Circuit board assembly and electronic equipment

Abstract

The invention discloses a circuit board assembly and electronic equipment, and belongs to the technical field of printed circuit boards. The circuit board assembly comprises a first board body, the first board body comprises a first board surface and a second board surface which are adjacent to each other, and the first board surface is used for arranging electronic elements; the second plate body and the first plate body are arranged at intervals, and at least part of the electronic elements are located between the first plate body and the second plate body; the first connecting part is arranged on the second plate body, the first end face of the first connecting part is connected with the first plate face, the second end face of the first connecting part is connected with the second plate face, and the first plate body is electrically connected with the second plate body through the first connecting part.

Description

Technical Field

[0001] The present application belongs to the technical field of printed circuit boards, and in particular relates to a circuit board assembly and an electronic device. Background Art

[0002] With the continuous development of the information society and the improvement of user needs, mobile phones have more and more functions, and the number of electronic components carried by PCB (Printed Circuit Board) of mobile terminals such as smart phones is also increasing. However, due to the limitation of the overall shape of the mobile phone, the PCB cannot be infinitely lengthened and widened in the plane direction. In order to solve the space problem of PCB component stacking, a double-layer stacking layout of PCB is designed.

[0003] In the related art, in a double-layer stacked PCB structure, the two PCBs are welded only through solder joints on a plane, without screw holes or other reinforcement methods. Excessive stress often occurs at the solder joints, causing the solder joints to crack, resulting in an open signal connection that affects the function of the electronic product, and there is a problem of low connection reliability between the two PCBs. Summary of the invention

[0004] The present application aims to provide a circuit board assembly and an electronic device, which can solve the problem of low connection reliability between two PCB boards.

[0005] In the first aspect, an embodiment of the present application proposes a circuit board assembly, comprising: a first board body, the first board body comprising a first board surface and a second board surface adjacent to each other, the first board surface being used to set electronic components; a second board body, spaced apart from the first board body, at least part of the electronic components being located between the first board body and the second board body; a first connecting portion, arranged on the second board body, the first end surface of the first connecting portion being connected to the first board surface, the second end surface of the first connecting portion being connected to the second board surface, and the first board body and the second board body being electrically connected via the first connecting portion.

[0006] In a second aspect, an embodiment of the present application provides an electronic device, including: the circuit board assembly in the above-mentioned first aspect.

[0007] In the embodiment of the present application, by providing a first connecting portion on the second board body, and connecting the first end face and the second end face of the first connecting portion to the first board surface and the second board surface of the second board body respectively, the connection area between the first connecting portion and the first board body is increased, thereby improving the stability of the connection between the first board body and the second board body. In addition, since there is no need to provide electronic components on the second board surface, the layout space of the electronic components of the first board body will not be squeezed while the connection area between the first connecting portion and the first board body is increased, thereby improving the connection stability between the first board body and the second board body, solving the problem of low connection reliability between the two PCBs in the related art, and ensuring the layout utilization rate of the circuit board assembly.

[0008] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0010] Figure 1 One of the structural schematic diagrams of the circuit board assembly provided in some embodiments of the present application is shown;

[0011] Figure 2 A second structural schematic diagram of a circuit board assembly provided in some embodiments of the present application is shown;

[0012] Figure 3 One of the structural schematic diagrams of the first plate body provided in some embodiments of the present application is shown;

[0013] Figure 4 A second structural schematic diagram of a first plate body provided in some embodiments of the present application is shown;

[0014] Figure 5 The third structural schematic diagram of the first plate body provided in some embodiments of the present application is shown;

[0015] Figure 6 One of the structural schematic diagrams of the second plate body and the first connecting portion provided in some embodiments of the present application is shown;

[0016] Figure 7 A second structural schematic diagram of a second plate body and a first connecting portion provided in some embodiments of the present application is shown;

[0017] Figure 8 A fourth structural schematic diagram of a first plate body provided in some embodiments of the present application is shown;

[0018] Fig. 9 A third structural schematic diagram of the second plate body and the first connecting portion provided in some embodiments of the present application is shown;

[0019] Fig.10 A third structural schematic diagram of a circuit board assembly provided in some embodiments of the present application is shown;

