A heat-conducting graphene floor heating pipe

Abstract

The present invention discloses a heat-conducting graphene floor heating pipe, belonging to the technical field of polymer materials, which includes an outer layer, a bonding layer and an inner layer. The outer layer comprises the following components in parts by weight: 100-189 parts of a support heat-conducting material, 150-270 parts of a matrix resin, 10-16 parts of a toughening agent, and 8-19 parts of an antioxidant; the polyethylene resin, graphene, a support material, and a hydrophobic material; the mass ratio of the graphene, the support material, and the hydrophobic material is 5:(0.8-1.2):(0.2-1):(0.1-0.8); the support material includes at least one of potassium titanate whiskers and aluminum borate whiskers. The floor heating pipe of the present invention has excellent heat-conducting performance and mechanical properties, greatly improves the heat dissipation rate, effectively improves the heating efficiency of the floor heating system, and achieves an overall high energy-saving effect.

Description

Technical Field

[0001] The present invention relates to the technical field of polymer materials, and particularly relates to a heat-conducting graphene floor heating pipe. Background Art

[0002] Due to the large differences in climate environments in different regions, in the cold winter, suitable heating equipment is particularly important. In the north, the weather remains in a relatively cold environment for a long time, so it is not enough to use only air conditioners for heating like most places in the south. In the past, the heating equipment used in the north was generally kang. With the development, floor heating is gradually replacing kang and becoming the main heating method in the north. In modern construction, floor radiation heating is generally realized for building heating, that is, what people often call floor heating. Floor heating is a heat storage and heat transfer technology based on the ground. At present, there are also newly built communities in the south equipped with floor heating facilities to solve the heating needs in winter. Compared with air-conditioning heating, floor radiation heating has many advantages, such as uniform indoor surface temperature, no impact on indoor humidity, and comfortable body feeling, which is recognized by people.

[0003] The floor heating pipe is an important heat dissipation component of floor radiation heating. The heat conduction performance of the floor heating pipe affects the effect of floor heating and is an extremely key performance parameter. At present, the floor heating pipe is mainly made of polyethylene pipe. The thermal conductivity coefficient of the polyethylene pipe is in the range of 0.2 - 0.4 W / (m·k), and its heat conduction performance is poor, which cannot meet the requirement of rapid indoor temperature rise. At the same time, due to the large heat loss in heat conduction, the thermal efficiency is low, affecting the overall heating efficiency of the floor heating. Therefore, the market demand for ultra-high heat-conducting floor heating pipe products is increasing day by day.

[0004] The existing floor heating pipes have a relatively slow heat dissipation speed and low working efficiency, and are prone to wasting a part of heat during heat transfer, wasting resources.

[0005] In view of this, this application is proposed. Summary of the Invention

[0006] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a heat-conducting graphene floor heating pipe with excellent heat conduction performance and mechanical properties.

[0007] To achieve the above purpose, the technical solution adopted by the present invention is as follows:

[0008] A heat-conducting graphene floor heating pipe, comprising an outer layer, a bonding layer and an inner layer. The outer layer comprises the following components in parts by weight: 100 - 189 parts of a support heat-conducting material, 150 - 270 parts of a matrix resin, 10 - 16 parts of a toughening agent, and 8 - 19 parts of an antioxidant;

[0009] The supporting heat-conducting material includes polyethylene resin, graphene, a supporting material, and a hydrophobic material; the mass ratio of the polyethylene resin, graphene, supporting material, and hydrophobic material is 5:(0.8 - 1.2):(0.2 - 1):(0.1 - 0.8);

[0010] The supporting material includes at least one of potassium titanate whiskers and aluminum borate whiskers;

[0011] The hydrophobic material includes the following components in parts by weight: 1 - 5 parts of titanium dioxide, 1 - 3 parts of epoxidized soybean oil, and 10 - 17 parts of polybutene.

