Bendable anti-static cooling fin for mainboard of lower shell of notebook computer

Abstract

The invention discloses a bendable anti-static cooling fin for a mainboard of a lower shell of a notebook computer, which comprises a supporting and positioning film, a conductive cloth single-sided adhesive tape, a second conductive copper foil double-sided adhesive tape, alloy copper, a first conductive copper foil double-sided adhesive tape and a polyester insulating film, a plurality of pieces of alloy copper and a plurality of pieces of second conductive copper foil double-faced adhesive tape are arranged, each piece of alloy copper is adhered to one piece of second conductive copper foil double-faced adhesive tape, the adjacent pieces of alloy copper are arranged at intervals, and the adjacent pieces of second conductive copper foil double-faced adhesive tape are arranged at intervals. The device is used for the edge of a mainboard of a lower shell of a notebook computer, static electricity generated during operation of the computer can be conducted out in time, heat generated by a key chip during working of the computer can be conducted to a shell in time, the internal heat accumulation temperature is prevented from being too high, and the stability and safety of equipment operation can be improved; the radiating fin product can be bent, so that the radiating fin product can be conveniently and accurately attached to the front surface and the side surface of an attached element; the whole structure is simple, and the total thickness of the product does not exceed 0.31 mm.

Description

Technical Field

[0001] The invention belongs to the technical field of computers, and in particular relates to a bendable antistatic heat sink for a lower shell mainboard of a notebook computer. Background Art

[0002] With the rapid development of the Internet in my country, the application of computers in various fields is becoming more and more extensive. Laptops have become an indispensable electronic product in people's life, work and study because of their lightness, portability and portability. The motherboard of a laptop is the core component of the laptop. It connects and integrates various hardware such as the central processing unit, graphics card, memory, etc., and together maintains the normal operation of the computer.

[0003] There are many electronic components inside a laptop computer, which will generate a lot of heat after running for a period of time. If the heat is not dissipated in time, it will lead to adverse consequences such as decreased computer performance, blue screen, computer crash, shortened computer life, etc.

[0004] There are many electronic components inside a laptop computer, which will generate heat when in operation, thus generating static electricity. In addition, static electricity will be generated when the laptop computer is in operation due to friction with materials such as plastic, fiber, and metal. If the laptop computer is used at the same time as other electronic products, static electricity will also be generated due to electromagnetic interference.

[0005] Therefore, how to timely dissipate the heat generated by the notebook computer when it is running and how to timely conduct away the static electricity generated when the computer is running is of great practical significance. Summary of the invention

[0006] In order to solve the technical problems existing in the prior art, the purpose of the present invention is to provide a bendable antistatic heat sink for a lower shell mainboard of a notebook computer.

[0007] In order to achieve the above purpose and the above technical effect, the technical solution adopted by the present invention is:

[0008] A bendable antistatic heat sink for a lower shell mainboard of a laptop computer comprises a supporting positioning film, a conductive cloth single-sided tape, a second conductive copper foil double-sided tape, an alloy copper, a first conductive copper foil double-sided tape and a polyester insulating film which are sequentially arranged and matched from top to bottom, wherein a pre-folded pressing line portion is arranged on the polyester insulating film, and a plurality of alloy coppers and second conductive copper foil double-sided tapes are respectively arranged, each alloy copper is adhered to a second conductive copper foil double-sided tape, adjacent alloy coppers are arranged at intervals, and adjacent second conductive copper foil double-sided tapes are arranged at intervals.

[0009] Furthermore, the total thickness of the bendable antistatic heat sink for the lower shell mainboard of a notebook computer is not greater than 0.31 mm.

[0010] Furthermore, the model of the polyester insulating film is D250, and the thickness is 0.05 mm.

[0011] Furthermore, the 180-degree peeling force of the first conductive copper foil double-sided adhesive is greater than 0.4 N / mm, and the thickness is 0.02 mm.

[0012] Furthermore, the copper alloy has a model of C7701R, a thickness of 0.1 mm, and a thermal conductivity of 120±20 W / mK.

[0013] Furthermore, the 180-degree peeling force of the second conductive copper foil double-sided adhesive is greater than 0.4 N / mm, and the thickness is 0.02 mm.

[0014] Furthermore, the model of the conductive cloth single-sided tape is SH-93704WB-C2, the vertical impedance is: <0.1Ω, and the thickness is 0.035-0.045mm.

