Heat regeneration device based on solid elastic card refrigeration and heating and refrigeration and heating device

Abstract

The invention provides a heat regeneration device based on solid elastic clamping refrigeration and heating and a refrigeration and heating device. The heat regeneration device comprises a fixing mechanism, solid elastic clamping refrigeration and heating materials with penetrating holes, a driving mechanism and a sleeve, and the fixing mechanism and the driving mechanism are arranged in the sleeve; the driving mechanism comprises a dynamic pressure head provided with a through hole, and the dynamic pressure head extends into the fixing mechanism to load or unload stress on the solid elastic clamping refrigerating and heating material; the penetrating holes in the solid elastic card refrigerating and heating materials are arranged to form a cavity channel, and the cavity channel is communicated with the through hole and used for enabling heat conduction fluid to exchange heat generated by the solid elastic card refrigerating and heating materials when the heat conduction fluid flows. The fixing mechanism is used for fixing the solid elastic clamping material plates, movement of the solid elastic clamping material plates is limited, dislocation is formed, meanwhile, the dynamic pressure head of the driving mechanism stretches into the fixing mechanism to apply stress to the solid elastic clamping material plates, it can be ensured that all the solid elastic clamping material plates generate phase change, and the refrigerating and heating efficiency is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of refrigeration and heating, and in particular relates to a heat recovery device and a refrigeration and heating device based on solid-state spring-clip refrigeration and heating. Background Art

[0002] Solid-state spring card cooling and heating is an emerging green and environmentally friendly cooling and heating technology. By loading or unloading solid-state spring card materials, it causes phase change or reverse phase change to generate heat or cold, thereby achieving cooling or heating.

[0003] In the cooling and heating device prepared based on this principle, when the driving device therein is loaded with solid-state spring-loaded materials, more solid-state spring-loaded materials are required in order to generate sufficient heat or cold. In practical applications, solid-state spring-loaded materials are usually designed to be assembled with multiple solid-state spring-loaded material units. In the process of applying stress by the driving device, it is easy to cause multiple solid-state spring-loaded material units to be misaligned, and the flow cavity to be blocked, resulting in a decrease in the thermal conductivity of the heat transfer fluid. At the same time, after the solid-state spring-loaded material units are misaligned, the driving device may not be able to fully apply stress to the surface of the solid-state spring-loaded material plate during the loading process, causing some solid-state spring-loaded material units to be unable to undergo phase change, resulting in a decrease in heat and cold generation, and a decrease in cooling and heating efficiency. Summary of the invention

[0004] The embodiment of the present application provides a heat recovery device based on solid-state spring clip cooling and heating, comprising: a fixing mechanism, a solid-state spring clip cooling and heating material with perforations arranged in sequence in the fixing mechanism, a driving mechanism and a sleeve, wherein the fixing mechanism and the driving mechanism are arranged in the sleeve;

[0005] The driving mechanism includes a dynamic pressure head provided with a through hole, and the dynamic pressure head extends into the fixing mechanism to load stress or unload stress on the solid spring card refrigeration and heating material;

[0006] The perforations on each of the solid spring card cooling and heating materials are arranged to form a cavity, and the cavity is connected to the through hole, so that the heat transfer fluid can exchange heat generated by the solid spring card cooling and heating material when flowing.

[0007] Furthermore, the dynamic pressure head matches the cross-sectional shape of one end of the solid spring card that contacts the cooling and heating material, and the through hole is located at the center of the dynamic pressure head and is coaxial with the cavity.

[0008] Furthermore, the driving mechanism further comprises: a first hydraulic pressure head fixed to one end of the dynamic pressure head, a liquid separation pipeline being arranged in the first hydraulic pressure head, and the liquid separation pipeline being connected to the through hole for conducting the heat transfer fluid out.

[0009] Furthermore, the driving mechanism further comprises: a driving pressure head fixed to the other end of the first hydraulic pressure head, and the other end of the driving pressure head is fixed on the driver.

[0010] Furthermore, the first liquid distribution pipeline includes: a main pipeline, a first branch pipeline and a second branch pipeline respectively connected to the main pipeline; the main pipeline is connected to the through hole, the first branch pipeline is used to allow the heat transfer fluid to flow out, and the second branch pipeline is used to allow the heat transfer fluid to flow in.

