Display panel and spliced display module

Abstract

The application provides a display panel and a spliced display module. The display panel comprises a substrate, a transparent cover plate, a filling part and a plurality of light emitting chips. The plurality of light emitting chips and the filling part are located between the substrate and the transparent cover plate. The filling part comprises a first filling part and a second filling part. The first filling part is located on the side of the light emitting chip away from the substrate. The second filling part is located between two adjacent light emitting chips. The first filling part is transparent or translucent to visible light, and the second filling part is translucent or opaque to visible light. The display panel and the spliced display module provided by the application can not only improve the transmittance of the display panel, but also ensure sufficient black level.

Description

Technical Field

[0001] This invention relates to the field of display technology, specifically to a display panel and a splicing display module. Background Technology

[0002] Currently, mini-LED display panels use potting encapsulation, which results in a thicker encapsulation structure with a higher risk of seam defects. It also has poor rework characteristics, making it difficult to remove the surface encapsulation adhesive.

[0003] Another type of encapsulation uses a film-coated layer. This encapsulation achieves ideal optical performance through a flexible layered design, and the soft adhesive used in this type of encapsulation is easier to remove during rework. In the existing encapsulation layered structure, the black layer is on top. To increase the transmittance of the display module, the transmittance of the black layer needs to be increased, but this also carries the risk of insufficient black levels in dark states, resulting in poor black levels. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a display panel and splicing display module, which can not only improve the transmittance of the display panel, but also ensure sufficient black level.

[0005] To achieve the above objectives, this disclosure provides a display panel including a substrate, a transparent cover plate, a filling portion, and a plurality of light-emitting chips, wherein the plurality of light-emitting chips and the filling portion are all located between the substrate and the transparent cover plate; the filling portion includes a first filling portion and a second filling portion, wherein the first filling portion is located on the side of the light-emitting chip facing away from the substrate; and the second filling portion is located between two adjacent light-emitting chips;

[0006] The first filling portion is transparent or translucent to visible light, and the second filling portion is translucent or opaque to visible light.

[0007] In some embodiments, the substrate includes a driving circuit and a pad, and the light-emitting chip includes pins, which are fixedly connected to the pads.

[0008] The driving circuit provides a driving signal to the light-emitting chip through the pads.

[0009] In some embodiments, the first filling portion is disposed in contact with the second filling portion;

[0010] The second filling portion contacts the transparent cover plate and the substrate respectively; the first filling portion contacts the light-emitting chip and the transparent cover plate respectively.

[0011] In some embodiments, the orthographic projection of the first filling portion onto the plane of the transparent cover plate covers the center of the orthographic projection of the light-emitting area of ​​the light-emitting chip onto the plane of the transparent cover plate.

[0012] In some embodiments, the orthographic projection of the first filling portion onto the plane of the transparent cover plate covers the orthographic projection of the light-emitting area of ​​the light-emitting chip onto the plane of the transparent cover plate.

[0013] In some embodiments, the second filling portion includes a matrix and a light-absorbing material mixed in the matrix, the light-absorbing material including at least one of light-absorbing particles and light-absorbing dyes.

[0014] In some embodiments, the second filling portion further includes scattering particles mixed in the matrix.

[0015] In some embodiments, the matrix is ​​an ultraviolet-cured product or a thermosetting product.

[0016] In some embodiments, the first filling portion and the second filling portion are made of the same material.

[0017] In some embodiments, the permeability of the first filling portion is in the range of 45% to 80%;

[0018] The permeability of the second filling portion is in the range of 10% to 20%.

[0019] In some embodiments, the thickness of the first filling portion is in the range of 20 μm or greater.

[0020] In some embodiments, the first filling portion is transparent to visible light;

[0021] The light-emitting chips are arranged in a one-to-one correspondence with the first filling portions, and the volume V of the first filling portion corresponding to each light-emitting chip satisfies:

[0022] V = k × S × H1;

[0023] Wherein, S is the area of ​​the light-emitting region of one of the light-emitting chips; H1 is the thickness of the first filling part, the value of H1 is greater than or equal to 20 μm, and k is greater than or equal to 0.5 and less than or equal to 1.5.