[0020] Fig.11 A fourth structural schematic diagram of a circuit board assembly provided in some embodiments of the present application is shown;

[0021] Fig.12A fourth structural schematic diagram of the second plate body and the first connecting portion provided in some embodiments of the present application is shown;

[0022] Fig.13 A fifth structural schematic diagram of the second plate body and the first connecting portion provided in some embodiments of the present application is shown;

[0023] Fig.14 A sixth structural schematic diagram of the second plate body and the first connecting portion provided in some embodiments of the present application is shown;

[0024] Fig.15 A schematic diagram of gluing provided in some embodiments of the present application is shown;

[0025] Fig.16 A fifth structural schematic diagram of a circuit board assembly provided in some embodiments of the present application is shown;

[0026] Fig.17 A schematic diagram showing a method for preparing a second plate body and a first connecting portion provided in some embodiments of the present application is shown;

[0027] Fig.18 A schematic diagram of a method for preparing a first plate body provided in some embodiments of the present application is shown;

[0028] Fig.19 A sixth structural schematic diagram of a circuit board assembly provided in some embodiments of the present application is shown;

[0029] Fig. 20 FIG7 shows a seventh structural schematic diagram of a circuit board assembly provided in some embodiments of the present application;

[0030] Fig.21 An eighth structural schematic diagram of a circuit board assembly provided in some embodiments of the present application is shown;

[0031] Fig. 22 A ninth structural schematic diagram of a circuit board assembly provided in some embodiments of the present application is shown;

[0032] Fig.23 A tenth structural schematic diagram of a circuit board assembly provided in some embodiments of the present application is shown;

[0033] Fig.24 A structural block diagram of an electronic device provided in some embodiments of the present application is shown.

[0034] Reference numerals:

[0035] 100 circuit board assembly, 110 first board body, 111 first board surface, 112 second board surface, 113 groove, 114 fifth board surface, 120 second board body, 121 third board surface, 122 avoidance groove, 123 fourth board surface, 130 first connecting portion, 131 first end surface, 132 second end surface, 140 first soldering pad, 141 first sub-soldering pad, 142 second sub-soldering pad, 150 second soldering pad, 151 third sub-soldering pad, 152 fourth sub-soldering pad, 160 glue injection channel, 162 glue injection port, 164 filling glue, 170 third soldering pad, 180 fourth soldering pad, 190 second connecting portion, 200 electronic device, 300 electronic component. DETAILED DESCRIPTION

[0036] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0037] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0038] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] Combine the following Figures 1 to 24 A circuit board assembly and an electronic device according to embodiments of the present application are described.

[0041] In some embodiments of the present application, a circuit board assembly is provided. Figure 1 One of the structural schematic diagrams of the circuit board assembly provided in some embodiments of the present application is shown. Figure 2 FIG. 2 shows a second structural schematic diagram of a circuit board assembly provided in some embodiments of the present application. Figure 1 and Figure 2 As shown, the circuit board assembly 100 includes: a first board body 110, a second board body 120 and a first connecting portion 130; the first board body 110 includes adjacent first board surfaces 111 and second board surfaces 112, and the first board surface 111 is used to set the electronic components 300; the second board body 120 is spaced apart from the first board body 110, and at least part of the electronic components 300 is located between the first board body 110 and the second board body 120; the first connecting portion 130 is arranged on the second board body 120, the first end surface 131 of the first connecting portion 130 is connected to the first board surface 111, the second end surface 132 of the first connecting portion 130 is connected to the second board surface 112, and the first board body 110 and the second board body 120 are electrically connected through the first connecting portion 130.

[0042] In the embodiment of the present application, the circuit board assembly 100 includes a first board 110 and a second board 120, the first board 110 and the second board 120 are arranged at intervals, and the first board 110 is fixedly connected to the second board 120 through a first connecting portion 130, and the first board 110 and the second board 120 are electrically connected through the first connecting portion 130. Among them, the first board 110 and the second board 120 are both PCB boards, and the first board 110 and the second board 120 are used to set electronic components 300, and the electronic components 300 on the first board 110 and the electronic components 300 on the second board 120 can be electrically connected through the first connecting portion 130.

