Foldable electronic device including flexible printed circuit board

Abstract

A foldable electronic device according to an exemplary embodiment of the present disclosure may include a foldable housing, a flexible display module, a first flexible printed circuit board, and a first non-conductive member. The foldable housing may include a first housing, a second housing, and a hinge unit for connecting the first housing and the second housing. The flexible display module may include a first display area disposed in the first housing, a second display area disposed in the second housing, and a third display area positioned between the first display area and the second display area corresponding to the hinge unit. The first flexible printed circuit board may include: a first surface accommodated in the first housing and oriented toward the first display area; and a second surface oriented in an opposite direction to the first surface. The first non-conductive member may be disposed between the first surface of the first flexible printed circuit board and the first housing. The first housing is connected to the hinge unit and may include a first side portion including a metal material. The second housing may include a second side portion connected to the hinge unit. The first flexible printed circuit board may include a first region facing and overlapping the first side portion when viewed from above the second surface. The first non-conductive member may be disposed between the first region and the first side portion.

Description

Technical Field

[0001] The present disclosure relates to a foldable electronic device including a flexible printed circuit board. Background Art

[0002] There is a foldable electronic device having a foldable screen (or display). The screen of the electronic device can be folded to increase its portability, and the display can be unfolded when using it, thereby providing a large screen.

[0003] The above information may be provided as related art intended to assist in understanding the present disclosure. No claim or assertion is made as to whether any of the above description might be applicable as prior art related to the present disclosure. Summary of the invention

[0004] Technical issues

[0005] It is difficult to arrange electronic components in a limited space inside a foldable electronic device while reducing electromagnetic interference (EMI) between electronic components. The thinning of foldable electronic devices exacerbates these problems. A foldable electronic device may include a flexible printed circuit board configured to transmit radio frequency (RF) signals. It may be necessary to arrange a flexible printed circuit board to reduce electromagnetic influences (or electromagnetic interference) exerted on the flexible printed circuit board by other electronic components inside the foldable electronic device (e.g., RF performance degradation, communication performance degradation, or antenna performance degradation).

[0006] Exemplary embodiments of the present disclosure provide a foldable electronic device including a flexible printed circuit board, wherein the flexible printed circuit board can be efficiently disposed in a limited space inside the foldable electronic device.

[0007] Exemplary embodiments of the present disclosure may provide a foldable electronic device including a flexible printed circuit board, which may reduce electromagnetic influence (or electromagnetic interference) (e.g., RF performance degradation, communication performance degradation, or antenna performance degradation) exerted on the flexible printed circuit board by other electronic components inside the foldable electronic device.

[0008] The technical problems to be solved by the present disclosure are not limited to the above-mentioned technical problems, and other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the present disclosure belongs from the following description.

[0009] Solution to the problem

[0010] According to an exemplary embodiment of the present disclosure, a foldable electronic device includes a foldable housing, a flexible display module, a first flexible printed circuit board, and a first non-conductive member. The foldable housing includes a first housing, a second housing, and a hinge portion configured to connect the first housing and the second housing. The flexible display module includes a first display area disposed in the first housing, a second display area disposed in the second housing, and a third display area positioned between the first display area and the second display area to correspond to the hinge portion. The first flexible printed circuit board is accommodated in the first housing, and may include a first surface facing the first display area and a second surface oriented in a direction opposite to the first surface. The first non-conductive member is disposed between the first surface of the first flexible printed circuit board and the first housing. The first housing includes a first lateral portion connected to the hinge portion and including a metal material. The second housing includes a second lateral portion connected to the hinge portion. In a view observed from above the second surface, the first flexible printed circuit board includes a first area configured to face the first lateral portion and overlap with the first lateral portion. The first non-conductive member is disposed between the first area and the first lateral portion.

[0011] Advantageous Effects of the Invention

[0012] An advantage of a foldable electronic device including a flexible printed circuit board according to an exemplary embodiment of the present disclosure is that the flexible printed circuit board is arranged in a limited space inside the foldable electronic device by utilizing a portion of the first shell connected to the hinge part, thereby improving space efficiency and improving the electromagnetic influence exerted on the flexible printed circuit board by the portion of the first shell connected to the hinge part, thereby ensuring the integrity of the signal transmitted through the flexible printed circuit board.

[0013] Various other beneficial effects obtainable or predictable from the various embodiments of the present disclosure may be disclosed explicitly or implicitly through the detailed description of the embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0015] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure.

[0016] Figure 2 A view showing a foldable electronic device in an unfolded state according to an embodiment of the present disclosure.

[0017] Figure 3 A view showing a foldable electronic device in a folded state according to an embodiment of the present disclosure.

[0018] Figure 4 is an exploded perspective view of a foldable electronic device in an unfolded state according to an embodiment of the present disclosure.

[0019] Figure 5 and Figure 6 is a view showing a foldable housing in an unfolded state according to an embodiment of the present disclosure.

[0020] Figure 7 is a view showing a hinge portion according to an embodiment of the present disclosure.

[0021] Figure 8 2 is a view showing a hinge portion, a third flexible printed circuit board, and a fourth flexible printed circuit board according to an embodiment of the present disclosure.

[0022] Fig. 9 is a view showing a first hinge module, a second hinge module, a third hinge module, a hinge housing, and a third printed circuit board according to an embodiment of the present disclosure.

[0023] Fig.10 is a view showing a hinge part, a first printed circuit board, a second printed circuit board, a third printed circuit board, a first battery, a first flexible printed circuit board, a third flexible printed circuit board, and a fourth flexible printed circuit board according to an embodiment of the present disclosure.

[0024] Fig.11 A view of a first flexible printed circuit board according to an embodiment of the present disclosure, a cross-sectional view of the first flexible printed circuit board cut along line BB′, and a cross-sectional view of the first flexible printed circuit board cut along line CC′ are shown.

[0025] Fig.12 A view showing a portion of a foldable electronic device in an unfolded state and a cross-sectional view of the foldable electronic device cut along line DD′ according to an embodiment of the present disclosure are shown.

[0026] Fig.13 Shown are views of a portion of a foldable electronic device according to an embodiment of the present disclosure, a cross-sectional view of the foldable electronic device cut along line EE', a cross-sectional view of the foldable electronic device cut along line F-F', and a cross-sectional view of the foldable electronic device cut along line G-G'.

[0027] Fig.14 is a view showing a portion of a foldable electronic device according to an embodiment of the present disclosure.

[0028] Fig.15 is a view showing a first battery and a first flexible printed circuit board according to an embodiment of the present disclosure.

[0029] Fig.16is a view showing a first antenna structure and a first flexible printed circuit board according to an embodiment of the present disclosure.

[0030] Fig.17 The present invention is a diagram showing an embodiment of the present invention. Fig.14 A cross-sectional view of the foldable electronic device cut along line H-H' in FIG.

[0031] Fig.18 A view of a first flexible printed circuit board according to an embodiment of the present disclosure and a cross-sectional view of the first flexible printed circuit board cut along line KK′ are shown.

[0032] Fig.19 is a view showing a first flexible printed circuit board according to an embodiment of the present disclosure.

[0033] Fig. 20 The present invention is a diagram showing an embodiment of the present invention. Fig.14 A cross-sectional view of the foldable electronic device cut along line II' in FIG.

[0034] Fig.21 is a perspective view showing a portion of a foldable electronic device according to an embodiment of the present disclosure.

[0035] Fig. 22 The present invention is a diagram showing an embodiment of the present invention. Fig.14 A cross-sectional view of the foldable electronic device cut along line J-J' in FIG. DETAILED DESCRIPTION

[0036] Hereinafter, various exemplary embodiments of the present disclosure disclosed herein will be described in more detail with reference to the accompanying drawings.

[0037] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment.

[0038] refer to Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the external electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). The electronic device 101 may communicate with the external electronic device 104 via the server 108. The electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, and / or an antenna module 197. In various embodiments of the present disclosure, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In various embodiments of the present disclosure, some components may be implemented as a single integrated circuit. For example, the sensor module 176, the camera module 180, or the antenna module 197 may be implemented as embedded in a single component (eg, the display module 160).

[0039] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. As at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the obtained data in the non-volatile memory 134. The processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. In addition or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0040] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. The auxiliary processor 123 (e.g., an image signal processor (ISP) or a communication processor (CP)) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment of the present disclosure, the auxiliary processor 123 (e.g., a neural network processing device) may include a hardware structure designated to process an artificial intelligence model. The artificial intelligence model may be created through machine learning. For example, learning can be performed in the electronic device 101 itself that executes the artificial intelligence model, or can be performed by a separate server (e.g., server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited thereto. The artificial intelligence model may include multiple artificial neural network layers, and the artificial neural network may be any of a deep neural network (DNN), a convolutional neural network (CNN), a recursive neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recursive DNN (BRDNN), a deep Q network, or a combination of two or more of the above networks, but is not limited to the above examples. In addition to the hardware structure, the artificial intelligence model may additionally or optionally include a software structure.

[0041] Various data used by the memory 130 or non-volatile memory 101H (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 and / or a non-volatile memory 134.

[0042] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , and / or applications 146 .

[0043] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0044] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing a recording, and the receiver can be used for incoming calls. The receiver can be implemented as a separate speaker or as a part of the speaker.

[0045] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. The display module 160 may include a touch circuit (e.g., a touch sensor) suitable for detecting a touch, or a sensor circuit (e.g., a pressure sensor) suitable for measuring the force generated by a touch.

[0046] The audio module 170 can convert sound into an electrical signal, or vice versa. The audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., external electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0047] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. The sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0048] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., external electronic device 102). The interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface.

[0049] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the external electronic device 102) via the connector. The connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector).

[0050] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. The haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0051] The camera module 180 may capture still images or moving images. The camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0052] The power management module 188 may manage power provided to or consumed by the electronic device 101. The power management module 188 may be implemented as, for example, at least part of a power management integrated circuit (PMIC).

[0053] The battery 189 may power at least one component of the electronic device 101. The battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell.

[0054] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., external electronic device 102, external electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. The communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0055] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 of the present disclosure can support various requirements specified in the electronic device 101, an external electronic device (e.g., an external electronic device 104), or a network system (e.g., a second network 199). Depending on the embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0056] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). The antenna module 197 may include an antenna including a radiating element, which is formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. Additional components other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

[0057] According to various embodiments of the present disclosure, the antenna module 197 may form a millimeter wave antenna module. According to embodiments of the present disclosure, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or is adjacent to the first surface and is capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or is adjacent to the second surface and is capable of transmitting or receiving signals of the specified high frequency band.

[0058] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0059] A command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. All or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment of the present disclosure, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment of the present disclosure, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0060] The electronic device according to the embodiment of the present disclosure may be one of various types of electronic devices. The electronic device may include a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. However, the electronic device is not limited to any of the above.

[0061] The various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). If an element (e.g., a first element) is referred to as being “coupled with another element (e.g., a second element)”, “coupled to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” with or without the terms “operably” or “communicatively”, the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0062] The term "module" may include a unit implemented in hardware, software, or firmware, or any combination thereof, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or part of the single integrated component. For example, according to an embodiment of the present disclosure, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0063] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0064] The method according to the embodiment of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published online (e.g., downloaded or uploaded) via an application store (e.g., PLAYSTORETM), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0065] Each component (e.g., module or program) in the above-mentioned components can include a single entity or multiple entities. One or more components in the above-mentioned components can be omitted, or one or more other components can be added. Alternatively or additionally, multiple components (e.g., module or program) can be integrated into a single component. In this case, the integrated component can perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. The operations performed by a module, program or another component can be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations can be run or omitted in different orders, or one or more other operations can be added.

[0066] Figure 2 A view showing a foldable electronic device 2 in an unfolded state (or unfolded state or flat state) according to an embodiment of the present disclosure. Figure 3 A view showing a foldable electronic device 2 in a folded state (or folded state) according to an embodiment of the present disclosure.

[0067] refer to Figure 2 and Figure 3 The foldable electronic device 2 includes a foldable housing 20 and a first display module (eg, a flexible display module or a foldable display module) 24. The foldable electronic device 2 may also include a second display module 25. In various embodiments, the foldable electronic device 2 may be Figure 1 The electronic device 101 in.

[0068] The foldable housing 20 includes a first housing (or a first housing portion or a first housing structure) 21, a second housing (or a second housing portion or a second housing structure) 22, and a hinge portion. The foldable housing 20 may also include a hinge housing 23. The first housing 21 and the second housing 22 are connected by a hinge portion and can rotate relative to each other around the hinge portion. The hinge portion may include one or more hinge modules (or hinge components) (e.g., Figure 5 The first hinge module 5A or the second hinge module 5B in the embodiment.

[0069] Among the first display module 24, the display area 24A of the first display module 24 can be an active area capable of displaying an image, and includes a first display area (or a first active area or a first screen area) ①, a second display area (or a second active area or a second screen area) ②, and a third display area (or a third active area or a third screen area) ③ for connecting the first display area ① and the second display area ②. The first display area ① is positioned to correspond to the first shell 21. The second display area ② is positioned to correspond to the second shell 22. The third display area ③ is positioned to correspond to the hinge portion. The first display area ① is arranged in the first shell 21. The shape of the first display area ① can be maintained by the support of the first shell 21. The second display area ② is arranged in the second shell 22. The shape of the second display area ② can be maintained by the support of the second shell 22. For example, the first display area ① and the second display area ② can be provided to be substantially flat. The unfolded state of the foldable electronic device 2 (see Figure 2) may be a state in which the third display area ③ is set to be substantially flat. In the unfolded state of the foldable electronic device 2, the first display area ① and the second display area ② may form an angle of about 180 degrees, and the display area 24A including the first display area ①, the second display area ② and the third display area ③ may be provided (or arranged) in the shape of a substantially flat surface. In the unfolded state of the foldable electronic device 2, due to the relative position between the first display area ① provided in the first housing 21 and the second display area ② provided in the second housing 22, the third display area ③ for connecting the first display area ① and the second display area ② may be set to be flat. In the unfolded state of the foldable electronic device 2, the third display area ③ may be pulled by the first display area ① and the second display area ② from the opposite sides thereof, and a pulling force may be provided to reduce damage to the third display area ③ while allowing the third display area ③ to be set flatly. In the unfolded state of the foldable electronic device 2, the third display area ③ may be pulled by the first display area ① and the second display area ②, and thus an extended width may be provided, which allows the third display area to be set flatly while reducing its stress. In the unfolded state of the foldable electronic device 2, the hinge portion can support the third display area ③. In the unfolded state of the foldable electronic device 2, when an external force (e.g., external pressure such as touch input using a user's finger or touch input using an electronic pen) is applied to the third display area ③, the hinge portion can reduce the sagging phenomenon of the third display area ③, thereby helping the third display area ③ to remain flat. In the unfolded state of the foldable electronic device 2, when an external impact is applied to it due to reasons such as falling, the hinge portion can be configured to reduce the impact of the external impact on the third display area ③. In the unfolded state of the foldable electronic device 2, the hinge portion can support the third display area ③ so that the third display area ③ is arranged flatly without sagging, thereby reducing its crease phenomenon. The coordinate axes shown in this article are shown with reference to the first shell 21, for example, the +z axis direction can be interpreted as the direction of the flat surface orientation provided by the flat first display area ①.

[0070] According to an embodiment, the foldable electronic device 2 may be provided as an inward-folding type in which the display area 24A of the first display module 24 is folded inwardly. Figure 3The fully folded state of the foldable electronic device 2 is shown, in which the first housing 21 and the second housing 22 are arranged so as not to be close to each other. In the fully folded state of the foldable electronic device 2, the first display area ① and the second display area ② can be positioned to face each other, and the third display area ③ can be set to a bent (curved) shape. In the fully folded state of the foldable electronic device 2, the angle between the first housing 21 and the second housing 22 (or the angle between the first display area ① and the second display area ②) can be about 0 degrees-about 10 degrees or about 0 degrees-about 5 degrees, and the display area 24A can be substantially invisible. Although not shown here, the intermediate state of the foldable electronic device 2 can be a state between the unfolded state and the fully folded state. In the case of the intermediate state where the angle between the first housing 21 and the second housing 22 is equal to or greater than a predetermined angle, a use environment in which there is no practical difficulty in using the display area 24A can be provided. Hereinafter, the "folded state of the foldable electronic device 2" disclosed in the present disclosure may mean a fully folded state compared to an intermediate state as a less folded state.

[0071] According to an embodiment, when referring to the unfolded state of the foldable electronic device 2 (see Figure 2 ), the display area 24A of the first display module 24 may be provided in a symmetrical shape about the center line A of the foldable electronic device 2. When referring to the unfolded state of the foldable electronic device 2, the center line A may correspond to the middle of the width of the third display area ③ extending from the first boundary between the first display area ① and the third display area ③ to the second boundary between the second display area ② and the third display area ③. In the folded state of the foldable electronic device 2 (see Figure 3) The third display area ③ set to a bent shape under the foldable electronic device 2 may have a shape that is substantially symmetrical with reference to the center line A of the foldable electronic device 2. When referring to the unfolded state of the foldable electronic device 2, the display area 24A may have a substantially rectangular shape. The display area 24A may include a first edge E1, a second edge E2, a third edge E3, and a fourth edge E4. The first edge E1 and the second edge E2 may be substantially parallel to the center line A. The third edge E3 may connect one end of the first edge E1 and one end of the second edge E2, and the fourth edge E4 may connect the other end of the first edge E1 and the other end of the second edge E2. The first display area ① may include the first edge E1, a portion of the third edge E3, and a portion of the fourth edge E4. The second display area ② may include the second edge E2, a portion of the third edge E3, and a portion of the fourth edge E4. The third display area ③ may include a portion of the third edge E3 and a portion of the fourth edge E4. In the folded state of the foldable electronic device 2, the first edge E1 and the second edge E2 may be aligned to overlap each other. In the folded state of the foldable electronic device 2, a portion of the third edge E3 included in the first display area ① and a portion of the third edge E3 included in the second display area ② may be aligned to overlap each other. In the folded state of the foldable electronic device 2, a portion of the fourth edge E4 included in the first display area ① and a portion of the fourth edge E4 included in the second display area ② may be aligned to overlap each other.

