Universal optical module full-temperature test bench

Abstract

The invention relates to the technical field of optical communication, and discloses a universal optical module full-temperature test board, which comprises a test assembly, a temperature environment cavity, an optical module, an optical module, a temperature sensor and a control module, and is characterized in that the test assembly provides a module test jig and a temperature environment cavity; according to the optical module testing device, the testing assembly, the preheating assembly, the box body assembly and the heating stage assembly are combined, seamless connection from preheating to testing of the optical module is achieved, the testing efficiency and the temperature control precision are improved, the testing assembly is combined with a water cooling head, a refrigeration sheet, a first heating pipe, a second heating pipe, a third heating pipe and other key components, and the testing efficiency is improved. The temperature in the test fixture can be accurately controlled in cooperation with PID algorithms of the first temperature sensor, the second temperature sensor and the third temperature sensor, so that a stable test environment is provided for the optical module, meanwhile, the preheating assembly ensures that the optical module reaches the required target temperature in the preheating stage through linkage control of the second heating pipe and the second temperature sensor, and the test efficiency is improved. And interference on a test result due to too high or too low temperature is avoided.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to a universal optical module full-temperature test bench. Background Art

[0002] Optical modules are one of the core key components in the optical communication industry and are widely used in data centers, communication base stations, network transmission and other fields. With the rapid development of communication technology, the requirements for the performance of optical modules are getting higher and higher. In the production process of optical modules, in order to ensure their stable operation in different extreme environments, "extreme temperature environment testing" must be carried out to verify their performance under extreme conditions such as high temperature and low temperature. This test is an important part of production quality control and one of the important steps in the final inspection.

[0003] In practice, in the optical communication industry, optical modules are one of the most important components. "Extreme temperature environment testing" is one of the most important links in the final inspection during the production process. The main testing equipment is the heat flow meter, but it has many disadvantages: high power, high gas consumption, high noise, high price, etc.

[0004] Through market research, in view of these drawbacks, the present invention proposes a universal optical module full-temperature test bench to solve the above problems. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a universal optical module full-temperature test bench, which solves the problem that the optical module extreme temperature test relies on a heat flow meter, but the equipment has high power consumption, high cost and high noise.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a universal optical module full-temperature test bench, comprising:

[0007] Test components, which provide fixtures and temperature environment chambers for module testing;

[0008] A preheating component, which provides a fixture and a temperature environment chamber for preheating the module;

[0009] a box assembly, which serves as the outer shell of the fixture;

[0010] A hot stage assembly provides a platform for batch preheating of modules.

[0011] Preferably, the test assembly includes a fixing fixture, a test fixture, a water cooling head, a cooling plate, a heating tube and a temperature sensor; the water cooling head, the cooling plate, the heating tube and the temperature sensor are fixedly connected to the test fixture by screws; and the fixing fixture is fixedly connected to the test fixture by screws.

[0012] Preferably, the preheating assembly includes a limiting clamp, a preheating fixture, a second heating tube and a second temperature sensor. The second heating tube and the second temperature sensor are fixedly connected to the preheating fixture by screws, and the limiting clamp is fixedly connected to the preheating fixture by screws.

[0013] Preferably, the box assembly includes a shell, a front panel, a rear cover, an upper cover, a ground pin, a cable connector and a water pipe connector. The ground pin and the water pipe connector are fixedly connected to the shell by screws, the cable connector is fixedly connected to the rear cover, and the front panel and the rear cover are fixedly connected to the shell by screws.

[0014] Preferably, the preheating assembly includes a heating platform, a heat insulation baffle, three heating tubes, three temperature sensors and a support leg, and the heat insulation baffle, three heating tubes, three temperature sensors and the support leg are fixedly connected to the heating platform by screws.

[0015] Preferably, the temperature control process of the temperature sensor 1, the temperature sensor 2 and the temperature sensor 3 uses a PID algorithm to dynamically adjust the power output of the refrigeration plate or the heating tube 1, the heating tube 2 and the heating tube 3 based on real-time temperature data.

[0016] Preferably, a heat dissipation mechanism is provided on the front side of the shell, and the heat dissipation mechanism includes a mounting bracket, a mounting groove, a heat conducting plate, heat dissipation fins, a support frame and a heat dissipation fan. Two mounting grooves are provided on the front side of the shell, and heat conducting plates are embedded in the inner walls of the two mounting grooves. The outer wall of the heat conducting plate is fixedly connected with a mounting bracket, and the mounting bracket is fixedly connected to the shell by screws. The front side of the heat conducting plate is fixedly connected with heat dissipation fins.