[0043] Exemplarily, the first board body 110 is a PCB board, the second board body 120 is a cavity frame board, the first connecting portion 130 is a connecting structure formed by a PCB board separator on the second board body, and the first connecting portion 130 is connected to the first board body 110 through pads and solder points.

[0044] Exemplarily, the first board 110 is a PCB board, the second board 120 is also a PCB board, the first connecting portion 130 is an Interposer frame board, and the Interposer (interposer) frame board is connected to the first board 110 and the second board 120 respectively through pads and solder points.

[0045] In the embodiment of the present application, the first board body 110 includes a first board surface 111 and a second board surface 112 . The first board surface 111 is used to place the electronic component 300 . The first board surface 111 and the second board surface 112 are two adjacent board surfaces.

[0046] Figure 3 One of the structural schematic diagrams of the first plate body provided in some embodiments of the present application is shown, Figure 4 The second structural schematic diagram of the first plate provided in some embodiments of the present application is shown. Figure 5 The third structural schematic diagram of the first plate provided in some embodiments of the present application is shown as follows: Figures 1 to 5 As shown, the first plate surface 111 is the upper surface of the first plate body 110, and the second plate surface 112 is the right side wall surface of the first plate body 110. Figure 3 is a front view of the first plate body 110, Figure 4 is a right side view of the first plate body 110, Figure 5 FIG. 1 is a top view of the first plate body 110 .

[0047] In the embodiment of the present application, the second board 120 is arranged opposite to the first board 110, and at least part of the electronic components 300 on the first board 110 are located between the second board 120 and the first board 110. The first connecting portion 130 is arranged on the second board 120, and the first connecting portion 130 includes a first end surface 131 connected to the first board surface 111, and a second end surface 132 connected to the second board surface 112. The first connecting portion 130 is connected to the first board surface 111 and the second board surface 112 of the first board 110 through the first end surface 131 and the second end surface 132, respectively, so as to improve the connection stability between the first connecting portion 130 and the first board 110.

[0048] Figure 6 One of the structural schematic diagrams of the second plate body and the first connecting part provided in some embodiments of the present application is shown, Figure 7 FIG. 2 shows a second structural schematic diagram of a second plate body and a first connecting portion provided in some embodiments of the present application. Figures 1 to 7As shown, the second plate body 120 is provided with an avoidance groove 122 on the plate surface facing the first plate body 110, and at least part of the electronic component 300 arranged on the first plate body 110 is accommodated in the avoidance groove 122, so as to prevent the second plate body 120 from interfering with the installation of the electronic component 300 on the first plate body 110. The first connecting portion 130 is arranged at one end of the second plate body 120, and the first end surface 131 of the first connecting portion 130 is an end surface facing the first plate surface 111, and the second end surface 132 is an end surface facing the second plate surface 112. By arranging the first end surface 131 opposite to the first plate surface 111, and arranging the second end surface 132 opposite to the second plate surface 112, the convenience of welding the first connecting portion 130 and the first plate body 110 can be improved.

[0049] In the embodiment of the present application, a first connecting portion 130 is provided on the second board body 120, and the first end surface 131 and the second end surface 132 of the first connecting portion 130 are connected to the first board surface 111 and the second board surface 112 of the second board body 120 respectively, thereby increasing the connection area between the first connecting portion 130 and the first board body 110, thereby improving the stability of the connection between the first board body 110 and the second board body 120, and since the second board surface 112 does not need to be provided with the electronic component 300, the layout space of the electronic component 300 of the first board body 110 is not squeezed while the connection area between the first connecting portion 130 and the first board body 110 is increased, thereby improving the connection stability between the first board body 110 and the second board body 120, solving the problem of low connection reliability between the two PCBs in the related art, and ensuring the layout utilization rate of the circuit board assembly 100.

[0050] like Figures 1 to 7 As shown, in some embodiments of the present application, the circuit board assembly 100 also includes: a first solder pad 140 and a second solder pad 150, wherein the first solder pad 140 is arranged on the first board surface 111 and the second board surface 112; the second solder pad 150 is arranged on the first end surface 131 and the second end surface 132, and the first connecting portion 130 is electrically connected to the first board body 110 through the first solder pad 140 and the second solder pad 150.

