Radio frequency front-end module

Abstract

The invention discloses a radio frequency front-end module. The radio frequency front-end module comprises a substrate, a first chip and a balun, the first chip is arranged on the substrate, and the first chip is provided with a first output end and a second output end. The balun comprises a primary side coil and a secondary side coil, the primary side coil comprises a primary side wiring part, a first binding wire and a second binding wire, the primary side wiring part is arranged in a surrounding mode, one end of the primary side wiring part is connected to the first output end through the first binding wire, and the other end of the primary side wiring part is connected to the second output end through the second binding wire. The secondary side coil comprises a first wiring part and a second wiring part, the first wiring part is arranged on the first chip in a surrounding mode, and the second wiring part and the first wiring part are connected in series. A wiring circuit formed by connecting the second wiring part and the first wiring part in series surrounds the peripheries of the first binding wire and the second binding wire. Therefore, the secondary side coil of the balun almost completely surrounds the periphery of the primary side coil, and the coupling area and the coupling coefficient between the primary side coil and the secondary side coil are increased.

Description

Technical Field

[0001] The present application relates to the field of radio frequency technology, and more specifically, to a radio frequency front-end module. Background Art

[0002] In the field of radio frequency technology, a balun is a device that uses electromagnetic mutual induction to achieve voltage, current and impedance conversion. For example, in a push-pull power amplifier circuit, a balun is usually used for impedance conversion or signal synthesis.

[0003] However, in the existing balun structure, the coupling coefficient between the primary coil and the secondary coil of the balun is low, resulting in poor signal output power of the balun. Summary of the invention

[0004] An embodiment of the present application provides a radio frequency front-end module.

[0005] According to one aspect of the present application, an embodiment of the present application provides a radio frequency front-end module, which includes a substrate, a first chip and a balun. Among them, the first chip is arranged on the substrate, and the first chip is provided with a first output terminal and a second output terminal. The balun includes a primary coil and a secondary coil, the primary coil includes a primary routing portion, a first binding wire and a second binding wire, the primary routing portion is arranged in a surrounding manner, one end of the primary routing portion is connected to the first output terminal through the first binding wire, and the other end of the primary routing portion is connected to the second output terminal through the second binding wire. One end of the secondary coil is used to output a radio frequency signal, and the other end is grounded. The secondary coil includes a first routing portion and a second routing portion, the first routing portion is arranged in a surrounding manner on the first chip, the second routing portion and the first routing portion are connected in series, and the routing line formed by the second routing portion and the first routing portion being connected in series surrounds the periphery of the first binding wire and the second binding wire.

[0006] An embodiment of the present application provides a radio frequency front-end module. Since the routing line formed by the second routing portion and the first routing portion of the secondary coil being connected in series surrounds the periphery of the first binding wire and the second binding wire, the secondary coil of the balun in the present application is almost completely surrounded by the periphery of the primary coil. When the primary coil remains unchanged, the coupling area between the primary coil and the secondary coil is increased, thereby increasing the coupling coefficient between the two, thereby improving the signal output efficiency of the radio frequency signal and reducing the signal insertion loss of the radio frequency signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0008] Figure 1 It is a structural schematic diagram of the RF front-end module provided in an embodiment of the present application.

[0009] Figure 2 yes Figure 1 Schematic cross-section of the substrate.

[0010] Figure 3 yes Figure 1 Schematic cross-sectional view of the first chip.

[0011] Figure 4 This is another structural schematic diagram of the RF front-end module provided in an embodiment of the present application.

[0012] Figure 5 yes Figure 4 Schematic cross-sectional view of the second chip.

[0013] Figure 6 This is another structural diagram of the RF front-end module provided in an embodiment of the present application.

[0014] Figure 7 This is another structural diagram of the RF front-end module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0015] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0016] The embodiment of the present application provides a radio frequency front-end module 100, which is a component that integrates two or more discrete devices such as a radio frequency switch, a low noise amplifier, a filter, a duplexer, a power amplifier, and a transformer into an independent module, thereby improving the integration and hardware performance of the radio frequency front-end module 100 and miniaturizing its size. Specifically, the radio frequency front-end module 100 can be applied to 4G and 5G communication devices such as smart phones, tablet computers, and smart watches.

