Epoxy molding compound and preparation method and application thereof

Abstract

The invention relates to the field of epoxy molding compounds, and discloses an epoxy molding compound as well as a preparation method and application thereof. The epoxy molding compound contains a heat-conducting filler, epoxy resin, a curing agent, a curing accelerator, a coupling agent, a bonding modifier, a flame retardant, a coloring agent, a release agent, hydroxyl-terminated silicone oil and a dispersing wetting agent. The heat-conducting filler contains aluminum oxide, crystalline silicon dioxide powder and molten spherical silicon dioxide powder; the bonding modifier is a triazole compound or a gallic acid compound; the weight ratio of the hydroxyl-terminated silicone oil to the heat-conducting filler to the bonding modifier is (1.5-4): (700-800): 1. The epoxy molding compound has the advantages of favorable molding process property, excellent heat-conducting property and high adhesive strength, and is suitable for being used as a packaging material of a fully-packaged power module.

Description

Technical Field

[0001] The invention relates to the field of epoxy molding compounds, and in particular to an epoxy molding compound and a preparation method and application thereof. Background Art

[0002] Power modules are key components in power electronics systems, responsible for the efficient conversion and control of power. According to packaging technology and application requirements, power modules can be divided into standard power modules and intelligent power modules (IPM). Standard power modules usually contain multiple semiconductor chips, while intelligent power modules integrate drive circuits, protection functions and power supplies. Power modules have a wide range of applications, covering the following application markets: ① Electric vehicles: With the rapid growth of the electric vehicle market, the demand for high-performance and high-reliability power modules has surged; ② Industrial motors: Industrial motor drives place strict requirements on the stability and durability of power modules; ③ Photovoltaics: Solar photovoltaic systems require efficient power conversion modules to maximize energy output; ④ Wind energy: Wind power generation systems rely on power modules to control and optimize energy conversion; ⑤ Other applications: including uninterruptible power supplies (UPS), home appliances and telecommunications infrastructure.

[0003] All-in-one power modules are an important area of ​​power module types. This packaging form uses an asymmetric packaging process, and the packaging material has a mold flow back-up phenomenon during the injection molding process, which easily forms surface or internal pores at the back healing point, resulting in a low yield of packaging molding, affecting its electrical insulation and reliability.

[0004] Therefore, developing an epoxy molding compound with excellent formability is of great significance to the development of a new generation of high-power and high-performance module packaging electronic devices and equipment. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the existing epoxy molding compound, such as poor moldability, and to provide an epoxy molding compound and a preparation method and application thereof. The epoxy molding compound has good molding process performance, and also has excellent thermal conductivity and high adhesion, and is suitable for use as a packaging material for all-inclusive power modules.

[0006] In order to achieve the above object, the present invention provides an epoxy molding compound on one hand, wherein the epoxy molding compound contains a thermal conductive filler, an epoxy resin, a curing agent, a curing accelerator, a coupling agent, an adhesion modifier, a flame retardant, a colorant, a release agent, a terminal hydroxyl silicone oil and a dispersing wetting agent;

[0007] The thermal conductive filler contains aluminum oxide, crystalline silicon dioxide powder and molten spherical silicon dioxide powder;

[0008] The bonding modifier is a triazole compound or a gallic acid compound;

[0009] Based on the total weight of the epoxy molding compound as 100 weight percent, the content of the thermal conductive filler is 75-85 weight percent, the content of the epoxy resin is 5-15 weight percent, the content of the curing agent is 3-7 weight percent, the content of the flame retardant is 0.5-8 weight percent, the content of the curing accelerator is 0.1-1 weight percent, the content of the release agent is 0.1-1 weight percent, the content of the adhesion modifier is 0.1-2 weight percent, the content of the coupling agent is 0.1-1 weight percent, the content of the dispersing and wetting agent is 0.1-3 weight percent, the content of the terminal hydroxyl silicone oil is 0.05-0.3 weight percent, and the content of the colorant is 0.1-1 weight percent;

[0010] The weight ratio of the terminal hydroxyl silicone oil, the thermal conductive filler and the adhesion modifier is 1.5-4:700-800:1.

