Micromachining apparatus and method using laser

Abstract

The present invention relates to an apparatus and a method for micromachining using a laser beam, the apparatus comprising: a laser beam irradiation unit that irradiates a laser beam to a crystallized machining target through which the laser beam is transmitted to form a machining hole; an optical unit that adjusts the shape of the laser beam so as to partially irradiate the laser beam into the workpiece to non-crystallize the crystallized workpiece; a laser beam adjustment unit and a chemical reaction furnace for removing a processing hole formed in an amorphous region of a processing object by a chemical reaction, the processing object being deposited in a reaction solution accommodated in the chemical reaction furnace; according to the present invention, damage to a crystallized workpiece can be minimized, and an extremely narrow hole having an extremely small three-dimensional shape and having a ratio of the thickness of the workpiece to the diameter of the machined hole of several times to tens of thousands of times can be machined inside the crystallized workpiece.

Description

Technical Field

[0001] The present invention relates to a micromachining device and method, and more particularly, to a micromachining device and method using laser for micromachining the surface and / or the interior of a processing object using laser. Background Art

[0002] Generally, transparent ceramic materials such as glass, quartz, and sapphire have properties such as brittleness, chemical resistance, amorphousness, and non-conductivity, and the processing methods for micromachining are very limited. In particular, in the case of fine shapes, only a few processing steps such as laser processing using microwave lasers are applicable.

[0003] However, in the case of such laser processing, it is difficult to develop an effective processing method for ceramic materials because of problems such as the occurrence of cracks and increased shape errors.

[0004] Therefore, conventionally, a method of micromachining has been used in which a groove or a crack is machined by irradiating a ceramic material with a laser and the machined portion is etched with a reaction solution.

[0005] For example, the following Patent Document 1 discloses a processing method in which, as a process of laser wet rear surface etching in processing a glass shape, laser light irradiated through glass as a processing material heats a metal ion electrolyte located on the back side of the processing material to indirectly process the processing material.

[0006] The following patent document 2 discloses the structure of a glass shape processing device. When the glass is indirectly processed using a laser, the irradiation path of the irradiated laser is set to point units or line units, and the point units or line units are randomly distributed to prevent the irradiation path from being repeatedly set in a specific pattern, thereby reducing the interaction between the laser and bubbles to improve the processing precision.

[0007] Therefore, it is necessary to develop technology that can use lasers and etching to micro-process transparent ceramic materials such as glass, quartz, and sapphire into the desired shape without causing damage.

[0008] (Patent Document 1) Korean Patent Grant No. 10-1625948 (published on May 31, 2016).

[0009] (Patent Document 2) Korean Patent Grant No. 10-2382471 (announced on April 4, 2022). Summary of the invention

[0010] Technical issues

[0011] The present invention is used to solve the problems mentioned above. The purpose of the present invention is to provide a micro-machining device and method using a laser, which utilizes a laser beam and a reaction solution that chemically reacts with the processing object to more finely process the processing hole into a desired shape without damaging the processing object.

[0012] Technical Solution

[0013] In order to achieve the above-mentioned purpose, the micro-machining device using laser of the present invention is characterized in that it includes: a laser beam irradiation unit, which irradiates the laser beam to the crystallized processing object that transmits the laser beam to form a processing hole; an optical unit, which adjusts the shape of the above-mentioned laser beam to locally irradiate the above-mentioned laser beam to the inside of the processing object to make the crystallized processing object non-crystallized; a laser beam adjustment unit, which adjusts the pulse width and pulse energy of the above-mentioned laser beam; and a chemical reactor, which chemically removes the processing hole formed in the non-crystallized area of ​​the processing object through a chemical reaction, the above-mentioned processing object is precipitated in the reaction solution contained in the above-mentioned chemical reactor, and the above-mentioned processing hole is processed so that the ratio of the thickness of the processing object to the diameter of the above-mentioned processing hole reaches several times to tens of thousands times.

