Electronic component testing system and method

Abstract

The invention provides an electronic component test system and method, and the system comprises a test board which comprises a test surface; the contact belt is arranged on one side of the test surface of the test board, and the contact belt at least provides a first contact surface for the connection part of the to-be-tested device; the switching point is connected with the contact belt through a connecting line, and one side, located on the test surface, of the switching point at least provides a second contact surface for the test device; wherein the wiring of the connecting line is arranged in the test board. The connection between the connection part of the to-be-tested device and the contact band is removed, so that the damage to the chip or the bonding wire in the to-be-tested device caused by pressing, connecting and fixing the to-be-tested device is avoided. And meanwhile, pin reconstruction of the to-be-tested device is integrally realized by using the contact belt, the transfer point and the connecting line, so that I-V curve testing and electrical performance testing are effectively performed on the unsealed to-be-tested device, and a universal tool for I-V curve testing and electrical performance testing of the to-be-tested device is met.

Description

Technical Field

[0001] The present application relates to the technical field of electronic component testing, and in particular to an electronic component testing system and method. Background Art

[0002] At present, the failure analysis process of electronic components mainly includes non-destructive testing and destructive testing, among which non-destructive testing includes IV (current-voltage) curve testing and electrical performance testing, and destructive testing includes unsealing testing. IV curve testing generally uses an IV curve tracer to test the pins with a probe, and the device can be fixed independently for testing without tooling; electrical performance testing generally uses the corresponding test device for testing, and the corresponding test tooling is required for testing. Commonly used test tools are generally press-type fixation, that is, the device pins and the test connection are fastened by pressing.

[0003] During the failure analysis process, after the device is unsealed, IV curve testing and electrical performance retesting are required. Since there is no special tooling for IV curve testing in related technologies, a press test is generally used in the test tooling during the electrical performance test, that is, the unsealed device is fixed by pressing. However, due to the lack of a cover or packaging material on the unsealed device, pressing may cause damage to the internal bonding wires or chips, and the retest results are inaccurate or cannot be retested. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide an electronic component testing system and method that overcomes the above problems or at least partially solves the above problems.

[0005] Based on the above objectives, the first aspect of the present application provides an electronic component testing system, comprising:

[0006] A test board, the test board comprising a test surface;

[0007] A contact strip, arranged on one side of the test surface of the test board, and the contact strip at least provides a first contact surface to the connection of the device under test;

[0008] A transfer point is connected to the contact strip via a connecting line, and the transfer point is located on one side of the test surface to at least provide a second contact surface for the test device; wherein the wiring of the connecting line is arranged inside the test board.

[0009] Furthermore, a central area is provided at the center of the test board for placing or accommodating the device under test, wherein the area of ​​the central area is larger than the cross-sectional area of ​​the device under test;

[0010] The contact belt comprises a plurality of first contact belts and second contact belts spaced apart around the central area;

[0011] The transfer point includes a first transfer point and a second transfer point, the first transfer point is connected to the first contact belt through the connection line, and the second transfer point is connected to the second contact belt through the connection line;

[0012] The first transition point and the first contact belt connected to the first transition point are located on the same side of the central area, and the second transition point and the second contact belt connected to the second transition point are located on the same side of the central area.

[0013] Further, the widths of the first contact zone and the second contact zone increase sequentially around the central area, and the interval between the first contact zone and the second contact zone around the central area is the same;

[0014] Or the widths of the first contact zone and the second contact zone are the same around the central area, and the interval between the first contact zone and the second contact zone around the central area increases successively.

[0015] Furthermore, a central area is provided at the center of the test board for placing or accommodating the device under test, wherein the area of ​​the central area is larger than the cross-sectional area of ​​the device under test;

[0016] A plurality of installation areas are arranged around the central area, and in any of the installation areas, plug holes are arranged along the arrangement direction of the plurality of installation areas, and the transfer point is connected to the plug hole through the connection line;

[0017] A first plug pin matched with the plug hole is provided on one side of the contact strip facing the test surface.