[0011] Preferably, the median particle size of the thermally conductive filler is 15-40 μm.

[0012] Preferably, in the thermally conductive filler, the weight ratio of aluminum oxide, crystalline silicon dioxide powder and molten spherical silicon dioxide powder is 1:1-20:0.2-2.

[0013] Preferably, the epoxy resin is selected from one or more of o-cresol epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, linear phenol epoxy resin and dicyclopentadiene epoxy resin.

[0014] Preferably, the curing agent is selected from one or more of phenol linear phenolic resin and its derivatives, cresol linear phenolic resin and its derivatives, monohydroxy or dihydroxy naphthol phenolic resin and its derivatives, condensation products of p-xylene and phenol or naphthol, and copolymers of dicyclopentadiene and phenol;

[0015] Preferably, the curing accelerator is selected from one or more of a coupling compound of p-benzoquinone and triphenylphosphine, 1-benzyl 2-methylimidazole, triphenylphosphine, 2-methylimidazole, 2-phenyl-4-methylimidazole and 2-undecylimidazole.

[0016] Preferably, the coupling agent is selected from one or more of γ-glycidyl propyl ether trimethoxy silane, γ-aminopropyl triethoxy silane, γ-mercaptopropyl trimethoxy silane and γ-aminopropyl trimethoxy silane;

[0017] Preferably, the release agent is selected from one or more of carnauba wax, ethylene bisstearamide and mineral wax;

[0018] Preferably, the flame retardant is selected from at least one of bromine antimony flame retardant, spherical flame retardant, hydrated metal compound flame retardant, organosilicon flame retardant, nitrogen-containing compound flame retardant, organophosphorus flame retardant and organometallic compound flame retardant;

[0019] Preferably, the dispersing wetting agent is a modified silicone polymer.

[0020] The second aspect of the present invention provides a method for preparing the epoxy molding compound, the method comprising: mixing a thermal conductive filler, an epoxy resin, a curing agent, a curing accelerator, a coupling agent, an adhesion modifier, a flame retardant, a colorant, a release agent, a terminal hydroxyl silicone oil and a dispersing wetting agent, then melt-kneading the obtained mixture, then cooling, crushing and molding;

[0021] Preferably, the mixture is melt-kneaded using a double-roll mixer;

[0022] Preferably, the temperature of the melt kneading is 80-110°C.

[0023] A third aspect of the present invention provides an application of the epoxy molding compound in a full-package power module packaging process.

[0024] The epoxy molding compound described in the present invention is prepared by using the specific component of terminal hydroxyl silicone oil, so that the epoxy molding compound can have better molding performance, improve the packaging yield of the prepared epoxy molding compound, and reduce the number of packaging defective products; in addition, in the present invention, by further using the terminal hydroxyl silicone oil in combination with a thermal conductive filler and an adhesion promoter of a specific component, the epoxy molding compound can have more excellent thermal conductivity and molding performance, and at the same time, it also has excellent hot strength, extends the mold cleaning cycle, and improves the level of adhesion to metal, so that the epoxy molding compound described in the present invention can be well used in the packaging process of all-inclusive power modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of sample preparation for the adhesion test in the test example. DETAILED DESCRIPTION

[0026] The specific embodiments of the present invention are described in detail below. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0027] The endpoints and any values ​​of the ranges disclosed in this article are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of each range, the endpoint values ​​of each range and the individual point values, and the individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this article.

[0028] The epoxy molding compound of the invention contains heat-conducting filler, epoxy resin, curing agent, curing accelerator, coupling agent, adhesion modifier, flame retardant, colorant, release agent, terminal hydroxyl silicone oil and dispersing wetting agent.