[0017] See also Figure 1 The RF front-end module 100 in this embodiment may include a substrate 10, a first chip 30 and a balun 50. The first chip 30 is disposed on the substrate 10, and the first chip 30 is provided with a first output terminal 300 and a second output terminal 320.

[0018] The balun 50 may include a primary coil 500 and a secondary coil 520. The primary coil 500 includes a primary routing portion 5010, a first binding wire 5030 and a second binding wire 5050. The primary routing portion 5010 is arranged in a surrounding manner. One end of the primary routing portion 5010 is connected to the first output terminal 300 through the first binding wire 5030, and the other end of the primary routing portion 5010 is connected to the second output terminal 320 through the second binding wire 5050.

[0019] One end of the secondary coil 520 is used to output the RF signal, and the other end is grounded. The secondary coil 520 may include a first routing portion 5210 and a second routing portion 5220, and the first routing portion 5210 is disposed on the first chip 30 in a circumferential manner. The second routing portion 5220 and the first routing portion 5210 are connected in series, and a routing line 5230 formed by the second routing portion 5220 and the first routing portion 5210 in series surrounds the periphery of the first binding wire 5030 and the second binding wire 5050.

[0020] An embodiment of the present application provides a radio frequency front-end module 100. Since the routing line 5230 formed by the second routing portion 5220 and the first routing portion 5210 of the secondary coil 520 connected in series surrounds the periphery of the first binding wire 5030 and the second binding wire 5050, the secondary coil 520 of the balun 50 in the present application is almost completely surrounded by the periphery of the primary coil 500. When the primary coil 500 remains unchanged, the coupling area between the primary coil 500 and the secondary coil 520 is increased, thereby increasing the coupling coefficient between the two, thereby improving the signal output efficiency of the radio frequency signal and reducing the signal insertion loss of the radio frequency signal.

[0021] The various modules in the RF front-end module 100 are introduced below.

[0022] The substrate 10 is roughly rectangular and is used to fix and support the components (e.g., the first chip 30 and the balun 50, etc.) in the RF front-end module 100. Specifically, the substrate 10 can be a copper-clad laminate, and a circuit can be printed on the surface of the substrate 10 by performing hole processing, chemical copper plating, electroplating copper, etching, etc. on the copper-clad laminate.

[0023] In this embodiment, the substrate 10 is provided with at least one second metal layer 120, and the at least one second metal layer 120 can be used to lay out part of the routing in the balun 50. The second metal layer 120 can be a copper foil layer, an aluminum foil layer, etc. Figure 2 There are two second metal layers 120 , and a first dielectric layer 140 is disposed between the two second metal layers 120 . The first dielectric layer 140 and the two second metal layers 120 are arranged at intervals in a specified direction H. The first dielectric layer 140 is used to isolate signal transmission between different second metal layers 120 .

[0024] The first chip 30 is disposed on the substrate 10, and is provided with a first output terminal 300 and a second output terminal 320. The first chip 30 is used to amplify the RF signal input to the RF front-end module 100, and output a pair of RF signals through the first output terminal 300 and the second output terminal 320. Therefore, the first chip 30 in this embodiment is a RF power amplifier chip. Specifically, the first chip 30 can be attached to the substrate 10, or it can be soldered to the substrate by a welding process (for example, soldering).

[0025] In this embodiment, the first chip 30 may include a plurality of transistors (not shown in the figure), and the plurality of transistors 430 are used to form a power amplifier circuit (for example, a differential power amplifier circuit, a push-pull power amplifier circuit, etc.), and the first output terminal 300 and the second output terminal 320 are signal output terminals of the power amplifier circuit. Specifically, the plurality of transistors may be metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), and the first chip 30 is a complementary metal-oxide-semiconductor (Complementary Metal-Oxide-Semiconductor, CMOS) chip. In some other possible embodiments, the plurality of transistors may also be heterojunction bipolar transistors (Heterojunction Bipolar Transistor, HBT), and the first chip 30 is a heterojunction bipolar transistor chip (that is, HBT chip).

[0026] In this embodiment, the first chip 30 is provided with at least one first metal layer 340, and the at least one first metal layer 340 can be used to lay out part of the routing in the balun 50. The first metal layer 340 can be a copper foil layer, an aluminum foil layer, etc. Figure 3 There are two first metal layers 340 , and a second dielectric layer 360 is disposed between the two first metal layers 340 . The second dielectric layer 360 and the two first metal layers 340 are arranged at intervals in a specified direction H. The second dielectric layer 360 is used to isolate signal transmission between different first metal layers 340 .