[0072] According to an embodiment, the first housing 21 may include a first frame (or a first frame structure or a first frame) 211. In a further embodiment, the first housing 21 may include a first cover 212 disposed on the first frame 211. The first frame 211 may include a first side (or a first side portion, a first side member, a first side structure or a first side frame structure) (e.g., Figure 4 The first side may be arranged along an edge of the first display region ① of the first display module 24. The first side may provide a first side surface of the foldable electronic device 2, which corresponds to the first display region ① of the foldable electronic device 2. The first frame 211 may include a first support portion (e.g., Figure 4The first display area ① may be provided in the first support portion, and the first support portion may support the first display area ①. The first display area ① and the first cover 212 may be positioned on opposite sides of each other, with the first support portion of the first frame 211 interposed therebetween. The first side of the first frame 211 may be provided to surround at least a portion of the space between the first display area ① and the first cover 212. The first display area ① may provide one surface among the outer surfaces of the foldable electronic device 2, and the first cover 212 may provide another surface among the outer surfaces of the foldable electronic device 2, the other surface being oriented in a direction substantially opposite to the first display area ①. Various electrical elements (or electronic components) such as a printed circuit board or a battery may be arranged in the first support portion, between the first support portion of the first frame 211 and the first cover 212.

[0073] According to an embodiment, the second housing 22 may include a second frame (or a second frame structure or a second frame) 221. In a further embodiment, the second housing 22 may include a second cover 222 disposed on the second frame 221. The second frame 221 may include a second side (or a second side portion, a second side member, a second side structure or a second side frame structure) (e.g., Figure 4 The second side may be arranged along the edge of the second display area ② of the first display module 24. The second side may provide a second side surface of the foldable electronic device 2, which corresponds to the second display area ② of the foldable electronic device 2. In the folded state of the foldable electronic device 2 (see Figure 3 ), the first side of the first frame 211 and the second side of the second frame 221 may be aligned to overlap each other. The second frame 221 may include a second support portion (eg, Figure 4 The second display area ② may be provided in the second support portion, and the second support portion may support the second display area ②. The second display area ② and the second cover 222 may be positioned on opposite sides of each other, with the second support portion of the second frame 221 interposed therebetween. The second side of the second frame 221 may be provided to surround at least a portion of the space between the second display area ② and the second cover 222. The second display area ② may provide one of the outer surfaces of the foldable electronic device 2, and the second cover 222 may provide another of the outer surfaces of the foldable electronic device 2, the other surface being oriented in a direction substantially opposite to the second display area ②. Various electrical elements (or electronic components) such as a printed circuit board or a battery may be arranged in the second support portion, between the second support portion of the second frame 221 and the second cover 222.

[0074] According to an embodiment, the hinge housing (or hinge cover) 23 may be coupled to the first hinge module 5A, the second hinge module 5B and / or the third hinge module 6. Figure 2 ) to switch to the folded state (see Figure 3 ), due to the change in the relative position between the first shell 21 and the second shell 22 connected to each other by the hinge portion H and the change in the state of the hinge portion H connected to the hinge shell 23, the gap between the first shell 21 and the second shell 22 is opened on the side opposite to the third display area ③, so the hinge shell 23 can be exposed to the outside through the open gap. In the folded state of the foldable electronic device 2, the hinge shell 23 can be a part of the exterior, which covers the interior of the foldable electronic device 2 exposed through the open gap between the first shell 21 and the second shell 22. The hinge shell 23 can be in Figure 3 In the case where the foldable electronic device 2 is switched from the folded state to the unfolded state, due to the change in the relative position between the first shell 21 and the second shell 22 connected to each other by the hinge portion H, and the change in the state of the hinge portion H connected to the hinge shell 23, the gap between the first shell 21 and the second shell 22 is closed on the side opposite to the third display area ③, and the hinge shell 23 can be positioned in the internal space generated by the combination of the first shell 21 and the second shell 22, and thus may not be exposed to the outside.

[0075] According to an embodiment, the second display module 25 may be positioned between the second frame 221 and the second cover 222. The second cover 222 may be substantially transparent, and the second display module 25 may be visible through the second cover 222. The foldable electronic device 2 may be configured to display an image through the second display module 25 instead of the first display module 24 in the folded state.

[0076] According to various embodiments, the second display module 25 may be provided in the form of including the second cover 222. In this case, the second cover 222 may be excluded from the foldable housing 20.

[0077] According to an embodiment, the first cover 212 may include a first curved surface area 212a, which is bent toward the first display area ① to correspond to the first edge E1 of the display area 24A, and then extends seamlessly. The second cover 222 may include a second curved surface area 222a, which is bent toward the second display area ② to correspond to the second edge E2 of the display area 24A, and then extends seamlessly. In the unfolded state of the foldable electronic device 2 (see Figure 2 ) or folded state (see Figure 3), the first curved surface area 212a and the second curved surface area 222a can be provided symmetrically to each other on opposite sides, thereby contributing to its aesthetic appearance. In an embodiment, the second display module 25 may include a flexible display that can be configured to be bent along the second curved surface area 222a. In various embodiments, the first cover 212 can be provided substantially flat without the first curved surface area 212a. In various embodiments, the second cover 222 can be provided substantially flat without the second curved surface area 222a. In this case, the second display module 25 may include a rigid display.

[0078] According to an embodiment, the foldable electronic device 2 may include at least one of the following: one or more audio modules (eg, Figure 1 ), one or more sensor modules (e.g., Figure 1 sensor module 176 in), one or more camera modules (e.g., Figure 1 ), one or more lighting modules, one or more input modules (e.g., Figure 1 ) and / or one or more connection terminal modules (e.g., Figure 1 In various embodiments, at least one of the elements may be omitted from the foldable electronic device 2, and other elements may be additionally included therein. The position or number of elements included in the foldable electronic device 2 is not limited to the illustrated example, and may be various.

[0079] For example, any one of the one or more audio modules may include a microphone positioned inside the foldable electronic device 2 to correspond to the microphone hole 301 provided through the outside of the foldable electronic device 2. In the example shown, the microphone hole 301 may be provided to pass through the first side of the first frame 211, and the microphone may be positioned in the internal space of the first housing 21. The position or number of the microphone and the microphone hole is not limited to the example shown, and may be various. In various embodiments, the foldable electronic device 2 may include a plurality of microphones for detecting the direction of sound.

[0080] For example, any of the one or more audio modules may include a first speaker for multimedia playback (or recording playback), which is positioned inside the foldable electronic device 2 to correspond to the first speaker hole 302 provided through the outside of the foldable electronic device 2. In the example shown, the first speaker hole 302 may be provided to pass through the second side of the second frame 221, and the first speaker may be positioned in the inner space of the second housing 22. For example, any of the one or more audio modules may include a second speaker (e.g., a receiver for a phone call) positioned inside the foldable electronic device 2 to correspond to the second speaker hole (e.g., receiver hole) 303 provided through the outside of the foldable electronic device 2. In the example shown, the second speaker hole 303 may be provided to pass through the second frame 221 to be adjacent to the second cover 222, and the second speaker may be positioned in the inner space of the second housing 22. The position or number of the speaker and the speaker hole is not limited to the example shown, and may be various. In various embodiments, the microphone hole and the speaker hole may be implemented as a single hole. In various embodiments, a piezoelectric speaker may be provided in which the speaker hole is omitted.

[0081] For example, one or more sensor modules may generate an electrical signal or data value corresponding to the internal operating state or external environmental state of the foldable electronic device 2. In an embodiment, any one of the one or more sensor modules may include an optical sensor 304 positioned in the interior space of the second housing 22 to correspond to the second cover 212. The optical sensor 304 may be positioned to align with the opening provided through the second display module 25, or may be at least partially inserted into the opening. External light may reach the optical sensor through the second cover 222 and the opening provided through the second display module 25. For example, the optical sensor 304 may include a proximity sensor or an illumination sensor. The number or position of the optical sensors is not limited to the examples shown, and may be various.

[0082] According to various embodiments, in a view observed from above the second cover 222, the optical sensor 304 may be positioned in the internal space of the second housing 22 to at least partially overlap with the display area of ​​the second display module 25. In this case, the sensing function of the optical sensor 304 may be performed when the optical sensor 304 or the position of the optical sensor 304 is not visually distinguished (or exposed) or is not visible. In an embodiment, the optical sensor 304 may be positioned on the rear surface of the second display module 25 or below or below the second display module 25, and the optical sensor 304 or the position of the optical sensor 304 may not be visually distinguished (or exposed). In various embodiments, the optical sensor 304 may be positioned to align with a recess provided on the rear surface of the second display module 25, or may be at least partially inserted into the recess. The partial area of ​​the second display module 25 that at least partially overlaps with the optical sensor 304 may include a different pixel structure and / or line structure than other areas. For example, the partial area of ​​the second display module 25 that at least partially overlaps with the optical sensor 304 may have a different pixel density than other areas. The pixel structure and / or wiring structure formed in the partial region of the second display module 25 at least partially overlapping with the optical sensor 304 can reduce light loss between the outside and the optical sensor 304. For another example, the plurality of pixels may not be arranged in the partial region of the second display module 25 at least partially overlapping with the optical sensor 304.

[0083] According to various embodiments, the present disclosure is not limited to the optical sensor 304 such as a proximity sensor or an illumination sensor, and various other sensors may be positioned to correspond to the opening provided through the second display module 25, or may be positioned on the rear surface of the second display module 25 or below the second display module 25. For example, an optical, capacitive, or ultrasonic type biometric sensor (e.g., a fingerprint sensor) may be positioned to correspond to the opening provided through the second display module 25, or may be positioned on the rear surface of the second display module 25 or below the second display module 25.

[0084] According to various embodiments, various sensors may be positioned to correspond to an opening provided through the first display module 24 , or positioned on a rear surface of the first display module 24 or below the first display module 24 .

[0085] According to various embodiments, in addition to this, the foldable electronic device 2 may further include various other sensors (e.g., a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a temperature sensor, or a humidity sensor), and their locations may be various.

[0086] According to the embodiment, one or more camera modules may each include one or more lenses, an image sensor and / or an image signal processor. For example, one or more camera modules may include a first camera module 305, a second camera module 306, a third camera module 307 and / or a fourth camera module 308.

[0087] According to an embodiment, the first camera module 305 may be positioned in the internal space of the second housing 22 to correspond to the second cover 222. The first camera module 305 may be positioned to align with an opening provided through the second display module 25, or may be at least partially inserted into the opening. External light may reach the first camera module 305 through the second cover 222 and the opening of the second display module 25. The opening of the second display module 25 aligned with or overlapping the first camera module 305 may be provided in a through-hole shape, as shown in the example. In various embodiments, the opening of the second display module 25 aligned with or overlapping the first camera module 305 may be provided in a notch shape.

[0088] According to various embodiments, in a view observed from above the second cover 222, the first camera module 305 may be positioned in the internal space of the second housing 22 to at least partially overlap with the display area of ​​the second display module 25. In this case, the shooting function of the first camera module 305 may be performed when the first camera module 305 or the position of the first camera module 305 is not visually distinguished (or exposed) or is not visible. In an embodiment, the first camera module 305 may be positioned on the rear surface of the second display module 25 or below or under the second display module 25, and the first camera module 305 or the position of the first camera module 305 may not be visually distinguished (or exposed) or may be invisible. In various embodiments, the first camera module 305 may be positioned to align with a recess provided on the rear surface of the second display module 25, or may be at least partially inserted into the recess. For example, the first camera module 305 may include a hidden display rear camera (e.g., an under-display camera (UDC)). A partial area of ​​the second display module 25 at least partially overlapping with the first camera module 305 may include a different pixel structure and / or line structure compared to other areas. For example, a partial area of ​​the second display module 25 that at least partially overlaps with the first camera module 305 may have a different pixel density than other areas. The pixel structure and / or wiring structure formed in the partial area of ​​the second display module 25 that at least partially overlaps with the first camera module 305 may reduce light loss between the outside and the optical sensor. For another example, a plurality of pixels may not be arranged in the partial area of ​​the second display module 25 that at least partially overlaps with the first camera module 305.

[0089] According to an embodiment, the second camera module 306, the third camera module 307, or the fourth camera module 308 may be positioned in the internal space of the first housing 21 to correspond to the first cover 212. The first cover 212 may include a camera cover portion (e.g., a camera decoration portion) that is provided to correspond to the second camera module 306, the third camera module 307, and the fourth camera module 308. The camera cover portion may include a camera hole (or a light-transmitting area) provided to correspond to the second camera module 306, a camera hole (or a light-transmitting area) provided to correspond to the third camera module 307, and a camera hole (or a light-transmitting area) provided to correspond to the fourth camera module 308. The number or position of the camera modules provided to correspond to the first cover 212 is not limited to the illustrated example, and may be various. The second camera module 306, the third camera module 307, and the fourth camera module 308 may have different properties (e.g., viewing angles) or functions. The second camera module 306, the third camera module 307, and the fourth camera module 308 can provide different viewing angles (or lenses with different viewing angles), and the foldable electronic device 2 can selectively use the corresponding camera module based on a user selection related to the viewing angle. Any of the second camera module 306, the third camera module 307, and the fourth camera module 308 may include a wide-angle camera module, a telephoto camera module, a color camera module, a monochrome camera module, or an infrared (IR) camera (e.g., a time-of-flight (TOF) camera or a structured light camera) module. In various embodiments, the IR camera module may also operate as at least a portion of the sensor module.

[0090] According to an embodiment, any one of the one or more light emitting modules may include a flash 309 positioned in the inner space of the first housing 21 to correspond to a flash hole (or light-transmitting area) provided in the camera cover portion of the first cover 212. The flash 309 may include a light source for the second camera module 306, the third camera module 307, and / or the fourth camera module 308. For example, the flash 309 may include a light emitting diode (LED) or a xenon lamp.

[0091] According to various embodiments, any of one or more light emitting modules (e.g., LED, IR LED, or Xenon lamp) may be configured to provide status information of the foldable electronic device 2 in the form of light. In various embodiments, the light emitting module may provide a light source that operates in association with the operation of the first camera module 305.

[0092] According to an embodiment, one or more input modules may include a first key input device 310 or a second key input device 311. In the example shown, the first key input device 310 or the second key input device 311 may be positioned in an opening provided through the first side of the first frame 211. The position or number of the input modules is not limited to the example shown and may be various. In various embodiments, the foldable electronic device 2 may not include some or all of the key input devices, and the key input devices not included therein may be implemented as soft keys by the first display module 24 or the second display module 25. In some embodiments, each of the input modules or each of the key input devices may include at least one sensor module.

[0093] For example, any one of the one or more connection terminal modules (or connector modules or interface terminal modules) may include a connector (or interface terminal) positioned inside the foldable electronic device 2 to correspond to the connector hole 312 formed through the outside of the foldable electronic device 2. In the example shown, the connector hole 312 may be provided to pass through the first side of the first frame 211. The position or number of the connection terminal modules is not limited to the example shown and may be various. The foldable electronic device 2 may send power and / or data to an external electronic device electrically connected to the connector and / or receive power and / or data from an external electronic device electrically connected to the connector. In an embodiment, the connector may include a USB connector or an HDMI connector. In various embodiments, any one of the one or more connection terminal modules may include an audio connector (e.g., a headphone connector or an earmuff connector) and a connector hole provided through the outside of the foldable electronic device 2 to correspond to the audio connector. In various embodiments, any one of the one or more connection terminal modules may include a memory card connector positioned inside the foldable electronic device 2 and a connector hole formed through the outside of the foldable electronic device 2 to correspond to the memory card connector.

[0094] According to various embodiments, the foldable electronic device 2 may include an attachable / detachable pen input device (e.g., an electronic pen, a digital pen, or a stylus pen) (not shown). For example, the pen input device may be implemented to be insertable into the internal space of the first housing 21 or the second housing 22. For another example, the pen input device may be attached to or detached from the hinge housing 23. The hinge housing 23 may include a recess, and the pen input device may be assembled into the recess.

[0095] The foldable electronic device 2 may also include various elements according to the form in which it is provided. Such elements may be variously changed according to the trend of the foldable electronic device 2, and therefore may not be listed. However, elements equivalent to the mentioned elements may be additionally included in the foldable electronic device 2. In various embodiments, according to the form in which it is provided, specific elements may also be excluded from the above-mentioned elements, or may also be replaced with other elements.

[0096] Figure 4 is an exploded perspective view of a foldable electronic device 2 in an unfolded state according to an embodiment of the present disclosure. Figure 5 and Figure 6 2 is a view showing the foldable housing 20 in an unfolded state according to an embodiment of the present disclosure. Figure 7 2 is a view showing a hinge part H according to an embodiment of the present disclosure. Figure 8 4 is a view showing a hinge portion H, a third flexible printed circuit board 463, and a fourth flexible printed circuit board 464 according to an embodiment of the present disclosure. Fig. 9 2 is a view showing a first hinge module 5A, a second hinge module 5B, a third hinge module 6, a hinge housing 23, and a third printed circuit board 423 according to an embodiment of the present disclosure. Fig.10 is a view showing a hinge part H, a first printed circuit board 421, a second printed circuit board 422, a third printed circuit board 423, a first battery 431, a first flexible printed circuit board 461, a third flexible printed circuit board 463, and a fourth flexible printed circuit board 464 according to an embodiment of the present disclosure.

[0097] refer to Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 , the foldable electronic device 2 includes a foldable housing 20 and a first flexible printed circuit board 461. The foldable electronic device 2 may further include a first inner support body 411, a second inner support body 412, a first display module 24, a second display module 25, a first printed circuit board 421, a second printed circuit board 422, a third printed circuit board 423, a first battery 431, a second battery 432, a first speaker module 441, a second speaker module 442, a first antenna structure 451, a second antenna structure 452, a second flexible printed circuit board 462, a third flexible printed circuit board 463 and / or a fourth flexible printed circuit board 464.

