Semiconductor test probe with overvoltage trigger function

Abstract

The present invention discloses a semiconductor test probe with an overvoltage trigger function, comprising an insulating needle tube, a first needle tube is provided at one end of the insulating needle tube, a first needle head and a first spring are provided in the first needle tube, the first spring is located between the tail of the first needle head and the bottom of the first needle tube, a second needle tube is provided at the other end of the insulating needle tube, a second needle head and a second spring are provided in the second needle tube, a limiting step is provided in the middle of the second needle head, the second spring is sleeved on the second needle head and the second spring is located between one side of the limiting step and the bottom of the second needle tube, and the tail of the second needle head passes through the bottom of the second needle tube. The semiconductor test probe with an overvoltage trigger function solves the problem that when the existing semiconductor test probe is used, the semiconductor test probe is easily crushed due to excessive force during the test and exceeding the set stroke, which leads to the crushing of the product to be tested.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor detection, and in particular relates to a semiconductor test probe with an overvoltage triggering function. Background Art

[0002] Semiconductor test probes are widely used in technical fields such as mobile phones, automobiles, medical treatment, and aerospace, and are high-end electronic components.

[0003] The structure of a semiconductor test probe is usually composed of three parts: a needle shaft, a needle tube, and a spring. The needle shaft and the spring are installed inside the needle tube. The needle tube mouth is riveted and shrunken to keep the needle shaft and the spring inside the needle tube, forming an integral structure. When in use, the needle shaft is forced to compress the spring into the needle tube. At this time, the elastic force generated by the spring supports the needle shaft, and the needle shaft is in good contact with the test piece for testing.

[0004] However, when the existing semiconductor test probes are used, due to the large dimensional tolerances of the product to be tested and the exposed part of the movable needle of the semiconductor test probe, the test points to be tested and the test points of the semiconductor test probe are not collinear or the relative spacing difference is large, resulting in the large spacing pre-stressing distance being too short or the small spacing pre-stressing being excessive, resulting in the semiconductor test probe being crushed and then the product to be tested being crushed. Summary of the invention

[0005] The purpose of the present invention is to provide a semiconductor test probe with an overvoltage trigger function to solve the problem that when the existing semiconductor test probe is used, the semiconductor test probe is easily crushed and then the product to be tested is crushed due to excessive force during the test and exceeding the set stroke.

[0006] In order to solve the above technical problems, the present invention discloses a semiconductor test probe with an overvoltage trigger function, including an insulating needle tube, a first needle tube is provided at one end of the insulating needle tube, a first needle head and a first spring are provided in the first needle tube, the first spring is located between the tail of the first needle head and the bottom of the first needle tube, a second needle tube is provided at the other end of the insulating needle tube, a second needle head and a second spring are provided in the second needle tube, a limiting step is provided in the middle of the second needle head, the second spring is sleeved on the second needle head and the second spring is located between one side of the limiting step and the bottom of the second needle tube, and the tail of the second needle head passes through the bottom of the second needle tube.

[0007] The technical solution of the present invention also has the following characteristics:

[0008] As a preferred solution of the present invention, an insulating inner tube is arranged inside the insulating needle tube, and both ends of the first needle tube and the second needle tube are respectively arranged at both ends of the insulating inner tube.

[0009] As a preferred solution of the present invention, both ends of the insulating needle tube are formed with constrictions, and the first needle tube and the second needle tube are both confined within the constrictions.

[0010] As a preferred solution of the present invention, a constriction is formed at one end of the first needle tube, and the tail of the first needle head is limited in the constriction.

[0011] As a preferred solution of the present invention, a constriction is formed at one end of the second needle tube, and the limiting step is confined within the constriction.

[0012] Compared with the prior art: the semiconductor test probe with overvoltage trigger function of the present invention, during use, may cause triggering to generate short-circuit current only when overvoltage occurs during the test process. When the short-circuit current signal is transmitted to the device, the test is stopped immediately and an alarm is sounded. Therefore, it can ensure that the product to be tested will not be damaged due to overvoltage, and can also well guarantee the test performance of the semiconductor test probe under the premise of ensuring the test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0014] Figure 1 The figure is a schematic structural diagram of a semiconductor test probe with an overvoltage triggering function according to the present invention.

[0015] In the figure: 1. first needle tube, 2. first spring, 3. first needle, 4. second needle tube, 5. limiting step, 6. insulating needle tube, 7. second needle, 8. insulating inner tube, 9. second spring. DETAILED DESCRIPTION

[0016] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0017] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0018] Example 1

[0019] like Figure 1As shown, a semiconductor test probe with an overvoltage trigger function of the present invention comprises an insulating needle tube 6, a first needle tube 1 is arranged at one end of the insulating needle tube 6, a first needle head 3 and a first spring 2 are arranged in the first needle tube 1, and the first spring 2 is located between the tail of the first needle head 3 and the bottom of the first needle tube 1, a second needle tube 4 is arranged at the other end of the insulating needle tube 6, a second needle head 7 and a second spring 2 are arranged in the second needle tube 4, a limiting step 5 is arranged in the middle of the second needle head 7, the second spring 2 is sleeved on the second needle head 7 and the second spring 2 is located between one side of the limiting step 5 and the bottom of the second needle tube 4, and the tail of the second needle head 7 passes through the bottom of the second needle tube 4.

[0020] The first needle tube 1 is a carrier of the semiconductor trigger test probe, and is used for carrying the first spring 2 and the first needle head 3 .

[0021] The first spring 2 is installed inside the first needle tube 1 , one end of which contacts the bottom of the first needle tube 1 when it is triggered, and the other end of which contacts the first needle head 3 .

