Printing device and forming method of a line protection layer of a display device

By using at least two barrier printing units and filler adhesive to form a circuit protection layer on a flexible circuit board, the problems of uneven thickness and slope in the circuit protection layer in the prior art are solved, thereby improving the packaging and display effect of the display device.

CN119255503BActive Publication Date: 2026-06-23ENOVATE3D (HANGZHOU) TECH DEV CO LTD
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Patent Information

Application Number
CN202411128732.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-08-16
Publication Date
2026-06-23
Estimated Expiration
2044-08-16

AI Technical Summary

Technical Problem

The existing technology produces a protective layer with depressions and sharp slopes on the side near the display panel, which affects the packaging and display effect, and the film thickness has poor uniformity.

Method used

At least two barrier printing units are used to form barriers close to and far from the display panel on the flexible circuit board, and a circuit protection layer is formed between the barriers by a filler adhesive printing unit. The barrier dimensions are kept consistent to avoid sharp inclines and depressions.

Benefits of technology

It achieves high uniformity in the thickness of the circuit protection film, reduces the overall thickness and ramp width, does not affect the packaging and display effect, and improves work efficiency.

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Abstract

The present application relates to the technical field of 3D printing, and particularly relates to a printing device and forming method of a circuit protection layer of a display device. The printing device of the present application comprises: a main support; the main support has a front end and a rear end along a horizontal direction; at least two barrier wall printing units, which are adapted to print and form barrier walls on the surface of the connection area and / or non-connection area of a flexible circuit board respectively; the printing unit comprises a printing needle; the printing units are arranged at intervals in the direction from the front end to the rear end; a filling glue printing unit is arranged at intervals with the barrier wall printing units in the direction from the front end to the rear end, is located between the rear end and the barrier wall printing units, and is adapted to print filling glue in the space between the multiple barrier walls formed by the multiple printing units to form a circuit protection layer; the circuit protection layer covers at least the connection area. The present application can effectively solve the problems of poor uniformity of the film layer thickness of the circuit protection layer, influence on packaging, and even possible influence on the display effect.
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