[0098] According to an embodiment, the foldable housing 20 includes a hinge portion H. The foldable housing 20 may further include a first frame 211 , a first cover 212 , and / or a second frame 221 . Figure 2The first housing 21 in the embodiment may include a first frame 211 and a second cover 212 . Figure 2 The second housing 22 may include a second frame 221 .

[0099] According to an embodiment, the first frame 211 may include a first support portion 2111 and a first side 2112. The first frame 211 may be provided in an integrated form including the first support portion 2111 and the first side 2112. The first support portion 2111 may be positioned inside the foldable electronic device 2 to correspond to the first housing 21 (see Figure 2 ) and may be referred to as various other terms such as "first bracket", "first support body", "first support member" or "first support structure". The second frame 221 may include a second support portion 2211 and a second side 2212. The second frame 221 may be provided in an integrated form including the second support portion 2211 and the second side 2212. The second support portion 2211 may be positioned inside the foldable electronic device 2 to correspond to the second housing 22 (see Figure 2 ) and may be referred to as various other terms such as “second bracket”, “second support body”, “second support member” or “second support structure”. At least a portion of the first frame 211 and / or at least a portion of the second frame 221 may be formed of a metallic material and / or a non-metallic material (e.g., a polymer). Electrical elements (or electronic components) or various members related to electrical elements may be arranged on the first frame 211 or in the first support portion 2111, and may be supported by the first frame 211 or the first support portion 2111. The first support portion 2111 may include a first support region 2111A facing the first display region ① and a third support region 2111B oriented in a direction substantially opposite to the first support region 2111A (see Figure 6 ). The first display area ① of the first display module 24 may be disposed in the first support area 2111A of the first support portion 2111. Various elements such as the first printed circuit board 421, the second printed circuit board 422, or the first battery 431 may be disposed or coupled to the third support area 2111B. The second support portion 2211 may include a second support area 2211A facing the second display area ② and a fourth support area 2211B oriented in a direction substantially opposite to the second support area 2211A (see Figure 6 ). The second display area ② of the first display module 24 may be disposed in the second support area 2211A of the second frame 221. Various elements such as the third printed circuit board 423 or the second battery 432 may be arranged or coupled to the fourth support area 2211B.

[0100] According to an embodiment, the first display area ① of the first display module 24 can be set in the first support portion 2111 of the first frame 211, and the second display area ② of the first display module 24 can be set in the second support portion 2211 of the second frame 221 by various adhesive materials (or bonding materials) such as thermal reactive adhesive materials (or thermal reactive bonding materials), photo reactive adhesive materials (or photo reactive bonding materials), general adhesives (or general bonding materials) and / or double-sided tapes.

[0101] According to the embodiment, the hinge portion H (see Figure 5 and Figure 6 ) may include a first hinge module 5A, a second hinge module 5B and a third hinge module 6. In a further embodiment, the hinge part H may include a hinge housing 23, a first plate 71, a second plate 72, a third plate 73 and / or a fourth plate 74.

[0102] According to an embodiment, the first hinge module 5A, the second hinge module 5B, and the third hinge module 6 may connect the first frame 211 and the second frame 221. The first frame 211 and the second frame 221 may be rotatably connected to each other through the first hinge module 5A, the second hinge module 5B, and the third hinge module 6. The first hinge module 5A, the second hinge module 5B, and the third hinge module 6 may be arranged along the center line A of the foldable electronic device 2, and the third hinge module 6 may be positioned between the first hinge module 5A and the second hinge module 5B. In an embodiment, the third hinge module 6 may be positioned to correspond to the center between the first hinge module 5A and the second hinge module 5B (e.g., a point on the center line A, which is substantially the same distance from the first hinge module 5A and the second hinge module 5B).

[0103] According to an embodiment, the first housing 21 (e.g., in particular, the first frame 211 of the first housing 21) includes a first lateral portion 401 (side portion) corresponding to the hinge portion H. The first lateral portion 401 may include a portion of a first support portion 2111 included in the first frame 211. The second housing 22 (e.g., in particular, the second frame 221 of the second housing 22) includes a second lateral portion 402 corresponding to the hinge portion H. The second lateral portion 402 may include a portion of a second support portion 2211 included in the second frame 221. The first hinge module 5A, the second hinge module 5B, and the third hinge module 6 may be coupled to the first lateral portion 401 and the second lateral portion 402.

[0104] According to an embodiment, the first hinge module 5A may include a first bracket 51A, a second bracket 52A and / or a bracket connection portion 53A. The first bracket 51A may be connected to the first transverse portion 401 (of the first frame 211). The first bracket 51A may be provided or coupled to the first support area 2111A of the first frame 211 by screw fastening. The second bracket 52A may be connected to the second transverse portion 402 (of the second frame 221). The second bracket 52A may be provided or coupled to the second support area 2211A of the second frame 221 by screw fastening. The bracket connection portion 53A may connect the first bracket 51A and the second bracket 52A. The first bracket 51A and the second bracket 52A may rotate relative to the bracket connection portion 53A.

[0105] According to an embodiment, the bracket connection portion 53A of the first hinge module 5A may be configured so that the first frame 211 to which the first bracket 51A is fixed and the second frame 221 to which the second bracket 52A is fixed can rotate at the same angle in opposite directions to each other. The bracket connection portion 53A may be configured so that the first frame 211 to which the first bracket 51A is fixed and the second frame 221 to which the second bracket 52A is fixed are rotated at at least one specified angle and then maintained. For example, the bracket connection portion 53A may have a free stop function. The bracket connection portion 53A may be configured so that the first frame 211 to which the first bracket 51A is fixed and the second frame 221 to which the second bracket 52A is fixed provide a force that enables mutual rotation between them. For example, the bracket connection portion 53A may be configured in combination with at least one shaft, at least one cam gear and / or at least one compression spring for providing elasticity.

[0106] The second hinge module 5B may be provided substantially the same as the first hinge module 5A, and, for example, may include a first bracket 51B, a second bracket 52B, and / or a bracket connecting portion 53B. In an embodiment, the second hinge module 5B may be provided in the foldable electronic device 2 in a direction opposite to the first hinge module 5A. The first bracket 51B of the second hinge module 5B may be connected to the second transverse portion 402 of the second frame 221. The first bracket 51B of the second hinge module 5B may be provided or coupled to the second support area 2211A of the second frame 221 by screw fastening. The second bracket 52B of the second hinge module 5B may be connected to the first transverse portion 401 of the first frame 211. The second bracket 52B of the second hinge module 5B may be provided or coupled to the first support area 2111A of the first frame 211 by screw fastening.

[0107] According to an embodiment, the third hinge module 6 may include a rotational motion guide or a guide rail assembly. For example, the third hinge module may include a first sliding member 61, a second sliding member 62, and a guide rail 63. The guide rail 63 may be provided or coupled to the hinge housing 23. The hinge housing 23 may include a hinge assembly provided in the folded state of the foldable electronic device 2 (see Figure 3 ) is provided on one surface exposed to the outside and on another surface opposite thereto, and the guide rail 63 may be fastened in the recess of the hinge housing 23 by screws. The first slider 61 may be provided on the guide rail 63 to be slidable relative to the guide rail 63, and may be coupled to the first support portion 2111 of the first frame 211 by screws. The second slider 62 may be provided on the guide rail 63 to be slidable relative to the guide rail 63, and may be coupled to the second support portion 2211 of the second frame 221 by screws. The guide rail 63 may include a first guide rail (e.g., a first rotational motion guide rail) having a sliding pair relationship with the first slider 61, and a second guide rail (e.g., a second rotational motion guide rail) having a sliding pair relationship with the second slider 62. The third hinge module 6 may reduce a phenomenon in which a gap between the first frame 211 and the second frame 221 is opened. The third hinge module 6 is not limited thereto, and may be provided in various other types.

[0108] According to an embodiment, the first hinge module 5A, the second hinge module 5B, and the third hinge module 6 may be coupled to the hinge housing 23 by screws. The hinge housing 23 may be connected to the first frame 211 and the second frame 221 by the first hinge module 5A, the second hinge module 5B, and the third hinge module 6. The hinge housing 23 may include a hinge member provided in the folded state of the foldable electronic device 2 (see Figure 3 ) is provided on one surface exposed to the outside and on the other surface opposite thereto, and the bracket connecting portion 53A of the first hinge module 5A, the bracket connecting portion 53B of the second hinge module 5B and the third hinge module 6 can be arranged in the recess of the hinge housing 23 by fastening with screws.

[0109] According to an embodiment, the first plate 71 and the second plate 72 may be positioned to correspond to the first frame 211. The first plate 71 and the second plate 72 may be fastened to the first support portion 2111 of the first frame 211 by screws. Figure 2), the first hinge module 5A, the second hinge module 5B, the third hinge module 6, the first plate 71, and the second plate 72 can support a side area of ​​the third display area ③ of the first display module 24 with reference to the center line A of the foldable electronic device 2. The first plate 71 can support a portion of the third display area ③ of the first display module 24 corresponding to between the first hinge module 5A and the third hinge module 6. The second plate 72 can support a portion of the third display area ③ of the first display module 24 corresponding to between the second hinge module 5B and the third hinge module 6.

[0110] According to an embodiment, the third plate 73 and the fourth plate 74 may be positioned to correspond to the second frame 221. The third plate 73 and the fourth plate 74 may be fastened to the second support portion 2211 of the second frame 221 by screws. Figure 2 ), the first hinge module 5A, the second hinge module 5B, the third hinge module 6, the third plate 73 and the fourth plate 74 may support the other side area of ​​the third display area ③ of the first display module 24 with reference to the center line A of the foldable electronic device 2. The third plate 73 may support the portion of the third display area ③ of the first display module 24 corresponding between the first hinge module 5A and the third hinge module 6. The fourth plate 74 may support the portion of the third display area ③ of the first display module 24 corresponding between the second hinge module 5B and the third hinge module 6. In the unfolded state of the foldable electronic device 2, even if an external force (e.g., external pressure such as a touch input using a user's finger or a touch input using an electronic pen) is applied to the third display area ③, the third display area ③ may remain flat due to the support of the first hinge module 5A, the second hinge module 5B, the third hinge module 6, the first plate 71 and the second plate 72. When the foldable electronic device 2 is in the unfolded state, the first hinge module 5A, the second hinge module 5B, the third hinge module 6, the first plate 71 and the second plate 72 can reduce or prevent the sagging or crease phenomenon of the third display area ③.

[0111] According to an embodiment, the first surface (not shown) of the first plate 71 may include a flat surface capable of supporting the third display area ③ of the first display module 24 in the unfolded state of the foldable electronic device 2. The second surface (not shown) of the second plate 72 may include a flat surface capable of supporting the third display area ③ in the unfolded state of the foldable electronic device 2. The third surface (not shown) of the third plate 73 may include a flat surface capable of supporting the third display area ③ in the unfolded state of the foldable electronic device 2. The fourth surface (not shown) of the fourth plate 74 may include a flat surface capable of supporting the third display area ③ in the unfolded state of the foldable electronic device 2. The first surface of the first plate 71 and the third surface of the third plate 73 may face each other in the folded state of the foldable electronic device 2, and may substantially form an angle of about 180 degrees in the unfolded state of the foldable electronic device 2. The second surface of the second plate 72 and the fourth surface of the fourth plate 74 may face each other in the folded state of the foldable electronic device 2, and may substantially form an angle of about 180 degrees in the unfolded state of the foldable electronic device 2. In the unfolded state of the foldable electronic device 2, the first surface of the first plate 71, the second surface of the second plate 72, the third surface of the third plate 73 and the fourth surface of the fourth plate 74 can be arranged to have no significant height difference with the surface of the first hinge module 5A supporting the third display area ③ of the first display module 24, the surface of the second hinge module 5B supporting the third display area ③ and the surface of the third hinge module 6 supporting the third display area ③.

[0112] According to various embodiments, when the foldable electronic device 2 is changed from the unfolded state (see Figure 2 ) to switch to the folded state (see Figure 3 ), the hinge portion H may be configured to provide a space that allows the third display area ③ of the first display module 24 to be set to a bent shape that can reduce its bending stress. When the foldable electronic device 2 switches from the unfolded state to the folded state, the hinge portion H may be configured to provide a space that allows the third display area ③ to be set in a bent shape that can reduce its buckling phenomenon. In an embodiment, when the foldable electronic device 2 switches from the unfolded state to the folded state, the third display area ③ may be set in a teardrop shape or a dumbbell shape that can reduce damage or permanent deformation.

[0113] According to the implementation method (see Figure 5 ), the first side 2112 of the first frame 211 may include a first frame B1, a third frame B3, a fifth frame B5 and / or a seventh frame B7. The second side 2212 of the second frame 221 may include a second frame B2, a fourth frame B4, a sixth frame B6 and / or an eighth frame B8.

[0114] According to an embodiment, the first frame B1 may extend in a direction parallel to the center line A of the foldable electronic device 2 (eg, the y-axis direction). The first frame B1 may be positioned to correspond to the first edge E1 of the display area 24A (see Figure 2 ). The third frame B3 may extend from one end of the first frame B1 in a direction perpendicular to the direction of the center line A of the electronic device 2. The fifth frame B5 may extend from the other end of the first frame B1 in a direction perpendicular to the direction of the center line A of the electronic device 2, and may be substantially parallel to the third frame B3. The third frame B3 may be positioned to correspond to the third edge E3 of the display area 24A (see Figure 2 ) is included in the first display area ①. The fifth frame B5 may be positioned to correspond to the fourth edge E4 of the display area 24A (see Figure 2 ) is included in the first display area ①. The seventh frame B7 may extend in parallel with the direction of the center line A of the foldable electronic device 2. The seventh frame B7 may be positioned to be spaced apart from the first frame B1 in a direction perpendicular to the direction of the center line A of the foldable electronic device 2, and may connect the third frame B3 and the fifth frame B5. In a view observed from above the first cover 212, the first cover 212 may be arranged to be surrounded by the first frame B1, the third frame B3, the fifth frame B5 and the seventh frame B7.

[0115] According to an embodiment, the seventh frame B7 may be the first transverse portion 401 (see Figure 4 ) included in the first frame 211.

[0116] According to an embodiment, the second frame B2 may extend in a direction parallel to the center line A of the foldable electronic device 2 (eg, the y-axis direction). The second frame B2 may be positioned to correspond to the second edge E2 of the display area 24A (see Figure 2 ). The fourth frame B4 may extend from one end of the second frame B2 in a direction perpendicular to the direction of the center line A of the electronic device 2. The sixth frame B6 may extend from the other end of the second frame B2 in a direction perpendicular to the direction of the center line A of the electronic device 2 and may be substantially parallel to the fourth frame B4. The fourth frame B4 may be positioned to correspond to the third edge E3 of the display area 24A (see Figure 2 ) is included in the second display area ②. The sixth frame B6 can be positioned to correspond to the fourth edge E4 of the display area 24A (see Figure 2) is included in the second display area ②. The eighth frame B8 may extend in parallel to the direction of the center line A of the foldable electronic device 2. The eighth frame B8 may be positioned to be spaced apart from the second frame B2 in a direction perpendicular to the direction of the center line A of the foldable electronic device 2, and may connect the fourth frame B4 and the sixth frame B6. In a view observed from above the second display module 25, the second display module 25 may be arranged to be surrounded by the second frame B2, the fourth frame B4, the sixth frame B6 and the eighth frame B8.

[0117] According to an embodiment, the eighth frame B8 may be the second transverse portion 402 (see Figure 4 ) included in the second frame 221.

[0118] According to an embodiment, in the folded state of the foldable electronic device 2 (see Figure 3 ), the first frame B1 and the second frame B2 can be aligned. In the folded state of the foldable electronic device 2, the third frame B3 and the fourth frame B4 can be aligned. In the folded state of the foldable electronic device 2, the fifth frame B5 and the sixth frame B6 can be aligned.

[0119] According to an embodiment, in the unfolded state of the foldable electronic device 2, the gap between the seventh frame B7 of the first frame 211 and the eighth frame B8 of the second frame 221 can be closed, so that the hinge housing 23 can be substantially not exposed to the outside. In the folded state of the foldable electronic device 2, the gap between the seventh frame B7 of the first frame 211 and the eighth frame B8 of the second frame 221 can be open, so that the hinge housing 23 can be exposed to the outside.

[0120] According to an embodiment, in a view observed from above the first cover 212 (or in a view observed from above the first display area ① of the first display module 24), the first printed circuit board 421 may be positioned closer to the third frame B3 than the fifth frame B5. In conjunction with the terms described in the present disclosure, the phrase "in a view observed from above the first display area ①" may be used instead of the phrase "in a view observed from above the first cover 212". In a view observed from above the first cover 212, the second printed circuit board 422 may be positioned closer to the fifth frame B5 than the third frame B3. In a view observed from above the first cover 212, the first battery 431 may be positioned between the first printed circuit board 421 and the second printed circuit board 422.

[0121] According to an embodiment, in a view observed from above the second display module 25 (or in a view observed from above the second display area ② of the first display module 24), the third printed circuit board 423 may include a first substrate area 4231 and a second substrate area 4232 extending from the first substrate area 4231. In conjunction with the terms described in the present disclosure, the phrase “in a view observed from above the second display area ②” may be used instead of the phrase “in a view observed from above the second display module 25”. In the view observed from above the second display module 25, the first substrate area 4231 may be positioned closer to the fourth bezel B4 than to the sixth bezel B6. In the view observed from above the second display module 25, the second substrate area 4232 may be positioned between the second battery 432 and the eighth bezel B8 (see Figure 6 )between.

[0122] According to an embodiment, the first frame 211 may include a first connection region (not shown) connected to the first slider 61 of the third hinge module 6. The first connection region may include Figure 4 The first frame 221 may be connected to the first horizontal portion 401 of the third hinge module 6 and may be connected to the seventh frame B7. For example, the first connection area may include a recess into which the first sliding member 61 is inserted. For example, the first connection area may include a screw fastening portion corresponding to the screw hole of the first sliding member 61. Each of the screw fastening portions may be a boss including a female thread corresponding to the male thread of the screw. According to an embodiment, the second frame 221 may include a second connection area (not shown) connected to the second sliding member 62 of the third hinge module 6. The second connection area may include Figure 4 The second connecting area may include a depression into which the second sliding member 62 is inserted. For example, the second connecting area may include a screw fastening portion corresponding to a screw hole of the second sliding member 62.