[0012] In the present invention, creatively, polyethylene resin, graphene, a supporting material, and a hydrophobic material are used as the supporting heat-conducting material, which can significantly improve the heat-conducting performance of the floor heating pipe, greatly increase the heat dissipation rate, effectively improve the heating efficiency of the floor heating system, and achieve an overall high energy-saving effect. Among them, graphene has a very high thermal conductivity, which can theoretically reach 5300 W / m·K. Potassium titanate whiskers have chemical stability and a relatively high melting point, playing an excellent supporting role. The hydrophobic material can reduce the erosion of water on the material, extend the service life of the floor heating pipe. At the same time, reducing the presence of water helps to maintain the thermal conductivity of the material (water may reduce the thermal performance of the material).

[0013] In the present invention, the combination of the three (graphene, supporting material, and hydrophobic material) and polyethylene resin as the supporting heat-conducting material makes use of the characteristics of the three. Under the synergistic effect of the three, the heat-conducting effect and tensile strength of the system are significantly improved. Among them, the two-dimensional sheet of graphene provides an efficient in-plane heat transfer path, while potassium titanate whiskers promote the formation of a three-dimensional heat conduction network. The combination of this two-dimensional and three-dimensional structure significantly improves the heat transfer efficiency and reduces the heat conduction "dead zone" in the composite material. Potassium titanate whiskers provide an additional heat conduction path in the vertical direction through its fiber structure, thus compensating for the deficiency of graphene in the vertical direction. This complementary effect of anisotropic heat transfer significantly improves the thermal conductivity of the overall material. The hydrophobic material, while reducing water, fills the microscopic voids between graphene and potassium titanate whiskers, reducing the thermal resistance at the interface, so that heat can be transferred more smoothly between each component. In addition, graphene and potassium titanate whiskers can be bridged by titanium dioxide to form a tighter interface, further reducing the interface thermal resistance.

[0014] As a preferred embodiment of the present invention, the supporting material is potassium titanate whiskers, and the diameter of the potassium titanate whiskers is 3 - 5 μm, and the length is 10 - 30 μm. Especially when the length and diameter of the potassium titanate whiskers are within this range, the potassium titanate whiskers can form a denser conductive network structure to make up for the deficiency of graphene in the vertical direction.

[0015] In the present invention, the length and diameter of potassium titanate whiskers are measured by a microscopy method: 100 potassium titanate whisker samples are placed under a microscope for observation, and the lengths and diameters of all potassium titanate whiskers in the samples are calculated, and the average value is calculated.

[0016] As a preferred embodiment of the present invention, the average particle size of the graphene is 10 - 14 μm, wherein the average particle size of the graphene is measured according to GB / T 19077-2016.

[0017] As a preferred embodiment of the present invention, the bulk density of the graphene is 0.20 - 0.28 g / ml, wherein the bulk density of the graphene is measured according to GB / T 16913.1-1997.

[0018] As a preferred embodiment of the present invention, the mass ratio of the polyethylene resin, graphene, support material and hydrophobic material is 5:1:(0.4 - 0.7):(0.3 - 0.6). In particular, when the mass ratio of the three is within this range, the synergistic effect is more obvious.

[0019] As a preferred embodiment of the present invention, the matrix resin includes a polyethylene resin and a silicone rubber, and the mass ratio of the polyethylene resin and the silicone rubber is 1:(0.4 - 0.5). By using a matrix resin composed of a polyethylene resin and a silicone rubber, the dispersion effect of graphene potassium titanate whiskers and titanium dioxide in the system can be improved, making their distribution uniform and the structure dense, promoting heat transfer and improving the synergistic heat conduction effect, and reducing the interfacial thermal resistance.

[0020] As a preferred embodiment of the present invention, the silicone rubber is methyl vinyl silicone rubber, and the vinyl content in the methyl vinyl silicone rubber is 0.25 - 0.79%. The vinyl content in the methyl vinyl silicone rubber is measured according to the standard of GB / T36691-2018.

[0021] As a preferred embodiment of the present invention, the toughening agent includes at least one of POE resin, CPE resin, and ABS resin; and / or

[0022] The antioxidant includes at least one of thioester antioxidants, hindered phenol antioxidants, hydroxylamine antioxidants, phosphite antioxidants, and phosphate antioxidants.

[0023] As a preferred embodiment of the present invention, the inner layer includes the following components in parts by weight: 40 - 55 parts of hydrophobic material, 20 - 39 parts of antibacterial material, 5 - 17 parts of coupling agent, and 1 - 8 parts of dispersant.

