Hybrid packaging structure of integrated circuit chip

Abstract

The invention discloses a mixed packaging structure of an integrated circuit chip, and relates to the technical field of semiconductor chip packaging, the mixed packaging structure comprises an outer packaging layer, the outer packaging layer comprises a bottom fixing plate layer, the inner wall of the bottom fixing plate layer is sleeved with a chip assembly, the chip assembly comprises a chip main body, and the chip main body is provided with a plurality of through holes. The bottom end of the chip main body is electrically connected with a plurality of groups of pins, the outer walls of the plurality of groups of pins are sleeved with buffer pads, and the outer wall of the chip main body is sleeved with a sealing sleeve located below the buffer pads. When the radiator is installed on the mainboard, the metal base of the radiator is attached to the outer wall of the upper metal gland, and the upper metal gland is pushed to slide on the inner wall of the bottom fixing plate layer, so that heat-conducting silicone grease in the material storage bag flows to the position between the copper foil layer and the protruding strips; therefore, heat generated by the chip main body can be efficiently transmitted to the radiator.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, in particular to a hybrid packaging structure of an integrated circuit chip. Background Art

[0002] An integrated circuit is a miniature electronic device or component. An integrated circuit is made using a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit. It is then made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function. During the assembly process of integrated circuits, integrated circuits are usually assembled into cores through packaging processing. For example, electronic components such as the CPU in a computer are relatively common integrated circuit chips.

[0003] The existing patent (publication number: CN118431172B) discloses a hybrid packaging structure of an integrated circuit chip, which belongs to the field of semiconductor processing technology, and includes an upper packaging component and a lead frame. The upper packaging component includes an upper packaging plate, a buffer pressure plate and a limit frame. The lead frame is connected to the limit fixing plate and the chip, and also includes: a lower packaging component, the lower packaging component includes a lower packaging frame, and the lower packaging frame is connected to a one-way air intake valve, a plug-in strip and an air pressure sensor; a buffer component, the buffer component can absorb the stress generated by the chip and the lower packaging frame to avoid damage to both, and it absorbs the impact force of the lead frame during vibration, thereby reducing the damage to the chip caused by the stress and improving the applicability; and under specific circumstances, the inside of the airbag can be quickly inflated to ensure a temporary buffering effect, thereby avoiding damage to the chip, the lead frame or the packaging component due to failure to detect and discover in time during the working process, thereby reducing maintenance costs.

[0004] However, the above technical solution still has certain defects. The above technical solution supports the chip body through the airbag, so that the external heat is not easily transferred to the chip, thereby reducing the risk of chip overheating and damage. However, it ignores the large amount of heat generated by the chip itself during operation. There is a gap between the chip body and the upper packaging plate, which causes the heat generated by the chip itself to be unable to be efficiently transferred to the radiator, resulting in chip damage. Therefore, a hybrid packaging structure of an integrated circuit chip is proposed. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a hybrid packaging structure of an integrated circuit chip, which can efficiently transfer the heat generated by the chip body to the heat sink, thereby improving the service life and performance of the chip.

[0006] An embodiment of the present invention provides a hybrid packaging structure of an integrated circuit chip, comprising an outer packaging layer, the outer packaging layer comprising a bottom fixed plate layer, the inner wall of the bottom fixed plate layer being sleeved with a chip component, the chip component comprising a chip body, the bottom end of the chip body being electrically connected to a plurality of groups of pins, the outer walls of the plurality of groups of pins being sleeved with a buffer pad, the outer wall of the chip body being sleeved with a sealing sleeve located below the buffer pad, the sealing sleeve being slidably sleeved on the outer walls of the plurality of groups of pins, and the top end of the chip body being sleeved with a heat dissipation layer located inside the outer packaging layer; The heat dissipation layer includes a sealing silicone pad located inside the sealing sleeve, the sealing silicone pad is attached to the top of the chip body, the bottom of the sealing silicone pad is fixedly connected to multiple groups of convex strips, the multiple groups of convex strips respectively surround the outside of the multiple cores of the chip body, the sealing silicone pad is provided with a groove at the connection with the convex strip, the top of the sealing silicone pad is fixedly connected to a pressure strip, the pressure strip is located directly above the groove, the top of the sealing silicone pad is fixedly connected to multiple groups of material storage capsules, the side walls of each group of the material storage capsules are respectively connected to a group of capillaries, the capillaries penetrate the convex strips and extend to the top of the chip body, and the multiple groups of material storage capsules are filled with thermal conductive silicone grease.

