A platinum resistance temperature sensor system and detection device thereof
By introducing PT100 temperature sensing components, analog-to-digital converters, microprocessors and data processing neural networks into the platinum resistance temperature sensor system, combining hardware anti-aliasing filters and thermal adhesive cooling parts, the problems of slow thermal response, insufficient anti-interference capability and inaccurate data processing are solved, and higher measurement accuracy and reliability are achieved.
Patent Information
- Application Number
- CN202410999207.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2044-07-24
AI Technical Summary
The platinum resistance temperature sensor has problems such as slow thermal response, poor vibration and impact resistance, insufficient electromagnetic interference resistance, and inaccurate data processing, which affects its measurement accuracy and reliability in rapid temperature changes and complex environments.
The PT100 temperature sensing element, analog-to-digital converter MCP335X ADC, microprocessor and data processing neural network are used, and combined with hardware anti-aliasing filters, power supply and signal monitoring circuits, thermal adhesives and porous shell cooling parts are used to optimize data processing and thermal response speeds, and reduce the impact of electromagnetic interference and vibration shock on temperature measurement.
It improves the thermal response speed, anti-interference ability and data processing accuracy of the platinum resistance temperature sensor, and enhances its reliability and measurement accuracy in complex environments.
Smart Images

Figure CN119023083B_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of temperature measuring equipment, and in particular relates to a platinum resistance temperature sensor system and a detection device thereof. Background Art
[0002] Platinum resistance temperature sensor is a device that measures temperature by using the property that the resistance of metal platinum changes with temperature. This sensor is widely used in industrial automation, laboratory research, medical equipment and other fields due to its high precision, good stability and fast response.
[0003] The following are the defects of platinum resistance temperature sensors:
[0004] 1. Slow thermal response. The thermal response time of platinum resistance temperature sensors is slow, which means that it may not be able to provide real-time data in situations where rapid temperature change detection is required. 2. Poor vibration and shock resistance. Platinum resistance temperature sensors have poor tolerance to vibration and shock, which may cause sensor damage or measurement inaccuracy in environments with large mechanical fluctuations.
[0005] The platinum resistance temperature sensor system still needs to be improved in the following aspects:
[0006] First, anti-interference ability. During long-distance signal transmission, improving the system's anti-electromagnetic interference ability is crucial to ensuring measurement accuracy. Second, data processing. It is urgent to improve the system's prediction accuracy of temperature change trends. Otherwise, adjustments cannot be made in advance, which is not conducive to ensuring that the temperature is controlled within a reasonable range. Summary of the invention
[0007] The purpose of the present invention is to provide a platinum resistance temperature sensor system and a detection device thereof, which can reduce electromagnetic interference, monitor power supply and signal anomalies, optimize data processing, and improve thermal response speed, reduce the influence of thermal airflow on temperature measurement, and reduce damage caused by vibration and impact.
[0008] The technical solution adopted by the present invention is as follows:
[0009] A platinum resistance temperature sensor system includes a PT100 temperature sensing element, an analog-to-digital converter MCP335X ADC, a microprocessor, and a data processing neural network. The output end of the circuit where the PT100 temperature sensing element is located is connected to a bridge, and the output end of the bridge is connected to a differential amplifier. The bridge and the differential amplifier cooperate to convert the change of the PT100 resistance into a voltage level suitable for ADC input.
[0010] The output end of the differential amplifier is connected to a hardware anti-aliasing filter, and the hardware anti-aliasing filter is used to remove high-frequency noise in the signal before sampling;
[0011] The output end of the hardware anti-aliasing filter is connected to the analog input end of the analog-to-digital converter MCP335X ADC, and the analog-to-digital converter MCP335X ADC is used to convert the conditioned analog signal into a digital signal, and the power supply port of the analog-to-digital converter MCP335X ADC is connected to a reference voltage;
[0012] The digital output end of the analog-to-digital converter MCP335X ADC is connected to the ADC interface of the microprocessor, and the microprocessor is used to read the data of the analog-to-digital converter MCP335X ADC and process the data to obtain the temperature value. The GPIO port of the microprocessor is respectively connected to a circuit containing a window comparator and a voltage comparator, wherein the window comparator is used to monitor whether the power supply is abnormal, and the voltage comparator is used to monitor whether the signal exceeds the expected range;
[0013] The digital output end of the analog-to-digital converter MCP335X ADC is connected to a data processing neural network, and the data processing neural network is used to predict the trend of temperature change. The data processing neural network is provided with a data integration module and a trend analysis module, and the trend analysis module is provided with a trend range prediction module. The data processing neural network is also provided with a different scene selection module, a measurement parameter adjustment module and a processing parameter adjustment module;
[0014] The microprocessor is connected to a display device for displaying temperature data via an SPI interface.