[0123] According to an embodiment, in a view viewed from above the second display module 25, a portion 4232a (see Fig. 9 and Fig.10 ) may be connected to a second connection region (eg, a portion of the second sliding member 62 coupled to the third hinge module 6) that is not connected to the second frame 221 (see Fig.12 An overlapping shape (eg, an avoidance shape) is provided as shown in the figure mark “1240”).

[0124] According to an embodiment, the first inner support 411 may be positioned between the first support portion 2111 of the first frame 211 and the first cover 212. The first inner support 411 may be coupled to the first support portion 2111. The first inner support 411 may cover an element such as a first printed circuit board 421 disposed in the first support portion 2111 of the first frame 211. At least a portion of the first printed circuit board 421 may be positioned between the first support portion 2111 and the second inner support 412.

[0125] According to various embodiments, the first inner support 411 may include a non-metal material, and a conductive pattern used as an antenna radiator may be provided in the first inner support 411. The conductive pattern used as the antenna radiator may be electrically connected to the first printed circuit board 421. In an embodiment, at least one flexible conductive portion (not shown) may be provided between the first inner support 411 and the first printed circuit board 421, and the conductive pattern of the first inner support 411 may be electrically connected to the first printed circuit board 421 through the flexible conductive portion. For example, the flexible conductive portion may be various flexible conductive portions, such as a conductive clip (e.g., a conductive structure including an elastic structure), a spring pin, a spring, a conductive foam, a conductive rubber, a conductive tape, or a conductive connector.

[0126] According to an embodiment, the second inner support body 412 may be positioned between the first support portion 2111 of the first frame 211 and the first cover 212. The second inner support body 412 may be coupled to the first support portion 2111. In a view observed from above the first cover 212 (e.g., when observed in the +z-axis direction), the first battery 431 may be positioned between the first inner support body 411 and the second inner support body 412. The second inner support body 412 may cover an element such as a third printed circuit board 423 disposed in the first support portion 2111 of the first frame 211. At least a portion of the third printed circuit board 423 may be positioned between the first support portion 2111 and the second inner support body 412. The first frame 211 may be referred to as a “first front shell”, and the first inner support body 411 and / or the second inner support body 412 may be referred to as a “first rear shell”.

[0127] According to an embodiment, the second inner support 412 may include a non-metal material, and a conductive pattern used as an antenna radiator may be provided in the second inner support 412. The conductive pattern used as an antenna radiator may be electrically connected to the second printed circuit board 422. In an embodiment, at least one flexible conductive portion (not shown) may be provided between the second inner support 412 and the second printed circuit board 422, and the conductive pattern of the second inner support 412 may be electrically connected to the second printed circuit board 422 through the flexible conductive portion. For example, the flexible conductive portion may be various flexible conductive portions, such as a conductive clip (e.g., a conductive structure including an elastic structure), a spring pin, a spring, a conductive foam, a conductive rubber, a conductive tape, or a conductive connector.

[0128] According to various embodiments, the foldable electronic device 2 may further include a third inner support body (not shown) positioned between the second support portion 2211 of the second frame 221 and the second display module 25. The third inner support body may be coupled to the second support portion 2211. The third inner support body may support the second display module 25 (or the rear surface of the second display module 25).

[0129] According to an embodiment, when referring to the cross-sectional view 25S of the second display module 25, the second display module 25 may include a display 250, a transparent cover 255, and / or an optically transparent adhesive portion (or an optically transparent bonding portion) 256. For example, the display 250 may be coupled to the transparent cover 255 by using an optically transparent bonding portion 256 (e.g., an optically clear adhesive (OCA), an optically clear resin (OCR), or a super view resin (SVR)). The transparent cover 255 (e.g., a window) may cover the display 250 to protect the display 250 from external influences. The transparent cover 255 may provide a rear surface of the foldable electronic device 2. In various embodiments, the transparent cover 255 may be Figure 2The second cover 222 in the display 250. For example, the transparent cover 255 may include a polymer or glass. In various embodiments, the transparent cover 255 may include a plurality of layers. For example, the transparent cover 255 may have a form in which various coatings are arranged on a plastic plate or a glass plate. For example, the transparent cover 255 may have a form in which a coating including a polymer material (e.g., polyester (PET), polyimide (PI) or thermoplastic polyurethane (TPU)) or at least one protective layer is arranged on a plastic plate or a film plate. In various embodiments, the transparent cover 255 and the optically transparent adhesive portion 256 may be defined or interpreted as a part of the display 250. In various embodiments, the transparent cover 255 may be interpreted as a part of the foldable housing 20 instead of the second display module 25. For example, the display 250 may include a display panel 251, a base film 252, a lower panel 253 and / or an optical layer 254. The display panel 251 may be positioned between the optical layer 254 and the base film 252. The base film 252 may be positioned between the display panel 251 and the lower panel 253. The optical layer 254 may be positioned between the optically transparent adhesive portion 256 and the display panel 251. An adhesive material (or adhesive member) or a bonding material (or bonding member) made of various polymers may be provided between the display panel 251 and the base film 252, between the base film 252 and the lower panel 253, and / or between the display panel 251 and the optical layer 254. For example, the display panel 251 may include a light emitting layer 251a, a thin film transistor (TFT) film (or TFT substrate) 251b, and / or an encapsulation (e.g., a thin film encapsulation (TFE)) 251c. For example, the light emitting layer 251a may include a plurality of pixels implemented by a light emitting element such as an organic light emitting diode (OLED) or a micro LED. The light emitting layer 251a may be provided on the TFT film 251b by organic evaporation. The TFT film 251b may be positioned between the light emitting layer 251a and the base film 252. The TFT film 251b may mean a film structure in which at least one TFT is disposed on a flexible substrate (e.g., a PI film) by a series of processes such as deposition, patterning, and / or etching. At least one TFT may control the current of the light-emitting element of the light-emitting layer 251a, thereby adjusting the on or off of the pixel or the brightness of the pixel. For example, at least one TFT may be implemented with an amorphous silicon (a-Si) TFT, a liquid crystal polymer (LCP) TFT, a low temperature polycrystalline oxide (LTPO) TFT, or a low temperature polycrystalline silicon (LTPS) TFT. In an embodiment, the display panel 251 may include a storage capacitor, and the storage capacitor may maintain a voltage signal to the pixel, may maintain a voltage applied to the pixel within a frame, or may reduce a gate voltage variation of the TFT caused by a leakage current during the light-emitting time. The storage capacitor may maintain a voltage applied to the pixel at a predetermined time interval by a routine (e.g., initialization or data writing) for controlling at least one TFT.In an embodiment, the display panel 251 may be implemented based on an OLED, and the encapsulation 251c may cover the light-emitting layer 251a. The organic materials and electrodes used to emit light in the OLED may react very sensitively to oxygen and / or moisture, and thus may lose their light-emitting properties. In order to reduce or prevent this, the encapsulation 251c may seal the light-emitting layer 251a so that oxygen and / or moisture do not penetrate into the OLED. The base film 252 may be used to support and protect the display panel 251. In various embodiments, the base film 252 may be referred to as a "protective film", "back film" or "backplane". The lower panel 253 may include multiple layers for various functions. Various polymer adhesive materials (or bonding materials) (not shown) may be arranged between the multiple layers included in the lower panel 253. In an embodiment, for example, the lower panel 253 may include a light blocking layer 253a, a buffer layer 253b and / or a lower layer 253c. The light blocking layer 253a may be positioned between the base film 252 and the buffer layer 253b. The buffer layer 253b may be positioned between the light blocking layer 253a and the lower layer 253c. The light blocking layer 253a may block at least a portion of light incident from the outside. For example, the light blocking layer 253a may also include an embossed layer. The embossed layer may be a black layer including an uneven pattern. The buffer layer 253b may mitigate external impacts applied to the display 250. For example, the buffer layer 253b may include a sponge layer or a cushioning layer. The lower layer 253c may disperse, diffuse or dissipate heat generated in the foldable electronic device 2 or the display 250. The lower layer 253c may absorb or shield electromagnetic waves. The lower layer 253c may mitigate external impacts applied to the foldable electronic device 2 or the display 250. For example, the lower layer 253c may include a composite sheet 253d or a metal sheet 253e. In an embodiment, the composite sheet 253d may be a sheet formed by combining and processing layers or sheets having different characteristics. For example, the composite sheet 253d may include at least one of polyimide or graphite. The composite sheet 253d can be replaced by a single sheet including a material (e.g., polyimide or graphite). The composite sheet 253d can be positioned between the buffer layer 253b and the metal sheet 253e. For example, the metal sheet 253e can be a copper sheet. For example, the metal sheet 253e can include various other metal materials. The metal sheet 253e can reduce electromagnetic interference (EMI) on the second display module 25 or the display 250. In various embodiments, at least a portion of the lower layer 253c can be a conductive member (e.g., a metal plate), which can help enhance the rigidity of the foldable electronic device 2, and can be used to shield environmental noise and dissipate heat emitted from the heat dissipation components (e.g., display driver circuits) (e.g., display driver integrated circuits (DDI)) around it. For example, the conductive member can include at least one of copper (CU), aluminum (Al), stainless steel (SUS), or cladding (CLAD) (e.g., a laminated member in which SUS and Al are alternately arranged).The lower layer 253c may include various layers for various other functions. In various embodiments (not shown), in addition to the base film 252, at least one additional polymer layer (e.g., a layer including PI, PET, or TPU) may also be further disposed on the rear surface of the display panel 251. In various embodiments, at least one of the multiple layers (e.g., light blocking layer 253a, buffer layer 253b, composite sheet 253d, and metal sheet 253e) included in the lower panel 253 may be omitted. In various embodiments, the arrangement order of the multiple layers included in the lower panel 253 is not limited to the illustrated embodiment and may be changed in various ways. For example, the optical layer 254 may include a polarizing layer (or polarizer) or a phase delay layer (or delay). The polarizing layer and the phase delay layer may improve the outdoor visibility of the screen. For example, the optical layer 254 may selectively transmit light generated from the light source of the display panel 251 and vibrating in a predetermined direction. In various embodiments, a layer in which a polarizing layer and a phase delay layer are combined may be provided, and such a layer may be interpreted as a "circular polarizing layer". The optically transparent adhesive portion 256 may be positioned between the transparent cover 255 and the optical layer 254. In various embodiments, the polarizing layer (or circular polarizing layer) may be omitted, and in this case, a black pixel defining layer (PDL) and / or a color filter may be provided instead of the polarizing layer. In an embodiment, the foldable electronic device 2 may include a touch detection circuit (e.g., a touch sensor) (not shown). The touch detection circuit may be implemented with a transparent layer (or film) based on various conductive materials such as indium tin oxide (ITO). In an embodiment, the touch detection circuit may be provided between the transparent cover 255 and the optical layer 254 (e.g., an attached type). In various embodiments, the touch detection circuit may be provided between the optical layer 254 and the display panel 251 (e.g., an on-cell type). In various embodiments, the display panel 251 may include a touch detection circuit or a touch detection function (e.g., an in-cell type). In various embodiments, the display panel 251 may be based on an OLED and may include a package 251c positioned between the light emitting layer 251a and the optical layer 254. The package 251c may perform the function of a pixel protection layer for protecting a plurality of pixels of the light emitting layer 251a. A plurality of layers included in the display panel 251 or the lower panel 253, a stacking structure thereof, or a stacking order thereof may be various. The display 250 may be implemented by omitting a portion of elements or adding other elements according to the provided type or trend.

[0130] According to various embodiments, the second display module 25 may be a flexible display module. In this case, the display 250 may be a flexible display. The transparent cover 255 may be implemented in the form of a thin film (e.g., a thin film layer) having flexibility. For example, the transparent cover 255 may include a plastic film (e.g., a polyimide (PI) film) or a thin film glass (e.g., an ultra-thin glass (UTG)). In various embodiments, the transparent cover 255 may include a plurality of layers. For example, the transparent cover 255 may have a form in which various coatings are arranged on the plastic film or the thin film glass. For example, the transparent cover 255 may have a form in which a coating including a polymer material (e.g., polyester (PET), polyimide (PI), or thermoplastic polyurethane (TPU)) or at least one protective layer is arranged on the plastic film or the thin film glass. The base film 252 may include a flexible film formed of a plastic or a polymer (e.g., polyimide or polyester (PET)). In an embodiment, the display 250 may include a conductive pattern such as a metal mesh (e.g., an aluminum metal mesh) as a touch detection circuit arranged on the package 251c, between the package 251c and the optical layer 254. For example, in response to bending of the display 250, the metal mesh may have greater durability than the durability of the transparent conductive layer implemented with ITO. In various embodiments, the display 250 may also include a pressure sensor (not shown) capable of measuring the intensity (pressure) of a touch. In an embodiment, the first display module 24 may include at least a portion of the elements included in the above-mentioned flexible display module.

[0131] According to various embodiments, the first display module 24 may include a support sheet (or a support plate or a support layer). The support sheet may be disposed on the rear surface of a flexible display (e.g., a display 250 implemented as a flexible display). The rear surface of the flexible display may be a surface positioned on a side opposite to the surface of a display panel including a plurality of pixels, from which light is emitted. The support sheet may be disposed on (e.g., attached to) the rear surface of the lower panel while covering at least a portion of the lower panel (e.g., lower panel 253) of the flexible display. The support sheet may be coupled to the lower panel by an adhesive material or a bonding material. For example, the adhesive material (or bonding material) between the flexible display and the support sheet may include a thermo-reactive adhesive material (or thermo-reactive bonding material), a photo-reactive adhesive material (or photo-reactive bonding material), a universal adhesive (or universal bonding material), or a double-sided tape. For another example, the adhesive material (or bonding material) may include various polymers (such as triazine thiol, dithiopyrimidine, or a silane-based compound) or an organic adhesive material (or organic bonding material) (such as a sealant). The support sheet can contribute to the durability (e.g., rigidity enhancement) of the first display module 24. The support sheet can reduce the impact on the first display module 24 (or flexible display) caused by loads or stresses that may occur during the folding of the foldable housing 20. The support sheet can reduce or prevent the first display module 24 from being damaged by the force transmitted when the foldable housing 20 is folded. In an embodiment, the support sheet may include a metal material. For example, the support sheet may include stainless steel. The support sheet may include various other metal materials. In various embodiments, the support sheet may include engineering plastics.

[0132] According to an embodiment, the support sheet included in the first display module 24 may include a lattice structure (not shown) that is aligned with the third display area ③ (see Figure 2) at least partially overlap. For example, the lattice structure may include a plurality of openings (or slits) provided through the support sheet. The lattice structure may mean a pattern structure in which a plurality of openings are regularly arranged. The plurality of openings may be formed periodically, may have substantially the same shape, and may be repeatedly arranged at predetermined intervals. The lattice structure may reduce the degradation of the flexibility of the third display area ③. In various embodiments, the lattice structure including a plurality of openings may be referred to as other terms, such as "opening pattern", "hole pattern" or "lattice pattern". In various embodiments, the support sheet may include a recessed pattern (not shown) including a plurality of recesses replacing the lattice structure. For example, the recessed pattern may mean a pattern structure in which a plurality of recesses are regularly arranged, and the plurality of recesses are provided on a first surface of the support sheet facing the lower panel of the flexible display or on a second surface positioned at a side opposite to the first surface of the support sheet and having a pit shape. In various embodiments, the lattice structure or the recessed pattern may extend to the first display area ① (see Figure 2 ) and / or the second display area② (see Figure 2 ) corresponding to the portion. In various embodiments, the support sheet including the lattice structure or the concave pattern or the conductive member corresponding thereto may be provided as a plurality of layers. In various embodiments, the support sheet may reduce electromagnetic interference (EMI) on the flexible display. In various embodiments, the support sheet may diffuse or spread the heat emitted from the heat dissipation component (e.g., a display driver circuit, such as a display driver integrated circuit (DDI) or a DDI chip). In various embodiments, the support sheet may be interpreted as an element separate from the first display module 24.

[0133] According to an embodiment, the first speaker module (or first speaker assembly) 441 may be positioned between the second support portion 2211 of the second frame 221 and the second display module 25. The first speaker module 441 may be disposed or coupled to the second support portion 2211. For example, the first speaker module 441 may include a first speaker and a first speaker support body, and the first speaker is disposed or coupled to the first speaker support body. The first speaker support body may provide a sound movement path (or channel) between the first speaker and the first speaker hole provided through the second side 2212 of the second frame 221.

[0134] According to an embodiment, the second speaker module (or second speaker assembly) 442 may be positioned between the second support portion 2211 of the second frame 221 and the second display module 25. The second speaker module 442 may be disposed or coupled to the second support portion 2211. For example, the second speaker module 442 may include a second speaker and a second speaker support body, and the second speaker is disposed or coupled to the second speaker support body. The second speaker support body may provide a sound movement path (or channel) between the second speaker and the second speaker hole provided through the second side 2212 of the second frame 221.

[0135] According to an embodiment, the first antenna structure 451 may be positioned between the first support portion 2111 of the first frame 211 and the first cover 212. The first antenna structure 451 may be disposed on a surface of the first battery 431 facing the first cover 212 or on the first cover 212. The position of the first antenna structure 451 is not limited thereto and may be various. For example, the first antenna structure 451 may be implemented in a film shape such as an FPCB. The first antenna structure 451 may include at least one conductive pattern used as a loop radiator. For example, at least one conductive pattern included in the first antenna structure 451 may include a spiral conductive pattern in a planar shape (e.g., a planar coil or a pattern coil). In an embodiment, at least one conductive pattern included in the first antenna structure 451 may be electrically connected to a wireless communication circuit (e.g., a wireless communication circuit) disposed on the first printed circuit board 421. Figure 1 The wireless communication module 192 in the first printed circuit board 421). For example, at least one conductive pattern may be used for short-range wireless communication such as near field communication (NFC). For another example, at least one conductive pattern may be used for magnetic secure transmission (MST) for sending and / or receiving magnetic signals. In various embodiments, at least one conductive pattern included in the first antenna structure 451 may be electrically connected to a power transmission / reception circuit provided on the first printed circuit board 421. The power transmission / reception circuit may wirelessly receive power from an external electronic device or wirelessly transmit power to an external electronic device by using at least one conductive pattern. The power transmission / reception circuit may include a power management module, for example, may include a power management integrated circuit (PMIC) or a charger integrated circuit (IC). The power transmission / reception circuit may charge the first battery 431 and / or the second battery 432 by using power wirelessly received using the conductive pattern.