[0007] According to some embodiments of the present invention, multiple groups of copper foil layers are fixedly connected to the top of the convex strip, and the multiple groups of copper foil layers are respectively located above the core of a group of chip bodies. The copper foil layers and the convex strip form a closed cavity above the core of the chip body.

[0008] According to some embodiments of the present invention, the outer packaging layer also includes an upper metal pressure cover, which is slidably sleeved on the inner wall of the bottom fixed plate layer near the top, and the bottom end of the upper metal pressure cover is attached to the top of the multiple groups of storage bags.

[0009] According to some embodiments of the present invention, a plurality of groups of capsules are fixedly connected to the inner wall of the bottom fixed plate layer near the edge, the top ends of the plurality of groups of capsules are attached to the bottom end of the upper metal pressure cover, the bottom end of each group of capsules is respectively connected to a plurality of groups of glue nozzles, the glue nozzles extend to the inner wall of the bottom fixed plate layer, and the bottom fixed plate layer is provided with an opening at the contact position with the glue nozzle.

[0010] According to some embodiments of the present invention, the inner wall of the glue outlet nozzle is connected to an hourglass-shaped rubber sleeve, and a through hole is opened at the place where the glue outlet nozzle is connected to the hourglass-shaped rubber sleeve. Two groups of elastic sheets are fixedly connected to the side walls of the hourglass-shaped rubber sleeve, and the ends of the two groups of elastic sheets are fixedly connected to the inner wall of the glue outlet nozzle.

[0011] According to some embodiments of the present invention, the bottom end of the bottom fixed plate layer is fixedly sleeved with a plurality of groups of external connection mechanisms, and the top end of each group of the external connection mechanisms is respectively attached to the bottom end of a group of pins.

[0012] According to some embodiments of the present invention, the external mechanism includes a metal sleeve, the metal sleeve is fixedly mounted at the bottom end of the bottom fixed plate layer, the top end of the metal sleeve is attached to the bottom end of the pin, and a ceramic ring is provided on the inner wall of the metal sleeve near the bottom fixed sleeve, and the ceramic ring is made of heat insulating material.

[0013] According to some embodiments of the present invention, the inner wall sliding sleeve of the ceramic ring is provided with a conductive seat, the top of the conductive seat extends to the inner wall of the metal sleeve, the top of the conductive seat is fixedly connected to two groups of spring bars, and the top of the spring bars is fixedly connected to the top of the metal sleeve.

[0014] According to some embodiments of the present invention, a plurality of groups of jaws are fixedly connected to the top of the conductive seat, two groups of carbon sheets are fixedly connected to the end of each group of jaws, a conductive strip is slidably arranged between the two groups of carbon sheets at the end of the same jaw, and the conductive strip is fixedly connected to the inner wall of the metal sleeve.

