Heat pipe and heat conduction substrate welding device for aerospace electronic equipment

Abstract

A heat pipe and heat conduction substrate welding device for aerospace electronic equipment comprises a pressing plate and a supporting plate which are arranged on the upper surface and the lower surface of a heat conduction substrate in a pressing mode respectively. A pressing strip is arranged on the upper surface of the pressing plate and right above each welding surface, and a space for pressing the heat pipe is reserved between the pressing plate and each welding surface; and a supporting unit is arranged between the supporting plate and each welding surface. By means of reasonable arrangement of component structures, poor welding quality and stability caused by the fact that local areas of the heat pipes are not in complete contact with welding faces in the welding process are avoided, effective welding of the heat pipes and the heat conduction substrate in the high-temperature environment is achieved, and meanwhile compactness and light weight of the welding device are guaranteed. The whole device is easy to implement, efficiency is greatly improved, labor, time and cost are saved, welding quality and stability of the heat pipe are improved, and heat dissipation reliability of aerospace electronic equipment is guaranteed.

Description

Technical Field

[0001] The invention belongs to the technical field of spacecraft electronic products, and in particular relates to a heat pipe and heat-conducting substrate welding device for aerospace electronic equipment. Background Art

[0002] Spacecraft electronic products are subject to harsh thermal environments during the pre-research and on-orbit flight stages. In order to ensure the stability of spacecraft product operation and prevent thermal failure, effective heat dissipation must be performed on heat-generating components. With the increasing sophistication and high performance of electronic equipment, how to effectively remove heat in a limited space has become an important challenge. Ultra-thin heat pipes are the main tool for achieving efficient heat dissipation solutions. With their excellent thermal conductivity and compact design, they have become an ideal choice for aerospace electronic equipment application scenarios.

[0003] Heat pipe welding is achieved by placing a welding sheet between the heat expansion plate and the heat pipe, pressing the heat pipe, welding sheet and heat expansion plate with a welding tool, and then placing them in a high-temperature oven to melt the solder at high temperature to achieve welding between the heat pipe and the casing. In actual engineering applications, it is found that during high-temperature welding, the upper and lower pressure plates are too thin, resulting in insufficient strength. The thermal deformation of the material at high temperature causes the upper and lower pressure plates to warp, which also causes some parts of the heat pipe to warp accordingly, resulting in inadequate welding; the clamping device itself is not strong enough, and the thermal deformation of the upper and lower pressure plates causes plastic deformation of the clamping device, which also causes some parts of the heat pipe to fail to fully contact the casing during welding, resulting in welding defects. In addition, the different welding positions of heat pipes on different thermal conductive substrates require the upper and lower pressure plates to be redesigned and put into production, and a unified design cannot be achieved, which greatly increases the heat pipe welding cycle. The current solution is to design a new welding tool for the thermal conductive substrate, increase the thickness of the pressure plate, and greatly increase the number of pressing points, which makes the entire welding device bulky, affects work efficiency, and reduces welding quality and stability. Summary of the invention

[0004] In view of the above problems, the purpose of the present invention is to provide a heat pipe and heat conductive substrate welding device for aerospace electronic equipment to solve the problem that during the high-temperature welding process of the heat pipe, the material deforms and warps, resulting in incomplete welding and poor welding quality and stability.

[0005] To achieve the above object, the technical solution adopted by the present invention includes:

[0006] A device for welding heat pipes and heat-conducting substrates for aerospace electronic equipment comprises a pressing plate and a supporting plate respectively pressed on the upper surface and the lower surface of the heat-conducting substrate; a pressing strip is provided on the upper surface of the pressing plate just above each welding surface, and a space for pressing the heat pipe is reserved between the pressing plate and each welding surface; a supporting unit is provided between the supporting plate and each welding surface.

[0007] Preferably, the support unit comprises a support bar located directly below each welding surface, and at least one support boss is provided between any support bar and the welding surface.

[0008] Preferably, second limiting sliding grooves are provided on opposite sides of the support plate, and each support bar is limitedly slidably disposed between two second limiting sliding grooves.