[0029] In a preferred embodiment, the thermally conductive filler contains aluminum oxide, crystalline silicon dioxide powder and molten spherical silicon dioxide powder. Specifically, the crystalline silicon dioxide powder refers to the silicon dioxide contained therein in a crystalline form, and does not contain amorphous silicon dioxide, which can be a conventional commercial product, for example, it can be a product purchased from Jiangsu Lianrui New Materials Co., Ltd., with a brand name DE1230; the molten spherical silicon dioxide powder refers to a silicon dioxide powder whose morphology is spherical, which can also be a conventional commercial product, for example, it can be a product purchased from Jiangsu Lianrui New Materials Co., Ltd., with a brand name NQ101; the aluminum oxide is preferably spherical aluminum oxide (i.e., spherical alumina), which can be a conventional commercial product. More preferably, the weight ratio of the crystalline silicon dioxide and the molten spherical silicon dioxide is 5-10:1; further preferably, the weight ratio of aluminum oxide, crystalline silicon dioxide powder and molten spherical silicon dioxide powder is 1:1-20:0.2-2.

[0030] In a preferred embodiment, the weight ratio of aluminum oxide, crystalline silica powder and molten spherical silica powder is 1:1-18:0.2-1.5. Specifically, the weight ratio of aluminum oxide, crystalline silica powder and molten spherical silica powder can be 1:1:0.2, 1:5:0.2, 1:10:0.2, 1:15:0.2, 1:18:0.2, 1:1:0.8, 1:5:0.8, 1:10:0.8, 1:15:0.8, 1:18:0.8, 1:1:1, 1:5:1, 1:10:1, 1:15:1, 1:18:1, 1:1:1.5, 1:5:1.5, 1:10:1.5, 1:15:1.5 or 1:18:1.5.

[0031] In a preferred embodiment, the median particle size of the thermally conductive filler is 15-40 μm, preferably 22-28 μm. Specifically, the median particle size of the thermally conductive filler may be 15 μm, 20 μm, 25 μm, 30 μm or 40 μm. It can be understood that the median particle size is the D50 particle size.

[0032] In the present invention, the epoxy resin is selected from one or more of o-cresol epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, linear phenol epoxy resin and dicyclopentadiene epoxy resin, preferably o-cresol epoxy resin and / or dicyclopentadiene epoxy resin.

[0033] In the present invention, the curing agent is selected from one or more of phenol linear phenolic resin and its derivatives, cresol linear phenolic resin and its derivatives, monohydroxy or dihydroxy naphthol phenolic resin and its derivatives, condensation products of p-xylene and phenol or naphthol, and copolymers of dicyclopentadiene and phenol, preferably phenol linear phenolic resin and its derivatives.

[0034] In a preferred embodiment, the curing agent is selected from phenol linear phenolic acid resin and / or phenol alkyl phenolic resin.

[0035] In the present invention, the curing accelerator is selected from one or more of a coupling compound of p-benzoquinone and triphenylphosphine, 1-benzyl 2-methylimidazole, triphenylphosphine, 2-methylimidazole, 2-phenyl-4-methylimidazole and 2-undecylimidazole.

[0036] In a preferred embodiment, the curing accelerator is a combination of 1-benzyl 2-methylimidazole, 2-methylimidazole, 2-phenyl-4-methylimidazole and triphenylphosphine.

[0037] In the present invention, the coupling agent is selected from one or more of γ-glycidyl propyl ether trimethoxysilane, γ-aminopropyl triethoxysilane, γ-mercaptopropyl trimethoxysilane and γ-aminopropyl trimethoxysilane, and more preferably γ-mercaptopropyl trimethoxysilane.

[0038] In the present invention, the adhesion modifier is a triazole compound or a gallic acid compound. More specifically, the triazole compound can be selected from one or more of 3-amino-1,2,4-triazole, 4-amino-1,2,4-triazole and 3-amino-5-mercapto-1,2,4-triazole; the gallic acid compound can be selected from one or more of methyl gallate, ethyl gallate and propyl gallate. More preferably, the adhesion modifier is 3-amino-1,2,4-triazole.

[0039] In the present invention, the flame retardant is selected from at least one of bromine antimony flame retardant, spherical flame retardant, hydrated metal compound flame retardant, organosilicon flame retardant, nitrogen-containing compound flame retardant, organophosphorus flame retardant and organometallic compound flame retardant, more preferably hydrated metal compound flame retardant. Specifically, the hydrated metal compound flame retardant can be zinc borate.

