A type of vacuum glass

Abstract

This invention discloses a vacuum glass, relating to the field of glass product technology. The vacuum glass includes a glass body and a vacuum sensing probe. The glass body includes a first glass layer, a second glass layer, and a sealing edge. A gap is provided between the first and second glass layers, and the sealing edge seals the periphery of the gap, forming a vacuum cavity. The vacuum cavity is formed by welding solder in a vacuum environment. The vacuum sensor probe is disposed within the vacuum cavity and is used to detect the vacuum level of the vacuum cavity. A data processor is disposed outside the vacuum cavity and is wired or wirelessly connected to the sensing probe to receive data transmitted by the vacuum sensing probe. By placing a vacuum sensing probe within the vacuum cavity inside the vacuum glass, the vacuum level inside the vacuum glass can be detected conveniently and quickly, enabling efficient detection of the vacuum glass.

Description

Technical Field

[0001] This invention generally relates to the field of glass product technology, and more specifically, to a vacuum glass. Background Technology

[0002] Vacuum glass (VIG) is a heat-insulating and sound-insulating glass product based on vacuum technology. Its main body consists of two parallel panes of glass stacked together, with supporting material placed at a certain interval in between. The glass is permanently sealed around its perimeter using welding materials, resulting in a high-vacuum interior that satisfies the characteristics of heat and sound insulation. To improve heat insulation and regulate light transmission, one pane of the vacuum glass is generally made of low-emissivity coated glass. The vacuum degree of vacuum glass is an important indicator of product quality; the higher the vacuum degree, the lower the heat transfer coefficient and the better the heat insulation performance. Furthermore, if the vacuum degree is too low, it will affect the lifespan of the vacuum glass; therefore, it is necessary to test the vacuum degree of vacuum glass.

[0003] However, current methods for testing vacuum glass generally involve indirect measurement using external testing equipment. For example, vacuum levels can be determined by utilizing the energy attenuation of ultrasonic waves propagating through different media, or by using the law of optical reflection. These methods require sophisticated equipment, involve cumbersome procedures, and have relatively poor measurement accuracy, failing to meet the demands for rapid testing.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The summary section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This summary section is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] The purpose of this invention is to overcome at least one of the defects of the prior art and to provide a vacuum glass.

[0007] To achieve the above-mentioned objectives, the present invention adopts the following technical solution:

[0008] A vacuum glass, comprising:

[0009] A glass body includes a first glass layer, a second glass layer, and an edge seal. A gap is provided between the first glass layer and the second glass layer. The edge seal seals the periphery of the gap, forming a vacuum cavity. The edge seal is formed by welding solder in a vacuum environment.

[0010] A vacuum sensor probe is disposed in the vacuum chamber and is used to detect the vacuum level of the vacuum chamber.

[0011] According to one embodiment of the present invention, the vacuum sensing probe includes a probe assembly, the probe assembly including a substrate, a first microelectrode, a second microelectrode disposed on the substrate, and a nanosensing layer, the two sides of the nanosensing layer being connected to the first microelectrode and the second microelectrode respectively, and the nanosensing layer being used to generate a sensing signal based on vacuum pressure information.

[0012] According to one embodiment of the present invention, the substrate is selected from one or more of glass, polymer and ceramic plates; the nanosensing layer is made of one or more of nano-metallic elements, nano-alloys and nano-metal oxides.

[0013] According to one embodiment of the present invention, the nanosensing layer has a nanoporous structure and is selected from one or more of nanoporous metal elements, nanoporous alloys, and nanoporous metal oxides.

[0014] According to one embodiment of the present invention, the pore size of the nanoporous structure is 1 to 1000 nm.

[0015] According to one embodiment of the present invention, the nanosensing layer is a nanoparticle structure selected from one or more of elemental metals, alloys, and metal oxide nanoparticles.

[0016] According to one embodiment of the present invention, the particle size of the nanoparticles is 1 to 1000 nm.

[0017] According to one embodiment of the present invention, a data processor is further disposed outside the vacuum cavity, the data processor being wired or wirelessly connected to the vacuum sensing probe for receiving data transmitted by the vacuum sensing probe.

[0018] According to one embodiment of the present invention, the vacuum sensing probe further includes:

[0019] The communication module is used to communicate bidirectionally with the data processor, receive control commands sent by the data processor and send feedback data to the data processor, the feedback data including sensor data and / or vacuum value;

[0020] The control module is used to control the current and / or voltage of the probe assembly according to the control instructions, generate acquisition instructions, and transmit data back.

[0021] The acquisition module is used to acquire the sensing signal generated by the vacuum sensing probe according to the acquisition command;

[0022] A storage module is used to store the sensing data and / or the vacuum value.

