Evaporator temperature sensor

Abstract

The evaporator temperature sensor comprises an injection molding sensor and a cover cap, the injection molding sensor is composed of shell plastic, an inner mold assembly and a wire clamping groove, the inner mold assembly is embedded in the shell plastic, the wire clamping groove is formed in the shell plastic in the axial direction, and the inner mold assembly is composed of a sensor inner mold and a pin resistor assembly; the end, needing to be bent, of the high-temperature wire is embedded and installed in the guide groove formed in the cover cap, then the high-temperature wire is fixed in the guide groove through epoxy resin, an interface and a clamping position installation part of the sensor are universally modularized, the development cost is reduced, the mold opening number is reduced, and the cost is reduced. Meanwhile, the risk that the wire and the resistor head are damaged due to the fact that the wire needs to be bent during mold closing is avoided, the trend of the bent wire can be more flexibly set by changing the bending shape and size of the guide groove in the cover cap, and the purpose of arranging temperature sensing monitoring points in a complex space is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature sensors, and in particular to an evaporator temperature sensor. Background Art

[0002] The main function of the evaporator sensor is to sense the real-time temperature of the evaporator and adjust the operating time of the air conditioner accordingly. The automobile air-conditioning evaporator sensor is one of the key components in the automobile air-conditioning system. Its normal operation is crucial to ensuring the cooling effect and operating stability of the air-conditioning system. The existing automobile air-conditioning evaporator sensor basically meets user needs, but there are still certain defects; the existing automobile air-conditioning evaporator sensor arranges temperature sensing detection points in a complex structure, which is often limited by the internal structure layout of the product. Because the installation position of some evaporation sensors and the position of the temperature sensing detection points cannot be arranged in a plane, the design of the evaporator sensor is complicated, the mold structure is complicated, and the development cost is high and the development cycle is long; at the same time, after the wire is bent, the bending part and the tail of the wire are easy to curl up without external force. In the one-piece molding mold, it is easy to cause the wire to be crushed when the mold is closed, resulting in quality problems; therefore, it is necessary to design an evaporator temperature sensor. Summary of the invention

[0003] The purpose of the present invention is to provide an evaporator temperature sensor to solve the defects of the existing temperature sensor, such as complex structure, high development cost, and easy wire crushing during one-piece molding after bending, which leads to product quality problems.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions: an evaporator temperature sensor, comprising an injection molded sensor and a cover, the injection molded sensor comprising an outer shell plastic, an inner mold assembly, a wire clamping groove and a bottom piece, the inner mold assembly is embedded and installed inside the outer shell plastic, a wire clamping groove is axially arranged on the outer shell plastic, and one end of the outer shell plastic is fixedly connected to the bottom piece, the inner mold assembly comprises a sensor inner mold and a pin resistor assembly, the pin resistor assembly is embedded and installed in the slot hole opened in the sensor inner mold, the pin resistor assembly comprises a pin part and a thermistor assembly, and the pin part is welded with solder in the thermistor assembly.

[0005] As a preferred technical solution, the thermistor assembly is composed of an NTC sensitive chip, a high-temperature wire, solder, epoxy resin and a resistor head, and one end of the solder is fixedly connected to the high-temperature wire.

[0006] As a preferred technical solution, one end of the high-temperature wire is fixedly connected with epoxy resin.

[0007] As a preferred technical solution, a resistor head is fixedly connected to the epoxy resin.

[0008] As a preferred technical solution, an NTC sensitive chip is embedded and installed inside the epoxy resin, and the NTC sensitive chip and the high-temperature wire are connected by soldering.

[0009] As a preferred technical solution, one end of the shell plastic is snap-connected with a snap connector on the cover.

[0010] As a preferred technical solution, the cover includes a clamping joint, a bent rod, a limiting head, a guide groove and a limiting groove, one side of the clamping joint is fixedly connected to the bent rod, and the guide groove is provided on the bent rod.

[0011] As a preferred technical solution, a high-temperature wire is embedded and installed in the guide groove.