[0018] Further, the plug-in hole comprises a first plug-in hole and a second plug-in hole;

[0019] The installation area includes a first area and a second area distributed along the arrangement direction of the plurality of installation areas, in the first area, a plurality of the first plug holes are arranged in parallel along the arrangement direction of the first area and the second area, and in the second area, a plurality of the second plug holes are arranged in parallel along the arrangement direction of the first area and the second area;

[0020] The transfer points include a first transfer point and a second transfer point. The first transfer points are connected to the first plug holes through the connection lines, and the second transfer points are connected to the second plug holes through the connection lines.

[0021] Furthermore, the first plug hole and the second plug hole are evenly provided with adjustment holes, and the contact belt is provided with second plug pins adapted to the adjustment holes;

[0022] The first pin movable sleeve is provided with an adjustment ring.

[0023] Furthermore, the test panel is provided with a heating wire, and the orthographic projection of the contact belt on the test panel is located within the orthographic projection range of the heating wire on the test panel; wherein the heating wire is in a different layer from the connecting wire in the test panel;

[0024] A connection point is provided at the edge of the test board, the connection point is connected to the heating wire, and the connection point is located on one side of the test surface to provide at least a third contact surface for the power supply.

[0025] Further, the transition point includes a welding pad and / or a connecting screw, and the connecting screw is threadedly connected with a fastening nut.

[0026] Furthermore, the contact strip is made of a metal material with low resistance and anti-oxidation.

[0027] A second aspect of the present application provides an electronic component testing method, which is applicable to the electronic component testing system as described in the first aspect, and the method comprises:

[0028] Placing the connection belt of the device under test on the first contact surface of the contact belt, and welding the first contact surface of the contact belt and the connection;

[0029] connecting the test device using the second contact surface of the transfer point;

[0030] The test device is used to power up the transition point to determine the performance of the device under test.

[0031] As can be seen from the above, the electronic component test system provided by the present application includes a test board, the test board includes a test surface; a contact belt, which is arranged on one side of the test surface of the test board, and the contact belt at least provides a contact surface to the pins of the device to be tested; a transfer point, which is connected to the contact belt through a connecting line, and the connection point is located on one side of the test surface and at least provides a contact surface to the test device; wherein the wiring of the connecting line is arranged inside the test board. Through the above arrangement, it can be applied to electronic components of various packaging forms, especially for electronic components after opening, using the contact surface provided by the contact belt, when testing the electronic components, there is no need to press the electronic components to fix the pins of the electronic components, but to use the contact belt to contact the pins or internal pins of the device after opening and then weld to achieve connection, and use the contact belt, the connecting line and the transfer point as a whole to achieve the reconstruction of the pins of the electronic components after opening, overcome the situation that the internal chip and the bonding wire are damaged during the IV curve test and electrical performance test of the electronic components after opening by pressing, resulting in inaccurate test results, and provide a universal test tooling for the IV curve test and electrical performance test of the electronic components after opening.

[0032] At the same time, for unopened electronic components, the contact tape can also be used to contact their pins or pads to achieve IV curve testing and electrical performance testing of the electronic components.

[0033] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1a It is a schematic diagram of a top view of an electronic component having radial pins on both sides;

[0036] Figure 1b It is a schematic diagram of a top view of an electronic component with a single-sided radial pin;

[0037] Figure 1c A schematic diagram of an electronic component in a QFN package;

[0038] Figure 2 A schematic diagram of an electronic component testing system according to an embodiment of the present application;

[0039] Figure 3 A schematic diagram of another electronic component testing system according to an embodiment of the present application;

[0040] Figure 4 A schematic diagram of a contact belt according to an embodiment of the present application;

[0041] Figure 5 This is an enlarged schematic diagram of the installation area of ​​an embodiment of the present application;

[0042] Figure 6 This is a schematic diagram of the distribution of adjustment holes in an embodiment of the present application;

[0043] Figure 7 A schematic diagram of the distribution of heating wires in an embodiment of the present application;

[0044] Figure 8 This is a flow chart of the electronic component testing method according to an embodiment of the present application. DETAILED DESCRIPTION