[0023] According to one embodiment of the present invention, the communication module includes a coil winding and a synchronous rectification circuit. The coil winding is used to receive AC power and data signals from the data processor, and the synchronous rectification circuit is used to convert the AC power into DC power to power the control module.

[0024] According to one embodiment of the present invention, the vacuum cavity has a first region and a second region. When the vacuum glass leaks, the air pressure in the first region is higher than that in the second region. The vacuum sensing probe is disposed in the first region.

[0025] According to one embodiment of the present invention, the first region is configured as a region in the vacuum cavity near the sealing edge; the second region is configured as another region in the vacuum cavity other than the first region.

[0026] According to one embodiment of the present invention, the first region is a loop-shaped area formed by extending radially from the sealing edge to the center of the vacuum cavity by a first distance D1, wherein the first distance D1 is 0.1 to 20 cm, or the first distance D1 is 0.01 to 0.2 of the length D2 of the long side of the sealing edge.

[0027] According to one embodiment of the present invention, the height of the gap is 0.1 to 5 mm, the thickness of the vacuum sensing probe is less than or equal to the height of the gap, and it is fixed to the inner wall of the first glass layer and / or the second glass layer.

[0028] According to one embodiment of the present invention, the device further includes a support and / or a getter, wherein the support is disposed in the vacuum cavity to support the first glass layer and the second glass layer, and the support is columnar, spherical, or other shaped; the getter is disposed in the vacuum cavity to maintain the vacuum level inside the vacuum glass.

[0029] As can be seen from the above technical solution, the advantages and positive effects of the vacuum glass of the present invention are as follows:

[0030] The vacuum glass provided by this invention has a built-in vacuum sensing probe inside the vacuum chamber, which can detect the vacuum level of the vacuum chamber in real time. The testing environment is simple, and the testing process is efficient and convenient, which helps to realize large-scale testing of the vacuum level of vacuum glass. Attached Figure Description

[0031] Various objects, features, and advantages of the invention will become more apparent from the following detailed description of preferred embodiments of the invention, taken in conjunction with the accompanying drawings. The drawings are merely illustrative of the invention and are not necessarily drawn to scale. In the drawings, the same reference numerals always denote the same or similar parts. Wherein:

[0032] Figure 1 This is a schematic diagram of the structure of the vacuum glass provided in the embodiments of this disclosure.

[0033] Figure 2 This is a schematic diagram of the cross-sectional structure of the vacuum glass (support structure omitted) provided in the embodiments of this disclosure.

[0034] Figure 3 This is a schematic diagram of the structure of a vacuum sensing probe provided in one embodiment of this disclosure.

[0035] Figure 4 This is a schematic diagram of the module structure of a vacuum sensing probe provided in one embodiment of the present disclosure.

[0036] Figure 5 This is a schematic diagram of the detection circuit structure of a vacuum sensing probe provided in one embodiment of this disclosure.

[0037] Figure 6 This is a schematic diagram of the rectangular cross-section pipe in the experimental example disclosed in this publication.

[0038] Figure 7 This is a schematic diagram of the experimental setup (support structure omitted) in the experimental example disclosed herein. Detailed Implementation

[0039] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that the invention will be thorough and complete, and the concept of the exemplary embodiments will be fully conveyed to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted.

[0040] The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a full understanding of embodiments of the invention. However, those skilled in the art will recognize that the invention can be practiced without one or more of the specific details described, or other methods, components, materials, etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring various aspects of the invention.

[0041] In the following description, numerous specific details are set forth to provide a more thorough understanding of the invention. However, it will be apparent to those skilled in the art that the invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described to avoid obscuring the invention.

[0042] Example 1

[0043] Please see Figure 1 This embodiment provides a vacuum glass 100, which includes a glass body 10 and a vacuum sensing probe 20 disposed inside the glass body 10. The vacuum sensing probe 20 is used to detect the vacuum level inside the glass body 10.

[0044] Specifically, the glass body 10 includes a first glass layer 11, a second glass layer 12 and a sealing edge 13. A gap is provided between the first glass layer 11 and the second glass layer 12. The sealing edge 13 is formed by welding the sealing edge in a vacuum environment, and the gap is closed around the periphery to form a vacuum cavity 101.

[0045] Specifically, in one embodiment, in 20 to 10 -6 In a high vacuum environment of 20 Pa, solder is used to seal the periphery of the first glass layer 11 and the second glass layer 12, forming a sealing edge 13. The solder can be organic or inorganic, etc., and this disclosure does not impose specific limitations. For example, in a specific application scenario, the following operation is performed in a vacuum process chamber: solder is placed around the periphery of the second glass layer 12, the first glass layer 11 is stacked on top of the second glass layer 12, and then the solder is heated to melt, fusing with the first glass layer 11 and the second glass layer 12 to form a vacuum glass. The vacuum process chamber is a high vacuum environment (20-100 Pa). -6 By sealing the edges through welding in a vacuum environment, the resulting vacuum glass has a smooth appearance, few vacuum leakage points, and the vacuum level of the vacuum glass matches that of the vacuum sealing cavity, resulting in a long service life.

