Solder wire soldering flux for soft soldering of nickel part and preparation method of solder wire soldering flux

Abstract

The invention relates to a soldering tin wire soldering flux for soft soldering of nickel parts and a preparation method of the soldering tin wire soldering flux. The soldering flux is prepared from the following raw materials: 2.0 to 8.0 percent of compound binary organic carboxylic acid, 1.0 to 10.0 percent of compound ionic state halogen activating agent, 1.0 to 5.0 percent of compound covalent state halogen activating agent, 0.3 to 3.0 percent of compound surfactant, 0.5 to 3.0 percent of metal salt, 0.1 to 1.0 percent of antioxidant, 1.0 to 5.0 percent of organic alcohol amine, 0.01 to 1.0 percent of odor masking agent, 2.0 to 6.0 percent of organic solvent and the balance of solvent. And the balance of compound modified rosin resin. The soldering tin wire soldering flux for soft soldering of the nickel part is high in activity, high in tinning speed, easy to wet, bright, full and clean in welding spot, high in residue dryness, excellent in splashing and comfortable and pleasant in welding experience in the soft soldering process of the nickel part, and high-quality stable industrial production can be achieved. The preparation method of the soldering flux is fine and standard, active functional groups of all the auxiliaries can be protected from being damaged or the damage degree is reduced to the minimum in the high-temperature preparation process to the maximum extent, and therefore high quality and excellent stability of soldering flux preparation are achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic soft soldering materials, and in particular relates to a solder wire flux for nickel component soft soldering and a preparation method thereof. Background Art

[0002] In recent years, the market demand for soldering nickel electronic components or nickel material products with solder wire has become increasingly strong. Nickel has the advantages of good conductivity, corrosion resistance, wear resistance and heat resistance, which can extend the service life of electronic components. For example, nickel plating is often used in some switch contacts, plug-ins and other parts to improve their wear resistance and corrosion resistance. Nickel can also be used as one of the components of the base material to improve the stability and reliability of the device. Therefore, nickel is widely used in the field of electronic appliances, and the metal materials of nickel parts used in this field mainly include pure nickel metal, nickel alloy, copper-plated nickel and other nickel plating layers.

[0003] Although conventional solder wires on the market have excellent tinning properties for tin-plated welds and copper parts, they either cannot tin at all or have poor tinning properties for nickel parts, resulting in various welding failure anomalies such as incomplete solder joints, easy detachment, dewetting, and sharp tin. It is difficult to meet the ideal welding technical requirements. The key reasons are analyzed. First, from the perspective of the welding base material, the oxide layer on the surface of nickel parts is more difficult to remove quickly than the oxide layer on the surface of tin-plated welds and copper parts. According to welding experience, the difficulty of removing the oxide layer on the surface of the base metal with the same L1-level active tin wire is ranked as follows: nickel parts > copper parts > tin-plated parts; second, from the perspective of the solder wire, the flux activity of the inner core of these solder wires is insufficient or the activator design in the flux formula is defective. The solder wire does not have enough activity to quickly remove the oxide layer on the surface of the nickel base metal, resulting in abnormal welding failure. Therefore, in order to achieve high-quality soldering of nickel parts with solder wire, the material properties of the nickel parts themselves cannot be changed objectively. We can only find ways to change the flux properties of the solder wire core to quickly remove the dense oxide layer passivated on the surface of the nickel base metal to achieve ideal welding quality.

[0004] Domestic researchers have never stopped their persistent exploration and pursuit of the research on solder wire flux for nickel parts soft soldering. In 2003, China's invention patent publication number CN1449886A disclosed a stainless steel flux that can also be used for soldering on nickel-plated surfaces. It uses 20%-30% phosphoric acid, 10%-15% zinc chloride, and 10%-15% ammonium chloride as an activator system, and the carrier is 40%-60% water. This type of flux has very serious residual corrosion after welding. In addition, even if the flux can be canned into the tin wire core, it cannot be solidified and further processed. Therefore, it is not suitable for preparing solder wire with a solid flux as the core. In 2008, China's invention patent publication number CN101204762A disclosed a metal replacement lead-free soldering flux for aluminum and aluminum alloys, which can also be used for lead-free soldering of metal materials such as nickel alloys. It uses 5-50% metal salts that can be reduced by aluminum, 10-50% film removers, 3-40% wetting agents, 3-20% activators, and 1-15% surfactants as an activator system, in addition to 2-20% corrosion inhibitors and the remainder of the carrier. The flux is too corrosive and is in a paste rather than solid form at room temperature. It is not suitable for the production of solder wires with solid flux as the inner core. In 2012, China Invention Patent Publication No. CN102728967A disclosed a flux for nickel-plated alloy soft soldering solder wire core, which uses 0.1%-20% organic acid, 0.1%-10% organic amine, 0.1%-20% metal salt, 0.1%-2.0% activity enhancer as the activator system, and 0.1%-2.0% surfactant, 0.1%-1.0% corrosion inhibitor, 0.1%-1.0% antioxidant as other auxiliary agent system. Although this technology can achieve excellent soft soldering of nickel-plated alloy, the soft soldering performance of pure nickel or nickel alloy substrates is unclear. In addition, there are many high melting point reagents such as cyclohexylamine hydrobromide and hexadecyltrimethylammonium bromide in the formula. According to experience, it is difficult to fully melt or dissolve evenly in a warm bath of 140±5℃. In addition, a large amount of activator and auxiliary ingredients are added, and the smoke and odor generated by welding are irritating. It is also worrying whether the employees who perform on-site welding operations can adapt to it.In 2018, China's invention patent publication number CN109014662A disclosed a flux for multi-metal material soft soldering solder core. The solder wire made of this flux can be used for the welding of various metal materials such as nickel and nickel alloys, stainless steel, aluminum and aluminum alloys. It adopts 20-80% alkyd ionic liquid, 5-20% zinc fluoroborate, 5-30% zinc oxide, 2-20% basic zinc carbonate, 0.1-2% surfactant, and 0.05-0.1% corrosion inhibitor. During the preparation process, the temperature of step S2 is 95-105°C, and the temperature of step S3 is below 40°C. The flux formula is almost entirely activator. Although it has excellent welding tinning activity for nickel parts, there are major risks of severe corrosion and substandard dryness after welding. In addition, the temperature is too low during the preparation process. Whether it can be quickly solidified and formed after being canned into the inner core of the tin rod for further assembly line diameter reduction and deep processing is also a big test.