[0051] In the embodiment of the present application, the first connecting portion 130 is connected to the first board body 110 by welding, a first soldering pad 140 is arranged on the first board surface 111 and the second board surface 112 of the first board body 110, and a second soldering pad 150 is arranged on the first end surface 131 and the second end surface 132 of the first connecting portion 130, the first soldering pad 140 and the second soldering pad 150 have the same shape and size, and the first soldering pad 140 and the second soldering pad 150 are connected by welding, thereby welding the first board body 110 to the first connecting portion 130.

[0052] like Figure 3 and Figure 6 As shown, exemplarily, the first pad 140 and the second pad 150 are both in an "L" shape, a portion of the first pad 140 is disposed on the first board surface 111 of the first board body 110, and another portion of the first pad 140 is disposed on the second board surface 112 of the first board body 110. A portion of the second pad 150 is disposed on the first end surface 131 of the first connecting portion 130, and another portion of the second pad 150 is disposed on the second end surface 132 of the first connecting portion 130.

[0053] It should be noted that the number of the first pads 140 and the second pads 150 may be at least two, and the number of the first pads 140 and the second pads 150 are the same. By providing a plurality of first pads 140 on the first board 110 and providing a corresponding number of second pads 150 on the second board 120, the welding area between the first board 110 and the first connecting portion 130 is increased, and the connection stability between the first board 110 and the first connecting portion 130 is further improved.

[0054] like Figure 5 and Figure 7 As shown, the number of the first pads 140 and the number of the second pads 150 are both ten.

[0055] In the embodiment of the present application, a first soldering pad 140 is arranged on the first board surface 111 and the second board surface 112 of the first board body 110, and a corresponding second soldering pad 150 is arranged on the first end surface 131 and the second end surface 132 of the first connecting portion 130, so that the first connecting portion 130 and the first board body 110 can be welded through the first soldering pad 140 and the second soldering pad 150, thereby increasing the welding area between the first connecting portion 130 and the first board body 110, thereby improving the connection stability between the first connecting portion 130 and the first board body 110.

[0056] Figure 8 FIG. 4 shows a fourth structural schematic diagram of the first plate provided in some embodiments of the present application, such as Figures 1 to 8 As shown, in some embodiments of the present application, a groove 113 is disposed on the second board surface 112 , wherein at least a portion of the first solder pad 140 is disposed in the groove 113 .

[0057] In the embodiment of the present application, a groove 113 is opened on the second board surface 112 of the first board body 110, and the first soldering pad 140 arranged on the first board body 110 is arranged in the groove 113, so as to increase the surface area of ​​the first soldering pad 140. When the first soldering pad 140 and the second soldering pad 150 are soldered, the tin capacity between the first soldering pad 140 and the second soldering pad 150 can be increased, that is, more tin can be stored by the groove 113, thereby improving the connection stability of the first soldering pad 140 and the second soldering pad 150, thereby improving the welding reliability between the second end surface 132 of the first connecting portion 130 and the second board surface 112 of the first board body 110, solving the problem of low connection reliability between the two layers of PCB boards, and avoiding the occurrence of excessive stress at the solder joints, resulting in cracking of the solder joints and causing the signal connection to be open, affecting the function of the electronic product.

[0058] Exemplarily, the number of the grooves 113 is at least two, and the number of the grooves 113 is the same as the number of the first pads 140 , so that each first pad 140 can be located in the groove 113 .

[0059] Exemplarily, the cross section of the groove 113 is semicircular, so that the first soldering pad 140 disposed in the groove 113 has enough space to accommodate solder.

[0060] Fig. 9 The third structural schematic diagram of the second plate body and the first connecting portion provided in some embodiments of the present application is shown. Fig.10 The third structural schematic diagram of the circuit board assembly provided in some embodiments of the present application is shown. Figures 1 to 10 As shown, in some embodiments of the present application, the first solder pad 140 includes a first sub-pad 141 and a second sub-pad 142, the first sub-pad 141 is arranged on the first board surface 111, and the second sub-pad 142 is arranged on the second board surface 112; the second solder pad 150 includes a third sub-pad 151 and a fourth sub-pad 152, the third sub-pad 151 is arranged on the first end surface 131, and the fourth sub-pad 152 is arranged on the second end surface 132, and the third sub-pad 151 is welded to the first sub-pad 141, and the second sub-pad 142 is welded to the fourth sub-pad 152.