[0045] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0046] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0047] There are many types of electronic components, and accordingly, there are many types of packaging for different electronic components, such as Figure 1a The electronic component shown has radial pins on both sides. Figure 1b For electronic components with unilateral radial pins, due to the different unsealing methods and device packaging types, for most electronic devices, such as integrated circuits and chips, the pins will not be affected after unsealing. Of course, it is not ruled out that the external pins are removed during the unsealing process due to the unsealing method. Regardless of whether the pins exist, the electronic components need to be fixed and connected by pressing during the corresponding electrical performance test after unsealing. For example, Figure 1a The electronic components are pressed into the test socket as shown in the figure. Figure 1b The electronic components are pressed into the test socket in the direction of the pin extension. Due to the different packaging methods, the package will fix the pins. After opening, the fixing effect of the package is no longer there. During the pressing process of the electronic components, pressing the body of the electronic components may cause damage to the internal chip and bonding wires. Pressing the pins may cause the connection between the pins and the chip body to be disconnected, causing damage. Ultimately, after the device under test is opened, the retest of the IV curve and electrical performance cannot provide accurate test results or cannot be retested directly.

[0048] For example, Figure 1cThe QFN (Quad Flat No-leads Package) shown in the figure is one of the surface mount packages. Since it has no pins, it is connected to the test device through the electrode contacts configured in the package. When it is unpacked, the contact is connected to the test device by pressing. Similarly, the QFN package has internal pins. After unpacking, it cannot be effectively clamped due to the size design of the internal pins. The connection between the internal pins and the test device is also achieved by pressing. However, the pressing after unpacking can easily cause damage to the internal bonding wires or chips, resulting in inaccurate test results such as electrical performance after retesting or the inability to retest directly.

[0049] In addition, when conducting electrical performance tests on electronic components of different packaging types, pressing is used to connect and fix the electronic components, thereby enabling the test device to perform relevant tests on the electronic components. After the device is opened, due to the lack of a cover or packaging material, pressing may cause damage to the internal bonding wires or chips, resulting in inaccurate results for retesting or direct failure to retest.

[0050] Based on this, reference Figure 2 As shown, the present application provides an electronic component testing system, comprising: a test board 100, wherein the test board 100 comprises a test surface; a contact strip 1, which is arranged on one side of the test surface of the test board 100, and the contact strip at least provides a first contact surface to the connection of the device to be tested; a transfer point, which is connected to the contact strip 1 through a connecting line 3, and the transfer point 22 is located on one side of the test surface to provide a second contact surface to at least a testing device; wherein the wiring of the connecting line 3 is arranged inside the test board 100.

[0051] The device to be tested in the embodiments of the present application is mainly aimed at electronic components that are unsealed after destructive testing, especially QFN packaged chips. Since they are surface mount packages and have no pins, after unsealing, if you want to use a test device to perform an electrical performance test on the unsealed device to be tested, you need to fix it by pressing. During the fixing process, the internal pins or pads of the device to be tested need to be connected to the test equipment, and then the corresponding test is performed. However, in the process of fixing and connecting by pressing, whether it is a fixed connection achieved by pressing once or by continuous pressing, there is no clear standard for the force applied to the unsealed electronic components (device to be tested). At the same time, the pressing force cannot be accurately grasped during manual pressing, which will cause damage to the chip or bonding wire inside the device to be tested. After the device to be tested is unsealed, the retest of the IV curve and the electrical performance cannot provide accurate test results, that is, the test results obtained in the non-destructive test are quite different from the retest results.

[0052] For devices with external pins, in destructive testing, that is, the pins of the device under test are not necessarily removed during the unpacking process, and during the process of fixing such devices under test, for example Figure 1a and Figure 1b The electronic components shown all need to be fixed by pressing the electronic component body and the pins. However, due to the removal of the package, there are chips and bonding wires in the electronic component body, and there is no package to fix the pins of this type of device under test. The chip and bonding wire inside the device under test and the location where they are connected to the pins may also be damaged due to pressing, which ultimately leads to the retesting of the IV curve and electrical properties of the device under test after unpacking cannot provide accurate test results or cannot be tested directly, that is, the test results obtained in the non-destructive test are quite different from the retest results or cannot be tested due to damage.

