091] It should also be noted that open time is also an inherent property of the adhesive itself. It is applicable to contact adhesives and is used to determine the longest exposure time from application to bonding.

[0092] Specifically, when the combination of assessment factors includes open time, the detection method may include: under the boundary conditions of the construction environment (high temperature, high humidity, and low temperature), select a rigid substrate and a flexible substrate consistent with production, and use a predetermined process for surface treatment; apply adhesive to the two substrates in turn (the amount of glue applied is based on the upper and lower limits of the preset parameters), record the start time of glue application, refer to the data description in the relevant adhesive TDS, and let it air dry for different time gradients; bond and press the substrates together, fix them, and let them cure. After curing, use a tensile testing machine to perform a 180° peel test and output the test results (specifically, the bonding strength value of the two substrates). Specifically, perform the above operation when the amount of glue applied is the upper limit, and perform the above operation again when the amount of glue applied is the lower limit. Among them, the principle for determining the open time may include: taking the longest air-drying time that can achieve the required strength as its open time.

[0093] It should also be noted that the fixture time refers to the shortest curing time after the bonded parts can be processed or the fixtures can be removed. When the assessment factor combination includes the fixture time, the fixture time detection method can specifically include:

[0094] Analyze the static loads borne by the bonded parts during subsequent processing or removal of fixtures during the production process, and prepare corresponding bonded joints based on the bonding method. Combined with the curing environment boundary conditions (high temperature, low temperature, high humidity, low humidity), multiple prepared bonded joints are placed under the corresponding environmental conditions for different curing time gradients. Use a tensile testing machine to test the bond strength of the bonded joints at different curing times, and output the test results. The principle for determining the curing time may include: the shortest curing time at which the tested bond strength exceeds the static load is defined as the curing time.

[0095] Among them, curing time, curing pressure, and curing environment conditions are all curing parameters. They refer to the specific curing environment conditions after bonding, such as temperature, relative humidity, and light, and the specific curing pressure (pressure applied by equipment, tools, or vacuum pressure) for a specific curing time to ensure that the bonded parts can reach the state of assembly, processing, and application, that is, achieve the final required strength. By preparing bonding samples (shear, tensile), curing them for a specific time under pre-set curing environment conditions and curing pressure, and performing destructive testing on the samples, it is determined whether the required final strength is achieved.

[0096] Furthermore, before determining the detection method corresponding to the bonding element to be evaluated based on the pre-established correspondence between the evaluation element combination and the detection method in S120, the method may further include:

[0097] Based on each bonding element to be evaluated, determine whether there is a bonding process evaluation in the pre-stored bonding process evaluations whose evaluation elements are consistent with each bonding element to be evaluated. If so, output the bonding process evaluation as the bonding process evaluation of the bonding process to be evaluated; if not, execute the steps of determining the detection method corresponding to the bonding element to be evaluated based on the pre-established correspondence between the evaluation elements and the detection method.

[0098] It can be understood that in actual applications, after the evaluation of each bonding process to be evaluated is completed, the corresponding bonding process evaluation can be stored, so that when the bonding process to be evaluated is subsequently evaluated, it can first be matched from the pre-stored bonding process evaluations based on the various bonding elements to be evaluated in the bonding process to be evaluated, and it can be determined whether the various evaluation elements in the various bonding process evaluations are consistent with the various elements to be evaluated. If so, the corresponding bonding process evaluation can be directly output as the bonding process evaluation of the bonding process to be evaluated. If there is no bonding process evaluation with completely consistent evaluation elements, the subsequent steps can be executed, thereby improving the efficiency of the bonding process evaluation.

[0099] Furthermore, when it is determined that there is no bonding process evaluation in which the evaluation factors are consistent with the bonding factors to be evaluated among the pre-stored bonding process evaluations, the method further includes:

[0100] Based on the pre-established bonding process assessment coverage rules and the bonding elements to be assessed, determine whether there is a bonding process assessment that meets the bonding process assessment coverage rules among the pre-stored bonding process assessments. If so, the bonding process assessment that meets the bonding process assessment coverage rules will be output as the bonding process assessment of the bonding process to be assessed; if not, execute the steps of determining the detection method corresponding to the bonding element to be assessed based on the correspondence between the pre-established assessment elements and the detection methods.

