Millimeter wave phased-array antenna PCB laminated structure and preparation method thereof

Abstract

The invention relates to the technical field of communication equipment, and provides a millimeter wave phased-array antenna PCB laminated structure and a preparation method thereof. The millimeter wave phased array antenna PCB laminated structure comprises an array element layer, a digital control-power supply layer, a radio frequency power layer and a PCB bottom layer, the array element layer comprises a radiation patch layer, a coupling feed layer and a reference ground layer which are arranged in a stacked mode, the digital control-power supply layer comprises a first ground layer, a digital signal wiring layer and a power supply layer which are arranged in a stacked mode, a radio frequency power division network circuit is arranged on the radio frequency power division layer, and the PCB bottom layer, the radio frequency power division layer, the digital control-power supply layer and the array element layer are sequentially arranged in a stacked mode. And a second ground layer is arranged between the radio frequency power layer and the PCB bottom layer. The millimeter wave phased-array antenna PCB laminated structure provided by the invention has the advantages of small thickness, simple assembly, high reliability and the like. Through the multi-layer superposition design, the functional modules are integrated on one PCB, space utilization is optimized, the external connection problem in the traditional design is avoided, the assembly process is simplified, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of communication equipment, and in particular to a millimeter wave phased array antenna PCB laminate structure and a preparation method thereof. Background Art

[0002] The high integration and miniaturization of millimeter wave phased array antennas are important trends in the development of satellite communications. Phased array antennas have two structures: brick-type and tile-type. The brick-type adopts a vertical layout, which is simple in design but low in integration, resulting in large size and weight; the tile-type adopts a horizontal layout, which has a higher integration and smaller size, but is difficult to manufacture and has more complex heat dissipation issues.

[0003] Based on the tile-type solution, the integrated phased array solution further improves the integration. Through high-integration PCB technology, multiple functions such as antenna elements, RF, control, and power supply are integrated on the same PCB board, and connected through vertical interconnection technology. This integration method improves the compactness and performance of the system, but due to the complex manufacturing process, a reasonable design of the PCB stack can reduce the number of vias, reduce the process difficulty, shorten the processing cycle, and reduce costs.

[0004] Related technologies disclose a skin-type millimeter-wave satellite communication phased array antenna, which adopts a modular design concept and decomposes the antenna array into multiple components, including an antenna fixing frame, a microstrip antenna unit, a thermal control board, a multi-channel transceiver assembly, an antenna cavity skeleton structure, a microwave circuit board, and a bottom cover, etc. However, it has disadvantages such as large module thickness, complex assembly process, and relatively low reliability. Summary of the invention

[0005] The present invention provides a millimeter wave phased array antenna PCB laminated structure and a preparation method thereof, which are used to solve the defects of the existing phased array antenna module, such as large thickness, complex assembly and low reliability.

[0006] On one hand, the present invention provides a millimeter wave phased array antenna PCB stacking structure, including: an array element layer, a digital control-power supply layer, a radio frequency power layer and a PCB bottom layer.

[0007] The array element layer includes a radiation patch layer, a coupling feed layer and a reference ground layer which are stacked, the digital control-power supply layer includes a first ground layer, a digital signal routing layer and a power supply layer which are stacked, a radio frequency power division network circuit is provided on the radio frequency power layer, the PCB bottom layer, the radio frequency power layer, the digital control-power supply layer and the array element layer are stacked in sequence, and a second ground layer is provided between the radio frequency power layer and the PCB bottom layer.

[0008] According to the millimeter wave phased array antenna PCB stacked structure provided by the present invention, the radiation patch layer includes a first radiation patch layer and a second radiation patch layer which are stacked, and the first radiation patch layer is the top layer of the PCB.

[0009] According to the millimeter wave phased array antenna PCB stacked structure provided by the present invention, at least one of an antenna array element, a digital control chip, a power chip, a connector and a passive device is provided on the top layer of the PCB.