[0024] As a preferred embodiment of the present invention, the coupling agent includes at least one of titanate coupling agents, stannate coupling agents, silane coupling agents, and aluminate coupling agents;

[0025] The dispersant includes at least one of zinc stearate, barium stearate, and calcium stearate;

[0026] The antibacterial agent is a complex of a triazole compound and silver, and the triazole compound includes at least one of 2-triazole-biphenyldicarboxylic acid and 1,2,3-triazole.

[0027] As a preferred embodiment of the present invention, the melt flow rate of the polyethylene resin mentioned in the present invention under the conditions of 190 °C / 2.16 kg is 0.5 - 2 g / 10 min, and the test method is ISO1133-2011.

[0028] As a preferred embodiment of the present invention, the thickness of the outer layer is 7 - 14 mm, the thickness of the inner layer is 5 - 15 mm, and the thickness of the bonding layer is 50 - 120 μm.

[0029] The present invention also provides a preparation method of a heat-conducting graphene floor heating pipe, including the following steps:

[0030] (1) Prepare the inner layer, weigh each raw material according to the ratio, mix each raw material evenly, melt and blend, extrude and mold the melt blend through an extruder, and cool to form the inner layer;

[0031] (2) Prepare the outer layer, weigh each raw material according to the ratio, mix each raw material evenly, melt and blend, extrude and mold the melt blend through an extruder, and cool to form the outer layer;

[0032] (3) Coat the bonding agent between the inner layer and the outer layer, and assemble the inner layer, the bonding layer, and the outer layer together in sequence to obtain the heat-conducting graphene floor heating pipe.

[0033] The beneficial effects of the present invention are as follows: The present invention uses polyethylene resin, graphene, a support material, and a hydrophobic material as the heat-conducting material, which can significantly improve the heat conduction performance of the floor heating pipe, greatly increase the heat dissipation rate, effectively improve the heating efficiency of the floor heating system, and achieve an overall high energy-saving effect. Specific Embodiments

[0034] To make the purposes, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0035] In the present application, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0036] In this application, when it comes to numerical ranges, unless otherwise specified, the above numerical ranges are deemed to be continuous and include the minimum and maximum values ​​of the range, as well as each value between such minimum and maximum values. Further, when a range refers to an integer, each integer between the minimum and maximum values ​​of the range is included. In addition, when multiple ranges are provided to describe features or characteristics, the ranges can be merged. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges included therein.

[0037] In the present application, there is no particular limitation on the specific dispersion and stirring treatment methods.

[0038] Unless otherwise specified, the components, raw materials or instruments used in the embodiments and comparative examples of the present invention are all commercially available raw materials or instruments, and the components and raw materials used in each parallel experiment are all of the same kind.

[0039] The sources of raw materials for the embodiments and comparative examples are as follows:

[0040] Polyethylene resin: Dow Chemical, brand: DGDK-3364.

[0041] Methyl vinyl silicone rubber-1: Dongjue silicone, vinyl content 0.25~0.49%, brand 110-4.

[0042] Methyl vinyl silicone rubber-2: Dongjue silicone, vinyl content 0.50~0.79%, brand 110-5.

[0043] Methyl vinyl silicone rubber-3: Dongjue silicone, vinyl content 0.07~0.12%, brand 110-1.

[0044] Methyl vinyl silicone rubber-4: Dongjue silicone, vinyl content 0.8~1.79%, brand 110-6.

[0045] Methyl silicone rubber: Dongjue silicone, brand 110.

[0046] Graphene-1: Xiamen Kaina Graphene Co., Ltd., average particle size 10~14μm, brand KNG-180-3.

[0047] Graphene-2: Xiamen Kaina Graphene Co., Ltd., average particle size 20~45μm, brand KNG-182.

[0048] Graphene-3: Xiamen Kaina Graphene Co., Ltd., average particle size 3~6μm, brand KNG-150.

[0049] Potassium titanate whisker - 1: Macklin reagent, with a diameter of 3 - 5 μm and a length of 10 - 30 μm, grade H790559.