[0046] Specifically, the first glass layer 11 and the second glass layer 12 are arranged in parallel. The first glass layer 11 and the second glass layer 12 can be, for example, non-tempered glass, tempered glass, coated glass, etc. This disclosure does not impose any specific limitations.

[0047] Please see Figure 2 In one embodiment, the vacuum chamber 101 has a first region 102 and a second region 103. When air leakage occurs at the edge of the vacuum glass seal, the air pressure in the first region 102 is higher than that in the second region 103. The vacuum sensing probe 20 is disposed in the first region 102.

[0048] Within the glass body 10, the perimeter sealing 13 is the most prone to leakage. The gas pressure is higher at the leakage points, causing the gas to flow towards the lower pressure areas inside the glass body 10. Therefore, placing the vacuum sensor probe 20 within the higher-pressure first region 102 allows for earlier detection of leaks in the vacuum chamber 101, enabling timely detection of changes in vacuum level within the vacuum chamber 101 and effectively improving the sensitivity of vacuum level detection.

[0049] In one embodiment, the first region 102 is configured as a region close to the sealing edge 13. Specifically, the second region 103 is configured as the central region of the vacuum cavity 101, and the first region 102 is configured as the region between the sealing edge 13 and the second region 103. Specifically, the first region is a loop-shaped area formed by extending radially from the sealing edge 13 toward the center of the vacuum cavity 101 by a first distance D1.

[0050] The vacuum sensor probe 20 can be installed at any point within the loop-shaped area, and this disclosure does not impose any specific limitations. It should be noted that the installation position of the vacuum sensor probe 20 is unrelated to the accuracy of vacuum measurement; the only difference is that when installed in the aforementioned loop-shaped area, it can detect air leakage in the vacuum cavity earlier.

[0051] Furthermore, in one embodiment, the first distance D1 is 0.01 to 0.2 times the length of the long side of the sealing edge D2. Specifically, in this embodiment, the glass body 10 has a square structure, and the sealing edge length D2 is the distance of the long side of the sealing edge 13. The first distance D1 is 0.01 to 0.2 times the length of the long side of the sealing edge D2. By setting the vacuum sensing probe 20 within this range, a high detection sensitivity can be maintained.

[0052] Furthermore, in another embodiment, the first distance D1 is 0.1 to 20 cm, for example, 0.1 cm, 1 cm, 5 cm, 18 cm, etc. Within this distance range, air leakage at the sealing edge 13 can cause a sharp increase in air pressure within this range. By placing the vacuum sensor probe 20 at this position, pressure changes inside the vacuum chamber 101 can be detected earlier, resulting in better detection performance.

[0053] Further, please refer to Figure 1 In one embodiment, the vacuum glass further includes a support 14 disposed within the vacuum cavity 101. Specifically, the top of the support 14 contacts the first glass layer 11, and the bottom contacts the second glass layer 12, thereby supporting the first glass layer 11 and the second glass layer 12. One or more supports 14 may be provided, and multiple supports 14 can be uniformly distributed within the vacuum cavity 101 to improve the strength of the vacuum glass. The support 14 may be made of, for example, stainless steel or other high-hardness materials. The support 14 may be columnar, spherical, or other shapes.

[0054] Furthermore, in one embodiment, the vacuum glass may also include a getter (not shown), which is disposed in the vacuum chamber 101. The getter can effectively absorb gas molecules, improve and maintain the vacuum level inside the vacuum glass, and effectively extend the service life of the vacuum glass.

[0055] Furthermore, the gap height between the first glass layer 11 and the second glass layer 12 is 0.1 to 5 mm, that is, the thickness of the vacuum cavity 101 is 0.1 to 5 mm, such as 0.1 mm, 0.3 mm, 0.5 mm, 1 mm, 3 mm, etc.

[0056] Specifically, in this embodiment, the vacuum sensing probe 20 is disposed in the vacuum cavity 101 to detect the vacuum level of the vacuum cavity. The height of the vacuum sensing probe 20 is less than or equal to the height of the gap between the first glass layer 11 and the second glass layer 12. Due to the small gap height, most vacuum sensors currently cannot be adapted to the space inside the vacuum glass and cannot directly measure the vacuum level of the vacuum cavity. To solve this problem, in this embodiment, the vacuum sensing probe 20 is configured as a thin vacuum sensing probe. The thin vacuum sensing probe is small in size and can be assembled inside the vacuum cavity 101 to directly measure the vacuum level of the vacuum cavity 101.