[0014] Furthermore, in order to achieve the above-mentioned purpose, the micro-processing method using laser of the present invention is characterized in that it includes: step (a), using a laser beam irradiation unit to irradiate a laser beam to a crystallized processing object that transmits the laser beam to form a processing hole; step (b), using an optical unit to adjust the shape of the above-mentioned laser beam to locally irradiate the above-mentioned laser beam to the inside of the processing object to make the crystallized processing object non-crystallized; step (c), using a laser beam adjustment unit to adjust the pulse width and pulse energy of the above-mentioned laser beam; and step (d), allowing the processing object to be precipitated in a chemical reactor that contains a reaction solution, chemically removing the processing hole formed in the non-crystallized area through a chemical reaction based on the above-mentioned reaction solution, and the above-mentioned processing hole is processed into a ratio of the thickness of the processing object to the diameter of the above-mentioned processing hole to reach several times to tens of thousands times.

[0015] Effects of the Invention

[0016] As described above, according to the micromachining device and method using laser of the present invention, the present invention has the following effect: a laser beam having high energy per unit volume and extremely short pulse width is irradiated onto a processing object formed by a crystallized material that transmits a laser beam, and the laser beam is absorbed into the interior of the processing object and de-crystallizes the interior of the crystallized processing object.

[0017] Therefore, according to the present invention, the present invention has the following effect: the reaction rate of the chemical reaction with the reaction solution such as the strong acidic or strong alkaline chemical substance is increased in the non-crystallized area, and the processing holes formed in the processing object are chemically removed by chemical reaction, so that a fine pattern utilizing the fine processing holes can be processed.

[0018] Therefore, according to the present invention, the present invention has the following effect: inside the crystallized processing object, cracks or damages of the processing object can be minimized and extremely fine three-dimensional shapes and extremely narrow holes with a ratio of several to tens of thousands times the thickness of the processing object to the diameter of the processing hole can be processed. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural diagram of a micromachining device using laser according to a preferred embodiment of the present invention.

[0020] Figure 2 This is an example diagram of classifying alternately arranged processing objects according to the regularity of their arrangement.

[0021] Figure 3 The present invention is a process diagram for describing step by step a micromachining method using laser according to a preferred embodiment of the present invention.

[0022] Figure 4 A diagram illustrating an object to be micro-machined according to a preferred embodiment of the present invention.

[0023] Figure 5 A diagram illustrating an example of a micro-machined object according to another embodiment of the present invention.

[0024] Figures 6 to 8 A diagram illustrating an example of a micro-machined object according to the present invention. DETAILED DESCRIPTION

[0025] Hereinafter, a micromachining device and method using laser according to a preferred embodiment of the present invention will be described in detail with reference to the drawings.

[0026] Figure 1 This is a structural diagram of a micromachining device using laser according to a preferred embodiment of the present invention.

[0027] Hereinafter, terms indicating directions such as “left side”, “right side”, “front”, “rear”, “above”, and “below” are defined as indicating the respective directions based on the state shown in each drawing.

[0028] In this embodiment, a micromachining apparatus and method using a laser for forming a fine-shaped pattern on the surface and / or inside of a processing object having a predetermined area and thickness will be described.

[0029] Furthermore, in this embodiment, processing is performed on a processing object formed of a transparent ceramic material such as glass, quartz, sapphire, etc. However, the present invention is not limited thereto, and processing can also be performed on a processing object of a variety of materials such as silicon and metal.

[0030] This processing object may be in a non-crystallized state. In the present embodiment, after a fine pattern is processed on the surface or inside of the processing object by irradiating a crystallized processing object with a laser beam to make the processing object non-crystallized, the processed area is removed at a high speed by a chemical reaction of a reaction solution such as a strongly acidic or strongly alkaline chemical substance.

[0031] That is, when a laser beam having high energy per unit volume and an extremely short pulse width is irradiated to a crystallized material that can transmit the laser beam, the surface and / or interior of the corresponding material absorbs the energy of the laser beam and becomes amorphous.

[0032] The strong acids and bases used as reaction solutions remove the processed areas very slowly by an extremely slow chemical reaction in the crystallized material.

[0033] In contrast, in a non-crystallized material, the processed areas are removed at a very high speed by chemical reaction with a strong acid or base.

