Temperature adjusting module, electronic equipment and error compensation method

Abstract

The invention discloses a temperature adjusting module, electronic equipment and an error compensation method, and belongs to the technical field of sensors, and the temperature adjusting module comprises a first sensor, a first temperature detection device, a temperature compensation device and a heat source; a heat propagation path is arranged between the heat source and the first sensor; the first temperature detection device is arranged corresponding to the first sensor and is used for detecting the temperature of the first sensor; the temperature compensation device is electrically connected with the first temperature detection device and is used for performing temperature compensation on the first sensor according to the temperature detected by the first temperature detection device so as to adjust the temperature change rate of the first sensor to be consistent with a target temperature curve; wherein the target temperature curve is used for determining a temperature hysteresis curve of the first sensor, and the temperature hysteresis curve is used for compensating offset errors caused by temperature changes of the first sensor.

Description

Technical Field

[0001] The present application belongs to the field of sensor technology, and specifically relates to a temperature regulation module, an electronic device and a temperature regulation method. Background Art

[0002] In the related art, there are a large number of sensors that are affected by temperature changes. The performance of these sensors will be affected by temperature changes, thereby causing detection errors of the sensors.

[0003] Taking the Micro-Electro-Mechanical System (MEMS) gyroscope as an example, MEMS gyroscopes are widely used in camera anti-shake, navigation and other fields. However, MEMS gyroscopes have zero offset error and angle random walk error.

[0004] Among them, the angle random walk error is an irregular error, which can usually be filtered out by software filtering, and this type of error is easily offset during angle integration. The zero offset will deteriorate due to temperature changes and is one of the main factors causing angle integration errors.

[0005] Since the temperature offset characteristics of the MEMS gyroscope are different during the heating and cooling processes, there are hysteresis characteristics. Moreover, the hysteresis characteristics of the MEMS gyroscope are not only related to the external real-time temperature, but also affected by the temperature change rate. The temperature change rate around the MEMS gyroscope is related to the ambient temperature, the heating efficiency of the heat source in the same electronic device, etc., which makes the temperature changes around the MEMS gyroscope irregular. Therefore, the hysteresis characteristics of the MEMS gyroscope are composed of multiple complex hysteresis paths, and a large number of complex neural network calculations are required to achieve software compensation for the offset characteristics of the MEMS gyroscope at various temperature points. Summary of the invention

[0006] The purpose of the embodiments of the present application is to provide a temperature control module, an electronic device and a temperature control method, which performs thermal compensation on a sensor through a thermal compensation device so that the temperature change around the sensor is close to a preset temperature change curve. In this way, software compensation can be performed on the offset characteristics of the sensor at each temperature point based on a hysteresis path corresponding to the temperature change curve, which can simplify the calculation process of software compensation for the offset characteristics of the sensor.

[0007] In a first aspect, an embodiment of the present application provides a temperature adjustment module, the temperature adjustment module comprising: a first sensor, a first temperature detection device, a temperature compensation device and a heat source;

[0008] A heat transfer path is provided between the heat source and the first sensor;

[0009] The first temperature detection device is arranged corresponding to the first sensor and is used to detect the temperature of the first sensor;

[0010] The temperature compensation device is electrically connected to the first temperature detection device and is used to perform temperature compensation on the first sensor according to the temperature detected by the first temperature detection device, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve;

[0011] The target temperature curve is used to determine a temperature hysteresis curve of the first sensor, and the temperature hysteresis curve is used to compensate for an offset error caused by a temperature change of the first sensor.

[0012] In a second aspect, an embodiment of the present application provides an electronic device, which includes the temperature adjustment module as described in the first aspect.

[0013] In a third aspect, an embodiment of the present application provides an error compensation method, which is applied to the temperature adjustment module as described in the first aspect, or applied to the electronic device as described in the second aspect;

[0014] The method comprises:

[0015] Obtain target temperature curve;

[0016] According to the temperature of the first sensor detected by the first temperature detection device, controlling the temperature compensation device to perform temperature compensation on the first sensor, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve;

[0017] Acquire a temperature offset error of the first sensor at each temperature point on the target temperature curve;

[0018] determining a temperature hysteresis curve according to a temperature offset error of the first sensor at each temperature point on the target temperature curve;

[0019] According to the temperature hysteresis curve, error fitting compensation is performed on the detection result of the first sensor.

[0020] In an embodiment of the present application, a temperature adjustment module includes: a first sensor, a first temperature detection device, a temperature compensation device and a heat source; a heat transfer path is provided between the heat source and the first sensor; the first temperature detection device is arranged corresponding to the first sensor and is used to detect the temperature of the first sensor; the temperature compensation device is electrically connected to the first temperature detection device and is used to perform temperature compensation on the first sensor according to the temperature detected by the first temperature detection device, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve; wherein the target temperature curve is used to determine the temperature hysteresis curve of the first sensor, and the temperature hysteresis curve is used to compensate for the offset error caused by the temperature change of the first sensor. The temperature of the first sensor is fine-tuned by controlling the temperature compensation device so that the temperature change rate of the first sensor conforms to the preset target temperature curve. In this way, no matter how much heat is generated by the heat source or how much the ambient temperature of the temperature adjustment module changes, the first sensor can be adjusted to conform to a fixed temperature change law, so that the first sensor has a fixed temperature hysteresis curve, which can simplify the calculation complexity of software compensation for the offset characteristics of the MEMS gyroscope at each temperature point based on the fixed temperature hysteresis curve. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is the temperature curve of MEMS gyroscope;

[0022] Figure 2 yes Figure 1 The temperature hysteresis curve of the MEMS gyroscope shown;

[0023] Figure 3 is a schematic diagram of a MEMS gyroscope thermal insulation device in the related art;

[0024] Figure 4 This is one of the structural schematic diagrams of the temperature adjustment module provided in the embodiment of the present application;

[0025] Figure 5 is a schematic diagram of a possible temperature curve of the first sensor when the temperature compensation device is not activated;

[0026] Figure 6 When the temperature compensation device is started, Figure 5 The temperature curve shown is adjusted to a schematic diagram of a target temperature curve;

[0027] Figure 7 is the first sensor and Figure 6 A schematic diagram of a temperature hysteresis curve corresponding to the target temperature curve shown;

[0028] Figure 8 is the first sensor and Figure 5A schematic diagram of a temperature hysteresis curve corresponding to the temperature curve shown;

[0029] Fig. 9 This is the second structural schematic diagram of the temperature adjustment module provided in the embodiment of the present application;

[0030] Fig.10 This is the third structural schematic diagram of the temperature adjustment module provided in the embodiment of the present application;

[0031] Fig.11 is a side view of a temperature adjustment module provided in an embodiment of the present application;

[0032] Fig.12 It is one of the flow charts of the error compensation method provided in the embodiment of the present application;

[0033] Fig.13 This is the second flowchart of the error compensation method provided in the embodiment of the present application. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0035] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0036] In the related art, in order to reduce the temperature offset error of the MEMS gyroscope, there are usually the following two methods:

[0037] 1. Use software compensation to compensate for the offset characteristics of the MEMS gyroscope at various temperature points.