[0057] Furthermore, in one embodiment, the vacuum sensing probe 20 is fixed to the inner wall of the first glass layer 11 or the second glass layer 12. Specifically, the vacuum sensing probe 20 can be connected to the first glass layer 11 or the second glass layer 12 by means of adhesive bonding or welding. Preferably, in this embodiment, the vacuum sensing probe 20 is fixed by adhesive bonding. Adhesive bonding is a simple and feasible method.

[0058] Please see Figure 3 Specifically, in one embodiment, the vacuum sensing probe 20 includes a probe assembly 21, which includes a substrate 211, a first microelectrode 212, a second microelectrode 213 disposed on the substrate 211, and a nanosensing layer 214. The two sides of the nanosensing layer 214 are respectively connected to the first microelectrode 212 and the second microelectrode 213.

[0059] Specifically, the substrate 211 serves as the carrier of the probe assembly 21, and the material of the substrate 211 can be selected from one or more of glass, silicon wafers, polymers, and ceramic plates. Polymers can be, for example, polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc. Specifically, the thickness of the substrate 211 can be 0.01–5 mm, and more preferably, the thickness of the substrate 211 is 0.05–0.5 mm. The relatively thin thickness of the substrate 211 ensures the miniaturization and portability of the vacuum sensing probe.

[0060] Specifically, both the first microelectrode 212 and the second microelectrode 213 are conductive materials used to connect the nanosensing layer 214. The first microelectrode 212 and the second microelectrode 213 can be inorganic conductive materials, organic conductive materials, composite materials, etc. Inorganic conductive materials can be, for example, graphite, carbon nanotubes, or metallic materials. Metallic materials can be, for example, elemental metals such as platinum, gold, silver, copper, aluminum, titanium, and nickel, or alloys of two or more of the aforementioned elemental metals. Organic conductive materials can be, for example, conductive polymers such as polyaniline, polystyrene, polythiophene, and polypyrrole.

[0061] Furthermore, the first microelectrode 212 and the second microelectrode 213 can be constructed as circular electrodes, strip electrodes, bar electrodes, array electrodes, interdigitated electrodes, etc.

[0062] Specifically, the nanosensing layer 214 has a nanostructure made of one or more of nano-metallic elements, nano-alloys, and nano-metal oxides, and can interact with gas molecules to generate sensing signals. For example, the nanosensing layer 214 can undergo molecular bonding, metal coordination, tunneling effect, catalytic reaction, etc., with gas molecules, thereby changing its impedance and other properties. Based on the changes in the impedance and other properties of the nanosensing layer 214, the vacuum level of the vacuum cavity can be determined.

[0063] Furthermore, the metals in nano-metallic elements, nano-alloys, and nano-metal oxides can be selected from one or more of the following: aluminum, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, ruthenium, rhodium, palladium, silver, cadmium, indium, tin, antimony, tungsten, iridium, platinum, and gold. Nano-alloys can be homogeneous bimetallic alloys or multiphase alloys.

[0064] Furthermore, in one embodiment, the nanosensing layer 214 may be nanoparticles with a particle size of 1 to 1000 nm, selected from one or more of elemental metals, alloys, and metal oxide nanoparticles.

[0065] Furthermore, in one embodiment, the nanosensing layer 214 is a nanoporous metal element, nanoporous alloy, or nanoporous metal oxide, such as nanoporous aluminum, nanoporous Cu-Ni alloy, or nanoporous CuO. Furthermore, the pore size of the aforementioned nanoporous material is 1–1000 nm. By selecting nanoporous materials, a higher specific surface area is achieved, providing more binding sites for gas molecules and effectively improving the detection sensitivity of the vacuum sensing probe.

[0066] It should be noted that nanoparticles, nanoporous metal elements, nanoporous alloys, or nanoporous metal oxides can be prepared using existing technologies, such as synthesis, template methods, sintering methods, and deposition methods, and this disclosure does not impose any specific limitations.

[0067] Furthermore, the vacuum sensing probe 20 is wirelessly connected to the data processor 30 disposed outside the vacuum chamber 101 to receive data sent by the vacuum sensing probe 20.

[0068] Specifically, please refer to Figure 4 In this embodiment, the vacuum sensing probe 20 further includes a control module 22 and a communication module 23, a data acquisition module 24, and a storage module 25 electrically connected to the control module 22. Specifically, the communication module 23 is used to realize bidirectional communication with the data processor 30. Specifically, the communication module 23 can receive control commands sent by the data processor 30 and send feedback data to the data processor 30. The control commands may include parameters for measuring vacuum pressure, etc., and the feedback data may be sensing data acquired by the data acquisition module 24 and / or vacuum degree values ​​obtained after conversion from the sensing data.