[0034] This reaction rate difference can vary depending on the material, the type and concentration of chemicals used as the reaction solution, and the process, and can vary from several times to tens of thousands times.

[0035] Therefore, the present invention can form a fine pattern in a non-crystallized state by irradiating a crystallized material with a laser beam, and can perform fine processing at a high speed by utilizing a chemical reaction of a reaction solution.

[0036] Furthermore, the present invention can process an extremely narrow hole in which the ratio of the thickness of the processing object to the diameter of the processing hole reaches several to tens of thousands times while minimizing cracks or damage to the processing object.

[0037] For this reason, Figure 1 As shown, the micro-machining device 10 using laser in a preferred embodiment of the present invention includes: a laser beam irradiation unit 20, irradiating the laser beam to the crystallized processing object 11 that transmits the laser beam to form a fine pattern using a processing hole; an optical unit 30, adjusting the shape of the laser beam to locally irradiate the above-mentioned laser beam to the inside of the processing object 11 to de-crystallize the crystallized processing object 11; a laser beam adjustment unit 40, adjusting the pulse width and pulse energy of the laser beam; and a chemical reactor 70, in the de-crystallized area of ​​the processing object 11, chemical removal is performed according to the above-mentioned processing hole through a chemical reaction, and the processing object 11 is precipitated in the reaction solution contained in the chemical reactor 70, thereby processing at a speed several to tens of thousands times faster than the crystallized processing object 11, so that the ratio of the thickness of the processing object 11 to the diameter of the processing hole reaches several to tens of thousands times.

[0038] Meanwhile, the laser micromachining device 10 according to the preferred embodiment of the present invention may further include a transfer unit 50 for moving the laser beam according to the fine pattern to be formed and a control unit 60 for controlling the driving of each device.

[0039] The transfer unit 50 has a function of moving the laser beam outputted from the optical unit 30 into a shape to be processed.

[0040] To this end, the transfer unit 50 may move only the optical unit 30 , or may move the entire laser beam irradiation unit 20 , the optical unit 30 , and the laser beam adjustment unit 40 .

[0041] The control unit 60 generates a control signal for controlling the driving of the laser beam irradiation unit 20 and the optical unit 30 so as to irradiate the object 11 while changing the shape of the laser beam and the pulse width and pulse energy of the laser beam based on the processing conditions of the object 11 .

[0042] Therefore, the laser beam adjusting part 40 may drive the laser beam irradiating part 20 and the optical part 30 according to the control signal of the control part 60 .

[0043] The processing object 11 can be formed of a transparent ceramic material such as glass, quartz, sapphire, etc. Of course, the processing object 11 can also be formed of silicon or metal materials.

[0044] For example, Figure 2 This is an example diagram showing how objects to be processed in a solid form are classified according to the regularity of their arrangement.

[0045] Figure 2 Parts (a) to (c) illustrate processing objects in single crystal, polycrystalline, and amorphous states, respectively.

[0046] like Figure 2 As shown in part (a) or (b) of FIG. 1 , the processing object 11 formed of glass, quartz, sapphire, silicon, metal material, etc. usually exists in a single crystal or polycrystalline state.

[0047] When a laser beam having high energy per unit volume and extremely short pulse width is irradiated to the crystallized processing object 11, Figure 2 As shown in part (c) of FIG. 1 , the object 11 may become amorphous.

[0048] Furthermore, the non-crystallized region in the processing object 11 can be removed at an extremely high speed, for example, several to tens of thousands times faster than the reaction speed in the crystallized state, by a chemical reaction with a reaction solution such as a strong acid or a strong alkaline chemical substance.

[0049] To this end, the laser beam irradiation unit 20 may be a laser beam generator that generates laser light according to a control signal of the control unit 60 .

[0050] The optical part 30 may include at least one lens, and adjusts the shape of the laser beam by focusing the laser beam generated from the laser beam irradiation part 21 and irradiating the laser beam toward the processing object 11 .

[0051] Therefore, in order to locally amorphize the surface and / or the inside of the crystallized processing object 11 that can transmit the laser beam, the crystallized processing object 11 can be irradiated with a laser beam having high energy per unit volume and an extremely short pulse width.

