Wafer box cleaning and packaging system and method

Abstract

The invention provides a wafer box cleaning and packaging system and method.The wafer box cleaning and packaging system comprises a first cleaning module, a second cleaning module and a packaging module, the first cleaning module purges a wafer box body, the second cleaning module purges a wafer box door plate, it is ensured that no foreign matter exists in the wafer box, then the wafer box is cleaned, and the packaging module is used for packaging the wafer box. Through purging, foreign matter pollution is effectively avoided, and the product quality is guaranteed; and finally, the wafer box loaded with the wafer is packaged through the packaging module, in the packaging process, the position of the grabbing clamp is adjusted according to the size of the packaging bag, it is ensured that the grabbing clamp can accurately fix the packaging bag, the problems that the packaging bag falls off and the like are solved, therefore, external pollutants are prevented from entering the packaging bag, and the product quality is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and specifically relates to a wafer box cleaning packaging system and method. Background Art

[0002] Semiconductor silicon wafers have extremely high requirements for the control of particle contamination. Therefore, during the wafer shipping and packaging process, it is particularly important to control the impact of contamination on silicon wafer particles. In order to achieve this goal, it is necessary to improve the cleanliness of the wafer box and the sealing of the packaging bag.

[0003] First, foreign matter and particles in the wafer box will directly affect the quality and performance of the product, because these particles may cause defects in the subsequent semiconductor manufacturing process, resulting in product abnormalities. Secondly, the sealing quality of the packaging bag is also crucial. In the existing technology, the position of the gripper in the automatic packaging machine is fixed. For packaging bags of different sizes, the gripper cannot automatically adjust its position. During the bag sorting process, the gripper cannot accurately fix the packaging bag, resulting in the entry of external contaminants, which also affects the particle control of the product. Therefore, ensuring the cleanliness of the wafer box and the sealing of the packaging bag is a key measure to reduce particle contamination, improve product quality and customer satisfaction. Summary of the invention

[0004] In view of the shortcomings of the prior art mentioned above, the present invention provides a wafer box cleaning and packaging system and method. The wafer box cleaning and packaging system comprises a first cleaning module, a second cleaning module and a packaging module. The first cleaning module purges the wafer box body, and the second cleaning module purges the wafer box door panel to ensure that there is no foreign matter in the wafer box. The wafer box is then cleaned. By purging, foreign matter contamination is effectively avoided and product quality is guaranteed. Finally, the packaging module is used to package the wafer box loaded with wafers. During the packaging process, the position of the gripper is adjusted according to the size of the packaging bag to ensure that the gripper can accurately fix the packaging bag, thereby avoiding problems such as the packaging bag falling off, thereby preventing external pollutants from entering the packaging bag and improving product quality.

[0005] To achieve the above objectives and other related objectives, the present invention provides a wafer box cleaning packaging system, comprising:

[0006] The first cleaning module comprises a support platform and a lifting nozzle, wherein the support platform is a rectangular frame structure, and a window is provided in the middle of the support platform; the lifting nozzle is located below the window and reciprocates in a direction perpendicular to the support platform during the cleaning process;

[0007] A second cleaning module comprises two rotating brackets and two fixed nozzles located in the same plane, the two rotating brackets are arranged opposite to each other in a first direction, and the two fixed nozzles are arranged opposite to each other in a second direction perpendicular to the first direction;

[0008] The packaging module comprises a base, a guide rail, a packaging bag and a plurality of grippers, wherein the guide rail is located directly above the base, a laser emitter is arranged on the guide rail, and the laser emitter moves on the guide rail and emits laser; the packaging bag is located between the guide rail and the base, and positioning notches are provided on both sides of the packaging bag opening; the plurality of grippers are located in the same plane as the packaging bag and are symmetrically distributed on both sides of the packaging bag opening; the length of the base is equal to the length of the guide rail, the surface of the base is covered with a laser receiver, and the laser reaches the laser receiver through the positioning notch.

[0009] Optionally, a first camera is disposed in the first cleaning module, and the first camera is located below the window.

[0010] Optionally, a second camera is provided in the second cleaning module, and the second camera is opposite to the plane where the rotating bracket and the fixed nozzle are located.

[0011] Optionally, the first camera and the second camera are communicatively connected to a detection device, and the detection device is used to detect a cleaning effect of the wafer box.

[0012] Optionally, the packaging module further includes a controller, and the controller is communicatively connected with the laser receiver and the gripper.