[0015] Furthermore, the model of the supporting positioning film is TR-7501-LLG, and the thickness is 0.07-0.09 mm.

[0016] Furthermore, the supporting positioning film is provided with a plurality of positioning holes.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The invention discloses a bendable antistatic heat sink for a mainboard of a lower shell of a notebook computer. The heat sink is used at the edge of the mainboard of the lower shell of a notebook computer. The first conductive copper foil double-sided adhesive, alloy copper, and the second conductive copper foil double-sided adhesive are provided to improve the electrical and thermal conductivity of the product, which is beneficial to timely conduct the static electricity generated when the computer is running, and is also beneficial to timely conduct the heat generated by a key chip when the computer is working to the magnesium-aluminum alloy case, so as to prevent the internal heat accumulation and excessively high temperature, and can improve the stability and safety of equipment operation; the support positioning film is provided to increase the product shelf life and provide support for the product, and a plurality of positioning holes are provided to improve the accuracy of mounting, and improve the production efficiency and yield rate; a plurality of alloy coppers are placed at intervals by using the second conductive copper foil double-sided adhesive, and a pre-folding pressure line is provided on a polyester insulating film, so that the product can be bent when used to achieve more accurate fitting with the front and side surfaces of the component to be mounted; the overall structure is simple, and the total thickness of the product does not exceed 0.31 mm, which conforms to the current lightweight development trend of the industry and is suitable for industrial promotion and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention. DETAILED DESCRIPTION

[0020] The present invention is described in detail below so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0021] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or critical elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0022] like Figure 1 As shown, a bendable antistatic heat sink for a lower shell motherboard of a laptop computer comprises a matching polyester insulating film 1, a first conductive copper foil double-sided adhesive tape 2, an alloy copper 3, a second conductive copper foil double-sided adhesive tape 4, a conductive cloth single-sided adhesive tape 5 and a supporting positioning film 6, wherein a pre-folded pressing line portion 7 is provided on the polyester insulating film 1, the supporting positioning film 6 is located at the top, a conductive cloth single-sided adhesive tape 5 is provided on the lower surface of the supporting positioning film 6, a second conductive copper foil double-sided adhesive tape 4 is provided on the lower surface of the conductive cloth single-sided adhesive tape 5, a second conductive copper foil double-sided adhesive tape 4 is provided on the lower surface of the second conductive copper foil double-sided adhesive tape 4, a copper alloy 3 is provided on the lower surface of the copper alloy 3, a first conductive copper foil double-sided adhesive tape 2 is provided on the lower surface of the copper alloy 3, and a A polyester insulating film 1 is provided on the lower surface of a conductive copper foil double-sided adhesive tape 2, and a plurality of alloy coppers 3 and second conductive copper foil double-sided adhesive tapes 4 are respectively provided, each alloy copper 3 is adhered to a second conductive copper foil double-sided adhesive tape 4, adjacent alloy coppers 3 are arranged at intervals, and adjacent second conductive copper foil double-sided adhesive tapes 4 are arranged at intervals. The setting position of the pre-folding pressing line portion 7 is adapted to the alloy copper 3 and the second conductive copper foil double-sided adhesive tape 4. By providing the pre-folding pressing line portion 7 and cooperating with the plurality of alloy coppers 3 and second conductive copper foil double-sided adhesive tapes 4 arranged at intervals, the product can be bent so that it can be more accurately bonded to the front and side surfaces of the attached component.

[0023] The polyester insulating film 1 is of model D250, has excellent shielding and insulating properties, and has a thickness of 0.05 mm.

[0024] The model of the first conductive copper foil double-sided adhesive tape 2 and the second conductive copper foil double-sided adhesive tape 4 is N7702, the 180-degree peeling force is >0.4 N / mm, and the thickness is 0.02 mm.

[0025] Alloy copper 3 is white copper, model C7701R, thickness 0.1mm, thermal conductivity: 120±20W / mK, electrical conductivity: ≧97% IACS, tensile strength: 500-600N / mm 2 , hardness: 120-180HV.

[0026] The model of the conductive cloth single-sided tape 5 is SH-93704WB-C2, which is a matte black conductive cloth single-sided tape, with a vertical impedance of <0.1Ω and a thickness of 0.035-0.045mm.

