High-strength and high-liquid-carrying superfine tungsten-based material electroplating diamond wire and preparation method thereof

Abstract

The invention relates to a preparation method of a high-strength and high-liquid-carrying-capacity superfine tungsten-based material electroplating diamond wire. The tungsten powder, the molybdenum powder and the lanthanum powder are prepared into rods according to a specific formula, and the steps of rotary swaging, drawing, oil removing, acid pickling, nickel layer pre-plating, sand feeding, two-time curing, drying and the like are carried out. A nickel-cobalt alloy coating is formed in curing I, so that the tensile strength and the breaking force are improved, and the line breaking risk is reduced; and a rough crystal coating obtained through curing II improves the liquid carrying capacity, and is beneficial to chip removal and reduction of diamond abrasion. According to the method, the bottleneck problem of wire thinning is solved, and the produced electroplated diamond wire adapts to the cost reduction requirement of the solar photovoltaic power generation industry, has high strength, high wear resistance, good liquid carrying capacity and process stability, can improve the silicon wafer cutting quality and efficiency, reduces silicon material loss, reduces the production cost, and provides powerful support for the development of the photovoltaic industry.

Description

Technical Field

[0001] The invention relates to the field of production and preparation of diamond wire saws, and mainly relates to a method for preparing a high-strength, high-liquid-carrying capacity ultrafine tungsten-based material electroplated diamond wire. Background Art

[0002] With the growing demand for energy and the urgent pursuit of clean energy, solar photovoltaic power generation has developed rapidly as a sustainable energy solution. In the solar photovoltaic power generation industry, efficient silicon wafer cutting is a crucial link, which is directly related to the production quality and cost-effectiveness of solar cells.

[0003] As a key tool for silicon wafer cutting, the performance of electroplated diamond wire has a significant impact on the development of the entire photovoltaic industry. With the continuous advancement of technology, in order to better reduce the cost of photovoltaic power generation, the field of electroplated diamond wire for silicon wafer cutting has been actively promoting the thinning technology. Thinning diamond wire can reduce silicon material loss and improve cutting accuracy during the cutting process, thereby improving the conversion efficiency of solar cells and reducing production costs.

[0004] Tungsten-based materials have gradually taken a dominant position in the thinning of the electroplated diamond wire market due to their unique performance advantages. Compared with traditional carbon steel wire cores, tungsten-based wire cores have higher tensile strength, better torsional fracture performance, and lower ductility deformation. Specifically, the tensile strength of tungsten-based wire cores is 1.2-1.5 times that of carbon steel wire cores, the torsional fracture index is 8-12 times that of carbon steel wire cores, and the ductility deformation is only about 60% of that of carbon steel wire cores. This allows tungsten-based diamond wires to withstand greater tension during the cutting process, reduce the risk of wire breakage, and improve cutting efficiency.

[0005] However, despite the significant advantages of tungsten-based materials in wire thinning, the current promotion of electroplated diamond wire thinning still faces many challenges. The existing mass-produced electroplated diamond wire process uses carbon steel as the wire core and uses a minimum 35μm wire core. The finished diamond wire has an outer diameter of 44μm and a breaking force of ≥5.0N. As the carbon steel wire core is further refined, its tensile strength is difficult to meet the cutting tension requirements required during cutting, so it is difficult to continue to promote refinement. The minimum 30μm wire core is used for tungsten-based alloy materials as the wire core, and the finished diamond wire has an outer diameter of 39μm and a breaking force of ≥5.1N. Although the tungsten-based material wire core has achieved finer specifications to a certain extent, with the further refinement of the wire core, new problems have also been brought about.

[0006] On the one hand, the tensile strength of the base material of the thinner wire core is lower. In the process of thinning, the diameter of the wire core decreases, and its cross-sectional area also decreases accordingly, which leads to a decrease in the tensile force that the wire core can withstand. When the tensile strength of the wire core is insufficient, it is easy to break during the cutting process, affecting production efficiency and product quality.