[0136] According to an embodiment, the second antenna structure 452 may be positioned between the first support portion 2111 of the first frame 211 and the first cover 212. The second antenna structure 452 may be disposed on a surface of the first inner support body 411 facing the first cover 212 or on the first cover 212. The position of the second antenna structure 452 is not limited thereto and may be various. For example, the second antenna structure 452 may be implemented in a film shape such as an FPCB. In an embodiment, the second antenna structure 452 may be electrically connected to a wireless communication circuit (e.g., Figure 1 A processor (eg, Figure 1 The processor 120 in the second antenna structure 452 can perform a positioning function (e.g., angle of arrival (AOA)) of a signal source (e.g., a responder, a transmitter, or a transmitter (Tx) device) by using the second antenna structure 452. The processor can simultaneously perform a positioning function (AOA) for measuring an angle and a ranging function for measuring a distance. In an embodiment, the processor can identify (or estimate) the distance between the foldable electronic device 2 and the signal source by using at least one antenna element (e.g., a first antenna element, a second antenna element, and / or a third antenna element) included in the second antenna structure 452. In an embodiment, the processor can identify (or estimate) the reception angle (e.g., the direction of the signal) of the signal relative to the set axis of the foldable electronic device 2 by using at least one of the arrival time difference of the response message to the request message through at least two antenna elements included in the second antenna structure 452, and the arrival distance difference or phase difference between the received signals. The foldable electronic device 2 can support the positioning function by using a broadband bandwidth (e.g., ultra-wideband (UWB)). For example, UWB is a technology that complies with the international standard of IEEE 802.15.4, and may be a technology for communicating using a broadband bandwidth. In an embodiment, the processor may identify or estimate the position of a signal source (e.g., a responder, a transmitter, or a Tx device) relative to the foldable electronic device 2 (e.g., a starter, a receiver, or a receiver (Rx) device) by using a phase difference between signals received by a plurality of antenna elements included in the second antenna structure 452. The antenna structure 452 may be provided as a printed circuit board (e.g., a flexible printed circuit board (FPCB)), and may be, for example, a patch antenna including a plurality of patches (e.g., a first antenna element, a second antenna element, and a third antenna element).

[0137] According to an embodiment, the third flexible printed circuit board 463 and / or the fourth flexible printed circuit board 464 may be disposed to cross the hinge portion H. The third end 4631 of the third flexible printed circuit board 463 may include a third connector (e.g., a third FPCB connector), and the fourth end 4632 of the third flexible printed circuit board 463 may include a fourth connector (e.g., a fourth FPCB connector). The third connector may be electrically connected to an electrical component (e.g., a fourth FPCB connector) positioned or accommodated in the first housing 21. Fig.10 connector C3 of the first printed circuit board 421 (see Figure 2 The fourth connector may be electrically connected to an electrical component (eg, Fig.10 The connector C4 of the third printed circuit board 423 (see Figure 2 ). The fifth end 4641 of the fourth flexible printed circuit board 464 may include a fifth connector (e.g., a fifth FPCB connector), and the sixth end 4642 of the fourth flexible printed circuit board 464 may include a sixth connector (e.g., a sixth FPCB connector). The fifth connector may be electrically connected to an electrical component (e.g., Fig.10 of the first printed circuit board 421 (see Figure 2 The sixth connector may be electrically connected to an electrical component (eg, Fig.10 Connector C6 of the third printed circuit board 423 (see Figure 2 ). The third flexible printed circuit board 463 may have a film shape having a third surface (not shown) and a fourth surface 463B oriented in a direction opposite to the third surface (see Figure 8 ) and may include a signal line (or an electrical path) for electrically connecting the third end 4631 and the fourth end 4632, and a conductive pattern for configuring a grounding area for reducing electromagnetic interference (EMI) on the signal line. The fourth flexible printed circuit board 464 may have a film shape having a sixth surface 464B (see FIG. 1 ) oriented in a direction opposite to the fifth surface and a fifth surface (not shown). Figure 8 ) and may include a signal line (or an electrical path) for electrically connecting the fifth end 4641 and the sixth end 4642, and a conductive pattern for configuring a ground area for reducing electromagnetic interference (EMI) on the signal line.

[0138] According to an embodiment, the first support portion 2111 of the first frame 211 may include a first opening (or a first hole or a first through hole) 501 (see Figure 5 and Figure 6The second support portion 2211 of the second frame 221 may include a second opening (or a second hole or a second through hole) 502 (see Figure 5 and Figure 6 ). The third flexible printed circuit board 463 may extend through the first opening 501 and the second opening 502. In an embodiment, the first opening 501 and the second opening 502 may be opened in the folded state of the foldable electronic device 2 (see Figure 3 ) overlap and align with each other. The third flexible printed circuit board 463 may include a first fixing portion F1, a second fixing portion F2 and / or a third fixing portion F3. The first fixing portion F1, the second fixing portion F2 and the third fixing portion F3 may be provided in an area between the third end 4631 and the fourth end 4632 of the third flexible printed circuit board 463.

[0139] According to an embodiment, the first fixing portion F1 of the third flexible printed circuit board 463 may be positioned between the first plate 71 and the first supporting portion 2111 of the first frame 211. The first fixing portion F1 may be coupled to the first plate 71 or the first supporting portion 2111 of the first frame 211 by various coupling methods such as bonding including an adhesive material or a bonding material or screw fastening.

[0140] According to an embodiment, the second fixing portion F2 of the third flexible printed circuit board 463 may be positioned between the second plate 72 and the second support portion 2211 of the second frame 221. The second fixing portion F2 may be coupled to the third plate 73 or the second support portion 2211 of the second frame 221 by various coupling methods such as bonding including an adhesive material or a bonding material or screw fastening. When the foldable electronic device 2 switches between the unfolded state and the folded state, the relative position between the first fixing portion F1 and the second fixing portion F2 may change, and the area between the first fixing portion F1 and the second fixing portion F2 of the third flexible printed circuit board 463 may be set to a shape corresponding to the relative position between the first fixing portion F1 and the second fixing portion F2. The hinge housing 23 may include a recess that helps to set the area between the first fixing portion F1 and the second fixing portion F2 of the third flexible printed circuit board 463 while reducing its stress when the foldable electronic device 2 switches between the unfolded state and the folded state.

[0141] According to an embodiment, the third fixing portion F3 of the third flexible printed circuit board 463 may extend from a region between the third end 4631 of the third flexible printed circuit board 463 and the first fixing portion F1. The third fixing portion F3 may be disposed or coupled to the first supporting portion 2111 of the first frame 211.

[0142] According to an embodiment, the first fixing portion F1, the second fixing portion F2, and / or the third fixing portion F3 of the third flexible printed circuit board 463 may be configured to be less flexible (or more rigid) than other portions of the third flexible printed circuit board 463. The first fixing portion F1, the second fixing portion F2, and / or the third fixing portion F3 may be substantially rigid. For example, the first fixing portion F1 may include a first reinforcing portion (or a first reinforcing member or a first reinforcing structure) such as a reinforcing member, and thus may be made rigid. For example, the second fixing portion F2 may include a second reinforcing portion (or a second reinforcing member or a second reinforcing structure) such as a reinforcing member, and thus may be made rigid. For example, the third fixing portion F3 may include a third reinforcing portion (or a third reinforcing member or a third reinforcing structure) such as a reinforcing member, and thus may be made rigid. In an embodiment, the first reinforcing portion of the first fixing portion F1 may include a screw hole for screw fastening with the first support portion 2111 of the first plate 71 or the first frame 211. In an embodiment, the second reinforcing portion of the second fixing portion F2 may include a screw hole for screw fastening with the second support portion 2211 of the third plate 73 or the second frame 221. In various embodiments, the third flexible printed circuit board 463 may be implemented as a rigid flexible printed circuit board (rigid FPCB (RFPCB)), and the first fixing portion F1 , the second fixing portion F2 , or the third fixing portion F3 may be substantially rigid without a reinforcement portion.

[0143] According to an embodiment, the first support portion 2111 of the first frame 211 may include a third opening (or a third hole or a third through hole) 503 (see Figure 5 and Figure 6 The second support portion 4221 of the second frame 221 may include a fourth opening (or a fourth hole or a fourth through hole) 504 (see Figure 5 and Figure 6 The fourth flexible printed circuit board 464 may extend through the third opening 503 and the fourth opening 504. The third opening 503 and the fourth opening 504 may be in the folded state of the foldable electronic device 2 (see Figure 3) overlap and align with each other. The first opening 501 and the third opening 503 may be positioned to be spaced apart from each other in the direction of the center line A of the foldable electronic device 2 (e.g., the y-axis direction). The second opening 502 and the fourth opening 504 may be positioned to be spaced apart from each other in the direction of the center line A of the foldable electronic device 2. At least a portion of the fourth flexible printed circuit board 464 may be configured to be the same as or similar to the third flexible printed circuit board 463. The fourth flexible printed circuit board 464 may include a fourth fixing portion F4 (e.g., the first fixing portion F1) and a fifth fixing portion F5 (e.g., the second fixing portion F2) provided in an area between the fifth end 4641 and the sixth end 4642. The fourth fixing portion F4 may be coupled to the first support portion 2111 of the second plate 72 or the first frame 211 by various coupling methods such as coupling including an adhesive material or a bonding material or screw fastening. The fifth fixing portion F5 may be coupled to the second support portion 2211 of the fourth plate 74 or the second frame 221 by various coupling methods such as coupling including an adhesive material or a bonding material or screw fastening.

[0144] According to an embodiment, in a view viewed from above the first cover 212, the first opening 501 may be positioned between the first battery 431 and the seventh frame B7 (see Figure 6 In the view observed from above the first cover 212, the third opening 503 may be located between the first printed circuit board 421 and the seventh frame B7 (see Figure 6 )between.

[0145] According to an embodiment, in a view viewed from above the second display module 25, the second opening 502 and / or the fourth opening 504 may be positioned between the second battery 432 and the eighth frame B8 (see Figure 6 ). The area of ​​the third flexible printed circuit board 463 extending from the second fixing portion F2 to the fourth end 4632 may be provided in a bent shape to face the third printed circuit board 423, so that the fourth connector included in the fourth end 4632 of the third flexible printed circuit board 463 and the connector C4 provided on the third printed circuit board 423 are connected while facing each other. The area of ​​the fourth flexible printed circuit board 464 extending from the fourth fixing portion F4 to the sixth end 4642 may be provided in a bent shape to face the third printed circuit board 423, so that the sixth connector included in the sixth end 4642 of the fourth flexible printed circuit board 464 and the connector C6 provided on the third printed circuit board 423 are connected while facing each other.

[0146] According to an embodiment, in a view viewed from above the first cover 212, the first flexible printed circuit board 461 may overlap with the first battery 431. Figure 8A surface opposite to the fourth surface 463B in the embodiment may face the first battery 431.

[0147] According to an embodiment, the fifth flexible printed circuit board 465 may electrically connect the first printed circuit board 421 and the second printed circuit board 422. For example, a connector module (eg, Figure 2 The fifth flexible printed circuit board 465 may be electrically connected to the first printed circuit board 421 through the fifth flexible printed circuit board 465. In a view observed from above the first cover 212, the fifth flexible printed circuit board 465 may overlap with the first battery 431.

[0148] According to an embodiment, the first flexible printed circuit board 461 may electrically connect the first printed circuit board 421 and the second printed circuit board 422. The first flexible printed circuit board 461 may include a first end 4611 including a first connector electrically connected to the first printed circuit board 421 and a second end 4612 including a second connector electrically connected to the second printed circuit board 422. The first flexible printed circuit board 461 may have a film shape having a first surface (not shown) and a second surface 461B oriented in a direction opposite to the first surface (see Fig.10 ) and may include a signal line (or an electrical path) for electrically connecting the first end 4611 and the second end 4612, and a conductive pattern for configuring a ground area for reducing electromagnetic interference (EMI) on the signal line.

[0149] According to an embodiment, the first flexible printed circuit board 461 may be a flexible RF cable (FRC). The second printed circuit board 422 may include an antenna radiator or may be electrically connected to the antenna radiator. A wireless communication circuit (eg, Figure 1 The wireless communication module 192 in the first printed circuit board 421 may be disposed on the first printed circuit board 421. The wireless communication circuit may be electrically connected to the antenna radiator through the first flexible printed circuit board 461. The wireless communication circuit may send a transmission current (or a wireless signal or an electromagnetic signal) to the antenna radiator through the first flexible printed circuit board 461. The wireless communication circuit may process a signal (or an RF signal) sent or received through the antenna radiator.

[0150] According to an embodiment, at least one conductive portion included in the first side 2112 of the first frame 211 may be used as at least a part of an antenna radiator or a radiating portion that transmits electromagnetic waves (or electromagnetic signals) to the outside or receives electromagnetic waves from the outside. In an embodiment, the foldable electronic device 2 may include a first flexible conductive portion (or flexible conductive member) 422a (see Fig.10) and / or the second flexible conductive portion 422b (see Fig.10 ). The first flexible conductive portion 422a and the second flexible conductive portion 422b may be in elastic contact with the conductive portion included in the first side 2112 of the first frame 211. The conductive portion included in the first side 2112 of the first frame 211 may be electrically connected to the second printed circuit board 422 through the first flexible conductive portion 422a and the second flexible conductive portion 422b. The first flexible conductive portion 422a or the second flexible conductive portion 422b may be a conductive clip (e.g., a conductive structure including an elastic structure), but may be various conductive clips such as a spring pin, a spring, a conductive foam, a conductive rubber, a conductive tape, or a conductive connector, but is not limited thereto. The second printed circuit board 422 may include a connector C2 electrically connected to the second end 4612 of the first flexible printed circuit board 461, and a conductive line (e.g., a signal line) for electrically connecting the first flexible conductive portion 422a. The conductive portion included in the first side 2112 of the first frame 211 may be electrically connected to a wireless communication circuit (e.g., a signal line) provided on the first printed circuit board 421 through the second printed circuit board 422 and the first flexible printed circuit board 461. Figure 1 The wireless communication module 192 in the first printed circuit board 421). The conductive portion included in the first side 2112 of the first frame 211 may be electrically connected to a ground plane (or grounding area) included in the second printed circuit board 422 through the second flexible conductive portion 422b. For example, a position or portion of the conductive portion included in the first side 2112 electrically connected to the first flexible conductive portion 422a may be used as a feeding point (or feeding portion), and a position or portion of the conductive portion included in the first side 2112 electrically connected to the second flexible conductive portion 422b may be used as a grounding point. In the case where the wireless communication circuit provided on the first printed circuit board 421 provides (or feeds) a transmission current to the feeding point, a signal path may be formed between the feeding point and the grounding point of the conductive portion included in the first side 2112. The conductive portion included in the first side 2112 may form an electrical length (e.g., a length expressed as a ratio of a wavelength) corresponding to the signal path, thereby operating as an antenna radiator having a resonant frequency corresponding to the electrical length. In various embodiments, at least one conductive portion included in the second side 2212 of the second frame 221 may be configured to operate as an antenna radiator in a manner substantially the same or similar thereto.

[0151] According to an embodiment, in a view viewed from above the first cover 212, a partial area of ​​the first flexible printed circuit board 461 may overlap with the first battery 431. A portion of the first surface of the first flexible printed circuit board 461 (e.g., a surface of the first flexible printed circuit board 464 oriented in a direction opposite to the second surface 461B) may face the first battery 431.

[0152] According to an embodiment, in a view viewed from above the first cover 212 , the first flexible printed circuit board 461 may not substantially overlap with the third flexible printed circuit board 463 .

[0153] According to various embodiments (not shown), in a view observed from above the first cover 212, the first flexible printed circuit board 461 may overlap with the third flexible printed circuit board 463. In an embodiment, the portion where the first flexible printed circuit board 461 and the third flexible printed circuit board 463 overlap may include a non-conductive member (e.g., a non-conductive film or a non-conductive sheet) (not shown) disposed between the first flexible printed circuit board 461 and the third flexible printed circuit board 463. The spacing distance between the first flexible printed circuit board 461 and the third flexible printed circuit board 463 may be provided by the non-conductive member, thereby reducing the electromagnetic influence (e.g., electromagnetic interference (EMI)) of the third flexible printed circuit board 463 on the first flexible printed circuit board 461. The non-conductive member may be disposed in a region of the first flexible printed circuit board 461 facing the third flexible printed circuit board 463. In various embodiments, the non-conductive member may include a non-conductive adhesive material (or bonding material).

[0154] According to an embodiment, in a view viewed from above the first cover 212 , the first flexible printed circuit board 461 may not overlap with the fourth flexible printed circuit board 464 .

[0155] According to an embodiment, in a view viewed from above the first cover 212, a partial area (hereinafter, “first area”) of the first flexible printed circuit board 461 It can be positioned between the first battery 431 and the seventh frame B7 (see Figure 6 In an embodiment, in the unfolded state of the foldable electronic device 2 (see Figure 2 ), in the view viewed from above the first cover 212, the first region of the first flexible printed circuit board 461 It may be positioned between the first battery 431 and the hinge housing 23 .

[0156] According to an embodiment, the first region of the first flexible printed circuit board 461 The third supporting area 2111B (see FIG. 21A ) of the first supporting portion 2111 included in the first frame 211 may face the first supporting portion 2111 included in the first frame 211. Figure 6 The first surface of the first flexible printed circuit board 461 (eg, a surface of the first flexible printed circuit board 461 oriented in a direction opposite to the second surface 461B) includes a first area The portion in the middle may face the third supporting region 2111B of the first supporting portion 2111 .