[0052] For example, a laser beam with a speed of about 10 -4 Seconds to 10 -15 The pulse width is about 10 μJ to 100 μJ / μm 3 The energy irradiation does not penetrate the processing object 11, but makes the interior of the crystallized processing object 11 partially non-crystallized.

[0053] Alternatively, the laser beam can be -4 Seconds to 10 -18 A pulse width of seconds causes the interior of the crystallized object 11 to be partially non-crystallized.

[0054] That is, the energy and pulse width of the laser beam per unit volume can be adjusted according to various conditions such as material, thickness, size, etc., so as to partially de-crystallize the crystallized processing object 11.

[0055] On the other hand, the control unit 60 may control the driving of the chemical reactor 70 to activate the reaction solution of the chemical substance such as strong acid or strong alkali in the non-crystallized region of the processing object 11 having the fine pattern formed thereon using the laser beam.

[0056] The chemical reaction furnace 70 is a container for storing a reaction solution, and may include at least one of an ultrasonic vibrator (not shown) and a heating unit (not shown) driven according to a control signal of the control unit 60 .

[0057] That is, the control unit 60 may generate a control signal for controlling the driving of the ultrasonic vibrator to adjust the period, intensity, and direction of the ultrasonic vibration generated from the chemical reactor 70 according to the output of the laser beam irradiated from the laser beam irradiation unit 20 .

[0058] The ultrasonic vibration may be applied in a direction parallel to the direction of the processing hole formed in the processing object 11. Alternatively, the ultrasonic vibration may be applied in a direction perpendicular to the direction of the processing hole formed in the processing object 11.

[0059] Furthermore, in order to heat the reaction solution to activate it, the control unit 60 may generate a control signal for controlling the driving of the heating unit so as to heat the reaction solution and the heating object to a preset set temperature.

[0060] The set temperature may be set to correspond to the melting point of the chemical components contained in the reaction solution.

[0061] Therefore, the transfer unit 50 can move the irradiation position of the laser beam.

[0062] Of course, in the present invention, the chemical reaction furnace can be eliminated, and instead of allowing the processing object to be precipitated in the reaction solution, the processing hole formed in the processing object can be chemically removed by spraying the reaction solution onto the processing object, thereby performing micro-processing.

[0063] As described above, the present invention can irradiate a processing object formed of a crystallized material that transmits a laser beam with high energy per unit volume and an extremely short pulse width, and the laser beam is absorbed into the processing object to de-crystallize the inside of the crystallized processing object.

[0064] Therefore, the present invention can increase the reaction rate of chemical reactions with reaction solutions such as strongly acidic or strongly alkaline chemicals in non-crystallized areas, thereby chemically removing the processing holes formed in the processing object through chemical reactions, thereby processing a fine pattern utilizing the processing holes.

[0065] Therefore, the present invention can minimize cracks or damage to the processing object inside the crystallized processing object and process extremely fine three-dimensional shapes and extremely narrow holes with a ratio of several to tens of thousands times the thickness of the processing object to the diameter of the processing hole.

[0066] Next, refer to Figures 3 to 5 , a micromachining method using laser according to a preferred embodiment of the present invention is described in detail.

[0067] Figure 3 The present invention is a process diagram for describing step by step a micromachining method using laser according to a preferred embodiment of the present invention.

[0068] and, Figure 4 is a diagram illustrating an object to be micro-machined according to a preferred embodiment of the present invention, Figure 5 The figure is a diagram illustrating an object to be processed by micro-processing into a three-dimensional shape according to another embodiment of the present invention. Figure 4 Parts (a) to (c) show the plane, cross section, and bottom surface of the micro-machined object. Figure 5 Parts (a) to (c) show the plane, cross-section, and bottom surface of the object to be micromachined into a three-dimensional shape.

[0069] exist Figure 3 In step S10, the laser beam irradiation unit 20 generates a laser beam at an output set according to a control signal of the control unit 60 and irradiates the laser beam to the processing object 11. Therefore, the optical unit 30 adjusts the shape of the irradiated laser beam.