[0010] According to the millimeter wave phased array antenna PCB stacked structure provided by the present invention, at least one of a radio frequency transceiver chip, a power amplifier chip, a digital control chip, a power chip, a connector, a passive device and a power division network circuit is provided on the bottom layer of the PCB.

[0011] The millimeter wave phased array antenna PCB stacking structure provided by the present invention also includes a via and a first laser hole, wherein the via connects the second ground layer, the RF power layer and the digital control-power layer in sequence, and the first laser hole connects the second ground layer and the RF power layer.

[0012] The millimeter wave phased array antenna PCB stacking structure provided by the present invention also includes a second laser hole and a buried hole, the second laser hole connects the reference ground layer and the digital control-power layer, and the buried hole connects the reference ground layer and the second ground layer.

[0013] The millimeter wave phased array antenna PCB stacking structure provided by the present invention also includes a third laser hole, a fourth laser hole and a digital blind hole, the third laser hole sequentially connects the PCB bottom layer, the second ground layer and the RF power layer, the fourth laser hole connects the PCB bottom layer and the second ground layer, and the digital blind hole sequentially connects the PCB bottom layer, the second ground layer, the RF power layer and the digital control-power layer.

[0014] The millimeter wave phased array antenna PCB stacked structure provided by the present invention also includes depth-controlled blind holes and through holes, wherein the depth-controlled blind holes sequentially connect the radiation patch layer, the coupling feed layer and the reference ground layer, and the through holes sequentially connect the array element layer, the digital control-power supply layer, the RF power layer, the second ground layer and the PCB bottom layer.

[0015] The millimeter wave phased array antenna PCB stacked structure provided by the present invention further includes a back drilled hole, and the back drilled hole is used to remove the stub dead area of ​​the array element layer.

[0016] Another aspect of the present invention provides a method for preparing a PCB laminate structure, comprising the following steps.

[0017] The first ground layer, the digital signal routing layer, the power layer, the RF power layer and the second ground layer are pressed together to form a first stacked structure, and via holes and a first laser hole are drilled on the first stacked structure. The via holes sequentially connect the second ground layer, the RF power layer and the digital control-power layer, and the first laser hole connects the second ground layer and the RF power layer.

[0018] The reference ground layer, the first stacked structure and the PCB bottom layer are pressed together to form a second stacked structure, and a second laser hole, a third laser hole, a fourth laser hole, a buried hole and a digital blind hole are drilled on the second stacked structure, the second laser hole connects the reference ground layer and the digital control-power layer, the buried hole connects the reference ground layer and the second ground layer, the third laser hole connects the PCB bottom layer, the second ground layer and the RF power layer in sequence, the fourth laser hole connects the PCB bottom layer and the second ground layer, and the digital blind hole connects the PCB bottom layer, the second ground layer, the RF power layer and the digital control-power layer in sequence.

[0019] The second radiation patch layer, the coupling feed layer and the second stacked structure are pressed together to form a third stacked structure, and a first depth-controlled blind hole is drilled on the third stacked structure, wherein the first depth-controlled blind hole connects the second radiation patch layer, the coupling feed layer and the second stacked structure.

[0020] The first radiation patch layer and the third stacked structure are pressed together to form a fourth stacked structure, and a second depth-controlled blind hole is drilled in the fourth stacked structure, wherein the second depth-controlled blind hole connects the first radiation patch layer and the third stacked structure.

[0021] A through hole is drilled on the fourth stacked structure, and the through hole sequentially connects the array element layer, the digital control-power supply layer, the RF power layer, the second ground layer and the PCB bottom layer. A back drilled hole is formed on the basis of the through hole to remove the stub dead area of ​​the array element layer.

[0022] The millimeter wave phased array antenna PCB stacked structure provided by the present invention has significant advantages such as thin thickness, simple assembly and high reliability. Through the multi-layer stacking design, the functional modules (including the array element layer, digital control power supply layer, RF power layer, etc.) are integrated on a PCB, which significantly reduces the overall thickness, optimizes space utilization, and has a simple and integrated structure, avoiding the external connection problems in traditional designs, simplifying the assembly process, and facilitating automated production, thereby improving production efficiency.

