Wafer test box

Abstract

The invention discloses a wafer test box. The wafer test box comprises a first shell, a second shell and a wafer, the first shell comprises a probe card, the probe card comprises at least one probe, and the at least one probe has paramagnetism. The second shell is combined with the first shell, and the second shell is provided with a magnetic force generating assembly which is arranged corresponding to the at least one probe. The wafer is located in the second housing, and the at least one probe is in electrical contact with the at least one bonding pad of the wafer with a predetermined contact force. When the magnetic force generating assembly generates a first magnetic attraction force, the at least one probe is attracted, so that the at least one probe is electrically contacted with the at least one welding pad through a first contact force, and the first contact force is greater than or equal to a preset contact force.

Description

Technical Field

[0001] The invention relates to a wafer testing box, in particular to a wafer testing box with a magnetic structure for adjusting the needle pressure of a probe on an object to be tested. Background Art

[0002] When the wafer completes the design of the integrated circuit, the wafer needs to undergo a burn-in test and an electrical test. Traditionally, the wafer burn-in and reliability test is performed by testing each wafer separately through a test machine and a probe card. Each wafer is placed on a carrier and electrically contacted with the probe of the probe card to complete the test. Therefore, when the number of wafers is large, more test machines and probe cards are required, and the test process generates greater time and equipment costs.

[0003] In the prior art, in order to improve the efficiency of the burn-in test, a composite test unit system has been developed, which can perform burn-in tests on multiple wafers at the same time. The aforementioned system has multiple test unit arrays in one test end, each wafer is respectively configured in each test unit array, and each test unit has at least one chuck to fix the wafer, and the wafer is connected to the tester for burn-in test or electrical test.

[0004] On the other hand, a wafer test box has been developed recently, which pre-positions the probe card and the wafer and places them in the wafer test box. The wafer test box is directly connected to the test machine electrically, and the wafer test box is placed in the test unit to perform a burn-in test or an electrical test. The existing method of combining the upper and lower shells of the wafer test box requires calibration of the positioning of the probe card and the wafer.

[0005] Furthermore, the finished wafer is not a completely flat surface due to process tolerance and the weight of the wafer itself, and the pads on the wafer are not on a flat horizontal plane. As a result, the chances of inaccurate probe test results due to uneven contact between the probe and the pad or insufficient contact force during pre-positioning increase.

[0006] In addition, in the existing wafer test box, the probe card and the wafer are pre-positioned, and the probe needle pressure is fixed, and there is no way to adjust the needle pressure according to different test requirements.

[0007] Therefore, how to overcome the above-mentioned defects through the improvement of structural design has become one of the important issues that this business wants to solve. Summary of the invention

[0008] The technical problem to be solved by the present invention is to provide a wafer test box in view of the deficiencies in the prior art, comprising: a first shell, a second shell and a wafer. The first shell includes a probe card, the probe card includes at least one probe, and the at least one probe has paramagnetism. The second shell is combined with the first shell, and the second shell has a magnetic force generating component, which is arranged corresponding to the at least one probe. The wafer is located in the second shell, and the at least one probe is electrically contacted with at least one pad of the wafer with a predetermined contact force. Wherein, when the magnetic force generating component generates a first magnetic attraction force, it attracts at least one probe, so that the at least one probe is electrically contacted with the at least one pad with a first contact force, and the first contact force is greater than or equal to the predetermined contact force.

[0009] According to a feasible implementation, the first contact force is greater than a predetermined contact force, and when the magnetic force generating component releases the first magnetic attraction force, the at least one probe returns to electrical contact with the at least one pad with the predetermined contact force.

[0010] According to a feasible implementation, the magnetic force generating component can also generate a second magnetic attraction force, so that at least one probe is in electrical contact with at least one pad with a second contact force, and the second contact force is greater than the first contact force.

[0011] According to a feasible implementation scheme, the magnetic force generating component is connected to the control circuit, and the control circuit controls the magnetic force generating component to generate the first magnetic attraction force.