[0040] In the present invention, the colorant is carbon black.

[0041] In a specific embodiment, the release agent is selected from one or more of carnauba wax, ethylene bisstearic acid amide and mineral wax, more preferably ethylene bisstearic acid amide.

[0042] In a specific embodiment, the dispersing wetting agent is a modified silicone polymer, for example, a modified liquid silicone oil and / or a modified silicone polymer. Specifically, the modified liquid silicone oil and the modified silicone polymer can be commercially available products commonly found in the art. For example, the modified silicone polymer can be a product purchased from BYK Chemical with the grades BYK-9142 and BYK-106; the modified liquid silicone oil can be a product purchased from Dow with the grade SF8421EG.

[0043] In the present invention, the use of terminal hydroxyl silicone oil can make the epoxy molding compound of the present invention have excellent molding performance. In addition, the terminal hydroxyl silicone oil of a specific component is matched with a bonding modifier and a thermal conductive filler of a specific component, so that the epoxy molding compound can have excellent molding performance while having excellent thermal conductivity. The epoxy molding compound can be used as a packaging material for a power template, and it is not easy to produce pores during use, thereby improving the packaging molding rate of the power template. Further preferably, the weight ratio of the terminal hydroxyl silicone oil, the thermal conductive filler and the bonding modifier is 1.5-4:700-800:1; more preferably 1.8-2.8:700-800:1. Specifically, the weight ratio of the terminal hydroxyl silicone oil, the thermal conductive filler and the adhesion modifier can be 1.5:700:1, 1.5:750:1, 1.5:700:1, 1.5:800:1, 2:700:1, 2:760:1, 2:800:1, 3:700:1, 3:750:1, 3:700:1, 4:700:1, 4:750:1, 4:760:1 or 4:800:1.

[0044] In a preferred embodiment, based on the total weight of the epoxy molding compound as 100 weight %, the content of the thermally conductive filler is 75-85 weight %, the content of the epoxy resin is 5-15 weight %, the content of the curing agent is 3-7 weight %, the content of the flame retardant is 0.5-8 weight %, the content of the curing accelerator is 0.1-1 weight %, the content of the release agent is 0.1-1 weight %, the content of the adhesion modifier is 0.1-2 weight %, the content of the coupling agent is 0.1-1 weight %, the content of the dispersing wetting agent is 0.1-3 weight %, the content of the terminal hydroxyl silicone oil is 0.05-0.3 weight %, and the content of the colorant is 0.1-1 weight %.

[0045] In a further preferred embodiment, based on the total weight of the epoxy molding compound as 100 weight %, the content of the thermally conductive filler is 78-85 weight %, the content of the epoxy resin is 8-14 weight %, the content of the curing agent is 3-6 weight %, the content of the flame retardant is 2-8 weight %, the content of the curing accelerator is 0.1-0.5 weight %, the content of the release agent is 0.1-0.8 weight %, the content of the adhesion modifier is 0.1-1.5 weight %, the content of the coupling agent is 0.2-0.8 weight %, the content of the dispersing wetting agent is 0.1-2 weight %, the content of the terminal hydroxyl silicone oil is 0.05-0.3 weight %, and the content of the colorant is 0.1-0.5 weight %.

[0046] The present invention also provides a method for preparing the epoxy molding compound, which comprises: mixing thermal conductive filler, epoxy resin, curing agent, curing accelerator, coupling agent, adhesive modifier, flame retardant, colorant, release agent, terminal hydroxyl silicone oil and dispersing wetting agent, then melt-kneading the obtained mixture, and then cooling, crushing and molding.

[0047] In a specific embodiment, the mixture is melt-kneaded using a double-roll mixer.

[0048] In a preferred embodiment, the temperature of the melt-kneading is 80-110° C. Specifically, the temperature of the melt-kneading can be 80° C., 90° C., 100° C. or 110° C.

