Wafer defect detection apparatus and method

Abstract

The application discloses a wafer defect detection device and method, and belongs to the field of semiconductor element detection. The wafer defect detection device comprises a detection substrate, and further comprises a support assembly for fixing a wafer, the support assembly being reversibly mounted on the detection substrate; an air jet assembly for cleaning the surface of the wafer; and a coating assembly for spraying detection material on the surface of the wafer, the coating assembly being movably arranged above the support assembly. The wafer defect detection device can select the number of suction cups according to the size of the wafer, the contact friction between the suction cups and the wafer is small, and the damage to the wafer is reduced as much as possible. The size of the recess defect on the wafer is increased, so that the recess defect can be conveniently detected, the occurrence of the defect can be effectively detected in time, and the loss caused by the defect is reduced. The air pipe is used to remove dust on the surface of the wafer, and the coating of a compound and the timely surface cleaning can be realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device inspection technology, and more particularly to a wafer defect inspection device and method. Background Technology

[0002] With the miniaturization of semiconductor devices and advancements in manufacturing technology, increasingly numerous tiny defects are having a significant impact on semiconductor product yield, potentially severely affecting the functionality of the resulting semiconductor devices and leading to yield defects. To improve semiconductor device yield, multiple inspection processes are typically incorporated into the manufacturing process to promptly detect defects and improve the process, thereby increasing the yield of subsequent wafers. Current wafer inspection equipment uses a detection beam to scan the surface of the wafer under test, processing the beam reflected back from the wafer surface to obtain data on surface depressions and defects.

[0003] The existing testing equipment has the following defects: 1. Traditional wafer inspection equipment can only inspect wafers of fixed size. When the wafer size changes, a new inspection equipment needs to be manufactured, resulting in high inspection costs and low inspection efficiency. 2. When inspecting defects such as dents, wafer inspection equipment has a certain measurement range. If the size of the dents on the wafer is too small, the wafer inspection equipment will have difficulty capturing the dents, which can easily cause a batch of wafers to be scrapped due to defects, resulting in a large amount of loss. Summary of the Invention

[0004] The purpose of this invention is to solve the problems of high detection cost and low detection efficiency in the prior art; when the size of the dent defect on the wafer is too small, the wafer inspection equipment is unable to completely detect the dent defect on the wafer, which can easily cause a batch of wafers to be scrapped due to defects, resulting in a large amount of loss. Therefore, a wafer defect detection device and method are proposed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A wafer defect inspection device includes an inspection substrate, and further includes: a support assembly for fixing the wafer, the support assembly being rotatably mounted on the inspection substrate; an air jet assembly for cleaning the wafer surface; and a coating assembly for spraying inspection material onto the wafer surface, the coating assembly being movably disposed above the support assembly.

[0006] Preferably, an electrical control cabinet is connected to one side of the detection substrate, and a detection component is provided on one side of the electrical control cabinet. The detection component includes an optical imaging module and a display screen pinned to the top of the electrical control cabinet. The optical imaging module and the electrical control cabinet are slidably connected.

[0007] Preferably, the support assembly includes a flip frame, two sets of second ear plates are symmetrically arranged on one side of the bottom of the flip frame, and a support shaft is fixedly connected through the two sets of second ear plates. Two sets of first ear plates are symmetrically arranged on the upper surface of the detection substrate, and both ends of the support shaft are rotatably connected to the first ear plates.

[0008] Preferably, a driving assembly is provided between the flipping frame and the detection substrate. The driving assembly includes a lead screw, a driving block is slidably connected to the surface of the lead screw, an internal threaded sleeve is connected between the driving block and the lead screw, a third ear plate is fixedly connected to the driving block, and the driving block is slidably connected inside the detection substrate. A fourth ear plate is fixedly connected to the center of one side of the bottom of the flipping frame, and a first connecting plate is pinned between the fourth ear plate and the third ear plate.