[0005] In summary, the exploration process of solder wire flux for nickel parts soft soldering has gone through the exploration of liquid-paste-solid state, until it can be solidified and formed into solid flux for solder wire core. From the perspective of formula structure, it has developed from a relatively simple formula structure system to a relatively comprehensive formula structure system. From the perspective of the core technology of the formula, it is mainly developing towards better activity performance, from a relatively single activator system with metal salts as the main body to a relatively comprehensive and complex activator system with metal salts, organic acids, organic amines, activity enhancers, etc., and even almost the entire formula system is composed of activators. From the perspective of application performance, the comprehensive application reliability performance of tin activity, wetting, corrosion inhibition, etc. on nickel parts soft soldering is becoming more and more excellent. However, although the research on solder wire flux for soft soldering of nickel parts has achieved good results, there is still a lot of room for improvement. First, although the overall structural system design of the formula has become more and more comprehensive, it lacks a more refined and industrializable design concept; second, at room temperature, most flux forms are not pure solid, which will fail the residual dryness test of solder wire flux; third, the core technology in the flux formula - the activator system design is not refined enough; fourth, when the preparation method of the flux is put into the actual industrial assembly line production process, whether the quality of the produced solder wire products can be guaranteed to be stable and controllable is also a key consideration; fifth, the flux research technology is almost all pursuing welding activity and welding reliability performance, ignoring the application experience of solder wire. For example, a large amount of activator auxiliary ingredients are added to the formula, the welding produces large smoke, irritating odor, and may cause serious tin explosion, without considering whether on-site employees can adapt and accept it during the welding operation application experience. Summary of the invention

[0006] The present invention comprehensively considers the actual industrialized assembly line production of solder wire flux for nickel parts welding, the demand for excellent solderability and reliability of nickel parts, the humanized demand of market client employees for a pleasant and comfortable experience in on-site welding applications, and in order to solve the deficiencies in the prior art, provides an environmentally friendly solder wire flux for nickel parts soft soldering, which has the characteristics of high activity, fast tinning rate, easy wetting, bright, full and clean solder joints, high residual dryness, excellent spatter, comfortable and pleasant welding experience, and can be put into high-quality and stable industrial production during the nickel parts soft soldering process. The present invention also provides a preparation method of the flux.

[0007] The technical solution adopted by the present invention is as follows:

[0008] A solder wire flux for nickel parts soldering, the raw materials are composed of the following by weight percentage:

[0009] Compound dibasic organic carboxylic acid 2.0-8.0%,

[0010] Compound ionic halogen activator 1.0-10.0%,

[0011] Compound covalent halogen activator 1.0-5.0%,

[0012] Compound surfactant 0.3-3.0%,

[0013] Metal salt 0.5-3.0%,

[0014] Antioxidant 0.1-1.0%,

[0015] Organic alcohol amine 1.0-5.0%,

[0016] Odor masking agent 0.01-1.0%,

[0017] Organic solvent 2.0-6.0%,

[0018] Residue of compounded modified rosin resin;

[0019] The compounded dibasic organic carboxylic acid is a combination of two or more of methylsuccinic acid, succinic anhydride, glutaric acid, glutaric anhydride, adipic acid, suberic acid, sebacic acid, dodecanedioic acid, and tridecanedioic acid;

[0020] The complex ion-state halogenated activator is a combination of two or more of cyclohexylamine hydrobromide, diethylamine hydrobromide, p-tert-butylimidazole hydrobromide, diphenylguanidine hydrobromide, 2-bromoethylamine hydrobromide, isopropylamine hydrobromide, 2-ethylimidazole hydrobromide, n-butylmonoaniline hydrobromide, cyclohexylamine hydrochloride, dimethylamine hydrochloride, ethylenediamine hydrochloride, triethanolamine hydrochloride, and diphenylguanidine hydrochloride;

[0021] The composite covalent halogenated activator is chlorohydrin, dibromobutylene glycol, dibromoethylbenzene, hydrazine bromide, dibromosuccinic acid, , a combination of two or more of 2-chlorosuccinic acid;

[0022] The compound surfactant is a combination of a nonionic surfactant and an ionic surfactant or a combination of a nonionic fluorocarbon surfactant and an ionic surfactant;

[0023] The metal salt is one or a combination of two or more of stannous chloride, stannous oxalate and stannous methanesulfonate;

[0024] The antioxidant is one or a combination of two or more of BASF Ciba antioxidant 1010, 168, 1076, 1098, B215, and antioxidant BHT;

[0025] The organic alcohol amine is one or a combination of two or more of monoethanolamine, diethanolamine, triethanolamine, triisopropanolamine, and diethanol monoisopropanolamine;

[0026] The masking agent is one or a combination of two or more of a fruity masking agent, a floral masking agent, an aromatic masking agent, a herbal masking agent, and a fantasy masking agent;

[0027] The organic solvent is one or a combination of two or more of methanol, tetrahydrofurfuryl alcohol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol ethyl ether, propylene glycol propyl ether, propylene glycol butyl ether, diethylene glycol methyl ether, tripropylene glycol methyl ether, tripropylene glycol butyl ether, dipropylene glycol butyl ether, and N-methylpyrrolidone;

[0028] The modified rosin resin is a combination of two or more of hydrogenated white rosin, refined hydrogenated rosin, Eastman fully hydrogenated rosin AX-E, fully hydrogenated rosin AX-80, acrylic acid modified hydrogenated rosin HM-604, and 3250 rosin.

[0029] Furthermore, the nonionic surfactant is one of oleyl alcohol polyoxyethylene ether, TX-10 phosphate, octylphenol polyoxyethylene ether, NP-10, and OP-10; the nonionic fluorocarbon surfactant is FS-3000 or FS-3100; the ionic surfactant is one of hexadecyltrimethylammonium chloride, octadecyltrimethylammonium chloride, hexadecyltrimethylammonium bromide, and octadecyltrimethylammonium bromide.

[0030] Furthermore, the fruity masking agent is one of 851, 855, 856, 858, and 859; the floral masking agent is one of rose essence, jasmine essence, osmanthus essence, lily of the valley essence, magnolia essence, gardenia essence, lavender essence, violet essence, tuberose essence, acacia essence, and chrysanthemum essence; the aromatic masking agent is one of lemon aromatic essence, mint aromatic essence, sandalwood aromatic essence, tea tree aromatic essence, orange blossom aromatic essence, and lily aromatic essence; the herbal masking agent is one of wormwood flavor, rosemary flavor, lemongrass flavor, eucalyptus flavor, sage flavor, thyme flavor, lemongrass flavor, and basil flavor; the fantasy masking agent is one of dream mist flavor, fantasy rainbow flavor, starry sky flavor, magic forest flavor, and dream island flavor.