[0015] A platinum resistance temperature sensor detection device, comprising a detection part, a machine handle part and a data line, wherein the detection part is connected to one end of the machine handle part and is used to contact a heat source, and the data line is connected to the other end of the machine handle part and is used to complete signal transmission, wherein the detection part comprises a quartz shell located at the outermost side, an inner insulating rod body is fixedly arranged inside the end of the quartz shell, a copper inner shell is fittedly arranged on the inner wall of the quartz shell and located outside the inner insulating rod body, and the wall thickness of the copper inner shell part of the quartz shell is half of the wall thickness of the remaining parts;
[0016] The fluid thermal conductive glue is used as the thermal conductive medium and the copper inner shell is used to promote the convection heat transfer between the platinum resistor and the measured medium.
[0017] With the help of the expansion of thermal conductive glue, high-pressure gas can quickly pass through multiple groups of cones to reduce the cooling of hot air flow;
[0018] Select potting glue as the packaging support to absorb the vibration of the handle part caused by the shaking of the equipment.
[0019] A spiral heat-conducting glue flow channel is arranged between the outer wall of the inner insulating rod and the inner wall of the copper inner shell, and a platinum resistance wire is spirally wound inside the spiral heat-conducting glue flow channel, and the interior of the spiral heat-conducting glue flow channel is filled with heat-conducting glue.
[0020] An annular top overflow shell is fixedly provided on the edge of the top of the quartz shell, and the top overflow shell is used to collect the thermally expanded thermally conductive adhesive. An inlet and an overflow port are provided at the connection between the top overflow shell and the spiral thermally conductive adhesive flow channel. An annular ring plug is movably assembled inside the top overflow shell. A spring is arranged in an annular array on the side of the ring plug facing away from the inner insulating rod body. A push rod is connected in an annular array on the side of the ring plug facing away from the inner insulating rod body, and the push rod extends out of the top overflow shell.
[0021] An air passage is provided through the axis of the inner insulating rod body, and air holes are provided in an array on the side wall of the inner insulating rod body. An exhaust pipe is fixedly connected to the side wall of one end of the quartz shell extending to the inside of the handle part, and the end of the exhaust pipe extends to the outside of the handle part.
[0022] A cooling component is arranged inside the quartz shell near one end of the machine handle part, and the cooling component includes a porous shell and a porous plate arranged in an array. The surfaces of the porous shell and the porous plate near the machine handle part are both arranged with conical tubes in a circular array, and the pointed end of the conical tubes faces the machine handle part.
[0023] The inner wall of the porous shell is provided with a spiral conductor in a circular array, the inner part of the porous shell is movably assembled with a push plate, and the outer wall of the push plate is provided with a spiral groove for fitting with the spiral conductor, the surface of the push plate close to the handle part is connected with elastic telescopic parts in a circular array, and the ends of the elastic telescopic parts are commonly connected with a plug plate for controlling the gas to pass through the porous shell, and the surface of the plug plate is penetrated by conical tubes in a circular array, and when the through hole coincides with the corresponding conical tube, the gas can pass through the porous shell.
[0024] An electrical connection body electrically connected to the platinum resistance wire is arranged at the center of the circle at the top of the inner insulating rod body, and one end of the quartz shell extending to the inside of the handle part is fixedly connected to an internal electrical post, and both ends of the internal electrical post are electrically connected to the data line and the electrical connection body respectively.
[0025] An extension ring body is integrally provided on the outer wall of one end of the quartz shell extending to the interior of the handle part, a live tube is provided at the connection between the quartz shell and the handle part, a filling groove is symmetrically provided on the inner wall at the connection between the handle part and the quartz shell, the extension ring body is embedded in the interior of the live tube, and the interior of the live tube is filled with a potting colloid, and vertical ring bodies are symmetrically and integrally provided on the surfaces of both sides of the live tube, the vertical ring bodies are embedded in the interior of the corresponding filling groove, and the interior of the filling groove is filled with a potting colloid.