[0069] Specifically, please refer to Figure 5 In this embodiment, the communication module 23 includes a coil winding 231, a rectifier circuit 232, and a bidirectional communication circuit 233, enabling power reception and communication with the data processor 30. Specifically, the data processor 30 can modulate a fixed-frequency AC signal and a data signal, using the frequency of the AC signal as the base frequency of the carrier, and modulate and superimpose the high-frequency data signal onto this frequency band to form a new carrier signal. This new carrier signal is magnetically coupled through the coil on the data processor 30 and the coil winding 231 on the vacuum sensor probe 20, enabling the coil winding 231 to simultaneously perform power reception and communication functions.

[0070] Specifically, the coil winding 231 can receive alternating current at a fixed frequency, which is then converted into direct current by the subsequent rectifier circuit to power the entire circuit. Simultaneously, during magnetic field interaction, the coil winding can transmit data signals via a magnetic field carrier wave, which is then used by the subsequent bidirectional communication circuit for signal modulation and demodulation. The data signals may include control command signals and measurement signals, etc.

[0071] The rectifier circuit 232 converts the AC power transmitted from the data processor 30 into DC power. Since the components in the vacuum sensor probe all use DC voltage as their power source, AC power needs to be converted to DC to power the various modules. For example, a single-phase half-wave rectifier circuit can be used: it rectifies half a cycle of the AC signal, allowing only the positive half-cycle of the sine wave to pass through, while the negative half-cycle is cut off. The rectifier circuit can include diodes and capacitors. When the AC power is transmitted through the winding coil, current begins to flow. The diodes remove the negative half-cycle from the AC signal, retaining only the positive half-cycle, thus converting the negative half-cycle into positive half-cycle AC power. Alternatively, a full-wave or bridge rectifier circuit can be used to convert the negative voltage of the negative half-cycle into a positive voltage. Then, high-frequency filtering is performed through the capacitor circuit to convert the positive half-cycle into DC power.

[0072] The bidirectional communication circuit 233 is connected to both the data processing circuit 221 and the coil winding 231. The bidirectional communication circuit 233 may include a signal generator, a filter, a modulator, and a demodulator. For example, the signal generator can be connected to the input of the modulator, generating signals by setting fixed frequencies, amplitudes, and waveforms, and then transmitting these signals to the modulator for modulation. The filter can be located between the signal generator and the modulator to filter out unwanted frequency components or noise, thereby improving signal quality. The modulator receives the signal generated by the signal generator and modulates the information signal onto a carrier signal. The demodulator receives and decodes the transmitted signals; it receives the data signal modulated by the modulator on the data processor 30 and then converts it back to the original information signal.

[0073] When the rectifier circuit 232 reaches a stable state, the bidirectional communication circuit 233 starts working and receives control command signals transmitted from the data processor 30. These control command signals may include information such as the start of measurement, the applied voltage / current value and time, the data acquisition interval, and the data return time. Simultaneously, the bidirectional communication circuit 233 can transmit the returned data to the data processor 30 through the coil winding 231, realizing bidirectional wireless communication. The returned data is the data transmitted from the control module 22 to the bidirectional communication circuit 233, including sensor data and / or vacuum values.

[0074] Specifically, the control module 22 applies appropriate measurement parameters (including current, voltage, and time) to the probe assembly 21 according to control commands to perform measurements and obtain measurement data. Specifically, the control module 22 includes a data processing circuit 221 and a detection circuit 222.

[0075] When the data processing circuit 221 receives a control command (e.g., start measurement) from the bidirectional communication circuit 233, it outputs DC power to the detection circuit 222. The probe assembly 21 is connected to the detection circuit 222 and the acquisition module 24. Upon receiving the DC power, the detection circuit 222 starts operating and generates a corresponding vacuum sensing analog signal. The data processing circuit 221 possesses computational, logical operation, and control capabilities, and can be programmed to control and schedule electronic components or devices. The data processing circuit 221 can be implemented, for example, using a microcontroller. The microcontroller can perform data processing, logical judgment, and control signal output based on the control command signal, executing various mathematical operations, logical operations, and bit operations to achieve data processing, conversion, and analysis, which will not be elaborated further here.

[0076] The acquisition module 24 is implemented by the acquisition circuit 241, which amplifies the acquired sensor signal and converts it into a digital signal for subsequent data processing.