[0050] Potassium titanate whisker - 2: Macklin reagent, with a diameter of 0.1 - 0.3 μm and a length of 3 - 5 μm, grade H790559.

[0051] Potassium titanate whisker - 3: Macklin reagent, with a diameter of 20 - 100 μm and a length of 1 μm, grade H790559.

[0052] Aluminum borate whisker: Macklin reagent, with a diameter of 20 - 100 μm and a length of 1 μm, grade: H790559.

[0053] POE resin: DuPont, with a molecular weight range between 2 million and 6 million, grade: Engage 8842.

[0054] Antioxidant: BASF, with an active ingredient content of over 98%, grade: Irganox 1010.

[0055] Titanium dioxide: Clariant, grade: Tiona R24.

[0056] Epoxidized soybean oil: Cargill, grade: Edenor SO - 300.

[0057] Polybutene: ExxonMobil, with a melt index of 1.0 g / 10min (230 °C, 2.16 kg), grade: Exact3035.

[0058] Coupling agent: Dow Corning, silane coupling agent, grade: Dynasylan® GLYMO.

[0059] Antibacterial agent: Add 2 - triazole - biphenyldicarboxylic acid and silver nitrate with a mass ratio of 1:1 to the DMF solution, stir evenly at room temperature, heat - treat at 180 °C for 2 h, and dry at 60 °C to obtain a complex of 2 - triazole - biphenyldicarboxylic acid and silver.

[0060] Dispersant: Zinc stearate, commercially available.

[0061] The following examples are provided to facilitate the understanding of the present invention. These examples are not provided to limit the scope of the claims.

[0062] Example 1

[0063] A heat - conductive graphene floor heating pipe, comprising an outer layer, a bonding layer, and an inner layer. The thickness of the outer layer is 10 mm, the thickness of the inner layer is 8 mm, and the thickness of the bonding layer is 70 μm.

[0064] Among them, the outer layer comprises the following components in parts by weight: 150 parts of a support heat-conducting material, 225 parts of a matrix resin, 15 parts of a toughening agent, and 10 parts of an antioxidant.

[0065] The support heat-conducting material includes a polyethylene resin, graphene-1, potassium titanate whiskers-1, and a hydrophobic material;

[0066] The mass ratio of the polyethylene resin, graphene-1, the support material, and the hydrophobic material is 5:1:0.6:0.4.

[0067] The hydrophobic material includes the following components in parts by weight: 4 parts of titanium dioxide, 2 parts of epoxy soybean oil, and 14 parts of polybutene.

[0068] The matrix resin includes a polyethylene resin and methyl vinyl silicone rubber-1, and the mass ratio of the polyethylene resin and methyl vinyl silicone rubber-1 is 1:0.4.

[0069] The inner layer comprises the following components in parts by weight: 52 parts of a hydrophobic material (the same as the outer layer), 30 parts of an antibacterial material, 12 parts of a coupling agent, and 6 parts of a dispersant.

[0070] The preparation method of the heat-conducting graphene floor heating pipe comprises the following steps:

[0071] (1) Prepare the inner layer. Weigh each raw material according to the ratio, mix each raw material evenly, melt and blend them, extrude the melt blend through an extruder to form an inner layer, and cool it.

[0072] (2) Prepare the outer layer. Weigh each raw material according to the ratio, mix each raw material evenly, melt and blend them, extrude the melt blend through an extruder to form an outer layer, and cool it.

[0073] (3) Coat an adhesive between the inner layer and the outer layer, and assemble the inner layer, the adhesive layer, and the outer layer together in sequence to obtain the heat-conducting graphene floor heating pipe.

[0074] Example 2

[0075] The difference between Example 2 and Example 1 lies in that the dosage of the raw materials in the outer layer is different, and the others are the same.

[0076] The outer layer comprises the following components in parts by weight: 100 parts of a support heat-conducting material, 150 parts of a matrix resin, 10 parts of a toughening agent, and 8 parts of an antioxidant.

[0077] Example 3

[0078] The difference between Example 3 and Example 1 lies in that the dosage of the raw materials in the outer layer is different, and the others are the same.