[0157] According to an embodiment, the first region of the first flexible printed circuit board 461 The first partial region 1001 and the second partial region 1002 may be included. The first partial region 1001 may be connected to the first region of the first flexible printed circuit board 461. The second portion 1002 may be connected to the first region extending from the first flexible printed circuit board 4611. The first partial area 1001 may be positioned closer to the third frame B3 than the fifth frame B5 in the view observed from above the first cover 212, and the second partial area 1002 may be positioned closer to the fifth frame B5 than the third frame B3. In an embodiment, in a view observed from above the first cover 212, the second partial area 1002 may overlap with an area of ​​the first opening 501 including the first support portion 2111 of the first frame 211, and the third flexible printed circuit board 463 extends through the first opening 501. The first partial area 1002 may have a first width W1. In an embodiment, in order to reduce the overlap between the second partial area 1002 and the first opening 501 in the view observed from above the first cover 212, the second partial area 1002 may have a second width W2 that is smaller than the first width W1. In a view observed from above the first cover 212, the first width W1 and the second width W2 may be widths in a direction orthogonal to the center line A of the foldable electronic device 2.

[0158] According to various embodiments, in a view from above the first cover 212 , the second partial region 1002 may not substantially overlap with the first opening 501 .

[0159] According to an embodiment, the portion where the first flexible printed circuit board 461 and the third supporting region 2111B of the first supporting portion 2111 overlap and face each other may include a first non-conductive member (e.g., a non-conductive film or a non-conductive sheet) disposed between the first flexible printed circuit board 461 and the third supporting region 2111B (e.g., Fig.12 The first non-conductive member 1210 in the third support area 2111B is connected to the first area of ​​the first flexible printed circuit board 461 The facing and overlapping portions may include a conductive material (or a metal material). The third supporting region 2111B and the first region The spacing distance between the first non-conductive member (e.g., Fig.12 The first non-conductive member 1210 is provided in the first flexible printed circuit board 461, thereby reducing the conductive material used to provide the third supporting area 2111B to the first area of ​​the first flexible printed circuit board 461 The first non-conductive member may be disposed on the first flexible printed circuit board 461. In various embodiments, the first non-conductive member may be disposed in the third supporting region 2111B. In various embodiments, the first non-conductive member may include a non-conductive adhesive material, and the first region of the first flexible printed circuit board 461 may be provided with a non-conductive adhesive material. The third supporting region 2111B may be coupled to the first supporting portion 2111 .

[0160] According to an embodiment, in a view viewed from above the first cover 212, the first region of the first flexible printed circuit board 461 The third fixing portion F3 may overlap with the third fixing portion F3 of the third flexible printed circuit board 463. The third fixing portion F3 may not include a conductive pattern such as a signal line or a ground plane. In the case where the third flexible printed circuit board 463 is arranged on the first frame 211, the third fixing portion F3 may be used to guide its arrangement. Since the third fixing portion F3 substantially does not include a conductive material, the third fixing portion F3 may reduce the first area of ​​the first flexible printed circuit board 461. electromagnetic influences (e.g. electromagnetic interference).

[0161] Fig.11 A view of the first flexible printed circuit board 461 according to an embodiment of the present disclosure, a cross-sectional view of the first flexible printed circuit board 461 cut along line BB′, and a cross-sectional view of the first flexible printed circuit board 461 cut along line CC′ are shown.

[0162] refer to Fig.11In an embodiment, the first flexible printed circuit board 461 may include a first portion 1101, a second portion 1102, a third portion 1103, a fourth portion 1104, a fifth portion 1105, a sixth portion 1106, and / or a seventh portion 1107. The first portion 1101 may include a first end 4611 of the first flexible printed circuit board 461, and a first connector 4611a is disposed in the first end 4611. The second portion 1102 may be a region for connecting the first portion 1101 and the third portion 1103 of the first flexible printed circuit board 461. The third portion 1103 may be a region for connecting the second portion 1102 and the fourth portion 1104 of the first flexible printed circuit board 461. The fourth portion 1104 may be a region for connecting the third portion 1103 and the fifth portion 1105 of the first flexible printed circuit board 461. The fifth portion 1105 may be a region for connecting the fourth portion 1104 and the sixth portion 1106 of the first flexible printed circuit board 461. The sixth portion 1106 may be a region for connecting the fifth portion 1105 and the seventh portion 1107 of the first flexible printed circuit board 461. The seventh portion 1107 may include the second end 4612 of the first flexible printed circuit board 461, and the second connector 4612a is disposed in the second end 4612.

[0163] According to an embodiment, the first portion 1101, the third portion 1103, the fifth portion 1105, and / or the seventh portion 1107 may be less flexible than the second portion 1102, the fourth portion 1104, and / or the sixth portion 1106, or may be more rigid than the second portion 1102, the fourth portion 1104, and / or the sixth portion 1106. The first portion 1101, the third portion 1103, the fifth portion 1105, and / or the seventh portion 1107 may be substantially rigid, and the second portion 1102, the fourth portion 1104, and / or the sixth portion 1106 may be substantially flexible. In the case where there is a height difference between the position where the first portion 1101 is disposed in the foldable electronic device 2 and the position where the third portion 1103 is disposed in the foldable electronic device 2, since the second portion 1102 is flexible, stress (e.g., bending stress) generated in the second portion 1102 may be reduced. In the case where there is a height difference between the position where the third portion 1103 is disposed in the foldable electronic device 2 and the position where the fifth portion 1105 is disposed in the foldable electronic device 2, since the fourth portion 1104 is flexible, stress (e.g., bending stress) generated in the fourth portion 1104 can be reduced. In the case where there is a height difference between the position where the fifth portion 1105 is disposed in the foldable electronic device 2 and the position where the seventh portion 1107 is disposed in the foldable electronic device 2, since the sixth portion 1106 is flexible, stress (e.g., bending stress) generated in the sixth portion 1106 can be reduced. The position or number of the flexible portion or the rigid portion included in the first flexible printed circuit board 461 is not limited to the illustrated example and may be various.

[0164] According to an embodiment, for flexibility thereof, the second portion 1102, the fourth portion 1104, and / or the sixth portion 1106 may have a thinner thickness than the first portion 1101, the third portion 1103, the fifth portion 1105, and / or the seventh portion 1107 or a smaller stacking number than the first portion 1101, the third portion 1103, the fifth portion 1105, and / or the seventh portion 1107. In various embodiments, for flexibility thereof, the second portion 1102, the fourth portion 1104, and / or the sixth portion 1106 may include a material different from that of the first portion 1101, the third portion 1103, the fifth portion 1105, and / or the seventh portion 1107.

[0165] According to various embodiments, the first part 1101, the third part 1103, the fifth part 1105, and / or the seventh part 1107 may further include a reinforcement portion (or reinforcement member or reinforcement structure) such as a reinforcement, and thus may become rigid compared to the second part 1102, the fourth part 1104, or the sixth part 1106. In various embodiments, the reinforcement portion may include a film or a sheet.

[0166] According to an embodiment, the fifth portion 1105 may include a first region .

[0167] According to various embodiments, the first flexible printed circuit board 461 may be a rigid flexible printed circuit board.

[0168] According to an embodiment, the first flexible printed circuit board 461 may include a plurality of conductive layers including conductive patterns and a plurality of non-conductive layers (e.g., insulating layers) alternately stacked with the plurality of conductive layers. Some of the conductive patterns among the plurality of conductive layers may be used as signal lines. Some of the conductive patterns among the plurality of conductive layers may be used as ground planes (or ground regions).

[0169] According to various embodiments, the first flexible printed circuit board 461 may include a plurality of conductive paths. The conductive path may be a conductive hole that penetrates to allow a connection line through which a conductive pattern for electrically connecting conductive layers different from each other is arranged. For example, the conductive path may include a plated through hole (PTH), a laser through hole (LVH), a buried through hole (BVH), or a stacked path. For example, at least one conductive path may be part of a signal line and may electrically connect signal line patterns arranged on layers different from each other. For example, at least one conductive path may electrically connect ground planes on different layers, and a conductive structure including a ground plane and at least one conductive path for electrically connecting the ground plane may be defined or interpreted as a ground (or ground structure) of the first flexible printed circuit board 461.

[0170] According to an embodiment, the first flexible printed circuit board 461 may include a first layer 1110, a second layer 1120, and / or a third layer 1130. The second layer 1120 may be disposed between the first layer 1110 and the third layer 1130. Although not shown herein, an insulating bonding material or an adhesive material may be disposed between the first layer 1110 and the second layer 1120 and between the second layer 1130 and the third layer 1130. The first layer 1110, the second layer 1120, and / or the third layer 1130 may include a conductive pattern used as a signal line and / or a conductive pattern used as a ground plane. The second layer 1120 may be positioned between the first layer 1110 and the first cover 212 (see Figure 2 ). The second portion 1102, the fourth portion 1104, and / or the sixth portion 1106 may include a first layer 1110 and a second layer 1120. The first portion 1101, the third portion 1103, the fifth portion 1105, and / or the seventh portion 1107 may include a first layer 1110, a second layer 1120, and a third layer 1130. In various embodiments, the number of layers included in the first flexible printed circuit board 461 is not limited to the illustrated example and may be various.

[0171] According to an embodiment, the fifth portion 1105 of the first flexible printed circuit board 461 may include a first support portion 2111 for contacting with the first frame 211 (see Fig.10 ) matches the hole 4613. For example, the first support portion 2111 (see Fig.10 ) may include a protrusion inserted into the hole 4613 of the fifth part 1105. The position or number of the hole 4613 and the protrusion corresponding thereto is not limited to the illustrated example and may be various. In various embodiments, in addition, the first support portion 2111 (see FIG. 211 ) for stably fixing, setting or coupling the first flexible printed circuit board 461 to the first frame 211 may include a protrusion inserted into the hole 4613 of the fifth part 1105. The position or number of the hole 4613 and the protrusion corresponding thereto is not limited to the illustrated example and may be various. Fig.10 ) can have various structures.

[0172] According to various embodiments, the hole 4613 of the fifth portion 1105 may be a screw hole for screw fastening, and the first support portion 2111 may include a screw fastening portion (e.g., a boss including a female screw) corresponding to the screw hole. The position or number of the screw hole is not limited to the example shown, and may be various.

[0173] Fig.12 A view showing a portion of the foldable electronic device 2 in an unfolded state according to an embodiment of the present disclosure and a view along line D-D' (see FIG. Fig.10 and Fig.12 ) is a cross-sectional view of the foldable electronic device 2 cut.

[0174] refer to Fig.12 The foldable electronic device 2 may include a first frame 211, a second frame 221, a first cover 212, a third hinge module 6, a hinge housing 23, a first display module 24, a second display module 25, a first printed circuit board 421, a third printed circuit board 423, a first battery 431, a second battery 432, a first antenna structure 451, a first flexible printed circuit board 461, a third flexible printed circuit board 463, a first non-conductive member 1210 and / or a flexible member 1220.

[0175] According to an embodiment, the first antenna structure 451 may overlap the first battery 431 in a view viewed from above the first cover 212. A portion of the third flexible printed circuit board 463 may be positioned between the first antenna structure 451 and the first battery 431.

[0176] According to an embodiment, in a view viewed from above the second display module 25 , the second printed circuit board 423 may be disposed in a region between the eighth bezel B8 and the second battery 432 of the second frame 221 .

[0177] According to an embodiment, the first frame 211 may include a first connection area 1230 for connecting with the first sliding member 61 of the third hinge module 6. The first connection area 1230 may be Figure 4 The first connection area 1230 may include a portion of the first lateral portion 401 in the third hinge module 6, which corresponds to the third hinge module 6. The first connection area 1230 may include a recess 1231 into which the first sliding member 61 of the third hinge module 6 is inserted. Although not shown here, the first connection area 1230 may include a screw fastening portion (e.g., a boss including a female screw) for screw fastening with the first sliding member 61 of the third hinge module 6.

[0178] According to an embodiment, the first connection area 1230 may include a structure or shape for connecting to the first sliding member 61 of the third hinge module 6, so that the first connection area 1230 of the first support portion 2111 of the first frame 211 can be positioned to be closer to the first cover 212 than to the first battery arrangement area 1251 (e.g., the area in which the first battery 431 is disposed).

[0179] According to an embodiment, the second frame 221 may include a second connection area 1240 for connecting with the second sliding member 62 of the third hinge module 6. The second connection area 1240 may be Figure 4 The second connection area 1240 may include a recess 1241 (see Fig.13 ), the second sliding member 62 of the third hinge module 6 is inserted into the recess 1241. The second connection area 1240 may include a screw fastening portion 1242 for screw fastening with the second sliding member 62 of the third hinge module 6.

[0180] According to an embodiment, the second connection area 1240 may include a structure or form for connecting to the second sliding member 62 of the third hinge module 6, so that the second connection area 1240 can be positioned closer to the second cover 222 or the second display module 25 compared to the second battery arrangement area 1252 (for example, the area in which the second battery 432 is disposed) of the second support portion 2211 of the second frame 221 and the area 1260 between the second connection area 1240.

[0181] According to an embodiment, in a view observed from above the second display module 25, a portion 4232a of the second printed circuit board 423 may be provided in a shape (e.g., an avoidance shape) that does not overlap with the second connection region 1240 of the second frame 221. A portion (hereinafter, “avoidance region”) 4232a of the second printed circuit board 423 may be provided in a region 1260 between the second battery arrangement region 1202 and the second connection region 1240 of the second support portion 2211 of the second frame 221.

[0182] According to an embodiment, one or more electronic components 4233 may be arranged in the avoidance area 4232a of the second printed circuit board 423. One or more shielding members 4234 and 4235 may be arranged in the avoidance area 4232a of the second printed circuit board 423. For example, the shielding member 4234 may reduce electromagnetic interference to the one or more electronic components 4233.

[0183] According to an embodiment, the first region of the first flexible printed circuit board 461 The substrate support area 1270 may be disposed in an area (hereinafter, “substrate support area”) 1270 between the first battery arrangement area 1251 and the seventh frame B7 of the first frame 211. In a view viewed from above the first cover 212, the substrate support area 1270 may overlap with the third hinge module 6 (or the first sliding member 61). The first area on which the first flexible printed circuit board 461 is disposed The surface of the substrate support region 1270 may include a flat surface. The substrate support region 1270 may include a first connection region 1230 for connecting with the first sliding member 61 of the third hinge module 6. The substrate support region 1270 may include Figure 4 In the first transverse portion 401.

[0184] According to an embodiment, the first non-conductive member 1210 may be disposed in a first region of the first flexible printed circuit board 461. Between the substrate supporting region 1270 of the first frame 211. The substrate supporting region 1270 and the first region The spacing distance between the first non-conductive member 1210 can be provided to reduce the conductive material (or metal material) at least partially included in the substrate support area 1270 to the first area of ​​the first flexible printed circuit board 461. The first non-conductive member 1210 may be disposed in a first region of the first flexible printed circuit board 461. The first non-conductive member 1210 may be disposed in the first substrate supporting region 1270 of the first frame 211. For example, the first non-conductive member 1210 may include a non-conductive film or a non-conductive sheet. In various embodiments, the first non-conductive member 1210 may include a non-conductive adhesive material. In various embodiments, the first non-conductive member 1210 may be a flexible member (e.g., a sponge) or a rigid member. In the case where the first non-conductive member 1210 includes a flexible material or a buffer material, the external impact may be reduced from being transmitted to the first region of the first flexible printed circuit board 461. .

[0185] According to an embodiment, the flexible member 1220 may be disposed at a first region between the first cover 212 and the first flexible printed circuit board 461. The flexible member 1220 may be disposed in the first region of the first flexible printed circuit board 461. The flexible member 1220 may be disposed on the first cover 212. The flexible member 1220 may include a non-conductive material, thereby reducing the first area of ​​the first flexible printed circuit board 461. In an embodiment, the flexible member 1220 may be a sponge.

[0186] According to various embodiments, the flexible member 1220 may include a buffer material or a buffer member, and thus may reduce the external impact transmitted to the first region of the first flexible printed circuit board 461. .

[0187] According to various embodiments, the flexible member 1220 may include an adhesive material.

[0188] Fig.13 Shown are views of a portion of a foldable electronic device 2 according to an embodiment of the present disclosure, a cross-sectional view of the foldable electronic device 2 cut along line EE', a cross-sectional view of the foldable electronic device 2 cut along line F-F', and a cross-sectional view of the foldable electronic device 2 cut along line G-G'.

[0189] refer to Fig.13 In an embodiment, the foldable electronic device 2 may include a second frame 221, a first cover 212, a third hinge module 6, a hinge housing 23, a first plate 71, a second plate 72, a first display module 24, a second display module 25, a third printed circuit board 423, a second battery 432, a third flexible printed circuit board 463, a fourth flexible printed circuit board 464 and / or a third inner support body (e.g., a rear shell) 413.

[0190] According to an embodiment, the third inner supporter 413 may be positioned between the second support portion 2211 of the second frame 221 and the second display module 25. The third inner supporter 413 may be coupled to the second support portion 2211. The third inner supporter 413 may support the second display module 25.

[0191] According to an embodiment, the third inner support body 413 may cover the fourth end 4632 of the third flexible printed circuit board 463 and the sixth end 4642 of the fourth flexible printed circuit board 464. The third inner support body 413 may press the fourth end 4632 toward the connector C4 so that the fourth end 4632 of the third flexible printed circuit board 464 is not separated from the connector C4 of the third printed circuit board 423. The third inner support body 413 may press the sixth end 4642 toward the connector C6 so that the sixth end 4642 of the fourth flexible printed circuit board 464 is not separated from the connector C6 of the third printed circuit board 423.

[0192] Fig.14 is a view showing a portion of a foldable electronic device 2 according to an embodiment of the present disclosure. Fig.15 2 is a view showing a first battery 431 and a first flexible printed circuit board 461 according to an embodiment of the present disclosure. Fig.16 2 is a view showing a first antenna structure 451 and a first flexible printed circuit board 461 according to an embodiment of the present disclosure.