[0027] The support positioning film 6 is a silicone protective film. The model of the support positioning film 6 is TR-7501-LLG, and the thickness is 0.07-0.09 mm. By designing the support positioning film 6, on the one hand, the conductive cloth single-sided tape 5 can be prevented from being oxidized by contact with air, thereby increasing the shelf life of the product, and on the other hand, it can provide support for the product. A plurality of positioning holes 8 are provided on the support positioning film 6, which is conducive to improving the accuracy of mounting, and improving production efficiency and yield.

[0028] In the present invention, the first conductive copper foil double-sided adhesive tape 2, the alloy copper 3, the second conductive copper foil double-sided adhesive tape 4, and the conductive cloth single-sided adhesive tape 5 all have excellent conductive properties, and can timely conduct away the static electricity generated during the operation of the equipment, thereby improving the stability and safety of the equipment operation. At the same time, the first conductive copper foil double-sided adhesive tape 2, the alloy copper 3, and the second conductive copper foil double-sided adhesive tape 4 all have excellent thermal conductivity, and can timely conduct away the heat generated during the operation of the high-power chip, thereby preventing the internal heat from accumulating and causing the temperature to be too high, thereby improving the stability and safety of the equipment operation.

[0029] The bendable antistatic heat sink for the lower shell motherboard of a laptop computer disclosed in the present invention is used on the edge of the lower shell motherboard of the laptop computer, which not only timely conducts the static electricity generated when the device is running, but also timely conducts the heat generated by the key chip when the device is working to the magnesium-aluminum alloy case, preventing the internal heat accumulation and excessive temperature, and can improve the stability and safety of the device operation. The bendable antistatic heat sink for the lower shell motherboard of a laptop computer disclosed in the present invention selects a variety of ultra-thin materials, so that the total thickness of the product does not exceed 0.31mm, which is in line with the current industry lightweight development trend.

[0030] Example 1

[0031] like Figure 1As shown, a bendable antistatic heat sink for a lower shell motherboard of a laptop computer comprises a matching polyester insulating film 1, a first conductive copper foil double-sided adhesive tape 2, an alloy copper 3, a second conductive copper foil double-sided adhesive tape 4, a conductive cloth single-sided adhesive tape 5 and a supporting positioning film 6, wherein a pre-folded pressing line portion 7 is provided on the polyester insulating film 1, the supporting positioning film 6 is located at the top, a conductive cloth single-sided adhesive tape 5 is provided on the lower surface of the supporting positioning film 6, a second conductive copper foil double-sided adhesive tape 4 is provided on the lower surface of the conductive cloth single-sided adhesive tape 5, an alloy copper 3 is provided on the lower surface of the second conductive copper foil double-sided adhesive tape 4, and the alloy copper 3 is provided on the lower surface of the alloy copper 3. A first conductive copper foil double-sided adhesive tape 2 is arranged on the surface, a polyester insulating film 1 is arranged on the lower surface of the first conductive copper foil double-sided adhesive tape 2, two alloy coppers 3 and two second conductive copper foil double-sided adhesive tapes 4 are respectively arranged, each alloy copper 3 is adhered to a second conductive copper foil double-sided adhesive tape 4, adjacent alloy coppers 3 are arranged at intervals, and adjacent second conductive copper foil double-sided adhesive tapes 4 are arranged at intervals. By arranging a pre-folded pressing line portion 7 and cooperating with the alloy copper 3 and the second conductive copper foil double-sided adhesive tape 4 arranged at intervals, the product can be bent so that it can be more accurately bonded to the front and side surfaces of the attached component.

[0032] The polyester insulating film 1 is of model D250, black in color, has excellent shielding and insulating properties, and has a thickness of 0.05 mm.

[0033] The model of the first conductive copper foil double-sided adhesive tape 2 and the second conductive copper foil double-sided adhesive tape 4 is N7702, 180 degree peeling force: >0.4N / mm, thickness 0.02mm, adhesive surface resistance: 0.1Ω / inch, adhesive resistance: 0.03Ω / inch 2 .

[0034] Alloy copper 3 is white copper, model C7701R, thickness 0.1mm, thermal conductivity: 120W / mK, electrical conductivity: ≧97% IACS, tensile strength: 549.69N / mm 2 , hardness: 156HV.

[0035] The model of the conductive cloth single-sided tape 5 is SH-93704WB-C2, which is a matte black conductive cloth single-sided tape with a vertical impedance of <0.1Ω, an adhesion of 0.49N / mm, and a thickness of 0.035mm.