[0023] The PCB laminate structure preparation method provided by the present invention simplifies the processing technology by optimizing the pressing sequence and punching sequence of each electrical layer, effectively improves the reliability of the PCB laminate structure, reduces the processing difficulty, and is suitable for high-frequency and high-speed applications such as millimeter-wave phased array antennas and other fields.

[0024] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a structural schematic diagram of a millimeter wave phased array antenna PCB stacking structure provided by an embodiment of the present invention.

[0027] Figure 2 It is a schematic diagram of the process of the method for preparing a PCB laminate structure provided in an embodiment of the present invention.

[0028] Figure 3 It is a lamination schematic diagram of a method for preparing a PCB laminate structure provided in an embodiment of the present invention.

[0029] Reference numerals: 100, array element layer; 110, radiation patch layer; 111, first radiation patch layer; 112, second radiation patch layer; 120, coupling feed layer; 130, reference ground layer; 200, digital control-power layer; 210, first ground layer; 220, digital signal routing layer; 230, power layer; 300, RF power layer; 400, PCB bottom layer; 500, second ground layer; 610, second laser hole; 620, buried hole; 630, third laser hole; 640, fourth laser hole; 650, digital blind hole; 660, depth-controlled blind hole; 670, through hole; 680, back-drilled hole. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0032] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0033] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0035] Combine the following Figures 1 to 3 The present invention describes a millimeter wave phased array antenna PCB laminate structure and a method for preparing the PCB laminate structure provided in an embodiment of the present invention.

[0036] See also Figure 1 As shown, the millimeter wave phased array antenna PCB stacking structure provided by the embodiment of the present invention includes: an array element layer 100, a digital control-power supply layer 200, a radio frequency power layer 300 and a PCB bottom layer 400.

[0037] The array element layer 100 includes a radiation patch layer 110, a coupling feed layer 120 and a reference ground layer 130 which are stacked, the digital control-power supply layer 200 includes a first ground layer 210, a digital signal routing layer 220 and a power supply layer 230 which are stacked, a radio frequency power division network circuit is provided on the radio frequency power layer 300, the PCB bottom layer 400, the radio frequency power layer 300, the digital control-power supply layer 200 and the array element layer 100 are stacked in sequence, and a second ground layer 500 is provided between the radio frequency power layer 300 and the PCB bottom layer 400.

[0038] The millimeter wave phased array antenna PCB stacked structure provided by the present invention has significant advantages such as thin thickness, simple assembly and high reliability. Through the multi-layer stacking design, the functional modules (including the array element layer 100, the digital control power supply layer 230, the radio frequency power layer 300, etc.) are integrated on a PCB, which significantly reduces the overall thickness, optimizes the space utilization, and has a simple and integrated structure, avoiding the external connection problems in the traditional design, simplifying the assembly process, and facilitating automated production, thereby improving production efficiency.

[0039] Specifically, the millimeter wave phased array antenna PCB stacked structure provided by the embodiment of the present invention is formed by laminating multiple layers of printed circuit boards.

[0040] The array element layer 100 includes a stacked radiation patch layer 110, a coupling feed layer 120 and a reference ground layer 130. The radiation patch layer 110 is used to radiate radio frequency signals, the coupling feed layer 120 is responsible for transmitting signals from the radio frequency power division network to the radiation patch layer 110, and the reference ground layer 130 provides an electrical reference ground to ensure stable operation of the antenna. In the array element layer 100, the number of the radiation patch layer 110, the coupling feed layer 120 and the reference ground layer 130 is at least one, that is, it is not limited to only including Figure 1 The L1-L4 layers shown in the figure may be increased or decreased in number according to different array element schemes.

[0041] In the array element layer 100, the dielectric materials of the radiation patch layer 110, the coupling feed layer 120 and the reference ground layer 130 can be radio frequency plates, and the array elements can be designed into different types (such as single polarization array elements, dual polarization array elements, linear polarization array elements, etc.) according to different requirements. The array element includes a radiation patch, an array element shielding isolation wall, a feed probe, etc.