[0017] Preferably, an outer wall of the mounting bracket is fixedly connected to a support frame, a cooling fan is installed on the inner side of the support frame, and the cooling fan is placed on the outer side of the cooling fins.

[0018] Beneficial Effects

[0019] The present invention provides a universal optical module full-temperature test bench. Compared with the prior art, it has the following advantages:

[0020] Beneficial effects:

[0021] 1. In the present invention, by combining the test component, the preheating component, the box component and the hot stage component, not only the seamless connection from preheating to testing of the optical module is achieved, but also the test efficiency and temperature control accuracy are improved. The test component combines the key components such as the water-cooled head, the refrigeration plate and the heating tube 1, the heating tube 2, etc., and cooperates with the PID algorithm of the temperature sensor 1, the temperature sensor 2 and the temperature sensor 3 to accurately control the temperature in the test fixture, thereby providing a stable test environment for the optical module. At the same time, the preheating component ensures that the optical module reaches the required target temperature during the preheating stage through the linkage control of the heating tube 2 and the temperature sensor 2, and avoids interference with the test results due to excessively high or low temperatures. The box component adopts a modular design, which is convenient for the maintenance and replacement of internal components, and through the synergistic effect of the heat insulation and heat dissipation mechanisms, effectively reduces the impact of internal temperature fluctuations on the overall performance of the system, making the test environment more stable and ensuring the reliability and long-term performance of the test bench.

[0022] 2. In the present invention, the heat dissipation efficiency and safety of the test bench are further improved through the optimized heat dissipation mechanism design. A mounting bracket, a mounting slot, a heat conducting plate, heat dissipating fins and a heat dissipating fan are provided on the front of the shell to form an efficient heat dissipation path. Heat is quickly transferred to the heat dissipating fins through the heat conducting plate, and the heat dissipation to the external environment is accelerated by the heat dissipating fan, thereby avoiding the risk of overheating of the test bench due to long-term operation. This design not only ensures the stable operation of internal components, but also extends the service life of the equipment. In addition, the modular heat dissipation structure is easy to disassemble and maintain, and can be adjusted according to the needs of different test environments, thereby enhancing the versatility and adaptability of the equipment. At the same time, the uniform arrangement of the heat dissipating fan and the reasonable selection of thermal conductive materials enable the test bench to maintain excellent performance under high load conditions, further improving the reliability of the optical module test and the consistency of the results. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall structure of a universal optical module full-temperature test bench proposed by the present invention;

[0024] Figure 2 This is a structural schematic diagram of the front side of a shell of a universal optical module full-temperature test bench proposed by the present invention;

[0025] Figure 3 A universal optical module full-temperature test bench proposed by the present invention Figure 2 Enlarged view of point A in the middle;

[0026] Figure 4 This is a structural exploded view of the test component part of a universal optical module full-temperature test bench proposed by the present invention;

[0027] Figure 5This is a structural exploded view of the box assembly part of a universal optical module full-temperature test bench proposed by the present invention;

[0028] Figure 6 This is a structural exploded view of the hot stage unit component part of a universal optical module full-temperature test bench proposed by the present invention;

[0029] Figure 7 This is a structural explosion diagram of the test component part of a universal optical module full-temperature test bench proposed by the present invention.

[0030] Legend:

[0031] 1. Test assembly; 11. Fixing fixture; 12. Test fixture; 13. Water cooling head; 14. Refrigeration plate; 15. Heating tube 1; 16. Temperature sensor 1; 2. Preheating assembly; 21. Limiting fixture; 22. Preheating fixture; 23. Heating tube 2; 24. Temperature sensor 2; 3. Box assembly; 31. Shell; 32. Front panel; 33. Rear cover; 34. Upper cover; 35. Ground pin; 36. Cable connector; 37. Water pipe connector; 4. Hot plate assembly; 41. Heating platform; 42. Heat insulation baffle; 43. Heating tube 3; 44. Temperature sensor 3; 45. Support foot; 5. Heat dissipation mechanism; 51. Mounting bracket; 52. Mounting slot; 53. Heat conduction plate; 54. Heat dissipation fins; 55. Support frame; 56. Cooling fan. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-Figure 7 The present invention provides two technical solutions, which specifically include the following embodiments:

[0034] Embodiment 1:

[0035] A universal optical module full-temperature test bench, comprising:

[0036] Test component 1, which provides a fixture and a temperature environment chamber for module testing;

[0037] Preheating component 2, which provides a fixture and temperature environment chamber for module preheating;

[0038] A box assembly 3, which serves as a housing of the fixture;

[0039] The hot stage assembly 4 provides a platform for batch preheating of modules.