[0036] The support positioning film 6 is a silicone protective film. The model of the support positioning film 6 is TR-7501-LLG, blue, and 0.075 mm thick. By designing the support positioning film 6, on the one hand, the conductive cloth single-sided tape 5 can be prevented from being oxidized by contact with air, thereby increasing the shelf life of the product, and on the other hand, it can provide support for the product. The four corners of the support positioning film 6 are symmetrically provided with positioning holes 8, and there are four positioning holes 8, which are conducive to improving the accuracy of mounting, and improving production efficiency and yield.

[0037] In this embodiment, the first conductive copper foil double-sided adhesive tape 2, the alloy copper 3, the second conductive copper foil double-sided adhesive tape 4, and the conductive cloth single-sided adhesive tape 5 all have excellent conductive properties, and can promptly conduct away the static electricity generated during the operation of the device, thereby improving the stability and safety of the operation of the device. At the same time, the first conductive copper foil double-sided adhesive tape 2, the alloy copper 3, and the second conductive copper foil double-sided adhesive tape 4 all have excellent thermal conductivity, and can promptly conduct away the heat generated during the operation of the high-power chip, thereby preventing the internal heat from accumulating and the temperature from being too high, thereby improving the stability and safety of the operation of the device.

[0038] The bendable antistatic heat sink for the lower shell motherboard of a laptop computer of this embodiment is used on the edge of the lower shell motherboard of the laptop computer, which not only timely conducts the static electricity generated when the device is running, but also timely conducts the heat generated by the key chip when the device is working to the magnesium-aluminum alloy case, preventing the internal heat accumulation and excessive temperature, and can improve the stability and safety of the device operation. The bendable antistatic heat sink for the lower shell motherboard of a laptop computer disclosed by the present invention selects a variety of ultra-thin materials, so that the total thickness of the product is 0.28mm, which is in line with the current industry trend of lightweight development.

[0039] Example 2

[0040] like Figure 1 As shown, a bendable antistatic heat sink for a lower shell motherboard of a laptop computer comprises a matching polyester insulating film 1, a first conductive copper foil double-sided adhesive tape 2, an alloy copper 3, a second conductive copper foil double-sided adhesive tape 4, a conductive cloth single-sided adhesive tape 5 and a supporting positioning film 6, wherein a pre-folded pressing line portion 7 is provided on the polyester insulating film 1, the supporting positioning film 6 is located at the top, a conductive cloth single-sided adhesive tape 5 is provided on the lower surface of the supporting positioning film 6, a second conductive copper foil double-sided adhesive tape 4 is provided on the lower surface of the conductive cloth single-sided adhesive tape 5, an alloy copper 3 is provided on the lower surface of the second conductive copper foil double-sided adhesive tape 4, and the alloy copper 3 is provided on the lower surface of the alloy copper 3. A first conductive copper foil double-sided adhesive tape 2 is arranged on the surface, a polyester insulating film 1 is arranged on the lower surface of the first conductive copper foil double-sided adhesive tape 2, two alloy coppers 3 and two second conductive copper foil double-sided adhesive tapes 4 are respectively arranged, each alloy copper 3 is adhered to a second conductive copper foil double-sided adhesive tape 4, adjacent alloy coppers 3 are arranged at intervals, and adjacent second conductive copper foil double-sided adhesive tapes 4 are arranged at intervals. By arranging a pre-folded pressing line portion 7 and cooperating with the alloy copper 3 and the second conductive copper foil double-sided adhesive tape 4 arranged at intervals, the product can be bent so that it can be more accurately bonded to the front and side surfaces of the attached component.

[0041] The polyester insulating film 1 is of model D250, has excellent shielding and insulating properties, and has a thickness of 0.05 mm.

[0042] The model of the first conductive copper foil double-sided adhesive tape 2 and the second conductive copper foil double-sided adhesive tape 4 is N7702, the 180-degree peeling force is >0.4 N / mm, and the thickness is 0.02 mm.

[0043] Alloy copper 3 is white copper, model C7701R, thickness 0.1mm, thermal conductivity: 140W / mK, electrical conductivity: ≧97% IACS, tensile strength: 549.69N / mm 2 , hardness: 156HV.

[0044] The model of the conductive cloth single-sided tape 5 is SH-93704WB-C2, which is a matte black conductive cloth single-sided tape, with a vertical impedance of <0.1Ω and a thickness of 0.045mm.