[0015] In summary, the present invention mainly has the following beneficial effects: 1. When the radiator is mounted on the mainboard, the metal seat of the radiator is attached to the outer wall of the upper metal pressure cover, and the upper metal pressure cover is pushed to slide on the inner wall of the bottom fixed plate layer, so that the thermal conductive silicone grease inside the storage bag flows to between the copper foil layer and the convex strip, so that the heat generated by the chip body can be efficiently transferred to the radiator, and when the chip is not assembled on the mainboard, the thermal conductive silicone grease is located inside the storage bag, thereby preventing the thermal conductive silicone grease from flowing freely inside the packaging structure; 2. After the chip is fixed on the mainboard, the present invention allows the resin glue in the capsule to flow out from the glue outlet while the radiator is installed, so that the resin glue is distributed at the edge of the bottom fixed plate layer, thereby fixing the edge of the bottom fixed plate layer and the mainboard together, the chip is not easy to loosen on the mainboard, and the connection between the conductive seat and the mainboard is sealed, thereby avoiding the problem of solder joint oxidation and loosening in the later stage; 3. The present invention relieves pressure to a certain extent by causing the liquid material in the capsule and the storage bag to flow out when the upper metal pressure cover is subjected to pressure, and the conductive seat slides inside the ceramic ring to compress the spring bar, so that the pressure applied by the radiator on the upper metal cover will not damage the chip, and the ceramic ring isolates the heat, while the contact area between the conductive seat and the metal sleeve is small, and a buffer pad and a sealing sleeve are also provided on the outside of the chip body, so that the heat on the main board is not easily transferred to the chip body, thereby avoiding the heat generated by other electronic components from being transferred to the chip body. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the bottom structure of the packaging structure of the present invention; Figure 2It is a schematic diagram of the explosion structure of the packaging structure of the present invention; Figure 3 It is a schematic diagram of the structure of the heat dissipation layer of the present invention when viewed from above; Figure 4 It is a schematic diagram of the top view structure of the heat dissipation layer of the present invention; Figure 5 It is a schematic diagram of the cross-sectional structure of the packaging structure of the present invention; Figure 6 It is a schematic diagram of the cross-sectional structure of the chip assembly of the present invention; Figure 7 It is a schematic diagram of the cross-sectional structure of the external connection mechanism of the present invention; Figure 8 It is a schematic diagram of the structure of the capsule and the bottom fixed plate layer of the present invention; Fig. 9 It is a schematic diagram of the cross-sectional structure of the capsule of the present invention; Fig.10 For the present invention Fig. 9 Enlarged structural diagram at A in the middle.

[0017] In the figure: 1. External packaging layer; 2. Heat dissipation layer; 3. External connection mechanism; 4. Chip assembly; 101, bottom fixed plate layer; 102, upper metal pressure cover; 103, capsule; 104, glue outlet; 105, through hole; 106, hourglass-shaped rubber sleeve; 107, elastic sheet; 201, sealing silicone pad; 202, convex strip; 203, groove; 204, pressure strip; 205, copper foil layer; 206, material storage bag; 207, capillary; 301, metal sleeve; 302, ceramic ring; 303, conductive seat; 304, clamping claw; 305, carbon sheet; 306, conductive strip; 307, spring strip; 401, chip body; 402, pin; 403, buffer pad; 404, sealing sleeve. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0019] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0020] In the description of the present invention, the meaning of "multiple groups" is more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0021] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0022] The technical solution of the present invention is described in detail below through the accompanying drawings and specific embodiments: A hybrid packaging structure of an integrated circuit chip, such as Figures 1 to 10 As shown, it includes an outer packaging layer 1, the outer packaging layer 1 includes a bottom fixed plate layer 101, the inner wall of the bottom fixed plate layer 101 is sleeved with a chip component 4, the chip component 4 includes a chip body 401, the bottom end of the chip body 401 is electrically connected to multiple groups of pins 402, the outer walls of the multiple groups of pins 402 are sleeved with buffer pads 403, the outer wall of the chip body 401 is sleeved with a sealing sleeve 404 located below the buffer pad 403, the sealing sleeve 404 is slidably sleeved on the outer walls of the multiple groups of pins 402, and the top of the chip body 401 is sleeved with a heat dissipation layer 2 located inside the outer packaging layer 1; The heat dissipation layer 2 includes a sealing silicone pad 201 located inside the sealing sleeve 404, the sealing silicone pad 201 is attached to the top of the chip body 401, the bottom of the sealing silicone pad 201 is fixedly connected to multiple groups of convex strips 202, and the multiple groups of convex strips 202 are respectively surrounded by the outside of the multiple groups of cores of the chip body 401, and the sealing silicone pad 201 is provided with a groove 203 at the connection with the convex strip 202, and the top of the sealing silicone pad 201 is fixedly connected to a pressure strip 204, and the pressure strip 204 is located directly above the groove 203. A plurality of groups of material storage capsules 206 are fixedly connected to the top of the pad 201, and the side walls of each group of the material storage capsules 206 are respectively connected to a group of capillaries 207, and the capillaries 207 penetrate the convex strips 202 and extend to the top of the chip body 401. The plurality of groups of material storage capsules 206 are filled with thermal grease, and a plurality of groups of copper foil layers 205 are fixedly connected to the top of the convex strips 202. The plurality of groups of copper foil layers 205 are respectively located above the core of a group of chip bodies 401, and the copper foil layers 205 and the convex strips 202 form a closed cavity above the core of the chip body 401.