[0042] The digital control-power layer 200 includes a first ground layer 210, a digital signal routing layer 220, and a power layer 230 arranged in a stacked manner. The first ground layer 210 is used to provide a ground reference for the digital control part, the digital signal routing layer 220 is used to transmit digital signals, such as control signals, etc., and the power layer 230 is used to provide power. The number of the first ground layer 210, the digital signal routing layer 220, and the power layer 230 is at least one, that is, not limited to Figure 1 In the form of L5-L11 layers shown in FIG, the number of layers of the first ground layer 210, the digital signal routing layer 220 and the power layer 230 can be increased or decreased according to actual conditions in the design.

[0043] In the digital control-power layer 200, the dielectric materials of the first ground layer 210, the digital signal routing layer 220 and the power layer 230 can be radio frequency boards, or ordinary FR4 boards can be used to reduce PCB costs.

[0044] The RF power division layer 300 is provided with a RF power division network circuit, which is responsible for distributing the RF signal to multiple array elements to realize the function of the phased array. The RF power division network circuit can be equal power division or unequal power division, and can be a T-shaped power division or Wilkinson power division network.

[0045] Since the signal frequency of the power division network is high, the dielectric material of the radio frequency power layer 300 is generally a radio frequency plate material to reduce signal loss.

[0046] The PCB bottom layer 400 serves as the foundation of the entire structure and supports the fixation of other layers.

[0047] The second ground layer 500 is located between the RF power layer 300 and the PCB bottom layer 400 and serves as an additional electrical reference ground to optimize signal quality and system performance.

[0048] See also Figure 1 As shown, according to some embodiments of the present invention, the radiation patch layer 110 includes a first radiation patch layer 111 and a second radiation patch layer 112 which are stacked, and the first radiation patch layer 111 is a top layer of the PCB.

[0049] The performance of the antenna can be effectively optimized by setting the radiation patch layer 110 to be a stacked first radiation patch layer 111 and a second radiation patch layer 112. The first radiation patch layer 111 is the top layer of the PCB and is mainly responsible for the radiation task, while the second radiation patch layer 112 is located inside the first radiation patch layer 111 and can improve the bandwidth, gain and directivity.

[0050] It should be noted that the first radiation patch layer 111 (PCB top layer) and the PCB bottom layer 400 are both PCB surface layers. Figure 1L1 shown in is the top layer or the bottom layer, that is, in some embodiments, Figure 1 L1 shown in FIG. 4 may also be the PCB bottom layer 400. In this case, Figure 1 L14 shown in the figure is the top layer of the PCB.

[0051] According to some embodiments of the present invention, at least one of an antenna array element, a digital control chip, a power chip, a connector and a passive device is disposed on the top layer of the PCB.

[0052] By placing antenna elements, digital control chips, power chips, connectors and passive components on the top layer of the PCB, the PCB stacking structure can be integrated to improve its performance and compactness, reduce the space requirements of the circuit board, simplify the connection and layout, and improve the stability and reliability of the system, making it suitable for high-frequency, high-performance communication applications.

[0053] Specifically, the antenna array elements are responsible for signal radiation and reception, the digital control chip is responsible for signal modulation and control, the power chip provides the required power support, the connector is used for signal input and output, and the passive devices are used for signal filtering, matching and other functions.

[0054] According to some embodiments of the present invention, at least one of a radio frequency transceiver chip, a power amplifier chip, a digital control chip, a power chip, a connector, a passive device and a power division network circuit is disposed on the PCB bottom layer 400 .

[0055] By arranging RF transceiver chips, power amplifier chips, digital control chips, power supply chips, connectors, passive devices and power division network circuits on the PCB bottom layer 400, efficient processing and distribution of RF signals can be achieved, the processing performance of RF signals can be optimized, and the system's integration, reliability and work efficiency can be improved, making it suitable for high-performance communications and other fields.