[0009] To ensure the stability of the flipping frame's flipping structure, two sets of guide components are further provided on both sides of the first connecting plate. Each guide component includes a guide block slidably disposed within the detection base plate, a second connecting plate pinned to the guide block, and a connecting rod connected to the fourth ear plate and the first connecting plate at the pinned position. Two sets of fifth ear plates are symmetrically arranged on one side of the bottom of the flipping frame, and both ends of the connecting rod are rotatably installed within the fifth ear plates. The connecting rod and the second connecting plate are pinned together. A guide groove is formed within the detection base plate, and a guide shaft is disposed within the guide groove. The guide shaft and the guide block are slidably connected.

[0010] To ensure that the structure used to fix the wafer can be adapted to wafers of different sizes, a fixing plate is slidably connected to the flipping frame, a suction cup is provided inside the fixing plate, and two sets of sliders are symmetrically arranged on the bottom surface of the fixing plate. At least six sets of sliding grooves are opened inside the flipping frame, and the sliders and sliding grooves are matched.

[0011] Preferably, the coating assembly is slidably disposed on the processing plate above the fixed plate, the first airbag and the processing plate are connected, the processing plate is filled with a detection compound, the first airbag coats the compound onto the surface of the wafer to be tested during the extrusion process, the processing plate is provided with adjustment sleeves at both ends, the flipping frame is symmetrically provided with electric slides on both sides, the electric slides are connected with support rods, and the adjustment sleeves and support rods are slidably sleeved; it also includes a first airbag sleeved outside the guide shaft, one end of the first airbag is slidably connected to one side of the guide block, the other end of the first airbag is fixedly connected to the guide groove, and the fixed end of the first airbag is connected to a spraying branch pipe.

[0012] To enable simultaneous application of the detection compound and removal of surface coatings, thereby improving efficiency, the processing plate further includes a spray tank containing a detection compound and a spray pipe connected to its bottom. A main spray pipe connects two sets of spray branch pipes and is connected to the spray tank via a flexible steel hose. The plate also includes an air chamber, with both the spray tank and the air chamber connected to a first air bladder via connecting pipes. A cleaning plate is connected to the bottom of the air chamber via a spring, and a guide rod is installed inside the spring. One end of the guide rod is slidably connected to the air chamber, and the other end is fixedly connected to the cleaning plate. A pressure pipe connected to the air chamber is provided between the air chamber and the cleaning plate, and the gas discharged from the pressure pipe pushes the cleaning plate to adhere to the wafer with the detection material.

[0013] Preferably, the jet assembly includes two sets of second airbags sleeved on the outside of the electric slide table. One end of the second airbag is connected to the movable block of the electric slide table, and the other end of the second airbag is fixedly connected to one end of the slide groove. One end of each set of second airbags is connected to a connecting air pipe. An air outlet pipe is provided on one side of the electrical control cabinet. The connecting air pipe and the air outlet pipe are connected in series.

[0014] A method for detecting wafer defects includes the following steps: Step 1: Place the wafer to be tested on the suction cup, start the external pump to drive the suction cup to draw a vacuum, adsorb the wafer, and thus fix the wafer in the test position. Step 2: Start the motor, drive the lead screw to rotate, drive the drive block to move forward, change the angle of the first connecting plate, and thus adjust the wafer angle; Step 3: During the flipping of the fixed plate, the first airbag is squeezed, and the detection compound in the spray tank is sprayed onto the wafer surface through the spray tube. The cleaning plate placed on one side of the spray tank removes the detection compound immediately after the spraying. Step 4: During the spraying process, the electric slide is started, the second airbag is squeezed, and air is blown through the air outlet to the wafer surface to remove the dust; Step 5: Activate the optical imaging module to illuminate the wafer surface. The wafer defects are detected by the interaction of light with the detection compound at the depressions on the wafer surface.