[0026] The outer wall of one end of the internal electric column is integrally provided with an extended ring body 2, the connection between the handle part and one end of the internal electric column is provided with a live tube 2, the inner wall of the connection between the handle part and the internal electric column is symmetrically provided with a filling groove 2, the extended ring body 2 is embedded in the inside of the live tube 2, and the inside of the live tube 2 is filled with a potting colloid 3, the surfaces of both sides of the live tube 2 are symmetrically and integrally provided with vertical ring bodies 2, the vertical ring bodies 2 are embedded in the inside of the corresponding filling groove 2, and the inside of the filling groove 2 is filled with a potting colloid 4.
[0027] The technical effects achieved by the present invention are:
[0028] (1) In the present invention, the use of a hardware anti-aliasing filter can remove high-frequency noise in the signal before sampling, reduce the impact of electromagnetic interference, and help improve the accuracy and stability of subsequent A / D conversion.
[0029] (2) The present invention introduces a power monitoring circuit, such as using a window comparator, to ensure that the power supply is within a preset range to avoid power supply anomalies affecting measurement accuracy. It also introduces a signal monitoring circuit, such as adding a voltage comparator in the signal path to monitor whether the signal exceeds the expected range to prevent false temperature readings caused by sensor failure or circuit errors.
[0030] (3) The present invention adopts advanced data processing algorithms, such as data processing neural networks, to enable the system to predict the temperature change trend, thereby facilitating early adjustments to ensure that the temperature is controlled within a reasonable range; in addition, for different application scenarios, the system automatically adjusts the measurement and processing parameters, thereby enhancing the system's adaptive capabilities to meet different temperature monitoring requirements.
[0031] (4) The present invention can promote convective heat transfer between the platinum resistor and the measured medium by reducing the wall thickness of the quartz shell, matching the copper inner shell, and using fluid thermal conductive glue as the thermal conductive medium, thereby improving the thermal response speed. The good thermal conductivity of the thermal conductive glue can effectively improve the thermal response speed.
[0032] (5) The present invention, by means of the expansion of the thermally conductive adhesive, allows the high-pressure gas to pass through the porous shell. In the process of passing through the multiple groups of conical tubes, the flow rate of the gas flow is increased, and the temperature of the gas flow is reduced accordingly, thereby reducing the influence of the internal hot air flow of the detection part on the internal electronic components, and avoiding the deviation of the temperature detection result caused by the hot air flow.
[0033] (6) In the present invention, when the handle is subjected to the vibration caused by the equipment, potting colloids 1 and 3 will absorb the vibration from the horizontal direction, and potting colloids 2 and 4 will absorb the vibration from the vertical direction. A potting glue with a smaller hardness and a smaller expansion coefficient is selected, which can not only fix the cable components, but also reduce the damage caused by vibration impact. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] Figure 1 is a system schematic diagram of a temperature sensing system provided by an embodiment of the present invention;
[0035] Figure 2 is a structural diagram of a temperature detection device provided by an embodiment of the present invention;
[0036] Figure 3 is a front cross-sectional view of a temperature detection device provided by an embodiment of the present invention;
[0037] Figure 4 is a side cross-sectional view of a temperature detection device provided by an embodiment of the present invention;
[0038] Figure 5 yes Figure 3 The local enlarged structure diagram at A in the middle;
[0039] Figure 6 yes Figure 3 The local enlarged structure diagram at B in the middle;
[0040] Figure 7 It is a structural diagram of a spiral heat-conducting adhesive flow channel and a top overflow housing provided by an embodiment of the present invention;
[0041] Figure 8 yes Figure 3 The local enlarged structure diagram at C in the middle;
[0042] Fig. 9 is a combined cross-sectional view of a porous shell and a push plate provided by an embodiment of the present invention;
[0043] Fig.10 yes Figure 4 The local enlarged structure diagram at D in the middle;
[0044] Fig.11 yes Figure 4 A partial enlarged structural diagram at point E in the middle.