[0027] See also Figure 4 The RF front-end module may further include a second chip 70. The second chip 70 and the first chip 30 may be located on the same surface of the substrate 10. The second chip 70 may be used to layout some of the routings in the balun 50. Specifically, the second chip 70 may be an integrated passive device chip (Integrated Product Development, IPD), that is, the second chip 70 is a chip made by IPD technology.

[0028] In this embodiment, the second chip 70 is provided with at least one third metal layer 720, and the at least one third metal layer 720 can be used to layout part of the routing in the balun 50. The third metal layer 720 can be a copper foil layer, an aluminum foil layer, etc. Figure 5 There are two third metal layers 720 , and a third dielectric layer 740 is disposed between the two third metal layers 720 . The two third metal layers 720 are arranged at intervals in a specified direction H, and the third dielectric layer 740 is used to isolate signal transmission between different third metal layers 720 .

[0029] The balun 50 may include a primary coil 500 and a secondary coil 520, wherein the secondary coil 520 surrounds the outer periphery of the primary coil 500, and the balun 50 is used to convert a pair of RF signals output by the first chip 30 into one signal for output. The primary coil 500 may include a primary routing portion 5010, a first binding wire 5030, and a second binding wire 5050, wherein the primary routing portion 5010 is arranged in a surrounding manner, wherein one end of the primary routing portion 5010 is connected to the first output terminal 300 via the first binding wire 5030, and the other end of the primary routing portion 5010 is connected to the second output terminal 320 via the second binding wire 5050. Figure 1 In the illustrated embodiment, the primary routing portion 5010 may be disposed in a substantially “C” shape around the second metal layer 120 of the substrate 10 , and the opening of the primary routing portion 5010 faces the side where the first output terminal 300 and the second output terminal 320 are located.

[0030] The first binding wire 5030 is connected between the first output terminal 300 and one end of the primary wiring portion 5010, and the second binding wire 5050 is connected between the second output terminal 320 and the other end of the primary wiring portion 5010, respectively playing the role of signal transmission. Specifically, the first binding wire 5030 and the second binding wire 5050 can be single-strand binding wires or multi-strand binding wires, respectively, which is not specifically limited in this embodiment.

[0031] One end of the secondary coil 520 is used to output the RF signal, and the other end is grounded. The secondary coil 520 includes a first routing portion 5210 and a second routing portion 5220, and the first routing portion 5210 is disposed on the first chip 30 in a circumferential manner. The second routing portion 5220 and the first routing portion 5210 are connected in series, and a routing line 5230 formed by the second routing portion 5220 and the first routing portion 5210 in series surrounds the periphery of the first binding wire 5030 and the second binding wire 5050.

[0032] The first routing portion 5210 may be disposed in a substantially “C” shape and surround the first metal layer 340 of the first chip 30, and the opening of the first routing portion 5210 faces the side where the first output terminal 300 and the second output terminal 320 are located. The second routing portion 5220 may be disposed in a substantially “C” shape and surround the second metal layer 120 of the substrate 10, and the opening of the primary routing portion 5010 faces the side where the first output terminal 300 and the second output terminal 320 are located. Therefore, in this embodiment, the secondary coil 520 is respectively arranged at different positions of the RF front-end module 100 (that is, respectively arranged on the substrate 10 and the first chip 30), so that the routing line 5230 formed by the second routing portion 5220 and the first routing portion 5210 connected in series can completely surround the outer periphery of the first binding wire 5030 and the second binding wire 5050, thereby ensuring that the secondary coil 520 is almost completely surrounded by the outer periphery of the primary coil 500. When the primary coil 500 remains unchanged, the coupling area between the primary coil 500 and the secondary coil 520 is increased, and the coupling coefficient between the two is increased, thereby improving the signal output efficiency of the RF signal and reducing the signal insertion loss of the RF signal.

[0033] In some possible embodiments, Figure 1 As shown, the second routing portion 5220 and the primary routing portion 5010 may both be disposed on the substrate 10 .