[0022] The first needle 3 is installed inside the first needle tube 1, one end of which contacts the first spring 2 and is confined inside the first needle tube 1 by means of a needle tube wrapping opening.

[0023] The second needle tube 4 is a carrier of the test probe, and is used to carry the first spring 2 and the second needle 7 .

[0024] The second needle 7 is installed inside the second needle tube 4, one end of which contacts the second spring 10 and is restricted inside the second needle tube 4 by means of the needle tube wrapping;

[0025] The insulating needle tube 6 is a carrier of the semiconductor test probe with overvoltage triggering function of the present invention, and is used for the first needle tube 1 and the second needle tube 4 .

[0026] The first spring 2 and the first needle 3 are installed in the first needle tube 1, and are fastened by the first needle tube 1 wrapping method; the first spring 2 and the second needle 7 are installed in the second needle tube 4, and are fastened by the second needle tube 4 wrapping method; the first needle 3 and the second needle 7 are installed at both ends of the insulating needle tube 6. When in use, the first needle 3 contacts the outgoing end, and the second needle 5 contacts the product to be tested when it is close to the product to be tested. Since the distance between the test point of the product to be tested and the end face of the second needle 5 is not the same, there may be a situation where the distance is close during the test process. The above situation may cause overvoltage during the test process. Therefore, when overvoltage occurs at some test points, the test is stopped immediately and an alarm is issued. Since the semiconductor test probe of the present invention has an overvoltage trigger function, it can ensure that all points can reach reliable contact within the specified pressing range, protect the product to be tested and the test fixture, and provide more accurate test results.

[0027] Example 2

[0028] like Figure 1 As shown, different from Example 1, in a semiconductor test probe with an overvoltage trigger function of the present invention, an insulating inner tube 8 is arranged inside the insulating needle tube 6, and both ends of the first needle tube 1 and the second needle tube 4 are respectively arranged at both ends of the insulating inner tube 8.

[0029] The insulating inner tube 8 is used as an installation platform inside the insulating needle tube 6, and mainly serves to respectively arrange the first needle tube 1 and the second needle tube 4 at the two ends of the insulating inner tube 8, so as to facilitate fast and accurate assembly and positioning, and the operation is relatively convenient.

[0030] Example 3

[0031] like Figure 1 As shown, different from Example 1, in a semiconductor test probe with an overvoltage trigger function of the present invention, constrictions are formed at both ends of the insulating needle tube 6, and the first needle tube 1 and the second needle tube 4 are both confined in the constrictions, which facilitates the rapid and stable assembly of the first needle tube 1 and the second needle tube 4 in the insulating needle tube 6.

[0032] Example 4

[0033] like Figure 1 As shown, different from Example 1, in a semiconductor test probe with an overvoltage trigger function of the present invention, a constriction is formed at one end of the first needle tube 1, and the tail of the first needle head 3 is limited in the constriction, so as to facilitate the rapid and stable assembly of the first needle head 3 in the first needle tube 1.

[0034] Example 5

[0035] like Figure 1 As shown, different from Example 1, in a semiconductor test probe with an overvoltage trigger function of the present invention, a constriction is formed at one end of the second needle tube 4, and the limiting step 5 is confined in the constriction, so as to facilitate the rapid and stable assembly of the second needle head 7 in the first needle tube 4.

[0036] Therefore, compared with the prior art, the semiconductor test probe with an overvoltage trigger function of the present invention may only trigger a short-circuit current when an overvoltage occurs during the test process. When the short-circuit current signal is transmitted to the device, the test is stopped immediately and an alarm is sounded. Therefore, it can ensure that the product to be tested will not be damaged due to overvoltage, and can also well guarantee the test performance of the semiconductor test probe while ensuring the test accuracy.

[0037] The above description shows and describes several preferred embodiments of the invention, but as mentioned above, it should be understood that the invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the invention concept described herein through the above teachings or the technology or knowledge of the relevant field. Changes and modifications made by those skilled in the art should be within the scope of protection of the claims attached to the invention without departing from the spirit and scope of the invention.

Claims

1. A semiconductor test probe with overvoltage triggering function, characterized in that: The invention comprises an insulating needle tube (6), wherein a first needle tube (1) is arranged at one end of the insulating needle tube (6), a first needle head (3) and a first spring (2) are arranged inside the first needle tube (1), and the first spring (2) is located between the tail of the first needle head (3) and the bottom of the first needle tube (1); a second needle tube (4) is arranged at the other end of the insulating needle tube (6), a second needle head (7) and a second spring (9) are arranged inside the second needle tube (4), a limiting step (5) is arranged in the middle of the second needle head (7), the second spring (9) is sleeved on the second needle head (7) and the second spring (9) is located between one side of the limiting step (5) and the bottom of the second needle tube (4), and the tail of the second needle head (7) passes through the bottom of the second needle tube (4).

2. The semiconductor test probe with overvoltage triggering function according to claim 1, characterized in that: An insulating inner tube (8) is arranged inside the insulating needle tube (6), and two ends of the first needle tube (1) and the second needle tube (4) are respectively arranged at two ends of the insulating inner tube (8).

3. The semiconductor test probe with overvoltage triggering function according to claim 2, characterized in that: The insulating needle tube (6) has first constrictions formed at both ends, and the first needle tube (1) and the second needle tube (4) are both confined within the first constrictions.

4. The semiconductor test probe with overvoltage triggering function according to claim 3, characterized in that: A second constriction is formed at one end of the first needle tube (1), and the tail of the first needle head (3) is limited in the second constriction.

5. The semiconductor test probe with overvoltage triggering function according to claim 4, characterized in that: A third constriction is formed at one end of the second needle tube (4), and the limiting step (5) is confined within the third constriction.

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