[0024] In some embodiments, all of the plurality of light-emitting chips are blue light-emitting chips;

[0025] The first filling portion includes a first sub-filling portion, a second sub-filling portion, and a third sub-filling portion;

[0026] The first sub-filling portion includes a first color-transfer material that converts blue light into red light; the second sub-filling portion includes a second color-transfer material that converts blue light into green light; and the third sub-filling portion is configured to transmit blue light.

[0027] In some embodiments, the filling portion further includes a third filling portion disposed around the light-emitting chip;

[0028] The third filling portion is located between the second filling portion and the light-emitting chip;

[0029] The third filling portion is respectively in contact with the first filling portion, the second filling portion, and the light-emitting chip;

[0030] The first filling portion is made of the same material as the third filling portion.

[0031] In some embodiments, the plurality of light-emitting chips are separated by the second filling portion, and the light-emitting chips are in direct contact with the second filling portion.

[0032] In some embodiments, the plurality of light-emitting chips include a blue light chip, a green light chip, and a red light chip;

[0033] The light-emitting chip is a mini-LED chip or a micro-LED chip.

[0034] As another technical solution, the present invention also provides a splicing display module, including multiple display panels provided by the present invention, wherein the multiple display panels are arranged in an array. Attached Figure Description

[0035] Figure 1 This is a partial cross-sectional view of a display panel related to the technology.

[0036] Figure 2 This is a partial cross-sectional view of a display panel provided in an embodiment of the present invention;

[0037] Figure 3 This is a process diagram of the display panel during the pressing process provided in an embodiment of the present invention;

[0038] Figure 4 Another partial cross-sectional view of the display panel provided in an embodiment of the present invention;

[0039] Figure 5 This is another partial cross-sectional view of the display panel provided in an embodiment of the present invention. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0041] The shapes and sizes of the components in the accompanying drawings do not reflect actual proportions and are intended only to facilitate understanding of the embodiments of the present invention.

[0042] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0043] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of the areas of an element, but are not intended to be limiting.

[0044] Figure 1 For a partial cross-sectional view of the display panel of the related technology, please refer to... Figure 1The display panel includes a transparent cover plate 12 and a substrate 11, and a plurality of light-emitting chips 13 and an encapsulation stack 14 disposed between the two and arranged sequentially in a direction away from the substrate 11. The plurality of light-emitting chips 13 include blue light-emitting chips, green light-emitting chips, and red light-emitting chips, and are arranged at intervals. The encapsulation stack 14 includes a diffusion adhesive layer 141, a transparent adhesive layer 142, and a black adhesive layer 143 arranged sequentially in a direction away from the substrate 11. The matrix of the black adhesive layer 143 contains black particles or a black dye; the matrix of the diffusion adhesive layer 141 contains white particles and transparent particles; the transparent adhesive layer 142 is used to compensate for its thickness, ensuring that the plurality of light-emitting chips 13 are not compressed. However, to increase the transmittance of the display panel, the transmittance of the black adhesive layer 143 needs to be increased, but this also carries the risk of insufficient blackness in dark states, resulting in a poor black level.

[0045] To address the aforementioned problems, embodiments of the present invention provide a display panel that not only improves the transmittance of the display panel but also ensures sufficient black levels. Please refer to [link / reference]. Figure 1 The display panel includes a substrate 21, a transparent cover plate 22, a filling portion 24, and multiple light-emitting chips 23. In some embodiments, the transparent cover plate 22 is, for example, a transparent polyethylene terephthalate (PET) material, which can be formed into an integral film with the filling material of the filling portion 24 before pressing. The filling material is located on the surface of the transparent cover plate 22 facing the substrate 21. During vacuum pressing, the entire cavity for the pressing process is first evacuated, and then air is introduced into the side of the transparent cover plate 22 away from the substrate 21 in the cavity to create a pressure difference between the two sides of the transparent cover plate 22. Using this pressure difference, the integral film formed by the transparent cover plate 22 and the filling material can be pressed onto the substrate 21 (on which multiple light-emitting chips 23 have been installed), thereby pressing the filling material between the transparent cover plate 22 and the substrate 21. Finally, after curing and other processes, the filling portion 24 is formed.