[0034] The number of the second metal layer 120 of the substrate 10 can be one, then the primary routing portion 5010 and the second routing portion 5220 are located in the same second metal layer 120, and the routing line 5230 surrounds the periphery of the primary routing portion 5010. In this case, the routing line 5230 formed by the second routing portion 5220 and the first routing portion 5210 connected in series is completely surrounded by the periphery of the primary coil 500, so that the primary routing portion 5010, the first binding wire 5030 and the second binding wire 5050 completely fall into the surrounding area defined by the secondary coil 520, thereby increasing the coupling area between the primary coil 500 and the secondary coil 520, and thus increasing the coupling coefficient between the two. In addition, the substrate 10 is a single-layer metal plate, which can save the hardware cost of the RF front-end module 100.

[0035] There may be multiple second metal layers 120 , and the multiple second metal layers 120 are spaced apart from each other in a specified direction H. The specified direction H is the thickness direction of the substrate 10 . The primary routing portion 5010 and the second routing portion 5220 are located in different second metal layers 120 .

[0036] As an implementation mode, when the routing line 5230 and the primary routing portion 5010 are projected onto the same plane along a specified direction H, the projection of the routing line 5230 can surround the periphery of the projection of the primary routing portion 5010. At this time, the routing line 5230 formed by the second routing portion 5220 and the first routing portion 5210 connected in series is completely surrounded by the periphery of the primary coil 500, thereby improving the coupling coefficient between the primary coil 500 and the secondary coil 520.

[0037] As another embodiment, when the routing line 5230 and the primary routing portion 5010 are projected onto the same plane along the specified direction H, the projection of the routing line 5230 overlaps with the projection of at least a portion of the primary routing portion 5010. Figure 6 , the primary routing portion 5010 may be located at the second metal layer 120 close to the first chip 30, and the second routing portion 5220 may be located at the second metal layer 120 away from the first chip 30. Since the projection of the routing line 5230 overlaps with the projection of at least part of the primary routing portion 5010, it means that at least part of the primary routing portion 5010 and the second routing portion 5220 are arranged side by side in the specified direction H. Therefore, compared with the technical solution of arranging the primary routing portion 5010 and the second routing portion 5220 on the substrate 10 including only a single metal layer, the layout method in this embodiment can save the layout space of the substrate 10, making the structure of the RF front-end module 100 more compact, which is conducive to the miniaturization design of the RF front-end module 100.

[0038] In some other possible embodiments, Figure 4 As shown, the second routing portion 5220 and the primary side routing portion 5010 may both be disposed on the second chip 70 .

[0039] The number of the third metal layer 720 of the second chip 70 can be one, then the primary routing portion 5010 and the second routing portion 5220 are located in the same third metal layer 720, and the routing line 5230 surrounds the periphery of the primary routing portion 5010. In this case, the routing line 5230 formed by the second routing portion 5220 and the first routing portion 5210 connected in series is completely surrounded by the periphery of the primary coil 500, so that the primary routing portion 5010, the first binding wire 5030 and the second binding wire 5050 completely fall into the surrounding area defined by the secondary coil 520, thereby increasing the coupling area between the primary coil 500 and the secondary coil 520, and thus increasing the coupling coefficient between the two. In addition, the second chip 70 is a single-layer metal chip, which can save the hardware cost of the RF front-end module 100.

[0040] There may be multiple third metal layers 720, and the multiple third metal layers 720 are spaced apart from each other in a specified direction H. The specified direction H is the thickness direction of the second chip 70. The primary edge routing portion 5010 and the second routing portion 5220 are located in different third metal layers 720, respectively.

[0041] As an implementation mode, when the routing line 5230 and the primary routing portion 5010 are projected onto the same plane along a specified direction H, the projection of the routing line 5230 can surround the periphery of the projection of the primary routing portion 5010. At this time, the routing line 5230 formed by the second routing portion 5220 and the first routing portion 5210 connected in series is completely surrounded by the periphery of the primary coil 500, thereby improving the coupling coefficient between the primary coil 500 and the secondary coil 520.