[0038] 2. Use hardware design to isolate and control the temperature of the MEMS gyroscope.

[0039] Among them, the software compensation method requires software compensation for the offset characteristics of the MEMS gyroscope under various temperatures or application environments.

[0040] However, since the temperature of the MEMS gyroscope is affected by the ambient temperature, the heating efficiency of the heat source, etc., the temperature around the MEMS gyroscope changes irregularly. Based on different temperature change rules, different temperature hysteresis curves need to be used for error compensation. Figure 1 The temperature curve of the MEMS gyroscope shown in the figure requires the use of Figure 2 A large number of temperature hysteresis curves are shown for error compensation. If a simple table lookup method or polynomial fitting of the temperature hysteresis curve is used, the error compensation effect will be poor.

[0041] Therefore, a large amount of data collection and calculation is required to handle the errors caused by complex temperature changes. For example, in the related art, a neural network algorithm is used to calculate the temperature hysteresis curve according to the temperature characteristics of the MEMS gyroscope, so as to use the temperature hysteresis curve to achieve a better error compensation effect. However, the neural network algorithm has high requirements for computing power and storage, and it is difficult to popularize it in conventional electronic devices, such as mobile phones, watches, etc.

[0042] The method of temperature isolation and constant temperature control of MEMS gyroscope is mainly to isolate the MEMS gyroscope from the external environment and heat source through a high thermal resistance structural design, so as to reduce the temperature change of the MEMS gyroscope as much as possible.

[0043] However, high thermal resistance isolation design is difficult, especially as electronic equipment pursues a trend of small size, it is difficult to achieve enough distance from the heat source while having enough space for insulation design. Figure 3 As shown, the method of temperature isolation and constant temperature control of MEMS gyroscope 103 can also be to place MEMS gyroscope 103 in thermal isolation cavity 101 based on the temperature isolation solution, and then stably control MEMS gyroscope 103 at a fixed temperature through heating device 102.

[0044] Figure 3 The solution shown in the figure simply makes the ambient temperature around the MEMS gyroscope a constant value from the hardware to solve the angle offset error caused by the temperature change of the MEMS gyroscope. This solution requires continuous temperature adjustment to achieve constant temperature control, which will consume a lot of power consumption, especially in scenarios with a large temperature difference with the external environment or drastic temperature changes. At the same time, Figure 3 The solution shown also requires the MEMS gyroscope to be thermally insulated to keep it away from heat sources and reduce the temperature impact of the external environment on the MEMS gyroscope. As a result, the power consumption of this solution is very large, and the thermal insulation design requires a large space, which will increase the size of the electronic device or make it difficult to implement on a smaller electronic device.

[0045] In the embodiment of the present application, there is no need to perform thermal insulation design on the first sensor, so that the heat of the heat source can be transferred to the first sensor, and by setting the target temperature curve in advance, the temperature curve can be compensated by using a temperature compensation device on the basis of the influence of the heat transferred by the heat source on the temperature curve of the first sensor, so that the temperature change rate of the first sensor is consistent with the pre-set target temperature curve. In this way, when the heating efficiency of the heat source, the ambient temperature, etc. change, the temperature compensation device can be used to compensate for the temperature influence of the change on the first sensor, so that the first sensor conforms to a fixed temperature change law, so that a fixed temperature hysteresis curve can be obtained based on the fixed temperature change law, and the temperature offset error compensation of the first sensor can be simplified based on the fixed temperature hysteresis curve.

[0046] The temperature adjustment module, electronic device and error compensation method provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in combination with the accompanying drawings.

[0047] See also Figure 4 The temperature adjustment module provided in the embodiment of the present application includes: a first sensor 1, a first temperature detection device 2, a temperature compensation device 3 and a heat source 4.

[0048] There is a heat transfer path between the heat source 4 and the first sensor 1;

[0049] The first temperature detection device 2 is arranged corresponding to the first sensor 1 and is used to detect the temperature of the first sensor 1;

[0050] The temperature compensation device 3 is electrically connected to the first temperature detection device 2 and is used to perform temperature compensation on the first sensor 1 according to the temperature detected by the first temperature detection device 2, so as to adjust the temperature change rate of the first sensor 1 to be consistent with the target temperature curve;

[0051] The target temperature curve is used to determine a temperature hysteresis curve of the first sensor 1 , and the temperature hysteresis curve is used to compensate for an offset error caused by a temperature change of the first sensor 1 .

[0052] It should be noted that the first sensor 1 in the embodiment of the present application can be any sensor whose detection error is related to temperature change. For the sake of convenience, the first sensor 1 in the embodiment of the present application is usually taken as a MEMS gyroscope, which is not specifically limited here.

[0053] In some embodiments, the target temperature curve may be a fixed temperature curve. In this case, the fixed temperature curve corresponds to a fixed temperature hysteresis curve.

[0054] In some embodiments, the target temperature curve may be a temperature curve set according to a heat generation law of a heat source.

[0055] In some embodiments, the target temperature curve may be a temperature curve determined according to a temperature variation pattern of the first sensor detected by the first temperature detection device.

[0056] For example, the temperature curve of the first sensor detected by the first temperature detection device in the historical time period is used as the target temperature curve.

[0057] For another example: the temperature of the first sensor is detected by the first temperature detection device within a historical time period to obtain a historical temperature curve, and the historical temperature curve is processed in a certain manner, such as smoothing, peak shaving and valley filling, replacing the temperature on the curve segment on the historical temperature curve that satisfies the temperature change rate less than a certain threshold with the same temperature, etc., to obtain a processed target temperature curve.