[0049] The present invention can also provide an application of the epoxy molding compound in the packaging process of a full-package power module. The epoxy molding compound of the present invention benefits from the specific terminal hydroxyl silicone oil used, which can make the epoxy molding compound more excellent in the packaging process of the full-package power module, and improve the yield of the packaged product. At the same time, in the epoxy molding compound of the present invention, the combination of the terminal hydroxyl silicone oil with the thermal conductive filler and the bonding modifier of the specific composition can further improve the molding property of the epoxy molding compound, and can also make the epoxy molding compound have excellent thermal conductivity, which can simultaneously improve the hot strength of the epoxy molding compound, extend the mold cleaning cycle, and improve the level of adhesion to the metal, thereby further improving the packaging molding rate of the power template, reducing the production loss of the power template, and also saving production costs.

[0050] The present invention will be described in detail below through examples, but the protection scope of the present invention is not limited thereto.

[0051] The experimental methods in the following examples, unless otherwise specified, are all conventional methods in the art. The experimental materials used in the following examples, unless otherwise specified, are all commercially available.

[0052] In the following examples and comparative examples, the o-cresol epoxy resin used was purchased from Jinan Shengquan Group Co., Ltd., brand: SQCN700-3;

[0053] Dicyclopentadiene epoxy resin, purchased from DIC Corporation of Japan, brand: HP-7200L;

[0054] Phenol linear phenolic resin was purchased from Jinan Shengquan Group Co., Ltd., brand: PF-8011; phenol alkyl phenolic resin was purchased from Mitsui Chemicals Inc, brand: XLC-4L;

[0055] 1-Benzyl-2-methylimidazole, a common commercial product; 2-methylimidazole, a common commercial product;

[0056] Crystalline silicon dioxide powder (D50: 25 μm) was purchased from Jiangsu Lianrui New Materials Co., Ltd., brand DE1230;

[0057] Fused spherical silica powder (D50 of 20 μm) was purchased from Jiangsu Lianrui New Materials Co., Ltd., brand NQ101;

[0058] Spherical alumina (D50 is 20 μm) was purchased from Jiangsu Lianrui New Materials Co., Ltd., brand NA1240W;

[0059] Dispersed wetting agent modified liquid silicone oil was purchased from Dow, brand: SF8421EG;

[0060] The first modified silicone polymer of the dispersing wetting agent was purchased from BYK Chemical with the brand name BYK-9142;

[0061] The second modified silicone polymer of the dispersing wetting agent was purchased from BYK Chemical with the brand name BYK-106;

[0062] Release agent ethylene bis stearamide, purchased from Nanjing Tianshi, brand: EBS;

[0063] Colorant carbon black, purchased from Mitsubishi Chemical, Japan, brand: MA600;

[0064] Coupling agent γ-mercaptopropyltrimethoxysilane, purchased from Chenguang Chemical, brand: CG-S313;

[0065] Thickener 3-amino-1, 2, 4-triazole, a common commercial product;

[0066] Flame retardant zinc borate was purchased from Shanghai Yushi, brand ZB-10.

[0067] In the following examples and comparative examples, please see Table 1 for the specific selection of ingredients and specific amounts of each raw material used in the preparation of epoxy molding compound.

[0068] Example 1

[0069] The thermal conductive filler, epoxy resin, curing agent, curing accelerator, coupling agent, adhesion modifier, flame retardant, colorant, release agent, terminal hydroxyl silicone oil and dispersing wetting agent are mixed, and then the obtained mixture is melt-mixed on a double-roll mixer at a temperature of 90°C, and then cooled and crushed to obtain a powder material, and then the powder material is molded to obtain an epoxy molding compound.

[0070] Example 2

[0071] The thermal conductive filler, epoxy resin, curing agent, curing accelerator, coupling agent, adhesion modifier, flame retardant, colorant, release agent, terminal hydroxyl silicone oil and dispersing wetting agent are mixed, and then the obtained mixture is melt-mixed on a double-roll mixer at a temperature of 80°C, and then cooled and crushed to obtain a powder material, and then the powder material is molded to obtain an epoxy molding compound.

[0072] Example 3

[0073] The thermal conductive filler, epoxy resin, curing agent, curing accelerator, coupling agent, adhesion modifier, flame retardant, colorant, release agent, terminal hydroxyl silicone oil and dispersing wetting agent are mixed, and then the obtained mixture is melt-mixed on a double-roll mixer at a temperature of 100° C., and then cooled and crushed to obtain a powder material, and then the powder material is molded to obtain an epoxy molding compound.

