Wafer thinning processing apparatus

Abstract

The application belongs to the technical field of wafer processing, in particular to a wafer thinning processing equipment, which comprises a rotary platform, three worktables are installed at equal intervals on the outer side of the rotary platform, mounting seats are arranged on both sides of the rotary platform, and an loading and unloading mechanism is arranged on the side of the rotary platform away from the two mounting seats; the automatic loading unit comprises a taking and placing assembly, a feeding assembly and a material returning assembly, the taking and placing assembly comprises telescopic columns arranged on both sides of the worktable, a turnover rod is hinged to one end of the telescopic column, a clamping plate is arranged above the turnover rod, and a clamping assembly is arranged between the clamping plate and the turnover rod; the clamping plate can drive the wafer main body to move and turn over through the driving of the telescopic column and the turnover rod, the wafer main body is conveniently loaded to the front end of the worktable, the clamping plate can automatically complete the taking and placing actions in the turning process through the driving of the moving block and the telescopic plate, manual operation can be reduced, and the processing efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of wafer processing technology, specifically wafer thinning processing equipment. Background Technology

[0002] A wafer is a silicon chip used in the fabrication of semiconductor integrated circuits. In 3D packaging multilayer stacking technology, thinner wafers are required. To avoid transmission difficulties caused by the warping of thin wafers, a process of leaving edges during thinning is often adopted. Existing edge-leaving processing equipment is an improvement on the thinning equipment. After leaving edges, the waste residue and wastewater generated during thinning are blocked by the edges and cannot be discharged in time, affecting processing efficiency and wafer surface quality.

[0003] When processing wafers, unprocessed wafers need to be loaded onto the worktable, and after processing, the wafers need to be removed from the worktable. The loading and unloading of wafers requires manual operation, which is time-consuming and carries the risk of wafers falling and being damaged, thus affecting production.

[0004] Therefore, the present invention provides wafer thinning processing equipment. Summary of the Invention

[0005] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0006] The technical solution adopted by the present invention to solve its technical problem is as follows: The wafer thinning processing equipment of the present invention includes a rotary platform, three worktables are installed at equal angles on the outer side of the rotary platform, one end of the worktable is loaded with a wafer body, and two grinding units and a loading and unloading mechanism are arranged on the outer side of the rotary platform, corresponding one-to-one with the three worktables; the grinding unit includes a mounting base, a driving component located inside the mounting base, and a grinding wheel located at the driving end of the driving component, a first direction moving component is installed at the bottom end of the mounting base, a second direction moving component is installed at the bottom end of the first direction moving component, and a support platform is fixed at the bottom end of the second direction moving component; the loading and unloading mechanism includes a pick-and-place component, a feeding component, and a return component, the pick-and-place component includes telescopic columns arranged on both sides of the worktable, one end of the telescopic column is hinged to a flipping rod, a clamping plate is arranged above the flipping rod, and a clamping component is arranged between the clamping plate and the flipping rod; the return component includes a support frame arranged on the side of the rotary platform away from the two mounting bases.

[0007] Preferably, a second motor is provided on both sides of the workbench, a fixed frame is fixed to the outside of the second motor, a guide plate is fixed to the top of the fixed frame, a telescopic column passes through the inside of the guide plate, a first threaded rod is fixed to the end of the shaft of the second motor, the first threaded rod is threadedly connected to one end of the telescopic column, an extension block is fixed to the bottom of the flipping rod, an electric telescopic rod is hinged to the top of the telescopic column, and the other end of the electric telescopic rod is hinged to the side of the flipping rod.

[0008] Preferably, the clamping assembly includes a telescopic plate fixed to one side of the top of the flipping rod. A movable block is provided on the outside of the telescopic plate, and a telescopic hole is opened inside the movable block. The telescopic plate is inserted into the telescopic hole. Two rollers are rotatably connected inside the movable block. A second threaded rod is threaded inside the rollers. The two rollers are respectively set above and below the telescopic hole. Multiple racks are fixed at equal intervals at the top and bottom of the telescopic plate. A rack is also fixed on the outside of the rollers near the telescopic plate. The telescopic plate is engaged with the rollers through the racks.

[0009] Preferably, the end of the fixing frame away from the second motor is fixedly connected to the support frame.