[0011] Furthermore, a slide rail is arranged in the sleeve, and tracks matching with the slide rail are arranged on the surfaces of the first hydraulic head and the driving head, so as to slide along the slide rail when the driving mechanism is loaded or unloaded.

[0012] Furthermore, the fixing mechanism is made of polymer material.

[0013] Furthermore, it also includes: a water diversion plug, which is arranged at the other end of the fixing mechanism, and the water diversion plug is provided with a liquid through hole, and the liquid through hole is coaxial with the cavity.

[0014] Furthermore, it also includes: the second liquid-dividing head includes a main line, a first liquid-dividing line and a second liquid-dividing line, and the main line is communicated with the liquid through hole, the first liquid-dividing line and the second liquid-dividing line respectively.

[0015] The present invention provides a refrigeration and heating device, comprising: a heat recovery device and a heat exchange device as described above;

[0016] The heat recovery device is connected to the heat exchange device through a pipeline, and is used to transmit the heat transfer fluid that is heated up after absorbing heat or the heat transfer fluid that is cooled down after releasing heat to the heat exchange device for heat exchange.

[0017] The present invention uses a fixing mechanism to fix the solid-state spring-cage material, restricting its movement to form a dislocation blocking perforation. At the same time, the dynamic pressure head of the driving mechanism extends into the fixing mechanism to apply stress to the solid-state spring-cage material plate, which can ensure that all solid-state spring-cage material plates undergo phase change, thereby improving the cooling and heating efficiency. In addition, the use of polymer materials for the fixing mechanism can further accommodate the lateral collision caused during the stress application process, buffer its lateral stress, and at the same time improve the prevention of heat loss of the heat transfer fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 A side structural diagram of a heat recovery device provided by the present invention;

[0020] Figure 2 A schematic diagram of stacking a solid-state spring-cage refrigeration and heating material provided by the present invention;

[0021] Figure 3 A cross-sectional detail diagram of the solid-state spring-clip refrigeration and heating material provided by the present invention. DETAILED DESCRIPTION

[0022] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0023] like Figure 1 The figure shows a heat recovery device based on solid-state spring card cooling and heating provided by the present invention, comprising: a fixing mechanism 1, solid-state spring card cooling and heating materials 2 arranged in sequence in the fixing mechanism 1, a driving mechanism 3 and a sleeve 4, wherein the fixing mechanism 1 and the driving mechanism 3 are arranged in the sleeve 4;

[0024] The driving mechanism 3 includes a dynamic pressure head 31 provided with a through hole 311, and the dynamic pressure head 31 extends into the fixing mechanism 1 to load stress or unload stress on the solid spring-clip refrigeration and heating material 2;

[0025] The perforations on the solid spring card cooling and heating material 2 are arranged to form a cavity, which is connected to the through hole 311 to allow the heat transfer fluid to exchange heat generated by the solid spring card cooling and heating material 2 when flowing.

[0026] In this embodiment, Figure 2 As shown, the fixing mechanism 1 is used to fix the solid-state spring-clip cooling and heating materials 2 that are stacked and arranged in sequence according to the cross section. The fixing method of the fixing mechanism 1 is not limited, as long as there is enough space at one or both ends after fixing to facilitate the insertion of the dynamic pressure head 31. Preferably, the fixing mechanism is a cylinder, cube, rectangular parallelepiped, etc. with a cavity inside, and its inner wall is in close contact with the solid-state spring-clip cooling and heating material 2, so that during the assembly process, the solid-state spring-clip cooling and heating material 2 can be placed in the fixing mechanism. It should be noted that the solid-state spring-clip cooling and heating material 2 can be in the shape of a block, plate, or sheet, and its shape is not limited.

[0027] It should be noted that the fixing mechanism 1 is preferably made of a polymer material, specifically nylon, polyester, hard silicone, resin, etc., preferably polytetrafluoroethylene. During the process of stress loading by the driving mechanism 3, the solid spring-cage refrigeration and heating material 2 will expand laterally. The use of a polymer material can accommodate its expanded size and buffer the lateral pressure. On the other hand, the polymer material has weak thermal conductivity and can also prevent the heat loss of the heat-conducting fluid.