[0045] In the accompanying drawings, the components represented by the reference numerals are listed as follows:
[0046] 1. Detection part; 101. Quartz shell; 102. Copper inner shell; 103. Inner insulating rod; 104. Spiral thermal conductive glue flow channel; 105. Top overflow shell; 106. Inlet and overflow port; 107. Ring plug; 108. Push rod; 109. Spring; 110. Airway; 111. Air hole; 112. Exhaust pipe; 113. Extension ring body 1; 2. Machine handle part; 201. Filling tank 1; 202. Filling tank 2; 3. Data line; 4. Platinum resistance wire; 401. Electrical connection body; 5. Internal electrical column; 501. Extension ring body 2; 6. Cooling component; 6 01. Porous shell; 602. Porous plate; 603. Conical tube; 604. Spiral conductor; 605. Push plate; 606. Elastic expansion member; 607. Plug plate; 608. Through hole; 7. Live tube 1; 701. Potting colloid 1; 702. Vertical ring body 1; 703. Potting colloid 2; 8. Live tube 2; 801. Potting colloid 3; 802. Vertical ring body 2; 803. Potting colloid 4; 9. PT100 temperature sensing element; 10. Bridge; 11. Differential amplifier; 12. Hardware anti-aliasing filter; 13. Analog-to-digital converter MCP335X ADC; 14. Reference voltage; 15. Microprocessor; 1501. Window comparator; 1502. Voltage comparator; 16. Data processing neural network; 1601. Data integration module; 1602. Trend analysis module; 1603. Trend range prediction module; 1604. Different scene selection module; 1605. Measurement parameter adjustment module; 1606. Processing parameter adjustment module; 17. Display device. DETAILED DESCRIPTION
[0047] In order to make the purpose and advantages of the present invention more clearly understood, the present invention is specifically described below in conjunction with embodiments. It should be understood that the following text is only used to describe one or several specific embodiments of the present invention, and does not strictly limit the scope of protection of the specific claims of the present invention.
[0048] like Figure 1 As shown, a platinum resistance temperature sensor system includes a PT100 temperature sensing element 9, an analog-to-digital converter MCP335X ADC13, a microprocessor 15 and a data processing neural network 16. The output end of the circuit where the PT100 temperature sensing element 9 is located is connected to a bridge 10, and the output end of the bridge 10 is connected to a differential amplifier 11. The bridge 10 and the differential amplifier 11 cooperate to convert the change of the PT100 resistance into a voltage level suitable for ADC input.
[0049] According to the above structure, when the PT100 temperature sensing element 9 is affected by temperature changes, its resistance value will change accordingly. Next, the changed resistance value will be preliminarily processed by the bridge 10 circuit. The bridge 10 circuit is composed of precision resistors and is used to convert the change in resistance into a voltage signal. After that, the voltage signal is usually processed by a differential amplifier 11 to reduce noise and improve signal stability and accuracy. After the signal is amplified, the analog-to-digital converter MCP335X ADC13 converts the amplified analog voltage signal into a digital signal for further processing by the microprocessor 15. Finally, through calibration and linearization processing, the digital signal is finally converted into a temperature reading. This process is all existing technology and will not be described in detail here.
[0050] The output end of the differential amplifier 11 is connected to a hardware anti-aliasing filter 12 , and the hardware anti-aliasing filter 12 is used to remove high-frequency noise in the signal before sampling.
[0051] According to the above structure, the use of the hardware anti-aliasing filter 12 can remove high-frequency noise in the signal before sampling, reduce the impact of electromagnetic interference, and help improve the accuracy and stability of subsequent A / D conversion.
[0052] The output end of the hardware anti-aliasing filter 12 is connected to the analog input end of the analog-to-digital converter MCP335X ADC13, and the analog-to-digital converter MCP335X ADC13 is used to convert the conditioned analog signal into a digital signal. The power supply port of the analog-to-digital converter MCP335X ADC13 is connected to a reference voltage 14.
[0053] The digital output end of the analog-to-digital converter MCP335X ADC13 is connected to the ADC interface of the microprocessor 15, and the microprocessor 15 is used to read the data of the analog-to-digital converter MCP335X ADC13 and process the data to obtain the temperature value. The GPIO port of the microprocessor 15 is respectively connected to a circuit containing a window comparator 1501 and a voltage comparator 1502, wherein the window comparator 1501 is used to monitor whether the power supply is abnormal, and the voltage comparator 1502 is used to monitor whether the signal exceeds the expected range.
[0054] According to the above structure, a power monitoring circuit is introduced, such as using a window comparator 1501 to ensure that the power supply is within a preset range to avoid power supply anomalies affecting the measurement accuracy. A signal monitoring circuit is introduced, such as adding a voltage comparator 1502 in the signal path to monitor whether the signal exceeds the expected range to prevent false temperature readings caused by sensor failure or circuit errors.
[0055] The digital output end of the analog-to-digital converter MCP335X ADC13 is connected to the data processing neural network 16, and the data processing neural network 16 is used to predict the trend of temperature change. The data processing neural network 16 is internally provided with a data integration module 1601 and a trend analysis module 1602, and the trend analysis module 1602 is internally provided with a trend range prediction module 1603. The data processing neural network 16 is also internally provided with a different scene selection module 1604, a measurement parameter adjustment module 1605 and a processing parameter adjustment module 1606.