[0058] In some embodiments, application scenarios can be set, such as dividing application scenarios according to seasons, or determining application scenarios according to the operating scenarios of electronic devices equipped with the temperature adjustment module, such as setting corresponding application scenarios for operating scenarios such as games and telephones. In this way, based on different application scenarios, the heating efficiency of the heat source and the changing law of the ambient temperature are different, and each application scenario can be associated with its own standard temperature curve, so that the standard temperature curve and the temperature change law of the first sensor 1 in the application scenario associated with it are roughly the same. In this way, when the temperature adjustment module is working, the actual application scenario can be detected, and the standard temperature curve associated with the actual application scenario can be determined as the target temperature curve.

[0059] In some embodiments, the heat source 4 may be a heating device located in the same electronic device or apparatus as the first sensor, such as a central processing unit (CPU), a chip, and the like.

[0060] In some embodiments, there is a heat transfer path between the heat source 4 and the first sensor 1 , and there may be a heat conductive structure between the heat source 4 and the first sensor 1 , and the heat of the heat source 4 can be transferred to the first sensor 1 through the heat conductive structure.

[0061] In some embodiments, there is a heat transfer path between the heat source 4 and the first sensor 1, and no insulation structure may be provided between the heat source 4 and the first sensor 1, so that the heat of the heat source 4 can be transferred to the first sensor 1 via air or other medium.

[0062] In some embodiments, the temperature compensation device 3 performs temperature compensation on the first sensor 1 to adjust the temperature change rate of the first sensor 1 to be consistent with the target temperature curve. The temperature compensation device 3 can be heated or cooled to increase or decrease the temperature of the first sensor 1 so that the temperature curve of the first sensor 1 over a period of time is consistent with or approximately the same as the shape of the target temperature curve.

[0063] In some embodiments, the temperature compensation device 3 may be a heating device. In this case, the temperature compensation device 3 may adjust the temperature curve of the first sensor 1 over a period of time to be consistent with or substantially the same as the target temperature curve by transferring heat of different magnitudes to the first sensor 1.

[0064] In some embodiments, the temperature compensation device 3 may be a refrigeration device. In this case, the temperature compensation device 3 may adjust the temperature curve of the first sensor 1 over a period of time to be consistent with or substantially the same as the target temperature curve by absorbing heat of different magnitudes transferred by the first sensor 1.

[0065] In some embodiments, the temperature compensation device 3 can be a device that can adjust cooling and heating. In this case, when the tail end point of the temperature curve of the first sensor 1 within a period of time is about to exceed the target temperature curve, the temperature compensation device 3 can absorb the heat of the first sensor 1, and when the tail end point of the temperature curve of the first sensor 1 within a period of time is about to be lower than the target temperature curve, the temperature compensation device 3 can transfer heat to the first sensor 1, and finally adjust the temperature curve of the first sensor 1 within a period of time to be consistent with or approximately the same as the target temperature curve.

[0066] In some embodiments, the temperature compensation device 3 may include a semiconductor cooler (Thermoelectric Cooler, TEC) material, so that the heating and cooling functions can be achieved using TEC.

[0067] Of course, in addition to TEC materials, the temperature compensation device 3 may also use other structures or materials to achieve at least one of the heating and cooling functions, which is not specifically limited here.

[0068] In some embodiments, the first temperature detection device 2 can be any device or apparatus capable of realizing the temperature detection function, such as a thermistor, a negative temperature coefficient (NTC) temperature sensor, etc. For the sake of convenience of explanation, the first temperature detection device 2 is usually taken as an NTC temperature sensor in the embodiments of the present application for example, which is not specifically limited here.

[0069] In the embodiment of the present application, the temperature of the first sensor 1 is compensated by the temperature compensation device 3 so that the temperature of the first sensor 1 changes according to a preset target temperature curve. In this way, the temperature curve of the first sensor 1 can be compensated to a fixed target temperature curve, and the offset error caused by the temperature change of the first sensor 1 can be compensated based on the target temperature curve. It is only necessary to first determine a temperature hysteresis curve corresponding to the target.

[0070] For example: Assume that Figure 5 The figure shows a possible temperature curve of the first sensor 1 when the temperature compensation device 3 is not working. By compensating the temperature of the first sensor 1 through the temperature compensation device 3, Figure 5 The possible temperature curves of the first sensor 1 shown are respectively adjusted to Figure 6 The target temperature curve is shown in Figure 1. Figure 6 The target temperature curve in the figure, the temperature hysteresis curve of the first sensor 1 is as follows: Figure 7 as shown in .

[0071] It can be seen that in the embodiment of the present application, the temperature of the first sensor is fine-tuned by controlling the temperature compensation device so that the temperature change rate of the first sensor conforms to the pre-set target temperature curve. In this way, no matter how the heat generated by the heat source and the ambient temperature of the temperature control module change, the first sensor can be adjusted to conform to a fixed temperature change law, so that the first sensor has a fixed temperature hysteresis curve, which can simplify the calculation complexity of software compensation for the offset characteristics of the MEMS gyroscope at various temperature points based on the fixed temperature hysteresis curve, and reduce the amount of storage space occupied during the calculation process.

[0072] It is worth mentioning that in the related art, if the first sensor 1 is not insulated, the temperature curves of the first sensor 1 at different times or in different application scenarios are various. At this time, the offset error caused by the temperature change of the first sensor 1 is compensated based on the various temperature curves. Different temperature hysteresis curves correspond to different temperature changes. Therefore, it is necessary to first determine a plurality of temperature hysteresis curves corresponding to the various temperature curves.

[0073] For example: Figure 8 As shown, for Figure 5 The three temperature curves of the first sensor 1 can correspond to Figure 8 The three temperature hysteresis curves shown in .

[0074] Determining a plurality of temperature hysteresis curves based on a plurality of temperature curves, and compensating for an offset error caused by a temperature change of the first sensor 1 based on the plurality of temperature hysteresis curves, requires a large amount of calculation and storage space.