[0015] Compared with the prior art, the present invention provides a wafer defect detection device, which has the following beneficial effects: 1. This wafer defect inspection equipment uses a fixed plate with multiple sets of suction cups inside to adsorb and fix the wafer. The number of suction cups can be selected according to the size of the wafer. At the same time, the contact friction between the suction cups and the wafer is small, which can minimize damage to the wafer. 2. This wafer defect detection equipment, by setting a processing plate above the fixed plate, the processing plate includes a spray tank and an air chamber. The spray tank coats the wafer surface with a detection compound, and the cleaning plate at the bottom of the air chamber and the wafer adhere together to remove the detection compound. This can increase the size of the dents and defects on the wafer, making them easier to detect. This allows for timely and effective detection of defects and reduces the losses caused by them. 3. This wafer defect detection equipment, by setting a first airbag between the flipping frame and the detection substrate, can achieve compound coating by squeezing the airflow generated by the first airbag, thereby improving detection efficiency, saving the installation of the drive mechanism, simplifying the equipment, and improving structural utilization. 4. This wafer defect inspection equipment, by setting guide components on both sides of the drive assembly, enables the guide block and the drive block to move synchronously, thereby enhancing the support force on both sides of the drive assembly, ensuring the stability of the flipping structure of the flipping frame, and ultimately enhancing the stability of the wafer inspection support; 5. This wafer defect inspection equipment, by installing a second airbag around the electric slide, can squeeze the second airbag when the electric slide is started, and exhaust the gas through the air outlet pipe to the wafer surface. This not only allows for dust blowing on the wafer surface, but also prevents excessive coating from flowing to the lower position on the tilted wafer surface, ensuring uniform coating.

[0016] The parts of this device not described herein are the same as or can be implemented using existing technologies. This invention can select the number of suction cups according to the size of the wafer, while minimizing contact friction between the suction cups and the wafer, thus reducing damage to the wafer. It can increase the size of dents and defects on the wafer, making them easier to detect and enabling timely and effective detection of defects, reducing losses. It can not only remove dust from the wafer surface through the air tube, but also achieve compound coating and timely surface cleaning, improving detection efficiency and saving on the installation of the drive mechanism, simplifying the equipment and improving structural utilization. It enhances the support force on both sides of the drive assembly, ensuring the stability of the flipping frame's flipping structure, and ultimately enhancing the stability of the wafer detection support. It can not only perform dust blowing on the wafer surface, but also prevent excessive coating from flowing to the lower position on the tilted wafer surface, ensuring uniform coating. Attached Figure Description

[0017] Figure 1 This is a front-view three-dimensional structural diagram of a wafer defect detection device proposed in this invention; Figure 2 This is a schematic diagram of the bottom structure of the fixing plate of a wafer defect detection device proposed in this invention; Figure 3 This is a partial cross-sectional view of a wafer defect detection device proposed in this invention. Figure 4 This is a schematic diagram of the internal structure of the first airbag in a wafer defect detection device proposed in this invention. Figure 5 This is a rear-view three-dimensional structural diagram of a wafer defect detection device proposed in this invention; Figure 6 This is a schematic diagram of the main cross-sectional structure of the processing board of a wafer defect detection device proposed in this invention; Figure 7 This is a schematic diagram of the bottom cross-sectional structure of the processing board of a wafer defect detection device proposed in this invention.

[0018] In the diagram: 1. Detection substrate; 2. Optical imaging module; 3. Electrical control cabinet; 4. Display screen; 5. Fixing plate; 6. Suction cup; 7. Slider; 8. Flip frame; 9. Slide rail; 10. First ear plate; 11. Second ear plate; 12. Support shaft; 13. Motor; 14. Lead screw; 15. Drive block; 16. Third ear plate; 17. First connecting plate; 18. Connecting rod; 19. Fourth ear plate; 20. Second connecting plate; 21. Guide block; 22. Guide 23. First airbag; 24. Spraying branch pipe; 25. Electric slide; 26. Treatment plate; 27. Support rod; 28. Guide groove; 29. ​​Fifth ear plate; 30. Spraying main pipe; 31. Second airbag; 32. Connecting air pipe; 33. Air outlet pipe; 34. Spraying tank; 35. Spraying pipe; 36. Adjusting sleeve; 37. Air chamber; 38. Pressure pipe; 39. Spring; 40. Cleaning plate; 41. Guide rod; 42. Connecting pipe. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0020] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Example:

[0021] Reference Figures 1-7 A wafer defect detection device includes a detection substrate 1, an electrical control cabinet 3 connected to one side of the detection substrate 1, and a detection component disposed on one side of the electrical control cabinet 3. The detection component includes an optical imaging module 2 and a display screen 4 pinned to the top of the electrical control cabinet 3. The optical imaging module 2 and the electrical control cabinet 3 are slidably connected.