[0010] Preferably, a second connecting plate is fixed to the end of the second threaded rod away from the moving block. A movable cavity is opened inside the second connecting plate. A telescopic block is fixed to the side of the clamping plate near the second connecting plate. The end of the telescopic block away from the clamping plate extends into the movable cavity. A second spring is fixed to the end of the movable cavity away from the clamping plate. The other end of the second spring is fixedly connected to the telescopic block.

[0011] Preferably, a connecting frame is fixed to one side of the fixed frame, a guide block is fixed to the bottom of one side of the connecting frame, and a limiting groove is opened at the top of the second connecting plate, with the guide block and the limiting groove being slidably connected.

[0012] Preferably, a return material conveyor belt is installed at the top of the support frame, and a tilting frame is set above the return material conveyor belt. A first connecting plate is fixed on both sides of the bottom end of the tilting frame. The first connecting plate is rotatably connected to the outside of the return material conveyor belt. Support plates are fixed on both sides of the return material conveyor belt. A first motor is installed on one side of one of the support plates. A first gear is fixed to the end of the shaft of the first motor. A second gear is fixed to the end of the first gear away from the first motor. Teeth are provided in a quarter area of ​​the outer side of the second gear near the first connecting plate. Teeth are also provided in a quarter area of ​​the outer side of the first connecting plate near the second gear. The first connecting plate and the second gear are meshed through the teeth. Two sets of second gears and first gears are symmetrically arranged on both sides of the return material conveyor belt. A transmission rod is fixedly connected between the two second gears.

[0013] Preferably, a rotating column is rotatably connected to the top of the support plate, and a pressure plate is fixed to the end of the rotating column away from the first connecting plate. The angle between the pressure plate and the flipping frame is 90°. Multiple teeth are evenly spaced on the outer side of the first gear, and multiple teeth are also evenly spaced on the outer side of the rotating column near the first gear. The rotating column and the first gear are meshed together.

[0014] Preferably, a support block is provided on the side of the support plate away from the first motor, a lifting block is fixed at the bottom of the support block, a connecting shell is provided below the support block, the bottom end of the lifting block extends into the interior of the connecting shell, a first spring is fixed at the bottom end of the lifting block, and the bottom end of the first spring is fixedly connected to the connecting shell.

[0015] Preferably, the feeding assembly includes an infeed conveyor belt disposed below the return conveyor belt, the infeed conveyor belt being fixedly connected to the support frame, and top plates being fixed on both sides of the infeed conveyor belt.

[0016] The beneficial effects of this invention are as follows: 1. The wafer thinning processing equipment of the present invention enables the clamping plate to move and rotate the wafer body by means of the telescopic column and the flipping rod, so as to facilitate the loading of the wafer body onto the front end of the worktable. By means of the moving block and the telescopic plate, the clamping plate can automatically complete the material picking and unloading actions during the flipping process, thereby reducing manual operation and improving processing efficiency.

[0017] 2. The wafer thinning processing equipment of the present invention conveys the wafer body through a return conveyor belt and a feed conveyor belt. It can be used with a clamp to place the processed wafer body at the top of the return conveyor belt and to pick up the unprocessed wafer body from the feed conveyor belt. It can realize automatic operation and improve the stability and efficiency of processing. Attached Figure Description

[0018] The invention will now be further described with reference to the accompanying drawings.

[0019] Figure 1 This is a perspective view of the present invention; Figure 2 This is a schematic diagram of the support frame and telescopic column structure of the present invention; Figure 3 This is a schematic diagram of the telescopic rod structure in this invention; Figure 4 This is a schematic diagram of the internal structure of the movable block in this invention; Figure 5 This is a schematic diagram of the internal structure of the connecting plate in this invention; Figure 6 This is a schematic diagram of the support frame structure in this invention; Figure 7 This is a schematic diagram of the flipping frame structure in this invention; Figure 8 This is a schematic diagram of the first motor structure in this invention; Figure 9 This is a schematic diagram of the support block structure in this invention.