[0075] It can be seen that in the embodiment of the present application, a heat transfer path can be provided between the heat source 4 and the first sensor 1, which can reduce the defect of increasing the volume of the temperature regulating module caused by the heat insulation design of the first sensor 1; and the temperature of the first sensor 1 is compensated by the temperature compensation device 3, so that the temperature of the first sensor 1 changes according to the preset target temperature curve. In this way, the temperature curve of the first sensor 1 can be compensated to a fixed target temperature curve, and the offset error caused by the temperature change of the first sensor 1 can be compensated based on the target temperature curve. It is only necessary to first determine a temperature hysteresis curve corresponding to the target, thereby greatly reducing the calculation amount and storage space occupied by software compensation for the offset characteristics of the first sensor 1 at various temperature points.

[0076] As an optional implementation, Fig. 9 As shown, the temperature regulating module also includes a substrate 5;

[0077] The heat source 4 and the first sensor 1 are arranged on the substrate 5 at intervals;

[0078] The heat transfer path between the heat source 4 and the first sensor 1 includes a connection portion 52 , which is located on the substrate 5 and between the heat source 4 and the first sensor 1 .

[0079] In some embodiments, the substrate 5 can be any structure that can conduct heat, such as a printed circuit board (PCB), a flexible printed circuit (FPC), a plastic or metal structure, etc. For the sake of convenience of explanation, the embodiments of the present application are generally illustrated by taking the substrate 5 as a PCB.

[0080] In the embodiment described above, by disposing the heat source 4 and the first sensor 1 on the substrate 5 with a gap therebetween, the substrate 5 can be used to promote heat conduction between the heat source 4 and the first sensor 1 .

[0081] In some embodiments, the heat conduction efficiency between the heat source 4 and the first sensor 1 can be adjusted by designing the structure, material, etc. of the portion of the substrate 5 used for heat conduction between the heat source 4 and the first sensor 1 .

[0082] For example: the substrate 5 further includes a hollow portion 51;

[0083] Part of the hollow portion 51 is located between the heat source 4 and the first sensor 1, and the heat source 4 and the first sensor 1 are connected via a connecting portion 52. The heat transfer efficiency between the heat source 4 and the first sensor 1 is related to the width of the connecting portion 52 along the first direction X, and / or, the heat transfer efficiency between the heat source 4 and the first sensor 1 is related to the material of the connecting portion 52, wherein the first direction X is a direction perpendicular to a line from the heat source 4 to the first sensor 1 within the plane where the substrate 5 is located.

[0084] In some embodiments, the wider the width of the connecting portion 52 along the first direction X is, the higher the heat transfer efficiency between the heat source 4 and the first sensor 1 is.

[0085] In some embodiments, the higher the proportion of the material with high thermal conductivity used in the connecting portion 52 , the higher the heat transfer efficiency between the heat source 4 and the first sensor 1 .

[0086] For example, taking the substrate 5 as a PCB, the PCB includes copper foil and plastic material, wherein the heat conduction efficiency of the copper foil is higher than that of the plastic. Thus, the wider the width of the copper foil used in the connecting portion 52 along the first direction X, the higher the heat transfer efficiency between the heat source 4 and the first sensor 1.

[0087] It should be noted that the hollow portion 51 represents a hollowed-out area on the substrate 5 , where the substrate is hollowed out to form a structure that is not heat-conductive or has low heat-conductive efficiency, so that the heat transfer between the heat source 4 and the first sensor 1 is mainly conducted through the connecting portion 52 .

[0088] In some embodiments, the cavity formed by the hollow portion 51 may be filled with a heat insulating material.

[0089] In some embodiments, Fig. 9 As shown, there are two hollow portions 51 , which are grooves formed by the first side 53 and the second side 54 of the substrate 5 being recessed toward the center of the substrate 5 . At this time, the connecting portion 52 is located between the bottoms of the two grooves.

[0090] In some embodiments, Fig.10 As shown, there are two hollow portions 51 , which are respectively through holes opened on the substrate 5 . The through holes are arranged near the first sensor 1 so that heat conduction between the heat source 4 and the first sensor 1 can only be carried out through the connecting portion 52 .

[0091] In this embodiment, the substrate 5 is divided into a hollow portion 51 and a connecting portion 52 . By designing the structure and material of the connecting portion 52 , the heat conduction efficiency between the heat source 4 and the first sensor 1 can be adjusted.

[0092] In some embodiments, the heat conduction efficiency between the heat source 4 and the first sensor 1 can be determined according to the power and compensation method of the temperature compensation device 3, and the width of the connecting portion 52 along the first direction X and / or the material of the connecting portion 52 can be designed according to the heat conduction efficiency.

[0093] For example, the width of the connecting portion 52 along the first direction X satisfies the following formula:

[0094] (AB) / 2≤C;

[0095] Among them, C represents the maximum compensation amount of heat compensation that the temperature compensation device 3 can perform on the first sensor 1, A represents the maximum value of the heat transferred by the heat source 4 to the first sensor 1 through the connecting part 52 per unit time; B represents the minimum value of the heat transferred by the heat source 4 to the first sensor 1 through the connecting part 52 per unit time.

[0096] In some embodiments, the temperature adjustment module may be subjected to thermal simulation with (AB) / 2≤C as a target, and the structure and material of the connection portion 52 may be adjusted according to the simulation results until (AB) / 2≤C is satisfied.

[0097] It is worth mentioning that by making the maximum compensation amount C of the heat compensation performed by the temperature compensation device 3 on the first sensor 1 greater than or equal to 1 / 2 of the difference between the maximum value and the minimum value of the heat transferred by the heat source 4 to the first sensor 1 through the connecting part 52 per unit time, the heat transferred by the heat source 4 to the first sensor 1 through the connecting part 52 can make the first sensor 1 heat up or cool down, so that the temperature compensation device 3 can at least compensate the temperature change rate of the first sensor 1 in the process to an intermediate value of the temperature rise or drop, so that the temperature curve of the first sensor 1 can be compensated for in a peak-shaving and valley-filling manner.

[0098] Compared with the related art, in which the ambient temperature of the sensor is changed to a constant value through a temperature control system and a thermal insulation design to solve the offset error caused by temperature changes, in the embodiment of the present application, a heat control system is formed by the heat source 4 and the temperature compensation device 3. The heat transferred from the heat source 4 to the first sensor 1 is compensated by the temperature compensation device 3, so that the temperature change hysteresis curve of the first sensor 1 is always close to following the same regular line characteristics, and then the offset error compensation can be achieved through a simple fitting algorithm.

