Manufacturing method of glass panel of self-induction induction cooker

Abstract

The invention belongs to the technical field of household appliances, and discloses a manufacturing method of a glass panel of a self-induction induction cooker, which comprises the following steps: printing a circuit on the back surface of a glass substrate, welding a plurality of thermistors to form a temperature measuring circuit, coating an insulating coating and the like. The temperature of all positions of the bottom of the kitchen ware can be effectively detected, so that the induction cooker can conveniently adjust the heating power according to the temperature distribution condition, and the induction cooker has the advantages that the temperature of all positions of the bottom of the kitchen ware can be effectively detected, overheat spots and overlarge temperature difference between different positions of the glass panel are prevented, safety is improved, and the service life is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of household appliances, and in particular to a method for manufacturing a glass panel of a self-induction induction cooker. Background Art

[0002] In order to prevent the water in the cookware from drying up or the uneven bottom of the cookware from causing the local surface temperature of the induction cooker to be too high, existing induction cookers usually set a fixed or retractable thermistor in the middle of the induction cooker coil to detect the temperature of the bottom of the cookware in real time, and adjust the power or automatically shut down according to the detection results.

[0003] However, this solution has some problems. When the bottom of a cookware is concave in the middle, the fixed thermistor cannot contact the bottom of the cookware, making it unable to effectively detect the actual temperature of the bottom of the cookware. Some cookware bottoms are designed with a concave center and a protruding edge. Even if the bottom is designed to be flat, it may become concave in the middle due to being dropped or bumped during use.

[0004] While a retractable thermistor can reliably contact the bottom of cookware, effectively detecting the actual temperature in the middle of the bottom, the temperature of cookware with an uneven bottom where it contacts the induction cooktop is often much higher than where it doesn't. This can lead to "hot spots" in contact with the induction cooktop, significantly increasing the risk of burn-through and damage to the cooktop surface.

[0005] In addition, due to the low cost of glass panels, some induction cookers use glass panels. However, glass panels have the following disadvantages: when the temperature difference between different positions on the glass panel is large, the glass panel will burst; the solution of setting a single thermistor in the existing technology cannot detect the temperature difference between different positions of the glass panel, and thus cannot prevent the occurrence of excessive temperature differences.

[0006] Existing technologies are unable to effectively detect the temperature at various locations on the bottom of cookware, making it difficult to prevent the generation of hot spots and large temperature differences between different locations on the glass panel. This poses a safety hazard and shortens the service life. Therefore, a method for manufacturing a self-sensing induction cooker glass panel is needed to produce a glass panel that can effectively detect the temperature at various locations on the bottom of the cookware. This allows the induction cooker to adjust the heating power based on the temperature distribution, preventing the generation of hot spots and large temperature differences between different locations on the glass panel.

[0007] In view of the above problems, the existing technology is in urgent need of improvement. Summary of the Invention

[0008] The purpose of this application is to provide a method for manufacturing a self-sensing induction cooker glass panel, which can produce a glass panel that can effectively detect the temperature of various locations on the bottom of the cookware.

[0009] The present application provides a method for manufacturing a self-induction induction cooker glass panel, which is used to prepare the glass panel of the induction cooker, comprising the steps of: A1. A conductive material that does not react magnetically to the magnetic field generated by the induction cooker coil of the induction cooker is used to print a circuit on the back of the glass substrate to obtain a printed circuit; the printed circuit is at least partially located in the heating zone of the glass substrate; A2. Soldering thermistors at different locations on the back of the glass substrate in the heating zone to electrically connect the thermistors to the printed circuit to form a temperature measurement circuit for inputting an operating voltage to each thermistor and outputting an output signal of each thermistor; A3. Coating a first insulating coating on the back of the glass substrate to cover the temperature measuring circuit to obtain a semi-finished product; A4. Curing the semi-finished product to obtain a glass panel product.

[0010] By setting thermistors at multiple locations on the back of the glass substrate, the temperature of various locations on the bottom of the cookware can be effectively detected, making it easier for the induction cooker to adjust the heating power according to the temperature distribution. This has the advantages of being able to effectively detect the temperature of various locations on the bottom of the cookware, prevent the generation of hot spots and excessive temperature differences between different locations on the glass panel, and improve safety and service life.