[0012] As a preferred technical solution, a limiting head is provided at one end of the curved rod, and a limiting groove is provided on the limiting head.

[0013] As a preferred technical solution, a resistor head is embedded and installed inside the limiting groove.

[0014] The evaporator temperature sensor provided by the present invention has the advantages that: the sensor inner mold is wrapped by integral molding in the straight section of the sensor, and the end of the high-temperature wire that needs to be bent is embedded and installed in the guide groove opened by the curved rod. The place where the wire is clamped is a limiting boss. The wire is clamped under the limiting boss to press the wire and prevent the wire from curling up at the bending part. Then, the high-temperature wire is fixed in the guide groove with epoxy resin. Not only the interface and the clamping installation part of the sensor are universally modularized, the development cost is reduced, and the number of molds is reduced, but also the risk of damaging the wire and the resistor head due to the need to bend the wire when closing the mold is avoided. By changing the bending shape and size of the guide groove in the curved rod, the direction of the wire after bending can be set more flexibly, so as to meet the purpose of arranging temperature sensing monitoring points in a complex space. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a three-dimensional diagram of the overall structure of the present invention;

[0017] Figure 2 It is a side view structural schematic diagram of the present invention;

[0018] Figure 3 It is a schematic diagram of the top view of the structure of the present invention;

[0019] Figure 4 It is a partial structural cross-sectional view of the present invention;

[0020] Figure 5 It is a schematic diagram of the structure of the shell plastic in the present invention;

[0021] Figure 6 It is a schematic diagram of the structure of the cover in the present invention;

[0022] Figure 7 This is a schematic diagram of the bending of the high temperature wire in the present invention;

[0023] Figure 8 It is a structural schematic diagram of the wire slot in the present invention;

[0024] Fig. 9 It is a structural schematic diagram of the inner mold assembly in the present invention;

[0025] Fig.10 It is a structural schematic diagram of the inner mold of the sensor in the present invention;

[0026] Fig.11 It is a schematic diagram of the structure of solder in the present invention;

[0027] Fig.12 It is a schematic diagram of the structure of the pin member in the present invention;

[0028] Fig.13 Schematic diagram of the structure of the epoxy resin in the present invention;

[0029] Fig.14 It is a schematic diagram of the structure of the thermistor assembly in the present invention.

[0030] In the figure: 10, injection molded sensor; 11, shell plastic; 12, inner mold assembly; 13, wire slot; 14, bottom piece; 20, cover; 21, card connector; 22, bent rod; 23, limit head; 24, guide groove; 25, limit groove; 30, pin resistor assembly; 31, pin piece; 40, thermistor assembly; 41, NTC sensitive chip; 42, high temperature wire; 43, solder; 44, epoxy resin; 45, resistor head; 121, sensor inner mold. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] Please refer to the attached Figure 1 -Attached Fig.14 An embodiment of the present invention is as follows: an evaporator temperature sensor comprises an injection molded sensor 10 and a cover 20, the injection molded sensor 10 comprises a shell plastic 11, an inner mold assembly 12, a wire slot 13 and a bottom piece 14, the inner mold assembly 12 is embedded and installed inside the shell plastic 11, the shell plastic 11 is provided with a wire slot 13 along the axial direction, and one end of the shell plastic 11 is fixedly connected with the bottom piece 14, the inner mold assembly 12 comprises a sensor inner mold 121 and a pin resistor assembly 30, the pin resistor assembly 30 is embedded and installed in the slot hole provided in the sensor inner mold 121, the pin resistor assembly 30 comprises a pin piece 31 and a thermistor assembly 40, the pin piece 31 is welded with solder 43 in the thermistor assembly 40, the thermistor assembly 40 comprises a high-temperature wire 42, solder 43 and a resistor head 45, the resistor head 45 comprises an NTC A sensitive chip 41 and epoxy resin 44, one end of the solder 43 is fixedly connected with a high-temperature wire 42, an NTC sensitive chip 41 is embedded and installed inside the epoxy resin 44, the NTC sensitive chip 41 and the high-temperature wire 42 are welded and connected by the solder 43, one end of the shell plastic 11 is clamped with a clamping joint 21 on the cover 20, the cover 20 includes a clamping joint 21, a bent rod 22, a limit head 23, a guide groove 24 and a limit groove 25, one side of the clamping joint 21 is fixedly connected with a bent rod 22, a guide groove 24 is provided on the bent rod 22, a high-temperature wire 42 is embedded and installed in the guide groove 24, a limit head 23 is provided at one end of the bent rod 22, a limit groove 25 is provided on the limit head 23, the place where the wire is clamped is a limit boss, the wire is clamped under the limit boss, the purpose is to press the wire, prevent the wire from warping at the bend, and ensure the stability of the structure.