[0009] Preferably, the support bar is provided with a third limiting sliding groove along its axial direction, and each supporting boss is slidingly limited on the third limiting sliding groove through a limiting shaft.

[0010] Preferably, first limiting sliding grooves are provided on opposite sides of the pressing plate, and each pressing strip is limitedly slidably disposed between two second limiting sliding grooves.

[0011] Preferably, reinforcing ribs are provided around the pressing plate.

[0012] Furthermore, at least one clamping mechanism is provided between the upper surface of each clamping strip and the bottom surface of the support plate.

[0013] Preferably, the clamping mechanism includes a positioning clamp clamped between the upper surface of any clamping strip and the bottom surface of the support plate, and also includes a clamping shaft passing through the positioning clamp from top to bottom and pressed against the upper surface of the clamping strip.

[0014] Preferably, the positioning clamp and the clamping shaft are threadedly connected.

[0015] Preferably, each clamping strip is provided with two clamping mechanisms.

[0016] Compared with the prior art, the advantages of the present invention are:

[0017] (1) The heat pipe and thermally conductive substrate welding device for aerospace electronic equipment of the present invention avoids the situation that a local area of ​​the heat pipe fails to fully contact the welding surface during the welding process, resulting in poor welding quality and stability, by reasonably arranging the component structure, thereby achieving effective welding of the heat pipe and the thermally conductive substrate in a high temperature environment, while ensuring the compactness and lightness of the welding device; the entire device is easy to implement, greatly improving efficiency, saving manpower and time costs, and improving the welding quality and stability of the heat pipe, thereby ensuring the heat dissipation reliability of aerospace electronic equipment.

[0018] (2) The heat pipe and heat conductive substrate welding device for aerospace electronic equipment of the present invention can meet the different welding positions of heat pipes on heat conductive substrates of different structural forms through the reasonable arrangement of the component structure and the design of each slide groove, and can facilitate the adjustment of the specific positions of the pressure plate, support bar and support boss, and is sufficient to adapt to various heat pipe welding position working conditions.

[0019] (3) The heat pipe and heat conductive substrate welding device for aerospace electronic equipment of the present invention can ensure the strength of the device and reduce the thermal capacity of the heat pipe welding device system through the reasonable arrangement of the component structure and the design of the reinforcing ribs. The welding part can quickly reach the predetermined welding temperature, thus saving welding time and improving the uniformity and stability of the welding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0021] Figure 1 It is a schematic diagram of welding a heat pipe and a heat-conducting substrate in the background technology;

[0022] Figure 2 This is a schematic diagram of the structure of the welding device of this application;

[0023] Figure 3 for Figure 2 Exploded diagram of

[0024] Figure 4 for Figure 2 Schematic diagram of the structure of the medium pressure plate;

[0025] Figure 5 for Figure 2 Structural schematic diagram of the middle support plate;

[0026] Figure 6 for Figure 5 Schematic diagram of the structure of the middle support bar;

[0027] The symbols in the figure represent:

[0028] a thermal conductive substrate, a0 welding surface, b heat pipe;

[0029] 1 pressure plate, 1-0 first limiting slide, 1-1 pressing strip, 1-2 reinforcing rib;

[0030] 2 support plate, 2-0 second limiting slide groove, 2-1 support bar, 2-10 third limiting slide groove, 2-2 support boss, 2-20 limiting shaft;

[0031] 3 clamping mechanism, 3-1 positioning clamp, 3-2 clamping shaft. DETAILED DESCRIPTION

[0032] The invention is not limited to the following specific embodiments, and all equivalent changes made on the basis of the technical solution of this application fall within the protection scope of the invention.

[0033] It should be noted that the directional terms mentioned in this article, such as "upper surface", "bottom surface", "surroundings", etc., are consistent with the specific directions on the paper of the drawings in the specification or the corresponding directions of the space shown in the drawings; all components and equipment in the present invention, unless otherwise specified, are all components and equipment known in the prior art.

