PCB black hole electroplating process

Abstract

The invention discloses a PCB black hole electroplating process, which comprises the following steps of heating and punching: preheating a PCB, heating to a preset temperature, punching a nail head, removing glue, removing glue at the bottom of the PCB, electroplating, electroplating the whole PCB, blackening, generating a layer of uniform black passive film for a preset hole formed in the PCB through chemical reaction, and removing the glue at the bottom of the PCB; the black passivation film of the preset hole is removed, washing copper deposition and drying are carried out, copper deposition is carried out in the preset hole through a chemical reaction, an inner circuit and an outer circuit are conducted, the whole PCB is dried, the size of the nail head is improved, efficient production is facilitated, the micro-etching depth is controlled, the most appropriate black hole efficiency of the PCB is achieved, unnecessary procedures are omitted, and the production efficiency of the PCB is improved. And moreover, the whole process is relatively simple, and the method has an efficient production prospect.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board processing, and in particular to a black hole electroplating process for a PCB board. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts. Circuit boards can be called printed circuit boards or printed circuit boards, and their English names are PCB, FPC circuit boards (FPC circuit boards are also called flexible circuit boards. Flexible circuit boards are made of polyimide or polyester film as substrates. They are highly reliable and extremely flexible printed circuit boards. They have the characteristics of high wiring density, light weight, thin thickness, and good bending properties.) and the birth and development of hard-and-soft boards - FPC and PCBs have given rise to a new product, the hard-and-soft board. Therefore, a rigid-flex board is a circuit board with both FPC and PCB characteristics formed by combining a flexible circuit board and a rigid circuit board through processes such as pressing and other processes according to relevant process requirements. At present, the overall electroplating blackening process of PCB boards is relatively complicated and inefficient during processing, which wastes a lot of time and makes the overall operation inconvenient and inefficient.

[0003] Therefore, in order to solve the above technical problems, this application proposes a. Summary of the invention

[0004] In view of the shortcomings of the prior art, the purpose of the present invention is to overcome the problems that the existing electroplating blackening process is relatively complicated and inefficient, thus wasting a lot of time and the overall operation is not convenient and efficient. A PCB board black hole electroplating process of the present invention can be quickly processed and produced by eliminating unnecessary processes, and the overall process is relatively simple, with the prospect of efficient production.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is: A PCB black hole electroplating process, the process comprising the following steps: Heating and punching: preheat the PCB board to a predetermined temperature for nail head punching; Glue removal: remove glue from the bottom of PCB board; Electroplating: electroplating the entire PCB board; Blackening: A uniform black passivation film is produced on the preset holes of the PCB through a chemical reaction; Film removal: remove the black passivation film of the preset holes; Water washing, copper deposition and drying: Copper is deposited in the preset holes through chemical reaction, internal and external circuits are connected, and the entire PCB board is dried.

[0006] In the aforementioned black hole electroplating process for a PCB board, the PCB board is heated to between 80°C and 140°C.

[0007] In the aforementioned black hole electroplating process for a PCB board, the nail head is used to punch holes in the PCB board, and the nail head has a diameter of ≤1.25 and a roughness of ≤1.5mil.

[0008] In the aforementioned black hole electroplating process for a PCB board, a layer of electroplated carbon is coated on the surface of the PCB for overall electroplating.

[0009] In the aforementioned black hole electroplating process for a PCB board, the immersion treatment time of the chemical reaction of the PVB board is ≥40 seconds, and the micro-etching depth of the PCB board is controlled to be 0.4-0.7um.

[0010] In the aforementioned black hole electroplating process for a PCB board, the PCB is immersed in a chemical tank to remove the black passivation film in the preset holes.

[0011] In the aforementioned black hole electroplating process for a PCB board, the PCB board is sunk into a chemical tank to attach a copper layer, and the immersion treatment time of the chemical reaction of the PCB board is ≥1 minute.

[0012] In the aforementioned black hole electroplating process for a PCB board, the PCB board is fished out and dried with strong wind.

[0013] The beneficial effects of the present invention are as follows: a PCB black hole electroplating process of the present invention facilitates efficient production by improving the size of the nail head, controls the micro-etching depth, achieves the most suitable PCB black hole efficiency, deletes unnecessary processes, and performs rapid processing and production, and the overall process is relatively simple, with the prospect of efficient production. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings: Figure 1 The present invention is a flow chart of a PCB board black hole electroplating process production process. DETAILED DESCRIPTION

[0015] like Figure 1As shown, the present invention provides a PCB black hole electroplating process, which facilitates efficient production by improving the size of the nail head, controls the micro-etching depth, achieves the most suitable PCB black hole efficiency, deletes unnecessary processes, and performs rapid processing and production. The overall process is relatively simple and has the prospect of efficient production. The following steps are included: Heating and punching: preheat the PCB board to a predetermined temperature for nail head punching; Glue removal: remove glue from the bottom of PCB board; Electroplating: electroplating the entire PCB board; Blackening: A uniform black passivation film is produced on the preset holes of the PCB through a chemical reaction; Film removal: remove the black passivation film of the preset holes; Water washing, copper deposition and drying: Copper is deposited in the preset holes through chemical reaction, internal and external circuits are connected, and the entire PCB board is dried.