[0023] During the computer assembly process, the entire integrated circuit chip is installed in the CPU seat on the motherboard. Then, when the user installs the radiator, the radiator is fixed to the motherboard by bolts, so that the metal seat of the radiator is pressed against the outer wall of the upper metal pressure cover 102, thereby pushing the upper metal pressure cover 102 to slide on the inner wall of the bottom fixed plate layer 101, so that the upper metal pressure cover 102 squeezes the storage bag 206. At this time, the thermal grease inside the storage bag 206 flows out from the inside of the capillary 207, so that the thermal grease flows to the outside of the chip body 401. At this time, the enclosed space formed by the convex strip 202 and the copper foil layer 205 is filled with the thermal grease, and then As the upper metal pressure cover 102 is further pressed down, the upper metal pressure cover 102 pushes the pressure strip 204, which is located directly above the groove 203. Therefore, as the pressure strip 204 is pressed down, the groove 203 is deformed, thereby pushing the convex strip 202 to fit tightly against the core outside of the chip body 401, so that the thermal grease on the chip body 401 is blocked by the convex strip 202 and the copper foil layer 205 and cannot flow freely, thereby preventing the thermal grease from flowing into other parts, thereby forming a cavity in the space formed by the convex strip 202 and the copper foil layer 205, which affects heat dissipation, and at this time, the upper metal pressure cover 102 is tightly fitted with the copper foil layer 205.

[0024] Please refer to Figure 1 , Figure 2 , Figure 5 , Figure 8 , Fig. 9 and Fig.10 The outer packaging layer 1 further comprises an upper metal pressure cover 102, which is slidably sleeved on the inner wall of the bottom fixed plate layer 101 near the top, and the bottom end of the upper metal pressure cover 102 is attached to the top of multiple groups of storage capsules 206, and multiple groups of capsules 103 are fixedly connected to the inner wall of the bottom fixed plate layer 101 near the edge, and the tops of the multiple groups of capsules 103 are attached to the bottom end of the upper metal pressure cover 102, and the bottom end of each group of capsules 103 is respectively connected to multiple groups of glue nozzles 106. 4. The glue nozzle 104 extends to the inner wall of the bottom fixed plate layer 101, and the bottom fixed plate layer 101 is provided with an opening at the contact position with the glue nozzle 104. The inner wall of the glue nozzle 104 is connected with an hourglass-shaped rubber sleeve 106. The glue nozzle 104 is provided with a through hole 105 at the connection position with the hourglass-shaped rubber sleeve 106. The side wall of the hourglass-shaped rubber sleeve 106 is fixedly connected with two groups of elastic sheets 107, and the ends of the two groups of elastic sheets 107 are fixedly connected to the inner wall of the glue nozzle 104.

[0025] When the upper metal pressure cover 102 is pushed by the radiator, the upper metal pressure cover 102 squeezes the capsule 103, so that the pressure inside the capsule 103 increases, so that the resin glue inside the capsule 103 opens the hourglass-shaped rubber sleeve 106, and the two sets of elastic sheets 107 are bent. At this time, the resin glue passes through the hourglass-shaped rubber sleeve 106 and flows out of the through hole 105. Before the radiator is installed, the elastic force of the elastic sheet 107 closes the hourglass-shaped rubber sleeve 106, and the pressure of the resin glue inside the capsule 103 cannot open the hourglass-shaped rubber sleeve 106, so the resin glue cannot flow out from the opening, and then the resin glue flows to the surrounding of the bottom fixed plate layer 101 along the opening. , and part of the resin glue does not completely flow out inside the opening, so that the resin glue extends from the edge of the bottom fixed plate layer 101 to the inside of the opening, so that the resin glue has enough contact area with the bottom fixed plate layer 101 after solidification, and the connection between the conductive seat 303 and the mainboard is sealed, thereby preventing moisture in the outside air from causing oxidation corrosion to the welding point between the conductive seat 303 and the mainboard, making the chip and the mainboard connected more tightly, and when the radiator is disassembled later, it is not easy for the radiator to adhere to the CPU and cause the CPU to be forced to be pulled out of the CPU base, thereby avoiding damage to the mainboard and chip.