[0011] Preferably, the step A1 further includes the following steps: A00. Print a display pattern on the back side of the glass substrate.

[0012] Printing a display pattern on the back of the glass substrate can create an aesthetically pleasing decorative effect on the glass panel and provide different indicator patterns for buttons and indicators with different functions. By performing these steps before printing the printed circuit, it can be ensured that the display pattern will not be covered by subsequent printed circuits and coatings.

[0013] Preferably, after step A00 and before step A1, the method further includes the following steps: A01. Apply a second insulating coating on the back side of the glass substrate.

[0014] Applying a second insulating coating protects the printed display pattern from subsequent circuit printing and coating processes. It also effectively prevents direct contact between the glass substrate and electrical components, reducing the risk of short circuits and improving overall electrical safety. This insulating coating also provides a smooth, insulating foundation for subsequent circuit printing steps, improving the quality and reliability of the printed circuit.

[0015] Preferably, in both step A01 and step A3, the thermal expansion coefficient after curing is 3.2×10 -5 / ℃-3.8×10 -5 / ℃ high temperature resistant insulating coating is applied to obtain the corresponding insulating coating.

[0016] Preferably, the coating thickness of the second insulating coating layer is 10 μm-15 μm; the coating thickness of the first insulating coating layer is 3 μm-5 μm.

[0017] Optionally, in step A1, aluminum or copper material is used to print the printed circuit.

[0018] Optionally, in step A1, the printed circuit is printed using a polyimide material.

[0019] Preferably, in step A2, the heating area on the back side of the glass substrate is divided into a plurality of self-sensing areas, and at least one thermistor is soldered in each of the self-sensing areas.

[0020] Preferably, the self-sensing zone includes a first self-sensing zone located in the middle of the heating zone and a plurality of second self-sensing zones evenly arranged around the first self-sensing zone.

[0021] Beneficial effects: The manufacturing method of the self-inductive induction cooker glass panel provided in the present application includes the steps of printing a circuit on the back of a glass substrate, soldering multiple thermistors to form a temperature measurement circuit, and applying an insulating coating. By arranging thermistors at multiple positions on the back of the glass substrate, the temperature of various parts of the bottom of the cookware can be effectively detected, thereby facilitating the induction cooker to adjust the heating power according to the temperature distribution. It has the advantages of being able to effectively detect the temperature of various parts of the bottom of the cookware, prevent the generation of hot spots and excessive temperature differences between different positions of the glass panel, and improve safety and service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a flow chart of a method for manufacturing a self-induction induction cooker glass panel provided in an embodiment of the present application.

[0023] Figure 2 This is a flow chart of another method for manufacturing a self-induction induction cooker glass panel provided in an embodiment of the present application.

[0024] Figure 3 This is a bottom view of the glass substrate after the display pattern is printed.

[0025] Figure 4 Schematic diagram of the distribution of thermistors and printed circuits.

[0026] Figure 5 4 is a cross-sectional view of the glass panel of the self-induction induction cooker corresponding to step A01.

[0027] Figure 6 4 is a cross-sectional view of the glass panel of the self-induction induction cooker corresponding to step A1.

[0028] Figure 7 4 is a cross-sectional view of the self-induction induction cooker glass panel corresponding to step A2.

[0029] Figure 8 4 is a cross-sectional view of the self-induction induction cooker glass panel corresponding to step A3.

[0030] Explanation of reference numerals: 1. glass substrate; 101. first self-sensing region; 102. second self-sensing region; 2. printed circuit; 3. thermistor; 4. temperature measuring circuit; 5. first insulating coating; 7. display pattern; 8. second insulating coating. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work fall within the scope of protection of the present application.

[0032] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance.

[0033] Temperature control is a key technical challenge in induction cooker applications. Existing temperature detection methods typically rely on a single thermistor positioned at the center of the cooker coil. However, this approach has serious limitations. When using cookware with uneven bottoms, the fixed thermistor may not effectively contact the bottom, resulting in inaccurate temperature detection. Even with a thermistor that can be extended and retracted, it cannot fully reflect the temperature distribution under the cookware. This single-point temperature measurement method makes it difficult to detect the formation of local hot spots, increasing the risk of burn-through of the cookware bottom and damage to the induction cooker surface. Furthermore, for induction cookers with glass panels, single-point temperature measurement cannot effectively monitor temperature differences between different positions on the panel, potentially causing the glass panel to crack due to temperature stress. These issues seriously affect the safety, cooking performance, and service life of the induction cooker.