[0042] As another embodiment, when the routing line 5230 and the primary routing portion 5010 are projected onto the same plane along the specified direction H, the projection of the routing line 5230 overlaps with the projection of at least a portion of the primary routing portion 5010. Figure 7 , the primary routing portion 5010 may be located at the third metal layer 720 away from the substrate 10, and the second routing portion 5220 may be located at the third metal layer 720 close to the substrate 10. Since the projection of the routing line 5230 overlaps with the projection of at least part of the primary routing portion 5010, it means that at least part of the primary routing portion 5010 and the second routing portion 5220 are arranged side by side in the specified direction H. Therefore, compared with the technical solution of arranging the primary routing portion 5010 and the second routing portion 5220 on the second chip 70 including only a single metal layer, the layout method in this embodiment can save the layout space of the second chip 70, making the structure of the RF front-end module 100 more compact, which is conducive to the miniaturization design of the RF front-end module 100.

[0043] In this example, please refer again to Figure 1 The secondary coil 520 may further include a third routing portion 5240, which is disposed on the first chip 30, and the third routing portion 5240 and the first routing portion 5210 are spaced apart. The first routing portion 5210, the second routing portion 5220, and the third routing portion 5240 are sequentially connected in series. Therefore, the secondary coil 520 may increase its overall length by disposing the third routing portion 5240, thereby increasing the turns ratio between the secondary coil 520 and the primary coil 500, and improving the power of the RF signal output by the balun 50.

[0044] The third routing portion 5240 may be substantially “C”-shaped and arranged around the first metal layer 340 of the first chip 30 , and an opening of the third routing portion 5240 faces the side where the first output terminal 300 and the second output terminal 320 are located.

[0045] In some possible embodiments, the number of first metal layers 340 of the first chip 30 can be one, then the first routing portion 5210 and the third routing portion 5240 are located on the same third metal layer 720, and the third routing portion 5240 is located on the side of the first routing portion 5210 away from the first output end 300, and partially surrounds the outer periphery of the first routing portion 5210, so that the secondary coil 520 is more compact when wound on the first chip 30.

[0046] In some other possible embodiments, the number of the first metal layers 340 may also be multiple, and the multiple first metal layers 340 are spaced apart from each other in a specified direction H. The specified direction H is the thickness direction of the first chip 30. The first routing portion 5210 and the third routing portion 5240 are respectively located in different first metal layers 340.

[0047] As an embodiment, the projection of the third routing portion 5240 on the first metal layer 340 where the first routing portion 5210 is located is located on the side of the first routing portion 5210 away from the first output end 300 , so that the projection of the third routing portion 5240 surrounds the periphery of the first routing portion 5210 .

[0048] As another implementation, the projection of the third wiring portion 5240 on the first metal layer 340 where the first wiring portion 5210 is located overlaps at least a portion of the first wiring portion 5210. Figure 4 , the first routing portion 5210 may be located at the first metal layer 340 away from the substrate 10, and the third routing portion 5240 may be located at the first metal layer 340 close to the substrate 10. Since the projection of the third routing portion 5240 overlaps with the projection of at least part of the first routing portion 5210, it means that at least part of the first routing portion 5210 and the third routing portion 5240 are arranged side by side in the specified direction H. Therefore, compared with the technical solution of arranging the third routing portion 5240 and the first routing portion 5210 on the first chip 30 including only a single metal layer, the layout method in this embodiment can save the layout space of the first chip 30, making the structure of the RF front-end module 100 more compact, which is conducive to the miniaturization design of the RF front-end module 100.

[0049] In this embodiment, the secondary coil 520 may further include a third binding wire 5250 and a fourth binding wire 5260, which may respectively play a role in signal transmission. Specifically, the third binding wire 5250 and the fourth binding wire 5260 may respectively be a single-strand binding wire or a multi-strand binding wire, which is not specifically limited in this embodiment.

[0050] In some possible embodiments, the first end 5212 of the first routing portion 5210 is used for grounding, the second end 5214 of the first routing portion 5210 is connected to the first end 5221 of the second routing portion 5220 through the third binding wire 5250, the second end 5223 of the second routing portion 5220 is connected to the first end 5241 of the third routing portion 5240 through the fourth binding wire 5260, and the second end 5243 of the third routing portion 5240 is used for outputting RF signals. Therefore, the first routing portion 5210, the third binding wire 5250, the second routing portion 5220, the fourth binding wire 5260 and the third routing portion 5240 in this embodiment are sequentially connected in series to form the secondary coil 520 of the balun 50. In other possible embodiments, the first end 5212 of the first routing portion 5210 is used for outputting RF signals, and the second end 5243 of the third routing portion 5240 is used for grounding. This application does not make any specific limitation to this, and the following description will be given with the first end 5212 of the first wiring portion 5210 being used for grounding, and the second end 5243 of the third wiring portion 5240 being used for outputting a radio frequency signal.