[0034] Specifically, when in use, first, the sensor inner mold 121 is wrapped inside by using one-piece molding in the straight section of the sensor, and the end of the high-temperature wire 42 that needs to be bent is embedded and installed in the guide groove 24 opened in the cover 20, and the high-temperature wire 42 is limited by the limit groove 25 set in the cover 20 to limit the warping of the high-temperature wire 42, and then the high-temperature wire 42 is fixed in the guide groove 24 with epoxy resin 44. Not only the interface and the card installation part of the sensor are universally modularized, the development cost is reduced, and the number of molds is reduced, but also the risk of damaging the wire and the resistor head 45 due to the need to be bent when the mold is closed is avoided. By changing the bending shape and size of the guide groove 24 in the cover 20, the direction of the wire after bending can be set more flexibly, so as to meet the purpose of arranging temperature monitoring points in a complex space.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An evaporator temperature sensor, comprising an injection-molded sensor (10) and a cover (20), characterized in that: The injection molded sensor (10) comprises a shell plastic (11), an inner mold component (12), a wire slot (13) and a bottom piece (14); the inner mold component (12) is embedded and installed inside the shell plastic (11); the shell plastic (11) is provided with a wire slot (13) along the axial direction, and one end of the shell plastic (11) is fixedly connected to the bottom piece (14); the inner mold component (12) comprises a sensor inner mold (121) and a pin resistor component (30); the pin resistor component (30) is embedded and installed in a slot hole provided in the sensor inner mold (121); the pin resistor component (30) comprises a pin component (31) and a thermistor component (40); the pin component (31) is welded with solder (43) in the thermistor component (40).

2. The evaporator temperature sensor according to claim 1, characterized in that: The thermistor assembly (40) comprises a high-temperature wire (42), solder (43) and a resistor head (45); the resistor head (45) comprises an NTC sensitive chip (41) and epoxy resin (44); one end of the solder (43) is fixedly connected to the high-temperature wire (42).

3. The evaporator temperature sensor according to claim 2, characterized in that: One end of the high-temperature wire (42) is fixedly connected to the resistor head (45).

4. The evaporator temperature sensor according to claim 3, characterized in that: A resistor head (45) is fixedly connected to the epoxy resin (44).

5. The evaporator temperature sensor according to claim 4, characterized in that: An NTC sensitive chip (41) is embedded and installed inside the epoxy resin (44), and the NTC sensitive chip (41) and the high-temperature wire (42) are connected by soldering (43).

6. The evaporator temperature sensor according to claim 1, characterized in that: One end of the shell plastic (11) is clamped with a clamping joint (21) on the cover (20).

7. The evaporator temperature sensor according to claim 6, characterized in that: The cover (20) comprises a clamping joint (21), a bent rod (22), a limiting head (23), a guide groove (24) and a limiting groove (25); one side of the clamping joint (21) is fixedly connected to the bent rod (22); and the guide groove (24) is provided on the bent rod (22).

8. The evaporator temperature sensor according to claim 7, characterized in that: A high-temperature wire (42) is embedded and installed in the guide groove (24).

9. The evaporator temperature sensor according to claim 7, characterized in that: A limiting head (23) is provided at one end of the curved rod (22), and a limiting groove (25) is provided on the limiting head (23).

10. An evaporator temperature sensor according to claim 9, characterized in that: A resistor head (45) is embedded and installed inside the limiting groove (25).

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