[0022] In this embodiment, a detection substrate 1 is set up, and the wafer to be detected is placed on the detection substrate 1. The surface of the wafer is detected by optical imaging technology using an electrical control cabinet 3 and an optical imaging module 2 that is slidably set on one side of the electrical control cabinet 3.

[0023] In this embodiment, the optical imaging module 2 is preferably an optical microscope. The optical imaging system of the optical microscope is used to observe the microstructure of the wafer surface and identify defects such as dents. It has the advantages of being intuitive and easy to operate.

[0024] It should be noted that, since wafer inspection requires a certain angle of rotation, the optical imaging module 2 needs to be perpendicular to the wafer being inspected. Therefore, a moving device and a rotating device for changing the imaging angle of the optical imaging module 2 are provided between the optical imaging module 2 and the electrical control cabinet 3, facilitating the adjustment of the optical imaging module 2 according to the wafer's angle before inspection. This embodiment also includes: a support assembly for fixing the wafer. The support assembly is rotatably mounted on the detection substrate 1. The support assembly includes a flip frame 8. A fixing plate 5 is slidably connected to the flip frame 8. A suction cup 6 is provided in the fixing plate 5. Two sets of sliders 7 are symmetrically arranged on the bottom surface of the fixing plate 5. At least six sets of sliding grooves 9 are opened in the flip frame 8. The sliders 7 and sliding grooves 9 are matched.

[0025] In this embodiment, a set of fixing plates 5 with suction cups 6 are provided for fixing the wafer. Considering the special material and structure of the wafer, an external air pump is used to connect the suction cups 6. Each set of suction cups 6 is equipped with a solenoid valve at its bottom, and the solenoid valves are all connected to the PLC electrical signal in the electrical control cabinet 3. Therefore, an appropriate number of suction cups 6 can be selected according to the size of the wafer. The wafer is placed at the air port of the suction cup 6, and the external air pump is started to draw air to form a negative pressure area. The negative pressure area will spread along the surface of the suction cup 6 from the inlet. Due to the pressure difference between the negative pressure area and the environment, air molecules will be pushed towards the negative pressure area, forming a negative pressure adsorption force. When the negative pressure adsorption force is greater than the contact force between the wafer and the surface of the suction cup 6, the wafer will be tightly adsorbed on the suction cup 6. Not only can the number of suction cups 6 be selected according to the size of the wafer, but also the contact friction between the suction cup 6 and the wafer is small, which can minimize damage to the wafer. Two sets of second ear plates 11 are symmetrically arranged on one side of the bottom of the flip frame 8. A support shaft 12 is fixedly connected through the two sets of second ear plates 11. Two sets of first ear plates 10 are symmetrically arranged on the upper surface of the detection substrate 1. Both ends of the support shaft 12 are rotatably connected to the first ear plates 10.

[0026] In this embodiment, one side of the flip frame 8 is rotatably connected to one side of the detection substrate 1 through a pin connection structure formed by the first ear plate 10, the second ear plate 11 and the support shaft 12. This allows the fixed plate 5 and the flip frame 8 to be connected so that the angle of the fixed wafer can be adjusted to find the most suitable optical angle for detection, ensuring the accuracy of detection and improving detection efficiency.

[0027] A drive assembly is provided between the flipping frame 8 and the detection substrate 1. The drive assembly includes a lead screw 14, a drive block 15 is slidably connected to the surface of the lead screw 14, an internal threaded sleeve is connected between the drive block 15 and the lead screw 14, a third ear plate 16 is fixedly connected to the drive block 15, and the drive block 15 is slidably connected inside the detection substrate 1. A fourth ear plate 19 is fixedly connected to the center of one side of the bottom of the flipping frame 8, and a first connecting plate 17 is pinned between the fourth ear plate 19 and the third ear plate 16.