[0061] In the embodiment of the present application, the first pad 140 includes a first sub-pad 141 disposed on the first board surface 111, and a second sub-pad 142 disposed on the second board surface 112, and the second pad 150 includes a third sub-pad 151 disposed on the first end surface 131, and a fourth sub-pad 152 disposed on the second end surface 132. During the welding process, by welding the first sub-pad 141 and the third sub-pad 151 separately, and welding the second sub-pad 142 and the fourth sub-pad 152 separately, a pair of the first pad 140 and the second pad 150 are welded through two welding points, thereby increasing the number of welding points between the first pad 140 and the second pad 150.

[0062] It should be noted that the solder joints can be ground networks for signal shielding, or signal pins for signal connection. Specifically, when the solder joints on the second board surface 112 and the second end surface 132 are signal pins, the space occupied by the first board surface 111 of the first board body 110 can be kept constant, while the number of signal pins is increased, thereby improving the space utilization of the circuit board assembly 100.

[0063] Exemplarily, there are multiple first pads 140 and multiple second pads 150 , each first pad 140 includes a first sub-pad 141 and a second sub-pad 142 , and each second pad 150 includes a third sub-pad 151 and a fourth sub-pad 152 .

[0064] In the embodiment of the present application, a first sub-pad 141 and a second sub-pad 142 are separately provided in the first pad 140, and a third sub-pad 151 and a fourth sub-pad 152 are correspondingly separately provided in the second pad 150. By welding the first sub-pad 141 and the third sub-pad 151, and welding the second sub-pad 142 and the fourth sub-pad 152 at the same time, the number of solder joints between the first pad 140 and the second pad 150 can be increased, thereby further improving the space utilization of the circuit board assembly 100.

[0065] Fig.11 FIG4 shows a fourth structural schematic diagram of a circuit board assembly provided in some embodiments of the present application. Fig.12 FIG. 4 shows a fourth structural schematic diagram of the second plate body and the first connecting portion provided in some embodiments of the present application, such as Fig.11 and Fig.12 As shown, in some embodiments of the present application, the circuit board assembly 100 further includes: a glue injection channel 160 disposed on the first connecting portion 130 , a glue injection port 162 being disposed at the first end of the glue injection channel 160 , and the other end of the glue injection channel 160 facing the first board surface 111 .

[0066] In the embodiment of the present application, the circuit board assembly 100 also includes a glue injection channel 160 arranged on the first connecting part 130, the glue injection channel 160 passes through the first connecting part 130, and a glue injection port 162 is arranged at one end of the glue injection channel 160. The glue injection port 162 is located on the side of the first connecting part 130 away from the first board body 110, and the other end of the glue injection channel 160 faces the first board surface 111. Glue can be injected into the glue injection channel 160 through the glue injection port 162, so that the glue flows through the glue injection channel 160 to the first soldering pad 140 and the second soldering pad 150 between the first connecting part 130 and the first board surface 111, thereby improving the reliability of the welding position of the first soldering pad 140 and the second soldering pad 150.

[0067] Fig.13 FIG5 shows a fifth structural diagram of the second plate body and the first connecting portion provided in some embodiments of the present application. Fig.14 FIG. 6 shows a sixth structural schematic diagram of the second plate body and the first connecting portion provided in some embodiments of the present application, such as Fig.13 and Fig.14 As shown, the number of the glue injection channels 160 is three, and the glue injection ports 162 of the three glue injection channels 160 are arranged on the first connecting portion 130 at intervals.

[0068] Exemplarily, the second board 120 and the first connecting portion 130 are a Cavity frame board, and a through hole is punched at a preset interval on the Cavity frame board, and the through hole extends to the second pad 150 , and the through hole is used as a glue injection channel 160 .