[0056] Specifically, the RF transceiver chip is responsible for receiving and sending signals, the power amplifier chip is used to enhance signal power, the digital control chip is responsible for signal modulation and system control, the power chip provides stable power for each component, the connector is used for signal connection between systems, and the passive components are used for signal filtering, matching and adjustment. The power division network circuit is used to distribute the signal to different paths or antenna arrays as needed.

[0057] See also Figure 1 As shown, according to some embodiments of the present invention, the millimeter wave phased array antenna PCB stacking structure also includes a via (not shown in the figure) and a first laser hole (not shown in the figure), the via connects the second ground layer 500, the RF power layer 300 and the digital control-power layer 200 in sequence, and the first laser hole connects the second ground layer 500 and the RF power layer 300.

[0058] By setting vias and the first laser holes, effective connection and signal transmission between different electrical layers in the PCB stacked structure of the millimeter-wave phased array antenna can be achieved, which can not only optimize the circuit wiring and improve the signal transmission efficiency, but also reduce the volume and complexity of the PCB, improve the integration, reliability and performance of the antenna system, and meet the needs of high-frequency and high-speed signal processing.

[0059] Specifically, the vias vertically connect the second stratum 500, the RF power layer 300 and the digital control-power layer 200 to achieve electrical interconnection between the layers, ensuring signal transmission and stable power supply. The first laser hole is used to connect the second stratum 500 and the RF power layer 300, providing a more accurate signal channel and reducing interference or loss in signal transmission. Through the design of the above holes.

[0060] See also Figure 1 As shown, according to some embodiments of the present invention, the millimeter wave phased array antenna PCB stacking structure also includes a second laser hole 610 and a buried hole 620, the second laser hole 610 connects the reference ground layer 130 and the digital control-power layer 200, and the buried hole 620 connects the reference ground layer 130 and the second ground layer 500.

[0061] By setting the second laser hole 610 and the buried hole 620, the electrical connection and signal integrity of the millimeter-wave phased array antenna PCB laminate structure can be further optimized, which not only optimizes the electrical performance of the PCB, but also improves the reliability and signal transmission efficiency of the antenna system, and is particularly suitable for high-frequency, high-performance millimeter-wave communications.

[0062] Specifically, the second laser hole 610 connects the reference ground layer 130 and the digital control-power layer 200, which can provide a stable ground potential reference and ensure good electrical connection between the digital control and power layers 230, thereby reducing noise interference and signal distortion. The buried hole 620 connects the reference ground layer 130 and the second ground layer 500, which can effectively provide a channel for current between different layers, while avoiding the intersection and interference of signal paths, thereby ensuring the stability and integrity of the signal.

[0063] See also Figure 1 As shown, according to some embodiments of the present invention, the millimeter wave phased array antenna PCB stacking structure also includes a third laser hole 630, a fourth laser hole 640 and a digital blind hole 650, the third laser hole 630 sequentially connects the PCB bottom layer 400, the second ground layer 500 and the RF power layer 300, the fourth laser hole 640 connects the PCB bottom layer 400 and the second ground layer 500, and the digital blind hole 650 sequentially connects the PCB bottom layer 400, the second ground layer 500, the RF power layer 300 and the digital control-power layer 200.

[0064] By setting the third laser hole 630, the fourth laser hole 640 and the digital blind hole 650, the electrical connection and signal transmission of the PCB stacking structure can be optimized, and the integration, reliability and high-frequency performance of the PCB stacking structure are significantly improved, which is particularly suitable for millimeter wave applications of high-frequency and high-speed signal transmission.

[0065] Specifically, the third laser hole 630 connects the PCB bottom layer 400, the second ground layer 500 and the RF power layer 300, effectively improving the transmission stability of the RF signal and reducing the loss; the fourth laser hole 640 connects the PCB bottom layer 400 and the second ground layer 500, enhancing the stability of the ground potential reference and reducing noise interference; the digital blind hole 650 connects multiple electrical layers, including the bottom layer, the ground layer, the RF power layer 300 and the digital control-power layer 200, ensuring efficient connection between the layers and improving the stability of signal transmission and the overall electrical performance. Through these designs, the system See also Figure 1 As shown, according to some embodiments of the present invention, the millimeter wave phased array antenna PCB stacking structure also includes a controlled depth blind hole 660 and a through hole 670, the controlled depth blind hole 660 sequentially connects the radiation patch layer 110, the coupling feed layer 120 and the reference ground layer 130, and the through hole 670 sequentially connects the array element layer 100, the digital control-power supply layer 200, the RF power layer 300, the second ground layer 500 and the PCB bottom layer 400.