[0013] The present invention also provides a wafer box cleaning packaging method, comprising the following steps:

[0014] Providing a wafer box cleaning packaging system as described in any one of the above items;

[0015] Using the first cleaning module to purge the wafer box body, and using the second cleaning module to purge the wafer box door panel;

[0016] The packaging bag is supported, and the gripper is moved from an initial position to a designated position to fix the packaging bag;

[0017] The wafers are placed in a cleaned wafer box, and then the wafer box is placed in the packaging bag for packaging.

[0018] Optionally, using the first cleaning module to purge the wafer box body includes:

[0019] Placing the wafer box body on the supporting platform, with the window covering the viewing window of the wafer box body;

[0020] The lifting nozzle reciprocates in a direction perpendicular to the supporting platform to purge the interior of the wafer box body.

[0021] Optionally, using the second cleaning module to blow the wafer box door plate includes:

[0022] The wafer box door panel is fixed by the rotating bracket, and the two rotating brackets use the connecting line thereof as the central axis to drive the wafer box door panel to swing;

[0023] The two fixed nozzles purge the wafer box door panel.

[0024] Optionally, after purging the wafer box body and the wafer box door panel, the following steps are further included:

[0025] The first camera captures the interior of the wafer box body to obtain a first image;

[0026] The second camera photographs the inner side of the wafer box door panel to obtain a second image;

[0027] The detection device determines whether the cleanliness of the wafer box meets the standards based on the first image and the second image.

[0028] Optionally, after the wafer box cleaning meets the standard, the method further includes: cleaning the wafer box.

[0029] Optionally, when the gripping clamp is located at an initial position, the center of the gripping clamp is located directly below the edge of the guide rail.

[0030] Optionally, the clamp fixing the packaging bag comprises:

[0031] Inputting the length d of the gripper into the controller;

[0032] The laser transmitter moves from the edge of the guide rail to the center. When it moves to above the positioning notch, the laser receiver detects the laser, and the controller records the distance D from the position where the laser is detected to the edge of the base.

[0033] The controller calculates the moving distance Dd / 2 of the gripper and sends a moving signal to the gripper;

[0034] The gripper moves to a designated position according to the movement signal to fix the packaging bag.

[0035] The wafer box cleaning packaging system and method provided by the present invention have at least the following beneficial effects:

[0036] 1) The first cleaning module and the second cleaning module purge the wafer box to identify and remove foreign matter inside the wafer box; in addition, the first camera, the second camera and the detection device effectively avoid the problem of missed inspection caused by visual or appearance inspection operations, thereby avoiding the introduction of cleaning contaminants into the wafer box, thereby improving product quality;

[0037] 2) During the process of packaging the wafer box, the packaging module can adjust the position of the gripper according to the size of the packaging bag to ensure that the gripper can accurately fix the packaging bag, avoiding uneven force during the bag-holding process due to different sizes of packaging bags, thereby causing packaging defects and sealing abnormalities, and avoiding external contaminants from entering the packaging bag, thereby improving product quality; in addition, it also reduces the personnel burden and production capacity loss caused by production abnormalities, and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 Shown is a schematic structural diagram of a first cleaning module provided in Example 1.

[0039] Figure 2 Shown is a schematic structural diagram of a second cleaning module provided in the first embodiment.

[0040] Figure 3-4 Shown is a schematic diagram of the structure of the packaging module provided in Example 1.

[0041] Figure 5 Shown is a flow chart of the wafer box cleaning and packaging method provided in Example 2.

[0042] Component number description

[0043] 100 First cleaning module 32 Guide rail

[0044] 200 Second cleaning module 33 Packaging bag

[0045] 300 Packaging module 34 Grasping

[0046] 11 Support platform 35 Laser transmitter

[0047] 12 Lifting nozzle 36 Positioning notch

[0048] 13 First camera 37 Laser receiver

[0049] 21 Rotating bracket 38 Controller

[0050] 22 Fixed nozzle 41 Wafer box body

[0051] 23 Second camera 42 Wafer box door panel

[0052] 31 base 50 detection device DETAILED DESCRIPTION

[0053] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0054] It should be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Although the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation, the form, quantity, positional relationship and proportion of each component in actual implementation can be changed at will under the premise of realizing the technical solution of this party, and the component layout form may also be more complicated.

[0055] Embodiment 1

[0056] This embodiment provides a wafer box cleaning packaging system, combined with Figure 1 to Figure 3 As shown, it includes a first cleaning module 100 , a second cleaning module 200 and a packaging module 300 .