[0053] Therefore, no matter whether the device under test has external pins or no external pins, for the retest of the device under test, it is first necessary to change the connection method of the device under test, that is, to connect it in a way that will not cause damage to the device under test. No matter whether the device under test has external pins or internal pins, after unsealing, both the internal pins and the external pins can be used as the connection of the device under test, and the effective connection with the connection is first achieved by utilizing a larger contact area to achieve the connection between the connection and the device under test, that is, utilizing the first contact surface of the contact band 1 to achieve a lossless connection between the connection of the device under test after unsealing and the contact band 1.

[0054] Secondly, it is necessary to change the fixing method of the device under test. In the case of different connection methods, it is obvious that the connection point cannot be fixed like a horizontal pin or a vertical pin. Fixing by pressing may still damage the device under test. In the case that the contact belt 1 provided is connected to the connection point of the device under test without loss, welding is used to fix the contact belt 1 to the connection point. The welding method can be soldering.

[0055] In this embodiment, for the unsealed device under test, the contact tape 1, the connecting wire 3 and the transfer point 2 are used as a whole to reconstruct the pins of the unsealed device under test, that is, the contact tape 1, the connecting wire 3 and the transfer point 3 are used as a whole as the pins of the device under test, and the transfer point 2 is connected to the test device through the second contact surface of the transfer point 2. The test device is used to power the transfer point 2 to implement the test of the device under test. Here, the test device can be an IV curve tracer for performing IV curve testing, or it can be an ATE device (Automatic Test Equipment) for performing corresponding electrical performance testing.

[0056] It is understandable that, in addition to unsealed devices under test, the electronic component testing system provided in this embodiment can also be used to perform IV curve testing and electrical performance testing on unsealed devices under test. At the same time, the electronic component testing system provided in this embodiment provides a universal tooling for IV curve testing for non-destructive testing, and provides a universal tooling for IV curve testing and electrical performance testing for unsealed devices under test for destructive testing.

[0057] In some embodiments, a central area 4 is provided at the center of the test board 100 for placing or accommodating the device under test; the contact band 1 includes a plurality of first contact bands 11 and a second contact band 12 spaced apart around the central area 4; the transfer point 2 includes a first transfer point 21 and a second transfer point 22, the first transfer point 21 is connected to the first contact band 11 through the connecting line 3, and the second transfer point 22 is connected to the second contact band 12 through the connecting line 3; the first transfer point 21 and the first contact band 11 connected to the first transfer point 21 are located on the same side of the central area 4, and the second transfer point 22 and the second contact band 12 connected to the second transfer point 22 are located on the same side of the central area 4.

[0058] In the present embodiment, as a universal tool for IV curve test and electrical performance test of the device under test, performing corresponding tests on the devices under test one by one in turn obviously cannot meet the testing requirements of the universal tool. Through the above-mentioned configuration, a group of first contact bands 11 and second contact bands 12 are connected and fixed to the connection point of the device under test to realize the testing of one device under test. Through the configuration of multiple first contact bands 11 and second contact bands 12, multiple devices under test can be tested at the same time, thereby realizing the universal testing function of the universal tool for IV curve test and electrical performance test.

[0059] The first transfer point 21 and the first contact band 11 connected thereto are located on the same side of the central area 4, and the second transfer point 22 and the second contact band 12 connected thereto are located on the same side of the central area 4, thereby reducing the wiring length of the connecting line 3, and utilizing the contact band, the connecting line 3 and the transfer point as a whole as a reconstruction of the pin of the device under test. The shorter the connecting line 3 is, the smaller the resistance is, and the higher the accuracy of the relevant tests on the device under test is.

[0060] When testing the device under test, the main body of the device under test is located in the central area 4. In the present embodiment, as a universal tooling for IV curve testing and electrical performance testing of the device under test, when testing multiple devices, the central area 4 can at least hold all the devices under test, and the area of ​​the central area 4 is much larger than the cross-sectional area of ​​the device under test.

[0061] In some embodiments, the widths of the first contact band 11 and the second contact band 12 increase sequentially around the central area 4, and the interval between the first contact band 11 and the second contact band 12 around the central area 4 is the same; or the widths of the first contact band 11 and the second contact band 12 are the same around the central area 4, and the interval between the first contact band 11 and the second contact band 12 increases sequentially around the central area 4.