[0069] In the embodiment of the present application, a glue injection channel 160 is provided on the first connection portion 130, and a glue injection port 162 of the glue injection channel 160 is provided on a side of the first connection portion 130 away from the first board 110, and the other end of the glue injection channel 160 extends to the position of the second pad 150. After the first pad 140 and the second pad 150 are welded, glue can be injected into the welding position of the first pad 140 and the second pad 150 through the glue injection channel 160, thereby improving the connection stability between the first pad 140 and the second pad 150, thereby improving the welding reliability between the first connection portion 130 and the first board 110.

[0070] Fig.15 shows a schematic diagram of gluing provided in some embodiments of the present application, Fig.16 FIG. 5 shows a fifth structural schematic diagram of a circuit board assembly provided in some embodiments of the present application, such as Fig.15 and Fig.16 As shown, in some embodiments of the present application, one end of the glue injection channel 160 facing the first board surface 111 is staggered with the second solder pad 150 .

[0071] In the embodiment of the present application, the end of the glue injection channel 160 facing the first board surface 111 is staggered with the second solder pad 150, which can avoid punching a hole on the second solder pad 150 to form the glue injection channel 160, thereby improving the stability of welding the second solder pad 150 and the first solder pad 140.

[0072] Exemplarily, there are multiple glue injection channels 160, and the ends of the multiple glue injection channels 160 facing the first board surface 111 are staggered with the second solder pad 150. When glue is injected through the glue injection channels 160, the glue flows from the glue injection channels 160 to the position of the second solder pad 150. Due to the capillary effect, the glue flows to both sides, thereby filling the first solder pad 140 and the second solder pad 150 with filling glue 164.

[0073] like Figure 1 As shown, in some embodiments of the present application, the first connecting portion 130 and the second plate body 120 are integrally formed.

[0074] In the embodiment of the present application, the second board 120 and the first connecting portion 130 are cavity frames, and the first board 110 is a main PCB board.

[0075] Fig.17 A schematic diagram of a method for preparing a second plate body and a first connecting portion provided in some embodiments of the present application is shown. Fig.17 As shown, the preparation method comprises:

[0076] Step 11, drilling slots on the PCB board;

[0077] Step 12, copper deposition treatment is performed on the PCB board;

[0078] Step 13, performing a gong process on the PCB board to form a second board body and a first end surface of the first connecting portion;

[0079] Step 14, performing secondary gong processing on the first connection portion to form a first end surface and a second end surface on the first connection portion.

[0080] Fig.18 A schematic diagram of a method for preparing a first plate body provided in some embodiments of the present application is shown. Fig.18 As shown, the preparation method comprises:

[0081] Step 21, drilling slots on the PCB board;

[0082] Step 22, copper deposition treatment is performed on the PCB board;

[0083] Step 23, performing contour milling on the PCB board to form a first board surface and a second board surface.

[0084] In the embodiment of the present application, the second board body 120 is formed by grooving the PCB board using the Cavity technology, and the first connecting portion 130, i.e., the Cavity frame, is formed at the edge of the second board body 120. The first connecting portion 130 is then grooved twice, and after the second grooving, the first end face 131 and the second end face 132 that match the first board surface 111 and the second board surface 112 are formed, so that the stability of the second board body 120 when being welded to the first board body 110 through the first connecting portion 130 is improved.

[0085] like Figure 2 As shown, in some embodiments of the present application, the second board body 120 includes a third board surface 121, and the third board surface 121 is opposite to the second board surface 112, and the circuit board assembly 100 further includes: a third solder pad 170 and a fourth solder pad 180. The third solder pad 170 is arranged on the third board surface 121; the fourth solder pad 180 is arranged on the first connecting portion 130, and the fourth solder pad 180 is welded to the third solder pad 170, wherein the first connecting portion 130 is connected to the second board body 120 through the third solder pad 170 and the fourth solder pad 180.

[0086] In the embodiment of the present application, the second board body 120 includes a third board surface 121, and the third board surface 121 is located on a side of the second board body 120 opposite to the first board body 110. The first connecting portion 130 may also be a PCB board, and the first connecting portion 130 is welded on the second board body 120 through a third soldering pad 170 disposed on the third board surface 121 and a fourth soldering pad 180 disposed on the first connecting portion 130.