[0193] refer to Fig.14 , Fig.15 and Fig.16 The foldable electronic device 2 includes a first flexible printed circuit board 461. The foldable electronic device 2 may further include a first frame 211, a first printed circuit board 421, a first battery 431, a first printed circuit board 421, a second printed circuit board 422 and / or a first antenna structure 451.

[0194] According to an embodiment, after removing the first cover 212 (see Figure 2 ), the first antenna structure 451 may overlap the first battery 431. In various embodiments, the foldable electronic device 2 may further include a non-conductive support (or support member or support structure) at least partially positioned between the first antenna structure 451 and the first battery 431, and the non-conductive support may support the first antenna structure 451.

[0195] According to an embodiment, after removing the first cover 212 (see Figure 2 ) In a view viewed from above, the first flexible printed circuit board 461 may overlap with the first battery 431.

[0196] According to an embodiment, the foldable electronic device 2 may include a second flexible printed circuit board (e.g., battery FPCB) 1510 for electrically connecting the first battery 431 and the first printed circuit board 421. The second flexible printed circuit board 1510 may extend from the first battery 431. In various embodiments, the second flexible printed circuit board 1510 may be defined or interpreted as a part of the first battery 431.

[0197] According to an embodiment, after removing the first cover 212 (see Figure 2 ) in a view viewed from above, the first flexible printed circuit board 461 may include a second region overlapping with the second flexible printed circuit board 1510 The first flexible printed circuit board 461 is formed from the first area The area extending to the first end 4611 may include a portion located on the second flexible printed circuit board 1510 and the first cover 212 (see Figure 2 ) .

[0198] According to an embodiment, after removing the first cover 212 (see Figure 2 ) in a view viewed from above, the first flexible printed circuit board 461 may include a third area overlapping the first antenna structure 451 A partial area of ​​the first antenna structure 451 may be located on the first flexible printed circuit board 461 from the first area The area extending to the first end 4611 and the first cover 212 (see Figure 2 In an embodiment, the second area of ​​the first flexible printed circuit board 461 and the third region At least a portion of the same region may be included.

[0199] Fig.17 The present invention is a diagram showing an embodiment of the present invention. Fig.14 A cross-sectional view of the foldable electronic device 2 cut along the line HH′ in FIG. Fig.18 A view of a first flexible printed circuit board 461 according to an embodiment of the present disclosure and a cross-sectional view of the first flexible printed circuit board 461 cut along line KK′ are shown. Fig.19 is a view showing a first flexible printed circuit board 461 according to an embodiment of the present disclosure.

[0200] refer to Fig.17 , Fig.18 and Fig.19 The foldable electronic device 2 may include a first frame 211, a hinge housing 23, a first frame 211, a second plate 72, a first display module 24, a first inner support body 411, a first antenna structure 451, a first flexible printed circuit board 461, a second flexible printed circuit board (e.g., a battery FPCB) 1510, a first non-conductive member 1210, a second non-conductive member 1910 and / or a third non-conductive member 1920.

[0201] According to an embodiment, in a view viewed from above the first cover 212, the first flexible printed circuit board 461 may overlap the first antenna structure 451. In a view viewed from above the first cover 212, the first flexible printed circuit board 461 may overlap the first flexible printed circuit board 1510. In an embodiment, in a view viewed from above the first cover 212, the first flexible printed circuit board 461 may overlap the first flexible printed circuit board 1510. The region extending to the first end 4611 or the third portion 1103 of the first flexible printed circuit board 461 may overlap the first antenna structure 451 and / or the second flexible printed circuit board 1510 .

[0202] According to an embodiment, the third region of the first flexible printed circuit board 461 overlapping the first antenna structure 451 (See Fig.14 ) (eg, the third portion 1103) may include a first layer 1110, a second layer 1120, and a third layer 1130. The second layer 1120 may be disposed between the first layer 1110 and the third layer 1130. The first layer 1110 may be disposed between the second layer 1120 and the first cover 212. The first layer 1110 may include a first layer 1101 (see Fig.11 ) in the region 1101a, included in the rigid third portion 1103 (see Fig.11 ) in the region 1103a, included in the rigid fifth portion 1105 (see Fig.11 ) in the region 1105a and / or included in the rigid seventh portion 1107 (see Fig.11 ) in the region 1107a. The first layer 1110 may include an empty region 1102a between the two regions 1101a and 1103c, an empty region 1104a between the two regions 1103c and 1105a, and / or an empty region 1106a between the two regions 1105a and 1107a. The second layer 1120 may include a region 1106a included in the rigid first portion 1101 (see Fig.11 ) in the region 1101b, included in the flexible second portion 1102 (see Fig.11 ) in the region 1102b, included in the rigid third portion 1103 (see Fig.11 ) in the region 1103b, included in the flexible fourth portion 1104 (see Fig.11 ) in the region 1104b, included in the rigid fifth portion 1105 (see Fig.11 ) in the region 1105b, included in the flexible sixth portion 1106 (see Fig.11 ) in the region 1106b and / or included in the rigid seventh portion 1107 (see Fig.11) in the region 1107b. The third layer 1130 may include a layer included in the rigid first portion 1101 (see Fig.11 ) in the region 1101c, included in the flexible second portion 1102 (see Fig.11 ) in the region 1102c, included in the rigid third portion 1103 (see Fig.11 ) in the region 1103c, included in the flexible fourth portion 1104 (see Fig.11 ) in the region 1104c, included in the rigid fifth portion 1105 (see Fig.11 ) in the region 1105c, included in the flexible sixth portion 1106 (see Fig.11 ) in the region 1106c and / or included in the rigid seventh portion 1107 (see Fig.11 ) in area 1107c.

[0203] According to an embodiment, a plurality of signal lines 1820 (e.g., a first signal line 1821, a second signal line 1822, a third signal line 1823, a fourth signal line 1824, and / or a fifth signal line 1825) may be included in the second layer 1120. The third layer 1130 may include a ground plane 1830. The ground plane 1830 of the third layer 1130 may be positioned at a third region of the first antenna structure 451 and the first flexible printed circuit board 464. (See Fig.14 ), the third area Overlapping the first antenna structure 451 . The ground plane 1830 of the third layer 1130 may reduce or shield electromagnetic influence (eg, electromagnetic interference (EMI)) of the first antenna structure 451 or the fifth flexible printed circuit board 1510 on the plurality of signal lines 1820 .

[0204] According to an embodiment, the first layer 1110 may include a ground plane 1810. The ground plane 1810 of the first layer 1110 may be electrically connected to the ground plane 1830 of the third layer 1130. For example, the ground plane 1810 of the first layer 1110 and the ground plane 1830 of the third layer 1130 may be electrically connected through one or more vias included in the first flexible printed circuit board 461. The ground plane 1810 of the first layer 1110 may reduce or shield the electromagnetic influence (e.g., electromagnetic interference) of external noise traveling from the outside toward the first cover 212 on the plurality of signal lines 1820. The ground plane 1810 of the first layer 1110, the ground plane 1830 of the third layer 1130, and the current-carrying structure (e.g., one or more vias) between the ground planes 1810 and 1830 may become a ground structure that at least partially surrounds the plurality of signal lines 1820. The ground structure may reduce or shield electromagnetic interference to the plurality of signal lines 1820.

[0205] According to an embodiment, the second layer 1120 may further include a ground plane 1840. The ground plane 1840 may include a plurality of ground regions 1841, 1842, 1843, 1844, 1845, and 1846. One ground region 1841 may be positioned on one lateral portion of the first flexible printed circuit board 461. Another ground region 1846 may be positioned on another lateral portion of the first flexible printed circuit board 461. Each of the remaining ground regions 1842, 1843, 1844, and 1845 may be positioned between two signal lines. The ground plane 1840 of the second layer 1120 may be electrically connected to the ground plane 1810 of the first layer 1110 and the ground plane 1830 of the third layer 1130. For example, the ground plane 1840 of the second layer 1120 may be electrically connected to the ground plane 1810 of the first layer 1110 and / or the ground plane 1830 of the third layer 1130 through one or more vias included in the first flexible printed circuit board 461. The ground plane 1810 of the first layer 1110, the ground plane 1830 of the third layer 1130, the ground plane 1840 of the second layer 1120, and the current-carrying structures (e.g., one or more vias) between the plurality of ground planes 1810, 1830, and 1840 may become a ground structure that at least partially surrounds the plurality of signal lines 1820. The ground structure may reduce or shield electromagnetic interference to the plurality of signal lines 1820.

[0206] According to various embodiments, the number of layers included in the first flexible printed circuit board 461, the position or number of signal lines included in the first flexible printed circuit board 461, or the position, number, or shape of the ground plane are not limited to the illustrated example and may be various.

[0207] The first flexible printed circuit board 461 includes a first surface 461A and a second surface 461B oriented in a direction opposite to the first surface 461A. In an embodiment, the first surface 461A of the first flexible printed circuit board 461 may substantially face the first display area ① of the first display module 24 (see Figure 2 ), and the second surface 461B of the first flexible printed circuit board 461 may substantially face the first cover 212 (see Figure 2 ). The second surface 461B may be provided by the first layer 1110 or by a non-conductive material layer (eg, a coating or a protective layer) disposed on the first layer 1110. The first surface 461A may be provided by the third layer 1130 or by a non-conductive material layer (eg, a coating or a protective layer) disposed on the third layer 1130.

[0208] According to various embodiments, the first flexible printed circuit board 461 may further include a conductive member (e.g., a conductive sheet, a conductive film, or a conductive coating) disposed on the first layer 1110 or the third layer 1130. The conductive member (e.g., a conductive sheet, a conductive film, or a conductive coating) may be disposed on the first surface 461A or the second surface 461B. The conductive member (e.g., a shielding member) may be electrically connected to a ground structure included in the first flexible printed circuit board 461. The conductive member may reduce or shield electromagnetic interference to the plurality of signal lines 1821, 1822, 1823, 1824, and 1825. In an embodiment, the conductive member disposed on the first surface 461A or the second surface 461B of the first flexible printed circuit board 461 may be a graphite sheet or a graphite layer.

[0209] According to an embodiment, after removing the first cover 212 (see Figure 2 ) from above, the area (or first area) of the first flexible printed circuit board 461 that does not overlap with the first antenna structure 451 ) and / or at least a portion of the first flexible printed circuit board 461 and the substrate support area 1270 (see Fig.17 ) overlapped area (or first area ) may be implemented such that a plurality of signal lines are included in the first layer 1110. For example, the first flexible printed circuit board 461 and the substrate support area 1270 (see Fig.17 ) and not overlapping with the first antenna structure 451 may be implemented such that a plurality of signal lines are included in the first layer 1110. In various embodiments, the first flexible printed circuit board 461 is provided from the first region to the At least a portion of the region extending to the first end 4611 may be implemented such that a plurality of signal lines are included in the first layer 1110 .

[0210] According to an embodiment, in a view viewed from above the first cover 212, the second non-conductive member 1910 may be at least partially disposed in a region of the first flexible printed circuit board 461 that overlaps with the fifth flexible printed circuit board 1510 (eg, Fig.14 The second area in ). The second non-conductive member 1910 may be positioned between the first flexible printed circuit board 461 and the fifth flexible printed circuit board 1510. The second non-conductive member 1910 may be disposed on the first surface 461A of the first flexible printed circuit board 461. For example, the second non-conductive member 1910 may include a non-conductive film, a non-conductive sheet, or a non-conductive coating. The spacing distance between the first flexible printed circuit board 461 and the second flexible printed circuit board 1510 may be provided by the second non-conductive member 1910, thereby reducing the electromagnetic influence (e.g., electromagnetic interference (EMI)) of the second flexible printed circuit board 1510 on the first flexible printed circuit board 461.

[0211] According to various embodiments, a conductive member (eg, a conductive sheet, a conductive film, or a conductive coating) may replace the second non-conductive member 1910, and the conductive member may be electrically connected to a ground structure included in the first flexible printed circuit board 461. For example, the conductive member may include a graphite sheet or a graphite layer.

[0212] According to an embodiment, the third non-conductive member 1920 may be disposed on the first flexible printed circuit board 461 from the first region The third non-conductive member 1920 may be disposed on the first surface 461A of the first flexible printed circuit board 461. For example, the third non-conductive member 1920 may include a non-conductive film, a non-conductive sheet, or a non-conductive coating. The spacing distance between the first flexible printed circuit board 461 and the conductive element may be provided by the third non-conductive member 1920, thereby reducing the conductive element (e.g., various electrical elements, such as Fig.10 The battery 431 in the embodiment of the present invention is used to prevent electromagnetic influence (eg, electromagnetic interference (EMI)) on the first flexible printed circuit board 461.

[0213] According to various embodiments, a conductive member (eg, a conductive sheet, a conductive film, or a conductive coating) may replace the third non-conductive member 1920, and the conductive member may be electrically connected to a ground structure included in the first flexible printed circuit board 461. For example, the conductive member may include a graphite sheet or a graphite layer.

[0214] According to various embodiments, a conductive member (eg, a conductive sheet, a conductive film, or a conductive coating) may replace the first non-conductive member 1210, and the conductive member may be electrically connected to a ground structure included in the first flexible printed circuit board 461. For example, the conductive member may include a graphite sheet or a graphite layer.

[0215] Fig. 20 The present invention is a diagram showing an embodiment of the present invention. Fig.14 A cross-sectional view of the foldable electronic device 2 cut along line II' in FIG. Fig.21 is a perspective view showing a portion of the foldable electronic device 2 according to an embodiment of the present disclosure.

[0216] refer to Fig. 20 and Fig.21 The foldable electronic device 2 may include a first frame 211 , a first hinge module 5A, a second hinge module 5B, a first cover 212 , a first display module 24 , a first battery 431 and / or a third printed circuit board 463 .

[0217] According to one embodiment, the substrate supporting region 1270 included in the first supporting portion 2111 of the first frame 211 may include one or more recesses 2010 and 2020. The one or more recesses 2010 and 2020 may reduce the substrate supporting region 1270 made of a conductive material or metal included in the substrate supporting region 1270 from contacting the first region of the first flexible printed circuit board 461. (See Fig.14 ) to reduce electromagnetic influences (eg, electromagnetic interference (EMI)). In various embodiments, one or more recesses 2010 and 2020 may be replaced with openings (or through holes).

[0218] Fig. 22 The present invention is a diagram showing an embodiment of the present invention. Fig.14 A cross-sectional view of the foldable electronic device 2 cut along the line JJ' in FIG.

[0219] refer to Fig. 22 The foldable electronic device 2 may include a first frame 211, a second frame 221, a hinge housing 23, a first plate 71, a second plate 72, a first cover 212, a first display module 24, a second display module 25, a third printed circuit board 423, a first battery 431, a second battery 432, a first flexible printed circuit board 461, a third flexible printed circuit board 463, a first non-conductive member 1210, a flexible member 1220, a first sealing portion 2210 and / or a second sealing portion 2220.

[0220] According to an embodiment, the first sealing portion (sealing part) (or the first waterproof portion, the first waterproof member, the first sealing member or the first sealing material) 2210 may be arranged in the first opening 501 of the first frame 211. The second sealing portion (or the second waterproof portion, the second waterproof member, the second sealing member or the second sealing material) 2220 may be arranged in the second opening 502 of the second frame 221. Although not shown here, the third sealing portion (or the third waterproof portion, the third waterproof member, the third sealing member or the third sealing material) may be provided in the third opening 503 of the first frame 211 (see Figure 5Although not shown here, the fourth sealing portion (or fourth waterproof portion, fourth waterproof member, fourth sealing member or fourth sealing material) may be provided in the fourth opening 504 of the second frame 221 (see Figure 5 ). In an embodiment, the first sealing portion 2210, the second sealing portion 2220, the third sealing portion, or the fourth sealing portion may be formed after an adhesive material (e.g., cured in place gasket (CIPG)) is filled therein and then the filled adhesive material is cured (e.g., cured by photoreaction or thermal reaction). The first sealing portion 2210 may reduce or prevent foreign matter such as moisture or dust from moving through the first opening 501. The second sealing portion 2220 may reduce or prevent foreign matter such as moisture or dust from moving through the second opening 502. The third sealing portion may reduce or prevent foreign matter such as moisture or dust from moving through the third opening 503 (see Figure 5 The fourth sealing portion may reduce or prevent foreign matter such as moisture or dust from moving through the fourth opening 504 (see Figure 5 ).

[0221] According to an embodiment, the third flexible printed circuit board 463 may extend through the first sealing portion 2210 provided in the first opening 501 and the second sealing portion 2220 provided in the second opening 502. The third flexible printed circuit board 463 may be connected to the first frame 211 through the first sealing portion 2210, and may be connected to the second frame 221 through the second sealing portion 2220. The fourth flexible printed circuit board 464 (see Figure 4 ) may extend through the third opening 503 (see Figure 5 ) and the third sealing portion disposed in the fourth opening 504 (see Figure 5 ) in the fourth sealing portion. The fourth flexible printed circuit board 464 (see Figure 4 ) may be connected to the first frame 211 through a third sealing portion, and may be connected to the second frame 221 through a fourth sealing portion.

[0222] According to an embodiment, the recess 2020 included in the substrate supporting region 1270 included in the first frame 211 may reduce electromagnetic influence (eg, electromagnetic interference (EMI)) of the substrate supporting region 1270 made of a conductive material or metal included in the substrate supporting region 1270 on the first region of the first flexible printed circuit board 461 .