[0079] The outer layer comprises the following components in parts by weight: 189 parts of a support heat-conducting material, 270 parts of a matrix resin, 16 parts of a toughening agent, and 19 parts of an antioxidant.

[0080] Example 4

[0081] The difference between Example 4 and Example 1 is that potassium titanate whisker-2 is used to replace potassium titanate whisker-1, and the others are the same.

[0082] Example 5

[0083] The difference between Example 5 and Example 1 is that potassium titanate whisker-3 is used to replace potassium titanate whisker-1, and the others are the same.

[0084] Example 6

[0085] The difference between Example 6 and Example 1 is that aluminum borate whisker is used to replace potassium titanate whisker-1, and the others are the same.

[0086] Example 7

[0087] The difference between Example 7 and Example 1 is that the mass ratios of the polyethylene resin, graphene, potassium titanate whisker-1, and the hydrophobic material are different, and the others are the same.

[0088] In this example, the mass ratio of the polyethylene resin, graphene, potassium titanate whisker-1, and the hydrophobic material is 5:1:0.4:0.6.

[0089] Example 8

[0090] The difference between Example 8 and Example 1 is that the mass ratios of the polyethylene resin, graphene-1, potassium titanate whisker-1, and the hydrophobic material are different, and the others are the same.

[0091] In this example, the mass ratio of the polyethylene resin, graphene-1, potassium titanate whisker-1, and the hydrophobic material is 5:1:0.7:0.3.

[0092] Example 9

[0093] The difference between Example 9 and Example 1 is that the mass ratios of the polyethylene resin, graphene-1, potassium titanate whisker-1, and the hydrophobic material are different, and the others are the same.

[0094] In this example, the mass ratio of the polyethylene resin, graphene, potassium titanate whisker-1, and the hydrophobic material is 5:1:0.2:0.1.

[0095] Example 10

[0096] The difference between Example 10 and Example 1 is that the mass ratios of the polyethylene resin, graphene-1, potassium titanate whisker-1, and the hydrophobic material are different, and the others are the same.

[0097] In this embodiment, the mass ratio of the polyethylene resin, graphene-1, potassium titanate whiskers-1 and the hydrophobic material is 5:1:1:0.8.

[0098] Example 11

[0099] The difference between Example 11 and Example 1 is that graphene-2 is used to replace graphene-1, and the others are the same.

[0100] Example 12

[0101] The difference between Example 12 and Example 1 is that graphene-3 is used to replace graphene-1, and the others are the same.

[0102] Example 13

[0103] The difference between Example 13 and Example 1 is that methyl vinyl silicone rubber-2 is used to replace methyl vinyl silicone rubber-1, and the others are the same.

[0104] Example 14

[0105] The difference between Example 14 and Example 1 is that methyl vinyl silicone rubber-3 is used to replace methyl vinyl silicone rubber-1, and the others are the same.

[0106] Example 15

[0107] The difference between Example 15 and Example 1 is that methyl vinyl silicone rubber-4 is used to replace methyl vinyl silicone rubber-1, and the others are the same.

[0108] Comparative Example 1

[0109] The difference between Comparative Example 1 and Example 1 is that the matrix resin of Comparative Example 1 is different from that of Example 1, and the others are the same.

[0110] The matrix resin of this comparative example is a single polyethylene resin.

[0111] Comparative Example 2

[0112] The difference between Comparative Example 2 and Example 1 is that the matrix resin of Comparative Example 2 is different from that of Example 1, and the others are the same.

[0113] The matrix resin described in this comparative example includes a polyethylene resin and a methyl silicone rubber, and the mass ratio of the polyethylene resin and the methyl silicone rubber is 1:0.4.

[0114] Comparative Example 3

[0115] The difference between Comparative Example 3 and Example 1 is that the supporting heat-conducting material of Comparative Example 3 is different from that of Example 1, and the others are the same.

[0116] The supporting heat-conducting material comprises a polyethylene resin, potassium titanate whiskers-1, and a hydrophobic material; the mass ratio of the polyethylene resin, the supporting material, and the hydrophobic material is 5:0.6:0.4.