[0031] The preparation method of the solder wire flux for nickel part soft soldering of the present invention comprises the following steps:

[0032] (1) A solid dibasic organic carboxylic acid, a portion of a covalent halogen activator, a portion of an ionic halogen activator, a metal salt, and an antioxidant are mixed and packaged in a solid reagent bottle for standby use to obtain a composite solid additive A;

[0033] (2) a portion of the organic solvent is charged into a reaction container, and then a portion of a solid covalent halogenated activator, a portion of a solid ionic halogenated activator, a portion of a liquid covalent halogenated activator, a portion of an ionic halogenated activator, and a composite surfactant are added into the reaction container, and the mixture is stirred at room temperature to fully dissolve and mix the materials, and filtered through a filter to obtain a mixed solution, and the mixed solution is sealed in a liquid reagent bottle for standby use, to obtain a composite mixed solution B;

[0034] (3) The remaining organic solvent is charged into a reaction container, and then the organic alcohol amine, the taste masking agent, the remaining liquid covalent halogenated activator, and the remaining liquid ionic halogenated activator are charged into the reaction container, and the mixture is stirred, dissolved, mixed and diluted at room temperature to obtain a fully dissolved and mixed uniform dilution solution, and the dilution solution is sealed in a liquid reagent bottle for standby use to obtain a composite dilution solution C;

[0035] (4) Add the compounded modified rosin resin into the flux production reactor, heat and stir at a constant temperature until it is completely melted;

[0036] (5) slowly adding the compounded solid additive A prepared in step (1) to the melted compounded modified rosin resin in step (4) while stirring, and continuously heating and stirring at a constant temperature so that the compounded solid additive A is rapidly dispersed into the molten rosin during stirring, thereby obtaining a compound material D;

[0037] (6) slowly adding the composite mixed solution B prepared in step (2) to the composite ingredient D in step (5) while stirring, and continuously heating and stirring at a constant temperature to allow the composite solid additive A and the composite mixed solution B to be completely melted, dissolved and mixed in the molten rosin to obtain a composite ingredient E;

[0038] (7) slowly adding the composite diluted solution C prepared in step (3) into the composite ingredient E in step (6) while stirring, and continuously heating and stirring at a constant temperature until the composite diluted solution C and the composite ingredient E are fully reacted and dissolved and mixed uniformly, thereby obtaining a composite ingredient F;

[0039] (8) Stop heating and stirring, and let the composite material F prepared in the above step (7) stand for 5 to 10 minutes under its own residual heat to allow the water phase and oil phase components in the composite material F to settle and separate under the action of gravity, directly remove the precipitated water phase on the bottom layer, and retain the upper oil phase to obtain the solder wire flux for nickel component soft soldering.

[0040] Furthermore, the solder wire flux for nickel component soft soldering prepared above is canned into the inner core of a leaded or lead-free tin rod through an extruder device, and a solder wire product is prepared by processing.

[0041] Furthermore, the heating temperature of the compounded modified rosin resin in step (4) is 150±10°C; the heating temperature of the compound material D in step (5) is 150±10°C; the heating temperature of the compound material E in step (6) is 150±10°C; and the heating temperature of the compound material F in step (7) is 145±5°C.

[0042] The invention proposes a solder wire flux for soft soldering of nickel parts, which is specially designed for tin wire welding of nickel parts substrates. By optimizing the structural characteristics of the activator in the flux formula and the preparation method of the flux that can be put into industrial production, the activity of the flux required for nickel parts welding and the industrial application experience are enhanced.

[0043] The solder wire flux for nickel part soldering of the present invention has the following advantages:

[0044] (1) The solder wire flux for nickel parts soldering of the present invention has excellent tinning wettability and solderability for nickel parts. The present invention has been demonstrated through practical experience and adopts a comprehensive and finely designed activator system. First, a stannous metal salt with reducing properties is used to undergo an oxidation-reduction reaction with the nickel part oxide layer, so that the dense oxide layer with a "shell" structure on the surface of the nickel part is partially broken. Then, the alcohol amine further undergoes a complex reaction with the nickel part oxide layer with a certain intensity, consumes the nickel part oxide layer and increases the width of the local broken opening. Then, the halide and organic acid invade the surface of the thin nickel part oxide layer and along the cracks of the locally broken oxide layer, and continuously react chemically with the nickel oxide until the reaction is completely consumed. The activator continuously activates the surface of the nickel part melt to keep it as a clean pure metal bath. The tin solder also forms a clean pure tin solder metal bath under the same working principle of the activator. After the two contact, they diffuse with each other to form an IMC layer with a certain uniform thickness, enhance the mechanical properties of the welding point, and complete the welding. Among them, the amount of stannous metal salt should not be too much, otherwise it will produce precipitation during the flux production process due to its reducing properties, affecting the quality and stability of the flux.

[0045] (2) The solder wire flux for nickel parts soldering of the present invention is guided by the actual application needs of the market, comprehensively considers aspects such as industrial production, actual application technical needs of market customers, product quality stability and performance reliability, rationally designs and improves the flux formula structure, and adopts a compound design concept to further improve the actual application performance of the formula. First, using compound rosin as the carrier system can give play to the advantages of different rosins, reduce their defects to a certain extent, achieve complementary advantages and disadvantages, and improve the stability of the comprehensive performance of the flux. Secondly, a compound binary organic carboxylic acid, a compound ionic halogen activator, a compound covalent halogen activator, a metal salt and an organic alcohol amine are used as the activator system to achieve excellent tinning wettability and solderability for nickel parts. On the one hand, the overall activator system is composed of a variety of different types of activators at the same time, ensuring that the flux formula has sufficient strong activity to achieve excellent soft soldering characteristics for nickel parts, and each type of activator has different welding activation characteristics, so it is compatible with excellent soft soldering characteristics for tin-plated parts, copper parts and other material weldments; on the other hand, the same type of activators basically also adopts a compound design to achieve complementary advantages and disadvantages between different activators and bring the activation performance to the best or better. In addition, through the compound design, the proportion of a single activator in the formula can be effectively reduced, and the stability of the comprehensive performance of the flux can be improved. It can not only ensure that the activity of the formula is not reduced, but also avoid a large increase in the proportion of a single activator in the formula to increase the activity intensity, resulting in excessive saturation in the formula and abnormal conditions such as precipitation, precipitation, and stratification. Next, the use of non-ionic and ionic compound surfactants can help remove tiny pollutants and oxides on the surface of the weldment, create conditions for the good combination of solder and weldment, and effectively reduce the surface tension of flux and liquid solder during the welding process, so that the solder can spread better on the surface of the solid weldment, promote the activator to better penetrate into the oxide layer on the surface of the weldment, enhance the removal effect of the activator, improve the welding quality and reliability, etc.; In addition, non-ionic surfactants have good compatibility with other components in the flux, can make the components of the flux evenly dispersed, improve the stability of the flux, and the post-weld residue is not easy to cause adverse effects such as short circuits on electronic components. A small amount of ionic surfactants are added, which have their own halide ions and have the function of activators. Then, antioxidants can prevent or delay the oxidation reaction of metals during the soldering process and the rapid failure of the activity of flux due to oxidation reaction in high temperature environments, thereby improving the quality and reliability of welding. Finally, odor masking agents can effectively cover up other irritating odors. Organic solvents can not only effectively dissolve a variety of solid active ingredients in the flux preparation process, promote the rapid dissolution and melting of each component of the flux in the molten rosin, but some solvents will also evaporate and escape, improving the quality stability and morphological stability of the flux, and can improve the fluidity of the flux during the welding process, creating good conditions for the adhesion of the solder.