[0046] It should be noted that the transparent cover plate 22 refers to a cover plate that is transparent to the visible light band.

[0047] In some embodiments, the transparent cover 22 is a rigid cover, for example, made of glass.

[0048] In some embodiments, the transparent cover 22 is a flexible cover, for example, made of PET film.

[0049] In some embodiments, the substrate 21 may include a driving circuit and pads, wherein the light-emitting chip 23 includes pins that are fixedly connected to the pads; the driving circuit provides driving signals to the light-emitting chip 23 through the pads. The driving circuit may be an active driving circuit or a passive driving circuit.

[0050] Multiple light-emitting chips 23 and filling portions 24 are located between the substrate 21 and the transparent cover plate 22. The filling portion 24 includes a first filling portion 241 and a second filling portion 242. The first filling portion 241 is located on the side of the light-emitting chip 23 facing away from the substrate 21. The second filling portion 242 is located between two adjacent light-emitting chips 23. The first filling portion 241 is transparent or translucent to visible light, and the second filling portion 242 is translucent or opaque to visible light. It should be noted that, in this embodiment of the invention, the transparent or translucent state of the first filling portion 241 and the translucent or opaque state of the second filling portion 242 can be set according to specific circumstances. That is, different states correspond to different transmittances required in practice. Specifically, "transparent" refers to a state where the transmittance is greater than a first preset percentage, such as 85%, 90%, or 95%, etc., and "translucent" refers to a state where the transmittance is less than or equal to the first preset percentage and greater than or equal to a second preset percentage, such as 5%, 10%, or 15%, etc. "Opaque" refers to a state where the transmittance is less than the second preset percentage.

[0051] The display panel provided in this embodiment of the invention uses the above-mentioned filling part 24 to replace the encapsulation stack 14 (i.e., diffusion adhesive layer 141, transparent adhesive layer 142 and black adhesive layer 143) in the related art. This not only simplifies the structure, but the filling part 24 can also realize multiple functions of the encapsulation stack 14, which can improve the transmittance of the display panel and ensure sufficient black level. Specifically, by using the first filling portion 241 located on the side of the light-emitting chip 23 facing away from the substrate 21, the light-emitting chip 23 can be prevented from being deformed by compression. Furthermore, since the first filling portion 241 is transparent or translucent to visible light, and its thickness between the transparent cover plate 22 and the light-emitting chip 23 is smaller than that of the second filling portion 242, and a smaller thickness results in higher transmittance, the transparent or translucent first filling portion 241 has high transmittance. Simultaneously, by using the second filling portion 242 located between two adjacent light-emitting chips 23, which is translucent or opaque to visible light and has a greater thickness than the first filling portion 241, the transmittance of the second filling portion 242 is lower than that of the first filling portion 241, thus ensuring a sufficient black level. Therefore, by combining the first filling portion 241 and the second filling portion 242, not only can the transmittance of the display panel be improved, but a sufficient black level can also be ensured.

[0052] In some embodiments, the first filling portion 241 and the second filling portion 242 are in contact. In this case, the thickness of the second filling portion 242 is greater than the thickness of the light-emitting chip 23, so that the first filling portion 241 and the second filling portion 242 are in contact. In this way, each light-emitting chip 23 can be completely covered by the first filling portion 241 and the second filling portion 242, thereby better protecting the light-emitting chip 23 and avoiding compression damage caused by the light-emitting chip 23 contacting the transparent cover plate 22 after pressing.

