Wafer exposure machine and non-contact flattening method of wafer exposure machine

Abstract

The invention discloses a wafer exposure machine and a non-contact flattening method thereof, which comprises a preparation step, a flattening step and an exposure step, in the flattening step, a sample piece is captured by a robot arm to a bearing table, then the bearing table is moved up and down, and the sample piece is exposed on the bearing table. The method comprises the following steps of: placing a sample sheet on a machine table, forming a specific exposure gap between the sample sheet and a pattern plate, keeping a complete horizontal state between the sample sheet and the pattern plate, recording the position of the bearing table as an exposure position by a computer on the machine table, descending the bearing table to an original position, and moving the sample sheet on the bearing table out of the bearing table by a machine arm, therefore, the leveling method capable of preventing the pattern board from being adhered to any liquid medicine is formed.

Description

Technical Field

[0001] The invention relates to a flattening method for a wafer exposure machine, and in particular to a contactless flattening method for a wafer exposure machine and a wafer exposure machine. Background Art

[0002] Before a wafer exposure machine performs an exposure operation on a wafer, a leveling process is usually performed to allow a certain exposure gap between the wafer and the graphic board, and to keep the wafer and the graphic board in a completely horizontal state. However, the existing wafer exposure machine directly uses a wafer work piece coated with exposure material to perform the leveling process. As a result, when the carrier table carrying the wafer moves up and down to adjust the exposure gap and levelness between the wafer and the graphic board, the exposure material on the wafer often contacts the graphic board, and then the exposure material adheres to the graphic board, which will damage the circuit layout pattern on the graphic board, and the subsequent exposure operation will cause the circuit layout after exposure on the wafer to be distorted, thereby affecting the yield of the entire wafer exposure operation. Further improvement is necessary. Summary of the invention

[0003] Therefore, the inventor has specially improved the defects caused by the flattening operation of the existing wafer exposure machine, and has developed a present invention which can improve the existing defects through continuous research and experiments.

[0004] The main purpose of the present invention is to provide a contactless wafer exposure machine flattening method, which can use a wafer sample sheet without any coating of chemicals to perform the flattening process to avoid the phenomenon of chemicals sticking to the graphic plate on the wafer exposure machine, thereby achieving the purpose of improving the overall exposure operation yield of the wafer exposure machine.

[0005] To achieve the above-mentioned purpose, the present invention mainly provides a contactless wafer exposure machine flattening method, which comprises:

[0006] Preparation step: providing a wafer exposure machine, the wafer exposure machine comprising a machine platform, a graphic board fixed on the machine platform, and a carrier platform that can be lifted and moved relative to the machine platform, a pattern of a specific circuit layout is formed on the graphic board, and the carrier platform corresponds to the graphic board and is located below the graphic board;

[0007] Leveling step: a robot arm picks up a sample sheet onto a carrier, then moves the carrier up and down to form a specific exposure gap between the sample sheet and the graphic board, and keeps the sample sheet and the graphic board in a completely horizontal state, and the computer on the machine platform records the position of the carrier as an exposure position, then lowers the carrier to its original position, and then uses the robot arm to move the sample sheet on the carrier off the carrier;

[0008] Exposure step: A robot arm picks up a work piece onto the carrier, and then moves the carrier to the recorded exposure position, so that a specific exposure gap is formed between the work piece and the graphic board, and the work piece and the graphic board are kept completely horizontal. Then, the ultraviolet exposure device on the machine exposes the work piece through the graphic board, so that the exposure material on the work piece relative to the circuit layout pattern on the graphic board is hardened, and then the robot arm moves the work piece on the carrier back to another place;

[0009] Repeat the exposure step: The robot arm picks up the work pieces one by one to repeat the above exposure steps, so that each work piece can be exposed at a specific exposure interval and in a horizontal state.

[0010] The non-contact wafer exposure machine flattening method, wherein after a predetermined number of exposure steps are performed, the above-mentioned flattening step is performed again.

[0011] The non-contact wafer exposure machine flattening method is described, wherein a sample sheet placement rack is further arranged on the machine platform, and the sample sheet is arranged on the sample sheet placement rack. When the robot arm takes the sample sheet, the sample sheet is taken from the sample sheet placement rack, and after the flattening step is completed, the sample sheet is moved back to the sample sheet placement rack for placement.