[0101] That is to say, in the embodiment of the present invention, in order to match the bonding process assessments whose assessment elements are consistent with the bonding elements to be assessed among the pre-stored bonding process assessments, it is further possible to determine whether there is a bonding process assessment that meets the bonding process assessment rules among the pre-stored bonding process assessments based on the pre-specified bonding process assessment coverage rules. If so, the corresponding bonding process assessment is output as the bonding process assessment of the bonding process to be assessed. If not, the steps of determining the detection method corresponding to the bonding element to be assessed are executed based on the correspondence between the pre-established assessment elements and the detection method.

[0102] It should be noted that the bonding process assessment coverage rules in the embodiment of the present invention may specifically include:

[0103] When other assessment factors are the same, the bonding process assessment of a higher-grade bonding joint overrides the process assessment of a lower-grade bonding joint;

[0104] When other assessment factors are the same, the substrate category is metal substrate, and the bonding process assessments corresponding to different grades of metal materials overlap each other;

[0105] When other assessment factors are the same, the substrate category is the coating substrate, and the bonding process assessments corresponding to coatings of different brands overlap each other;

[0106] When other assessment factors are the same, the substrate category is plastic substrate, and the bonding process assessments corresponding to substrates of different brands or manufacturers overlap each other;

[0107] The surface treatment states do not overlap each other;

[0108] The properties of the same adhesive cover each other;

[0109] Different types of adhesives do not cover each other;

[0110] Surface treatment method coverage;

[0111] Boundary construction conditions covered.

[0112] Furthermore, the process of judging whether there is a bonding process assessment that meets the bonding process assessment coverage rule among the pre-stored bonding process assessments based on the pre-established bonding process assessment coverage rule and in combination with the bonding elements to be assessed may specifically include:

[0113] If there is a bonding process assessment among the pre-stored bonding process assessments whose bonding joint grade is higher than the bonding joint grade to be assessed and whose other assessment factors are consistent with those of other bonding process assessments to be assessed, it is determined that the bonding process assessment meets the bonding process assessment coverage rule;

[0114] For example, if the bonding joint grade to be assessed is A1, and a bonding process assessment with a bonding joint grade of A2 is found in the database, where A2 is higher than A1, and other assessment factors are consistent with other assessment factors to be assessed, then the bonding process assessment meets the bonding process assessment coverage rules and can be output as the bonding process assessment of the bonding process to be assessed.

[0115] If there is a bonding process assessment among the pre-stored bonding process assessments whose metal substrate category is the same as the metal substrate category to be assessed, but the metal substrate brand is different, and whose other assessment factors are all the same as those of the other factors to be assessed, then it is determined that the bonding process assessment meets the bonding process assessment coverage rules;

[0116] For example, if the metal substrate category is aluminum alloy, and the brand of the metal substrate category of the bonding joint to be evaluated is aluminum alloy series 3, then the other evaluation factors of the bonding process evaluation matched from the database are consistent with the other bonding factors to be evaluated of the bonding process to be evaluated. The metal substrate category is also aluminum alloy, but the brand is 5 series. In this case, the bonding process evaluation complies with the bonding process evaluation coverage rules and can be output as the bonding process evaluation of the bonding process to be evaluated.

[0117] If there is a bonding process assessment in the pre-stored bonding process assessments in which the surface state of the coating substrate is consistent with the surface state of the coating substrate to be assessed, the coating substrate brand is different, and other assessment factors are consistent with the other assessment factors to be assessed, then it is determined that the bonding process assessment meets the bonding process assessment coverage rules;

[0118] That is, if the other assessment factors of the bonding process assessment matched from the database are consistent with the other bonding factors to be assessed of the bonding process to be assessed, and the surface state of the coating substrate is also consistent, but the brand of the coating substrate is different, then the bonding process assessment meets the bonding process assessment coverage rules and can be output as the bonding process assessment of the bonding process to be assessed.