[0028] In this embodiment, a drive assembly is provided at the center of the bottom of the flip frame 8 and on the side away from the support shaft 12. When adjusting the angle of the flip frame 8, the motor 13 is started, which drives the lead screw 14 to rotate. Since the drive block 15 is confined in the matching slot, the rotation of the lead screw 14 can drive the drive block 15 to move due to the transmission of the internal thread sleeve. During the movement of the drive block 15, the tilt angle of the first connecting plate 17 is changed. When the angle between the first connecting plate 17 and the detection substrate 1 increases, the flip angle of the flip frame 8 will also increase. Therefore, the flip frame 8, with the support shaft 12 as the fulcrum, can be raised to the required angle under the drive of the drive assembly to meet the detection requirements of the wafer.

[0029] Two sets of guide components are provided on both sides of the first connecting plate 17. The guide components include a guide block 21 that is slidably disposed in the detection base plate 1. A second connecting plate 20 is pinned to the guide block 21. A connecting rod 18 is pinned to the fourth ear plate 19 and the first connecting plate 17. Two sets of fifth ear plates 29 are symmetrically disposed on one side of the bottom of the flipping frame 8. Both ends of the connecting rod 18 are rotatably installed in the fifth ear plate 29. The connecting rod 18 and the second connecting plate 20 are pinned together. A guide groove 28 is opened in the detection base plate 1. A guide shaft 22 is disposed in the guide groove 28. The guide shaft 22 and the guide block 21 are slidably connected.

[0030] In this embodiment, considering that the tilting frame 8 relies solely on the support of the first connecting plate 17 during the tilting process, resulting in weak balance and stability, guide components are symmetrically arranged on both sides of the drive assembly. The connecting rod 18 sequentially connects and passes through the first connecting plate 17 and two sets of second connecting plates 20. As the angle of one end of the first connecting plate 17 changes, the two sets of guide blocks 21 also rotate synchronously. The guide blocks 21 slide on the surface of the guide shaft 22, thereby enhancing the support force on both sides of the drive assembly and ensuring the stability of the tilting structure of the tilting frame 8.

[0031] It should be noted that, in order to ensure that the airflow is strong enough to coat the wafer, designers in the art will know to install a pressure booster valve inside the coating manifold 24.

[0032] A coating assembly for spraying inspection materials onto the wafer surface is movably mounted above a support assembly. The coating assembly is slidably mounted on a processing plate 26 above a fixed plate 5. A first airbag 23 is connected to the processing plate 26. The processing plate 26 is filled with an inspection compound. During the extrusion process, the first airbag 23 coats the compound onto the wafer surface to be inspected. Adjustment sleeves 36 are provided at both ends of the processing plate 26. Electric slides 25 are symmetrically arranged on both sides of the flipping frame 8. Support rods 27 are connected to the electric slides 25. The adjustment sleeves 36 and support rods 27 are slidably fitted together.

[0033] In this embodiment, a coating assembly is provided above the fixing plate 5. The coating assembly is connected to the first airbag 23. During the process of adjusting the wafer angle, the guide block 21 moves along the guide shaft 22. During the movement, the guide block 21 squeezes the first airbag 23, and the air is squeezed into the processing plate 26. The detection compound in the processing plate 26 is squeezed and sprayed onto the wafer surface. At the same time, the processing plate 26 is used to wipe off the coated detection compound, which can increase the size of the dent defects on the wafer, so that they can be easily detected. This allows for timely and effective detection of defects and reduces the losses caused by them.

[0034] It also includes a first airbag 23 sleeved outside the guide shaft 22. One end of the first airbag 23 is slidably connected to one side of the guide block 21, and the other end of the first airbag 23 is fixedly connected to the guide groove 28. The fixed end of the first airbag 23 is connected to a spraying branch pipe 24.

[0035] In this embodiment, a first airbag 23 is sleeved inside the guide groove 28 and outside the guide shaft 22. When the guide block 21 moves, the first airbag 23 is squeezed to form an airflow.