[0066] By setting controlled-depth blind holes 660 and through holes 670, the millimeter-wave phased array antenna PCB stacking structure can further optimize signal transmission, ground potential connection and interlayer electrical isolation, and can achieve more efficient interlayer connection, thereby improving the overall performance of the antenna system, and is particularly suitable for high-frequency and high-speed millimeter-wave applications.

[0067] Specifically, the depth-controlled blind via 660 sequentially connects the radiation patch layer 110, the coupling feed layer 120 and the reference ground layer 130, which can effectively provide a stable electrical channel between the radiation patch and the ground layer, enhance the stability of the ground reference, reduce signal loss and interference, and improve radiation performance. The through hole 670 sequentially connects the array element layer 100, the digital control-power layer 200, the RF power layer 300, the second ground layer 500 and the PCB bottom layer 400, ensuring a stable connection between multiple electrical layers, promoting the effective transmission of signals, digital control and power, optimizing signal integrity and improving system reliability.

[0068] See also Figure 1 As shown, according to some embodiments of the present invention, the millimeter wave phased array antenna PCB stacking structure also includes a back-drilled hole 680, and the back-drilled hole 680 is used to remove the stub dead area of ​​the array element layer 100, the digital control-power supply layer 200, the RF power layer 300 and the second ground layer 500.

[0069] By providing the back-drilled holes 680 , the millimeter wave phased array antenna PCB stacked structure can effectively remove the stub dead area of ​​the array element layer 100 , thereby improving the quality of signal transmission.

[0070] Specifically, by removing these dead zones, back-drilled vias 680 reduce parasitic capacitance and inductance between electrical layers, reduce signal reflections and unnecessary electromagnetic interference, and improve the signal integrity and stability of the system. In addition, back-drilled vias 680 help reduce the length of the signal path and optimize the transmission of high-frequency signals, especially in the millimeter wave frequency band, which can significantly improve the performance of the system and enhance the efficiency and response speed of the antenna array.

[0071] The following is a description of the method for preparing the PCB laminate structure provided by the present invention. The method for preparing the PCB laminate structure described below and the millimeter wave phased array antenna PCB laminate structure described above can correspond to each other.

[0072] See also Figure 2 and Figure 3 As shown, the method for preparing a PCB laminate structure provided by an embodiment of the present invention includes the following steps.

[0073] S210, the first ground layer 210, the digital signal routing layer 220, the power layer 230, the RF power layer 300 and the second ground layer 500 are pressed together to form a first stacked structure, and vias and a first laser hole are drilled on the first stacked structure. The vias sequentially connect the second ground layer 500, the RF power layer 300 and the digital control-power layer 200, and the first laser hole connects the second ground layer 500 and the RF power layer 300.

[0074] S220, the reference ground layer 130, the first stacked structure and the PCB bottom layer 400 are pressed together to form a second stacked structure, and a second laser hole 610, a third laser hole 630, a fourth laser hole 640, a buried hole 620 and a digital blind hole 650 are drilled on the second stacked structure, the second laser hole 610 connects the reference ground layer 130 and the digital control-power layer 200, the buried hole 620 connects the reference ground layer 130 and the second ground layer 500, the third laser hole 630 connects the PCB bottom layer 400, the second ground layer 500 and the RF power layer 300 in sequence, the fourth laser hole 640 connects the PCB bottom layer 400 and the second ground layer 500, and the digital blind hole 650 connects the PCB bottom layer 400, the second ground layer 500, the RF power layer 300 and the digital control-power layer 200 in sequence.