[0053] In some embodiments, with the first filling portion 241 and the second filling portion 242 in contact, the second filling portion 242 contacts the transparent cover plate 22 and the substrate 21 respectively; the first filling portion 241 contacts the light-emitting chip 23 and the transparent cover plate 22 respectively. In this case, as Figure 2 As shown, the thickness H2 of the second filling portion 242 is equal to or approximately equal to the sum of the thickness of the light-emitting chip 23 and the thickness H1 of the first filling portion 241. In this way, the first filling portion 241 and the second filling portion 242 can completely fill the space between the transparent cover plate 22 and the substrate 21, thereby better protecting the light-emitting chip 23. In a specific embodiment, the thickness of the light-emitting chip 23 is 80 μm, the thickness H2 of the second filling portion 242 is 100 μm, and the thickness H1 of the first filling portion 241 is 20 μm.

[0054] In some embodiments, multiple light-emitting chips 23 are separated by a second filling portion 242, and the light-emitting chips 23 are in direct contact with the second filling portion 242. In this way, the second filling portion 242 can protect the light-emitting chips 23 on the outer periphery, avoiding squeezing damage caused by the light-emitting chips 23 coming into contact with the transparent cover plate 22 after pressing.

[0055] In some embodiments, the orthographic projection of the first filling portion 241 onto the plane of the transparent cover plate 22 covers the center of the orthographic projection of the light-emitting area of ​​the light-emitting chip 23 onto the plane of the transparent cover plate 22. The first filling portion 241 can partially cover the light-emitting area of ​​the light-emitting chip 23, that is, cover the center of the light-emitting area, so that the light emission effect of the display panel is better.

[0056] In some embodiments, the orthographic projection of the first filling portion 241 onto the plane of the transparent cover plate 22 covers the orthographic projection of the light-emitting area of ​​the light-emitting chip 23 onto the plane of the transparent cover plate 22. The first filling portion 241 can completely cover the light-emitting area of ​​the light-emitting chip 23.

[0057] In some embodiments, the second filler portion 242 includes a matrix and a light-absorbing material mixed in the matrix. The light-absorbing material includes at least one of light-absorbing particles and a light-absorbing dye. The light-absorbing material in the second filler portion 242 ensures that the black level of the second filler portion 242 meets the requirements. The matrix includes, for example, acrylic resins, epoxy resins, etc. The light-absorbing particles include, for example, carbon black particles (with a particle size greater than or equal to 400 nm and less than or equal to 600 nm, for example, 500 nm). The light-absorbing dye includes, for example, black organic pigments.

[0058] In addition to the matrix and light-absorbing material mixed in the matrix, the second filling portion 242, in some embodiments, also includes scattering particles mixed in the matrix. The scattering particles in the matrix of the second filling portion 242 can scatter light to produce a uniform light emission effect. The scattering particles include, for example, silica (SiO2) particles, transparent polystyrene (PS) particles, transparent polymethyl methacrylate (PMMA) particles, etc., and the particle size can be greater than or equal to 4 μm and less than or equal to 6 μm, for example, 5 μm. In some embodiments, the mass percentage of the scattering particles is, for example, greater than or equal to 10% and less than or equal to 20%. The aforementioned scattering particles are transparent to prevent the matrix from forming a color other than close to black.

[0059] In some embodiments, the matrix in the second filling section 242, which includes a matrix and a light-absorbing material mixed in the matrix, is an ultraviolet-curable or thermosetting product. Before curing, ultraviolet (UV) particles or thermosetting particles are provided in the matrix of the second filling section 242. After the matrix containing these particles undergoes curing treatment (UV irradiation or heat treatment), it is cured, thereby hardening the entire matrix of the second filling section 242, eliminating uncured portions, and reducing creep by approximately 50%, thus significantly reducing adhesion during assembly and disassembly. The aforementioned curing treatment is a process in which a substance (the matrix containing UV particles or thermosetting particles) transforms from a low-molecular-weight substance to a high-molecular-weight substance (the substance generated after curing). Taking UV curing as an example, its principle can be summarized as follows: UV particles are photosensitizing; under UV light irradiation, they photoinitiate the formation of excited ecological molecules, which decompose into free radicals or ions, causing unsaturated organic matter to undergo polymerization, grafting, cross-linking, and other chemical reactions to achieve curing.