[0087] Exemplarily, the first connection portion 130 may be an Interposer frame, the circuit board assembly 100 is a "sandwich structure", and the first board body 110 and the second board body 120 are both PCB boards. Specifically, the Interposer frame is welded to the second board body 120 via the third pad 170 and the fourth pad 180, and the Interposer frame is welded to the first board body 110 via the first pad 140 and the second pad 150.

[0088] Exemplarily, one end of the first connection portion 130 is provided with a first end surface 131 and a second end surface 132, and the other end of the first connection portion 130 is also provided with a first end surface 131 and a second end surface 132, and the second plate body 120 further includes a fourth plate surface 123 adjacent to the third plate surface 121. The first connection portion 130 is welded to the third plate surface 121 and the fourth plate surface 123 of the second plate body 120 through the first end surface 131 and the second end surface 132 of one end, and the first connection portion 130 is welded to the first plate surface 111 and the second plate surface 112 of the first plate body 110 through the first end surface 131 and the second end surface 132 of the other end, which further improves the welding stability between the first connection portion 130, the first plate body 110 and the second plate body 120.

[0089] In the embodiment of the present application, an Interposer frame is provided between the first plate 110 and the second plate 120 as the first connection portion 130, and the first connection portion 130 is provided on the second plate 120 via the third solder pad 170 and the fourth solder pad 180, so that the stability of the second plate 120 when being welded to the first plate 110 via the first connection portion 130 is improved.

[0090] Fig.19 FIG6 shows a sixth structural schematic diagram of a circuit board assembly provided in some embodiments of the present application. Fig. 20 FIG7 shows a seventh structural schematic diagram of a circuit board assembly provided in some embodiments of the present application. Fig.21 FIG. 8 shows a schematic diagram of a circuit board assembly provided in some embodiments of the present application. Fig.19 , Fig. 20 , Fig.21 As shown, in some embodiments of the present application, the number of the first connection parts 130 is at least two; at least two first connection parts 130 are located on the same side of the second plate body 120, and at least two first connection parts 130 are arranged at intervals; or at least two first connection parts 130 are located on two opposite sides of the second plate body 120.

[0091] In the embodiment of the present application, the number of the first connection parts 130 in the circuit board assembly 100 is set to be multiple, which can further improve the connection stability between the first board body 110 and the second board body 120.

[0092] like Fig.21 As shown, specifically, at least two first connection portions 130 are located on the same side of the second plate body 120 , and the at least two first connection portions 130 are spaced apart between the second plate bodies 120 .

[0093] It should be noted that the first connection portion 130 is disposed at a position with greater stress, which further improves the stability of the connection between the first plate body 110 and the second plate body 120 through the first connection portion 130 .

[0094] like Fig.19 and Fig. 20 Specifically, at least two first connection parts 130 are respectively located at the first side and the second side of the second plate body 120, and the first side and the second side are located at opposite sides. For example, the second plate body 120 is a quadrilateral, and the first connection parts 130 are disposed at the positions of the two opposite long sides of the second plate body 120.

[0095] Fig. 22 FIG8 shows an eighth structural schematic diagram of a circuit board assembly provided in some embodiments of the present application. Fig.23FIG. 9 shows a ninth structural schematic diagram of a circuit board assembly provided in some embodiments of the present application. Fig. 22 and Fig.23 As shown, in some embodiments of the present application, the number of the first connection portion 130 may be one.

[0096] It should be noted that the first connection portion 130 is disposed at a position where stress is relatively large.

[0097] In the embodiment of the present application, only one first connection part 130 is provided at a location with greater stress, which can improve the connection stability between the first plate body 110 and the second plate body 120 while reducing the volume of the first connection part 130 and saving hardware costs.

[0098] like Figure 1 and Figure 2 As shown, in some embodiments of the present application, the circuit board assembly 100 further includes a second connecting portion 190 , which is disposed on the second board body 120 , and the second connecting portion 190 is connected to the first board surface 111 .

[0099] In the embodiment of the present application, the first plate surface 111 is the upper surface of the first plate body 110, and the second plate surface 112 is the side wall surface of the first plate body 110. When the size of the second plate body 120 is smaller than the size of the first plate body 110, a second connecting portion 190 is arranged between the first plate body 110 and the second plate body 120 to further improve the connection stability between the first plate body 110 and the second plate body 120.