[0099] In addition, compared with the related art, the present embodiment does not need to perform heat insulation design on the first sensor 1, and can also reduce the volume of the temperature adjustment module. The temperature compensation device 3 only needs to compensate for the heat transferred from the heat source 4 to the first sensor 1, so that the temperature change rate of the first sensor 1 is consistent with the target temperature curve. There is no need to set the temperature compensation value of the first sensor 1 to a fixed value. Therefore, compared with the method of making the ambient temperature of the sensor a fixed value in the related art, the power consumption of the temperature compensation device 3 is smaller.

[0100] As an optional implementation, the temperature compensation device 3 is disposed on the substrate 5 and is arranged around the first side surface 11 of the first sensor 1, wherein the first side surface 11 is the side surface of the first sensor 1 avoiding the heat propagation path.

[0101] For example: Fig. 9 or Fig.10 As shown, the temperature compensation device 3 is close to the left side surface of the first sensor 1, and the two ends of the temperature compensation device 3 are bent and extended to the side surface and lower surface close to the first sensor 1. In this way, the heat transfer efficiency between the temperature compensation device 3 and the first sensor 1 can be improved.

[0102] In the present embodiment, since the temperature compensation device 3 and the first sensor 1 are both arranged on the substrate 5, and the temperature compensation device 3 is arranged close to the first side surface 11 of the first sensor 1, based on the copper foil structure in the substrate 5, the heat transfer efficiency between the temperature compensation device 3 and the first sensor 1 can be higher, at least the heat transfer efficiency between the temperature compensation device 3 and the first sensor 1 is higher than the heat transfer efficiency between the first sensor 1 and the heat source 4, and / or the heat transfer speed between the temperature compensation device 3 and the first sensor 1 is faster than the heat transfer speed between the first sensor 1 and the heat source 4, which can improve the sensitivity of the temperature compensation device 3 to the temperature compensation of the first sensor 1.

[0103] As an optional implementation, Fig.11 As shown, the height of the temperature compensation device 3 along the second direction Z is consistent with the height of the first sensor 1 along the second direction Z, and the second direction Z is a direction perpendicular to the plane where the substrate 5 is located.

[0104] In the present embodiment, since the temperature compensation device 3 and the first sensor 1 are respectively arranged on the substrate 5, and the height of the temperature compensation device 3 along the second direction Z is consistent with the height of the first sensor 1 along the second direction Z, the surface of the temperature compensation device 3 facing away from the substrate 5 can be made flush with the surface of the first sensor 1 facing away from the substrate 5. In this way, the space occupied by the temperature compensation device 3 in the second direction Z can be reduced, thereby reducing the size of the temperature regulation module along the second direction Z.

[0105] For example: when the temperature adjustment module is applied to a mobile phone, the substrate 5 can be a circuit board inside the mobile phone, and the second direction Z is the thickness direction of the mobile phone. At this time, by making the surface of the temperature compensation device 3 facing away from the substrate 5 flush with the surface of the first sensor 1 facing away from the substrate 5, the space occupied by the temperature adjustment module in the thickness direction of the mobile phone can be reduced.

[0106] As an optional implementation, when the temperature compensation device 3 is in a closed state, the target temperature curve is related to the temperature change rate of the first sensor 1 .

[0107] In this embodiment, the target temperature curve can be determined according to the temperature change law of the first sensor 1 when the temperature compensation device 3 is in the off state, so that the target temperature curve conforms to the temperature change law of the first sensor 1. In this way, when the temperature compensation device 3 is started, the temperature compensation device 3 only needs to fine-tune the temperature of the first sensor 1 to make the temperature change rate of the first sensor 1 consistent with the target temperature curve, thereby reducing the power consumption of the temperature compensation device 3.

[0108] As an optional implementation, Fig. 9 or Fig.10 As shown, the temperature adjustment module further includes: a second temperature detection device 6;

[0109] The second temperature detection device 6 is arranged corresponding to the heat source 4 and is used to detect the temperature of the heat source 4;

[0110] The second temperature detection device 6 is electrically connected to the temperature compensation device 3;

[0111] Among them, the temperature compensation amount and compensation time of the temperature compensation device 3 for the first sensor 1 are related to the first temperature and the second temperature, the first temperature is the temperature detected by the first temperature detection device 2, and the second temperature is the temperature detected by the second temperature detection device 6.

[0112] In some embodiments, the temperature compensation amount of the temperature compensation device 3 for the first sensor 1 is related to at least one of the first temperature and the second temperature. For example, the temperature compensation amount is determined based on the first temperature, or the temperature compensation amount is determined based on the second temperature, or the temperature compensation amount is determined based on the intermediate value or weighted sum of the first temperature and the second temperature, so that the temperature change rate of the first sensor 1 after compensation based on the temperature compensation amount meets the target temperature curve.

[0113] It should be noted that the target temperature curve includes temperatures at multiple time points, and the temperatures at adjacent time points may be the same or different. Based on this rule, the temperature change rate may be determined based on the temperatures at at least two consecutive time points. The temperature change rate of the first sensor 1 may be the temperature change ratio of the first sensor 1 at at least two consecutive sampling time points. Based on this principle, in the process of determining the temperature compensation amount for the first sensor 1, the temperature change rate at the next time point on the target temperature curve located at the current time point may be obtained, as well as the current first temperature of the first sensor 1, and the temperature change rate may be multiplied by the first temperature to obtain the temperature compensation amount that the temperature compensation device 3 needs to perform on the first sensor 1.

[0114] In some embodiments, the compensation time of the temperature compensation device 3 for the first sensor 1 is related to the second temperature. For example, based on the certain time delay of heat conduction, the first sensor 1 can be temperature compensated in advance according to the second temperature when the second temperature of the heat source 4 is detected.

[0115] For another example: when it is detected that the second temperature of the heat source 4 is lower than the third temperature, the heating value of the temperature compensation device 3 can be increased in advance according to the difference between the second temperature and the third temperature, wherein the third temperature is determined according to the target temperature curve, which is the temperature required by the heat source 4 when the heat transferred by the heat source 4 to the first sensor 1 can make the temperature change rate of the first sensor 1 consistent with the target temperature curve.

[0116] For another example: when it is detected that the second temperature of the heat source 4 is higher than the third temperature, the heating value of the temperature compensation device 3 can be reduced in advance according to the difference between the second temperature and the third temperature, wherein the third temperature is determined according to the target temperature curve, which is the temperature required by the heat source 4 when the heat transferred by the heat source 4 to the first sensor 1 can make the temperature change rate of the first sensor 1 consistent with the target temperature curve.