[0040] Specifically, the test assembly 1 includes a fixing fixture 11, a test fixture 12, a water cooling head 13, a cooling plate 14, a heating tube 15 and a temperature sensor 16. The water cooling head 13, the cooling plate 14, the heating tube 15 and the temperature sensor 16 are fixedly connected to the test fixture 12 by screws, and the fixing fixture 11 is fixedly connected to the test fixture 12 by screws.

[0041] Among the above components, the main function of the test component 1 is to provide the fixture and temperature environment cavity required for module testing. Its structure includes a fixing fixture 11, a test fixture 12, a water-cooling head 13, a cooling plate 14, a heating tube 15 and a temperature sensor 16. The water-cooling head 13, the cooling plate 14 and the heating tube 15 are respectively fixedly connected to the test fixture 12 by screws, and the fixing fixture 11 is also fixedly connected to the test fixture 12 by screws. During the test, the test component 1 uses the water-cooling head 13 and the cooling plate 14 to cool down during low-temperature testing, and collects real-time temperature data through the temperature sensor 16, and cooperates with the PID control system to dynamically adjust the power output of the cooling plate 14 or the heating tube 15, the heating tube 23 and the heating tube 3 43 to ensure the stability and accuracy of the internal temperature of the fixture, thereby providing a suitable test environment for the optical module.

[0042] Specifically, the preheating assembly 2 includes a limiting clamp 21, a preheating fixture 22, a heating tube 23 and a temperature sensor 24. The heating tube 23 and the temperature sensor 24 are fixedly connected to the preheating fixture 22 by screws, and the limiting clamp 21 is fixedly connected to the preheating fixture 22 by screws.

[0043] Among the above components, the main function of the preheating component 2 is to provide a temperature preheating fixture 22 and an environmental cavity before the module is tested. Its structure includes a limit clamp 21, a preheating fixture 22, a heating tube 23 and a temperature sensor 24. The heating tube 23 and the temperature sensor 24 are fixedly connected to the preheating fixture 22 by screws, and the limit clamp 21 is also fixedly connected to the preheating fixture 22 by screws. During operation, the preheating component 2 heats the preheating fixture 22 through the heating tube 23, and the temperature sensor 24 collects the temperature data of the fixture in real time and feeds it back to the PID control system. The PID system adjusts the power of the heating tube 23 according to the temperature change, so that the preheating fixture 22 heats up quickly and maintains at the target temperature. After the module is stably heated in the preheating component 2, it enters the test component 1 for performance testing, which ensures the stability of the temperature change of the module during the test and the test accuracy.

[0044] Specifically, the box assembly 3 includes a shell 31, a front panel 32, a rear cover 33, an upper cover 34, a ground pin 35, a cable connector 36 and a water pipe connector 37. The ground pin 35 and the water pipe connector 37 are fixedly connected to the shell 31 by screws, the cable connector 36 is fixedly connected to the rear cover 33, and the front panel 32 and the rear cover 33 are fixedly connected to the shell 31 by screws.

[0045] Among the above components, the main function of the box assembly 3 is to provide external support and protection, and at the same time realize heat insulation and heat dissipation of the equipment. Its structure includes a shell 31, a front panel 32, a rear cover 33, an upper cover 34, a ground pin 35, a cable connector 36 and a water pipe connector 37. The ground pin 35 and the water pipe connector 37 are fixedly connected to the shell 31 by screws, the cable connector 36 is fixedly connected to the rear cover 33, the front panel 32 and the rear cover 33 are fixedly connected to the shell 31 by screws. The interior of the box assembly 3 is modularly designed, and each component is easy to disassemble and maintain. At the same time, a heat dissipation mechanism 5 is provided on the front side of the box, including a mounting bracket 51, a heat conducting plate 53, heat dissipation fins 54 and a heat dissipation fan 56, which can efficiently discharge the heat generated during the working process to prevent the equipment from affecting the test accuracy or damaging the internal components due to excessive temperature.