[0062] For the DUT, different packages, different functions and different application scenarios, the sizes of the DUT are different, and accordingly, the spacing between the connections is also different. Different types of DUTs require different test systems, that is, different contact strips, transfer points, etc. are set in different test boards 100 to implement the testing of DUTs of different sizes and types.

[0063] The electronic component test system of this embodiment is a universal tool for IV curve test and electrical performance test of the device under test. In one case, the width of the central area 4 of the ring of multiple groups of first contact belts 11 and second contact belts 12 increases successively, while the interval remains unchanged, so that the effective first contact surface interval between the first contact belt 11 and the second contact belt 12 becomes larger and larger, thereby meeting the test of devices under test of different sizes and types. Further, according to the formula R=ρL / S, the larger the first contact surface, the smaller the resistance of the contact belt. As part of the pin reconstruction of the device under test, the smaller the resistance of the contact belt, the higher the accuracy of the test results, whether for IV curve test or electrical performance test.

[0064] In another case, the widths of the multiple groups of first contact belts 11 and second contact belts 12 are the same around the central area 4, and the intervals are increased successively. As in the above case, the increasing intervals can meet the test requirements of devices of different sizes. The first contact belts 11 and the second contact belts 12 have the same width, which facilitates the preparation of the first contact belts 11 and the second contact belts 12.

[0065] In some embodiments, reference Figure 3 , Figure 4 As shown, a central area 4 is provided at the center of the test board 100 for placing or accommodating the device under test, wherein the area of ​​the central area 4 is larger than the cross-sectional area of ​​the device under test; a plurality of mounting areas 10 are provided around the central area 4, and in any mounting area 10, plug holes are provided along the arrangement direction of the plurality of mounting areas 10, and the transfer point is connected to the plug hole through the connecting line 3; a first plug pin 6 adapted to the plug hole is provided on the side of the contact strip facing the test surface.

[0066] The electronic component testing system of this embodiment is a universal tool for IV curve testing and electrical performance testing of the device under test. After the connection of the test device is contacted and connected with the contact belt 1, the connection and the contact belt are fixed by soldering. After the test of the device under test is completed, the welding position needs to be heated to separate the connection from the contact belt 1, and the contact belt 1 is tested again for the next time. However, during the continuous welding and separation process, impurities brought by welding may appear at the welding position of the contact belt, and the welding position of the contact belt may also be damaged, resulting in the inability of the contact belt to be effectively connected and fixed to the connection.

[0067] Based on this, in order to effectively replace the damaged contact strip 1, the contact strip 1 can be connected to the test board 100 in a detachable manner. To be more specific, conventional detachable connection methods, such as snap-on connection, screw connection, etc., are not applicable to the test board 100. The wiring between different layers inside the test board 100 is connected through vias. Therefore, based on the maturity of the process for preparing vias in the test board 100, this embodiment uses the first pin 6 and the plug hole 5 to achieve a detachable connection between the contact strip 1 and the test board 100, which is convenient for replacing the damaged contact strip 1 and improving the service life of the electronic component test system in this embodiment.

[0068] Furthermore, for different devices under test, the distribution of internal pins after opening is different, that is, the distribution of connections is different. The contact band 1 can use the first pin 6 as an axis to rotate in the plug-in hole 5 to adjust the angle between the contact bands 1. For connections with different distributions, effective contact and connection between the connection and the contact band 1 is achieved, avoiding the inability to effectively contact and connect with the connection due to the single arrangement of the contact bands 1.

[0069] In some embodiments, reference Figure 5 As shown, the plug hole 5 includes a first plug hole 51 and a second plug hole 52; the installation area 10 includes a first area 20 and a second area 30 distributed along the arrangement direction of the plurality of installation areas 10, in the first area 20, a plurality of the first plug holes 51 are arranged in parallel along the arrangement direction of the first area 20 and the second area 30, and in the second area 30, a plurality of the second plug holes 52 are arranged in parallel along the arrangement direction of the first area 20 and the second area 30; the transfer node includes a first transfer node and a second transfer node, the first transfer point 21 is connected to the first plug hole 51 respectively through the connecting line 3, and the second connection point 72 is connected to the second plug hole 52 respectively through the connecting line 3.