[0007] On the other hand, thinner wire core substrate products have smaller outer diameters, more slits for the same rod length and thickness, and more powder to be removed during cutting. If too much powder cannot be removed in time, it will accumulate in the cutting slits, increase cutting resistance, reduce the cutting force of the diamond wire, make the cutting wire bow larger, and increase the risk of wire breakage. At the same time, the accumulation of powder will also affect the cutting accuracy and the surface quality of the silicon wafer.

[0008] At present, in order to strictly control costs, silicon wafer cutting companies are constantly pursuing the reduction of cutting wire usage and the shortening of cutting time. However, while meeting these requirements, the thinner tungsten-based alloy wire cores also face a higher risk of wire breakage. This has temporarily brought the thinning of electroplated diamond wires into a bottleneck period. A new preparation method is urgently needed to solve these problems in order to achieve further thinning of electroplated diamond wires, improve the efficiency of solar photovoltaic power generation and reduce costs. Summary of the invention

[0009] The purpose of the present invention is to provide a method for preparing a high-strength, high-liquid-carrying capacity ultrafine tungsten-based material electroplated diamond wire, so as to solve the problems encountered in the prior art in the process of advancing the thinning of the electroplated diamond wire and improve the performance and service life of the diamond wire.

[0010] A method for preparing a high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire comprises the following steps:

[0011] S1 tungsten-based material rod:

[0012] Prepare tungsten powder and molybdenum powder with a purity of ≥99.9%. According to the formula ratio of tungsten powder ≥95wt%, molybdenum powder 3.5-4.0wt%, and lanthanum powder 0.3-1.0wt%, mix the above powders evenly and put them into a mold for hot isostatic pressing to form an alloy material rod.

[0013] S2 rotary forging process:

[0014] The 35 mm diameter alloy rod produced in step S1 is subjected to 25 cycles of rotary forging at a high temperature of 1500°C, with each compression amount being 0.8-1.2 mm, to produce a metal wire body with a diameter of 8 mm.

[0015] S3 wire drawing:

[0016] First, in the temperature range of 600-2400°C, different compression amounts are set to perform rough drawing 20-25 times to produce a wire with a diameter of 0.50-0.55mm; then in the temperature range of 200-400°C, different compression amounts are set to perform fine drawing 45-60 times. During the drawing, annealing treatment is performed at 850°C when the wire is drawn to 0.15mm. After annealing, drawing is continued to produce a wire with a diameter of 0.027mm-0.040mm.

[0017] S4 degreasing treatment:

[0018] The tungsten-based material wire core is electrolytically degreased in 60g / L electrolytic degreasing liquid for 5-8 seconds, with an electrolytic current of 0.8-1.0A. Then it is degreased in 30g / L chemical degreasing liquid for 1-2 seconds to completely remove the grease substances that have not been completely removed from the surface of the wire core during the electrolytic degreasing process.

[0019] S5 pickling:

[0020] Immerse the wire core in a PH=1 aminosulfonic acid solution for 3-4 seconds to remove the oxide layer on the surface of the wire core.

[0021] S6 pre-nickel plating:

[0022] The core is electrochemically deposited in a nickel sulfamate solution to deposit a nickel layer with a thickness of 0.02-0.10 μm. The nickel ion concentration of the nickel sulfamate solution used is 85-100 g / L, the boric acid concentration is 28-38 g / L, the nickel chloride concentration is 5-10 g / L, and the current density is 1.0-2.0 A / dm 2 .

[0023] S7 sanding:

[0024] While completing nickel deposition in the nickel sulfamate solution, diamond particles are also deposited on the wire core that has completed the pre-nickel plating. The thickness of the nickel plating layer in the sanding process is 0.5-1.0μm. The nickel ion concentration of the nickel sulfamate solution is 85-100g / L, the boric acid concentration is 28-38g / L, and the nickel chloride concentration is 5.0-10.0g / L; the diamond particle concentration is 8.0-15.0ct / L, and the current density is 5.0-10.0A / dm 2 .