[0060] In some embodiments, such as Figure 2As shown, the first filling portion 241 and the second filling portion 242 are made of the same material. That is, the first filling portion 241 includes the aforementioned matrix and a light-absorbing material mixed in the matrix. Since the thickness H1 of the first filling portion 241 is smaller than the thickness H2 of the second filling portion 242, and the smaller the thickness, the higher the transmittance, the first filling portion 241 has a higher transmittance than the second filling portion 242, thereby still improving the transmittance of the display panel. In practical applications, the thickness H1 of the first filling portion 241 can be minimized as much as possible to maximize its transmittance, while avoiding squeezing damage caused by the contact between the light-emitting chip 23 and the transparent cover plate 22 after lamination. Based on this, in some embodiments, the first filling portion 241 also includes scattering particles mixed in the matrix, which can scatter light to produce a uniform light emission effect. In some embodiments, the first filling portion 241 also includes ultraviolet particles or thermosetting particles mixed in the matrix, which can harden the matrix of the first filling portion 241 as a whole, thereby greatly reducing adhesion during disassembly and assembly.

[0061] When the materials of the first filling portion 241 and the second filling portion 242 are the same, the first filling portion 241 and the second filling portion 242 can be manufactured simultaneously by pressing. That is, the filling materials of the first filling portion 241 and the second filling portion 242 are formed into an integral film with the transparent cover plate 22 on the side facing the substrate 21. During vacuum pressing, the entire cavity for the pressing process is first evacuated, and then air is introduced into the side of the transparent cover plate 22 away from the substrate 21 in the cavity to create a pressure difference between the two sides of the transparent cover plate 22. Using this pressure difference, the integral film formed by the transparent cover plate 22 and the filling material can be pressed onto the substrate 21 (on which multiple light-emitting chips 23 have been installed). The vacuum pressing process is as follows: Figure 3 As shown, the filling material on the surface of the light-emitting chip 23 facing away from the substrate 21 overflows between two adjacent light-emitting chips 23 due to compression. After pressing, the remaining filling material on the surface of the light-emitting chip 23 facing away from the substrate 21 forms the first filling portion 241, and the second filling portion 242 is formed between two adjacent light-emitting chips 23.

[0062] In other embodiments, such as Figure 4As shown, the materials of the first filling portion 241 and the second filling portion 242 can also be different. For example, the first filling portion 241 can be made of a filling material that is transparent to visible light, and the second filling portion 242 can be made of a filling material that is semi-transparent or opaque to visible light. In this case, the filling material of the first filling portion 241 (e.g., a filling material that is transparent to visible light) can be applied to the surface of the light-emitting chip 23 on the side away from the substrate 21 by dispensing adhesive. Then, the filling material of the second filling portion 242 (e.g., a filling material that is semi-transparent or opaque to visible light) and the transparent cover plate 22 can be formed into an integral film by vacuum pressing, and then pressed onto the substrate 21 (on which multiple light-emitting chips 23 have been mounted). Since the filling material of the first filling portion 241 has been applied to the surface of the light-emitting chip 23 on the side away from the substrate 21, during pressing, the filling material will squeeze and expel all the filling material of the second filling portion 242 to both sides of the light-emitting chip 23 to form the second filling portion 242.

[0063] In some embodiments, the transmittance of the first filling portion 241 is in the range of 45% or higher. Further, when the materials of the first filling portion 241 and the second filling portion 242 are the same, the transmittance of the first filling portion 241 is in the range of 45% to 80%, and the transmittance of the second filling portion 242 is in the range of 10% to 20%. When the materials of the first filling portion 241 and the second filling portion 242 are different, and the first filling portion 241 is transparent to visible light, while the second filling portion 242 is translucent or opaque to visible light, the transmittance of the first filling portion 241 is in the range of 80% or higher, and the transmittance of the second filling portion 242 is in the range of 10% to 20%.