[0057] like Figure 1 As shown, the first cleaning module 100 includes a support platform 11 and a lifting nozzle 12, and the first cleaning module 100 is used to clean the wafer box body 41. As an example, the support platform 11 is a rectangular frame structure with a window (not shown in the figure) in the middle, and the lifting nozzle 12 is located below the window. During the cleaning process, the window of the wafer box body 41 is placed on the support platform 11 downward, and the window in the support platform 11 covers the window of the wafer box body 41. The lifting nozzle 12 moves in a direction perpendicular to the support platform 11 ( Figure 1 The wafer box body 41 reciprocates in the Y-axis direction (as shown) to purge the inside of the wafer box body 41.

[0058] like Figure 1 As shown, the first cleaning module 100 is further provided with a first camera 13. As an example, the first camera 13 is located below the window in the supporting platform 11. After the purging is completed, the first camera 13 is used to capture the image inside the wafer box body 41 to obtain a first image.

[0059] like Figure 1 As shown, the first camera 13 is connected to the detection device 50 for communication, and the detection device 50 stores a first detection image, which is an image of the inside of the wafer box body 41 that meets the cleaning standards. As an example, the first camera 13 transmits the captured first image to the detection device 50, and the detection device 50 compares the first image with the first detection image to determine whether the cleaning of the wafer box body 41 meets the standards.

[0060] like Figure 2 As shown, the second cleaning module 200 includes two rotating brackets 21 and two fixed nozzles 22, and the second cleaning module 200 is used to clean the wafer box door plate 42. As an example, the two rotating brackets 21 and the two fixed nozzles 22 are located in the same plane, and the two rotating brackets 21 are in the first direction ( Figure 2 The two fixed nozzles 22 are arranged opposite to each other in a second direction ( Figure 2 During the cleaning process, the rotating bracket 21 fixes the wafer box door plate 42, and the two rotating brackets 21 use the connecting line as the central axis to drive the wafer box door plate 42 to rotate. Figure 2 The two fixed nozzles 22 swing in the YZ plane as shown, and purge the wafer box door plate 42.

[0061] like Figure 2 As shown, a second camera 23 is also provided in the second cleaning module 200. As an example, the second camera 23 is opposite to the plane where the rotating bracket 21 and the fixed nozzle 22 are located, and the second camera 23 faces the inner side of the wafer box door plate 42. After the purge is completed, the second camera 23 is used to capture the image of the inner side of the wafer box door plate 42 to obtain a second image. It should be noted that the inner side of the wafer box door plate 42 is the side facing the wafer after it is installed on the wafer box body 41.

[0062] like Figure 2 As shown, the second camera 23 is connected to the detection device 50 for communication, and the detection device 50 stores a second detection image, which is an image of the inner side of the wafer box door plate 42 that meets the cleaning standards. As an example, the second camera 23 transmits the captured second image to the detection device 50, and the detection device 50 compares the second image with the second detection image to determine whether the cleaning of the wafer box door plate 42 meets the standards.

[0063] like Figure 3 As shown, the packaging module 300 includes a base 31, a guide rail 32, a packaging bag 33 and a plurality of grippers 34. The guide rail 32 is located directly above the base 31, the packaging bag 33 is located between the guide rail 32 and the base 31, and the plurality of grippers 34 and the packaging bag 33 are located in the same plane. The packaging module 300 is used to package wafer boxes carrying wafers.

[0064] As an example, a laser emitter 35 is provided on the guide rail 32, and the laser emitter 35 moves on the guide rail 32 and emits laser. In this embodiment, two laser emitters 35 are provided on the guide rail 32, and the starting positions of the two laser emitters 35 are respectively located at the edges of both sides of the guide rail 32.

[0065] As an example, the packaging bag 33 is Figure 3The Y-axis direction is shown to have an opening, and both sides of the opening have positioning notches 36 . The positioning notches 36 on both sides can be symmetrically or asymmetrically arranged, and the positioning notches 36 pass through the upper surface and the lower surface of the packaging bag 33 .

[0066] As an example, a plurality of gripping clips 34 are symmetrically distributed on both sides of the opening of the packaging bag 33, and are used to fix both sides of the packaging bag 33, and a plurality of gripping clips 34 on the same side of the packaging bag 33 are arranged along the Figure 3 As shown, the Y-axis direction is arranged. As an example, the number of the grippers 34 is an even number, and the specific number is set according to the size of the packaging bag 33, which is not limited here.

[0067] As an example, in Figure 3 In the X-axis direction, the length of the base 31 is equal to the length of the guide rail 32 ; the surface of the base 31 is covered with a laser receiver 37 , and the laser emitted by the laser transmitter 35 can reach the laser receiver 37 through the positioning notch 36 .