[0034] Example

[0035] This embodiment discloses a heat pipe and heat conductive substrate welding device for aerospace electronic equipment, comprising a pressing plate 1 and a supporting plate 2 respectively pressed on the upper surface and the lower surface of the heat conductive substrate a; a pressing strip 1-1 is provided on the upper surface of the pressing plate 1 just above each welding surface a0, and a space for pressing a heat pipe b is reserved between the pressing plate 1 and each welding surface a0; a supporting unit is provided between the supporting plate 2 and each welding surface a0;

[0036] Its function is: when welding the heat pipe b on the welding surface a0 of the high-temperature welding thermal conductive substrate a, the pressing plate 1 and the supporting plate 2 clamp the thermal conductive substrate a and the heat pipe b, so that each heat pipe b is fully contacted with the thermal conductive substrate a through the cooperation of the supporting unit and the pressing strip 1-1, and sufficient pressing points are provided to avoid that the local area of ​​the heat pipe b fails to fully contact the welding surface a0 during the welding process, resulting in poor welding quality and stability, so as to achieve effective welding of the heat pipe b and the thermal conductive substrate a in a high temperature environment, while ensuring the compactness and lightweight of the welding device; the entire device is easy to implement, greatly improves the welding efficiency, saves manpower and time costs, and improves the welding quality and stability of the heat pipe, ensuring the heat dissipation reliability of aerospace electronic equipment.

[0037] The support unit disclosed in this embodiment includes a support bar 2-1 located directly below each welding surface a0, and at least one support boss 2-2 is provided between any support bar 2-1 and the welding surface a0. The number of support bosses 2-2 is determined according to the length / size of the heat pipe in actual application to ensure sufficient support strength.

[0038] The pressing plate 1 disclosed in this embodiment is provided with a first limiting sliding groove 1-0 on the opposite side, and each pressing strip 1-1 is limited and slidably disposed between two second limiting sliding grooves 2-0; the supporting plate 2 is provided with a second limiting sliding groove 2-0 on the opposite side, and each supporting strip 2-1 is limited and slidably disposed between two second limiting sliding grooves 2-0; the supporting strip 2-1 is provided with a third limiting sliding groove 2-10 along its axial direction, and each supporting boss 2-2 is limited and slidably disposed on the third limiting sliding groove 2-10 through a limiting shaft 2-20;

[0039] Its function is: through the design of each slide groove, it can meet the different welding positions of the heat pipe b on the heat-conducting substrate a with different structural forms, facilitate the adjustment of the specific positions of the pressure plate 1, the support bar 2-1 and the support boss 2-2, and is sufficient to adapt to various heat pipe welding position working conditions. There is no need to replace the pressure plate 1, the support bar 2-1 and the support boss 2-2 to ensure the effective welding of the heat pipe b, which greatly simplifies the design and processing flow and realizes the optimization of the design and processing procedures.

[0040] The thickness of the pressing plate 1 disclosed in this embodiment is not less than 10 mm. In order to increase the strength of the pressing plate, reinforcing ribs 1-2 are designed around the pressing plate to prevent the pressing plate from warping and deformation under high temperature. The overall strength of the device can be guaranteed, and the heat capacity of the device can be small. The welding part can quickly reach the predetermined welding temperature, saving welding time and improving the uniformity and stability of the welding process.

[0041] The thickness of the support plate 2 disclosed in this embodiment is not less than 10 mm. In order to increase the strength of the support plate, reinforcing ribs can also be fixed around the support plate to prevent the support plate from warping and deformation under high temperature. The overall strength of the device can be guaranteed, and the heat capacity of the device can be small. The welding part can quickly reach the predetermined welding temperature, saving welding time and improving the uniformity and stability of the welding process.

[0042] Specifically, at least one clamping mechanism 3 is provided between the upper surface of each clamping strip 1 - 1 and the bottom surface of the support plate 2 ;

[0043] Its function is: each clamping mechanism 3 provides a clamping point to ensure the welding effect, and the specific number depends on the actual working conditions.