[0064] By employing the aforementioned range, the first filling portion 241 and the second filling portion 242 each achieve an overall transmittance of greater than 50% for the filling portion 24 and a lightness value (called L value, used to characterize the black level; the lower the L value, the darker the black) of less than 31.5 for the Lab color system of the filling portion 24. This not only improves the transmittance of the display panel but also ensures a sufficient black level.

[0065] In some embodiments, the thickness H1 of the first filling portion 241 is in the range of greater than or equal to 20 μm. The setting of the thickness H1 of the first filling portion 241 takes into account the height tolerance of the light-emitting chip (e.g., ±15 μm) and the thickness tolerance of the first filling portion 241 (±5 μm), which can ensure that the light-emitting chip 23 does not come into contact with the transparent cover plate 22 after pressing, avoid the light-emitting chip 23 from being squeezed and damaged, and at the same time improve the transmittance, for example, to more than 50%.

[0066] Specifically, the thickness H1 of the first filling portion 241 can be 20 μm, and its transmittance can reach 60%. The thickness H2 of the second filling portion 242 can be 80 μm, and its transmittance is 10%. The overall transmittance of the filling portion 24 can reach about 55%, and the lightness value (called L value, used to characterize the black level, the lower the L value, the darker) of the Lab color system of the filling portion 24 is about 30, which is comparable to the L value of the encapsulation stack used in related technologies. Therefore, not only can the transmittance of the display panel be improved, but also sufficient black level can be guaranteed.

[0067] In some embodiments, the first filling portion 241 is transparent to visible light. The transparent first filling portion 241 is, for example, a transparent adhesive that does not contain scattering particles, so that the light energy of the light-emitting chip 23 can be released to the maximum extent, so that the transmittance reaches more than 80%; at the same time, the first filling portion 241 can also protect the light-emitting chip 23 and prevent the light-emitting chip 23 from contacting the transparent cover plate 22 and causing crushing.

[0068] In some embodiments, the light-emitting chips 23 are arranged in a one-to-one correspondence with the first filling portions 241, and the volume V of the first filling portion 241 corresponding to each light-emitting chip 23 satisfies:

[0069] V = k × S × H1;

[0070] Where S is the area of ​​the light-emitting region of a light-emitting chip 23; H1 is the thickness of the first filling part 241, which is equal to the difference between the thickness H2 of the second filling part 242 and the height of the light-emitting chip 23. The value of H1 is greater than or equal to 20 μm, and k is greater than or equal to 0.5 and less than or equal to 1.5.

[0071] In other embodiments, such as Figure 5As shown, the filling portion 24 further includes a third filling portion 243 surrounding the light-emitting chip 23. This third filling portion 243 is located between the second filling portion 242 and the light-emitting chip 23, and is in contact with the first filling portion 241, the second filling portion 242, and the light-emitting chip 23, respectively. The third filling portion 243 protects the light-emitting chip 23 around its periphery. In some embodiments, the first filling portion 241 and the third filling portion 243 are made of the same material. In this case, the first filling portion 241, the second filling portion 242, and the third filling portion 243 can be manufactured by dispensing and lamination. That is, firstly, a certain amount of filling material of the first filling portion 241 and the third filling portion 243 is dispensed onto the surface of the light-emitting chip 23 on the side facing away from the substrate 21 by dispensing. Then, the filling material of the second filling portion 242 and the transparent cover plate 22 are formed into an integral film by vacuum lamination and pressed onto the substrate 21 (on which multiple light-emitting chips 23 have been mounted). The surface already has filler material with the first filler portion 241 and the third filler portion 243 applied. During lamination, this filler material will squeeze and expel all the filler material of the second filler portion 242 to both sides of the light-emitting chip 23, forming the second filler portion 242. At the same time, a portion of the filler material of the first filler portion 241 and the third filler portion 243 will also be squeezed and expelled to both sides of the light-emitting chip 23, forming the aforementioned third filler portion 243 around the light-emitting chip 23. The remaining filler material on the surface of the light-emitting chip 23 facing away from the substrate 21 forms the aforementioned first filler portion 241. Therefore, the manufacturing method of the first filler portion 241, the second filler portion 242, and the third filler portion 243 is simple, and compared to simply applying the filler material to the surface of the light-emitting chip 23 facing away from the substrate 21, the dispensing precision requirement is reduced, thereby reducing the manufacturing difficulty. It is easy to understand that when only the filling material of the first filling portion 241 is dotted on the surface of the light-emitting chip 23 on the side away from the substrate 21, due to the small amount used, only the filling material of the second filling portion 242 is squeezed and expelled to both sides of the light-emitting chip 23 during pressing. When both the first filling portion 241 and the third filling portion 243 are dotted on the surface of the light-emitting chip 23 on the side away from the substrate 21, a larger amount of filling material is used so that during pressing, a portion of the filling material of the first filling portion 241 and the third filling portion 243 is also squeezed and expelled to both sides of the light-emitting chip 23, forming the aforementioned third filling portion 243 around the light-emitting chip 23.