[0051] For some possible embodiments, please refer again to Figure 4 The first chip 30 may also be provided with a ground terminal 370, and the first end 5212 of the first wiring portion 5210 is directly connected to the ground terminal 370, so that the secondary coil 520 is more flexible when grounding. In some possible embodiments, the first chip 30 may also be provided with a signal output terminal 390, and the second end 5243 of the third wiring portion 5240 is directly connected to the signal output terminal 390, so that the secondary coil 520 is more flexible when outputting signals.

[0052] In some possible embodiments, the secondary coil 520 may further include a fifth binding wire 5270 and a fourth routing portion 5275, wherein the fourth routing portion 5275 is disposed between the second routing portion 5220 and the primary routing portion 5010, and the first end 5212 of the first routing portion 5210 is connected to one end of the fourth routing portion 5275 through the fifth binding wire 5270, and the other end of the fourth routing portion 5275 is used for grounding. Therefore, the first routing portion 5210, the fifth binding wire 5270 and the fourth routing portion 5275 are connected in series, and the overall length of the secondary coil 520 can be further increased by providing the fifth binding wire 5270 and the fourth routing portion 5275, thereby increasing the turns ratio between the secondary coil 520 and the primary coil 500, and improving the power of the RF signal output by the balun 50.

[0053] As an implementation method, when the second routing portion 5220 and the primary routing portion 5010 are both disposed on the substrate 10, the fourth routing portion 5275 can also be disposed on the substrate 10. As another implementation method, please refer to Figure 7When the second routing portion 5220 and the primary side routing portion 5010 are both arranged in the second chip 70, the fourth routing portion 5275 can also be arranged in the second chip 70, so that the layout of the fourth routing portion 5275 is more flexible and the overall structure of the balun 50 is more compact.

[0054] In some possible embodiments, the secondary coil 520 may further include a sixth binding wire 5280 and a fifth routing portion 5285, wherein the fifth routing portion 5285 is disposed at the periphery of the second routing portion 5220, and the second end 5243 of the third routing portion 5240 is connected to one end of the fifth routing portion 5285 through the sixth binding wire 5280, and the other end of the fifth routing portion 5285 is used to output a radio frequency signal. Therefore, the third routing portion 5240, the sixth binding wire 5280, and the fifth routing portion 5285 are connected in series, and the overall length of the secondary coil 520 can be further increased by providing the sixth binding wire 5280 and the fifth routing portion 5285, thereby increasing the turns ratio between the secondary coil 520 and the primary coil 500, and improving the power of the radio frequency signal output by the balun 50.

[0055] As an implementation method, when the second routing portion 5220 and the primary routing portion 5010 are both disposed on the substrate 10, the fifth routing portion 5285 can also be disposed on the substrate 10. As another implementation method, please refer to Figure 7 In the case where the second routing portion 5220 and the primary routing portion 5010 are both disposed on the second chip 70, the fifth routing portion 5285 can also be disposed on the second chip 70, so that the layout of the fifth routing portion 5285 is more flexible and the overall structure of the balun 50 is more compact. In this embodiment, one end of the fifth routing portion 5285 for signal output can be directly connected to a signal output end (not shown in the figure) disposed on the second chip 70, and one end of the fifth routing portion 5285 for signal output can also be connected to a signal output port (not shown in the figure) on the substrate 10 through a binding wire, and this embodiment does not specifically limit this.

[0056] In this embodiment, the RF front-end module 100 further includes a matching capacitor 90, which can be connected to the secondary coil 520 of the balun 50, and can play an impedance matching role for the secondary coil 520, thereby improving the signal output quality of the RF front-end module 100. Specifically, the matching capacitor 90 can be integrated in the second chip 70, so that the overall structure of the RF front-end module 100 is more compact and reasonable. The matching capacitor 90 can also be attached to the substrate 10, and the specific setting method of the matching capacitor 90 is not limited in this embodiment.