[0034] If these technical problems are not resolved, a series of serious consequences will occur. The formation of local hot spots may cause food to overcook or burn in certain areas, affecting the cooking quality and taste. Continuous local overheating may damage the cookware or even burn through the bottom of the cookware. For the induction cooker itself, the accumulation of temperature stress on the glass panel may cause the panel to suddenly break, not only causing property damage but also personal injury to the user. Due to imprecise temperature control, the energy efficiency of the induction cooker will also be affected, resulting in unnecessary energy waste. In the long run, these problems will significantly shorten the service life of the induction cooker and cookware, and increase replacement costs for users. Therefore, it is particularly important to develop a new method for manufacturing induction cooker glass panels that can comprehensively and accurately detect the temperature distribution at the bottom of the cookware. This improvement will not only improve cooking safety and effectiveness, but also extend the life of the equipment and enhance the user experience.

[0035] To this end, the present application proposes a method for manufacturing a self-sensing induction cooker glass panel, which is used to prepare a glass panel that can effectively detect the temperature at various locations on the bottom of the cookware.

[0036] Please refer to Figure 1 In some embodiments of the present application, a method for manufacturing a self-induction induction cooker glass panel is provided, which is used to prepare the glass panel of the induction cooker, comprising the steps of: A1. Printing a circuit on the backside of a glass substrate 1 using a conductive material that does not react magnetically to the magnetic field generated by the induction cooker coil of an induction cooker to form a printed circuit 2. Printed circuit 2 is at least partially located within the heating zone of glass substrate 1 (i.e., partially or entirely located within the heating zone of glass substrate 1). A2. Thermistors 3 are soldered to multiple locations in the heated area on the back side of glass substrate 1 . These thermistors 3 are electrically connected to printed circuit 2 , forming a temperature measurement circuit 4 for inputting an operating voltage to each thermistor 3 and outputting an output signal (which may be a current signal or a voltage signal) from each thermistor 3 . A3. A first insulating coating 5 is applied on the back of the glass substrate 1 to cover the temperature measuring circuit 4 to obtain a semi-finished product; A4. After curing the semi-finished product, the glass panel product is obtained.

[0037] By placing thermistors 3 at multiple locations on the back of the glass substrate 1, the temperature at various locations on the bottom of the cookware can be effectively detected, allowing the induction cooker to adjust the heating power based on the temperature distribution. This effectively detects the temperature at various locations on the bottom of the cookware, preventing the generation of hot spots and excessive temperature differences between different locations on the glass panel. (For example, if the induction cooker detects excessively high temperatures at at least one location on the glass panel or a high maximum temperature deviation between different locations, it reduces the heating power, thereby avoiding the generation of hot spots and excessive temperature differences.) This improves safety and service life. The first insulating coating 5 covers the temperature measurement circuit 4, providing electrical isolation and protection.

[0038] Among them, since the printed circuit 2 does not react magnetically with the magnetic field generated by the induction cooker coil, the interference of the magnetic field of the induction cooker coil on the printed circuit 2 can be effectively reduced, thereby ensuring the stability and accuracy of the temperature measuring circuit 4; and the accuracy can be improved. Since the influence of the external magnetic field is reduced, the temperature measuring circuit 4 can more accurately reflect the temperature changes of the thermistor 3, thereby improving the accuracy of temperature measurement; it can also enhance compatibility. This design enables the self-inductive induction cooker glass panel to work normally in a strong magnetic field environment, thereby enhancing the applicability and compatibility of the product.

[0039] In some preferred embodiments, see Figure 2 , before step A1, the following steps are also included: A00. Print the display pattern 7 on the back side of the glass substrate 1.

[0040] Printing the display pattern 7 on the back of the glass substrate 1 can form an aesthetically pleasing decorative effect on the glass panel and provide different indication patterns for buttons and indicator lights with different functions (such as Figure 3 By performing these steps before printing the printed circuit 2, it is possible to ensure that the display pattern 7 will not be covered by the subsequent printed circuit 2 and coating.