[0072] In some embodiments, the plurality of light-emitting chips 23 include a blue light chip 23a, a green light chip 23b, and a red light chip 23c.

[0073] In other embodiments, all of the multiple light-emitting chips 23 are blue light chips. Based on this, the first filling portion 241 includes a first sub-filling portion, a second sub-filling portion, and a third sub-filling portion; wherein, the first sub-filling portion includes a first color-converting material, such as red quantum dots, which converts blue light into red light; the second sub-filling portion includes a second color-converting material, such as green quantum dots, which converts blue light into green light; the third sub-filling portion is configured to transmit blue light, for example, as a transparent resin (i.e., the wavelength of blue light does not need to be adjusted) or blue quantum dots. When the third sub-filling portion is a blue quantum dot, it can convert the first wavelength of blue light into the second wavelength of blue light.

[0074] In some embodiments, the light-emitting chip 23 is a mini-LED chip or a micro-LED chip.

[0075] In summary, the display panel provided by the embodiments of the present invention, by using the above-mentioned filling portion 24 to replace the encapsulation stack (i.e., diffusion adhesive layer, transparent adhesive layer and black adhesive layer) in the related technology, can not only simplify the structure, but also the filling portion 24 can realize multiple functions of the encapsulation stack, which can improve the transmittance of the display panel and ensure sufficient black level. Specifically, by using the first filling portion 241 located on the side of the light-emitting chip 23 facing away from the substrate 21, the light-emitting chip 23 can be prevented from being deformed by compression. Furthermore, since the first filling portion 241 is transparent or translucent to visible light, and its thickness between the transparent cover plate 22 and the light-emitting chip 23 is smaller than that of the second filling portion 242, and a smaller thickness results in higher transmittance, the transparent or translucent first filling portion 241 has high transmittance. Simultaneously, by using the second filling portion 242 located between two adjacent light-emitting chips 23, which is translucent or opaque to visible light and has a greater thickness than the first filling portion 241, the transmittance of the second filling portion 242 is lower than that of the first filling portion 241, thus ensuring a sufficient black level. Therefore, by combining the first filling portion 241 and the second filling portion 242, not only can the transmittance of the display panel be improved, but a sufficient black level can also be ensured.

[0076] As another technical solution, this embodiment of the invention also provides a splicing display module, including multiple display panels provided in this embodiment of the invention, which are arranged in an array. By using the display panels provided in this embodiment of the invention, the transmittance of the display panels can be improved, and sufficient black levels can be ensured.