[0012] The non-contact wafer exposure machine flattening method includes a work piece placement rack on the machine platform, on which a plurality of work pieces are placed, and when a robot arm is used to pick up work pieces, the work pieces are picked up one by one from the work piece placement rack.

[0013] The present invention further provides a wafer exposure machine, which comprises:

[0014] One machine;

[0015] A graphic board fixed on the machine platform, on which a pattern of a specific circuit layout is formed;

[0016] A carrier platform that can be lifted and moved relative to the machine platform, the carrier platform corresponds to the position of the graphic board and is located below the graphic board;

[0017] a sample sheet placement rack disposed on the machine platform for placing at least one sample sheet; and

[0018] A work piece placing rack is arranged on the machine platform for placing a plurality of work pieces.

[0019] Through the above-mentioned technical means, the present invention can avoid the situation where the graphic board is adhered to any solution, and can maintain the integrity of the circuit layout pattern on the graphic board, so as to prevent the circuit layout formed by the working piece from being distorted when it is exposed through the graphic board in the subsequent exposure step, thereby improving the yield rate of the wafer exposure machine in performing wafer exposure operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of the preparation steps of the present invention.

[0021] Figure 2 It is a schematic diagram of capturing a sample sheet onto a supporting platform according to the present invention.

[0022] Figure 3 It is a schematic diagram of moving the carrier platform up and down to adjust the exposure gap according to the present invention.

[0023] Figure 4 This is a schematic diagram of moving the sample sheet back to the placement rack according to the present invention.

[0024] Figure 5 It is a schematic diagram of capturing a working piece onto a supporting platform according to the present invention.

[0025] Figure 6 It is a schematic diagram of moving the carrier platform to move the working sheet to the exposure gap position according to the present invention.

[0026] Figure 7 It is a schematic diagram of the repeated exposure steps of the working film according to the present invention.

[0027] Explanation of symbols:

[0028] 10: Graphics board

[0029] 20: Loading platform

[0030] 30: Sample rack

[0031] 32: Sample piece

[0032] 40: Work piece placement rack

[0033] 42: Work piece DETAILED DESCRIPTION

[0034] The present invention mainly provides a wafer exposure machine and a non-contact wafer exposure machine flattening method, please refer to Figures 1 to 3 As can be seen from the figure, the flattening method of the wafer exposure machine of the present invention mainly includes the following steps:

[0035] Preparation step: Provide a wafer exposure machine, which includes a machine platform, a graphic board 10 fixed on the machine platform, and a carrier 20 that can be raised and lowered relative to the machine platform. A pattern of a specific circuit layout is formed on the graphic board 10, and the carrier 20 corresponds to the position of the graphic board 10 and is located below the graphic board 10. In addition, a work sheet placement rack 40 that can place a plurality of wafer work sheets 42 and a sample sheet placement rack 30 that can place at least one sample sheet 32 ​​are arranged on the machine platform, wherein each sample sheet 32 ​​is not coated with a liquid such as an exposure material, and is a simple wafer sheet.

[0036] Leveling step: A robot arm picks up a sample sheet 32 ​​from the sample sheet placement rack 30 and places it on the carrier 20, and then moves the carrier 20 up and down to form a specific exposure gap between the sample sheet 32 ​​and the graphic board 10, and to keep the sample sheet 32 ​​and the graphic board 10 in a completely horizontal state, and the position of the carrier 20 is recorded as an exposure position by the computer on the machine. Figure 4 As shown, the carrier 20 is lowered to the original position, and then the sample sheet 32 ​​on the carrier 20 is moved out of the carrier 20 and back to the sample sheet placement rack 30 by a robot arm.

[0037] Working film exposure steps: please refer to Figure 5 and Figure 6 , a robot arm picks up a work piece 42 from the work piece placement rack 40 and puts it on the carrier 20, and the work piece 42 is covered with exposure materials to be exposed, and then the carrier 20 is moved to the recorded exposure position, so that a specific exposure gap is formed between the work piece 42 and the graphic board 10, and the work piece 42 and the graphic board 10 are kept in a completely horizontal state. Then, the ultraviolet exposure equipment on the machine exposes the work piece 42 through the graphic board 10, so that the exposure material on the work piece 42 hardens relative to the circuit layout pattern on the graphic board 10, and then the robot arm moves the work piece 42 on the carrier 2-back to another place for subsequent etching and other processing operations.