[0056] The microprocessor 15 is connected to a display device 17 for displaying temperature data via an SPI interface.
[0057] According to the above structure, by adopting advanced data processing algorithms, such as data processing neural network 16, the measurement data is integrated through data integration module 1601, and the system is enabled to predict the temperature change trend through trend analysis module 1602, so as to facilitate making adjustments in advance to ensure that the temperature is controlled within a reasonable range; in addition, different scene selection modules 1604 are used for different application scenarios, and measurement parameter adjustment module 1605 cooperates with processing parameter adjustment module 1606 to enable the system to automatically adjust measurement and processing parameters, thereby enhancing the system's adaptability to adapt to different temperature monitoring needs.
[0058] The working principle of the present invention is as follows: when the PT100 temperature sensing element 9 is affected by temperature changes, its resistance value will change accordingly. Next, this changed resistance value will be initially processed by the bridge circuit 10, which is composed of precision resistors and is used to convert the change in resistance into a voltage signal. After that, the voltage signal is usually processed by a differential amplifier 11 to reduce noise and improve signal stability and accuracy. After the signal is amplified, the analog-to-digital converter MCP335X ADC13 converts the amplified analog voltage signal into a digital signal for further processing by the microprocessor 15. Finally, through calibration and linearization processing, the digital signal is finally converted into a temperature reading;
[0059] Among them, the use of the hardware anti-aliasing filter 12 can remove high-frequency noise in the signal before sampling; the window comparator 1501 is used to prevent power supply anomalies from affecting measurement accuracy, and the voltage comparator 1502 is used to monitor whether the signal exceeds the expected range;
[0060] Finally, the measurement data is integrated through the data integration module 1601, and the trend analysis module 1602 enables the system to predict the temperature change trend, thereby facilitating early adjustment; in addition, the different scene selection module 1604 is used for different application scenarios, and the measurement parameter adjustment module 1605 cooperates with the processing parameter adjustment module 1606 to enable the system to automatically adjust the measurement and processing parameters.
[0061] like Figure 2-11 As shown, a platinum resistance temperature sensor detection device includes a detection part 1, a machine handle part 2 and a data line 3, the detection part 1 is connected to one end of the machine handle part 2 and is used to contact a heat source, the data line 3 is connected to the other end of the machine handle part 2 and is used to complete signal transmission, the detection part 1 includes a quartz shell 101 located at the outermost side, an inner insulating rod 103 is fixedly arranged inside the end of the quartz shell 101, a copper inner shell 102 is fitted on the inner wall of the quartz shell 101 and located on the outer side of the inner insulating rod 103, and the wall thickness of the quartz shell 101 including the copper inner shell 102 is half of the wall thickness of the remaining parts;
[0062] See attached Figure 5 and Figure 7 A spiral heat-conducting glue flow channel 104 is arranged between the outer wall of the inner insulating rod 103 and the inner wall of the copper inner shell 102, and a platinum resistance wire 4 is arranged in a spirally wound manner on the inner side of the spiral heat-conducting glue flow channel 104, and the interior of the spiral heat-conducting glue flow channel 104 is filled with heat-conducting glue;
[0063] See attached Figure 6 and Figure 7 A ring-shaped top overflow shell 105 is fixedly provided on the edge of the top of the quartz shell 101, and the top overflow shell 105 is used to collect the thermally expanded thermally conductive adhesive. An inlet and overflow port 106 is provided at the connection between the top overflow shell 105 and the spiral thermally conductive adhesive flow channel 104. A ring-shaped ring plug 107 is movably assembled inside the top overflow shell 105. A spring 109 is arranged in a ring array on the side of the ring plug 107 facing away from the inner insulating rod body 103. A push rod 108 is connected in a ring array on the side of the ring plug 107 facing away from the inner insulating rod body 103, and the push rod 108 extends out of the top overflow shell 105.
[0064] According to the above structure, during temperature measurement, the thin shell part at the end of the quartz shell 101 is in direct contact with the heat source, and the copper inner shell 102 located on the inner side can conduct the temperature to the inside more quickly. In addition, the platinum resistance wire 4 is arranged in the spiral thermal conductive glue flow channel 104, and the spiral thermal conductive glue flow channel 104 is also filled with thermal conductive glue. The fluid thermal conductive glue is used as the heat conductive medium and is combined with the copper inner shell 102 to promote the convective heat transfer between the platinum resistor and the measured medium, thereby improving the thermal response speed. The good thermal conductivity of the thermal conductive glue can effectively improve the thermal response speed;
[0065] The thermal conductive adhesive in the spiral thermal conductive adhesive flow channel 104 will expand to a certain extent after being heated, causing the excess thermal conductive adhesive to enter the interior of the overflow shell 105 from the overflow port 106, and then directly push the ring plug 107 to move and squeeze the spring 109 at the same time, and the push rod 108 integrated with the ring plug 107 will also move accordingly.