[0028] In this embodiment, the solid spring-cage cooling and heating material 2 is provided with perforations. When stacked, the perforations are aligned to form a cavity for the heat transfer fluid to flow. For further convenience of assembly, an alignment piece can be provided on the inner wall of the fixing mechanism, which can be a notch, an irregular shape or an external stopper. At the same time, each solid spring-cage cooling and heating material 2 is provided with a corresponding alignment mark according to the alignment piece. A preferred embodiment, such as Figure 3 As shown, it is preferred to set an irregular shape, and the specific shape is not limited. It should be noted that the shape of the perforation is not limited, and can be one or more of square, circular, radial or spiral. Preferably, in order to improve the heat exchange capacity, a radial or spiral shape is selected.

[0029] Furthermore, the dynamic pressure head 31 in the driving mechanism 3 has the same cross-sectional shape as the end in contact with the solid-state spring-clip cooling and heating material 2, and the through hole 311 is located at the center of the dynamic pressure head 31 and is coaxial with the cavity. In this embodiment, the dynamic pressure head 31 matches the cross-sectional shape of the end of the solid-state spring-clip cooling and heating material 2 to which stress is applied. For example, when the shapes are the same and stress is applied, the cross-sectional shapes of the dynamic pressure head 31 and the solid-state spring-clip cooling and heating material 2 overlap with each other, or the shapes of the two are different, and the cross-sectional shape of the dynamic pressure head 31 completely covers the cross-sectional shape of the solid-state spring-clip cooling and heating material, which can ensure that the driving mechanism 3 causes the solid-state spring-clip cooling and heating material to completely undergo a phase change when stress is applied, thereby improving the efficiency of cooling and heating. In addition, setting the through hole 311 at the center of the dynamic pressure head 31 can ensure that the heat transfer fluid in the cavity at all angles is uniform and flows out of the through hole 311 at the same flow rate.

[0030] It should be noted that the thickness of the solid spring card material plate is 0.01-100 mm, preferably 0.1-10 mm, and more preferably 0.15-0.3 mm.

[0031] In this embodiment, the sleeve 4 is used to fix the fixing mechanism 1 and the driving mechanism 3. That is, in actual application, the assembled fixing mechanism 1 and the driving mechanism 3 are placed in the sleeve 4, which not only fixes each mechanism, but also facilitates the replacement of components therein.

[0032] In one embodiment, Figure 1As shown, the driving mechanism 3 includes: a dynamic pressure head 31, a first hydraulic head 32 and a driving pressure head 33. The dynamic pressure head 31 is fixed with the first hydraulic head 32 at one end, and a liquid separation pipeline 321 is arranged in the first hydraulic head 32. The liquid separation pipeline 321 is connected with the through hole and is used to guide the heat transfer fluid out; the driving pressure head 33 is fixed with the other end of the first hydraulic head 32, and the other end of the driving pressure head 33 is fixed on the driver. The liquid separation pipeline 321 includes: a main pipeline, a first sub-pipeline and a second sub-pipeline respectively connected with the main pipeline; the main pipeline is connected with the through hole, the first sub-pipeline is used to make the heat transfer fluid flow out, and the second sub-pipeline is used to make the heat transfer fluid flow in.

[0033] In order to increase the strength of the load, the dynamic pressure head can be set to high-strength tungsten steel. In order to ensure that the medium flows in the flow cavity, a sealing ring is set at the connection between the pressure rod and the pressure head to form a closed flow cavity to prevent medium leakage.

[0034] In some embodiments, in order to reduce the friction between the first hydraulic sub-head 32 and the driving ram 33 in the driving mechanism and the sleeve 4, a slide rail 41 is provided in the sleeve 4, and the surfaces of the first hydraulic sub-head 32 and the driving ram 33 are provided with tracks matching the slide rail 41, which are used to slide along the slide rail 41 when the first hydraulic sub-head 32 and the driving ram 33 in the driving mechanism 3 are loaded or unloaded. In some embodiments, the slide rail in the inner wall of the sleeve 4 that contacts the fixing mechanism 1 can be provided with a clamping piece for fixing the fixing mechanism 1, or the portion of the inner wall of the sleeve 4 that overlaps with the fixing mechanism 1 may not be provided with a slide rail, and the slide rail is only provided at the end of the sleeve 4.

[0035] In some embodiments, in order to achieve heat exchange, that is, to transport the heat-conducting fluid that absorbs heat or cold to the heat exchange device as quickly as possible, a water diverter plug is provided at the other end of the fixing mechanism 1, and the water diverter plug is provided with a liquid hole, which is coaxial with the cavity. The function of the liquid hole is detailed in the function of the through hole in the dynamic pressure head 31.