[0068] like Figure 3 As shown, the packaging module 300 further includes a controller 38 , which is in communication with the laser receiver 37 and the gripper 34 . The controller 38 is used to receive a signal from the laser receiver 37 and control the gripper 34 according to the signal.

[0069] Embodiment 2

[0070] This embodiment provides a wafer box cleaning packaging method, such as Figure 5 As shown, the following steps are included:

[0071] Step S1: providing a wafer box cleaning and packaging system;

[0072] As an example, the wafer box cleaning and packaging system is the wafer box cleaning and packaging system provided in the first embodiment. Figure 1 to Figure 3 As shown, it includes a first cleaning module 100, a second cleaning module 200 and a packaging module 300, and its specific structure refers to the description of the first embodiment, which will not be repeated here.

[0073] Step S2: using the first cleaning module to purge the wafer box body, and using the second cleaning module to purge the wafer box door panel;

[0074] Combination Figure 1 As shown, the wafer box body 41 is placed on the support platform 11 so that the window in the support platform 11 covers the window of the wafer box body 41; then, the lifting nozzle 12 is moved in a direction perpendicular to the support platform 11 ( Figure 1 The wafer box body 41 reciprocates in the Y-axis direction (as shown) and uses nitrogen to purge the inside of the wafer box body 41.

[0075] Next, the first camera 13 captures the interior of the wafer box body 41 to obtain a first image, and the detection device 50 determines whether the cleaning of the wafer box body 41 meets the standard based on the first image. If it meets the standard, the wafer box body 41 is cleaned; if it does not meet the standard, the wafer box body 41 is purged until it meets the standard.

[0076] Combination Figure 2 As shown, the wafer box door plate 42 is fixed by the rotating bracket 21, and the rotating bracket 21 takes the connecting line as the central axis to drive the wafer box door plate 42 to rotate. Figure 2 The wafer box door plate 42 is swung in the YZ plane shown; the two fixed nozzles 22 use nitrogen to purge the wafer box door plate 42.

[0077] Next, the second camera 23 captures the inside of the wafer box door plate 42 to obtain a second image, and the detection device 50 determines whether the cleaning of the inside of the wafer box door plate 42 meets the standard based on the second image. If it meets the standard, the wafer box door plate 42 is cleaned; if it does not meet the standard, the wafer box door plate 42 is purged until it meets the standard.

[0078] As an example, cleaning of the wafer box body 41 and the wafer box door panel 42 that meet the cleaning standards includes: first using deionized water and a special cleaning solution to remove organic pollutants and some inorganic matter; then, using the shock waves generated by the bursting of tiny bubbles generated by ultrasound to further remove dirt; then, rinsing thoroughly with deionized water to remove residual cleaning solution; finally, using nitrogen to blow dry or hot air to dry to ensure that the wafer box is completely dry.

[0079] Step S3: the packaging bag is supported, and the gripper is moved from an initial position to a designated position to fix the packaging bag;

[0080] First, the packaging bag 33 is opened. As an example, a fully automatic bag opening device can be used to accurately and quickly open the packaging bag through components such as suction cups and electric clamps to ensure smooth loading of the wafer box.

[0081] Next, the length d of the gripper 34 is input to the controller 38 .

[0082] Then, if Figure 4 As shown, the laser emitter 35 moves from the edge of the guide rail 32 to the center. When it moves to the top of the positioning notch 36, the laser receiver 37 detects the laser, and the controller 38 records the distance D from the position where the laser is detected to the edge of the base 31. Since the length of the base 31 is equal to the length of the guide rail 32, and the guide rail 32 is located directly above the base 31, the distance moved by the laser emitter 35 is also D. In this embodiment, two laser emitters 35 are arranged on the guide rail 32. Therefore, the two laser emitters 35 move from the edge of the guide rail 32 to the center, and the distances moved by the two laser emitters 35 are D respectively.1 and D 2 , the two can be the same or different.

[0083] Next, the controller 38 calculates the moving distance Dd / 2 of the gripper 34 and sends a moving signal to the gripper 34. In this embodiment, the moving distances of the grippers 34 on both sides of the packaging bag 33 are D 1 -d / 2 and D 2 -d / 2.

[0084] Finally, if Figure 4 As shown, the gripper 34 moves from the initial position to the designated position according to the movement signal to fix the packaging bag 33. Figure 3 As shown, when the gripper 34 is located at the initial position, the center of the gripper 34 is located just below the edge of the guide rail 33 .