[0066] See attached Figure 5 and Fig.10 An air passage 110 is provided through the axis of the inner insulating rod 103, and air holes 111 are provided in an array on the side wall of the inner insulating rod 103. An exhaust pipe 112 is fixedly connected to the side wall of one end of the quartz shell 101 extending to the inside of the handle part 2, and the end of the exhaust pipe 112 extends to the outside of the handle part 2;
[0067] See attached Figure 8 and Fig. 9 A cooling member 6 is disposed inside the quartz housing 101 near one end of the machine handle 2. The cooling member 6 includes a porous shell 601 and a porous plate 602 arranged in an array. Conical tubes 603 are disposed in an annular array on the surfaces of the porous shell 601 and the porous plate 602 near the machine handle 2, and the pointed end of the conical tube 603 faces the machine handle 2.
[0068] See attached Figure 8 and Fig. 9 The inner wall of the porous shell 601 is provided with a spiral conductor 604 in a circular array, the porous shell 601 is movably assembled with a push plate 605, and the outer wall of the push plate 605 is provided with a spiral groove for fitting with the spiral conductor 604, the surface of the push plate 605 close to the handle part 2 is connected with elastic telescopic parts 606 in a circular array, and the ends of the elastic telescopic parts 606 are commonly connected with a plug plate 607 for controlling the gas to pass through the porous shell 601, and the surface of the plug plate 607 is penetrated by conical tubes 603 in a circular array, and when the through hole 608 coincides with the corresponding conical tube 603, the gas can pass through the porous shell 601.
[0069] According to the above structure, after the quartz shell 101 is heated, the gas inside it will also expand due to the heat. Since the plug plate 607 blocks the porous shell 601 at this time, the air pressure inside the quartz shell 101 increases, and the push plate 605 is pushed as the push rod 108 moves. Since the outer wall of the push plate 605 is provided with a spiral groove that fits the spiral conductor 604, under the guidance of the spiral conductor 604, the push plate 605 will rotate while moving, and then the elastic telescopic member 606 will shrink and drive the plug plate 607 to rotate at the same time. When the through hole 608 coincides with the corresponding cone tube 603, the high-pressure gas can quickly pass through the porous shell 601 and the multiple porous plates 602. In the process of the airflow passing through the cone tube 603, the diameter of the cone tube 603 becomes smaller, resulting in an increase in the flow rate of the airflow, and the temperature of the airflow decreases accordingly, thereby reducing the influence of the hot airflow inside the detection part 1 on the internal electronic components, and avoiding the deviation of the temperature detection result caused by the hot airflow.
[0070] See attached Figure 3 , Figure 4 and Figure 6, a connection body 401 electrically connected to the platinum resistance wire 4 is provided at the center of the top of the inner insulating rod 103, and one end of the quartz shell 101 extending to the inside of the handle part 2 is fixedly connected to the internal connection pole 5, and the two ends of the internal connection pole 5 are electrically connected to the data line 3 and the connection body 401 respectively;
[0071] See attached Fig.10 , an outer wall of one end of the quartz shell 101 extending to the inside of the handle part 2 is integrally provided with an extension ring body 113, a live tube 7 is provided at the connection between the quartz shell 101 and the handle part 2, a filling groove 201 is symmetrically provided on the inner wall at the connection between the handle part 2 and the quartz shell 101, the extension ring body 113 is embedded in the inside of the live tube 7, and the inside of the live tube 7 is filled with a potting colloid 701, and the surfaces of both sides of the live tube 7 are symmetrically integrally provided with vertical ring bodies 702, the vertical ring bodies 702 are embedded in the corresponding filling grooves 201, and the inside of the filling grooves 201 is filled with a potting colloid 2 703;
[0072] See attached Fig.11 An extended ring body 2 501 is integrally provided on the outer wall of one end of the internal electric column 5, a live tube 2 8 is provided at the connection between the handle part 2 and one end of the internal electric column 5, a filling groove 202 is symmetrically provided on the inner wall of the connection between the handle part 2 and the internal electric column 5, the extended ring body 2 501 is embedded in the inside of the live tube 2 8, and the inside of the live tube 2 8 is filled with a potting colloid 3 801, and the surfaces on both sides of the live tube 8 are symmetrically and integrally provided with vertical ring bodies 802, the vertical ring bodies 802 are embedded in the corresponding filling grooves 202, and the inside of the filling grooves 202 is filled with a potting colloid 4 803.