[0046] Specifically, the preheating component 2 includes a heating platform 41, an insulating baffle 42, a heating tube 3 43, a temperature sensor 3 44 and a support leg 45, and the insulating baffle 42, the heating tube 3 43, the temperature sensor 3 44 and the support leg 45 are fixedly connected to the heating platform 41 by screws.

[0047] Among the above components, the main function of the heat platform assembly 4 is to provide a platform for batch preheating of modules. Its structure includes a heating platform 41, a heat insulation bar 42, a heating tube 3 43, a temperature sensor 3 44 and a support leg 45. The heat insulation bar 42, the heating tube 3 43, the temperature sensor 3 44 and the support leg 45 are fixedly connected to the heating platform 41 by screws. During operation, the heat platform assembly 4 heats the heating platform 41 through the heating tube 3 43, and the temperature sensor 3 44 collects the platform surface temperature data in real time and feeds it back to the PID control system. The PID system dynamically adjusts the heating power according to the target temperature to ensure that multiple modules on the platform can be preheated at the same time in a uniform and stable temperature environment. The design of the heat platform assembly 4 makes it suitable for the preheating needs of large quantities of optical modules. At the same time, the heat insulation bar 42 is used to prevent heat from diffusing to other components, further improving the overall efficiency of the equipment.

[0048] Specifically, the temperature control process of temperature sensor 1 16, temperature sensor 2 24 and temperature sensor 3 44 uses a PID algorithm to dynamically adjust the power output of the cooling plate 14 or the heating tube 1 15, heating tube 2 23 and heating tube 3 43 based on real-time temperature data.

[0049] Among the above components, temperature sensor 16, temperature sensor 24 and temperature sensor 3 44 all adopt PID (proportional-integral-differential) control algorithm in the temperature control process, and dynamically adjust the power output of cooling plate 14 or heating tube 1 15, heating tube 2 23 and heating tube 3 43 by real-time acquisition and analysis of temperature data, so as to achieve high-precision temperature control. Specifically, temperature sensor 16 is mainly used to monitor the temperature of test fixture 12. In test mode, temperature sensor 16 acquires temperature data in test fixture 12 in real time and transmits it to PID control system. PID control system compares the set target temperature with the real-time acquired temperature to calculate the temperature deviation. Through the proportional, integral and differential adjustment mechanism in PID algorithm, control system dynamically adjusts the power output of cooling plate 14 or heating tube 1 15, heating tube 2 23 and heating tube 3 43 to quickly respond to temperature changes. Proportional adjustment (P) can quickly adjust power according to current deviation, integral adjustment (I) accumulates historical deviation to compensate the system, and differential adjustment (D) predicts temperature change trend, so as to achieve fast and stable temperature control and ensure that test fixture 12 is within the target temperature. The module is precisely and stably operated at the target temperature. The temperature sensor 24 is used to monitor the temperature of the preheating fixture 22. During the module preheating process, the temperature sensor 24 collects the temperature of the preheating fixture 22 in real time and transmits the data to the PID control system. According to the set preheating target temperature, the PID system dynamically adjusts the power output of the heating tube 15, the heating tube 23 and the heating tube 3 43, so that the preheating fixture 22 can quickly reach and maintain the target temperature. This precise temperature control method can avoid the module from being affected by excessive or insufficient heating during the preheating process, and ensure that the module enters the test phase in the best state. The temperature sensor 3 44 is mainly used for temperature monitoring of the hot stage assembly 4. The hot stage assembly 4 is usually used for simultaneous preheating of batch modules, so it has high requirements for temperature uniformity. The temperature sensor 3 44 monitors the temperature distribution of the heating platform 41 in real time and transmits the data to the PID system. The PID control system dynamically adjusts the power output of the heating tube 15, the heating tube 23 and the heating tube 3 43 according to the sensor data, which can not only quickly adjust the platform temperature to the target value, but also ensure that each module on the platform is in a uniform and stable temperature control environment through real-time adjustment of the temperature distribution.

[0050] In order to verify the performance and applicability of the optical module full-temperature test bench of the present invention under different working modes, detailed experimental research was carried out for actual application scenarios such as cooling mode, heating mode, batch preheating mode and long-term operation. By testing and recording key indicators such as temperature range, temperature rise and fall time, temperature control accuracy, test efficiency, power consumption and noise, the following experimental table was generated, which fully reflects the performance of the test bench in actual applications.