[0117] In this embodiment, the second temperature of the heat source 4 can be detected by the second temperature detection device 6, and the second temperature is used as the basis for determining the temperature compensation amount and temperature compensation time of the temperature compensation device 3, which can improve the accuracy of temperature compensation performed by the temperature compensation device 3 and reduce the time delay of temperature compensation performed by the temperature compensation device 3.

[0118] As an optional implementation, the temperature adjustment module further includes an information processing device (not shown);

[0119] The information processing device is electrically connected to the first sensor 1;

[0120] The information processing device is used to obtain the detection result of the first sensor 1, determine the temperature hysteresis curve of the first sensor 1 according to the target temperature curve, and compensate for the offset error caused by the temperature change of the first sensor 1 according to the temperature hysteresis curve.

[0121] In some embodiments, the information processing device may be any device or component capable of performing information processing and calculation, such as a central processing unit (CPU).

[0122] In this embodiment, an information processing device may be provided in the temperature adjustment module, so as to compensate for the offset error of the first sensor 1 through the information processing device.

[0123] Of course, in other embodiments, an information processing device located outside the temperature adjustment module may be used to compensate for the offset error of the first sensor 1. For example, when a temperature adjustment module is installed in an electronic device, the CPU in the electronic device may be electrically connected to the first sensor 1, and the CPU may execute an information processing process of obtaining the detection result of the first sensor 1, determining the temperature hysteresis curve of the first sensor 1 according to the target temperature curve, and compensating for the offset error caused by the temperature change of the first sensor 1 according to the temperature hysteresis curve.

[0124] An embodiment of the present application also provides an electronic device, which includes any temperature adjustment module provided in the aforementioned embodiments of the present application.

[0125] In some embodiments, the electronic device may be a terminal or other device other than a terminal. Exemplarily, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a mobile Internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc. It may also be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., and the embodiments of the present application are not specifically limited.

[0126] In an embodiment of the present application, by installing any one of the temperature control modules provided in the aforementioned embodiments of the present application in an electronic device, the temperature control module can be used to compensate the temperature change rate of the first sensor to be consistent with the target temperature curve. In this way, the calculation process of software compensation for the offset characteristics of the first sensor can be simplified. Compared with the method of insulating and constant temperature designing the sensor in the related art, the temperature control module of the embodiment of the present application has the advantages of low power consumption and small size.

[0127] An embodiment of the present application further provides an error compensation method, and the execution subject of the error compensation method can be the electronic device provided by the aforementioned embodiment of the present application, or can be the temperature adjustment module provided by the aforementioned embodiment of the present application.

[0128] like Fig.12 As shown, an error compensation method provided by an embodiment of the present application may include the following steps:

[0129] Step 1201: Obtain a target temperature curve.

[0130] Step 1202: Control a temperature compensation device to perform temperature compensation on the first sensor according to the temperature of the first sensor detected by a first temperature detection device, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve.

[0131] Step 1203: Obtain the temperature offset error of the first sensor at each temperature point on the target temperature curve.

[0132] Step 1204: determine a temperature hysteresis curve according to the temperature offset error of the first sensor at each temperature point on the target temperature curve.

[0133] Step 1205: Perform error fitting compensation on the detection result of the first sensor according to the temperature hysteresis curve.

[0134] It should be noted that the target temperature curve, the first temperature detection device, the temperature compensation device, the first sensor, and the temperature hysteresis curve in the embodiment of the present application have the same meaning as the target temperature curve, the first temperature detection device, the temperature compensation device, the first sensor, and the temperature hysteresis curve in the aforementioned temperature control module embodiment of the present application, and will not be repeated here.

[0135] In some implementations, the temperature offset error of the first sensor at each temperature point on the target temperature curve may be obtained by detecting the offset error of the first sensor at the time corresponding to each temperature point on the target temperature curve.

[0136] It should be noted that the process of performing error fitting compensation on the detection result of the first sensor according to the temperature hysteresis curve in step 1205 is the same as the process of performing software compensation on the offset characteristics of the MEMS gyroscope at various temperature points according to the temperature hysteresis curve in the related art. The difference is that, in the related art, due to the various temperature changes of the MEMS gyroscope, it is necessary to determine multiple temperature hysteresis curves, and based on each temperature hysteresis curve, perform software compensation on the offset characteristics of each temperature point on the corresponding temperature curve. In order to meet the computing requirements of the process, it is necessary to train a neural network model and perform a large amount of data collection and data storage. In the embodiment of the present application, the temperature change of the first sensor conforms to the same law, so that only one temperature hysteresis curve needs to be determined, and the temperature hysteresis curve needs to be used to perform software compensation on the offset characteristics of each temperature point on the temperature curve of the first sensor.

[0137] Therefore, the embodiments of the present application can greatly reduce the amount of data collection, calculation, and storage space occupied for software compensation of the offset characteristics of each temperature point on the temperature curve of the first sensor.

[0138] As an optional implementation manner, obtaining the target temperature curve includes:

[0139] When the temperature compensation device is in an inactive state, detecting a temperature curve of the first sensor by the first temperature detection device;

[0140] The target temperature curve is determined according to the temperature curve of the first sensor.

[0141] In some implementations, the temperature curve of the first sensor detected by the first temperature detection device may be directly used as the target temperature curve.

[0142] In other implementations, the temperature curve of the first sensor detected by the first temperature detection device may be processed in a certain manner to obtain a target temperature curve.

[0143] For example: at least one of the following processes is performed: smoothing the temperature curve of the first sensor detected by the first temperature detection device, performing peak shaving and valley filling processing, replacing the temperature on the curve segment on the temperature curve of the first sensor detected by the first temperature detection device that satisfies the temperature change rate less than a certain threshold with the same temperature, etc., to obtain the target temperature curve.

[0144] In this embodiment, the target temperature curve is determined based on the temperature curve of the first sensor detected by the first temperature detection device. The target temperature curve can be made closer to the temperature change law of the first sensor before the temperature compensation device is activated. As a result, the temperature compensation device only needs to fine-tune the temperature of the first sensor to make the temperature change rate of the first sensor conform to the target temperature curve, thereby reducing the power consumption of the temperature compensation device.