[0074] Comparative Example 1

[0075] The method of Example 1 was followed, except that the thermally conductive filler used did not contain spherical alumina, and the spherical alumina was replaced with crystalline silicon dioxide powder of the same weight.

[0076] Comparative Example 2

[0077] The method of Example 2 was followed, except that the terminal hydroxyl silicone oil in the epoxy molding compound was replaced with an equal weight of crystalline silicon dioxide powder.

[0078] Comparative Example 3

[0079] The method of Example 1 was used for implementation. However, the epoxy molding compound did not contain spherical alumina and terminal hydroxyl silicone oil. The specific ingredients are shown in Table 1.

[0080] Comparative Example 4

[0081] The method of Example 1 was followed, except that the adhesion modifier in the epoxy molding compound was replaced with an equal weight of phenol linear phenolic resin.

[0082] Comparative Example 5

[0083] The method of Example 1 was followed, except that the thermally conductive filler used did not contain molten spherical silica powder, and the molten spherical silica powder was replaced with an equal weight of crystalline silica powder.

[0084] Comparative Example 6

[0085] The method of Example 1 is used, except that the weight ratio of the terminal hydroxyl silicone oil, the thermal conductive filler and the adhesion modifier is 1:760:1.

[0086] Comparative Example 7

[0087] The method of Example 1 is used, except that the weight ratio of the terminal hydroxyl silicone oil, the thermal conductive filler and the adhesion modifier is 5:760:1.

[0088] Table 1

[0089]

[0090] Test Case

[0091] The properties of the epoxy molding compounds prepared in Examples 1-3 and Comparative Examples 1-7 were tested. The test results are shown in Table 2.

[0092] Gelation time: Use the hot plate method to test, heat the hot plate to 175±1℃, take 0.3-0.5g of the sample powder to be tested and put it on the hot plate. The end point is when the powder gradually changes from fluid to gel, and read the required time;

[0093] Spiral flow length: measured on a transfer molding press with the aid of an EMMI-1-66 spiral flow metal mold, with a molding pressure of 70 ± 2 Kgf / cm 2 , the mold temperature is 175±2℃, and 20±5g of the sample powder to be tested is taken for testing;

[0094] Thermal conductivity: According to the national standard GB / T3139-82, the thermal conductivity of the sample material to be tested is measured using a thermal conductivity meter;

[0095] Molding process performance: For the fully encapsulated power module IPM25, the internal pores are measured by ultrasonic scanning, and the pores on the back are visually inspected. The fewer the number of unqualified fully encapsulated power modules IPM25 after inspection, the better the molding process performance. For example, for the molding process performance parameter "0 / 100", it means that among 100 fully encapsulated power module IPM25 products, 0 have unqualified appearance, and the products with pore size > 100um are considered unqualified products;

[0096] Adhesion test: Sample preparation: Use a low-pressure transfer molding machine at a mold temperature of 175°C, an injection pressure of 70 bar, and a curing time of 110 seconds to mold the sample to be tested on the surface of the sample. Figure 1 As shown. The samples are bare copper sheet and silver-plated copper sheet respectively;

[0097] Adhesion test: A shear force is applied along the surface of the sample at a speed of 2 mm / min to test the maximum force value before the plastic sealant and the sample are separated. For the adhesion test, 5 samples are tested for each embodiment (or comparative example), and the average of the 5 test results is taken as the adhesion test result of the embodiment (or comparative example).

[0098] Table 2

[0099]

[0100] It can be seen from the results in Table 2 that the epoxy molding compound of the present invention can improve the thermal conductivity and adhesion to the metal substrate of the epoxy resin composition while having a good molding process, and has broad application prospects.

[0101] The preferred embodiments of the present invention are described in detail above, but the present invention is not limited thereto. Within the technical concept of the present invention, the technical solution of the present invention can be subjected to a variety of simple modifications, including the combination of various technical features in any other suitable manner, and these simple modifications and combinations should also be regarded as the contents disclosed by the present invention and belong to the protection scope of the present invention.