[0077] It should be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that, The device includes a substrate, a transparent cover plate, a filling portion, and multiple light-emitting chips, wherein the multiple light-emitting chips and the filling portion are all located between the substrate and the transparent cover plate; the filling portion includes a first filling portion and a second filling portion, wherein the first filling portion is located on the side of the light-emitting chip facing away from the substrate; and the second filling portion is located between two adjacent light-emitting chips. Wherein, the first filling part is transparent to visible light, and the first filling part is a transparent adhesive that does not contain scattering particles; the second filling part is semi-transparent to visible light. The transparent cover is made of glass or PET. The filling portion further includes a third filling portion disposed around the light-emitting chip; The third filling portion is located between the second filling portion and the light-emitting chip; The third filling portion is respectively in contact with the first filling portion, the second filling portion, and the light-emitting chip; The first filling portion and the third filling portion are made of the same material; The third filling part and the first filling part are a continuous integral structure; There is a gap between the third filling portions surrounding the adjacent light-emitting chips, and the gap is filled with the second filling portion; The second filling portion is also located between the first filling portions corresponding to adjacent light-emitting chips.

2. The display panel according to claim 1, characterized in that, The substrate includes a driving circuit and a pad, and the light-emitting chip includes pins, which are fixedly connected to the pads. The driving circuit provides driving signals to the light-emitting chip through the pads.

3. The display panel according to claim 1, characterized in that, The first filling portion and the second filling portion are disposed in contact. The second filling portion contacts the transparent cover plate and the substrate respectively; the first filling portion contacts the light-emitting chip and the transparent cover plate respectively.

4. The display panel according to claim 3, characterized in that, The orthographic projection of the first filling portion onto the plane of the transparent cover plate covers the center of the orthographic projection of the light-emitting area of ​​the light-emitting chip onto the plane of the transparent cover plate.

5. The display panel according to claim 3, characterized in that, The orthographic projection of the first filling portion onto the plane of the transparent cover plate covers the orthographic projection of the light-emitting area of ​​the light-emitting chip onto the plane of the transparent cover plate.

6. The display panel according to any one of claims 1-5, characterized in that, The second filling portion includes a matrix and a light-absorbing material mixed in the matrix, wherein the light-absorbing material includes at least one of light-absorbing particles and light-absorbing dyes.

7. The display panel according to claim 6, characterized in that, The second filling portion also includes scattering particles mixed in the matrix.

8. The display panel according to claim 6, characterized in that, The matrix is ​​an ultraviolet-cured product or a thermosetting product.

9. The display panel according to claim 6, characterized in that, The first filling portion and the second filling portion are made of the same material.

10. The display panel according to claim 9, characterized in that, The transmittance of the first filling portion is in the range of 45% to 80%; The transmittance of the second filling portion is in the range of 10% to 20%.

11. The display panel according to claim 9, characterized in that, The thickness of the first filling portion is greater than or equal to 20 μm.

12. The display panel according to claim 6, characterized in that, The first filling portion is transparent to visible light; The light-emitting chips are arranged in a one-to-one correspondence with the first filling portions, and the volume V of the first filling portion corresponding to each light-emitting chip satisfies: V = k × S × H1; Wherein, S is the area of ​​the light-emitting region of one of the light-emitting chips; H1 is the thickness of the first filling part, the value of H1 is greater than or equal to 20 μm, and k is greater than or equal to 0.5 and less than or equal to 1.

5.

13. The display panel according to claim 6, characterized in that, All of the aforementioned light-emitting chips are blue light-emitting chips; The first filling portion includes a first sub-filling portion, a second sub-filling portion, and a third sub-filling portion; The first sub-filling portion includes a first color-transfer material that converts blue light into red light; the second sub-filling portion includes a second color-transfer material that converts blue light into green light; and the third sub-filling portion is configured to transmit blue light.

14. The display panel according to any one of claims 1-5, characterized in that, The plurality of light-emitting chips include blue light chips, green light chips, and red light chips; The light-emitting chip is a mini-LED chip or a micro-LED chip.

15. A splicing display module, comprising a plurality of display panels as described in any one of claims 1 to 14, wherein the plurality of display panels are arranged in an array.

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