[0117] The hydrophobic material comprises the following components in parts by weight: 4 parts of titanium dioxide, 2 parts of epoxy soybean oil, and 14 parts of polybutene.

[0118] Comparative Example 4

[0119] The difference between Comparative Example 4 and Example 1 is that the supporting heat-conducting material of Comparative Example 4 is different from that of Example 1, and the others are the same.

[0120] The supporting heat-conducting material comprises a polyethylene resin, graphene-1, and a hydrophobic material; the mass ratio of the polyethylene resin, graphene-1, and the hydrophobic material is 5:1:0.4.

[0121] The hydrophobic material comprises the following components in parts by weight: 4 parts of titanium dioxide, 2 parts of epoxy soybean oil, and 14 parts of polybutene.

[0122] Comparative Example 5

[0123] The difference between Comparative Example 5 and Example 1 is that the supporting heat-conducting material of Comparative Example 5 is different from that of Example 1, and the others are the same.

[0124] The supporting heat-conducting material comprises a polyethylene resin, graphene-1, and potassium titanate whiskers-1; the mass ratio of the polyethylene resin, graphene-1, and the supporting material is 5:1:0.6.

[0125] Comparative Example 6

[0126] The difference between Comparative Example 6 and Example 1 is that the supporting heat-conducting material of Comparative Example 6 is different from that of Example 1, and the others are the same.

[0127] The described supporting heat-conducting material comprises a polyethylene resin and graphene-1, and the mass ratio of the polyethylene resin and graphene-1 is 5:1.

[0128] Comparative Example 7

[0129] The difference between Comparative Example 7 and Example 1 is that the supporting heat-conducting material of Comparative Example 7 is different from that of Example 1, and the others are the same.

[0130] The described supporting heat-conducting material comprises a polyethylene resin and potassium titanate whiskers-1, and the mass ratio of the polyethylene resin and potassium titanate whiskers-1 is 5:0.6.

[0131] Comparative Example 8

[0132] The difference between Comparative Example 8 and Example 1 is that the supporting heat-conducting material of Comparative Example 8 is different from that of Example 1, and the others are the same.

[0133] The described supporting heat-conducting material: includes polyethylene resin and a hydrophobic material, and the mass ratio of the polyethylene resin to the hydrophobic material is 5:0.4.

[0134] The hydrophobic material includes the following components in parts by weight: 4 parts of titanium dioxide, 2 parts of epoxy soybean oil, and 14 parts of polybutene.

[0135] Comparative Example 9

[0136] The difference between Comparative Example 9 and Example 1 is that the supporting heat-conducting material of Comparative Example 9 is different from that of Example 1, and the others are the same.

[0137] The described supporting heat-conducting material includes polyethylene resin, graphene-1, potassium titanate whiskers-1, and titanium dioxide; the mass ratio of the polyethylene resin, graphene-1, the supporting material, and titanium dioxide is 5:1:0.6:0.4.

[0138] Comparative Example 10

[0139] The difference between Comparative Example 10 and Example 1 is that the supporting heat-conducting material of Comparative Example 10 is different from that of Example 1, and the others are the same.

[0140] The described supporting heat-conducting material includes polyethylene resin, graphene-1, potassium titanate whiskers-1, and talcum powder; the mass ratio of the polyethylene resin, graphene-1, potassium titanate whiskers-1, and talcum powder is 1:0.6:0.4.

[0141] Test Example

[0142] Tensile strength standard: ASTM D638, the size of the specimen is 57mm * 127mm * 3.2mm (effective size), and the tensile speed is 5mm / min.

[0143] Thermal conductivity test standard: ASTM D1461.

[0144] Table 1

[0145]

[0146] It can be seen from Table 1 that the heat-conducting graphene floor heating pipe described in the present invention has excellent heat-conducting performance and tensile strength. Among them, the heat-conducting coefficient of the heat-conducting graphene floor heating pipe is ≥2.8 W / m·K, and the tensile strength is ≥21 MPa.

[0147] By comparing Example 1 with Comparative Examples 3 to 10, it can be seen that the graphene, the supporting material, and the hydrophobic material in the supporting heat-conducting material described in the present invention have a significant synergistic effect, which can significantly improve the heat-conducting effect and tensile strength. The lack of any one of them or the replacement with other raw materials will lead to a significant decrease in the heat-conducting effect and tensile strength.