[0070] Similar to the previous embodiment, in this embodiment, for the device under test, the size of the device under test is different under different packages, different functions and different application scenarios, and accordingly, the spacing between the connection points of the device under test is also different. For different types of devices under test, the spacing between different contact bands 1 is adjusted by using a plurality of first plug holes 51 and a second plug hole 52 distributed along the first area 20 and the second area 30. Multiple installation areas 10 adjust the distance between the contact bands 1 through the first plug hole 51 and the second plug hole 52 respectively, and can adjust the devices under test of different sizes and types at the same time, realizing the function of the electronic component testing system of this embodiment as a universal tooling for IV curve testing and electrical performance testing of the device under test.

[0071] In some embodiments, reference Figure 6 As shown, the first plug hole 51 and the second plug hole 52 are evenly provided with adjustment holes 53 respectively, and the contact belt 1 is provided with a second plug pin (not shown in the figure) adapted to the adjustment hole 53; the first plug pin 6 is movably sleeved with an adjustment ring (not shown in the figure).

[0072] In the above embodiment, the contact belt 1 is rotated in the first plug hole 51 using the first plug pin 6 as an axis to achieve angle adjustment between the contact belts 1, thereby avoiding the inability to effectively contact and connect with the devices under test distributed at different connection points due to the single arrangement of the contact belts 1. The angle adjustment between the contact belts 1 is achieved by rotating the first plug pin 6 in the first plug hole 51 only. After long-term use, the rotation will cause wear between the first plug pin 6 and the first plug hole 51, which may easily cause a virtual connection of the first plug pin 6 in the first plug hole 51, resulting in an ineffective connection between the contact belt 1 and the connecting line 3. At the same time, the long-term wear between the first plug pin 6 and the first plug hole 51 will cause a decrease in friction, which may easily cause the first pin 6 to be unable to be effectively fixed in the first plug hole 51, that is, the first pin 6 is prone to rotate in the first plug hole 51.

[0073] In order to avoid the above situation, reduce the wear between the first plug pin 6 and the first plug hole 51, further ensure the effective fixation of the contact belt 1, and at the same time meet the angle adjustment between the contact belt 1. By evenly arranging the adjustment holes 53 around the first plug hole 51 and the second plug hole 52, a second plug pin adapted to the adjustment hole 53 is arranged on the contact belt 1, wherein the second plug pin can be one or multiple second plug pins arranged around the first plug pin 6, which is not specifically limited here. After adjusting the angle between the contact belt 1, in the first zone 20, the first plug pin 6 is inserted into the first plug hole 51, and the second plug pin is inserted into the adjustment hole 53, and the second plug pin and the adjustment hole 53 are used to realize the axial fixation between the first plug pin 6 and the first plug hole 51 along the first plug pin 6, so as to avoid the additional wear between the first plug pin 6 and the first plug hole 51 caused by the rotation of the contact belt 1 in the first plug hole 51 along the first plug pin 6 as the axis.

[0074] Furthermore, for unsealed DUTs, especially for DUTs unsealed physically, the unsealing process may not be completely controllable. Accordingly, the connection of the DUT may not be located on the same plane. Therefore, in order to achieve effective contact between the connection and the contact belt 1, the use of pressing may cause damage to the internal chip and bonding wire. The connection of the DUT is connected to the contact belt 1 through contact, and effective contact with the connection can only be achieved by changing the contact belt 1. By movably sleeved an adjustment ring on the first pin 6, the height of the contact belt can be adjusted to achieve effective contact between the connection of the DUT and the contact belt 1.

[0075] It should be noted that the adjustment ring can be a rubber ring. The adjustment ring is configured to have a variety of different heights to adapt to the different heights of the contact belt 1. When there is no need to adjust the height of the contact belt 1, the adjustment ring can be removed from the first pin 6, and the adjustment ring can be used as a supporting device of the electronic component test system in the embodiment of the present application.

[0076] In some embodiments, reference Figure 7 As shown, the test board 100 is provided with a heating wire 71, and the orthographic projection of the contact belt 1 on the test board 100 is located within the orthographic projection range of the heating wire 71 on the test board 100; the heating wire 71 is in a different layer from the connecting line 3 in the test board 100; a connection point 72 is provided at the edge of the test board 100, the connection point 72 is connected to the heating wire 71, and the connection point 72 is located on one side of the test panel to provide at least a third contact surface to the power supply.