[0036] Furthermore, the fixing mechanism 1 further comprises: the second liquid-dividing head comprises a main line, a first liquid-dividing line and a second liquid-dividing line, and the main line is respectively connected with the first liquid-dividing line and the second liquid-dividing line of the liquid-passing hole. The specific functions thereof are detailed in the main line, the first liquid-dividing line and the second liquid-dividing line in the first liquid-dividing head.

[0037] The embodiment of the present invention further provides a refrigeration and heating device, comprising: the heat recovery device and the heat exchange device as described above;

[0038] The heat recovery device is connected to the heat exchange device through a pipeline, and is used to transfer the heat transfer fluid that has been heated up after absorbing heat or the heat transfer fluid that has been cooled down after releasing heat to the heat exchange device for heat exchange. It should be noted that the pipeline can be inserted into the first liquid separation pipeline and the second liquid separation pipeline in the first liquid separation head and the second liquid separation head, so that the heat transfer fluid flows into the heat exchange device for heat exchange.

[0039] In this embodiment, the pipeline is not shown in the figure. It serves as a container for the flow of the medium and is connected to the heat exchange device of the equipment, so that the medium flows into the heat exchange device and releases heat or cold.

[0040] The above content is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A heat recovery device based on solid-state spring card cooling and heating, characterized in that: include: A fixing mechanism, a solid spring-cage refrigeration and heating material with perforations arranged in sequence in the fixing mechanism, a driving mechanism and a sleeve, wherein the fixing mechanism and the driving mechanism are arranged in the sleeve; The driving mechanism includes a dynamic pressure head provided with a through hole, and the dynamic pressure head extends into the fixing mechanism to load stress or unload stress on the solid spring card refrigeration and heating material; The perforations on each of the solid spring card cooling and heating materials are arranged to form a cavity, and the cavity is connected to the through hole, so that the heat transfer fluid can exchange heat generated by the solid spring card cooling and heating material when flowing.

2. The heat recovery device according to claim 1, characterized in that: The cross-sectional shape of the dynamic pressure head is matched with that of the end of the solid spring card that contacts the refrigeration and heating material, and the through hole is located at the center of the dynamic pressure head and is coaxial with the cavity.

3. The heat recovery device according to claim 2, characterized in that: The driving mechanism further includes: a first hydraulic pressure head fixed to one end of the dynamic pressure head, wherein a liquid separation pipeline is arranged in the first hydraulic pressure head, and the liquid separation pipeline is connected to the through hole for conducting the heat transfer fluid out.

4. The heat recovery device according to claim 3, characterized in that: The driving mechanism further includes: a driving pressure head fixed to the other end of the first hydraulic pressure head, and the other end of the driving pressure head is fixed on the driver.

5. The heat recovery device according to claim 3, characterized in that: The liquid distribution pipeline includes: a main pipeline, a first branch pipeline and a second branch pipeline respectively connected to the main pipeline; the main pipeline is connected to the through hole, the first branch pipeline is used to allow the heat transfer fluid to flow out, and the second branch pipeline is used to allow the heat transfer fluid to flow in.

6. The heat recovery device according to claim 4, characterized in that: A slide rail is arranged in the sleeve, and tracks matching with the slide rail are arranged on the surfaces of the first hydraulic head and the driving head, so as to slide along the slide rail when the driving mechanism is loaded or unloaded.

7. The heat recovery device according to claim 1, characterized in that: The fixing mechanism is made of polymer material.

8. The heat recovery device according to claim 1, characterized in that: Also includes: A water diversion plug is arranged at the other end of the fixing mechanism, and the water diversion plug is provided with a liquid through hole, and the liquid through hole is coaxial with the cavity.

9. The heat recovery device according to claim 8, characterized in that: Also includes: The second liquid-dividing head includes a main line, a first liquid-dividing line, and a second liquid-dividing line. The main line is communicated with the liquid through hole, the first liquid-dividing line, and the second liquid-dividing line, respectively.

10. A cooling and heating device, characterized in that: include: The heat recovery device and the heat exchange device according to any one of claims 1 to 9; The heat recovery device is connected to the heat exchange device through a pipeline, and is used to transmit the heat transfer fluid that is heated up after absorbing heat or the heat transfer fluid that is cooled down after releasing heat to the heat exchange device for heat exchange.

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