[0046] (3) The method for preparing solder wire flux for nickel parts soldering of the present invention mainly consists of four parts: preparation and packaging of solid additives, preparation and packaging of mixed solution additives, preparation and packaging of dilute solution additives, and production and preparation of flux. The production and preparation of flux consists of five steps: smelting of rosin, feeding of solid additives, feeding of mixed solution additives, feeding of dilute solution additives, and static gravity sedimentation oil-water phase separation. The method for preparing solder wire flux of the present invention fully standardizes the operation procedures and even the steps, and has very precise practical operability. Each additive in the formula is finely classified, weighed and packaged according to its physical and chemical properties, and the flux is prepared by scientific feeding, so as to protect the active functional groups of each additive from damage or minimize the damage during the high-temperature preparation process to the greatest extent, thereby achieving high quality and excellent stability of flux preparation. In addition, the temperature of flux preparation is basically constant at about 150°C, which is very convenient for production operation control. The solder wire flux preparation method of the present invention has been verified by the author's scientific research team for many years and continuously revised and improved. It can not only be prepared at the experimental level in the laboratory, but also can be directly put into production on the production line for assembly line production operations.

[0047] (4) The solder wire flux for soft soldering of nickel parts of the present invention has excellent comprehensive performance due to the rational design of its flux formula structure and the refined flux preparation and production operation method. It has high activity, fast tinning rate and easy wetting during welding. It not only has excellent tinning wettability and solderability for nickel parts, but also has excellent soft soldering characteristics for tin-plated parts, copper parts and other material weldments. At the same time, it has low corrosion, excellent spatter performance and good electrical properties. The solder joints after welding are bright, full and clean. The chalk powder on the surface of the solder pool is easy to remove. The residual dryness is high and the flux quality is stable, which can be put into industrial production. In particular, the flux formula of the present invention uses additives such as organic alcohol amines, which have two active functional groups, hydroxyl and amino, and have an activator function, which can improve the removal effect of the flux on metal surface oxides; it is weakly alkaline and has the function of a corrosion inhibitor, which can neutralize part of the acidic components in the flux, thereby adjusting the pH of the flux to keep it within a suitable range, which can ensure good deoxidation ability and will not cause excessive corrosion to the welding parts due to excessive acidity; in addition, it has been found in practical experience that it also has the function of a brightener, and the organic alcohol amine can make the soldering point brighter and cleaner, and more beautiful in appearance.

[0048] (5) The solder wire flux for nickel parts soft soldering of the present invention introduces a masking agent into the formula to effectively mask the pungent odor generated during the welding process, making it more pleasant, and can be adjusted in a humanized manner according to the actual application experience of the customer. Because the flux formula contains a large amount of rosin and a certain amount of organic acids, halides, antioxidants and other additives, during the high-temperature welding burning process, some of these chemical substances will volatilize, while others will break and decompose the molecular chain, producing a lot of pungent chemical odors. This pungent chemical odor is unavoidable for any solder wire flux during the welding process, and the more chemical additives such as activators are added, the stronger the pungent chemical odor produced, resulting in the on-site employees of the application manufacturer being unable to adapt during the welding operation application experience, and even having strong rejection and resistance, and being unable to achieve the effective promotion and application of tin wire products. Practical experience has proven that adding an appropriate amount of pleasant-smelling masking agent to the flux can effectively mask the irritating chemical odor produced by the welding process and make it more pleasant, thereby enhancing the actual application experience and acceptance of solder wire and achieving smoother application and more efficient promotion of solder wire products in the market.

[0049] (6) The solder wire flux for nickel parts soft soldering of the present invention meets the requirements of EU RoHS 3.0 and REACH related environmental protection directives, and is not only suitable for lead-free solder soft soldering, but also suitable for lead solder soft soldering, and can be used to prepare solder wire products with various specifications of solder cores and wire diameters. DETAILED DESCRIPTION

[0050] The present invention is further described in detail below by way of examples, but the protection scope of the present invention is not limited to the contents described in the examples.

[0051] Example 1

[0052] A solder wire flux for nickel parts soldering, the raw material composition is as follows by weight percentage:

[0053] Refined hydrogenated rosin 67.27%

[0054] Eastman fully hydrogenated rosin AX-E 16.82%

[0055] Glutaric acid 1.20%

[0056] Sebacic acid 0.80%

[0057] Diethylamine hydrobromide 1.00%

[0058] Diphenylguanidine hydrobromide 1.00%

[0059] Cyclohexylamine hydrochloride 2.00%

[0060] Dibromobutylene glycol 0.70%

[0061] Hydrazine bromide 0.30%

[0062] TX-10 phosphate ester 1.00%

[0063] Octadecyltrimethylammonium chloride 1.00%

[0064] Stannous chloride 0.70%

[0065] Stannous oxalate 0.30%

[0066] BASF Ciba Antioxidant 1010 0.10%

[0067] Monoethanolamine 1.00%

[0068] Ethylene glycol monomethyl ether 2.00%

[0069] Propylene glycol ethyl ether 0.80%

[0070] N-Methylpyrrolidone 1.20%

[0071] Tripropylene glycol butyl ether 0.80%

[0072] Fruity flavor masking agent 855 0.01%.