[0119] If there is a bonding process assessment among the pre-stored bonding process assessments in which the plastic substrate category is consistent with the plastic substrate category to be assessed, the plastic substrate brand is different, and other assessment factors are consistent with other assessment factors to be assessed, then it is determined that the bonding process assessment meets the bonding process assessment coverage rules.

[0120] That is, when the substrate is a plastic substrate, the categories of plastic substrates may include rubber, FRP, etc. If the other assessment factors of the bonding process assessment matched from the database are consistent with the other bonding factors to be assessed of the bonding process to be assessed, and the categories of plastic substrates are also consistent, for example, both are rubber, but the brands of plastic substrates are different, then the bonding process assessment meets the bonding process assessment coverage rules and can be output as the bonding process assessment of the bonding process to be assessed.

[0121] It can be seen that in the embodiment of the present invention, basic bonding information and process parameters of each bonding element to be evaluated can be obtained according to the bonding process to be evaluated, and then according to the pre-established correspondence between the combination of evaluation elements and the detection method, the corresponding detection method can be further determined, and samples are prepared based on the process parameters of the relevant bonding elements to be evaluated, and the corresponding detection method is used to detect the prepared samples to obtain the detection results, and then the bonding process evaluation is further generated based on the detection results of each element to be evaluated, thereby completing the bonding process evaluation, realizing the standardization of the bonding process evaluation, effectively avoiding the problems of missing items or duplications, and improving the accuracy and completeness of the evaluation.

[0122] On the basis of the above embodiment, the embodiment of the present invention further provides an evaluation device for bonding construction process. Figure 6 The device comprises:

[0123] An acquisition module 11 is used to acquire basic bonding information and process parameters of each bonding element to be evaluated based on the bonding process to be evaluated;

[0124] A determination module 12 is configured to determine a detection method corresponding to the bonding element to be assessed based on a pre-established correspondence between the assessment element combination and the detection method;

[0125] The detection module 13 is used to detect the prepared sample using a detection method corresponding to each bonding element to be evaluated, and obtain a detection result; the prepared sample is made based on the process parameters of the relevant bonding element to be evaluated;

[0126] The generating module 14 is configured to generate a bonding process assessment of the bonding process to be assessed based on the detection results corresponding to each bonding element to be assessed.

[0127] It should be noted that the bonding construction process evaluation device provided in the embodiment of the present invention has the same beneficial effects as the bonding construction process evaluation device provided in the above embodiment, and for the specific introduction of the bonding construction process evaluation method involved in the embodiment of the present invention, please refer to the above embodiment, and the present invention will not go into details here.

[0128] Please refer to Figure 7Based on the above embodiment, the embodiment of the present invention further provides an evaluation device for bonding construction technology, including:

[0129] Memory 20, for storing computer programs;

[0130] The processor 21 is configured to implement the steps of the bonding construction process evaluation method described above when executing the computer program.

[0131] The device provided in this embodiment may include but is not limited to a smart phone, a tablet computer, a laptop computer, or a desktop computer.

[0132] Among them, the processor 21 may include one or more processing cores, such as a 4-core processor, an 8-core processor, etc. The processor 21 can be implemented in at least one hardware form of DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), and PLA (Programmable Logic Array). The processor 21 may also include a main processor and a coprocessor. The main processor is a processor for processing data in the awake state, also known as a CPU (Central Processing Unit); the coprocessor is a low-power processor for processing data in the standby state. In some embodiments, the processor 21 may be integrated with a GPU (Graphics Processing Unit), which is responsible for rendering and drawing the content to be displayed on the display screen. In some embodiments, the processor 21 may also include an AI (Artificial Intelligence) processor, which is used to process computing operations related to machine learning.