[0145] In other embodiments, application scenarios can be set, such as dividing application scenarios according to seasons, or determining application scenarios according to the operating scenarios of electronic devices equipped with the temperature adjustment module, such as setting corresponding application scenarios for operating scenarios such as games and telephones. Based on different application scenarios, the heating efficiency of the heat source and the changing law of the ambient temperature are different, and each application scenario can be associated with its own standard temperature curve, so that the standard temperature curve and the temperature change law of the first sensor 1 in the application scenario associated with it are roughly the same. In this way, when the temperature adjustment module is working, the actual application scenario can be detected, and the standard temperature curve associated with the actual application scenario can be determined as the target temperature curve.

[0146] As an optional implementation, controlling a temperature compensation device to perform temperature compensation on the first sensor according to the temperature of the first sensor detected by the first temperature detection device, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve, includes:

[0147] determining a first temperature compensation amount for temperature compensation of the first sensor according to a first temperature of the first sensor detected by the first temperature detection device and a temperature change rate corresponding to the target temperature curve;

[0148] Determining a second temperature compensation amount and a compensation time for temperature compensation of the first sensor according to a second temperature of the heat source detected by a second temperature detection device;

[0149] determining a target temperature compensation amount according to the first temperature compensation amount and the second temperature compensation amount;

[0150] The temperature compensation device is controlled to start at the compensation time, and temperature compensation is performed on the first sensor according to the target temperature compensation amount, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve.

[0151] In some embodiments, determining a first temperature compensation amount for temperature compensation of the first sensor according to the first temperature of the first sensor detected by the first temperature detection device and the temperature change rate corresponding to the target temperature curve may include:

[0152] The difference between the first temperature and the fourth temperature is used as the first temperature compensation amount that the temperature compensation device 3 needs to perform temperature compensation on the first sensor 1, wherein the fourth temperature is determined according to the target temperature curve and is the temperature of the first sensor 1 under the condition that the temperature change rate of the first sensor 1 is consistent with the target temperature curve. For example: if the first temperature is lower than the fourth temperature, it can be determined that the first temperature compensation amount is greater than 0; if the first temperature is higher than the fourth temperature, it can be determined that the first temperature compensation amount is less than 0.

[0153] In some embodiments, determining a second temperature compensation amount and a compensation time for temperature compensation of the first sensor according to a second temperature of the heat source detected by a second temperature detection device may include:

[0154] According to the difference between the second temperature and the third temperature, the second temperature compensation amount that the heat source 4 will transfer to the first sensor 1 is determined, wherein the third temperature is determined according to the target temperature curve, and is the temperature required by the heat source 4 when the heat transferred by the heat source 4 to the first sensor 1 can make the temperature change rate of the first sensor 1 consistent with the target temperature curve. For example: if the second temperature is higher than the third temperature, it means that the heat source 4 will transfer too much heat to the first sensor 1, and the heat transferred by the temperature compensation device 3 to the first sensor 1 needs to be reduced; if the second temperature is lower than the third temperature, it means that the heat source 4 will transfer too little heat to the first sensor 1, and the heat transferred by the temperature compensation device 3 to the first sensor 1 needs to be increased.

[0155] In some embodiments, the second temperature compensation amount may be negatively correlated with the value of DE, where D represents the second temperature and E represents the third temperature.

[0156] At this time, the target temperature compensation amount is determined according to the first temperature compensation amount and the second temperature compensation amount, which can be obtained by subtracting the second temperature compensation amount from the first temperature compensation amount, or by multiplying the first temperature compensation amount by the first coefficient to obtain the first value; multiplying the second temperature compensation amount by the second coefficient to obtain the second value; and subtracting the second value from the first value to obtain the target temperature compensation amount. The first coefficient and the second coefficient can be constants greater than 0, and the first coefficient and the second coefficient can be determined according to the proportional relationship between the heat conduction efficiency between the heat source 4 and the first sensor 1 and the heat conduction efficiency between the temperature compensation device 3 and the first sensor 1. For example, if the heat conduction efficiency between the heat source 4 and the first sensor 1 is lower than the heat conduction efficiency between the temperature compensation device 3 and the first sensor 1, the value of the second coefficient is smaller.

[0157] Of course, the quantitative relationship between the second temperature compensation amount and the second temperature and the third temperature can also be calculated in other ways. Similarly, the calculation process of determining the target temperature compensation amount based on the first temperature compensation amount and the second temperature compensation amount can also be adjusted accordingly. The calculation process of the first temperature compensation amount, the second temperature compensation amount and the target temperature compensation amount is not specifically limited here.

[0158] The error compensation method provided in the embodiment of the present application can realize the temperature compensation and error compensation functions of the temperature adjustment module provided in the aforementioned embodiment of the present application for the first sensor, and can reduce the amount of calculation and data storage in the process.

[0159] As an optional implementation, the method further includes:

[0160] updating the target temperature curve when the temperature compensation of the first sensor by the temperature compensation device does not satisfy the requirement of adjusting the temperature change rate of the first sensor to be consistent with the target temperature curve;

[0161] According to the temperature of the first sensor detected by the first temperature detection device, the temperature compensation device is controlled to perform temperature compensation on the first sensor, so as to adjust the temperature change rate of the first sensor to be consistent with the updated target temperature curve.

[0162] For example: Fig.13 As shown, the temperature adjustment module or electronic device that implements the error compensation method of the embodiment of the present application can perform the following steps:

[0163] Step 1301: The first sensor starts working;

[0164] Step 1302, collecting temperature change data of the first sensor;

[0165] Step 1303: determine a target temperature curve according to the temperature change data of the first sensor;

[0166] Step 1304, controlling the temperature compensation device to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve;

[0167] Step 1305: Detect and obtain a hysteresis error curve of the first sensor that satisfies a characteristic law;

[0168] Step 1306: Real-time control of the temperature compensation device to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve, while compensating for the offset error of the detection result of the first sensor;

[0169] Step 1307, determining whether the temperature change characteristic of the first sensor deviates from the target temperature curve;

[0170] If the judgment result of step 1307 is "yes", step 1302 is repeated; otherwise, step 1306 is continuously executed until the first sensor finishes working.

[0171] In some embodiments, the temperature change characteristics of the first sensor deviate from the target temperature curve, which may be due to a significant change in the ambient temperature or a significant change in the heating characteristics of the heat source, making it impossible for the temperature compensation device to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve.