[0038] Repeat the exposure steps: Please refer to Figure 7 , a robot arm picks up the work pieces 42 on the work piece placement rack 40 one by one to repeat the exposure steps of Figures 5 and 6 above, so that each work piece 42 can be exposed at a specific exposure interval and in a horizontal state. In this way, each work piece 42 can be exposed under exactly the same parameters and conditions to maintain the quality stability of the exposure operation.

[0039] Repeat the leveling step: After performing a predetermined number of working piece exposure steps, such as 5 or 10 times, the above-mentioned leveling step can be performed again to avoid deviations in the moving distance of the carrier 20 after multiple reciprocating movements, thereby affecting the accuracy of the exposure gap and levelness in the subsequent exposure steps.

[0040] By using the planarization method of the present invention, since no chemicals are coated on the sample sheet 32, when the planarization step is performed using the sample sheet 32, even if the sample sheet 32 ​​without chemicals on the carrier 20 accidentally contacts the graphic board 10, it is still possible to avoid the graphic board 10 from sticking to any chemicals, and the integrity of the circuit layout pattern on the graphic board 10 can be maintained, so as to prevent the circuit layout formed by the working sheet 42 from being distorted when it is exposed through the graphic board 10 in the subsequent exposure step, thereby improving the yield rate of the wafer exposure operation performed by the wafer exposure machine.

[0041] It can be seen from the above content that different modifications and changes can be achieved without departing from the essential spirit and novel concept scope of the present invention, and the specific embodiments disclosed in the present invention are not used to limit the present invention. This disclosure includes all modifications that fall within the scope of the attached patent application.

Claims

1. A non-contact wafer exposure machine flattening method, characterized in that: It includes the following steps: Preparation step: providing a wafer exposure machine, the wafer exposure machine comprising a machine platform, a graphic board fixed on the machine platform, and a carrier platform that can be lifted and moved relative to the machine platform, a pattern of a specific circuit layout is formed on the graphic board, and the carrier platform corresponds to the graphic board and is located below the graphic board; Leveling step: a robot arm picks up a sample sheet onto a carrier, then moves the carrier up and down to form a specific exposure gap between the sample sheet and the graphic board, and keeps the sample sheet and the graphic board in a completely horizontal state, and the computer on the machine platform records the position of the carrier as an exposure position, then lowers the carrier to its original position, and then uses the robot arm to move the sample sheet on the carrier off the carrier; Exposure step: A robot arm picks up a work piece onto the carrier, and then moves the carrier to the recorded exposure position, so that a specific exposure gap is formed between the work piece and the graphic board, and the work piece and the graphic board are kept completely horizontal. Then, the ultraviolet exposure device on the machine exposes the work piece through the graphic board, so that the exposure material on the work piece relative to the circuit layout pattern on the graphic board is hardened, and then the robot arm moves the work piece on the carrier back to another place; Repeating the exposure step: The robot arm picks up the work pieces one by one to repeat the above exposure steps, so that each work piece can be exposed at a specific exposure interval and in a horizontal state.

2. The non-contact wafer exposure machine planarization method as claimed in claim 1, characterized in that: After a predetermined number of exposure steps have been performed, the above-mentioned flattening step is performed again.

3. The non-contact wafer exposure machine flattening method according to claim 1 or 2, characterized in that: A sample sheet placement rack is also arranged on the machine platform, and the sample sheet is arranged on the sample sheet placement rack. When the robot arm takes the sample sheet, the sample sheet is taken from the sample sheet placement rack, and after the leveling step is completed, the sample sheet is moved back to the sample sheet placement rack for placement.

4. The non-contact wafer exposure machine flattening method as claimed in claim 3, characterized in that: A work piece placing rack is also arranged on the machine platform, and a plurality of work pieces are placed on the work piece placing rack. When the robot arm is used to pick up the work pieces, the work pieces are picked up one by one from the work piece placing rack.

5. A wafer exposure machine, characterized in that: It includes: One machine; A graphic board fixed on the machine platform, on which a pattern of a specific circuit layout is formed; A carrier platform that can be lifted and moved relative to the machine platform, the carrier platform corresponds to the position of the graphic board and is located below the graphic board; a sample sheet placement rack disposed on the machine platform for placing at least one sample sheet; and A work piece placement rack is arranged on the machine platform for placing a plurality of work pieces.

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