[0026] Please refer to Figure 1 , Figure 2 , Figure 5 and Figure 7 The bottom end of the bottom fixed plate layer 101 is fixedly sleeved with multiple groups of external mechanisms 3, and the top of each group of the external mechanisms 3 is respectively attached to the bottom end of a group of pins 402. The external mechanisms 3 include a metal sleeve 301, which is fixedly sleeved on the bottom end of the bottom fixed plate layer 101, and the top of the metal sleeve 301 is attached to the bottom end of the pin 402. The inner wall of the metal sleeve 301 is fixedly sleeved with a ceramic ring 302 near the bottom end, and the ceramic ring 302 is made of a heat-insulating material. The inner wall sliding sleeve of the ceramic ring 302 is provided with a conductive seat 3 03, the top of the conductive seat 303 extends to the inner wall of the metal sleeve 301, the top of the conductive seat 303 is fixedly connected with two groups of spring bars 307, the top of the spring bars 307 is fixedly connected to the top of the metal sleeve 301, the top of the conductive seat 303 is fixedly connected with multiple groups of jaws 304, the ends of each group of jaws 304 are respectively fixedly connected with two groups of carbon sheets 305, a conductive strip 306 is slidably arranged between the two groups of carbon sheets 305 at the end of the same jaw 304, and the conductive strip 306 is fixedly connected to the inner wall of the metal sleeve 301.

[0027] When installing the radiator, the pressure on the entire packaging structure causes the liquid material in the capsule 103 and the storage bag 206 to flow out, thereby relieving the pressure to a certain extent. At the same time, the conductive seat 303 also slides with the ceramic ring 302 under the action of the downward pressure, so that the conductive seat 303 drives the clamping claw 304 to slide inside the metal sleeve 301, thereby causing relative sliding between the carbon sheet 305 and the conductive strip 306. The carbon sheet 305 has excellent conductivity, so the conductive seat 303 still maintains electrical connection with the metal sleeve 301. The spring bar 307 is compressed by the conductive seat 303, thereby preventing the pressure applied by the heat dissipation from exceeding the bearing limit of the conductive seat 303 and preventing the conductive seat 303 from bending. The heat insulation ability of the ceramic ring 302 and the conductive seat 303 connected to the metal sleeve 301 through the carbon sheet 305 with a smaller area make it difficult for the heat received by the conductive seat 303 to be transferred to the inside of the outer packaging layer 1, thus preventing the heat generated by other electronic components from being transferred to the chip body 401, thereby protecting the entire chip and extending the service life of the chip.

[0028] When in use, when the radiator is installed on the mainboard, the metal seat of the radiator is attached to the outer wall of the upper metal pressure cover 102, and the upper metal pressure cover 102 is pushed to slide on the inner wall of the bottom fixed plate layer 101, so that the thermal grease inside the storage bag 206 flows to between the copper foil layer 205 and the convex strip 202, so that the heat generated by the chip body 401 can be efficiently transferred to the radiator, and when the chip is not assembled on the mainboard, the thermal grease is located inside the storage bag 206, thereby preventing the thermal grease from flowing freely inside the packaging structure. The parts not involved in the device are the same as the prior art or can be implemented by the prior art.

[0029] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A hybrid packaging structure of an integrated circuit chip, comprising an outer packaging layer (1), characterized in that: The outer packaging layer (1) comprises a bottom fixed plate layer (101), the inner wall of the bottom fixed plate layer (101) is sleeved with a chip component (4), the chip component (4) comprises a chip body (401), the bottom end of the chip body (401) is electrically connected to a plurality of groups of pins (402), the outer walls of the plurality of groups of pins (402) are sleeved with a buffer pad (403), the outer wall of the chip body (401) is sleeved with a sealing sleeve (404) located below the buffer pad (403), the sealing sleeve (404) is slidably sleeved on the outer walls of the plurality of groups of pins (402), and the top end of the chip body (401) is sleeved with a heat dissipation layer (2) located inside the outer packaging layer (1); The heat dissipation layer (2) comprises a sealing silicone pad (201) located inside the sealing sleeve (404), the sealing silicone pad (201) is attached to the top of the chip body (401), the bottom of the sealing silicone pad (201) is fixedly connected to multiple groups of convex strips (202), the multiple groups of convex strips (202) respectively surround the outside of multiple groups of cores of the chip body (401), the sealing silicone pad (201) is provided with a groove (203) at the connection with the convex strips (202), and the sealing silicone pad (201) is provided with a groove (203) at the connection with the convex strips (202). The top of the pad (201) is fixedly connected to a pressure strip (204), and the pressure strip (204) is located directly above the groove (203). The top of the sealing silicone pad (201) is fixedly connected to multiple groups of material storage capsules (206), and the side walls of each group of the material storage capsules (206) are respectively connected to a group of capillaries (207), and the capillaries (207) pass through the convex strip (202) and extend to the top of the chip body (401). The multiple groups of material storage capsules (206) are filled with thermal conductive silicone grease.