[0073] The preparation method of solder wire flux for nickel parts soldering is as follows:

[0074] Glutaric acid, sebacic acid, diethylamine hydrobromide, diphenylguanidine hydrobromide, cyclohexylamine hydrochloride, dibromobutylene glycol, hydrazine bromide, stannous chloride, stannous oxalate, and BASF Ciba antioxidant 1010 were quantitatively weighed in sequence and packaged in a well-sealed solid reagent bottle to obtain a composite solid additive A; TX-10 phosphate, octadecyltrimethylammonium chloride, 1.00% ethylene glycol monomethyl ether, N-methylpyrrolidone, and tripropylene glycol butyl ether were quantitatively weighed in sequence, stirred thoroughly at room temperature to fully dissolve and mix the materials, and then the mixture was stirred for 2 hours. Filter with a 200-mesh filter, quantitatively dispense into a well-sealed liquid reagent bottle to obtain a compound mixed solution B; quantitatively weigh monoethanolamine, 1.00% ethylene glycol monomethyl ether, and fruity flavor masking agent 855 in sequence, fully stir to dissolve, mix and dilute at room temperature, and quantitatively dispense into a well-sealed liquid reagent bottle to obtain a compound diluted solution C; add refined hydrogenated rosin and Eastman fully hydrogenated rosin AX-E into a flux production reactor, heat to 150°C, and heat and stir at a constant temperature until completely melted; then, stir and Slowly add the compound solid additive A, continue heating and stirring at 150℃ for 5-10min, so that the compound solid additive A can be quickly dispersed into the molten rosin with stirring. After melting 1 / 3~1 / 2 of the amount, slowly add the compound mixed solution B while stirring, continue heating to 150℃ and stirring at a constant temperature for 10-20min, so that the compound solid additive A and the compound mixed solution B can be completely fully melted and dissolved in the molten rosin and mixed evenly. Then, slowly add the compound dilution solution C while stirring and continue heating. The mixture is heated to 145°C and stirred at a constant temperature for 5 to 10 minutes, so that the compound diluted solution C is fully reacted and dissolved and mixed evenly in the molten rosin containing the compound solid additive A and the compound mixed solution B, to obtain an initial soldering flux compound F. Finally, the heating and stirring are stopped, and the mixture is allowed to stand for 5 to 10 minutes under its own residual heat to allow the water phase and the oil phase components in the compound F to achieve relative sedimentation separation under the action of gravity, and a very small amount of water phase precipitates settled in the bottom layer are removed, and the upper rosin flux oil phase is retained to prepare a solder wire flux for soft soldering of nickel parts.

[0075] The soldering flux for nickel parts soft soldering of this embodiment was prepared into a SnAg3.0Cu0.5 tin rod with a solder core of 2.0% by an extruder, and then an ultrafine solder wire with a wire diameter of 0.1 mm was prepared by rolling, medium drawing, fine drawing and ultrafine drawing. The spatter, weldability, spreading rate, copper plate corrosion, surface insulation resistance after welding and other performance tests were carried out respectively. The test results are shown in Table 1.

[0076] Example 2

[0077] A solder wire flux for nickel parts soldering, the raw material composition is as follows by weight percentage:

[0078] Eastman fully hydrogenated rosin AX-E 30.08%

[0079] Fully hydrogenated rosin AX-80 30.08%

[0080] Acrylic acid modified hydrogenated rosin HM-604 15.04%

[0081] Methylsuccinic acid 1.50%

[0082] Glutaric anhydride 1.50%

[0083] Dodecanedioic acid 1.00%

[0084] Isopropylamine hydrobromide 1.50%

[0085] 2-Ethylimidazole hydrobromide 1.00%

[0086] Triethanolamine hydrochloride 1.50%

[0087] Diphenylguanidine hydrochloride 2.00%

[0088] Cyclohexylamine hydrochloride 4.00%

[0089] Chloroanhydride 1.00%

[0090] Dibromosuccinic acid 1.00%

[0091] Oleyl alcohol polyoxyethylene ether 0.50%

[0092] Hexadecyltrimethylammonium chloride 0.50%

[0093] Stannous chloride 0.50%

[0094] BASF Ciba Antioxidant 168 0.50%

[0095] BASF Ciba Antioxidant 1098 0.30%

[0096] Triethanolamine 2.00%

[0097] Tetrahydrofurfuryl alcohol 2.50%

[0098] Propylene glycol butyl ether 1.00%

[0099] Fruity flavor masking agent 851 0.20%

[0100] Jasmine essence 0.15%

[0101] Lemon aroma essence 0.15%

[0102] Eucalyptus essence 0.10%

[0103] Magic Forest Breath Essence 0.40%

[0104] The preparation method of solder wire flux for nickel parts soldering is as follows:

[0105] Methylsuccinic acid, glutaric anhydride, dodecanedioic acid, isopropylamine hydrobromide, 2-ethylimidazole hydrobromide, triethanolamine hydrochloride, diphenylguanidine hydrochloride, cyclohexylamine hydrochloride, chlorobridged anhydride, BASF Ciba antioxidant 168, BASF Ciba antioxidant 1098 were quantitatively weighed in sequence and packaged in a well-sealed solid reagent bottle to obtain a composite solid additive A; dibromosuccinic acid, hexadecyltrimethylammonium chloride, stannous chloride, oleyl alcohol polyoxyethylene ether, 1.50% tetrahydrofurfuryl alcohol, and propylene glycol butyl ether were quantitatively weighed in sequence, and fully stirred at room temperature to fully dissolve and mix the materials. The mixture was mixed evenly, filtered through a 150-mesh filter, and quantitatively packaged in a well-sealed liquid reagent bottle to obtain a compound mixed solution B; triethanolamine, 1.00% tetrahydrofurfuryl alcohol, propylene glycol butyl ether, fruity flavor masking agent 851, jasmine essence, lemon aromatic essence, eucalyptus essence, and magic forest essence were quantitatively weighed in turn, fully stirred, dissolved, mixed and diluted at room temperature, and quantitatively packaged in a well-sealed liquid reagent bottle to obtain a compound diluted solution C; Eastman fully hydrogenated rosin AX-E, fully hydrogenated rosin AX-80, and acrylic acid modified hydrogenated rosin HM-604 were added In the flux production reactor, heat to 160℃, stir and heat at a constant temperature until it is completely melted; then, slowly add the compound solid additive A while stirring, continue heating and stirring at a constant temperature of 150℃ for 5-10min, so that the compound solid additive A is quickly dispersed into the molten rosin with stirring, and after melting 1 / 3~1 / 2 of the amount, slowly add the compound mixed solution B while stirring, continue heating and stirring at a constant temperature of 150℃ for 10-20min, so that the compound solid additive A and the compound mixed solution B are completely and fully melted and dissolved in the molten rosin and mixed evenly, then, stir The compound dilution solution C is slowly added while continuously heating and stirring at a constant temperature of 145° C. for 5 to 10 minutes, so that the compound dilution solution C can fully react and dissolve and mix evenly in the molten rosin containing the compound solid additive A and the compound mixed solution B, to obtain an initial soldering flux compound F. Finally, the heating and stirring are stopped, and the compound is allowed to stand for 5 to 10 minutes under its own residual heat conditions, so that the water phase and the oil phase components in the compound F can be relatively separated by sedimentation under the action of gravity, and a very small amount of water phase precipitates settled in the bottom layer are removed, and the upper rosin flux oil phase is retained to prepare a solder wire flux for soft soldering of nickel parts.