[0077] Furthermore, the acquisition module 24 sends the converted sensor data to the data processing circuit 221, which can directly transmit the sensor data back to the communication module 23. In other embodiments, the data processing circuit 221 may process the sensor data to obtain a vacuum degree value characterizing the vacuum pressure and transmit the vacuum degree value back to the communication module 23.

[0078] Specifically, before acquiring the vacuum level, the vacuum sensor probe 20 performs signal calibration. The signal calibration steps include: acquiring a pre-acquisition signal from the detection circuit 222 via the acquisition module 24, and sending this pre-acquisition signal to the data processing circuit 221. The data processing circuit 221 determines whether the pre-acquisition signal is too large or too small. If the signal is too large, the measured signal will exceed the maximum measurable range of the circuit; conversely, if the signal is too small, the signal-to-noise ratio will be poor, easily leading to inaccurate signal acquisition. Based on the determination result, the data processing circuit 221 controls an appropriate voltage or current before acquiring the vacuum level value.

[0079] Specifically, the storage module 25 can be implemented using a memory circuit 251. The memory circuit 251 can be, for example, a memory chip, which can store identification codes, vacuum pressure values, measurement parameters, etc.

[0080] Furthermore, this embodiment also provides a method for measuring the vacuum degree of the aforementioned vacuum sensing probe 20, including:

[0081] In step S101, when the data processor 30 approaches the coil winding 231, the rectifier circuit 232 converts the alternating current into direct current to a stable state.

[0082] In step S102, the bidirectional communication circuit 233 responds to the control command signal of the data processor 30 and sends the control command signal to the control module 22.

[0083] In step S103, the data processing circuit 221 in the control module 22 controls the detection circuit 222 to start according to the control command signal, and the detection circuit 222 outputs the analog signal of the probe assembly 21.

[0084] In step S104, the acquisition module 24 acquires the analog signal output by the detection circuit 222 and performs analog-to-digital conversion to generate a digital sensing signal.

[0085] In step S105, the data processing circuit 221 of the control module 22 converts the sensing signal into a vacuum degree value used to characterize the vacuum pressure and sends it back to the bidirectional communication circuit 233, or the data processing circuit 221 sends the sensing signal back to the bidirectional communication circuit 233.

[0086] Step S106: The storage module 25 acquires and stores the sensing signal and / or vacuum value.

[0087] In step S107, the bidirectional communication circuit 233 transmits the sensing signal or vacuum value to the data processor 30 via the coil winding 231.

[0088] Furthermore, in one embodiment, the data processor 30 may be, for example, a data server, a PC, a mobile phone, or a handheld device. The data processor 30 may have a built-in computing module, which processes the received sensor data according to the built-in computing module to obtain the vacuum value.

[0089] It should be noted that, in another embodiment, the data processor 30 can also be wired to the vacuum sensor probe 20. Specifically, the connecting wire is connected to the vacuum sensor probe 20 and led out to the outside, and then the sealing edge 13 is formed in a vacuum environment.

[0090] Experimental Example 1

[0091] The flow of gas in a rectangular cross-section pipe is as follows:

[0092] Rectangular cross-section pipes, such as Figure 6 As shown, when a pressure difference exists between the two ends of a rectangular cross-section pipe, gas will flow from the end with higher pressure to the end with lower pressure. When gas flows in the pipe or through a small orifice, if the pressure is high and the flow velocity is large, complex turbulence phenomena will occur. As the pressure gradually decreases, a clear regularity emerges. Specifically:

[0093] The flow state of gases is commonly expressed using the Reynolds number (R). e To determine the Reynolds number, it is calculated using the following formula (1):

[0094]

[0095] In equation (1), d is the equivalent diameter of the pipe; v is the gas velocity; ρ is the gas density; and η is the gas viscosity coefficient.

[0096] When R e When Re > 2200, the gas flow is turbulent; when Re < 1200, the gas flow is viscous (laminar). When Re < 1200... <R e At pressures below 2400°C, the gas flow is either turbulent or viscous. Turbulent flow is characterized by irregular streamlines and the formation of vortices. The streamlines change and swirl with the appearance and disappearance of vortices, and inertial forces play a dominant role. As pressure decreases, viscous flow develops. Viscous flow is characterized by distinct layers with different velocities in each layer. The frictional forces between layers are decisive, while inertial forces become secondary. With further pressure reduction, molecular flow emerges. Molecular flow is characterized by negligible intermolecular collisions; the flow is entirely determined by collisions between molecules and the container walls.

[0097] In vacuum technology, when a vacuum system is evacuated, the flow of gas initially becomes turbulent, then viscous, and finally molecular.