2. The hybrid packaging structure of integrated circuit chip according to claim 1, characterized in that: The top of the convex strip (202) is fixedly connected to a plurality of groups of copper foil layers (205), the plurality of groups of copper foil layers (205) are respectively located above the core of a group of chip bodies (401), and the copper foil layers (205) and the convex strip (202) form a closed cavity above the core of the chip body (401).

3. The hybrid packaging structure of integrated circuit chip according to claim 1, characterized in that: The outer packaging layer (1) further comprises an upper metal pressure cover (102), wherein the upper metal pressure cover (102) is slidably sleeved on the inner wall of the bottom fixed plate layer (101) near the top, and the bottom end of the upper metal pressure cover (102) is attached to the top ends of the plurality of groups of material storage bags (206).

4. The hybrid packaging structure of integrated circuit chips according to claim 1, characterized in that: The inner wall of the bottom fixed plate layer (101) is fixedly connected to a plurality of groups of capsules (103) at the edge, the top ends of the plurality of groups of capsules (103) are attached to the bottom end of the upper metal pressure cover (102), and the bottom end of each group of capsules (103) is respectively connected to a plurality of groups of glue outlet nozzles (104), the glue outlet nozzles (104) extending to the inner wall of the bottom fixed plate layer (101), and the bottom fixed plate layer (101) is provided with an opening at a position in contact with the glue outlet nozzles (104).

5. The hybrid packaging structure of integrated circuit chip according to claim 4, characterized in that: The inner wall of the glue outlet nozzle (104) is connected to an hourglass-shaped rubber sleeve (106); a through hole (105) is provided at the place where the glue outlet nozzle (104) is connected to the hourglass-shaped rubber sleeve (106); two groups of elastic sheets (107) are fixedly connected to the side wall of the hourglass-shaped rubber sleeve (106); and the ends of the two groups of elastic sheets (107) are fixedly connected to the inner wall of the glue outlet nozzle (104).

6. The hybrid packaging structure of integrated circuit chips according to claim 1, characterized in that: A plurality of groups of external connection mechanisms (3) are fixedly sleeved on the bottom end of the bottom fixed plate layer (101), and the top end of each group of external connection mechanisms (3) is respectively fitted on the bottom end of a group of pins (402).

7. The hybrid packaging structure of integrated circuit chips according to claim 6, characterized in that: The external connection mechanism (3) comprises a metal sleeve (301), the metal sleeve (301) being fixedly sleeved on the bottom end of the bottom fixed plate layer (101), the top end of the metal sleeve (301) being abutted against the bottom end of the pin (402), and the inner wall of the metal sleeve (301) being fixedly sleeved near the bottom end with a ceramic ring (302), the ceramic ring (302) being made of a heat insulating material.

8. The hybrid packaging structure of integrated circuit chips according to claim 7, characterized in that: The inner wall sliding sleeve of the ceramic ring (302) is provided with a conductive seat (303), the top end of the conductive seat (303) extends to the inner wall of the metal sleeve (301), the top end of the conductive seat (303) is fixedly connected to two groups of spring bars (307), and the top end of the spring bars (307) is fixedly connected to the top end of the metal sleeve (301).

9. The hybrid packaging structure of integrated circuit chips according to claim 8, characterized in that: A plurality of groups of clamping jaws (304) are fixedly connected to the top of the conductive seat (303), two groups of carbon sheets (305) are fixedly connected to the ends of each group of clamping jaws (304), and a conductive strip (306) is slidably arranged between the two groups of carbon sheets (305) at the ends of the same clamping jaw (304), and the conductive strip (306) is fixedly connected to the inner wall of the metal sleeve (301).

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