[0020] In the diagram: 1. Rotary platform; 2. Workbench; 3. Mounting base; 31. Grinding wheel; 32. Drive component; 33. First direction moving component; 34. Second direction moving component; 35. Support platform; 4. Support frame; 41. Feed conveyor belt; 411. Top plate; 42. Return conveyor belt; 421. Tilting frame; 422. Pressure plate; 423. Rotating column; 424. First connecting plate; 43. Support plate; 431. First motor; 432. First gear; 433. Second gear; 434. Transmission rod; 44. Support block; 441. Lifting block; 442. 443. Connecting shell; 5. First spring; 6. Wafer body; 7. Telescopic column; 8. Second motor; 9. First threaded rod; 10. Fixing frame; 11. Guide plate; 12. Flipping rod; 13. Extension block; 14. Electric telescopic rod; 15. Telescopic plate; 16. Moving block; 17. Telescopic hole; 18. Roller; 19. Second threaded rod; 10. Clamping plate; 10. Second connecting plate; 11. Limiting groove; 12. Movable cavity; 13. Telescopic block; 14. Second spring; 15. Connecting frame; 16. Guide block. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0022] like Figures 1 to 3 As shown, the wafer thinning processing equipment described in this embodiment of the invention includes a rotary platform 1, three worktables 2 are installed at equal angles on the outer side of the rotary platform 1, one end of each worktable 2 is loaded with a wafer body 5, and two grinding units and a loading / unloading mechanism are arranged on the outer side of the rotary platform 1, corresponding one-to-one with the three worktables 2; the grinding unit includes a mounting base 3, a driving component 32 located inside the mounting base 3, and a grinding wheel 31 located at the driving end of the driving component 32, a first direction moving component 33 is installed at the bottom end of the mounting base 3, a second direction moving component 34 is installed at the bottom end of the first direction moving component 33, and a support platform 35 is fixed at the bottom end of the second direction moving component 34; the loading / unloading mechanism includes a pick-and-place assembly, a feeding assembly, and a return assembly, the pick-and-place assembly includes telescopic columns 6 arranged on both sides of the worktable 2, one end of the telescopic column 6 is hinged to a flipping rod 62, a clamping plate 66 is arranged above the flipping rod 62, and a clamping assembly is arranged between the clamping plate 66 and the flipping rod 62; the return assembly includes a support frame 4 arranged on the side of the rotary platform 1 away from the two mounting bases 3; After the wafer body 5 is produced, its surface needs to be thinned to ensure that its thickness meets the standard. During the thinning process, the wafer body 5 to be processed is transported to the front of the worktable 2 by the feeding assembly. At this time, the clamping plate 66 is extended to the telescopic column 6 by the telescopic column 6, and then the clamping plate 66 is flipped to above the wafer body 5 by the flipping rod 62. Then, the clamping assembly pushes the clamping plate 66 to clamp the wafer body 5. Then, under the action of the telescopic column 6 and the flipping rod 62, the clamping plate 66 loads the wafer body 5 onto the front end of the worktable 2. The worktable 2 is equipped with a negative pressure adsorption assembly, which can adsorb the wafer body 5 to the front end of the worktable 2. After the wafer body 5 is fixed, the rotary platform 1 rotates 120° to rotate the wafer body 5 to the front of the grinding wheel 31 of the first station. Then, the drive component 32 drives the grinding wheel. The grinding wheel 31 rotates, and under the drive of the first direction moving part 33 and the second direction moving part 34, it grinds the surface of the wafer body 5 to perform rough processing. After the processing at the first processing position is completed, the rotary platform 1 continues to rotate 120°. At this time, the rotary platform 1 drives the rough-processed wafer body 5 into the second processing position for fine processing. The two processing operations can thin the wafer body 5 to the process standard. When one worktable 2 rotates to drive the wafer body 5 for processing, other worktables 2 will rotate to the front of the feeding component and then load the wafer body 5 onto the front end of the current worktable 2. When the processed wafer body 5 rotates back to the front of the feeding component, the pick-and-place component will place the processed wafer body 5 on top of the return component and pick up another wafer body 5 from the top of the feeding component. This cycle can realize automatic pick-and-place of wafer body 5 and thinning processing.