[0077] In this embodiment, after the connection of the device under test is in contact with the contact belt 1, it is fixed by soldering. After the test is completed, a special device for removing the solder needs to be used to disconnect the connection from the contact belt 1, such as a hot air blower, a soldering iron, etc. There are many inconveniences in the disconnection process between the device under test and the contact belt 1. As a universal tool for IV curve testing and electrical performance testing of the device under test, in order to achieve faster disconnection between the device under test and the contact belt 1, after the test of the device under test is completed, the power supply is used to power the heating wire 71 through the connection point 72, and the heating wire 71 heats up to remove the solder joints. No special additional device is required, and the removal efficiency is higher.

[0078] The orthographic projection of the contact belt 1 on the test board 100 is within the orthographic projection range of the heating wire 71 on the test board 100. The heating of the heating wire 71 only heats the corresponding position of the contact belt 1, and the heating does not affect other positions of the test board 100.

[0079] In some embodiments, the transition point 2 includes a welding pad and / or a connecting screw, and the connecting screw is connected with a fastening nut.

[0080] In this embodiment, for electronic devices, there are many types of electrical performance tests, such as resistor tests, capacitor tests, transistor tests, crystal oscillator tests, etc. Different test devices are required for different electrical performance tests, such as multimeters, capacitance meters, frequency meters, etc. Different test devices have different connection methods with the device to be tested when testing, such as clamps, gaskets, pads and other connection methods. For different connection methods, they can be connected to the corresponding transfer point 2. For example, when the connection method is a gasket or a clip, it can be connected to the connecting screw by a fastening nut. For example, when the connection method is a pad, the pad can be welded to the pad of the transfer point to achieve connection. The needs of different test devices for electrical performance testing of the device to be tested are met, and the needs of the electronic component testing system in the embodiment of the present application as a universal tooling for IV curve testing and electrical performance testing of the device to be tested are realized.

[0081] In some embodiments, the contact strip 1 is made of a metal material with low resistance and anti-oxidation.

[0082] It can be seen from the above embodiments that the electronic component test system provided in the embodiments of the present application is a universal tooling for IV curve testing and electrical performance testing of the device under test. Its main purpose is to achieve the pin reconstruction of the unsealed device under test, which is equivalent to re-providing the device under test with pins connected to the test device. If the resistance is too large, it may affect the electrical performance test data of the device under test itself. At the same time, the contact belt 1 is set on the test surface of the test board 100 to avoid the inability to effectively contact and connect the connection of the device under test with the first contact surface due to long-term exposure to air oxidation, and use anti-oxidation metal material.

[0083] In some optional embodiments, the material of the contact strip 1 may be copper.

[0084] The electronic component testing system provided by the embodiment of the present application includes a test board, the test board includes a test surface; a contact belt, which is arranged on one side of the test surface of the test board, and the contact belt at least provides a contact surface to the pin of the device to be tested; a transfer point, which is connected to the contact belt through a connecting line, and the connection point is located on one side of the test surface and at least provides a contact surface to the test device; wherein the wiring of the connecting line is arranged inside the test board. Through the above arrangement, various packaging forms of electronic components can be applied, especially for electronic components after opening, using the contact surface provided by the contact belt, when testing the electronic components, there is no need to press the electronic components to fix the pins of the electronic components, but to use the contact belt to contact with the pins or internal pins of the device after opening and then weld to achieve connection, and use the contact belt, the connecting line and the transfer point as a whole to achieve the reconstruction of the pins of the electronic components after opening, so as to overcome the situation that the internal chip and the bonding wire are damaged during the IV curve test and electrical performance test of the electronic components after opening by pressing, resulting in inaccurate test results, and provide a universal test tooling for the IV curve test and electrical performance test of the electronic components after opening.

[0085] At the same time, for unopened electronic components, the contact tape can also be used to contact their pins or pads to achieve IV curve testing and electrical performance testing of the electronic components.