[0073] According to the above structure, a live tube 7 is provided at the connection between the quartz housing 101 and the handle part 2, and a live tube 2 8 is provided at the connection between the handle part 2 and one end of the internal electric column 5. Figure 4 As shown, when the handle part 2 is subjected to the shaking caused by the equipment, the quartz shell 101 and the internal electric column 5 will be horizontally offset, and the corresponding potting colloid 1 701 and potting colloid 3 801 will absorb the vibration from the horizontal direction, and the live tube 1 7 and the live tube 2 8 will be vertically offset, and the corresponding potting colloid 2 703 and potting colloid 4 803 will absorb the vibration from the vertical direction. The above-mentioned structural design, combined with the selection of potting glue with lower hardness and smaller expansion coefficient, can not only fix the cable components, but also reduce the damage caused by vibration impact.
[0074] The working principle of the present invention is as follows: during temperature measurement, the thin shell part at the end of the quartz shell 101 is in direct contact with the heat source, and the copper inner shell 102 located on the inner side can conduct the temperature to the inside more quickly. In addition, the spiral thermal conductive glue flow channel 104 is filled with thermal conductive glue at the same time. The fluid thermal conductive glue is used as the heat conductive medium and is combined with the copper inner shell 102 to promote the convection heat transfer between the platinum resistor and the measured medium. After being heated, the thermal conductive glue will expand to a certain extent, causing the excess thermal conductive glue to enter the top overflow shell 105 from the overflow port 106, and then directly push the ring plug 107 to move and squeeze the spring 109 at the same time, and the push rod 108 integrated with the ring plug 107 will also move accordingly;
[0075] When the quartz shell 101 is heated, the gas inside it will expand due to the heat. As the push rod 108 moves, the push plate 605 is pushed. Under the guidance of the spiral conductor 604, the push plate 605 will rotate while moving. Then the elastic expansion member 606 will shrink and drive the plug plate 607 to rotate. When the through hole 608 coincides with the corresponding cone tube 603, the high-pressure gas can quickly pass through the porous shell 601 and the multiple porous plates 602. In the process of the airflow passing through each cone tube 603, it will be cooled at the same time and finally discharged from the exhaust pipe 112.
[0076] In addition, when the handle part 2 is subjected to the shaking caused by the equipment, the quartz shell 101 and the internal electric column 5 will be horizontally offset, and the corresponding potting colloid 1 701 and potting colloid 3 801 will absorb the vibration from the horizontal direction, and the live tube 1 7 and the live tube 2 8 will be vertically offset, and the corresponding potting colloid 2 703 and potting colloid 4 803 will absorb the vibration from the vertical direction.
[0077] The above is only a preferred embodiment of the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the art unless otherwise specified and limited.
Claims
1. A platinum resistance temperature sensor detection device, comprising a detection part (1), a machine handle part (2) and a data line (3), wherein the detection part (1) is connected to one end of the machine handle part (2) and is used to contact a heat source, and the data line (3) is connected to the other end of the machine handle part (2) and is used to complete signal transmission, characterized in that: The detection part (1) comprises a quartz shell (101) located at the outermost side, an inner insulating rod (103) is fixedly arranged inside the end of the quartz shell (101), a copper inner shell (102) is fittedly arranged on the inner wall of the quartz shell (101) and located outside the inner insulating rod (103), and the wall thickness of the part of the quartz shell (101) containing the copper inner shell (102) is half of the wall thickness of the remaining parts; A spiral heat-conducting glue flow channel (104) in a spiral shape is arranged between the outer wall of the inner insulating rod body (103) and the inner wall of the copper inner shell (102), and a platinum resistance wire (4) is arranged in a spirally wound manner on the inner side of the spiral heat-conducting glue flow channel (104), and the interior of the spiral heat-conducting glue flow channel (104) is filled with heat-conducting glue; An annular overflow shell (105) is fixedly arranged at the edge of the top of the quartz housing (101), and the overflow shell (105) is used to collect the heat-conducting adhesive that has expanded due to heat. An overflow inlet (106) is provided at the connection between the overflow shell (105) and the spiral heat-conducting adhesive flow channel (104). An annular ring plug (107) is movably assembled inside the overflow shell (105). A spring (109) is arranged in an annular array on the side of the ring plug (107) facing away from the inner insulating rod body (103). A push rod (108) is connected in an annular array on the side of the ring plug (107) facing away from the inner insulating rod body (103), and the push rod (108) extends out of the overflow shell (105); A fluid heat-conducting adhesive is used as a heat-conducting medium in combination with a copper inner shell (102) to promote convection heat transfer between the platinum resistor and the measured medium; As the push rod (108) moves, the high-pressure gas quickly passes through the multiple groups of cones (603) to reduce the temperature of the hot air flow; A potting compound is selected as a packaging support to absorb vibrations of the handle portion (2) caused by shaking of the device.