Claims

1. An epoxy molding compound, characterized in that: The epoxy molding compound contains thermal conductive filler, epoxy resin, curing agent, curing accelerator, coupling agent, adhesion modifier, flame retardant, colorant, release agent, terminal hydroxyl silicone oil and dispersing wetting agent; The thermal conductive filler contains aluminum oxide, crystalline silicon dioxide powder and molten spherical silicon dioxide powder; The bonding modifier is a triazole compound or a gallic acid compound; Based on the total weight of the epoxy molding compound as 100 weight %, the content of the thermal conductive filler is 75-85 weight %, the content of the epoxy resin is 7-15 weight %, the content of the curing agent is 3-7 weight %, the content of the flame retardant is 0.5-8 weight %, the content of the curing accelerator is 0.1-1 weight %, the content of the release agent is 0.1-1 weight %, the content of the adhesion modifier is 0.1-2 weight %, the content of the coupling agent is 0.1-1 weight %, the content of the dispersing and wetting agent is 0.1-3 weight %, the content of the terminal hydroxyl silicone oil is 0.05-0.3 weight %, and the content of the colorant is 0.1-1 weight %; The weight ratio of the terminal hydroxyl silicone oil, the thermal conductive filler and the adhesion modifier is 1.5-4:700-800:

1.

2. The epoxy molding compound according to claim 1, characterized in that: The median particle size of the thermal conductive filler is 15-40 μm.

3. The epoxy molding compound according to claim 1, characterized in that: In the thermally conductive filler, the weight ratio of aluminum oxide, crystalline silicon dioxide powder and molten spherical silicon dioxide powder is 1:1-20:0.2-2.

4. The epoxy molding compound according to claim 1, characterized in that: The epoxy resin is selected from one or more of o-cresol epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, linear phenol epoxy resin and dicyclopentadiene epoxy resin.

5. The epoxy molding compound according to claim 1, characterized in that: The curing agent is selected from one or more of phenol linear phenolic resin and its derivatives, cresol linear phenolic resin and its derivatives, monohydroxy or dihydroxy naphthol phenolic resin and its derivatives, condensation products of p-xylene and phenol or naphthol, and copolymers of dicyclopentadiene and phenol; and / or The curing accelerator is selected from one or more of a coupling compound of p-benzoquinone and triphenylphosphine, 1-benzyl 2-methylimidazole, triphenylphosphine, 2-methylimidazole, 2-phenyl-4-methylimidazole and 2-undecylimidazole.

6. The epoxy molding compound according to claim 1, characterized in that: The coupling agent is selected from one or more of γ-glycidyl propyl ether trimethoxy silane, γ-aminopropyl triethoxy silane, γ-mercaptopropyl trimethoxy silane and γ-aminopropyl trimethoxy silane; and / or The release agent is selected from one or more of carnauba wax, ethylene bisstearamide and mineral wax; and / or The colorant is carbon black.

7. The epoxy molding compound according to claim 1, characterized in that: The flame retardant is selected from at least one of bromine antimony flame retardants, spherical flame retardants, hydrated metal compound flame retardants, organic silicon flame retardants, nitrogen-containing compound flame retardants, organic phosphorus flame retardants and organic metal compound flame retardants.

8. The epoxy molding compound according to claim 1, characterized in that: The dispersing wetting agent is a modified organic silicon polymer.

9. A method for preparing the epoxy molding compound according to any one of claims 1 to 8, characterized in that: The method comprises: mixing a thermal conductive filler, an epoxy resin, a curing agent, a curing accelerator, a coupling agent, an adhesive modifier, a flame retardant, a colorant, a release agent, a terminal hydroxyl silicone oil and a dispersing wetting agent, then melting and kneading the obtained mixture, and then cooling, crushing and molding; Preferably, the mixture is melt-kneaded using a double-roll mixer; Preferably, the temperature of the melt kneading is 80-110°C.

10. Use of the epoxy molding compound according to any one of claims 1 to 8 in a packaging process of a full-package power module.

Images