[0012] According to a feasible implementation scheme, the control circuit is disposed in the wafer testing box.

[0013] According to a feasible implementation, after at least one probe performs a test procedure, the control circuit controls the magnetic force generating component to interrupt the magnetic attraction.

[0014] According to a possible implementation, the magnetic force generating component is a non-permanent magnet.

[0015] According to a feasible implementation scheme, the first shell has a first magnetic member, the second shell has a second magnetic member, the second magnetic member is arranged corresponding to the first magnetic member, and the first shell and the second shell are tightly combined through the magnetic attraction generated between the first magnetic member and the second magnetic member. In a state where no magnetic attraction is generated, at least one probe is in electrical contact with at least one pad with a third contact force. In a state where magnetic attraction is generated, the magnetic attraction provides at least one probe with at least one pad to be in electrical contact with a fourth contact force. The predetermined contact force is equal to the sum of the third contact force and the fourth contact force.

[0016] According to a feasible implementation scheme, the first housing has a first snap fastener, the second housing has a second snap fastener, the second snap fastener is arranged corresponding to the first snap fastener, and the first housing and the second housing are tightly combined by the snap fastener force of the first snap fastener and the second snap fastener. In a state where no snap fastener force is generated, at least one probe is in electrical contact with at least one pad with a fifth contact force. In a state where a snap fastener force is generated, the snap fastener force provides at least one probe with at least one pad to be in electrical contact with a sixth contact force. The predetermined contact force is equal to the sum of the fifth contact force and the sixth contact force.

[0017] According to a feasible implementation scheme, the first shell and the second shell are tightly combined in a vacuuming manner. In a non-vacuuming state, at least one probe is in electrical contact with at least one pad with a seventh contact force. In a vacuuming state, at least one probe is in electrical contact with at least one pad with an eighth contact force. The predetermined contact force is equal to the sum of the seventh contact force and the eighth contact force.

[0018] One of the beneficial effects of the present invention is that the wafer test box provided by the present invention can use magnetic attraction to make the probe of the probe card make precise electrical contact with the wafer. Through the magnetic attraction, the probe can apply different needle pressures to different wafers. In addition, through the magnetic attraction, the electrical contact between the probe and the wafer can be stabilized to avoid the alignment relationship between the probe and the wafer being affected when the wafer test box is affected by external forces (such as shaking), such as offset, which is not conducive to the detection procedure.

[0019] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 FIG. 4 is a schematic diagram of a wafer testing box according to a first embodiment of the present invention.

[0021] Figure 2 for Figure 1 Another schematic diagram of the illustrated embodiment.

[0022] Figure 3 for Figure 1 A schematic diagram of a wafer testing box in use according to a second embodiment of the present invention.

[0023] Figure 4 for Figure 3 A schematic diagram of another usage state of the illustrated embodiment.

[0024] Figure 5 FIG. 4 is a schematic diagram of a wafer testing box according to a third embodiment of the present invention.

[0025] Figure 6 FIG. 4 is a schematic diagram of a wafer testing box according to a fourth embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following is an explanation of the implementation of the "wafer test box" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted in actual size. It is stated in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0027] See also Figure 1 and Figure 2 , are schematic diagrams of a wafer test box 1A according to a first embodiment of the present invention. The wafer test box 1A includes a first shell 11, a second shell 12 and a wafer 13. The first shell 11 includes a probe card 112, and the probe card 112 includes at least one probe 1121, and the probe 1121 has paramagnetism. According to some embodiments, the probe 1121 is made of metal nickel, for example. The second shell 12 is combined with the first shell 11, and the second shell 12 has a magnetic force generating component MG1, which is arranged corresponding to the probe 1121. The wafer 13 is located in the second shell 12. When the first shell 11 and the second shell 12 are combined, the probe 1121 is electrically contacted with the pad 131 of the wafer 13 with a predetermined contact force P1. Among them, when the magnetic force generating component MG1 generates a first magnetic attraction force M1, it attracts the probe 1121, so that the probe 1121 is electrically contacted with the pad 131 with a first contact force F1, and the first contact force F1 is greater than or equal to the predetermined contact force P1.