[0100] Exemplarily, the second plate body 120 , the first connecting portion 130 and the second connecting portion 190 are a cavity frame plate, that is, the second plate body 120 , the first connecting portion 130 and the second connecting portion 190 are all integrally formed.

[0101] Exemplarily, the first board 110 and the second board 120 are PCB boards, the first connection part 130 and the second connection part 190 are Interposer frame boards, and the first connection part 130 and the second connection part 190 are connected between the first board 110 and the second board 120 by welding.

[0102] In some embodiments of the present application, the first board body 110 also includes a fifth board surface 114, which is a board surface opposite to the first board surface 111, and the fifth board surface 114 is used to connect the electronic component 300; the second board body 120 also includes a fourth board surface 123, and the fourth board surface 123 is located on a side of the second board body 120 away from the first board body 110, and the fourth board surface 123 is used to connect the electronic component 300.

[0103] In some embodiments of the present application, an electronic device is provided. Fig.24The structure block diagram of the electronic device provided in some embodiments of the present application is shown as follows: Fig.24 As shown, the electronic device 200 includes a circuit board assembly 100, wherein the circuit board assembly 100 is the circuit board assembly in any of the above embodiments, and thus has all the beneficial technical effects of the circuit board assembly 100 in any of the above embodiments, which will not be elaborated herein.

[0104] Exemplarily, the electronic device 200 further includes a housing, and the circuit board assembly 100 is located inside the housing.

[0105] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0106] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: include: A first board body, the first board body comprising a first board surface and a second board surface adjacent to each other, the first board surface being used for arranging electronic components; A second plate body is spaced apart from the first plate body, and at least part of the electronic components are located between the first plate body and the second plate body; The first connecting portion is arranged on the second plate body, the first end surface of the first connecting portion is connected to the first plate surface, the second end surface of the first connecting portion is connected to the second plate surface, and the first plate body and the second plate body are electrically connected through the first connecting portion.

2. The circuit board assembly according to claim 1, characterized in that: Also includes: A first solder pad is provided on the first board surface and the second board surface; The second solder pad is disposed on the first end surface and the second end surface, and the first connection portion is electrically connected to the first board body through the first solder pad and the second solder pad.

3. The circuit board assembly according to claim 2, characterized in that: A groove is disposed on the second board surface, wherein at least a portion of the first pad is disposed in the groove.

4. The circuit board assembly according to claim 2, characterized in that: The first pad includes a first sub-pad and a second sub-pad, the first sub-pad is arranged on the first board surface, and the second sub-pad is arranged on the second board surface; The second pad includes a third sub-pad and a fourth sub-pad, the third sub-pad is arranged on the first end surface, the fourth sub-pad is arranged on the second end surface, and the third sub-pad is welded to the first sub-pad, and the second sub-pad is welded to the fourth sub-pad.

5. The circuit board assembly according to any one of claims 2 to 4, characterized in that: Also includes: A glue injection channel is arranged at the first connecting portion, one end of the glue injection channel is provided with a glue injection port, and the other end of the glue injection channel faces the first plate surface.

6. The circuit board assembly according to claim 5, characterized in that: One end of the glue injection channel facing the first board surface is staggered with the second solder pad.

7. The circuit board assembly according to any one of claims 1 to 4, characterized in that: The first connecting portion and the second plate body are integrally formed.

8. The circuit board assembly according to any one of claims 1 to 4, characterized in that: The second board body includes a third board surface, the third board surface is opposite to the second board surface, and the circuit board assembly further includes: A third solder pad is disposed on the third board surface; A fourth solder pad is disposed on the first connection portion, and the fourth solder pad is soldered to the third solder pad, wherein the first connection portion is connected to the second board through the third solder pad and the fourth solder pad.

9. The circuit board assembly according to any one of claims 1 to 4, characterized in that: The number of the first connecting parts is at least two; At least two of the first connection parts are located on the same side of the second plate body, and at least two of the first connection parts are spaced apart; or At least two of the first connecting portions are located on two opposite sides of the second plate.

10. An electronic device, characterized in that: include: The circuit board assembly according to any one of claims 1 to 9.

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