[0057] exist Figure 7In the illustrated embodiment, the matching capacitor 90 is integrated in the second chip 70, and one end of the fourth routing portion 5275 for grounding is grounded through the matching capacitor 90, that is, the matching capacitor 90 is connected in series between the fourth routing portion 5275 and the grounding point. The above-mentioned "grounding point" may be a grounding terminal (not shown in the figure) provided on the second chip 70, or may be a grounding port 160 provided on the substrate 10. Exemplarily, one end of the fourth routing portion 5275 for grounding may be connected to one end of the matching capacitor 90 by a binding wire, and the other end of the matching capacitor 90 is connected to the grounding port 160 provided on the substrate 10 by a binding wire.

[0058] The embodiment of the present application provides a radio frequency front-end module 100, which may include a substrate 10, a first chip 30 and a balun 50. The first chip 30 is disposed on the substrate 10, and the first chip 30 is provided with a first output terminal 300 and a second output terminal 320.

[0059] The balun 50 may include a primary coil 500 and a secondary coil 520. The primary coil 500 includes a primary routing portion 5010, a first binding wire 5030 and a second binding wire 5050. The primary routing portion 5010 is arranged in a surrounding manner. One end of the primary routing portion 5010 is connected to the first output terminal 300 through the first binding wire 5030, and the other end of the primary routing portion 5010 is connected to the second output terminal 320 through the second binding wire 5050.

[0060] One end of the secondary coil 520 is used to output the RF signal, and the other end is grounded. The secondary coil 520 may include a first routing portion 5210 and a second routing portion 5220, and the first routing portion 5210 is disposed on the first chip 30 in a circumferential manner. The second routing portion 5220 and the first routing portion 5210 are connected in series, and a routing line 5230 formed by the second routing portion 5220 and the first routing portion 5210 in series surrounds the periphery of the first binding wire 5030 and the second binding wire 5050.

[0061] An embodiment of the present application provides a radio frequency front-end module 100. Since the routing line 5230 formed by the second routing portion 5220 and the first routing portion 5210 of the secondary coil 520 connected in series surrounds the periphery of the first binding wire 5030 and the second binding wire 5050, the secondary coil 520 of the balun 50 in the present application is almost completely surrounded by the periphery of the primary coil 500. When the primary coil 500 remains unchanged, the coupling area between the primary coil 500 and the secondary coil 520 is increased, thereby increasing the coupling coefficient between the two, thereby improving the signal output efficiency of the radio frequency signal and reducing the signal insertion loss of the radio frequency signal.

[0062] In the specification of this application, certain words are used to refer to specific components in the specification and claims. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in name as a way to distinguish components, but use the difference in function of the components as the criterion for distinction. For example, "including" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to"; "substantially" means that those skilled in the art can solve technical problems within a certain error range and basically achieve technical effects.

[0063] In the description of the present application, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", and "inside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are merely simplified descriptions for the convenience of describing the present application. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present application.

[0064] In this application, unless otherwise clearly specified or limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be internal communication between two elements, or it can be only surface contact. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0065] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0066] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A radio frequency front-end module, characterized in that: include: substrate; A first chip is disposed on the substrate, wherein the first chip is provided with a first output terminal and a second output terminal; as well as A balun, comprising a primary coil and a secondary coil; the primary coil comprises a primary wiring portion, a first binding wire and a second binding wire, the primary wiring portion is arranged in a surrounding manner, one end of the primary wiring portion is connected to the first output end through the first binding wire, and the other end of the primary wiring portion is connected to the second output end through the second binding wire; One end of the secondary coil is used to output a radio frequency signal, and the other end is grounded; the secondary coil includes a first wiring portion and a second wiring portion, and the first wiring portion is disposed on the first chip in a surrounding manner; The second routing portion and the first routing portion are connected in series, and a routing line formed by the second routing portion and the first routing portion being connected in series surrounds the outer circumference of the first binding wire and the second binding wire.

2. The RF front-end module according to claim 1, characterized in that: The secondary coil further includes a third routing portion, which is disposed on the first chip, and the third routing portion and the first routing portion are spaced apart; the first routing portion, the second routing portion and the third routing portion are sequentially connected in series.