[0085] Step S4: placing the wafers in the cleaned wafer box, and then placing the wafer box in the packaging bag for packaging.

[0086] As an example, the wafers are placed in a clean and dry wafer box to ensure dust-free; the wafer box containing the wafers is then placed stably in the opened packaging bag 33; finally, a sealing operation is performed to complete the packaging of the wafer box, ensuring that the entire process is carried out in a strictly controlled clean environment to prevent contamination.

[0087] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer box cleaning and packaging system, characterized in that: include: The first cleaning module comprises a supporting platform and a lifting nozzle, wherein the supporting platform is a rectangular frame structure and a window is provided in the middle of the supporting platform; The lifting nozzle is located below the window and reciprocates in a direction perpendicular to the support platform during cleaning; A second cleaning module comprises two rotating brackets and two fixed nozzles located in the same plane, the two rotating brackets are arranged opposite to each other in a first direction, and the two fixed nozzles are arranged opposite to each other in a second direction perpendicular to the first direction; The packaging module comprises a base, a guide rail, a packaging bag and a plurality of grippers, wherein the guide rail is located directly above the base, a laser emitter is arranged on the guide rail, and the laser emitter moves on the guide rail and emits laser; the packaging bag is located between the guide rail and the base, and positioning notches are provided on both sides of the packaging bag opening; the plurality of grippers are located in the same plane as the packaging bag and are symmetrically distributed on both sides of the packaging bag opening; the length of the base is equal to the length of the guide rail, the surface of the base is covered with a laser receiver, and the laser reaches the laser receiver through the positioning notch.

2. The wafer box cleaning and packaging system according to claim 1, characterized in that: The first cleaning module is provided with a first camera, and the first camera is located below the window.

3. The wafer box cleaning and packaging system according to claim 2, characterized in that: The second cleaning module is provided with a second camera, and the second camera is opposite to the plane where the rotating bracket and the fixed nozzle are located.

4. The wafer box cleaning and packaging system according to claim 3, characterized in that: The first camera and the second camera are communicatively connected with a detection device, and the detection device is used to detect the cleaning effect of the wafer box.

5. The wafer box cleaning and packaging system according to claim 1, characterized in that: The packaging module further includes a controller, which is communicatively connected with the laser receiver and the gripper.

6. A wafer box cleaning packaging method, characterized in that: The steps include: Providing a wafer box cleaning packaging system as described in any one of claims 1 to 5; Using the first cleaning module to purge the wafer box body, and using the second cleaning module to purge the wafer box door panel; The packaging bag is supported, and the gripper is moved from an initial position to a designated position to fix the packaging bag; The wafers are placed in a cleaned wafer box, and then the wafer box is placed in the packaging bag for packaging.

7. The wafer box cleaning and packaging method according to claim 6, characterized in that: Using the first cleaning module to blow down the wafer box body includes: Placing the wafer box body on the supporting platform, with the window covering the viewing window of the wafer box body; The lifting nozzle reciprocates in a direction perpendicular to the supporting platform to purge the interior of the wafer box body.

8. The wafer box cleaning and packaging method according to claim 6, characterized in that: Using the second cleaning module to blow the wafer box door plate includes: The wafer box door panel is fixed by the rotating bracket, and the two rotating brackets use the connecting line thereof as the central axis to drive the wafer box door panel to swing; The two fixed nozzles purge the wafer box door panel.

9. The wafer box cleaning and packaging method according to claim 6, characterized in that: After purging the wafer box body and wafer box door panel, it also includes: The first camera captures the interior of the wafer box body to obtain a first image; The second camera photographs the inner side of the wafer box door panel to obtain a second image; The detection device determines whether the cleanliness of the wafer box meets the standards based on the first image and the second image.

10. The wafer box cleaning and packaging method according to claim 9, characterized in that: After the wafer box cleaning meets the standard, the method further includes: cleaning the wafer box.

11. The wafer box cleaning and packaging method according to claim 6, characterized in that: When the gripper is located at the initial position, the center of the gripper is located just below the edge of the guide rail.

12. The wafer box cleaning and packaging method according to claim 6, characterized in that: The clamp fixes the packaging bag including: Inputting the length d of the gripper into the controller; The laser transmitter moves from the edge of the guide rail to the center. When it moves to above the positioning notch, the laser receiver detects the laser, and the controller records the distance D from the position where the laser is detected to the edge of the base. The controller calculates the moving distance Dd / 2 of the gripper and sends a moving signal to the gripper; The gripper moves to a designated position according to the movement signal to fix the packaging bag.

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