[0051]

[0052] The experimental table lists in detail the core performance parameters and experimental data of the optical module full-temperature test bench under different test modes, including test environment, temperature range, temperature rise and fall time, temperature control accuracy, test efficiency, power consumption and noise, etc., which fully demonstrates the performance of the equipment in high and low temperature tests of optical modules.

[0053] The experimental table lists four typical test scenarios:

[0054] Cooling mode: used to test the performance of optical modules under extreme low temperature conditions, mainly simulating the operating state of optical modules in a low temperature environment.

[0055] Heating mode: Tests the operating reliability of optical modules under high temperature conditions and evaluates the adaptability of modules in high temperature environments.

[0056] Batch preheating mode: The test bench is used to preheat multiple optical modules at the same time to ensure that the modules reach a stable operating temperature before entering the formal test.

[0057] Long-term operation mode: simulates the stability of the test bench under long-term temperature fluctuation conditions to verify the reliability and heat dissipation performance of the equipment.

[0058] In order to further verify the practical application effect of the present invention, we conducted experiments on the test bench through different application scenarios, and designed a variety of experimental schemes in combination with the specific test requirements of the optical module. These experimental schemes not only cover the core functional modules of the test bench, but also simulate the actual usage in the real production environment, and generate a series of representative embodiments. The following are specific embodiments:

[0059] Example 1.1: High and low temperature performance test of optical module

[0060] When testing the extreme temperature performance of the optical module, first set the test bench to cooling mode. Use the cooling sheet TEC to reduce the internal temperature of the test fixture 12 to the set value (such as -40°C). The temperature sensor 1 monitors the temperature changes in real time and dynamically adjusts the power output of the cooling sheet through the PID control system. After the temperature stabilizes, the optical module is inserted into the test fixture to simulate the operation of the optical module in a low temperature environment. During the experiment, the operating current, voltage and signal integrity of the optical module all met the design standards, and the test bench achieved efficient and accurate low temperature control.

[0061] Example 1.2: Module batch preheating and high temperature testing

[0062] When testing the high temperature adaptability of the optical module, switch the test bench to the heating mode. The optical module is first placed in the preheating component 2, and the preheating fixture is heated by the heating tube 2. The temperature sensor 2 collects real-time data and feeds it back to the PID system, dynamically adjusts the heating power, and ensures precise control of the preheating temperature. When the module is heated to the set value (such as 50°C), it is transferred to the test fixture 12 for further testing. In a high temperature environment, the performance indicators of the optical module, such as transmission rate and temperature drift, are kept within the normal range. During batch preheating, the hot bench assembly can handle multiple modules at the same time, significantly improving efficiency.

[0063] Example 1.3: Long-term operation heat dissipation verification

[0064] In the long-term operation experiment, the test bench was set under conditions with a large temperature variation range (such as -20℃ to 70℃). The heat dissipation mechanism effectively reduces internal heat accumulation through the combined action of the heat conduction plate, heat dissipation fins and heat dissipation fan. The heat conduction plate quickly transfers the internal heat source of the device to the heat dissipation fins, and the heat dissipation fan quickly discharges the heat to the external environment. After 8 hours of continuous operation, the internal temperature of the device remained stable, and the test accuracy of the optical module was not affected by the heat, verifying the efficiency and reliability of the heat dissipation system.

[0065] Example 1.4: Applicability of multi-modal testing

[0066] In this embodiment, the test bench runs the cooling mode, heating mode and batch preheating mode in sequence to test the performance of the optical module in extreme low temperature, high temperature and batch environments respectively. The test results show that the test bench can respond efficiently regardless of rapid heating or cooling or maintaining temperature stability for a long time, with a temperature control accuracy of ±0.3°C. After the module test is completed, there is no need for long cooling or heating waiting, which significantly improves the test efficiency.