[0028] In one embodiment, the first magnetic attraction force M1 makes the probe 1121 face the second housing 12 to more stably electrically contact the pad 131 of the wafer 13 without increasing the predetermined contact force P1 of the probe 1121 on the pad 131 of the wafer 13 .

[0029] In one embodiment, the wafer 13 is not flat, or the pad 131 has a tolerance problem, resulting in the probe 1121 not being able to make good electrical contact with the pad 131 of the wafer 13 with a predetermined contact force P1. The first magnetic attraction M1 attracts the probe 1121, so that the probe 1121 faces the second housing 12, and provides a first contact force F1 greater than the predetermined contact force P1, so that each probe 1121 has sufficient contact force to make electrical contact with the pad 131 of the wafer 13. In this embodiment, when the magnetic force generating component MG1 releases the first magnetic attraction M1, for example, when the probe 1121 completes the test procedure, the probe 1121 returns to make electrical contact with the pad 131 with the predetermined contact force P1.

[0030] like Figure 1 and Figure 2 As shown, the magnetic force generating component MG1 is a non-permanent magnet, such as an electromagnet, which is connected to a switch S and a power source P, and the magnetic force generating component MG1 generates a first magnetic attraction M1 or releases the first magnetic attraction M1 by opening and closing the switch S. However, the present invention is not limited thereto.

[0031] See also Figure 3 to Figure 4 , are schematic diagrams of the use status of the wafer test box 1B according to the second embodiment of the present invention. According to this embodiment, the wafer test box 1B also includes a shielding member 2, and the magnetic force generating component MG1 is a permanent magnet. The shielding member 2 is used to shield the magnetic force generating component MG1 to block the first magnetic attraction M1 between it and the probe 1121. At this time, the probe 1121 is in electrical contact with the pad 131 of the wafer 13 with a predetermined contact force P1. When the probe 1121 wants to execute the test program, the shielding member 2 moves away from the position of shielding the magnetic force generating component MG1, so that the shielding magnetic force generating component MG1 generates the first magnetic attraction M1 on the probe 1121, and the probe 1121 is attracted to electrically contact with the pad 131 with the first contact force F1 to execute the test program. After the probe 1121 completes the test program, the shielding member 2 returns to its original shielding position (such as Figure 3 ), to interrupt the first magnetic attraction M1, at which point the probe 1121 returns to electrical contact with the pad 131 with a predetermined contact force P1. According to some embodiments, although the shielding member 2 is in the shielding position, shielding the magnetic force generating component MG1, the magnetic force generating component still exerts a third magnetic attraction on the probe 1121 (not shown, the third magnetic attraction is less than the first magnetic attraction M1), and at this point the predetermined contact force P1 includes the third magnetic attraction and the force generated when the first shell 11 and the second shell 12 are combined.

[0032] See also Figure 5, is a schematic diagram of a wafer test box 1C according to a third embodiment of the present invention. In this embodiment, the magnetic force generating component MG1 can also generate a second magnetic attraction force M2, so that the probe 1121 is in electrical contact with the pad 131 with a second contact force F2, and the second contact force F2 is greater than the first contact force F1. For example, the magnetic force generating component MG1 is connected to the control circuit CRT, and the control circuit CRT can turn on and off the magnetic force generating component MG1 to generate a magnetic attraction force, and can control the magnitude of the magnetic attraction force (for example, to generate a first magnetic attraction force M1 or a second magnetic attraction force M2). For example, the control circuit CRT adjusts the current or power of the power source P through a control signal, affecting the magnetic attraction force of the magnetic force generating component MG1 to be the first magnetic attraction force M1 or the second magnetic attraction force M2. In this way, the probe can apply different needle pressures to the wafer 13 (pad 131) in response to the test requirements of different wafers 13, and the needle pressure can also be adjusted in response to the tolerance of the wafer or chip, so that each probe can actually contact the pad. After the probe executes the test program, the control circuit CRT controls the magnetic force generating component MG1 to interrupt the magnetic attraction (the first magnetic attraction M1 or the second magnetic attraction M2), so that the contact force P1 between the probe 1121 and the wafer 13 is restored to a predetermined contact force. For example, the control circuit CRT controls the power supply P to stop outputting current through a control signal, or the control circuit CRT controls the switch S to be in an open circuit state, so that the magnetic force generating component MG1 can be controlled to interrupt the magnetic attraction.