[0148] Comparing Example 1 with Comparative Examples 1-2, it can be seen that by using polyethylene resin and silicone rubber as the matrix resins in the present invention, the thermal conductivity and tensile strength can be significantly improved.

[0149] Comparing Examples 1, 4-6, it can be seen that by using potassium titanate whiskers with a diameter of 3-5 μm and a length of 10-30 μm in the present invention, the thermal conductivity and tensile strength can be further improved.

[0150] Comparing Examples 1, 7-10, it can be seen that by using polyethylene resin, graphene, support material and hydrophobic material in a ratio of 5:1:(0.4-0.7):(0.3-0.6) in the present invention, the thermal conductivity and tensile strength are further improved.

[0151] Comparing Examples 1, 11-12, it can be seen that by using graphene with an average particle size of 10-14 μm in the present invention, the thermal conductivity and tensile strength are further improved.

[0152] Comparing Examples 1, 13-15, it can be seen that by using methyl vinyl silicone rubber with a vinyl content of 0.25-0.79% in the present invention, the thermal conductivity and tensile strength are further improved.

[0153] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present invention rather than to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A thermally conductive graphene floor heating pipe, characterized in that: It comprises an outer layer, a bonding layer and an inner layer, wherein the outer layer comprises the following components in parts by weight: 100-189 parts of a supporting thermal conductive material, 150-270 parts of a base resin, 10-16 parts of a toughening agent, and 8-19 parts of an antioxidant; The supporting thermal conductive material comprises polyethylene resin, graphene, supporting material and hydrophobic material; the mass ratio of the polyethylene resin, graphene, supporting material and hydrophobic material is 5: (0.8-1.2): (0.2-1): (0.1-0.8); The support material includes at least one of potassium titanate whiskers and aluminum borate whiskers; The hydrophobic material comprises the following components in parts by weight: 1 to 5 parts of titanium dioxide, 1 to 3 parts of epoxidized soybean oil, and 10 to 17 parts of polybutene; The matrix resin includes polyethylene resin and silicone rubber, and the mass ratio of the polyethylene resin to the silicone rubber is 1: (0.4-0.5); The silicone rubber is methyl vinyl silicone rubber, the vinyl content of the methyl vinyl silicone rubber is 0.25-0.79%, and the vinyl content of the methyl vinyl silicone rubber is obtained by testing according to the standard of GB / T 36691-2018.

2. The heat-conducting graphene floor heating pipe according to claim 1, characterized in that: The supporting material is potassium titanate whisker, and the diameter of the potassium titanate whisker is 3-5 μm and the length is 10-30 μm.

3. The heat-conducting graphene floor heating pipe according to claim 1, characterized in that: The average particle size of the graphene is 10-14 μm.

4. The heat-conducting graphene floor heating pipe according to claim 1, characterized in that: The mass ratio of the polyethylene resin, graphene, support material and hydrophobic material is 5:1:(0.4-0.7):(0.3-0.6).

5. The heat-conducting graphene floor heating pipe according to claim 1, characterized in that: The toughening agent comprises at least one of POE resin, CPE resin and ABS resin; and / or The antioxidant includes at least one of a thioester antioxidant, a hindered phenol antioxidant, a hydroxylamine antioxidant, a phosphite antioxidant, and a phosphate antioxidant.

6. The heat-conducting graphene floor heating pipe according to claim 1, characterized in that: The inner layer comprises the following components in parts by weight: 40 to 55 parts of hydrophobic material, 20 to 39 parts of antibacterial material, 5 to 17 parts of coupling agent, and 1 to 8 parts of dispersant.

7. The heat-conducting graphene floor heating pipe according to claim 6, characterized in that: The coupling agent includes at least one of a titanate coupling agent, a stannate coupling agent, a silane coupling agent, and an aluminate coupling agent.

8. The heat-conducting graphene floor heating pipe according to claim 6, characterized in that: The dispersant includes at least one of zinc stearate, barium stearate and calcium stearate.

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