[0041] Various methods can be used to print the display pattern 7. For example, screen printing can be used to transfer a designed pattern onto the back of the glass substrate 1 via a screen. Alternatively, inkjet printing can be used to directly print a digitized pattern onto the back of the glass substrate 1. Furthermore, thermal transfer technology can be considered, where a prefabricated pattern film is transferred to the back of the glass substrate 1 at high temperature. The specific shape and position of the display pattern 7 can be adjusted according to actual needs.

[0042] Further, after step A00 and before step A1 , A01 . apply a second insulating coating 8 on the back surface of the glass substrate 1 .

[0043] Applying the second insulating coating 8 protects the printed display pattern 7 from being affected by subsequent circuit printing and coating processes. It also effectively prevents direct contact between the glass substrate 1 and electrical components, reducing the risk of short circuits and improving overall electrical safety. Furthermore, applying the second insulating coating 8 provides a smooth, insulating foundation for subsequent circuit printing steps, thereby improving the quality and reliability of the printed circuit 2.

[0044] In step A01, the second insulating coating 8 can be applied using insulating materials such as epoxy resin, polyurethane, or silicone resin. These materials have excellent insulation properties and heat resistance. The color of the second insulating coating 8 can be adjusted according to actual needs, for example, black, but is not limited to this. The second insulating coating 8 can be applied using techniques such as blade coating, spin coating, or spray coating, and the coating thickness can be adjusted according to actual needs.

[0045] The structure of the self-induction induction cooker glass panel after completing steps A01 to A3 is as follows: Figure 5-Figure 8 shown.

[0046] In one possible embodiment, in both step A01 and step A3, the thermal expansion coefficient after curing is 3.2×10 -5 / ℃-3.8×10 -5 / ℃ high temperature resistant insulating coating is applied to obtain the corresponding insulating coating.

[0047] First, the thermal expansion coefficient of the second insulating coating 8 after curing is 3.2×10 -5 / ℃-3.8×10 -5 / °C, which is close to the thermal expansion coefficient of the glass substrate 1. This helps reduce thermal stress between the second insulating coating 8 and the glass substrate 1, reducing the risk of the second insulating coating 8 peeling off. Secondly, the material of the first insulating coating 5 is selected to be a coating with the same properties as the material of the second insulating coating 8, ensuring the consistency of performance between the layers of coating. This consistency is crucial to the stability of the entire structure. When the induction cooker is operating, the glass panel will experience repeated thermal cycles. If different layers of coating have different thermal expansion characteristics, it may lead to the accumulation of interlayer stress, eventually causing the coating to crack or peel. By using materials with consistent thermal expansion coefficients, this risk can be significantly reduced.

[0048] In order to meet the above thermal expansion coefficient requirements, polymer materials such as epoxy resin, silicone resin or polyimide can be selected as the matrix, and appropriate amounts of inorganic fillers such as aluminum oxide and silicon oxide can be added to adjust the thermal expansion coefficient. The selection and proportion of these materials need to be accurately calculated and experimentally verified to ensure that the thermal expansion coefficient of the final cured coating falls within 3.2×10 -5 / ℃ to 3.8×10 -5 / ℃ range.

[0049] Each insulating coating can be applied by screen printing, spraying, or blade coating. Each method has its own characteristics. For example, screen printing is suitable for precise control of coating thickness, while spraying is suitable for rapid coating of large areas.

[0050] The coating thickness of each insulating coating layer can be adjusted according to actual needs. For example, the coating thickness of the second insulating coating layer 8 can be 10 μm-15 μm, the coating thickness of the first insulating coating layer 5 can be 3 μm-5 μm, and the coating thickness of the third insulating coating layer 9 can be 3 μm-5 μm.

[0051] The second insulating coating 8 is applied to the back of the glass substrate 1. Its relatively thick thickness of 10-15 μm provides excellent basic insulation performance. The first insulating coating 5 covers the temperature measurement circuit 4. Its thickness of 3-5 μm ensures effective insulation of the temperature measurement circuit 4 without excessively affecting heat conduction. This design of the insulating coating thickness ensures circuit insulation safety while minimizing the impact on heat conduction, thereby improving the overall performance and reliability of the self-induction induction cooker glass panel. By precisely controlling the thickness of each insulating coating, a good balance can be achieved between insulation performance and heat conduction efficiency, which is beneficial for improving the product's service life and operational stability.