[0044] Each clamping strip 1-1 disclosed in the present embodiment is clamped with two clamping mechanisms 3, the clamping mechanism 3 includes a positioning clamp 3-1 clamped between the upper surface of any clamping strip 1-1 and the bottom surface of the support plate 2, and also includes a clamping shaft 3-2 passing through the positioning clamp 3-1 from top to bottom and tightly pressed on the upper surface of the clamping strip 1-1, and the clamping shaft 3-2 is preferably a bolt; the positioning clamp 3-1 and the clamping shaft 3-2 are threadedly connected, and a pad is also connected to the lower end of the clamping shaft 3-2.

[0045] The clamping shaft 3 - 2 in the clamping mechanism 3 of this embodiment is made of stainless steel 2Cr13, and other structural parts are made of aluminum alloy 2A12 H112, which can meet the strength and rigidity requirements during high-temperature welding.

[0046] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0047] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0048] In addition, the various different implementation modes disclosed in this solution may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the content invented by the present disclosure.

Claims

1. A device for welding a heat pipe and a heat-conducting substrate for aerospace electronic equipment, characterized in that: It comprises a pressing plate (1) and a supporting plate (2) which are respectively pressed on the upper surface and the lower surface of a heat-conducting substrate (a); The upper surface of the pressing plate (1) is provided with a pressing strip (1-1) located directly above each welding surface (a0), and a space for pressing a heat pipe (b) is reserved between the pressing plate (1) and each welding surface (a0); and a supporting unit is provided between the supporting plate (2) and each welding surface (a0).

2. The heat pipe and heat conductive substrate welding device for aerospace electronic equipment according to claim 1, characterized in that: The support unit comprises a support bar (2-1) located directly below each welding surface (a0), and at least one support boss (2-2) is provided between any support bar (2-1) and the welding surface (a0).

3. The heat pipe and heat conductive substrate welding device for aerospace electronic equipment according to claim 2, characterized in that: The supporting plate (2) is provided with second limiting sliding grooves (2-0) on the opposite side edges, and each supporting strip (2-1) is limitedly slidably disposed between the two second limiting sliding grooves (2-0).

4. The heat pipe and heat conductive substrate welding device for aerospace electronic equipment according to claim 3, characterized in that: The support bar (2-1) is provided with a third limiting sliding groove (2-10) along its axial direction, and each supporting boss (2-2) is limitedly slidably disposed on the third limiting sliding groove (2-10) via a limiting shaft (2-20).

5. The heat pipe and heat conductive substrate welding device for aerospace electronic equipment according to claim 1, characterized in that: The pressing plate (1) is provided with a first limiting sliding groove (1-0) on the opposite side, and each pressing strip (1-1) is limitedly slidably arranged between two second limiting sliding grooves (2-0).

6. The device for welding a heat pipe and a heat-conducting substrate for aerospace electronic equipment according to claim 5, characterized in that: The pressing plate (1) is provided with reinforcing ribs (1-2) around its periphery.

7. The heat pipe and heat conductive substrate welding device for aerospace electronic equipment according to any one of claims 1 to 6, characterized in that: At least one clamping mechanism (3) is provided between the upper surface of each pressing strip (1-1) and the bottom surface of the supporting plate (2).

8. The heat pipe and heat conductive substrate welding device for aerospace electronic equipment according to claim 7, characterized in that: The clamping mechanism (3) comprises a positioning clamp (3-1) clamped between the upper surface of any clamping strip (1-1) and the bottom surface of the support plate (2), and also comprises a clamping shaft (3-2) passing through the positioning clamp (3-1) from top to bottom and tightly pressed against the upper surface of the clamping strip (1-1).

9. The heat pipe and heat conductive substrate welding device for aerospace electronic equipment according to claim 8, characterized in that: The positioning clamp (3-1) and the pressing shaft (3-2) are threadedly connected.

10. The device for welding heat pipe and heat conductive substrate for aerospace electronic equipment according to claim 9, characterized in that: Each of the pressing strips (1-1) is clamped with two clamping mechanisms (3).

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