2. A platinum resistance temperature sensor detection device according to claim 1, characterized in that: An air passage (110) is provided through the axis of the inner insulating rod body (103), and air holes (111) are provided in an array on the side wall of the inner insulating rod body (103); an exhaust pipe (112) is fixedly connected to the side wall of one end of the quartz housing (101) extending to the inside of the handle portion (2), and the end of the exhaust pipe (112) extends to the outside of the handle portion (2).
3. A platinum resistance temperature sensor detection device according to claim 2, characterized in that: A cooling element (6) is arranged inside the quartz housing (101) at one end close to the handle portion (2), and the cooling element (6) comprises a porous shell (601) and a porous plate (602) arranged in an array. Conical tubes (603) are arranged in an annular array on the surfaces of the porous shell (601) and the porous plate (602) close to the handle portion (2), and the pointed end of the conical tube (603) faces the handle portion (2).
4. A platinum resistance temperature sensor detection device according to claim 3, characterized in that: The inner wall of the porous shell (601) is provided with a spiral conductor (604) in a circular array, the porous shell (601) is internally movably assembled with a push plate (605), and the outer wall of the push plate (605) is provided with a spiral groove for fitting with the spiral conductor (604), the surface of the push plate (605) close to the handle part (2) is connected with an elastic telescopic member (606) in a circular array, and the ends of the elastic telescopic member (606) are commonly connected with a plug plate (607) for controlling the gas to pass through the porous shell (601), and the surface of the plug plate (607) is provided with a conical tube (603) in a circular array, and when the through hole (608) coincides with the corresponding conical tube (603), the gas can pass through the porous shell (601).
5. A platinum resistance temperature sensor detection device according to claim 4, characterized in that: An electrical connection body (401) electrically connected to the platinum resistance wire (4) is provided at the center of the circle at the top of the inner insulating rod (103); one end of the quartz shell (101) extending to the inside of the handle portion (2) is fixedly connected to an internal electrical post (5); and both ends of the internal electrical post (5) are electrically connected to the data line (3) and the electrical connection body (401), respectively.
6. A platinum resistance temperature sensor detection device according to claim 5, characterized in that: An extension ring body (113) is integrally provided on the outer wall of one end of the quartz shell (101) extending to the interior of the handle portion (2); a live tube (7) is provided at the connection between the quartz shell (101) and the handle portion (2); a filling groove (201) is symmetrically provided on the inner wall at the connection between the handle portion (2) and the quartz shell (101); the extension ring body (113) is embedded in the interior of the live tube (7), and the interior of the live tube (7) is filled with a potting colloid (701); and vertical ring bodies (702) are symmetrically integrally provided on the surfaces of both sides of the live tube (7); the vertical ring bodies (702) are embedded in the interior of the corresponding filling groove (201), and the interior of the filling groove (201) is filled with a potting colloid (703).
7. A platinum resistance temperature sensor detection device according to claim 6, characterized in that: The outer wall of one end of the internal electric column (5) is integrally provided with an extension ring body 2 (501), the connection between the handle part (2) and one end of the internal electric column (5) is provided with a live tube 2 (8), the inner wall of the connection between the handle part (2) and the internal electric column (5) is symmetrically provided with a filling groove 2 (202), the extension ring body 2 (501) is embedded in the inside of the live tube 2 (8), and the inside of the live tube 2 (8) is filled with a potting colloid 3 (801), and the surfaces of both sides of the live tube 2 (8) are symmetrically integrally provided with vertical ring bodies 2 (802), the vertical ring bodies 2 (802) are embedded in the inside of the corresponding filling groove 2 (202), and the inside of the filling groove 2 (202) is filled with a potting colloid 4 (803).
Citation Information
Patent Citations
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