[0086] Based on the unified invention concept, reference Figure 8 As shown, an embodiment of the present application provides an electronic component testing method, which is applied to an electronic component testing system of any of the above embodiments, including:

[0087] S10, placing the connection of the device under test on the first contact surface of the contact belt, and welding the first contact surface of the contact belt and the connection;

[0088] S20, connecting the test device using the second contact surface of the transfer point;

[0089] S30: Power on the transfer point using the test device to determine the performance of the device under test.

[0090] The test process has been introduced in the above embodiments and will not be repeated here.

[0091] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0092] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0093] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0094] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. An electronic component testing system, characterized in that: include: A test board, the test board comprising a test surface; A contact strip, arranged on one side of the test surface of the test board, and the contact strip at least provides a first contact surface to the connection of the device under test; A transfer point is connected to the contact strip via a connecting line, and the transfer point is located on one side of the test surface to at least provide a second contact surface for the test device; wherein the wiring of the connecting line is arranged inside the test board.

2. The electronic component testing system according to claim 1, characterized in that: A central area is provided at the center of the test board for placing or accommodating the device under test, wherein the area of ​​the central area is larger than the cross-sectional area of ​​the device under test; The contact belt comprises a plurality of first contact belts and second contact belts spaced apart around the central area; The transfer point includes a first transfer point and a second transfer point, the first transfer point is connected to the first contact belt through the connection line, and the second transfer point is connected to the second contact belt through the connection line; The first transition point and the first contact belt connected to the first transition point are located on the same side of the central area, and the second transition point and the second contact belt connected to the second transition point are located on the same side of the central area.

3. The electronic component testing system according to claim 2, characterized in that: The widths of the first contact zone and the second contact zone increase sequentially around the central area, and the intervals between the first contact zone and the second contact zone around the central area are the same; Or the widths of the first contact zone and the second contact zone are the same around the central area, and the interval between the first contact zone and the second contact zone around the central area increases successively.

4. The electronic component testing system according to claim 1, characterized in that: A central area is provided at the center of the test board for placing or accommodating the device under test, wherein the area of ​​the central area is larger than the cross-sectional area of ​​the device under test; A plurality of installation areas are arranged around the central area, and in any of the installation areas, plug holes are arranged along the arrangement direction of the plurality of installation areas, and the transfer point is connected to the plug hole through the connection line; A first plug pin matched with the plug hole is provided on one side of the contact strip facing the test surface.

5. The electronic component testing system according to claim 4, characterized in that: The plug-in hole comprises a first plug-in hole and a second plug-in hole; The installation area includes a first area and a second area distributed along the arrangement direction of the plurality of installation areas, in the first area, a plurality of the first plug holes are arranged in parallel along the arrangement direction of the first area and the second area, and in the second area, a plurality of the second plug holes are arranged in parallel along the arrangement direction of the first area and the second area; The transfer points include a first transfer point and a second transfer point. The first transfer points are connected to the first plug holes through the connection lines, and the second transfer points are connected to the second plug holes through the connection lines.

6. The electronic component testing system according to claim 5, characterized in that: The first plug hole and the second plug hole are evenly provided with adjustment holes respectively, and the contact belt is provided with second plug pins adapted to the adjustment holes; The first pin movable sleeve is provided with an adjustment ring.

7. The electronic component testing system according to claim 1, characterized in that: The test panel is provided with a heating wire, and the orthographic projection of the contact belt on the test panel is located within the orthographic projection range of the heating wire on the test panel; wherein the heating wire is in a different layer from the connecting wire in the test panel; A connection point is provided at the edge of the test board, the connection point is connected to the heating wire, and the connection point is located on one side of the test surface to provide at least a third contact surface for the power supply.

8. The electronic component testing system according to claim 1, characterized in that: The transition point includes a welding pad and / or a connecting screw, and the connecting screw is threadedly connected with a fastening nut.

9. The electronic component testing system according to claim 1, characterized in that: The contact strip is made of a metal material with low resistance and anti-oxidation.

10. An electronic component testing method, applicable to the electronic component testing system according to any one of claims 1 to 9, the method comprising: Placing the connection belt of the device under test on the first contact surface of the contact belt, and welding the first contact surface of the contact belt and the connection; connecting the test device using the second contact surface of the transfer point; The test device is used to power up the transition point to determine the performance of the device under test.

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