[0098] In viscous flow, the gas pressure and density are still relatively high, and it can be regarded as a continuous fluid, with internal friction of the gas playing a decisive role. At this time, the gas velocity is slower closer to the pipe wall and faster farther away from the pipe wall. The gas close to the pipe wall has a velocity of zero due to friction from the pipe wall. When the flow reaches a steady state, the mass of gas flowing through any cross-section of the pipe per second should be equal. For a rectangular cross-section pipe, when the pressures at both ends are p1 and p2 (p1 > p2), the gas flow rate Q flowing through any cross-section of the pipe per second is as shown in equation (2):

[0099]

[0100] In equation (2), Q is the gas flow rate per second through any cross-section of the pipe; K j Here, represents the shape factor for the rectangular pipe; a is the pipe width, b is the pipe height, and L is the pipe length (see...). Figure 6 ); η is the gas viscosity coefficient; The average pressure in the pipeline, p1 and p2 are the pressures at both ends of the pipe, respectively; ψ is a coefficient related to a and b, where ψ is as shown in equation (3):

[0101]

[0102] In equation (3), a is the pipe width and b is the pipe height. Specifically, ψ is calculated using only the first few terms listed in equation (3).

[0103] Specifically, the shape factor K of the rectangular pipe j Determined by a / b, as shown in Table 1 below:

[0104] Table 1 Shape Factor K for Rectangular Cross-Section Pipes j value

[0105] a / b 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 <![CDATA[K j ]]> 1 0.99 0.98 0.95 0.90 0.82 0.71 0.58 0.42 0.23

[0106] In viscous flow, the gas flow rate is directly proportional to the fourth power of the pipe cross-sectional side length, inversely proportional to the pipe length and the gas viscosity coefficient, and directly proportional to the product of the average pipe pressure and the pressure difference between the two ends.

[0107] As the pressure gradually decreases, the mean free path of the molecules becomes close to the diameter of the pipe, and the gas enters a viscous-molecular flow state. At this point, both intermolecular collisions and collisions between molecules and the pipe wall occur simultaneously. If the pressure continues to decrease (entering high vacuum conditions), the number of gas molecules per unit volume gradually decreases, and the mean free path λ of the molecules becomes much larger than the minimum size of the gas flow pipe. Collisions between gas molecules and the pipe wall become dominant, and intermolecular friction can be completely ignored, allowing the establishment of a gas flow formula for the molecular flow state.

[0108] For a rectangular cross-section pipe, when the pressures at its two ends are p1 and p2 (p1 > p2) respectively, the amount of gas flowing through any cross-section of the pipe per second can be calculated by the following formula (4):

[0109]

[0110] In equation (4), Q is the amount of gas flowing through any cross-section of the pipe per second, and K... j is the shape factor for the rectangular pipe; a is the pipe width, b is the pipe height, and L is the pipe length. Let p1 be the average thermal velocity of the gas molecules, and p2 be the pressures at both ends of the pipe.

[0111] Therefore, it can be seen that in molecular flow, the gas flow rate is positively proportional to the cube of the pipe cross-sectional side length, inversely proportional to the pipe length, positively proportional to the average thermal motion rate of gas molecules, and positively proportional to the pressure difference between the two ends of the pipe.

[0112] Therefore, under vacuum conditions, the gas flow rate is directly proportional to the 3rd or 4th power of the pipe's cross-sectional side length, inversely proportional to the pipe length, and directly proportional to the pressure difference between the two ends of the pipe. In the vacuum chamber within a vacuum glass enclosure, the thinner the chamber, the lower the gas flow rate. At the same gas flow rate, a thinner vacuum chamber or a longer distance between two points within the chamber results in a greater pressure difference. Gas within the vacuum chamber flows from areas of higher pressure to areas of lower pressure.

[0113] Based on the above gas flow conditions, the vacuum level in the vacuum glass vacuum chamber was tested, as follows:

[0114] Experimental setup such as Figure 7 As shown, the experimental setup is a vacuum glass system, comprising a first glass layer 501, a second glass layer 502, and a sealing edge 503. An evacuation hole 504 is located at the center of the first glass layer 501. Sensors A and B are mounted on the inner wall of the second glass layer 502. The distance d between the first and second glass layers 501 and 502 is 3 mm. Sensor A is positioned closer to the sealing edge 503, and the distance L between sensor A and sensor B is 20 cm. The sealing edge 503 is designed with leakage points; during evacuation, leakage will occur at the sealing edge 503, causing gas flow within the vacuum chamber of the experimental setup.

[0115] Vacuum was pumped out of the experimental setup through the evacuation port 504, resulting in a small amount of leakage at the seal 503. The vacuum pressure at the evacuation port 504 was controlled by the evacuation system to simulate leakage under different vacuum levels in the vacuum glass. Data from sensors A and B were read simultaneously, as shown in Table 2.