[0033] According to some embodiments, different from Figure 5 In the embodiment shown, the control circuit CRT may also be disposed in the wafer testing box 1C, but the present invention is not limited thereto.

[0034] Please refer to Figure 1 and Figure 3 ,exist Figure 1 and Figure 3In the illustrated embodiment, the first shell 11 has a first magnetic member 111, and the second shell 12 has a second magnetic member 121. The second magnetic member 121 is arranged corresponding to the first magnetic member 111. The first shell 11 and the second shell 12 are tightly combined by the magnetic attraction force MF generated between the first magnetic member 111 and the second magnetic member 121. In which, when the magnetic attraction force MF has not yet been generated (for example, the magnetic shielding member 14 moves to a position shielding the second magnetic member 121), the probe and the pad 131 are in electrical contact with the third contact force. When the magnetic attraction force is generated between the first shell 11 and the second shell 12 (for example, the magnetic shielding member 14 moves away from the position shielding the second magnetic member 121), the magnetic attraction force MF provides an additional fourth contact force for the electrical contact between the probe and the pad 131. The aforementioned predetermined contact force P1 is equal to the sum of the third contact force and the fourth contact force. That is, the third contact force and the additional fourth contact force generated during the combination process between the first shell 11 and the second shell 12 are equivalent to the predetermined needle pressure of the probe 1121 on the wafer 13, and will not cause the probe 1121 to destroy or damage the wafer 13. In other words, when the magnetic attraction force is generated, the magnetic attraction force provides the at least one probe and the at least one pad with the predetermined contact force to electrically contact the at least one pad of the wafer.

[0035] See also Figure 6 , which is a schematic diagram of a wafer test box 1D according to a fourth embodiment of the present invention. In addition to the first shell 11 and the second shell 12 being tightly combined by magnetic attraction, according to Figure 6 In the embodiment shown, the first housing 11 has a first snap member 115, and the second housing 12 has a second snap member 116. The second snap member 116 is arranged corresponding to the first snap member 115. The first housing 11 and the second housing 12 are tightly combined by the snap force of the first snap member 115 and the second snap member 116. In the state where no snap force is generated (that is, the first housing 11 and the second housing 12 are not tightly combined), the probe and the pad 131 are electrically contacted by the fifth contact force. In the state where the snap force is generated (when the first housing 11 and the second housing 12 are tightly combined), the snap force provides an additional sixth contact force for the electrical contact between the probe and the pad 131. The predetermined contact force P1 is equal to the sum of the fifth contact force and the sixth contact force. That is, the fifth contact force and the additional sixth contact force generated by the process of the first housing 11 and the second housing 12 being tightly combined by the snap-fitting force are equivalent to the predetermined needle pressure (predetermined contact force P1) of the probe 1121 on the wafer 13, and will not cause the probe 1121 to destroy or damage the wafer 13. In other words, when the snap-fitting force is generated, the snap-fitting force provides the at least one probe and the at least one pad with the predetermined contact force to electrically contact the at least one pad of the wafer.