[0075] S230, pressing the second radiation patch layer 112, the coupling feed layer 120 and the second stacked structure to form a third stacked structure, drilling a first depth-controlled blind hole 660 on the third stacked structure, the first depth-controlled blind hole 660 connecting the second radiation patch layer 112, the coupling feed layer 120 and the second stacked structure.

[0076] S240, pressing the first radiation patch layer 111 and the third stacked structure to form a fourth stacked structure, drilling a second depth-controlled blind hole 660 in the fourth stacked structure, the second depth-controlled blind hole 660 connecting the first radiation patch layer 111 and the third stacked structure.

[0077] S250, drilling a through hole 670 on the fourth stacked structure, the through hole 670 sequentially connecting the array element layer 100, the digital control-power supply layer 200, the RF power layer 300, the second ground layer 500 and the PCB bottom layer 400, and forming a back-drilled hole 680 on the basis of the through hole 670 to remove the stub dead area of ​​the array element layer 100.

[0078] The PCB laminate structure preparation method provided by the present invention simplifies the processing technology by optimizing the pressing sequence and punching sequence of each electrical layer, effectively improves the reliability of the PCB laminate structure, reduces the processing difficulty, and is suitable for high-frequency and high-speed applications such as millimeter-wave phased array antennas and other fields.

[0079] Specifically, the method includes laminating and drilling multiple electrical layers in sequence, involving various hole types such as vias, laser holes, controlled depth blind holes 660, buried holes 620, digital blind holes 650 and through holes 670, so as to achieve electrical connection between layers. In particular, back drilling is performed after drilling through holes 670 to remove stub dead zones, thereby reducing parasitic effects in signal transmission and optimizing signal integrity and high-frequency performance.

[0080] Specifically, in step S210, the first layer 210, the digital signal routing layer 220, the power layer 230, the RF power layer 300 and the second layer 500 are pressed together to form a first laminate structure, and vias and laser holes are drilled to ensure reliable electrical connection between the layers. The design of vias and laser holes accurately connects the key electrical layers, ensures effective connection between the signal and the power layer 230, and reduces interference and loss in signal transmission. Through the optimization of lamination and drilling, multiple complex operation steps are avoided and the production process is simplified.

[0081] In step S220, the connectivity between different electrical layers, especially the connection between the reference ground layer 130 and other electrical layers, is enhanced through further lamination and the design of multiple laser holes, buried vias 620 and blind vias. Through the setting of digital blind vias 650, multiple electrical layers can be effectively connected, the signal transmission path is optimized, and signal distortion is reduced. The design of buried vias 620 and laser vias reduces unnecessary parasitic effects and optimizes signal integrity and electromagnetic compatibility.

[0082] In step S230, by laminating the second radiation patch layer 112 and the coupling feed layer 120 with the second laminate structure to form a third laminate structure, the transmission path of the RF signal is optimized and the loss of the high-frequency signal is reduced. The drilling of the depth-controlled blind hole 660 ensures the depth control between the signal and power layers 230, improves the accuracy of the interlayer connection, and reduces unnecessary electrical distortion. The design of the third laminate enhances the mechanical and electrical consistency between the layers and improves the stability of the overall structure.

[0083] In step S240, by laminating the first radiation patch layer 111 and the third laminate structure to form a fourth laminate structure, the overall stability and strength of the PCB structure are enhanced, which is particularly suitable for high-frequency applications. The depth-controlled blind hole 660 drilled in this step ensures the accuracy of the electrical connection between layers, helps to optimize signal processing performance, and reduces noise during signal transmission. Through the precise depth-controlled hole design, unnecessary electrical noise can be effectively isolated, further improving the quality of the signal.

[0084] In step S250, the backdrilling process effectively reduces the parasitic inductance and capacitance during signal transmission by removing the stub area of ​​the inner layer of the PCB, optimizes signal integrity, and can significantly reduce reflections and noise in high-speed and high-frequency circuits. In addition, the backdrilling removes unnecessary conductive materials, reduces the complexity of the current path in the circuit, reduces the potential risk of electrical failure, and improves the overall reliability of the PCB.