[0023] like Figures 1 to 3 As shown, a second motor 61 is provided on both sides of the workbench 2. A fixing frame 612 is fixed to the outside of the second motor 61. A guide plate 613 is fixed to the top of the fixing frame 612. The telescopic column 6 passes through the inside of the guide plate 613. A first threaded rod 611 is fixed to the end of the shaft of the second motor 61. The first threaded rod 611 is threadedly connected to one end of the telescopic column 6. An extension block 621 is fixed to the bottom of the flipping rod 62. An electric telescopic rod 63 is hinged to the top of the telescopic column 6. The other end of the electric telescopic rod 63 is hinged to the side of the flipping rod 62. During the material handling process, the second motor 61 is started to drive the first threaded rod 611 to rotate. The rotation of the first threaded rod 611 drives the telescopic column 6 to extend and retract laterally. The guide plate 613 guides the telescopic column 6. After the telescopic column 6 extends and retracts to the required position, the electric telescopic rod 63 drives the flipping rod 62 to flip, which can meet the action required by the clamping plate 66 when handling materials. After the flipping rod 62 flips, the extension block 621 can limit it to prevent the flipping rod 62 from flipping too much.

[0024] like Figures 3 to 4As shown, the clamping assembly includes a telescopic plate 64 fixed to one side of the top of the flipping rod 62. A movable block 65 is provided on the outside of the telescopic plate 64. A telescopic hole 651 is opened inside the movable block 65. The telescopic plate 64 is inserted into the telescopic hole 651. Two rollers 652 are rotatably connected inside the movable block 65. A second threaded rod 653 is threaded inside the rollers 652. The two rollers 652 are respectively set above and below the telescopic hole 651. A rack is fixed at the top and bottom of the telescopic plate 64. A rack is also fixed on the outside of the rollers 652. The telescopic plate 64 is engaged with the rollers 652 through the rack. During the movement of the telescopic column 6 and the clamping plate 66, the wafer body 5 needs to be clamped and lowered via the clamping plate 66. During the clamping process, the moving block 65 is pushed by an external force, which pushes the clamping plate 66 towards the flipping rod 62. During this process, the moving block 65 is pushed and moved, and the telescopic plate 64 passes through the telescopic hole 651. The rollers 652 above and below the telescopic plate 64 are driven to rotate by the rack of the telescopic plate 64. When the rollers 652 rotate in this direction, they will drive the second threaded rod 653 to extend out from the inside of the rollers 652. The second threaded rod 653 can push The clamping plate 66 clamps the wafer body 5. When the clamping plate 66 drives the wafer body 5 to contact the inside of the worktable 2, the wafer body 5 needs to be released. At this time, the telescopic column 6 pulls the telescopic plate 64 through the flipping rod 62. The telescopic plate 64 is pulled out from the inside of the telescopic hole 651. During this process, the telescopic plate 64 will drive the roller 652 to rotate in the opposite direction. At this time, the rotation direction of the roller 652 will drive the second threaded rod 653 to retract into the inside of the roller 652. The second threaded rod 653 drives the clamping plate 66 to separate from the wafer body 5, which can realize the automatic picking and placing of the wafer body 5 by the clamping plate 66.

[0025] like Figures 1 to 2 As shown, the end of the fixing frame 612 away from the second motor 61 is fixedly connected to the support frame 4; The second motor 61 is fixed to one end of the support frame 4 by the fixing bracket 612. The support frame 4 can support the second motor 61, making it more stable during use.

[0026] like Figures 1 to 5 As shown, a second connecting plate 661 is fixed to one end of the second threaded rod 653 away from the moving block 65. A movable cavity 663 is opened inside the second connecting plate 661. A telescopic block 664 is fixed to one side of the clamping plate 66 near the second connecting plate 661. One end of the telescopic block 664 away from the clamping plate 66 extends into the movable cavity 663. A second spring 665 is fixed to one end of the movable cavity 663 away from the clamping plate 66. The other end of the second spring 665 is fixedly connected to the telescopic block 664. During the clamping process of the clamping plate 66 clamping the wafer body 5, the second threaded rod 653 pushes the second connecting plate 661, and the second connecting plate 661 drives the clamping plate 66 to come close to the wafer body 5. When the clamping plate 66 contacts the wafer body 5, it is pushed, and the clamping plate 66 pushes the telescopic block 664 to squeeze the second spring 665 into the interior of the movable cavity 663. At this time, the second spring 665 can buffer the second connecting plate 661 and the clamping plate 66, and can prevent the clamping plate 66 from damaging the wafer body 5 due to excessive force from the second connecting plate 661.