[0133] The memory 20 may include one or more computer-readable storage media, which may be non-transitory. The memory 20 may also include high-speed random access memory, and non-volatile memory, such as one or more disk storage devices, flash memory storage devices. In this embodiment, the memory 20 is at least used to store the following computer program 201, wherein, after the computer program is loaded and executed by the processor 21, it can implement the relevant steps of the evaluation method of the bonding construction process disclosed in any of the aforementioned embodiments. In addition, the resources stored in the memory 20 may also include an operating system 202 and data 203, etc., and the storage method may be temporary storage or permanent storage. Among them, the operating system 202 may include Windows, Unix, Linux, etc. The data 203 may include but is not limited to a set offset, etc.

[0134] In some embodiments, the electronic device may further include a display screen 22 , an input / output interface 23 , a communication interface 24 , a power supply 25 , and a communication bus 26 .

[0135] Those skilled in the art will understand that Figure 7 The structure shown in the figure does not constitute a limitation of the electronic device, and may include more or fewer components than shown in the figure.

[0136] It is understandable that if the bonding construction process assessment method in the above embodiment is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and executes all or part of the steps of the various embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, a magnetic disk or an optical disk, and other media that can store program codes.

[0137] Based on this, an embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the bonding construction process evaluation method as described above are implemented.

[0138] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Reference can be made to the common and similar parts between the various embodiments. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple, and the relevant parts can be referred to the method description.

[0139] It should also be noted that, in this specification, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

[0140] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

[0141] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0142] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for evaluating bonding construction technology, characterized in that: include: Obtaining basic bonding information and process parameters of each bonding element to be assessed based on the bonding process to be assessed; Based on the pre-established correspondence between the evaluation factor combination and the detection method, determining the detection method corresponding to the bonding factor to be evaluated; For each bonding element to be evaluated, a test method corresponding to the bonding element to be evaluated is used to test the sample to obtain a test result; The sample is made based on the process parameters of the relevant bonding elements to be evaluated; Generating a bonding process assessment of the bonding process to be assessed based on the test results corresponding to each bonding element to be assessed; wherein: Before determining the detection method corresponding to the bonding element to be evaluated based on the pre-established correspondence between the evaluation element combination and the detection method, the method further includes: Based on each bonding element to be evaluated, determine whether there is a bonding process evaluation in the pre-stored bonding process evaluations whose evaluation elements are consistent with each of the bonding elements to be evaluated. If so, output the bonding process evaluation as the bonding process evaluation of the bonding process to be evaluated; if not, execute the step of determining the detection method corresponding to the bonding element to be evaluated based on the correspondence between the pre-established evaluation elements and the detection method.

2. The method for evaluating bonding construction technology according to claim 1, wherein: The combination of assessment factors includes adhesive type, bonding form, construction environment conditions and surface treatment information; Then, the determination of the detection method corresponding to the bonding element to be evaluated based on the pre-established correspondence between the combination of evaluation elements and the detection method includes: When the adhesive type is an elastic adhesive, and the bonding form is any one of a rigid-rigid bonding form, a rigid-flexible bonding form, and a flexible-flexible bonding form, the detection method is a strip peeling test; When the adhesive type is other than elastic adhesive and the bonding form is rigid-rigid bonding, the testing method is tensile shear testing; When the adhesive type is other than elastic adhesive and the bonding form is rigid and flexible bonding, the detection method is 180° peeling test; When the adhesive type is other than elastic adhesive and the bonding form is flexible to flexible bonding, the detection method is T-peeling detection.

3. The method for evaluating bonding construction technology according to claim 2, wherein: When the testing method is a tensile shear test, the test result includes the area percentage of substrate cohesive failure CF or substrate failure SCF, and whether the test is qualified is determined based on the area percentage; When the testing method is tensile shear testing, the test results include the test strength value of the adhesive joint, the area percentage of substrate cohesive failure CF, or the substrate failure SCF. The test is qualified when the test strength value is greater than a preset strength value, and the area percentage of substrate cohesive failure CF is greater than a preset percentage, or substrate failure SCF exists. When the test method is a 180° peel test, the test results include the test strength value of the adhesive joint, the area percentage of the substrate cohesive failure CF, or the substrate failure SCF. The test is qualified when the test strength value is greater than a preset strength value, and the area percentage of the substrate cohesive failure CF is greater than a preset percentage, or there is a substrate failure SCF. When the detection method is T-peel detection, the detection results include the detection strength value of the bonding joint, the area percentage of the substrate cohesive failure CF or the substrate failure SCF situation, and the detection is qualified when the detection strength value is greater than the preset strength value, and the area percentage of the substrate cohesive failure CF is greater than the preset percentage or there is substrate failure SCF.