[0045] The support positioning film 6 is a silicone protective film. The model of the support positioning film 6 is TR-7501-LLG, and the thickness is 0.08 mm. By designing the support positioning film 6, on the one hand, the conductive cloth single-sided tape 5 can be prevented from being oxidized by contact with air, thereby increasing the shelf life of the product, and on the other hand, it can provide support for the product. The four corners of the support positioning film 6 are symmetrically provided with positioning holes 8, and there are four positioning holes 8, which are conducive to improving the accuracy of mounting, and improving production efficiency and yield.

[0046] In this embodiment, the first conductive copper foil double-sided adhesive tape 2, the alloy copper 3, the second conductive copper foil double-sided adhesive tape 4, and the conductive cloth single-sided adhesive tape 5 all have excellent conductive properties, and can promptly conduct away the static electricity generated during the operation of the device, thereby improving the stability and safety of the operation of the device. At the same time, the first conductive copper foil double-sided adhesive tape 2, the alloy copper 3, and the second conductive copper foil double-sided adhesive tape 4 all have excellent thermal conductivity, and can promptly conduct away the heat generated during the operation of the high-power chip, thereby preventing the internal heat from accumulating and the temperature from being too high, thereby improving the stability and safety of the operation of the device.

[0047] The bendable antistatic heat sink for the lower shell motherboard of a laptop computer disclosed in the present invention is used on the edge of the lower shell motherboard of the laptop computer, which not only timely conducts the static electricity generated when the device is running, but also timely conducts the heat generated by the key chip when the device is working to the magnesium-aluminum alloy case, preventing the internal heat accumulation and excessive temperature, and can improve the stability and safety of the device operation. The bendable antistatic heat sink for the lower shell motherboard of a laptop computer disclosed in the present invention selects a variety of ultra-thin materials, so that the total thickness of the product is 0.295mm, which is in line with the current industry trend of lightweight development.

[0048] The rest is the same as in Example 1.

[0049] Parts or structures not specifically described in the present invention may adopt existing technologies or existing products and will not be described in detail here.

[0050] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A bendable antistatic heat sink for the lower shell motherboard of a notebook computer, characterized in that: It includes a supporting positioning film, a conductive cloth single-sided tape, a second conductive copper foil double-sided tape, alloy copper, a first conductive copper foil double-sided tape and a polyester insulating film, which are arranged in sequence from top to bottom and matched with each other. The polyester insulating film is provided with a pre-folded pressure line portion. A plurality of alloy coppers and second conductive copper foil double-sided tapes are respectively provided. Each alloy copper is adhered to a second conductive copper foil double-sided tape. Adjacent alloy coppers are arranged at intervals, and adjacent second conductive copper foil double-sided tapes are arranged at intervals.

2. The bendable antistatic heat sink for the lower shell motherboard of a notebook computer according to claim 1, characterized in that: The total thickness of the bendable antistatic heat sink used for the lower shell mainboard of a notebook computer is no more than 0.31 mm.

3. The bendable antistatic heat sink for the lower shell motherboard of a notebook computer according to claim 1, characterized in that: The polyester insulating film has a model of D250 and a thickness of 0.05 mm.

4. The bendable antistatic heat sink for the lower shell motherboard of a notebook computer according to claim 1, characterized in that: The 180-degree peeling force of the first conductive copper foil double-sided adhesive is greater than 0.4 N / mm, and the thickness is 0.02 mm.

5. The bendable antistatic heat sink for the lower shell motherboard of a notebook computer according to claim 1, characterized in that: The model of the alloy copper is C7701R, the thickness is 0.1 mm, and the thermal conductivity is 120±20 W / mK.

6. The bendable antistatic heat sink for the lower shell motherboard of a notebook computer according to claim 1, characterized in that: The 180-degree peeling force of the second conductive copper foil double-sided adhesive is greater than 0.4 N / mm, and the thickness is 0.02 mm.

7. The bendable antistatic heat sink for the lower shell motherboard of a notebook computer according to claim 1, characterized in that: The model of the conductive cloth single-sided tape is SH-93704WB-C2, vertical impedance: <0.1Ω, thickness is 0.035-0.045mm.

8. The bendable antistatic heat sink for the lower shell motherboard of a notebook computer according to claim 1, characterized in that: The model of the supporting positioning film is TR-7501-LLG, and the thickness is 0.07-0.09 mm.

9. The bendable antistatic heat sink for the lower shell motherboard of a notebook computer according to claim 1, characterized in that: The supporting positioning film is provided with a plurality of positioning holes.

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