[0025] S8 curing Ⅰ:

[0026] Through electrochemical reaction, the wire core is plated with 1.0-2.0μm nickel-cobalt alloy in a mixed solution of nickel sulfamate and cobalt sulfamate. The material hardness of cobalt is 1.3-1.7 times that of nickel, and the thermal conductivity is 1.6 times that of nickel. Cobalt also has good corrosion resistance and high temperature resistance, which reduces the risk of wire breakage during cutting. The nickel ion concentration in the electroplating solution used is 85-100g / L, the cobalt ion concentration is 5-15g / L, the boric acid concentration is 28-38g / L, the nickel chloride concentration is 5.0-10.0g / L, and the current density is 10.0-15.0A / dm 2 .

[0027] S9 curing Ⅱ:

[0028] Through electrochemical reaction, the wire body that has been cured I is coated with a rough crystalline layer with a thickness of 0.5-1.0μm in a nickel sulfamate solution. The nickel ion concentration in the electroplating solution used is 65-80g / L, the cobalt ion concentration is 5.0-15.0g / L, the boric acid concentration is 25-35g / L, and the nickel chloride concentration is 5.0-10.0g / L; the current density is 20-30A / dm 2 , PH controlled at 4.5-5.0. The relatively rough nickel plating layer is more conducive to carrying more cutting fluid during the steel wire cutting process, thereby taking away more cutting waste. At the same time, carrying more cutting fluid can also reduce the temperature of the steel wire cutting point to avoid high-temperature carbonization of diamonds and reduce diamond wear.

[0029] S10 Drying:

[0030] The electroplated diamond wire that has completed curing II is washed with 60°C hot water and then placed in a 150-200°C drying device for 2-3 seconds to remove any water stains from the surface of the electroplated diamond wire, thereby obtaining a finished product.

[0031] Beneficial Effects of the Invention

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] 1. Improve the performance of diamond wire

[0034] High strength: Through the specific formula of tungsten-based material rod making and the subsequent swaging, drawing and other processes, combined with the nickel-cobalt alloy coating formed during solidification, the diamond wire has extremely high tensile strength and breaking force. Compared with traditional materials, the tungsten-based material core itself has better mechanical properties, coupled with the strengthening effect of the nickel-cobalt alloy coating, it greatly reduces the risk of wire breakage during use and can adapt to more stringent cutting conditions.

[0035] High wear resistance: The nickel-cobalt alloy coating and the strong adhesion of diamond particles make the diamond wire have excellent wear resistance during the cutting process. This not only prolongs the service life of the diamond wire, reduces the frequency of replacement, and reduces production costs, but also ensures the stability and consistency of cutting, and improves the cutting quality of silicon wafers.

[0036] 2. Optimize cutting effect

[0037] Good liquid carrying capacity: The rough crystalline coating formed during curing II enables the diamond wire to carry more cutting liquid. During the cutting process, more cutting liquid can better carry away the waste generated by cutting, reduce the interference of waste on cutting, reduce cutting resistance, and improve cutting efficiency. At the same time, the cutting liquid can also reduce the temperature of the steel wire cutting point, avoid high-temperature carbonization of diamond, reduce diamond wear, maintain the sharpness of diamond, and further improve the cutting effect.

[0038] Reduce cutting wire bow: Due to the high strength and good liquid carrying capacity of diamond wire, the wire bow phenomenon during the cutting process can be reduced. This means more precise cutting, better uniformity of silicon wafer thickness, and improved quality and yield of silicon wafers.

[0039] 3. Adapt to the needs of thin lines

[0040] Breaking through the bottleneck of thinning: With the pursuit of cost reduction in the solar photovoltaic power generation industry, the thinning of electroplated diamond wires for silicon wafer cutting is an inevitable trend. The preparation method of the present invention can produce ultra-fine tungsten-based electroplated diamond wires, solving the problems of low tensile strength of the substrate of the thinner wire core and difficulty in chip removal, and providing a feasible solution for the thinning of electroplated diamond wires.