[0027] like Figures 1 to 4 As shown, a connecting frame 67 is fixed on one side of the fixed frame 612, and a guide block 671 is fixed at the bottom of one side of the connecting frame 67. A limiting groove 662 is opened at the top of the second connecting plate 661, and the guide block 671 and the limiting groove 662 are slidably connected. When the moving block 65 causes the clamping plate 66 to separate from the wafer body 5, the second connecting plate 661 will slide at the front end of the worktable 2. During the sliding process, the second connecting plate 661 will cause the limiting groove 662 to slide outside the guide block 671. After the clamping plate 66 separates from the wafer body 5, the guide block 671 and the limiting groove 662 will close together. At this time, the second connecting plate 661 is fixed below the connecting frame 67 by the limiting groove 662 and the guide block 671. When it is necessary to remove the wafer body 5 from the front end of the worktable 2, the telescopic column 6 will move through the flipping rod 6. 2. Push the telescopic plate 64. At this time, the guide block 671 can limit the sliding groove 662, allowing the telescopic plate 64 to travel inside the moving block 65 during its forward extension. The telescopic plate 64 can drive the second threaded rod 653 to extend from inside the roller 652. The second threaded rod 653 can push the second connecting plate 661 to drive the clamping plate 66 to hold the wafer body 5. At this time, the negative pressure adsorption component of the worktable 2 stops adsorption, making it easy to remove the processed wafer body 5.

[0028] like Figures 6 to 8As shown, a return conveyor belt 42 is installed at the top of the support frame 4, and a tilting frame 421 is set above the return conveyor belt 42. A first connecting plate 424 is fixed on both sides of the bottom end of the tilting frame 421. The first connecting plate 424 is rotatably connected to the outside of the return conveyor belt 42. Support plates 43 are fixed on both sides of the return conveyor belt 42. A first motor 431 is installed on one side of one of the support plates 43. A first gear 432 is fixed at the end of the shaft of the first motor 431. A second gear 433 is fixed at the end of the first gear 432 away from the first motor 431. Teeth are provided in a quarter area of ​​the outer side of the second gear 433 near the first connecting plate 424. Teeth are also provided in a quarter area of ​​the outer side of the first connecting plate 424 near the second gear 433. The first connecting plate 424 and the second gear 433 are meshed through the teeth. Two sets of second gears 433 and first gears 432 are symmetrically arranged on both sides of the return conveyor belt 42. A transmission rod 434 is fixedly connected between the two second gears 433. Before processing, the flipping frame 421 is perpendicular to the return conveyor belt 42. At this time, the flipping frame 421 does not affect the clamping plate 66 picking up material from above the feeding assembly. After the wafer body 5 is processed, it needs to be recycled. At this time, the first motor 431 is started to drive the first gear 432 and the second gear 433 to rotate. After the second gear 433 rotates, it drives the first connecting plate 424 to rotate. At this time, the first connecting plate 424 drives the flipping frame 421 to rotate 90° towards the worktable 2. At this time, the flipping frame 421 is in the flipping position. The lever 62 drives the clamping plate 66 to rotate within the path. Then, the lever 62 drives the clamping plate 66 to rotate. The clamping plate 66 drives the wafer body 5 to pass above the flipping frame 421. The flipping frame 421 can pick up the processed wafer body 5. After the flipping frame 421 picks up the wafer body 5, the first motor 431 rotates in the opposite direction. During this process, the wafer body 5 at the top of the flipping frame 421 slides down to the top of the return conveyor belt 42. The return conveyor belt 42 can transport the wafer body 5, which can realize the automatic removal of the processed wafer body 5.

[0029] like Figures 1 to 8 As shown, a rotating column 423 is rotatably connected to the top of the support plate 43. A pressure plate 422 is fixed to the end of the rotating column 423 away from the first connecting plate 424. The angle between the pressure plate 422 and the flipping frame 421 is 90°. Multiple teeth are evenly spaced on the outer side of the first gear 432. Multiple teeth are also evenly spaced on the outer side of the rotating column 423 near the first gear 432. The rotating column 423 and the first gear 432 are meshed together. While the second gear 433 drives the first connecting plate 424 to rotate, the first gear 432 drives the rotating column 423 to rotate. When the first connecting plate 424 rotates 90°, the first connecting plate 424 and the second gear 433 lose meshing. At this time, the clamping plate 66 drives the wafer body 5 to flip above the flipping frame 421. Then, the first gear 432 can continue to drive the rotating column 423 to continue rotating. At this time, the rotating column 423 drives the pressure plate 422 to continue rotating 90°. The rotating column 423 can drive the pressure plate 422 to continue flipping. The flipping of the pressure plate 422 can press the flipped moving block 65 downward. After the moving block 65 is subjected to force, it drives the clamping plate 66 to release the clamping of the wafer body 5. After the unloading is completed, the first motor 431 is started to rotate in the opposite direction. At this time, the first gear 432 and the second gear 433 can drive the rotating column 423 and the first connecting plate 424 to rotate in the opposite direction to reset, and automatic unloading can be completed.