[0116] Table 2

[0117]

[0118] As shown in Table 1, in simulated leakage scenario 1, the vacuum pressure inside the vacuum glass is 0.035 Pa (sensor B). When leakage occurs at the sealing edge, the vacuum pressure near the sealing edge rises to 0.23 Pa (sensor A). It is evident that sensor A, being closer to the sealing edge, can detect the leakage earlier than sensor B, which is farther away. Therefore, in this embodiment, placing the sensor in the first region close to the sealing edge allows for earlier detection of leakage, i.e., detecting the increase in vacuum pressure first, resulting in higher detection sensitivity.

[0119] It should be understood that the various examples described above can be utilized in multiple directions (e.g., tilted, inverted, horizontal, vertical, etc.) and in multiple configurations without departing from the principles of the invention. The embodiments shown in the accompanying drawings are merely examples of effective application of the principles of the invention, and the invention is not limited to any specific details of these embodiments.

[0120] Of course, upon careful consideration of the above description of the representative embodiments, those skilled in the art will readily understand that various modifications, additions, substitutions, deletions, and other changes can be made to these specific embodiments, and that such changes are within the scope of the principles of the invention. Therefore, the foregoing detailed description should be clearly understood as being given by way of illustration and example only, and the spirit and scope of the invention are defined solely by the appended claims and their equivalents.

Claims

1. A vacuum glass, characterized in that, include: The glass body includes a first glass layer, a second glass layer, and an edge seal. A gap is provided between the first glass layer and the second glass layer. The edge seal seals the periphery of the gap to form a vacuum cavity. The edge seal is formed by welding solder in a vacuum environment. as well as A vacuum sensing probe is disposed in the vacuum cavity to detect the vacuum level of the vacuum cavity; The vacuum chamber has a first region and a second region. When the vacuum glass leaks, the air pressure in the first region is higher than that in the second region. The vacuum sensing probe is disposed in the first region. The first region is configured as the region in the vacuum cavity near the sealing edge; the second region is configured as other regions in the vacuum cavity besides the first region; The first region is a loop-shaped area formed by extending radially from the sealing edge towards the center of the vacuum cavity by a first distance D1, wherein the first distance D1 is 0.1~20 cm, or the first distance D1 is 0.01~0.2 of the length D2 of the long side of the sealing edge; The height of the gap is 0.1~5 mm, the thickness of the vacuum sensing probe is less than or equal to the height of the gap, and it is fixed to the inner wall of the first glass layer and / or the second glass layer.

2. The vacuum glass according to claim 1, characterized in that, The vacuum sensing probe includes a probe assembly, which includes a substrate, a first microelectrode, a second microelectrode, and a nanosensing layer disposed on the substrate. The two sides of the nanosensing layer are respectively connected to the first microelectrode and the second microelectrode, and the nanosensing layer is used to generate a sensing signal based on vacuum pressure information.

3. The vacuum glass according to claim 2, characterized in that, The substrate is selected from one or more of glass, polymer and ceramic plates; the nanosensing layer is made of one or more of nano-metallic elements, nano-alloys and nano-metal oxides.

4. The vacuum glass according to claim 2, characterized in that, The nanosensing layer has a nanoporous structure and is selected from one or more of nanoporous metal elements, nanoporous alloys, and nanoporous metal oxides.

5. The vacuum glass according to claim 4, characterized in that, The pore size of the nanoporous structure is 1 ~ 1000 nm.

6. The vacuum glass according to claim 2, characterized in that, The nanosensing layer has a nanoparticle structure and is selected from one or more of elemental metals, alloys, and metal oxide nanoparticles.

7. The vacuum glass according to claim 6, characterized in that, The nanoparticles have a particle size of 1 to 1000 nm.

8. The vacuum glass according to claim 2, characterized in that, It also includes a data processor configured outside the vacuum chamber, which is wired or wirelessly connected to the vacuum sensing probe and is used to receive data sent by the vacuum sensing probe.

9. The vacuum glass according to claim 8, characterized in that, The vacuum sensing probe also includes: The communication module is used to communicate bidirectionally with the data processor, receive control commands sent by the data processor and send feedback data to the data processor, the feedback data including sensor data and / or vacuum value; The control module is used to control the current and / or voltage of the probe assembly according to the control instructions, generate acquisition instructions, and transmit data back. The acquisition module is used to acquire the sensing signal generated by the vacuum sensing probe according to the acquisition command; A storage module is used to store the sensing data and / or the vacuum value.

10. The vacuum glass according to claim 9, characterized in that, The communication module includes a coil winding and a synchronous rectification circuit. The coil winding is used to receive AC power and data signals from the data processor, and the synchronous rectification circuit is used to convert the AC power into DC power to power the control module.

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