[0067] When working, in the cooling mode, the test bench uses the cooling plate 14TEC to cool the test fixture 12, and the temperature sensor 16 collects the temperature data inside the test fixture 12 in real time and transmits the data to the PID control system. The PID control system dynamically adjusts the deviation between the target temperature and the real-time temperature to accurately control the power output of the cooling plate 14. Through this control method, the test fixture 12 can quickly reach the set low temperature target and maintain temperature stability during the test. When the fixture temperature is stable, the optical module is inserted into the test fixture 12 for performance testing. During the test, the temperature sensor continuously monitors the temperature changes inside the fixture. The PID system adjusts the temperature control system in real time according to the feedback to ensure that the temperature of the entire test environment is constant, thereby ensuring the accuracy and reliability of the test data. This cooling mode is mainly used to simulate the working state of the optical module in a low-temperature environment to verify its performance under low-temperature conditions. In the heating mode, the test bench heats the preheating fixture 22 or the hot stage assembly 4 through the heating tube 1 15, the heating tube 2 23 and the heating tube 43. The temperature sensor 2 24 and the temperature sensor 3 44 respectively collect the temperature data of the preheating fixture 22 and the hot stage assembly 4 in real time, and transmit the data to the PID control system for analysis and regulation. The PID control system adjusts the temperature control system according to the collected temperature data and the set target temperature. The power output of the heating tube 1 15, the heating tube 2 23 and the heating tube 3 43 is dynamically adjusted according to the difference in the target temperature, so as to ensure that the preheating fixture 22 and the hot stage assembly 4 can quickly reach and stably maintain the required temperature. The optical module is first placed in the preheating fixture 22 or on the hot stage assembly 4 for preheating. During the preheating stage, the temperature is precisely controlled to gradually heat the module to the set target temperature, thereby avoiding the impact of rapid temperature changes on the module performance. After the module is preheated and the temperature is stable, the module is transferred to the test fixture 12, and its performance in different temperature ranges is further tested by the test assembly 1. In addition, the test fixture 12 itself can also be heated by the heating tube 15, Heating tube 2 23 and heating tube 3 43 are heated, and the temperature sensor collects the temperature data in the test fixture 12 in real time, and accurately adjusts the heating power through the PID system, so that the temperature of the test fixture 12 quickly reaches the set value and remains stable. During the conversion process of cooling and heating modes, the system adopts a PID control algorithm, which can quickly respond to changes in real-time temperature data and dynamically adjust the power output of the refrigeration plate 14 and heating tube 1 15, heating tube 2 23 and heating tube 3 43, thereby ensuring the accuracy and stability of the target temperature. Through this control method, the test bench can achieve full coverage from low temperature to high temperature environment while maintaining the stability of temperature changes.

[0068] Embodiment 2:

[0069] On the basis of the first embodiment, a heat dissipation mechanism 5 is provided on the front of the shell 31, and the heat dissipation mechanism 5 includes a mounting bracket 51, a mounting groove 52, a heat conducting plate 53, heat dissipation fins 54, a support frame 55 and a heat dissipation fan 56. Two mounting grooves 52 are provided on the front of the shell 31, and the inner walls of the two mounting grooves 52 are embedded with heat conducting plates 53. The outer wall of the heat conducting plate 53 is fixedly connected to the mounting bracket 51, and the mounting bracket 51 is fixedly connected to the shell 31 by screws. The front of the heat conducting plate 53 is fixedly connected to the heat dissipation fins 54.

[0070] Specifically, a support frame 55 is fixedly connected to the outer wall of the mounting bracket 51 , a heat dissipation fan 56 is installed on the inner side of the support frame 55 , and the heat dissipation fan 56 is placed on the outer side of the heat dissipation fins 54 .

[0071] Among the above components, the connection between the support frame 55 and the mounting bracket 51 is ensured to be overall firm by screws or other mechanical fixing methods to avoid loosening or structural deformation due to vibration when the cooling fan 56 is running. The cooling fan 56 is placed on the outside of the cooling fins 54 to form a close heat exchange environment with the cooling fins 54, further improving the heat transfer efficiency through the flow of air.