[0070] In this case, the laser beam may be a laser beam having high energy per unit volume and an extremely short pulse width.

[0071] Therefore, the irradiated laser beam is absorbed inside the processing object 11 and the inside of the processing object 11 is amorphized to form an amorphized region (step S12).

[0072] At the same time, in step S14 , the laser beam forms at least one processing hole in the non-crystallized region to form a fine pattern.

[0073] The processed hole has an extremely fine three-dimensional shape and can be formed into an extremely narrow hole in which the ratio of the thickness of the processing object 11 to the diameter of the processed hole reaches several to tens of thousands times.

[0074] For example, Figure 4 As shown, the processing hole 12 may be formed in a straight line shape from one side of the processing object 11 irradiated with the laser beam, for example, from the upper side toward the opposite side, that is, the lower side.

[0075] However, the processed hole 12 can be not only in a straight line shape, such as Figure 5 As shown, it may also be formed to include at least one right angle portion 13 or a horizontal portion horizontally formed in parallel with the surface of the processing object 11 .

[0076] Furthermore, the processed hole 12 may be formed in a straight line shape that forms a right angle with the surface of the processing object 11 , or may be formed to be inclined at a predetermined angle.

[0077] As described above, the processed hole 12 can be formed in various three-dimensional shapes according to the fine pattern to be formed.

[0078] In particular, the cross section of the processed hole 12 may be substantially circular, but may be formed into a circular shape or may be formed into an elliptical shape depending on the direction in which the ultrasonic vibration is applied.

[0079] As described above, in the process of forming a fine pattern, the control unit 60 controls the driving of the laser beam irradiation unit 20 and the optical unit 30 to irradiate by changing the shape of the laser beam and the pulse width and pulse energy of the laser beam based on the processing conditions of the processing object 11 .

[0080] When the fine pattern forming operation is completed, in step S16 , the processing object 11 is deposited in the chemical reaction furnace 70 containing the reaction solution.

[0081] In step S18 , in the processing object 11 deposited in the chemical reaction furnace 70 , the processing hole 12 can be chemically removed by chemical reaction with the reaction solution, so that the non-crystallized region is micro-processed at high speed.

[0082] In this case, the ultrasonic vibrator formed in the chemical reaction furnace 70 may be driven according to a control signal of the control unit 60 to apply ultrasonic vibration to the processing object 11 at a preset cycle.

[0083] Furthermore, the control unit 60 may control the driving of the ultrasonic vibrator to adjust the period, intensity, and direction of the ultrasonic vibration generated from the chemical reaction furnace 70 according to the output of the laser beam irradiated from the laser beam irradiation unit 20 .

[0084] The ultrasonic vibration may be applied in a direction parallel to the direction of the processing hole 12 formed in the processing object 11 or in a direction perpendicular to the direction of the processing hole 12 .

[0085] Furthermore, the heating unit formed in the chemical reaction furnace can be driven according to a control signal from the control unit to heat the reaction solution and the heating object to a preset temperature in order to heat the reaction solution and activate it.

[0086] To this end, the control unit 60 may generate a control signal for controlling the driving of the heating unit to heat the reaction solution and the heating object to a preset set temperature.

[0087] Furthermore, the set temperature may be set to correspond to the melting point of the chemical components contained in the reaction solution.

[0088] Of course, the processing object 11 can be micro-processed by using a spray nozzle to spray a reaction solution through a chemical reaction.

[0089] Through the above process, the present invention can irradiate a processing object formed of a crystallized material that transmits a laser beam with high energy per unit volume and an extremely short pulse width, and the laser beam is absorbed into the processing object and the interior of the crystallized processing object is non-crystallized.

[0090] Therefore, the present invention can increase the reaction rate of chemical reaction with reaction solutions such as strongly acidic or strongly alkaline chemical substances in non-crystallized areas, thereby chemically removing the processing holes formed in the processing object through chemical reactions to process fine patterns using fine processing holes.