[0106] The soldering flux for nickel parts soft soldering of this embodiment was prepared into a SnCu0.7 tin rod with a solder core of 3.5% by an extruder, and then a solder wire with a wire diameter of 1.0 mm was prepared by rolling, medium drawing and fine drawing. The spatter, weldability, spreading rate, copper plate corrosion, surface insulation resistance after welding and other performance tests were carried out respectively. The test results are shown in Table 1.

[0107] Example 3

[0108] A solder wire flux for nickel parts soldering, the raw material composition is as follows by weight percentage:

[0109] Hydrogenated rosin 13.72%

[0110] Refined hydrogenated rosin 20.58%

[0111] Eastman fully hydrogenated rosin AX-E 13.72%

[0112] Acrylic acid modified hydrogenated rosin HM-604 13.72%

[0113] Acrylic acid modified hydrogenated rosin 3250 6.86%

[0114] Succinic anhydride 2.00%

[0115] Adipic acid 1.60%

[0116] Suberic acid 1.20%

[0117] Tridecanoic acid 1.20%

[0118] 4-tert-Butylimidazole hydrobromide 1.00%

[0119] 2-Bromoethylamine hydrobromide 2.50%

[0120] Ethylenediamine hydrochloride 2.00%

[0121] Dimethylamine hydrochloride 1.50%

[0122] Dibromobutylene glycol 2.00%

[0123] Dibromoethylbenzene 0.70%

[0124] Dibromosuccinic acid 0.80%

[0125] 2-Chlorosuccinic acid 1.50%

[0126] FS-3000 0.10%

[0127] Octadecyltrimethylammonium bromide 0.20%

[0128] Stannous chloride 1.0%

[0129] Stannous oxalate 1.20%

[0130] Stannous methanesulfonate 0.80%

[0131] Antioxidant BHT 0.40%

[0132] Diethanolamine 1.50%

[0133] Diethanol monoisopropanolamine 2.00%

[0134] Methanol 1.00%

[0135] Propylene glycol propyl ether 2.00%

[0136] Diethylene glycol methyl ether 1.00%

[0137] Tripropylene glycol methyl ether 1.00%

[0138] Dipropylene glycol butyl ether 1.00%

[0139] Gardenia essence 0.10%

[0140] Mint aroma flavor 0.10%.

[0141] The preparation method of solder wire flux for nickel parts soldering is as follows:

[0142] Succinic anhydride, adipic acid, suberic acid, tridecanedioic acid, p-tert-butylimidazole hydrobromide, 2-bromoethylamine hydrobromide, ethylenediamine hydrochloride, dibromobutylene glycol, dibromoethylbenzene, 2-chlorosuccinic acid, stannous chloride, stannous oxalate, stannous methanesulfonate, and antioxidant BHT are quantitatively weighed in sequence and packaged in a well-sealed solid reagent bottle to obtain a composite solid additive A; dimethylamine hydrochloride, dibromosuccinic acid, FS-3000, octadecyltrimethylammonium bromide, methanol, diethylene glycol methyl ether, tripropylene glycol methyl ether, and dipropylene glycol butyl ether are quantitatively weighed in sequence and fully stirred at room temperature. The materials were fully dissolved and mixed evenly, filtered with a 120-mesh filter, and quantitatively packaged in a well-sealed liquid reagent bottle to obtain a compound mixed solution B; diethanolamine, diethanol monoisopropanolamine, propylene glycol propyl ether, gardenia essence, and mint aromatic essence were quantitatively weighed in turn, fully stirred, dissolved, mixed and diluted at room temperature, and quantitatively packaged in a well-sealed liquid reagent bottle to obtain a compound diluted solution C; hydrogenated white rosin, refined hydrogenated rosin, Eastman fully hydrogenated rosin AX-E, acrylic acid modified hydrogenated rosin HM-604, acrylic acid modified hydrogenated rosin 3250 Add to the flux production reactor, heat to 160℃, and heat and stir at constant temperature until it is completely melted; then, slowly add the compound solid additive A while stirring, continue heating and stirring at 150℃ for 5-10min, so that the compound solid additive A is quickly dispersed into the molten rosin with stirring, and after melting 1 / 3~1 / 2 of the amount, slowly add the compound mixed solution B while stirring, continue heating and stirring at 150℃ for 10-20min, so that the compound solid additive A and the compound mixed solution B are completely and fully melted and dissolved in the molten rosin, and then, stir While stirring, slowly add the compound dilution solution C, continue heating and stir at a constant temperature of 145°C for 5 to 10 minutes, allow the compound dilution solution C to fully react and dissolve and mix evenly in the molten rosin containing the compound solid additive A and the compound mixed solution B, and obtain the initial flux compound F; finally, stop heating and stirring, let it stand for 5 to 10 minutes under its own residual heat conditions, allow the water phase and oil phase components in the compound F to achieve relative sedimentation separation under the action of gravity, remove the very small amount of water phase precipitate settled in the bottom layer, retain the upper rosin flux oil phase, and prepare the solder wire flux for nickel soft soldering.

[0143] The soldering flux for nickel parts soldering of this embodiment was prepared into a Sn37.5PbA tin rod with a solder core of 2.5% by an extruder, and then a solder wire with a wire diameter of 1.4 mm was prepared by large drawing, medium drawing and fine drawing. The spatter, weldability, spreading rate, copper plate corrosion, surface insulation resistance after welding and other performance tests were carried out respectively. The test results are shown in Table 1.

[0144] Example 4

[0145] A solder wire flux for nickel parts soldering, the raw material composition is as follows by weight percentage:

[0146] Hydrogenated rosin 36.95%

[0147] Fully hydrogenated rosin AX-80 36.95%

[0148] Succinic anhydride 1.50%

[0149] Glutaric acid 2.00%

[0150] Glutaric anhydride 1.20%

[0151] Sebacic acid 1.80%

[0152] Dodecanedioic acid 1.50%

[0153] Cyclohexylamine hydrobromide 0.80%

[0154] n-Butyl monoaniline hydrobromide 0.20%

[0155] Dibromoethylbenzene 1.00%

[0156] Dibromosuccinic acid 1.00%

[0157] 2,2-Dichlorosuccinic acid 1.50%

[0158] OP-10 2.00%

[0159] Hexadecyltrimethylammonium bromide 1.00%

[0160] Stannous oxalate 1.00%

[0161] Stannous methanesulfonate 1.00%

[0162] BASF Ciba Antioxidant 1010 0.50%

[0163] BASF Ciba Antioxidant 1076 0.30%

[0164] BASF Ciba Antioxidant B215 0.20%

[0165] Monoethanolamine 1.20%

[0166] Triisopropanolamine 1.80%

[0167] Diethanol monoisopropanolamine 2.00%

[0168] Propylene glycol monomethyl ether 2.00%

[0169] Lily fragrance 0.20%

[0170] Thyme essence 0.20%

[0171] Fantasy Island Fragrance 0.20%.