[0052] Preferably, in step A1, the printed circuit 2 is printed using a conductive material that does not react magnetically to the magnetic field generated by the induction cooker coil of the induction cooker.

[0053] Considering that the influence of electromagnetic eddy current on the printed circuit 2 on the glass panel cannot be completely eliminated in the induction cooker environment, the printed circuit 2 can be prepared by selecting suitable materials according to the operating frequency of the induction cooker coil to minimize this influence.

[0054] For example, for low-frequency induction cookers, copper or aluminum can be used to print the printed circuit 2 to reduce costs. Polyimide or other inorganic conductive materials can also be used. For high-frequency induction cookers, polyimide or other inorganic conductive materials are preferred. Polyimide is an excellent conductive material with high conductivity and low magnetism. Even when used in high-frequency induction cookers, it is not affected by the magnetic field generated by the induction cooker coil, thus ensuring normal circuit operation.

[0055] The printed circuit 2 can be produced by screen printing, inkjet printing, laser etching, or other methods. Different printing methods are suitable for different conductive materials and production scales. For example, screen printing may be more economical for large-scale production, while inkjet printing may be more flexible for small-volume or customized production.

[0056] In some embodiments, in step A2, the heating area on the back side of the glass substrate 1 is divided into a plurality of self-sensing areas, and at least one thermistor 3 is soldered in each self-sensing area.

[0057] The heating zone is the area opposite the induction cooker coil. Dividing the heating zone into multiple self-sensing zones allows for better adaptation to cookware of varying sizes and shapes, improving temperature measurement accuracy. Soldering at least one thermistor 3 in each self-sensing zone enables real-time temperature monitoring of that zone. This design enables the induction cooker to more accurately sense temperature changes in different zones, resulting in more precise temperature control.

[0058] The number, shape, size and distribution of the self-sensing zones can be adjusted according to actual needs. The number of thermistors 3 in each self-sensing zone can be adjusted according to actual needs.

[0059] For example, in a preferred embodiment, see Figure 4 The self-sensing zone includes a first self-sensing zone 101 located in the middle of the heating zone (i.e., the circular area in the middle of the figure) and a plurality of second self-sensing zones 102 evenly arranged around the first self-sensing zone 101 (i.e., the fan-shaped area surrounding the first self-sensing zone 101 in the figure).

[0060] The first self-sensing zone 101, located in the center of the heating zone, can accurately sense temperature changes in the center of the cookware's bottom. In practice, the closer to the center of the induction cooker coil, the greater the magnetic field strength, resulting in higher temperatures and a greater likelihood of hotspots. Therefore, it is necessary to monitor the temperature in the center of the heating zone. Multiple second self-sensing zones 102 are evenly distributed around the first self-sensing zone 101, fully covering the rest of the cookware's bottom, enabling comprehensive temperature monitoring of the entire heating zone. This layout design ensures more uniform and comprehensive temperature sensing, more accurately reflecting the temperature distribution across the entire heating zone. By soldering at least one thermistor 3 in each self-sensing zone, a complete temperature measurement circuit 4 is formed, enabling real-time monitoring of temperature changes in each zone, providing reliable data support for precise heating control. By rationally dividing the self-sensing zones and evenly distributing them, this solution improves the accuracy and comprehensiveness of temperature sensing, enabling more precise temperature control and enhancing the heating quality and user experience of the induction cooker. This design also enables differentiated heating control for different zones, enhancing the functional flexibility of the induction cooker.

[0061] The number and number of distribution circles of the second self-sensing regions 102 can be adjusted according to actual needs; the second self-sensing regions 102 can be arranged in a single circle or multiple circles, and the number of second self-sensing regions 102 in each circle can be adjusted according to actual needs. Figure 4In the embodiment, the number of the second self-sensing regions 102 is seven (thereby there are eight self-sensing regions in total), and they are arranged in a circle, and a thermistor 3 is provided in each self-sensing region; but the present invention is not limited thereto.