[0091] Therefore, the present invention can minimize cracks or damage to the processing object inside the crystallized processing object and process extremely fine three-dimensional shapes and extremely narrow holes with a ratio of several to tens of thousands times the thickness of the processing object to the diameter of the processing hole.

[0092] [Example 1]

[0093] The processing object 11 is formed of quartz with a thickness of about 0.1 mm, and the laser beam irradiation unit 20 irradiates a picosecond UV laser beam capable of emitting an output of about 100 W.

[0094] The pulse width of the laser beam is 1 ps, and the laser beam adjustment unit 40 sets the laser beam overlap ratio (over rate) to about 50%. The laser beam processes the inside of the processing object 11 with a diameter of about 10 μm.

[0095] Then, a strong acidic reaction solution such as sulfuric acid (H 2 SO 4 ) or hydrochloric acid (HCl) is used to chemically remove only the portion processed by the laser beam, that is, only the processed hole 12 formed in the non-crystallized region is removed.

[0096] Therefore, if Figure 4 As shown in parts (a) to (c) of FIG. 1 , it can be confirmed that a processing hole 12 is micro-machined in the processing object 11 .

[0097] [Example 2]

[0098] The processing object 11 is formed of sapphire having a thickness of about 1 mm, and the laser beam irradiation unit 20 irradiates a femtosecond UV laser capable of emitting an output of about 30 W.

[0099] The pulse width of the laser beam is 10 fs, and the laser beam adjustment unit 40 sets the ratio of laser beam overlap to about 80%. The laser beam processes the inside of the processing object 11 with a diameter of about 30 μm.

[0100] Then, a strong alkaline reaction solution such as sodium hydroxide (NaOH) or barium hydroxide (Ba(OH) 2 ) is used to chemically remove only the fine pattern formed by the non-crystallized region.

[0101] Thus, it can be confirmed that a processed hole 12 having a ratio of thickness to hole diameter of 30:1 is micro-machined in the processing object 11 .

[0102] [Example 3]

[0103] The processing object 11 is formed of a silicon wafer having a thickness of about 730 μm, and the laser beam irradiation section 20 irradiates a femtosecond laser capable of emitting an output of about 30 W.

[0104] The pulse width of the laser beam is 30 fs, and the laser beam adjustment unit sets the ratio of laser beam overlap to about 10%. The laser beam processes the inside of the processing object with a diameter of about 7 μm.

[0105] Furthermore, it was confirmed that by chemically removing only the fine pattern formed in the non-crystallized region using a strong acid solution, a processing hole 12 having a ratio of thickness to hole diameter of 100:1 can be micro-machined in the processing object 11 .

[0106] On the other hand, in the above-mentioned embodiment, it is described that linear micro-holes are processed in the processing object, but the present invention is not limited to this, and linear micro-holes and various three-dimensional micro-patterns can also be processed.

[0107] like Figure 5 As shown, the processing object 11 is formed of glass with a width and a length, and a thickness of about 50 mm respectively, and the laser beam irradiation unit 20 irradiates a nanosecond laser with a deep UV wavelength that can emit an output of about 10W.

[0108] Furthermore, the laser beam adjusting unit 40 adjusts the wavelength, pulse width, and beam mode of the laser beam according to the control signal of the control unit 60 , and the optical unit 30 adjusts the beam shape of the laser beam.

[0109] For example, the shape of the light beam can be changed into various shapes such as a circle or an ellipse.

[0110] Furthermore, the above-mentioned beam patterns may include a Gaussian beam pattern and a non-Gaussian beam pattern.

[0111] The laser beam performs pre-processing on the processing object 11 in a Gaussian beam mode and a circular beam shape, and uses a strong acid solution of about 5% to perform etching for about 2 hours to chemically remove only the fine pattern formed in the non-crystallized area.

[0112] Thus, 48×48 holes with a diameter of about 50 μm are processed in the horizontal and vertical directions at intervals of about 0.2 mm, that is, a total of 2304 holes, to form a fine pattern of processing holes 12 in which the ratio of the thickness of the processing object 11 to the diameter of the hole is 100:1.