[0172] In this embodiment, the target temperature curve is first determined according to the temperature change law of the first sensor when the temperature compensation device is not working, so that the target temperature curve can represent the temperature change law of the first sensor; subsequently, the temperature of the first sensor can be temperature compensated in real time according to the control temperature compensation device, so that the temperature change rate of the first sensor is always consistent with the target temperature curve; moreover, when the ambient temperature changes significantly or the heating characteristics of the heat source change significantly, the target temperature curve can be adjusted in time to make the target temperature curve conform to the actual temperature change characteristics of the first sensor, which can effectively reduce the power consumption of the temperature compensation device in various application scenarios.

[0173] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0174] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, a disk, or an optical disk), and includes a number of instructions for a terminal (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0175] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A temperature adjustment module, characterized in that: include: a first sensor, a first temperature detection device, a temperature compensation device and a heat source; A heat transfer path is provided between the heat source and the first sensor; The first temperature detection device is arranged corresponding to the first sensor and is used to detect the temperature of the first sensor; The temperature compensation device is electrically connected to the first temperature detection device and is used to perform temperature compensation on the first sensor according to the temperature detected by the first temperature detection device, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve; The target temperature curve is used to determine a temperature hysteresis curve of the first sensor, and the temperature hysteresis curve is used to compensate for an offset error caused by a temperature change of the first sensor.

2. The temperature adjustment module according to claim 1, characterized in that: Also included is a substrate; The heat source and the first sensor are arranged on the substrate at intervals; A heat transfer path between the heat source and the first sensor includes a connection portion located on the substrate and between the heat source and the first sensor.

3. The temperature adjustment module according to claim 2, characterized in that: The substrate further includes a hollow portion; Part of the hollow portion is located between the heat source and the first sensor, the heat source and the first sensor are connected through the connecting portion, the heat transfer efficiency between the heat source and the first sensor is related to the width of the connecting portion along the first direction, and / or, the heat transfer efficiency between the heat source and the first sensor is related to the material of the connecting portion, wherein the first direction is a direction within the plane where the substrate is located and perpendicular to a line connecting the heat source to the first sensor.

4. The temperature adjustment module according to claim 3, characterized in that: The width of the connecting portion along the first direction satisfies the following formula: (AB) / 2≤C; Among them, C represents the maximum compensation amount of heat compensation that the temperature compensation device can perform on the first sensor, A represents the maximum value of the heat transferred by the heat source to the first sensor through the connecting part per unit time; B represents the minimum value of the heat transferred by the heat source to the first sensor through the connecting part per unit time.

5. The temperature adjustment module according to any one of claims 2 to 4, characterized in that: The temperature compensation device is disposed on the substrate and is arranged around a first side surface of the first sensor, wherein the first side surface is a side surface of the first sensor that avoids the heat propagation path.

6. The temperature adjustment module according to claim 5, characterized in that: The height of the temperature compensation device along the second direction is consistent with the height of the first sensor along the second direction, and the second direction is a direction perpendicular to the plane where the substrate is located.

7. The temperature adjustment module according to any one of claims 1 to 4, characterized in that: When the temperature compensation device is in an off state, the target temperature curve is related to a temperature change rate of the first sensor.

8. The temperature adjustment module according to any one of claims 1 to 4, characterized in that: Also includes: a second temperature detection device; The second temperature detection device is arranged corresponding to the heat source and is used to detect the temperature of the heat source; The second temperature detection device is electrically connected to the temperature compensation device; Among them, the temperature compensation amount and compensation time of the temperature compensation device for the first sensor are related to the first temperature and the second temperature, the first temperature is the temperature detected by the first temperature detection device, and the second temperature is the temperature detected by the second temperature detection device.

9. The temperature adjustment module according to any one of claims 1 to 4, characterized in that: Also includes information processing devices; The information processing device is electrically connected to the first sensor; The information processing device is used to obtain the detection result of the first sensor, determine the temperature hysteresis curve of the first sensor according to the target temperature curve, and compensate for the offset error caused by the temperature change of the first sensor according to the temperature hysteresis curve.

10. An electronic device, characterized in that: It comprises a temperature regulating module as claimed in any one of claims 1 to 9.

11. An error compensation method, characterized in that: Applicable to the temperature regulating module according to any one of claims 1 to 9, or, applied to the electronic device according to claim 10; The method comprises: Obtain target temperature curve; According to the temperature of the first sensor detected by the first temperature detection device, controlling the temperature compensation device to perform temperature compensation on the first sensor, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve; Acquire a temperature offset error of the first sensor at each temperature point on the target temperature curve; determining a temperature hysteresis curve according to a temperature offset error of the first sensor at each temperature point on the target temperature curve; According to the temperature hysteresis curve, error fitting compensation is performed on the detection result of the first sensor.

12. The method according to claim 11, characterized in that The obtaining of the target temperature curve comprises: When the temperature compensation device is in an inactive state, detecting a temperature curve of the first sensor by the first temperature detection device; The target temperature curve is determined according to the temperature curve of the first sensor.

13. The method according to claim 11, characterized in that The controlling the temperature compensation device to perform temperature compensation on the first sensor according to the temperature of the first sensor detected by the first temperature detection device, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve, comprises: determining a first temperature compensation amount for temperature compensation of the first sensor according to a first temperature of the first sensor detected by the first temperature detection device and a temperature change rate corresponding to the target temperature curve; Determining a second temperature compensation amount and a compensation time for temperature compensation of the first sensor according to a second temperature of the heat source detected by a second temperature detection device; determining a target temperature compensation amount according to the first temperature compensation amount and the second temperature compensation amount; The temperature compensation device is controlled to start at the compensation time, and temperature compensation is performed on the first sensor according to the target temperature compensation amount, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve.

14. The method according to any one of claims 11 to 13, characterized in that The method further comprises: updating the target temperature curve when the temperature compensation of the first sensor by the temperature compensation device does not satisfy the requirement of adjusting the temperature change rate of the first sensor to be consistent with the target temperature curve; According to the temperature of the first sensor detected by the first temperature detection device, the temperature compensation device is controlled to perform temperature compensation on the first sensor, so as to adjust the temperature change rate of the first sensor to be consistent with the updated target temperature curve.

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