3. The RF front-end module according to claim 2, characterized in that: The secondary coil also includes a third binding wire and a fourth binding wire; The first end of the first routing portion is used for grounding, the second end of the first routing portion is connected to the first end of the second routing portion through the third binding wire, the second end of the second routing portion is connected to the first end of the third routing portion through the fourth binding wire, and the second end of the third routing portion is used for outputting a radio frequency signal.

4. The RF front-end module according to claim 3, characterized in that: The first chip is provided with a ground terminal, and the first end of the first wiring portion is connected to the ground terminal; or The secondary coil also includes a fifth binding wire and a fourth routing portion, the fourth routing portion is arranged between the second routing portion and the primary routing portion; the first end of the first routing portion is connected to one end of the fourth routing portion through the fifth binding wire, and the other end of the fourth routing portion is used for grounding.

5. The RF front-end module according to claim 3, characterized in that: The first chip is provided with a signal output terminal, and the second end of the third wiring portion is connected to the signal output terminal; or The secondary coil also includes a sixth binding wire and a fifth routing portion, the fifth routing portion is arranged on the outer periphery of the second routing portion; the second end of the third routing portion is connected to one end of the fifth routing portion through the sixth binding wire, and the other end of the fifth routing portion is used to output a radio frequency signal.

6. The RF front-end module according to claim 2, characterized in that: The first chip is provided with at least one first metal layer, the first routing portion and the third routing portion are located in the same first metal layer, and the third routing portion is located on a side of the first routing portion away from the first output end.

7. The RF front-end module according to claim 2, characterized in that: The first chip is provided with a plurality of first metal layers, and the plurality of first metal layers are spaced apart from each other in a specified direction; the first routing portion and the third routing portion are respectively located in different first metal layers; A projection of the third wiring portion on the first metal layer where the first wiring portion is located is located on a side of the first wiring portion away from the first output end; or A projection of the third routing portion on the first metal layer where the first routing portion is located overlaps with at least a portion of the first routing portion.

8. The RF front-end module according to claim 1, characterized in that: The first chip is a complementary metal oxide semiconductor chip or a heterojunction bipolar transistor chip.

9. The RF front-end module according to claim 1, characterized in that: The primary routing portion and the second routing portion are arranged on the substrate, the substrate is provided with at least one second metal layer, the primary routing portion and the second routing portion are located in the same second metal layer, and the routing line surrounds the periphery of the primary routing portion.

10. The RF front-end module according to claim 1, characterized in that: The primary routing portion and the second routing portion are arranged on the substrate, the substrate is provided with a plurality of second metal layers, and the plurality of second metal layers are spaced apart from each other in a specified direction; the primary routing portion and the second routing portion are respectively located in different second metal layers; When the routing line and the primary routing portion are projected onto the same plane along the specified direction, the projection of the routing line surrounds the periphery of the projection of the primary routing portion; or When the routing line and the primary routing portion are projected onto the same plane along the designated direction, the projection of the routing line overlaps with at least a portion of the projection of the primary routing portion.

11. The RF front-end module according to claim 1, characterized in that: The RF front-end module further includes a second chip, and the second chip and the first chip are located on the same surface of the substrate; The primary routing portion and the second routing portion are arranged on the second chip.

12. The RF front-end module according to claim 11, characterized in that: The second chip is provided with at least one third metal layer, the primary routing portion and the second routing portion are located in the same third metal layer, and the routing line surrounds the periphery of the primary routing portion.

13. The RF front-end module according to claim 11, characterized in that: The second chip is provided with a plurality of third metal layers, and the plurality of third metal layers are spaced apart from each other in a specified direction; the primary edge routing portion and the second routing portion are respectively located in different third metal layers; When the routing line and the primary routing portion are projected onto the same plane along the specified direction, the projection of the routing line surrounds the periphery of the projection of the primary routing portion; or When the routing line and the primary routing portion are projected onto the same plane along the designated direction, the projection of the routing line overlaps with at least a portion of the projection of the primary routing portion.

14. The RF front-end module according to claim 11, characterized in that: The RF front-end module further includes a matching capacitor, and the matching capacitor is integrated in the second chip; One end of the secondary coil used for grounding is grounded through the matching capacitor.

15. The RF front-end module according to claim 11, characterized in that: The second chip is an integrated passive device chip.

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