[0041] Meeting cost control requirements: Thinner diamond wire can reduce silicon material loss, improve cutting accuracy, reduce cutting wire usage and cutting time, and meet the strict cost control requirements of various silicon wafer cutting companies. At the same time, the preparation method of the present invention can achieve efficient production while ensuring performance, further reducing production costs.

[0042] 4. Process stability and reliability

[0043] Precise process control: There are clear process parameters and operating requirements in each step from tungsten-based material rod making to drying. Strict process control ensures the quality stability and consistency of the product, reduces uncertainty in the production process, and improves production efficiency and yield rate.

[0044] Good coating adhesion: Through the processes of pre-nickel plating, sanding and curing, the coating and the wire core, as well as the diamond particles and the coating, have good adhesion. This ensures that the coating and diamond particles will not fall off easily during the use of the diamond wire, and improves the reliability and service life of the diamond wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The foregoing and following detailed description of the present invention will become more apparent when read in conjunction with the following drawings, in which: Figure 1 The present invention relates to a step diagram of a method for preparing a high-strength, high-liquid-carrying capacity ultrafine tungsten-based material electroplated diamond wire.

[0046] Figure 2 It is a normal smooth coating of the prior art non-curing II process involved in the present invention.

[0047] Figure 3 The present invention relates to an improved rough coating with a curing II process. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below. If the specific conditions are not specified in the embodiments, they are carried out according to the conventional conditions or the conditions recommended by the manufacturer. If the manufacturer is not specified for the reagents or instruments used, they are all conventional products that can be purchased commercially.

[0049] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to specific embodiments.

[0050] Embodiment 1:

[0051] A method for preparing a high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire comprises the following steps:

[0052] S1 tungsten-based material rod:

[0053] Prepare tungsten powder and molybdenum powder with a purity of ≥99.9%. According to the formula ratio of tungsten powder ≥95wt%, molybdenum powder 3.5-4.0wt%, and lanthanum powder 0.3-1.0wt%, mix the above powders evenly and put them into a mold for hot isostatic pressing to form an alloy material rod.

[0054] S2 rotary forging process:

[0055] The 35 mm diameter alloy rod produced in step S1 is subjected to 25 cycles of rotary forging at a high temperature of 1500°C, with each compression amount being 0.8-1.2 mm, to produce a metal wire body with a diameter of 8 mm.

[0056] S3 wire drawing:

[0057] First, in the temperature range of 600-2400°C, different compression amounts are set to perform rough drawing 20-25 times to produce a wire with a diameter of 0.50-0.55mm; then in the temperature range of 200-400°C, different compression amounts are set to perform fine drawing 45-60 times. During the drawing, annealing treatment is performed at 850°C when the wire is drawn to 0.15mm. After annealing, drawing is continued to produce a wire with a diameter of 0.027mm-0.040mm.

[0058] S4 degreasing treatment:

[0059] The tungsten-based material wire core is electrolytically degreased in 60g / L electrolytic degreasing liquid for 5-8 seconds, with an electrolytic current of 0.8-1.0A. Then it is degreased in 30g / L chemical degreasing liquid for 1-2 seconds to completely remove the grease substances that have not been completely removed from the surface of the wire core during the electrolytic degreasing process.

[0060] S5 pickling:

[0061] Immerse the wire core in a PH=1 aminosulfonic acid solution for 3-4 seconds to remove the oxide layer on the surface of the wire core.

[0062] S6 pre-nickel plating:

[0063] The core is electrochemically deposited in a nickel sulfamate solution to deposit a nickel layer with a thickness of 0.02-0.10 μm. The nickel ion concentration of the nickel sulfamate solution used is 85-100 g / L, the boric acid concentration is 28-38 g / L, the nickel chloride concentration is 5-10 g / L, and the current density is 1.0-2.0 A / dm 2 .