[0030] like Figures 6 to 9 As shown, a support block 44 is provided on the side of the support plate 43 away from the first motor 431. A lifting block 441 is fixed to the bottom end of the support block 44. A connecting shell 442 is provided below the support block 44. The bottom end of the lifting block 441 extends into the interior of the connecting shell 442. A first spring 443 is fixed to the bottom end of the lifting block 441. The bottom end of the first spring 443 is fixedly connected to the connecting shell 442. After the tilting frame 421 is tilted, the support block 44 can support the bottom of the tilting frame 421, which can prevent the state of the tilting frame 421 from being affected after the first connecting plate 424 and the second gear 433 lose meshing. After the top of the tilting frame 421 is pressed, the support block 444 pushes the lifting block 441 downward. The lifting block 441 squeezes the first spring 443 into the connecting shell 442, which can buffer the tilting frame 421 and prevent the teeth from being damaged by excessive compression during the process of the first connecting plate 424 and the second gear 433 losing meshing.

[0031] like Figures 1 to 7 As shown, the feeding assembly includes a feeding conveyor belt 41 disposed below the return conveyor belt 42. The feeding conveyor belt 41 is fixedly connected to the support frame 4, and top plates 411 are fixed on both sides of the feeding conveyor belt 41. After the wafer body 5 is unloaded from the clamping plate 66, the clamping plate 66 moves upward to the feed conveyor belt 41. The feed conveyor belt 41 transports the unprocessed wafer body 5 to the area below the clamping plate 66. At this time, the top plate 411 will lift the moving block 65, which allows the clamping plate 66 to move downward while simultaneously moving towards the wafer body 5. When the clamping plate 66 is completely aligned with the position of the wafer body 5, the clamping plate 66 can clamp the wafer body 5, realizing automatic clamping of the wafer body 5. After clamping the wafer body 5, the clamping plate 66 resets, which can drive the wafer body 5 to be loaded onto the front end of the worktable 2.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer thinning processing equipment, characterized in that: It includes a rotary platform (1), three worktables (2) are installed at equal angles on the outside of the rotary platform (1), one end of the worktable (2) is loaded with a wafer body (5), and two polishing units and a loading and unloading mechanism are set on the outside of the rotary platform (1), which correspond one-to-one with the three worktables (2); The grinding unit includes a mounting base (3), a drive component (32) located inside the mounting base (3), and a grinding wheel (31) located at the drive end of the drive component (32). A first direction moving component (33) is installed at the bottom end of the mounting base (3), a second direction moving component (34) is installed at the bottom end of the first direction moving component (33), and a support platform (35) is fixed at the bottom end of the second direction moving component (34). The loading and unloading mechanism includes a pick-up and place component, a feeding component and a return component. The pick-up and place component includes telescopic columns (6) set on both sides of the workbench (2). One end of the telescopic column (6) is hinged to a flipping rod (62). A clamping plate (66) is set above the flipping rod (62). A clamping component is set between the clamping plate (66) and the flipping rod (62). The return assembly includes a support frame (4) located on the side of the rotary platform (1) away from the two mounting seats (3); The workbench (2) is equipped with a second motor (61) on both sides. The second motor (61) is fixed with a fixed frame (612) on the outside. The top of the fixed frame (612) is fixed with a guide plate (613). The telescopic column (6) passes through the inside of the guide plate (613). The shaft end of the second motor (61) is fixed with a first threaded rod (611). The first threaded rod (611) is threadedly connected to one end of the telescopic column (6). The bottom end of the flipping rod (62) is fixed with an extension block (621). The top of the telescopic column (6) is hinged with an electric telescopic rod (63). The other end of the electric telescopic rod (63) is hinged to the side of the flipping rod (62). The clamping assembly includes a telescopic plate (64) fixed to one side of the top of the flipping rod (62). A movable block (65) is provided on the outside of the telescopic plate (64). A telescopic hole (651) is opened inside the movable block (65). The telescopic plate (64) is inserted into the telescopic hole (651). Two rollers (652) are rotatably connected inside the movable block (65). A second threaded rod (653) is threaded inside the rollers (652). The two rollers (652) are respectively set above and below the telescopic hole (651). Multiple racks are fixed at equal intervals at the top and bottom of the telescopic plate (64). A rack is also fixed on the outside of the side of the roller (652) near the telescopic plate (64). The telescopic plate (64) is engaged with the roller (652) through the rack.