[0113] Among them, Figure 5 As shown in parts (a) to (c) of FIG. 1 , the processing hole 12 may be a straight line shape along the vertical direction, and may also include a right angle portion 13 along the horizontal direction at a predetermined depth inside the processing object 11 .

[0114] That is, the present invention can control the focus of the laser beam to move the laser beam inside the processing object and process a processing hole with a straight line shape along the vertical direction and at least one right angle portion horizontally along the horizontal direction.

[0115] Furthermore, the present invention can form a processed hole that is inclined at a preset angle from one side of the processing object toward the opposite direction.

[0116] That is, the present invention can adjust the depth of the irradiated laser beam, the beam mode of the laser beam, the shape of the beam, etc. to process holes along various diameters and shapes, for example, in an inclined direction, thereby also processing fine patterns of various three-dimensional shapes.

[0117] For example, Figures 6 to 8 A diagram illustrating an example of a micro-machined object according to the present invention.

[0118] Figure 6 In the embodiment, the thickness of the processing object is about 5 mm, and the diameter of the processing hole formed in the processing object is about 20 μm to 80 μm.

[0119] Figure 7 Part (a) shows the micro-machining object. Figure 7 Part (b) shows an enlarged cross-sectional view of a pair of machined holes formed in the machined object.

[0120] Figure 7 In parts (a) and (b), the thickness of the object to be processed is about 2 mm, and the diameter of the processed hole formed in the object to be processed is about 40 μm.

[0121] Figure 8 A diagram comparing a processing object processed by the prior art and the processing object processed according to the present invention.

[0122] Figure 8 Part (a) shows a cross section of a workpiece in which a hole is machined according to the prior art. Figure 8 Part (b) shows a cross section of a workpiece in which a hole is machined according to the present invention.

[0123] According to the prior art, Figure 8 As shown in part (a), since the reaction solution is not fully introduced into the laser-processed processing hole 12, the processing hole 12 is processed so that the diameter of the central part of the processing object 11 is smaller than the diameters of the upper and lower ends, thereby forming a roughly pestle shape.

[0124] On the contrary, according to the present invention, Figure 8 As shown in part (b), a laser beam having high energy per unit volume and extremely short pulse width is irradiated onto a processing object 11 formed by a crystallized material that transmits a laser beam. The laser beam is absorbed into the interior of the processing object and de-crystallizes the interior of the crystallized processing object, thereby increasing the reaction rate of a chemical reaction with a reaction solution in the de-crystallized area. As a result, a processing hole 12 formed in the processing object 11 can be chemically removed by a chemical reaction, thereby being micro-processed.

[0125] As described above, the present invention can form processing holes of various shapes by controlling the focal distance, wavelength, pulse width, beam mode, and beam shape of the laser beam, and chemically remove fine patterns through chemical reaction with the etching solution, thereby processing three-dimensional patterns at high speed.

[0126] Furthermore, the present invention can process extremely fine three-dimensional shapes and extremely narrow holes with a ratio of several to tens of thousands times the thickness of the processing object to the diameter of the processing hole inside the crystallized processing object while minimizing cracks or damage to the processing object.

[0127] As mentioned above, the invention of the inventors has been specifically described based on the above-mentioned embodiments. However, the present invention is not limited to the above-mentioned embodiments, and can be modified into various shapes within the scope not exceeding the gist of the present invention.

[0128] Industrial Applicability

[0129] The present invention is applicable to the following technology, in which a laser beam is irradiated onto a processing object formed of a crystallized material, the laser beam is absorbed into the processing object and de-crystallizes the interior of the crystallized processing object, and a fine pattern formed in the de-crystallized area is chemically removed through a chemical reaction, thereby performing fine processing at high speed.