[0064] S7 sanding:

[0065] While completing nickel deposition in the nickel sulfamate solution, diamond particles are also deposited on the wire core that has completed the pre-nickel plating. The thickness of the nickel plating layer in the sanding process is 0.5-1.0μm. The nickel ion concentration of the nickel sulfamate solution is 85-100g / L, the boric acid concentration is 28-38g / L, and the nickel chloride concentration is 5.0-10.0g / L; the diamond particle concentration is 8.0-15.0ct / L, and the current density is 5.0-10.0A / dm 2 .

[0066] S8 curing Ⅰ:

[0067] Through electrochemical reaction, the wire core is plated with 1.0-2.0μm nickel-cobalt alloy in a mixed solution of nickel sulfamate and cobalt sulfamate. The material hardness of cobalt is 1.3-1.7 times that of nickel, and the thermal conductivity is 1.6 times that of nickel. Cobalt also has good corrosion resistance and high temperature resistance, which reduces the risk of wire breakage during cutting. The nickel ion concentration in the electroplating solution used is 85-100g / L, the cobalt ion concentration is 5-15g / L, the boric acid concentration is 28-38g / L, the nickel chloride concentration is 5.0-10.0g / L, and the current density is 10.0-15.0A / dm 2 .

[0068] S9 curing Ⅱ:

[0069] Through electrochemical reaction, the wire body that has been cured I is coated with a rough crystalline coating of 0.5-1.0μm in thickness in a nickel sulfamate solution. The nickel ion concentration in the electroplating solution is 65-80g / L, the cobalt ion concentration is 5.0-15.0g / L, the boric acid concentration is 25-35g / L, and the nickel chloride concentration is 5.0-10.0g / L; the current density is 20-30A / dm2, and the pH is controlled at 4.5-5.0. The rough nickel coating is more conducive to carrying more cutting fluid during the steel wire cutting process, thereby taking away more cutting waste. At the same time, carrying more cutting fluid can also reduce the temperature of the steel wire cutting point to avoid high-temperature carbonization of diamonds and reduce diamond wear.

[0070] S10 Drying:

[0071] The electroplated diamond wire that has completed curing II is washed with 60°C hot water and then placed in a 150-200°C drying device for 2-3 seconds to remove any water stains from the surface of the electroplated diamond wire, thereby obtaining a finished product.

[0072] Embodiment 2:

[0073] Preparation of high-strength and high-liquid-carrying ultra-fine tungsten-based electroplated diamond wire

[0074] 1. Raw materials preparation

[0075] According to the invention requirements, prepare tungsten powder, molybdenum powder and lanthanum powder with a purity of ≥99.9%. Accurately weigh the tungsten powder to ensure that its content is ≥95wt%, the content of molybdenum powder is controlled at about 3.8wt%, and the content of lanthanum powder is 0.5wt%. These powders are fully mixed to ensure the stability of the performance of the alloy material formed later.

[0076] 2. Tungsten-based material rods (S1)

[0077] The mixed powder is placed in a special mold for hot isostatic pressing. Under the action of high temperature and high pressure, the powder particles are tightly combined to form an alloy material rod. The rod after hot isostatic pressing has a uniform organizational structure and good mechanical properties.

[0078] 3. Rotary forging process (S2)

[0079] The alloy rod with a diameter of 35mm is placed in the rotary forging equipment and rotary forged at a high temperature of 1500℃. The rotary forging is repeated 25 times, and the compression amount is controlled at about 1mm each time. Through rotary forging, the diameter of the alloy rod is gradually reduced, and the grain of the material is refined, and the strength and toughness are further improved. Finally, a metal wire with a diameter of 8mm is produced.

[0080] 4. Wire drawing (S3)

[0081] Rough drawing: First, the temperature range is between 1000-2000℃, and different compression amounts are set according to different stages, and rough drawing is performed 22 times. After rough drawing, the wire diameter is reduced to about 0.52mm.

[0082] Annealing treatment: When the wire is drawn to a diameter of 0.15 mm, annealing treatment is performed. The wire is placed in an annealing furnace at a temperature of 850°C and kept warm for a period of time to eliminate the internal stress generated during the drawing process.