2. The wafer thinning processing equipment according to claim 1, characterized in that: The end of the fixed frame (612) away from the second motor (61) is fixedly connected to the support frame (4).

3. The wafer thinning processing equipment according to claim 2, characterized in that: The second threaded rod (653) is fixed to a second connecting plate (661) at one end away from the moving block (65). The second connecting plate (661) has a movable cavity (663) inside. The clamping plate (66) is fixed to a telescopic block (664) on one side near the second connecting plate (661). The telescopic block (664) extends into the movable cavity (663) at one end away from the clamping plate (66). The movable cavity (663) is fixed to a second spring (665) at one end away from the clamping plate (66). The other end of the second spring (665) is fixedly connected to the telescopic block (664).

4. The wafer thinning processing equipment according to claim 3, characterized in that: A connecting frame (67) is fixed on one side of the fixed frame (612), and a guide block (671) is fixed at the bottom of one side of the connecting frame (67). A limiting groove (662) is opened at the top of the second connecting plate (661), and the guide block (671) and the limiting groove (662) are slidably connected.

5. The wafer thinning processing equipment according to claim 1, characterized in that: A return conveyor belt (42) is installed at the top of the support frame (4). A tilting frame (421) is installed above the return conveyor belt (42). A first connecting plate (424) is fixed on both sides of the bottom end of the tilting frame (421). The first connecting plate (424) is rotatably connected to the outside of the return conveyor belt (42). A support plate (43) is fixed on both sides of the return conveyor belt (42). A first motor (431) is installed on one side of one of the support plates (43). A first gear (432) is fixed at the end of the shaft of the first motor (431). The first gear (432) is away from the first motor. A second gear (433) is fixed at one end of (431). Teeth are provided in a quarter area of ​​the outer side of the second gear (433) near the first connecting plate (424). Teeth are also provided in a quarter area of ​​the outer side of the first connecting plate (424) near the second gear (433). The first connecting plate (424) and the second gear (433) are meshed through the teeth. Two sets of the second gear (433) and the first gear (432) are symmetrically arranged on both sides of the return conveyor belt (42). A transmission rod (434) is fixedly connected between the two second gears (433).

6. The wafer thinning processing equipment according to claim 5, characterized in that: A rotating column (423) is rotatably connected to the top of the support plate (43). A pressure plate (422) is fixed to the end of the rotating column (423) away from the first connecting plate (424). The angle between the pressure plate (422) and the flipping frame (421) is 90°. Multiple teeth are evenly spaced on the outer side of the first gear (432). Multiple teeth are also evenly spaced on the outer side of the rotating column (423) near the first gear (432). The rotating column (423) and the first gear (432) are meshed together.

7. The wafer thinning processing equipment according to claim 5, characterized in that: A support block (44) is provided on the side of the support plate (43) away from the first motor (431). A lifting block (441) is fixed at the bottom of the support block (44). A connecting shell (442) is provided below the support block (44). The bottom end of the lifting block (441) extends into the interior of the connecting shell (442). A first spring (443) is fixed at the bottom end of the lifting block (441). The bottom end of the first spring (443) is fixedly connected to the connecting shell (442).

8. The wafer thinning processing equipment according to claim 5, characterized in that: The feeding assembly includes a feeding conveyor belt (41) located below the return conveyor belt (42), the feeding conveyor belt (41) is fixedly connected to the support frame (4), and top plates (411) are fixed on both sides of the feeding conveyor belt (41).

Images