[0062] The performance parameters of the thermistor 3 can be selected according to actual needs. For example, a thermistor 3 with a resistance range of 1KΩ-200KΩ, an operating temperature range of -40°C-300°C, and a rated power of no more than 25mW can be selected, but the present invention is not limited thereto.

[0063] In step A4, curing can be performed naturally (i.e., standing), thermally, or UV-curing, depending on the coating system used. The temperature and time of the curing process must be strictly controlled to ensure sufficient crosslinking of the coating and achieve the desired thermal expansion coefficient and insulation performance.

[0064] It should be noted that the magnetic field generated by the induction cooker coil will cause certain interference to the thermistor 3, but the interference of the magnetic field on each thermistor 3 is basically the same; and as long as the thermistor 3 is affected by high temperature, the output signal at the output end will change. No matter how the magnetic field affects it, this changed signal will still exist. In the induction cooker, the output signals of each thermistor 3 can be compared with each other through a comparator, so that according to the deviation between the output signals of each thermistor 3, it can be determined whether there is a specific high-temperature point on the glass panel of the induction cooker. Therefore, even if the magnetic field interferes with the thermistor 3, it will not affect the detection of the specific high-temperature point (that is, although the magnetic field will affect the detection accuracy of the specific temperature value, it will not affect the discovery of the specific high-temperature point when multiple thermistors 3 are set); in this way, the corresponding PWM signal can be fed back to adjust the output power of the induction cooker, thereby reducing the overheating situation and protecting the glass from bursting.

[0065] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any actual relationship or order between these entities or operations.

[0066] The above description is merely an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, various modifications and variations of the present application are possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A method for manufacturing a self-induction induction cooker glass panel, used for preparing a glass panel for an induction cooker, characterized in that: Includes steps: A1. Printing a circuit on the back of a glass substrate using a conductive material that does not react magnetically to the magnetic field generated by the induction cooker coil of the induction cooker to obtain a printed circuit; the printed circuit is at least partially located in the heating area of ​​the glass substrate; A2. soldering thermistors at different positions in the heating zone on the back of the glass substrate, so that the thermistors are electrically connected to the printed circuit, forming a temperature measurement circuit for inputting a working voltage to each thermistor and outputting an output signal of each thermistor; A3. Coating a first insulating coating on the back of the glass substrate to cover the temperature measuring circuit to obtain a semi-finished product; A4. Curing the semi-finished product to obtain a glass panel product.

2. The method for manufacturing a self-induction induction cooker glass panel according to claim 1, characterized in that: Before step A1, the following steps are also included: A00. Print a display pattern on the back side of the glass substrate.

3. The method for manufacturing a self-induction induction cooker glass panel according to claim 2, characterized in that: After step A00 and before step A1, the following steps are further included: A01. Apply a second insulating coating on the back side of the glass substrate.

4. The method for manufacturing a self-induction induction cooker glass panel according to claim 3, characterized in that: In both step A01 and step A3, the thermal expansion coefficient after curing is 3.2×10 -5 / ℃-3.8×10 -5 / ℃ high temperature resistant insulating coating is applied to obtain the corresponding insulating coating.

5. The method for manufacturing a self-induction induction cooker glass panel according to claim 4, characterized in that: The coating thickness of the second insulating coating layer is 10 μm-15 μm; the coating thickness of the first insulating coating layer is 3 μm-5 μm.

6. The method for manufacturing a self-induction induction cooker glass panel according to claim 1, characterized in that: In step A1, the printed circuit is printed using aluminum or copper material.

7. The method for manufacturing a self-induction induction cooker glass panel according to claim 1, characterized in that: In step A1, the printed circuit is printed using a polyimide material.

8. The method for manufacturing a self-induction induction cooker glass panel according to claim 1, characterized in that: In step A2, the heating area on the back side of the glass substrate is divided into a plurality of self-sensing areas, and at least one thermistor is soldered in each of the self-sensing areas.

9. The method for manufacturing a self-induction induction cooker glass panel according to claim 8, characterized in that: The self-sensing area includes a first self-sensing area located in the middle of the heating area and a plurality of second self-sensing areas uniformly arranged around the first self-sensing area.

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