[0036] In some other embodiments, the first shell 11 and the second shell 12 are tightly combined by vacuuming. In the state without vacuuming, the probe and the pad 131 are electrically contacted with the seventh contact force. In the state with vacuuming, an additional eighth contact force is provided for the electrical contact between the probe 1121 and the pad 131. Among them, the predetermined contact force P1 is equal to the sum of the seventh contact force and the eighth contact force. In other words, the seventh contact force and the eighth contact force generated by the process of tightly combining the first shell 11 and the second shell 12 by vacuuming are equivalent to the predetermined needle pressure (predetermined contact force P1) of the probe 1121 on the wafer 13, and will not cause the probe to destroy or damage the wafer. In other words, in the state with the vacuuming, the at least one probe and the at least one pad are electrically contacted with the at least one pad of the wafer with the predetermined contact force.

[0037] One of the beneficial effects of the present invention is that the wafer test box provided by the present invention can use magnetic attraction to make the probe of the probe card make precise electrical contact with the wafer. Through the magnetic attraction, the probe can apply different needle pressures to different wafers. In addition, through the magnetic attraction, the electrical contact between the probe and the wafer can be stabilized to avoid the alignment relationship between the probe and the wafer being affected when the wafer test box is affected by external forces (such as shaking), such as offset, which is not conducive to the detection procedure.

[0038] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the claims of the present invention.

Claims

1. A wafer testing box, characterized in that: include: A first housing, wherein the first housing includes a probe card, the probe card includes at least one probe, and the at least one probe has paramagnetism; a second shell, the second shell being combined with the first shell; A magnetic force generating component is disposed in the second housing, and the magnetic force generating component is disposed corresponding to the at least one probe; as well as A wafer is located in the second housing, and the at least one probe is in electrical contact with at least one pad of the wafer with a predetermined contact force; When the magnetic force generating component generates a first magnetic attraction force, the at least one probe is attracted so that the at least one probe is in electrical contact with the at least one pad with a first contact force, and the first contact force is greater than or equal to the predetermined contact force.

2. The wafer testing box according to claim 1, characterized in that: The first contact force is greater than the predetermined contact force, wherein when the magnetic force generating component releases the first magnetic attraction force, the at least one probe returns to electrically contact with the at least one pad with the predetermined contact force.

3. The wafer testing box according to claim 1, characterized in that: The magnetic force generating component can also generate a second magnetic attraction force, so that the at least one probe is in electrical contact with the at least one bonding pad with a second contact force, and the second contact force is greater than the first contact force.

4. The wafer testing box according to claim 1, characterized in that: The magnetic force generating component is a non-permanent magnet.

5. The wafer testing box according to claim 4, characterized in that: The magnetic force generating component is connected to a control circuit, and the control circuit controls the magnetic force generating component to generate the first magnetic attraction force.

6. The wafer testing box according to claim 5, characterized in that: The control circuit is arranged in the wafer testing box.

7. The wafer testing box according to claim 5, characterized in that: After the at least one probe executes a test procedure, the control circuit controls the magnetic force generating component to interrupt the magnetic attraction.

8. The wafer testing box according to claim 1, characterized in that: The first shell has a first magnetic component, and the second shell has a second magnetic component. The second magnetic component is arranged corresponding to the first magnetic component, and the first shell and the second shell are tightly combined by the magnetic attraction generated between the first magnetic component and the second magnetic component. Wherein, when the magnetic attraction force is generated, the magnetic attraction force enables the at least one probe and the at least one bonding pad to be in electrical contact with the at least one bonding pad of the wafer with the predetermined contact force.

9. The wafer testing box according to claim 1, characterized in that: The first shell has a first buckle, and the second shell has a second buckle. The second buckle is arranged corresponding to the first buckle, and the first shell and the second shell are tightly combined by the buckling force of the first buckle and the second buckle; Wherein, when the snap-in force is generated, the snap-in force enables the at least one probe and the at least one bonding pad to be in electrical contact with the at least one bonding pad of the wafer with the predetermined contact force.

10. The wafer testing box according to claim 1, characterized in that: The first shell and the second shell are tightly combined by vacuuming; Wherein, in the vacuum state, the at least one probe and the at least one bonding pad are in electrical contact with the at least one bonding pad of the wafer with the predetermined contact force.

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