[0072] The heat dissipation mechanism 5 includes a mounting bracket 51, a mounting groove 52, a heat conducting plate 53, a heat dissipation fin 54, a support frame 55 and a heat dissipation fan 56. The heat conducting plates 53 are embedded in the inner walls of the two mounting grooves 52 opened on the front of the shell 31. The heat conducting plates 53 quickly transfer the internal heat source of the shell 31 (such as the heat generated by the heating tube 1 15, the heating tube 23 and the heating tube 3 43 or the refrigeration plate 14 when working) to the outside through its good thermal conductivity. The outer wall of the heat conducting plate 53 is fixedly connected to the mounting bracket 51, and the bracket is firmly installed on the shell 31 by screws, thereby providing a stable heat dissipation support structure. The front of the heat conducting plate 53 is fixedly connected with the heat dissipation fin 54, and the heat dissipation fin 54 further expands the heat dissipation area. , through natural convection or forced heat dissipation by fans, heat diffusion is accelerated. The support frame 55 is fixed on the outer wall of the mounting bracket 51, and a cooling fan 56 is installed on the inner side thereof. The cooling fan 56 is located on the outer side of the cooling fins 54. When the cooling fan 56 is started, air flows through the surface of the cooling fins 54, and the heat transferred by the heat conducting plate 53 is quickly discharged to the outside of the device, thereby effectively reducing the internal temperature of the device and avoiding instability of the test environment or damage to internal components due to overheating. The design of this heat dissipation mechanism 5 not only ensures the safety and stability of the test bench during long-term operation, but also improves the overall heat dissipation efficiency of the equipment, providing a more stable and reliable temperature control environment for the testing and preheating of the optical module.

[0073] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the application should be included in the protection scope of the present application.

Claims

1. A universal optical module full-temperature test bench, characterized in that: include: A test assembly (1), which provides a fixture and a temperature environment chamber for module testing; A preheating component (2), which provides a fixture and a temperature environment chamber for preheating the module; A box assembly (3) serving as a housing of the fixture; The hot stage assembly (4) provides a platform for batch preheating of modules.

2. A universal optical module full-temperature test bench according to claim 1, characterized in that: The test assembly (1) comprises a fixing fixture (11), a test fixture (12), a water cooling head (13), a cooling plate (14), a heating tube (15) and a temperature sensor (16); the water cooling head (13), the cooling plate (14), the heating tube (15) and the temperature sensor (16) are fixedly connected to the test fixture (12) by screws, and the fixing fixture (11) is fixedly connected to the test fixture (12) by screws.

3. The universal optical module full-temperature test bench according to claim 1, characterized in that: The preheating assembly (2) comprises a limiting clamp (21), a preheating fixture (22), a second heating tube (23) and a second temperature sensor (24); the second heating tube (23) and the second temperature sensor (24) are fixedly connected to the preheating fixture (22) by means of screws; and the limiting clamp (21) is fixedly connected to the preheating fixture (22) by means of screws.

4. The universal optical module full-temperature test bench according to claim 1, characterized in that: The box assembly (3) comprises a shell (31), a front panel (32), a rear cover (33), an upper cover (34), a ground foot (35), a cable connector (36) and a water pipe connector (37); the ground foot (35) and the water pipe connector (37) are fixedly connected to the shell (31) by screws, the cable connector (36) is fixedly connected to the rear cover (33), and the front panel (32) and the rear cover (33) are fixedly connected to the shell (31) by screws.

5. The universal optical module full-temperature test bench according to claim 1, characterized in that: The preheating assembly (2) comprises a heating platform (41), a heat-insulating baffle (42), a heating tube (43), a temperature sensor (44) and a support leg (45); the heat-insulating baffle (42), the heating tube (43), the temperature sensor (44) and the support leg (45) are fixedly connected to the heating platform (41) by screws.

6. A universal optical module full-temperature test bench according to claim 2, characterized in that: The temperature control process of the temperature sensor 1 (16), the temperature sensor 2 (24) and the temperature sensor 3 (44) uses a PID algorithm to dynamically adjust the power output of the cooling plate (14) or the heating tube 1 (15), the heating tube 2 (23) and the heating tube 3 (43) based on real-time temperature data.

7. The universal optical module full-temperature test bench according to claim 4, characterized in that: The front of the shell (31) is provided with a heat dissipation mechanism (5), and the heat dissipation mechanism (5) comprises a mounting bracket (51), a mounting groove (52), a heat conducting plate (53), heat dissipation fins (54), a support frame (55) and a heat dissipation fan (56). The front of the shell (31) is provided with two mounting grooves (52), the inner walls of the two mounting grooves (52) are both embedded with heat conducting plates (53), the outer wall of the heat conducting plate (53) is fixedly connected with the mounting bracket (51), the mounting bracket (51) is fixedly connected to the shell (31) by screws, and the front of the heat conducting plate (53) is fixedly connected with the heat dissipation fins (54).

8. The universal optical module full-temperature test bench according to claim 7, characterized in that: The outer wall of the mounting bracket (51) is fixedly connected to a support frame (55), a cooling fan (56) is installed on the inner side of the support frame (55), and the cooling fan (56) is placed on the outer side of the cooling fins (54).

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