[0083] Fine drawing: After annealing, fine drawing is continued at a temperature range of 250-350°C. After about 50 times of fine drawing, the wire diameter is finally drawn to 0.03mm.

[0084] 5. Oil removal treatment (S4)

[0085] Electrolytic degreasing: Place the tungsten-based material wire core in 60g / L electrolytic degreasing liquid, pass an electrolytic current of 0.9A, and perform electrolytic degreasing for 6 seconds. The electrode polarization effect causes the oil stains on the surface of the wire core to fall off quickly.

[0086] Chemical degreasing: Then place the wire core into 30g / L chemical degreasing liquid for 1.5 seconds to completely remove the grease and oil substances that have not been completely peeled off from the surface of the wire core.

[0087] 6. Pickling (S5)

[0088] Immerse the wire core in a sulfamic acid solution with a pH of 1 for 3.5 seconds to remove the oxide layer on the surface of the wire core and prepare for the subsequent nickel plating deposition.

[0089] 7. Pre-nickel plating layer (S6)

[0090] The core is electrochemically deposited in a nickel sulfamate solution. The nickel ion concentration in the solution is 90g / L, the boric acid concentration is 32g / L, the nickel chloride concentration is 8g / L, and the current density is controlled at 1.5A / dm 2 After a period of deposition, a uniform nickel layer with a thickness of 0.06 μm is formed on the surface of the wire core.

[0091] 8. Sanding (S7)

[0092] In the nickel sulfamate solution, nickel deposition and diamond particle deposition are carried out simultaneously. The nickel ion concentration in the solution is 90g / L, the boric acid concentration is 32g / L, the nickel chloride concentration is 8g / L, the diamond particle concentration is 10ct / L, and the current density is 8A / dm 2 After the sanding process is completed, the thickness of the nickel layer on the surface of the wire core reaches 0.8μm, and the diamond particles are evenly distributed on the nickel layer.

[0093] IX. Curing I (S8)

[0094] Through electrochemical reaction, the wire core is solidified in a composite solution of nickel sulfamate and cobalt sulfamate. The nickel ion concentration in the solution is 90g / L, the cobalt ion concentration is 10g / L, the boric acid concentration is 32g / L, the nickel chloride concentration is 8g / L, and the current density is 12A / dm 2 After solidification, a nickel-cobalt alloy coating with a thickness of 1.5 μm is formed on the surface of the wire core.

[0095] 10. Curing II (S9)

[0096] The wire body that has completed curing I is cured for the second time in a nickel sulfamate solution. The nickel ion concentration in the solution is 70g / L, the cobalt ion concentration is 10g / L, the boric acid concentration is 30g / L, the nickel chloride concentration is 8g / L, and the current density is 25A / dm 2 , PH is controlled at 4.8. After curing, a rough crystalline coating with a thickness of 0.8μm is formed on the surface of the wire.

[0097] 11. Drying (S10)

[0098] The electroplated diamond wire after curing II was washed with 60°C hot water and then placed in a drying device at 180°C for 2.5 seconds. No water stains remained on the surface of the diamond wire after drying, and the finished product was obtained.

[0099] The above is a preferred embodiment of the present invention, but the present invention is not limited to the above embodiment. Without departing from the principle of the present invention, ordinary technicians in this field can make various equivalent substitutions and improvements to the present invention, and these substitutions and improvements should be included in the protection scope of the present invention.

Claims

1. A method for preparing a high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire, characterized in that: The following steps are involved: S1. Making rods from tungsten-based materials: prepare tungsten powder and molybdenum powder with a purity of ≥99.9%; according to the formula ratio of tungsten powder ≥95wt%, molybdenum powder 3.5-4.0wt%, and lanthanum powder 0.3-1.0wt%, mix the above powders evenly and put them into a mold for hot isostatic pressing to form an alloy material rod.