[0172] The preparation method of solder wire flux for nickel parts soldering is as follows:

[0173] Succinic anhydride, glutaric acid, glutaric anhydride, sebacic acid, dodecanedioic acid, cyclohexylamine hydrobromide, dibromoethylbenzene, 2,2-dichlorosuccinic acid, stannous oxalate, stannous methanesulfonate, BASF Ciba antioxidant 1010, BASF Ciba antioxidant 1076, BASF Ciba antioxidant B215, and triisopropanolamine were quantitatively weighed in sequence and packaged in a well-sealed solid reagent bottle to obtain a composite solid additive A; n-butyl monoaniline hydrobromide, dibromosuccinic acid, OP-10, hexadecyltrimethylammonium bromide, and propylene glycol monomethyl ether were quantitatively weighed in sequence Quantify, fully stir at room temperature to make all materials fully dissolved and mixed evenly, filter with a 180-mesh filter, quantitatively pack in a well-sealed liquid reagent bottle to obtain a compound mixed solution B; quantitatively weigh monoethanolamine, diethanol monoisopropanolamine, lily aromatic essence, thyme essence, and fantasy island essence in turn, fully stir, dissolve, mix and dilute at room temperature, quantitatively pack in a well-sealed liquid reagent bottle to obtain a compound diluted solution C; add hydrogenated white rosin and fully hydrogenated rosin AX-80 into the flux production reactor, heat to 145°C, Stir and heat at a constant temperature until it is completely melted; then, slowly add the compound solid additive A while stirring, continue heating and stirring at a constant temperature of 150℃ for 5-10 minutes, so that the compound solid additive A is quickly dispersed into the molten rosin with stirring, and after melting 1 / 3~1 / 2 of the amount, slowly add the compound mixed solution B while stirring, continue heating and stirring at a constant temperature of 150℃ for 10-20 minutes, so that the compound solid additive A and the compound mixed solution B are completely fully melted and dissolved in the molten rosin and mixed evenly, and then slowly add the compound diluted Solution C is released, and heating and stirring are continued at a constant temperature of 145°C for 5 to 10 minutes, so that the compounded diluted solution C is fully reacted and dissolved and mixed evenly in the molten rosin containing the compounded solid additive A and the compounded mixed solution B, to obtain an initial soldering flux compound F; finally, heating and stirring are stopped, and the compound is allowed to stand for 5 to 10 minutes under its own residual heat conditions, so that the water phase and oil phase components in the compound F are allowed to achieve relative sedimentation separation under the action of gravity, and a very small amount of water phase precipitates settled in the bottom layer are removed, and the upper rosin flux oil phase is retained to prepare a solder wire flux for soft soldering of nickel parts.

[0174] The soldering flux for nickel parts soft soldering of this embodiment was prepared into a Sn63PbA tin rod with a solder core of 1.2% by an extruder, and then a solder wire with a wire diameter of 2.0 mm was prepared by large drawing, medium drawing and fine drawing. The spatter, weldability, spreading rate, copper plate corrosion, surface insulation resistance after welding and other performance tests were carried out respectively. The test results are shown in Table 1.

[0175] According to the relevant test methods specified in the international standard IPC-TM-650, the above embodiments 1-4 were respectively tested for performance such as spatter rate, weldability, expansion rate, copper plate corrosion, and surface insulation resistance after welding. The test results are shown in Table 1.

[0176] Table 1 List of performance tests of solder wire and flux for nickel parts welding

[0177]

[0178]

[0179] As can be seen from Table 1, the soldering flux for nickel parts soldering of the present invention belongs to the soldering flux for halogen-containing high-activity solder wire, complies with RoHS 3.0 and REACH directives, is suitable for leaded and lead-free tin-based solders, is suitable for preparing solder wire products with various specifications of solder cores and wire diameters, has excellent wetting and tinning solderability for nickel parts, the fume generated during the welding process has a pleasant fragrance, the residual drying performance of the soldering flux is good, the solder joints are bright and full, the surface is clean and has no or little residue, the spot welding and drag welding performance are good, the spatter is small, the corrosion is not large, the spreading rate is greater than 75%, the electrical performance test is qualified, and the technical requirements of surface insulation resistance greater than 108Ω and electromigration IRfinal greater than IRinitial / 10, no discoloration, corrosion and filament growth in the international standard IPC-TM-650 are met.

[0180] The solder wire flux for nickel component soft soldering of the present invention belongs to the flux for halogen-containing high-activity solder wire, which can not only be prepared at the experimental level in the laboratory, but also can be directly put into production on the production line for assembly line production operation, is suitable for leaded and lead-free tin-based solders, and is used to prepare solder wire products with various specifications of welding cores and wire diameters, has excellent wetting and tinning weldability for metal weldments such as nickel components, the smoke generated during the welding process has a pleasant fragrance, the residual drying performance of the flux is good, the solder joints are bright and full, the surface is clean with no residue or little residue, the splash is small, the corrosion is not large, etc., and it meets the EU RoHS 3.0 and REACH environmental protection requirements.