[0036] The treatment plate 26 includes a spray tank 34, which contains a test compound and is connected to a spray pipe 35 at the bottom. A main spray pipe 30 is connected between the two sets of spray branch pipes 24. The main spray pipe 30 is connected to the spray tank 34 through a steel wire hose. Specifically, the processing plate 26 is divided into two cavities. The spray tank 34 is filled with the test compound. By squeezing the first airbag 23, an airflow is formed, which increases the gas tower strength in the spray tank 34. The test compound is sprayed out through the spray pipe 35.

[0037] It also includes an air chamber 37, a spray tank 34, and the air chamber 37 are connected to the first airbag 23 via a connecting pipe 42. A cleaning plate 40 is connected to the bottom of the air chamber 37 via a spring 39. A guide rod 41 is provided inside the spring 39. One end of the guide rod 41 is slidably connected to the air chamber 37, and the other end of the guide rod 41 is fixedly connected to the cleaning plate 40. A pressure pipe 38 connected to the air chamber 37 is provided between the air chamber 37 and the cleaning plate 40. The gas discharged from the pressure pipe 38 pushes the cleaning plate 40 to bond with the wafer with detection.

[0038] In this embodiment, one side of the spray tank 34 is set as an air chamber 37. The air pressure generated by the first airbag 23 is discharged through the pressure tube 38. Since the cleaning plate 40 is elastically and slidably connected to the outside of the air chamber 37 by the spring 39 and the guide rod 41, when the gas is discharged, it blows the cleaning plate 40 to extend to the wafer surface, thereby removing the detection compound from the coated wafer and ensuring that wafer defects can be clearly identified under light.

[0039] It should be noted that removing the capping layer can increase the size of the depressions and defects on the wafer, making them easier to detect and allowing for timely and effective monitoring of defect occurrence, thus reducing the losses caused by them.

[0040] The jet assembly includes two sets of second airbags 31 sleeved on the outside of the electric slide table 25. One end of the second airbag 31 is connected to the movable block of the electric slide table 25, and the other end of the second airbag 31 is fixedly connected to one end of the slide groove 9. One end of each set of second airbags 31 is connected to a connecting air pipe 32. An air outlet pipe 33 is provided on one side of the electrical control cabinet 3. The connecting air pipe 32 and the air outlet pipe 33 are connected.

[0041] In this embodiment, while the electric slide 25 drives the processing board 26 to perform spraying on the wafer surface, the movable block of the electric slide 25 compresses the second airbag 31 as it moves along the electric slide 25. The second airbag 31 is connected to the air outlet pipe 33 located on one side of the electrical control cabinet 3 via the connecting air pipe 32. The air outlet in the air outlet pipe 33 faces the inclined wafer detection surface. After the airflow is ejected, it can not only blow away dust from the wafer surface, but also prevent the sprayed coating from flowing to the lower position on the inclined wafer surface, ensuring uniform spraying and effectively preventing dust from affecting the subsequent coating effect.

[0042] In this invention, the wafer to be tested is first placed on the suction cup 6, and the external pump is started to drive the suction cup 6 to draw a vacuum and adsorb the wafer, thereby fixing the detection position of the wafer. Not only can the number of suction cups 6 be selected according to the size of the wafer, but also the contact friction between the suction cup 6 and the wafer is small, which can minimize damage to the wafer. Next, the motor 13 is started, which drives the lead screw 14 to rotate, drives the drive block 15 to move forward, changes the angle of the first connecting plate 17, thereby adjusting the wafer angle. The angle of the fixed wafer is adjusted to find the most suitable optical angle for detection, meet the wafer detection requirements, ensure detection accuracy and improve detection efficiency. It should be noted that in wafer inspection, factors such as the polarization state control, wavelength selection, cross-sectional shape, and incident angle of the illumination beam all affect the signal-to-noise ratio of the defect scattering signal. By adjusting the angle, the illumination effect can be optimized, thereby improving the accuracy and reliability of defect detection.