4. The method for evaluating bonding construction technology according to claim 1, wherein: In the case where it is determined that there is no bonding process evaluation in the pre-stored bonding process evaluations whose evaluation factors are consistent with all the bonding factors to be evaluated, the method further includes: Based on the pre-established bonding process assessment coverage rules and in combination with each of the bonding elements to be assessed, determine whether there is a bonding process assessment that meets the bonding process assessment coverage rules among the pre-stored bonding process assessments; if so, output the bonding process assessment that meets the bonding process assessment coverage rules as the bonding process assessment of the bonding process to be assessed; if not, execute the step of determining the detection method corresponding to the bonding element to be assessed based on the correspondence between the pre-established assessment elements and the detection methods.

5. The method for evaluating bonding construction technology according to claim 4, wherein: The method of determining whether there is a bonding process assessment that meets the bonding process assessment coverage rule in the pre-established bonding process assessment coverage rule in combination with the bonding elements to be assessed includes: If there is a bonding process assessment among the pre-stored bonding process assessments whose bonding joint grade is higher than the bonding joint grade to be assessed and whose other assessment factors are consistent with the other assessment factors to be assessed, it is determined that the bonding process assessment meets the bonding process assessment coverage rule; If there is a bonding process assessment among the pre-stored bonding process assessments, in which the metal substrate category is the same as the metal substrate category to be assessed, the metal substrate brand is different, and other assessment factors are all the same as the other assessment factors to be assessed, then it is determined that the bonding process assessment meets the bonding process assessment coverage rule; If there is a bonding process assessment among the pre-stored bonding process assessments, in which the surface state of the coating substrate is consistent with the surface state of the coating substrate to be assessed, the brand of the coating substrate is different, and other assessment factors are consistent with the other assessment factors to be assessed, then it is determined that the bonding process assessment meets the bonding process assessment coverage rule; If there is a bonding process assessment among the pre-stored bonding process assessments in which the plastic substrate category is consistent with the plastic substrate category to be assessed, the plastic substrate brand is different, and other assessment factors are consistent with other assessment factors to be assessed, then it is determined that the bonding process assessment meets the bonding process assessment coverage rules.

6. The method for evaluating bonding construction technology according to claim 1, wherein: Also includes: The generated bonding process assessment is used to generate a bonding process assessment report based on a preset template.

7. A bonding construction process evaluation device, characterized in that: include: An acquisition module, used for acquiring basic bonding information and process parameters of each bonding element to be assessed based on the bonding process to be assessed; a determination module for determining a detection method corresponding to the bonding element to be assessed based on a pre-established correspondence between a combination of assessment elements and a detection method; A detection module, configured to detect each bonding element to be evaluated by using a detection method corresponding to the bonding element to be evaluated to obtain a detection result; The sample is made based on the process parameters of the relevant bonding elements to be evaluated; A generating module is used to generate a bonding process assessment of the bonding process to be assessed based on the test results corresponding to each bonding element to be assessed; wherein: The determination module is specifically configured to: determine, based on each bonding element to be evaluated, whether there is a bonding process evaluation in each pre-stored bonding process evaluation whose evaluation elements are consistent with each of the bonding elements to be evaluated; if so, output the bonding process evaluation as the bonding process evaluation of the bonding process to be evaluated; If not, the detection method corresponding to the bonding element to be evaluated is determined based on the pre-established correspondence between the evaluation elements and the detection methods.

8. An evaluation device for bonding construction technology, characterized in that: include: memory for storing computer programs; A processor is used to implement the steps of the bonding construction process evaluation method as described in any one of claims 1 to 6 when executing the computer program.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the bonding construction process evaluation method according to any one of claims 1 to 6 are implemented.

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