[0016] Example 1 Preferably, in a black hole electroplating process for a PCB board of the present invention, the PCB board is heated to between 80° C. and 140° C.

[0017] Preferably, in a black hole electroplating process for a PCB board of the present invention, a nail head is used to punch holes in the PCB board, and the nail head has a diameter of ≤1.25 and a roughness of ≤1.5 mil.

[0018] Preferably, in a black hole electroplating process for a PCB board of the present invention, a layer of electroplated carbon is coated on the surface of the PCB for overall electroplating.

[0019] Preferably, in a black hole electroplating process for a PCB board of the present invention, the immersion treatment time of the chemical reaction of the PVB board is ≥40 seconds, and the micro-etching depth of the PCB board is controlled to be 0.4-0.7 um.

[0020] Preferably, in a black hole electroplating process for a PCB board of the present invention, the PCB is immersed in a chemical tank to remove the black passivation film in the preset holes.

[0021] Preferably, in a black hole electroplating process for a PCB board of the present invention, the PCB board is sunk into a chemical cylinder to attach a copper layer, and the immersion treatment time of the chemical reaction of the PCB board is ≥1 minute.

[0022] Preferably, in a black hole electroplating process for a PCB board of the present invention, the PCB board is fished out and dried with strong wind.

[0023] In summary, a black hole electroplating process for a PCB board of the present invention heats the PCB board to between 80°C and 140°C, and a nail head punches holes in the PCB board, wherein the nail head is ≤1.25 and the roughness is ≤1.5mil, so that the entire PCB board reaches the optimal drilling temperature, and holes are drilled therein to reduce the problem that the copper at the nail head is etched away after micro-etching, thereby exposing the glue layer, and the glue layer has no adsorbed carbon film, thereby causing the hole to be broken. A layer of electroplated carbon is coated on the surface of the PCB for overall electroplating, and the entire board is rapidly electroplated. The immersion treatment time of the chemical reaction of the PVB board is ≥40 seconds, and the micro-etching depth of the PCB board is controlled to be 0.4-0.7um. The PCB is immersed in a chemical tank to remove the black passivation film in the preset hole, and the anti-break hole treatment is reduced by controlling the micro-etching depth. The PCB board is sunk in the chemical tank to attach the copper layer. The immersion treatment time of the PCB board chemical reaction is ≥1 minute. By controlling the copper deposition treatment to be more than one minute, the convenience of attachment is increased. The PCB board is fished out for strong wind drying and drying. By improving the size of the nail head, efficient production is facilitated, the micro-etching depth is controlled, and the most suitable PCB black hole efficiency is achieved. Unnecessary processes are deleted, and the production is quickly processed. The overall process is relatively simple and has the prospect of efficient production.

[0024] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any ordinary technician in the industry can smoothly implement the present invention as shown in the drawings and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the present invention using the technical content disclosed above are all equivalent embodiments of the present invention. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the protection scope of the technical solution of the present invention.

Claims

1. A PCB black hole electroplating process, characterized in that: The process includes the following steps: Heating and punching: preheat the PCB board to a predetermined temperature for nail head punching; Glue removal: remove the glue at the bottom of the PCB board; Electroplating: electroplating the entire PCB board; Blackening: A uniform black passivation film is produced on the preset holes of the PCB board through a chemical reaction; Film removal: remove the black passivation film of the preset holes; Water washing, copper deposition and drying: Copper is deposited in the preset holes through chemical reaction, internal and external circuits are connected, and the entire PCB board is dried.

2. A PCB black hole electroplating process according to claim 1, characterized in that: The PCB board is heated to between 80°C and 140°C.

3. A PCB board black hole electroplating process according to claim 1, characterized in that: The nail head is used to punch holes in the PCB board, and the nail head has a thickness of ≤1.25 and a roughness of ≤1.5mil.

4. A PCB board black hole electroplating process according to claim 1, characterized in that: The surface of the PCB is coated with a layer of electroplated carbon for overall electroplating.

5. A PCB board black hole electroplating process according to claim 1, characterized in that: The immersion treatment time of the chemical reaction of the PVB board is ≥40 seconds, and the micro-etching depth of the PCB board is controlled to be 0.4-0.7um.

6. A PCB board black hole electroplating process according to claim 1, characterized in that: The PCB is immersed in a chemical tank to remove the black passivation film in the preset holes.

7. A PCB board black hole electroplating process according to claim 1, characterized in that: The PCB board is sunk into the chemical tank to attach a copper layer, and the immersion treatment time of the chemical reaction of the PCB board is ≥1 minute.

8. A PCB black hole electroplating process according to claim 1, characterized in that: The PCB board is fished out and dried with strong wind.

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