[0043] In wafer inspection, adjusting the angle optimizes illumination, improves inspection accuracy, and ensures optimal selection of the optical imaging module 2, thereby enhancing the quality and efficiency of wafer inspection. At the same time, during the flipping, the first airbag 23 is squeezed, and the airflow is poured into the spray tank 34. The detection compound in the spray tank 34 is sprayed onto the wafer surface through the spray pipe 35. The cleaning plate 40 placed on one side of the spray tank 34 removes the detection compound immediately after the spraying. The coated wafer is then wiped clean of the detection compound to ensure that wafer defects can be clearly identified under light. During spraying, the electric slide 25 is started. As the movable block inside moves along the electric slide 25, it squeezes the second airbag 31. The second airbag 31 is connected to the air outlet pipe 33 located on one side of the electrical control cabinet 3 through the connecting air pipe 32. The air outlet connected in the air outlet pipe 33 faces the inclined wafer inspection surface. After the airflow is sprayed out, it can not only blow dust off the wafer surface, but also prevent the spray coating from flowing to the lower position on the inclined wafer surface, thus ensuring uniform spraying. Finally, the optical imaging module 2 is activated to illuminate the wafer surface. The microstructure of the wafer surface is observed and wafer defects are detected by using the optical imaging system of the optical microscope.

[0044] A method for detecting wafer defects includes the following steps: Step 1: Place the wafer to be tested on the suction cup 6, start the external pump to drive the suction cup 6 to draw a vacuum, adsorb the wafer, and thus fix the wafer in the test position. Step 2: Start motor 13, drive lead screw 14 to rotate, drive drive block 15 to move forward, change the angle of first connecting plate 17, thereby adjusting wafer angle; Step 3: During the flipping process of the fixed plate 5, the first airbag 23 is squeezed, and the detection compound in the spray tank 34 is sprayed onto the wafer surface through the spray tube 35. The cleaning plate 40 placed on one side of the spray tank 34 removes the detection compound immediately after the spraying. Step 4: During the spraying process, the electric slide 25 is started, the second airbag 31 is squeezed, and exhaust is discharged through the air outlet pipe 33 to the wafer surface to remove floating dust; Step 5: Activate optical imaging module 2 to illuminate the wafer surface. Detect wafer defects by interacting with the detection compound at the wafer surface depressions.

[0045] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A wafer defect detection device, comprising a detection substrate (1), characterized in that, Also includes: A support assembly for fixing the wafer, the support assembly being rotatably mounted on the detection substrate (1); A jet assembly used for cleaning wafer surfaces; A coating assembly for spraying inspection materials onto the surface of a wafer, the coating assembly being movably disposed above a support assembly; The detection substrate (1) is connected to an electrical control cabinet (3) on one side, and a detection component is provided on one side of the electrical control cabinet (3). The detection component includes an optical imaging module (2) and a display screen (4) pinned to the top of the electrical control cabinet (3). The optical imaging module (2) and the electrical control cabinet (3) are slidably connected. The support assembly includes a flip frame (8), on one side of the bottom of the flip frame (8) are two sets of second ear plates (11) symmetrically arranged, and a support shaft (12) is fixedly connected through the two sets of second ear plates (11). Two sets of first ear plates (10) are symmetrically arranged on the upper surface of the detection substrate (1). Both ends of the support shaft (12) are rotatably connected to the first ear plates (10). A driving assembly is provided between the flipping frame (8) and the detection substrate (1). The driving assembly includes a lead screw (14), a driving block (15) is slidably connected to the surface of the lead screw (14), an internal threaded sleeve is connected between the driving block (15) and the lead screw (14), a third ear plate (16) is fixedly connected to the driving block (15), and the driving block (15) is slidably connected to the detection substrate (1). A fourth ear plate (19) is fixedly connected to the center of one side of the bottom of the flipping frame (8), and a first connecting plate (17) is pinned between the fourth ear plate (19) and the third ear plate (16). Two sets of guide components are provided on both sides of the first connecting plate (17). The guide components include a guide block (21) slidably disposed in the detection base plate (1). A second connecting plate (20) is pinned to the guide block (21). A connecting rod (18) is pinned to the fourth ear plate (19) and the first connecting plate (17). Two sets of fifth ear plates (29) are symmetrically disposed on one side of the bottom of the flipping frame (8). Both ends of the connecting rod (18) are rotatably installed in the fifth ear plate (29). The connecting rod (18) is pinned to the second connecting plate (20). A guide groove (28) is opened in the detection base plate (1). A guide shaft (22) is provided in the guide groove (28). The guide shaft (22) and the guide block (21) are slidably connected. The coating assembly is slidably disposed on the processing plate (26) above the fixed plate (5). The processing plate (26) is filled with a detection compound. Adjustment sleeves (36) are provided at both ends of the processing plate (26). Electric slides (25) are symmetrically disposed on both sides of the flipping frame (8). Support rods (27) are connected to the electric slides (25). The adjustment sleeves (36) and the support rods (27) are slidably disposed. It also includes a first airbag (23) sleeved outside the guide shaft (22). One end of the first airbag (23) is slidably connected to one side of the guide block (21), and the other end of the first airbag (23) is fixedly connected to the guide groove (28). The fixed end of the first airbag (23) is connected to a spraying branch pipe (24).