Claims

1. A solder wire flux for nickel parts soldering, characterized in that: By weight percentage, the raw material composition is: Compound dibasic organic carboxylic acid 2.0-8.0%, Compound ionic halogen activator 1.0-10.0%, Compound covalent halogen activator 1.0-5.0%, Compound surfactant 0.3-3.0%, Metal salt 0.5-3.0%, Antioxidant 0.1-1.0%, Organic alcohol amine 1.0-5.0%, Odor masking agent 0.01-1.0%, Organic solvent 2.0-6.0%, Residue of compounded modified rosin resin; The compounded dibasic organic carboxylic acid is a combination of two or more of methylsuccinic acid, succinic anhydride, glutaric acid, glutaric anhydride, adipic acid, suberic acid, sebacic acid, dodecanedioic acid, and tridecanedioic acid; The complex ion-state halogenated activator is a combination of two or more of cyclohexylamine hydrobromide, diethylamine hydrobromide, p-tert-butylimidazole hydrobromide, diphenylguanidine hydrobromide, 2-bromoethylamine hydrobromide, isopropylamine hydrobromide, 2-ethylimidazole hydrobromide, n-butylmonoaniline hydrobromide, cyclohexylamine hydrochloride, dimethylamine hydrochloride, ethylenediamine hydrochloride, triethanolamine hydrochloride, and diphenylguanidine hydrochloride; The composite covalent halogenated activator is a combination of two or more of chlorohydric anhydride, dibromobutylene glycol, dibromoethylbenzene, hydrazine bromide, dibromosuccinic acid, 2,2-dichlorosuccinic acid, and 2-chlorosuccinic acid; The compound surfactant is a combination of a nonionic surfactant and an ionic surfactant or a combination of a nonionic fluorocarbon surfactant and an ionic surfactant; The metal salt is one or a combination of two or more of stannous chloride, stannous oxalate and stannous methanesulfonate; The antioxidant is one or a combination of two or more of BASF Ciba antioxidant 1010, 168, 1076, 1098, B215, and antioxidant BHT; The organic alcohol amine is one or a combination of two or more of monoethanolamine, diethanolamine, triethanolamine, triisopropanolamine, and diethanol monoisopropanolamine; The masking agent is one or a combination of two or more of a fruity masking agent, a floral masking agent, an aromatic masking agent, a herbal masking agent, and a fantasy masking agent; The organic solvent is one or a combination of two or more of methanol, tetrahydrofurfuryl alcohol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol ethyl ether, propylene glycol propyl ether, propylene glycol butyl ether, diethylene glycol methyl ether, tripropylene glycol methyl ether, tripropylene glycol butyl ether, dipropylene glycol butyl ether, and N-methylpyrrolidone; The modified rosin resin is a combination of two or more of hydrogenated white rosin, refined hydrogenated rosin, Eastman fully hydrogenated rosin AX-E, fully hydrogenated rosin AX-80, acrylic acid modified hydrogenated rosin HM-604, and 3250 rosin.

2. The solder wire flux for nickel parts soldering according to claim 1, characterized in that: The nonionic surfactant is one of oleyl alcohol polyoxyethylene ether, TX-10 phosphate, octylphenol polyoxyethylene ether, NP-10, and OP-10; the nonionic fluorocarbon surfactant is FS-3000 or FS-3100; the ionic surfactant is one of hexadecyltrimethylammonium chloride, octadecyltrimethylammonium chloride, hexadecyltrimethylammonium bromide, and octadecyltrimethylammonium bromide.

3. A solder wire flux for nickel parts soldering according to claim 1 or 2, characterized in that: The fruity masking agent is one of 851, 855, 856, 858, and 859; the floral masking agent is one of rose essence, jasmine essence, osmanthus essence, lily of the valley essence, magnolia essence, gardenia essence, lavender essence, violet essence, tuberose essence, acacia essence, and chrysanthemum essence; the aromatic masking agent is one of lemon aromatic essence, mint aromatic essence, sandalwood aromatic essence, tea tree aromatic essence, orange blossom aromatic essence, and lily aromatic essence; the herbal masking agent is one of wormwood essence, rosemary essence, lemongrass essence, eucalyptus essence, sage essence, thyme essence, citronella essence, and basil essence; the fantasy masking agent is one of dream mist essence, fantasy rainbow essence, starry sky essence, magic forest breath essence, and dream island essence.

4. The method for preparing a solder wire flux for nickel part soldering according to claim 1, 2 or 3, characterized in that: The steps are as follows: (1) A solid dibasic organic carboxylic acid, a portion of a covalent halogen activator, a portion of an ionic halogen activator, a metal salt, and an antioxidant are mixed and packaged in a solid reagent bottle for standby use to obtain a composite solid additive A; (2) a portion of the organic solvent is charged into a reaction container, and then a portion of a solid covalent halogenated activator, a portion of a solid ionic halogenated activator, a portion of a liquid covalent halogenated activator, a portion of an ionic halogenated activator, and a composite surfactant are added into the reaction container, and the mixture is stirred at room temperature to fully dissolve and mix the materials, and filtered through a filter to obtain a mixed solution, and the mixed solution is sealed in a liquid reagent bottle for standby use, to obtain a composite mixed solution B; (3) The remaining organic solvent is charged into a reaction container, and then the organic alcohol amine, the taste masking agent, the remaining liquid covalent halogenated activator, and the remaining liquid ionic halogenated activator are charged into the reaction container, and the mixture is stirred, dissolved, mixed and diluted at room temperature to obtain a fully dissolved and mixed uniform dilution solution, and the dilution solution is sealed in a liquid reagent bottle for standby use to obtain a composite dilution solution C; (4) Add the compounded modified rosin resin into the flux production reactor, heat and stir at a constant temperature until it is completely melted; (5) slowly adding the compounded solid additive A prepared in step (1) to the melted compounded modified rosin resin in step (4) while stirring, and continuously heating and stirring at a constant temperature so that the compounded solid additive A is rapidly dispersed into the molten rosin during stirring, thereby obtaining a compound material D; (6) slowly adding the composite mixed solution B prepared in step (2) to the composite ingredient D in step (5) while stirring, and continuously heating and stirring at a constant temperature to allow the composite solid additive A and the composite mixed solution B to be completely melted, dissolved and mixed in the molten rosin to obtain a composite ingredient E; (7) slowly adding the composite diluted solution C prepared in step (3) into the composite ingredient E in step (6) while stirring, and continuously heating and stirring at a constant temperature until the composite diluted solution C and the composite ingredient E are fully reacted and dissolved and mixed uniformly, thereby obtaining a composite ingredient F; (8) Stop heating and stirring, and let the composite material F prepared in the above step (7) stand for 5 to 10 minutes under its own residual heat to allow the water phase and oil phase components in the composite material F to settle and separate under the action of gravity, directly remove the precipitated water phase on the bottom layer, and retain the upper oil phase to obtain the solder wire flux for nickel component soft soldering.

5. The method for preparing a solder wire flux for nickel part soldering as claimed in claim 4, characterized in that: The prepared solder wire flux for nickel component soft soldering is canned into the inner core of a leaded or lead-free tin rod through an extruder device, and a solder wire product is prepared by processing.

6. The method for preparing a solder wire flux for nickel part soldering as claimed in claim 4, characterized in that: The heating temperature for preparing the compound modified rosin resin in step (4) is 150±10°C; the heating temperature for preparing compound material D in step (5) is 150±10°C; the heating temperature for preparing compound material E in step (6) is 150±10°C; the heating temperature for preparing compound material F in step (7) is 145±5°C.

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