[0223] According to an exemplary embodiment of the present disclosure, a foldable electronic device 2 may include a foldable housing 20, a flexible display module (e.g., a first display module 24), a first flexible printed circuit board 461, and a first non-conductive member 1210. The foldable housing 20 may include a first housing 21, a second housing 22, and a hinge portion H configured to connect the first housing 21 and the second housing 22. The flexible display module (e.g., the first display module 24) may include a first display area ①, a second display area ②, and a third display area ③. The first display area ① may be disposed in the first housing 21. The second display area ② may be disposed in the second housing 22. The third display area ③ may be positioned to correspond to the hinge portion H. The third display area ③ may correspond between the first display area ① and the second display area ② of the flexible display module 24. The first flexible printed circuit board 461 may be accommodated in the first housing 20. The first flexible printed circuit board 461 may include a first surface 461A facing the first display area ① and a second surface 461B oriented in a direction opposite to the first surface 461A. The first non-conductive member 1210 may be disposed between the first surface 461A of the first flexible printed circuit board 461 and the first housing 21. The first housing 21 may include a first lateral portion 401 connected to the hinge portion H. The first lateral portion 401 may include a metal material. The second housing 22 may include a second lateral portion 402 connected to the hinge portion H. In a view viewed from above the second surface 461B, the first flexible printed circuit board 461 may include a first area , the first region The first non-conductive member 1210 may be disposed in the first region. and the first lateral portion 401. Therefore, the first flexible printed circuit board 461 is disposed in a limited space inside the foldable electronic device 2 by utilizing the portion of the first housing 21 connected to the hinge portion H, thereby improving space efficiency, and the electromagnetic influence exerted on the first flexible printed circuit board 461 by the portion connected to the hinge portion H is reduced by the non-conductive member 1210, thereby ensuring the integrity of the signal transmitted through the first flexible printed circuit board 461.

[0224] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a third flexible printed circuit board 463, which is accommodated in the foldable housing 20 and is disposed to intersect the hinge portion H. In a view viewed from above the second surface 461B, the first area Overlaps with the third flexible printed circuit board 463. Therefore, the first flexible printed circuit board 461 is disposed in a limited space inside the foldable electronic device 2 by utilizing a portion of the first housing 21 connected to the hinge portion H, thereby improving space efficiency.

[0225] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may include a non-conductive member disposed between the first flexible printed circuit board 461 and the third flexible printed circuit board 463 at a portion where the first flexible printed circuit board 461 and the third flexible printed circuit board 463 overlap. Therefore, a spacing distance between the first flexible printed circuit board 461 and the third flexible printed circuit board 463 may be provided by the non-conductive member, thereby reducing an electromagnetic influence (e.g., electromagnetic interference (EMI)) of the third flexible printed circuit board 463 on the first flexible printed circuit board 461.

[0226] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a fourth flexible printed circuit board 464, which is accommodated in the foldable housing 20 and is disposed to cross the hinge portion H. In a view observed from above the second surface 461B, the first flexible printed circuit board 461 does not overlap with the fourth flexible printed circuit board 464. Therefore, since the fourth flexible printed circuit board 464 is spaced apart from the first flexible printed circuit board 461 in a view observed from above the second surface 461B, an electromagnetic influence (e.g., electromagnetic interference (EMI)) of the fourth flexible printed circuit board 464 on the first flexible printed circuit board 461 is reduced.

[0227] According to an exemplary embodiment of the present disclosure, the hinge portion H may include a first hinge module 5A, a second hinge module 5B, and a third hinge module 6. The third hinge module 6 may be positioned between the first hinge module 5A and the second hinge module 5B. In a view viewed from above the second surface 461B, the first area It may overlap with the third hinge module 6. In the unfolded state of the foldable electronic device 2, the first hinge module 5A, the second hinge module 5B, the third hinge module 6, the first plate 71 and the second plate 72 may reduce or prevent the sagging or wrinkling of the third display area ③, while providing space-efficient integration in a limited space.

[0228] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a third flexible printed circuit board 463 and a fourth flexible printed circuit board 464. The third flexible printed circuit board 463 may be accommodated in the foldable housing 20, and may be disposed as a portion between the first hinge module 5A and the third hinge module 6 across the hinge portion H. The fourth flexible printed circuit board 464 may be accommodated in the foldable housing 20, and may be disposed as a portion between the second hinge module 5B and the third hinge module 6 across the hinge portion H. Therefore, the third flexible printed circuit board 463 and the fourth flexible printed circuit board 464 are disposed in a limited space within the foldable electronic device 2 by utilizing a portion of the first housing 21 connected to the hinge portion H, thereby improving space efficiency.

[0229] According to an exemplary embodiment of the present disclosure, the first flexible printed circuit board 461 may be an FRC.

[0230] According to an exemplary embodiment of the present disclosure, the first housing 21 may include a first frame 211 and a first cover 212 disposed on the first frame 211. The first frame 211 may include a first side 2112 and a first support portion 2111. The first side 2112 may be configured to surround at least a portion of a space between the first display area ① and the first cover 212. The first support portion 2111 may be positioned in the space between the first display area ① and the first cover 212 and connected to the first side 2112. The first support portion 2111 may be positioned between the first display area ① and the first flexible printed circuit board 461. The conductive portion included in the first side 2122 may be electrically connected to a wireless communication circuit (e.g., Figure 1 Therefore, through the first flexible printed circuit board 461, the wireless communication circuit can process the signal (or RF signal) transmitted or received through the antenna radiator.

[0231] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a first printed circuit board 421, a second printed circuit board 422, and a battery 431 housed in the first housing 21. In a view viewed from above the second surface 461B, the battery 431 may be positioned between the first printed circuit board 421 and the second printed circuit board 422. The first printed circuit board 421 and the second printed circuit board 422 may be electrically connected via the first flexible printed circuit board 461. In a view viewed from above the second surface 461B, the first region 461 may be electrically connected to the first flexible printed circuit board 461. It may be positioned to be spaced apart from the battery 431. Therefore, since the battery 431 is spaced apart from the first flexible printed circuit board 461 in a view viewed from above the second surface 461B, an electromagnetic influence (eg, electromagnetic interference (EMI)) of the battery 431 on the first flexible printed circuit board 461 is relatively reduced.

[0232] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a second non-conductive member 1910 disposed on the first flexible printed circuit board 461, a battery 431 accommodated in the first housing 21, and a second flexible printed circuit board 1510 extending from the battery 431. In a view observed from above the second surface 461B, the first flexible printed circuit board 461 may include a second region configured to overlap with the second flexible printed circuit board 1510. The second non-conductive member 1910 may be positioned in the second region Since the spacing distance between the first flexible printed circuit board 461 and the second flexible printed circuit board 1510 is provided by the second non-conductive member 1910, electromagnetic influence (eg, electromagnetic interference (EMI)) of the second flexible printed circuit board 1510 on the first flexible printed circuit board 461 is reduced.

[0233] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include an antenna structure (e.g., a first antenna structure 451) housed in the first housing 21. The antenna structure may include a coil. In a view viewed from above the second surface 461B, the first flexible printed circuit board 461 may include a third region configured to overlap with the antenna structure. . The third area The first layer 1110, the third layer 1130, and the second layer 1120 positioned between the first layer 1110 and the third layer 1130 may be included. The second layer 1120 may include a plurality of signal lines. The first layer 1110 may include a ground plane 1810. The third layer 1130 may include a ground plane 1830. Therefore, the ground plane 1810 of the first layer 1110 reduces or shields the electromagnetic influence (e.g., electromagnetic interference) of external noise traveling from the outside on the plurality of signal lines 1820. The ground plane 1810 of the first layer 1110 and the ground plane 1830 of the third layer 1130 may become a ground structure that at least partially surrounds the plurality of signal lines 1820 to reduce or shield electromagnetic interference to the plurality of signal lines 1820.

[0234] According to an exemplary embodiment of the present disclosure, the first lateral portion 401 may include a first region provided in the first lateral portion 401. One or more recesses (2010 and 2020) or openings in the overlapped portion. One or more recesses 2010 and 2020 reduce the first area of ​​the first lateral portion 401 including metal or conductive material to the first flexible printed circuit board 461. electromagnetic influences (e.g., electromagnetic interference (EMI)).

[0235] According to an exemplary embodiment of the present disclosure, the first flexible printed circuit board 461 includes one or more rigid parts (e.g., the first part 1101, the third part 1103, the fifth part 1105, and the seventh part 1107) and one or more flexible parts (e.g., the second part 1102, the fourth part 1104, and the sixth part 1106). Therefore, in the case where there is a height difference between positions where the rigid parts are provided in the foldable electronic device 2, due to the one or more flexible parts, stress (eg, bending stress) generated in the portion between the rigid parts can be reduced.

[0236] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a flexible member 1220, which is disposed on the second surface 461B to correspond to the first area. Since the flexible member 1220 is disposed in the second surface 461B to correspond to the first area , thus reducing the transmission to the first area of ​​the first flexible printed circuit board 461 external shocks.

[0237] According to an exemplary embodiment of the present disclosure, the hinge portion H may include a hinge housing 23. When the foldable housing 20 is switched from the unfolded state to the folded state, the hinge housing 23 may be exposed to the outside through the open gap between the first lateral portion 401 and the second lateral portion 402. Therefore, since the hinge housing 23 becomes the outer portion covering the inside of the foldable electronic device 2 exposed through the open gap between the first housing 21 and the second housing 22, the optical appearance may be maintained even in the folded state.

[0238] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may include a foldable housing 20, a flexible display module (e.g., a first display module 24), a first flexible printed circuit board 461, a third flexible printed circuit board 463, and a first non-conductive member 1210. The foldable housing 20 may include a first housing 21, a second housing 22, and a hinge portion H configured to connect the first housing 21 and the second housing 22. The flexible display module (e.g., the first display module 24) may include a first display area ①, a second display area ②, and a third display area ③. The first display area ① may be disposed in the first housing 21. The second display area ② may be disposed in the second housing 22. The third display area ③ may be positioned to correspond to the hinge portion H. The third display area ③ may correspond between the first display area ① and the second display area ② of the flexible display module 24. The first flexible printed circuit board 461 may be housed in the first housing 20, and may include a first surface 461A facing the first display area ① and a second surface 461B oriented in a direction opposite to the first surface 461A. The third flexible printed circuit board 463 may be housed in the foldable housing 20 and disposed to cross the hinge portion H. The first non-conductive member 1210 may be disposed between the first surface 461A of the first flexible printed circuit board 461 and the first housing 21. The first housing 21 may include a first lateral portion 401 connected to the hinge portion H. The first lateral portion 401 may include a metal material. The second housing 22 may include a second lateral portion 402 connected to the hinge portion H. In a view viewed from above the second surface 461B, the first flexible printed circuit board 461 may include a first area , the first region The first non-conductive member 1210 may be disposed in the first region. and between the first lateral portion 401. When viewed from above the second surface 461B, the first region The first flexible printed circuit board 461 may overlap with the third flexible printed circuit board 463. Therefore, the first flexible printed circuit board 461 is disposed in a limited space inside the foldable electronic device 2 by utilizing the portion of the first housing 21 connected to the hinge portion H, thereby improving space efficiency, and the electromagnetic influence exerted on the first flexible printed circuit board 461 by the portion connected to the hinge portion H is reduced by the non-conductive member 1210, thereby ensuring the integrity of the signal transmitted through the first flexible printed circuit board 461.

[0239] According to an exemplary embodiment of the present disclosure, the first flexible printed circuit board 461 may be an FRC.

[0240] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a second non-conductive member 1910 disposed on the first flexible printed circuit board 461, a battery 431 accommodated in the first housing 21, and a second flexible printed circuit board 1510 extending from the battery 431. In a view observed from above the second surface 461B, the first flexible printed circuit board 461 may include a second region configured to overlap with the second flexible printed circuit board 1510. The second non-conductive member 1910 may be positioned in the second region and the second flexible printed circuit board 1510 .

[0241] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include an antenna structure (e.g., a first antenna structure 451) housed in the first housing 21. The antenna structure may include a coil. In a view viewed from above the second surface 461B, the first flexible printed circuit board 461 may include a third region configured to overlap with the antenna structure. . The third area The first layer 1110, the third layer 1130, and the second layer 1120 positioned between the first layer 1110 and the third layer 1130 may be included. The second layer 1120 may include a plurality of signal lines. The first layer 1110 may include a ground plane 1810. The third layer 1130 may include a ground plane 1830.

[0242] According to an exemplary embodiment of the present disclosure, the first lateral portion 401 may include a first region provided in the first lateral portion 401. One or more recesses (2010 and 2020) or openings in the overlapping portions.

[0243] The embodiments disclosed in the present disclosure and the accompanying drawings are only specific examples presented to easily describe the technical content and help understand the embodiments, and are not intended to limit the scope of the embodiments. Therefore, in conjunction with the scope of the various embodiments of the present disclosure, the scope of the various embodiments of the present disclosure should be interpreted as including not only the embodiments disclosed herein, but also their changed or modified forms.

Claims

1. A foldable electronic device (2), comprising: A foldable shell (20) comprising a first shell (21), a second shell (22), and a hinge portion (H) connecting the first shell (21) and the second shell (22); A flexible display module (24), comprising a first display area (①) arranged in the first shell (21), a second display area (②) arranged in the second shell (22), and a third display area (③) positioned between the first display area (①) and the second display area (②) to correspond to the hinge portion (H); A first flexible printed circuit board (461) housed in the first housing (21) and comprising a first surface (461A) facing the first display area (①) and a second surface (461B) oriented in a direction opposite to the first surface (461A); as well as A first non-conductive member (1210) is disposed between the first surface (461A) of the first flexible printed circuit board (461) and the first housing (21). The first housing (21) comprises a first transverse portion (401), the first transverse portion (401) is connected to the hinge portion (H) and comprises a metal material, wherein the second housing (22) comprises a second transverse portion (402) connected to the hinge portion (H), Wherein, in a view observed from above the second surface (461B), the first flexible printed circuit board (461) includes a first area (461) facing the first lateral portion (401) and overlapping with the first lateral portion (401). ),as well as The first non-conductive member (1210) is arranged in the first area ( ) and the first transverse portion (401).

2. The electronic device according to claim 1, further comprising a third flexible printed circuit board (463), the third flexible printed circuit board (463) being accommodated in the foldable housing (20) and arranged to cross the hinge portion (H), and in, In a view viewed from above the second surface (461B), the first region ( ) overlaps with the third flexible printed circuit board (463).

3. The electronic device according to claim 2, further comprising a non-conductive member, the non-conductive member being disposed between the first flexible printed circuit board (461) and the third flexible printed circuit board (463) at a portion where the first flexible printed circuit board (461) and the third flexible printed circuit board (463) overlap.

4. The electronic device according to any one of claims 1 to 3, further comprising a fourth flexible printed circuit board (464), the fourth flexible printed circuit board (464) being accommodated in the foldable housing (20) and arranged to cross the hinge portion (H), wherein: In a view viewed from above the second surface (461B), the first flexible printed circuit board (461) does not overlap with the fourth flexible printed circuit board (464).

5. The electronic device according to any one of claims 1 to 4, wherein the hinge portion (H) comprises a first hinge module (5A), a second hinge module (5B) and a third hinge module (6), wherein the third hinge module (6) is positioned between the first hinge module (5A) and the second hinge module (5B), and in, In a view viewed from above the second surface (461B), the first region ( ) overlaps with the third hinge module (6).

6. The electronic device according to claim 5, wherein the third flexible printed circuit board (463) is arranged to span a portion between the first hinge module (5A) and the third hinge module (6) of the hinge portion (H); and / or The fourth flexible printed circuit board (464) is arranged to span a portion of the hinge portion (H) between the second hinge module (5B) and the third hinge module (6).

7. The electronic device according to any one of claims 1 to 6, wherein the first flexible printed circuit board (461) comprises a flexible RF cable (FRC).

8. The electronic device according to any one of claims 1 to 7, wherein the first housing (21) comprises a first frame (211) and a first cover (212) disposed on the first frame (211), The first frame (211) comprises a first side (2112) and a first support portion (2111), the first side (2112) being configured to surround at least a portion of a space between the first display area (①) and the first cover (212), the first support portion (2111) being positioned in the space and connected to the first side (2112), wherein the first supporting portion (2111) is positioned between the first display area (①) and the first flexible printed circuit board (461), and The conductive portion included in the first side (2122) is electrically connected to a wireless communication circuit (192) housed in the first housing (21) via the first flexible printed circuit board (461).

9. The electronic device according to any one of claims 1 to 8, further comprising a first printed circuit board (421), a second printed circuit board (422) and a battery (431) housed in the first housing (21), in, In a view viewed from above the second surface (461B), the battery (431) is positioned between the first printed circuit board (421) and the second printed circuit board (422), wherein the first printed circuit board (421) and the second printed circuit board (422) are electrically connected via the first flexible printed circuit board (461); and wherein, in a view viewed from above the second surface (461B), the first region ( ) is positioned to be spaced apart from the battery (431).

10. The electronic device according to any one of claims 1 to 8, further comprising: A second non-conductive member (1910) is disposed on the first flexible printed circuit board (461); as well as a battery (431) housed in the first housing (21) and a second flexible printed circuit board (1510) extending from the battery (431), Wherein, in a view observed from above the second surface (461B), the first flexible printed circuit board (461) includes a second area ( ),as well as wherein the second non-conductive member (1910) is positioned in the second region ( ) and the second flexible printed circuit board (1510).

11. The electronic device according to any one of claims 1 to 10, further comprising an antenna structure (451) accommodated in the first housing (21) and comprising a coil, in, In a view viewed from above the second surface (461B), the first flexible printed circuit board (461) includes a third area ( ), wherein the third region ( ) includes a first layer (1110), a third layer (1130), and a second layer (1120) positioned between the first layer (1110) and the third layer (1130), The second layer (1120) includes a plurality of signal lines. wherein the first layer (1110) comprises a ground plane (1810), and Wherein the third layer (1130) includes a ground plane (1830).

12. The electronic device according to any one of claims 1 to 11, wherein the first lateral portion (401) comprises a first area ( ) one or more recesses (2010, 2020) or openings in the overlapping portions.

13. The electronic device according to any one of claims 1 to 12, wherein the first flexible printed circuit board (461) comprises one or more rigid parts (1101, 1103, 1105 and 1107) and one or more flexible parts (1102, 1104 and 1106), and The first region ( ) is included in the one or more rigid parts (1101, 1103, 1105 and 1107).

14. The electronic device according to any one of claims 1 to 13, further comprising a ) of a flexible member (1220).

15. The electronic device according to any one of claims 1 to 14, wherein the hinge portion (H) comprises a hinge housing (23), and in, In the folded state of the foldable housing (20), the hinge housing (23) is exposed to the outside through an open gap between the first lateral portion (401) and the second lateral portion (402).

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