2. The wafer defect detection equipment according to claim 1, characterized in that, A fixed plate (5) is slidably connected to the flipping frame (8). A suction cup (6) is provided inside the fixed plate (5), and two sets of sliders (7) are symmetrically arranged on the bottom surface of the fixed plate (5). At least six sets of sliding grooves (9) are opened inside the flipping frame (8), and the sliders (7) and sliding grooves (9) are matched.

3. The wafer defect detection equipment according to claim 1, characterized in that, The processing plate (26) includes a spray tank (34), which contains a test compound and is connected to a spray pipe (35) at the bottom. A main spray pipe (30) is connected between the two sets of spray branch pipes (24), and the main spray pipe (30) is connected to the spray tank (34) through a steel wire hose. It also includes an air chamber (37), the spray tank (34) and the air chamber (37) are connected to the first airbag (23) through a connecting pipe (42), the bottom of the air chamber (37) is connected to a cleaning plate (40) through a spring (39), a guide rod (41) is provided in the spring (39), one end of the guide rod (41) is slidably connected to the air chamber (37), and the other end of the guide rod (41) is fixedly connected to the cleaning plate (40), a pressure pipe (38) connected to the air chamber (37) is provided between the air chamber (37) and the cleaning plate (40), and the gas discharged by the pressure pipe (38) pushes the cleaning plate (40) and the wafer with detection to bond together.

4. The wafer defect detection equipment according to claim 1, characterized in that, The jet assembly includes two sets of second airbags (31) sleeved on the outside of the electric slide (25). One end of the second airbag (31) is connected to the movable block of the electric slide (25), and the other end of the second airbag (31) is fixedly connected to one end of the slide groove (9). One end of each set of second airbags (31) is connected to a connecting air pipe (32). An air outlet pipe (33) is provided on one side of the electrical control cabinet (3). The connecting air pipe (32) and the air outlet pipe (33) are connected in a continuous manner.

5. A wafer defect detection method, comprising the wafer defect detection equipment according to any one of claims 1-4, characterized in that, Includes the following steps: Step 1: Place the wafer to be tested on the suction cup (6), start the external pump to drive the suction cup (6) to draw a vacuum, adsorb the wafer, and thus fix the detection position of the wafer; Step 2: Start the motor (13), drive the lead screw (14) to rotate, drive the drive block (15) to move forward, change the angle of the first connecting plate (17), and thus adjust the wafer angle; Step 3: During the flipping process of the fixed plate (5), the first airbag (23) is squeezed, and the detection compound in the spray tank (34) is sprayed onto the wafer surface through the spray tube (35). The cleaning plate (40) on one side of the spray tank (34) is then removed after spraying. Step 4: During the spraying process, the electric slide (25) is started, the second airbag (31) is squeezed, and exhaust is discharged through the air outlet pipe (33) to the wafer surface to remove floating dust; Step 5: Activate the optical imaging module (2) to illuminate the wafer surface. Detect wafer defects by interacting with the detection compound at the wafer surface depressions.

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