2. The method for preparing high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire according to claim 1, characterized in that: S2 rotary forging process: The 35 mm diameter alloy rod produced in step S1 is subjected to 25 cycles of rotary forging at a high temperature of 1500°C, with each compression amount being 0.8-1.2 mm, to produce a metal wire body with a diameter of 8 mm.

3. The method for preparing high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire according to claim 1 or 2, characterized in that: S3 wire drawing: First, in the temperature range of 600-2400℃, set different compression amounts for 20-25 rough drawing to produce a wire with a diameter of 0.50-0.55mm; then in the temperature range of 200-400℃, set different compression amounts for 45-60 fine drawing. During the drawing, annealing treatment is carried out at 850℃ when the wire is drawn to 0.15mm. After annealing, continue drawing to produce a wire with a diameter of 0.027mm-0.040mm.

4. The method for preparing high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire according to any one of claims 1 to 3, characterized in that: S4 degreasing treatment: The tungsten-based material core is electrolytically degreased in 60g / L electrolytic degreasing liquid for 5-8 seconds, with an electrolytic current of 0.8-1.0A; then degreased in 30g / L chemical degreasing liquid for 1-2 seconds to completely remove the grease substances that have not been completely removed from the surface of the core during the electrolytic degreasing process.

5. The method for preparing high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire according to any one of claims 1 to 4, characterized in that: S5 pickling: Immerse the wire core in a PH=1 aminosulfonic acid solution for 3-4 seconds to remove the oxide layer on the surface of the wire core.

6. The method for preparing high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire according to any one of claims 1 to 5, characterized in that: S6 pre-nickel plating: The wire core is electrochemically deposited in a nickel sulfamate solution to complete the deposition of a nickel layer with a thickness of 0.02-0.10μm. The nickel ion concentration of the nickel sulfamate solution used is 85-100g / L, the boric acid concentration is 28-38g / L, the nickel chloride concentration is 5-10g / L, and the current density is 1.0-2.0A / dm 2 .

7. The method for preparing high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire according to any one of claims 1 to 6, characterized in that: S7 Sanding: While completing nickel deposition in the nickel sulfamate solution, diamond particles are also deposited on the wire core that has completed the pre-nickel plating. The thickness of the nickel plating layer in the sanding process is 0.5-1.0μm. The nickel ion concentration of the nickel sulfamate solution is 85-100g / L, the boric acid concentration is 28-38g / L, and the nickel chloride concentration is 5.0-10.0g / L; the diamond particle concentration is 8.0-15.0ct / L, and the current density is 5.0-10.0A / dm 2 .

8. The method for preparing high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire according to any one of claims 1 to 7, characterized in that: S8 curing I: Through electrochemical reaction, the wire core is plated with a 1.0-2.0μm nickel-cobalt alloy in a mixed solution of nickel sulfamate and cobalt sulfamate; the nickel ion concentration in the electroplating solution is 85-100g / L, the cobalt ion concentration is 5-15g / L, the boric acid concentration is 28-38g / L, the nickel chloride concentration is 5.0-10.0g / L, and the current density is 10.0-15.0A / dm 2 .

9. The method for preparing high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire according to any one of claims 1 to 8, characterized in that: S9 Curing II: Through electrochemical reaction, the wire body that has completed curing I is coated with a rough crystalline coating with a thickness of 0.5-1.0μm in a nickel sulfamate solution; the nickel ion concentration in the electroplating solution used is 65-80g / L, the cobalt ion concentration is 5.0-15.0g / L, the boric acid concentration is 25-35g / L, and the nickel chloride concentration is 5.0-10.0g / L; the current density is 20-30A / dm 2 , PH controlled at 4.5-5.

0.

10. The method for preparing high-strength, high-liquid-carrying ultrafine tungsten-based material electroplated diamond wire according to any one of claims 1 to 9, characterized in that: S10 Drying: The electroplated diamond wire that has completed curing II is washed with 60°C hot water and then placed in a 150-200°C drying device for 2-3 seconds to remove any water stains from the surface of the electroplated diamond wire, thereby obtaining a finished product.

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