Claims

1. A micro-machining device using laser, characterized in that: include: a laser beam irradiation unit for irradiating a laser beam to a crystallized processing object through which the laser beam is transmitted, thereby forming a processing hole; an optical unit that adjusts the shape of the laser beam so as to locally irradiate the inside of the processing object with the laser beam to de-crystallize the crystallized processing object; A laser beam adjusting unit, which adjusts the pulse width and pulse energy of the laser beam; a transfer unit that moves the laser beam according to a fine pattern; as well as A control unit that controls the driving of each device, The processing hole formed in the non-crystallized area of ​​the processing object is chemically removed by utilizing a chemical reaction of a chemical substance, so that the ratio of the thickness of the crystallized processing object to the diameter of the processing hole reaches several to tens of thousands times, The processing object is formed of a transparent ceramic material, or a silicon or metal material. The laser beam is irradiated to the crystallized processing object which can transmit the laser beam with a preset energy and pulse width per unit volume, The control unit generates a control signal for controlling the driving of the laser beam irradiation unit and the optical unit so as to irradiate by changing the shape of the laser beam and the pulse width and pulse energy of the laser beam based on the processing conditions of the processing object. The control unit controls the laser beam by adjusting the wavelength, pulse width, beam mode, and beam shape of the laser beam according to the material and specifications of the processing object. The processing hole is formed in a straight line shape from one side of the processing object irradiated with the laser beam toward the opposite side, or is formed to include at least one right angle portion, or is inclined at a predetermined angle.

2. The laser micromachining device according to claim 1, characterized in that: The chemical reaction is carried out using strong acid or strong base chemicals.

3. The laser micromachining device according to claim 2, characterized in that: It also includes a chemical reaction furnace, which makes the processing object precipitate and processes the processing hole through chemical reaction. The chemical reaction furnace uses an ultrasonic vibrator to apply ultrasonic vibration to the processing object according to a preset period. The ultrasonic vibration is applied in a direction parallel to a direction of the processed hole formed in the processing object.

4. The micro-machining device using laser according to claim 3, characterized in that: The chemical reactor heats the reaction solution and a heating object to a preset temperature using a heating unit so as to activate the reaction solution. The preset temperature is set to correspond to the melting point of a chemical component contained in the reaction solution.

5. A micromachining method using laser, characterized in that: The following steps are involved: Step (a), irradiating a laser beam to a crystallized processing object that transmits a laser beam by a laser beam irradiation unit to form a processing hole; Step (b), adjusting the shape of the laser beam by using an optical unit to locally irradiate the laser beam into the interior of the processing object to de-crystallize the crystallized processing object; Step (c), using a laser beam adjusting unit to adjust the pulse width and pulse energy of the laser beam; Step (d), allowing the processing object to settle in a chemical reaction furnace containing a reaction solution, and chemically removing the processing hole formed in the non-crystallized area through a chemical reaction based on the reaction solution; as well as Step (e), using a transfer unit to move the laser beam to a pattern where the processing hole needs to be formed, In the process of performing the steps (a) to (e), the control unit is used to control the driving of the laser beam irradiation unit, the optical unit, and the transfer unit, so as to irradiate by changing the shape of the laser beam and the pulse width and pulse energy of the laser beam based on the processing conditions of the processing object. The processing object is formed of a transparent ceramic material, or a silicon or metal material. The laser beam is irradiated to the crystallized processing object which can transmit the laser beam with a preset energy and pulse width per unit volume, In the step (c), the control unit controls the laser beam by adjusting the wavelength, pulse width, beam mode and beam shape of the laser beam according to the material and specification of the processing object. The processing hole is processed in such a way that the ratio of the thickness of the processing object to the diameter of the processing hole reaches several times to tens of thousands times, The processing hole is formed in a straight line shape from one side of the processing object irradiated with the laser beam toward the opposite side, or is formed to include at least one right angle portion, or is inclined at a predetermined angle.

6. The micromachining method using laser according to claim 5, characterized in that: The chemical reaction is carried out using strong acid or strong base chemicals.

7. The micro-machining method using laser according to claim 6, characterized in that: In the step (d), the chemical reactor applies ultrasonic vibration to the processing object using an ultrasonic vibrator at a preset period, and the ultrasonic vibration is applied in a direction parallel to or at right angles to the processing hole formed in the processing object.

8. The micro-machining method using laser according to claim 7, characterized in that: The chemical reactor heats the reaction solution and a heating object to a preset set temperature using a heating unit so as to activate the reaction solution. The set temperature is set to correspond to a melting point of a chemical component contained in the reaction solution.

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