[0085] Specifically, in high-speed circuits, the stub area can cause signal reflection, resulting in signal loss and delay. Backdrilling technology can ensure that the signal propagates along the shortest and most direct path, improve the rise time and fall time of the signal, and improve high-frequency performance.

[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A millimeter wave phased array antenna PCB laminate structure, characterized in that: include: Array element layer, digital control-power supply layer, RF power layer and PCB bottom layer; The array element layer includes a radiation patch layer, a coupling feed layer and a reference ground layer which are stacked, the digital control-power supply layer includes a first ground layer, a digital signal routing layer and a power supply layer which are stacked, a radio frequency power division network circuit is provided on the radio frequency power layer, the PCB bottom layer, the radio frequency power layer, the digital control-power supply layer and the array element layer are stacked in sequence, and a second ground layer is provided between the radio frequency power layer and the PCB bottom layer.

2. The millimeter wave phased array antenna PCB laminate structure according to claim 1, characterized in that: The radiation patch layer includes a first radiation patch layer and a second radiation patch layer which are stacked, and the first radiation patch layer is a top layer of the PCB.

3. The millimeter wave phased array antenna PCB laminate structure according to claim 2, characterized in that: At least one of an antenna array element, a digital control chip, a power chip, a connector and a passive device is arranged on the top layer of the PCB.

4. The millimeter wave phased array antenna PCB laminate structure according to claim 1, characterized in that: At least one of a radio frequency transceiver chip, a power amplifier chip, a digital control chip, a power chip, a connector, a passive device and a power division network circuit is arranged on the bottom layer of the PCB.

5. The millimeter wave phased array antenna PCB laminate structure according to any one of claims 1 to 4, characterized in that: It also includes a via hole and a first laser hole, wherein the via hole sequentially connects the second ground layer, the radio frequency power layer and the digital control-power layer, and the first laser hole connects the second ground layer and the radio frequency power layer.

6. The millimeter wave phased array antenna PCB laminate structure according to any one of claims 1 to 4, characterized in that: It also includes a second laser hole and a buried hole, wherein the second laser hole connects the reference ground layer and the digital control-power layer, and the buried hole connects the reference ground layer and the second ground layer.

7. The millimeter wave phased array antenna PCB laminate structure according to any one of claims 1 to 4, characterized in that: It also includes a third laser hole, a fourth laser hole and a digital blind hole, wherein the third laser hole sequentially connects the PCB bottom layer, the second ground layer and the RF power layer, the fourth laser hole connects the PCB bottom layer and the second ground layer, and the digital blind hole sequentially connects the PCB bottom layer, the second ground layer, the RF power layer and the digital control-power layer.

8. The millimeter wave phased array antenna PCB laminate structure according to any one of claims 1 to 4, characterized in that: It also includes depth-controlled blind holes and through holes, wherein the depth-controlled blind holes sequentially connect the radiation patch layer, the coupling feed layer and the reference ground layer, and the through holes sequentially connect the array element layer, the digital control-power supply layer, the RF power layer, the second ground layer and the PCB bottom layer.

9. The millimeter wave phased array antenna PCB laminate structure according to claim 8, characterized in that: It also includes a back-drilled hole, and the back-drilled hole is used to remove the stub dead area of ​​the array element layer.

10. A method for preparing a PCB laminate structure, characterized in that: include: Laminating a first ground layer, a digital signal routing layer, a power layer, a radio frequency power layer, and a second ground layer to form a first stacked structure, drilling a via hole and a first laser hole on the first stacked structure, wherein the via hole sequentially connects the second ground layer, the radio frequency power layer, and the digital control-power layer, and the first laser hole connects the second ground layer and the radio frequency power layer; The reference ground layer, the first stacked structure and the PCB bottom layer are pressed together to form a second stacked structure, and a second laser hole, a third laser hole, a fourth laser hole, a buried hole and a digital blind hole are drilled on the second stacked structure, the second laser hole connects the reference ground layer and the digital control-power layer, the buried hole connects the reference ground layer and the second ground layer, the third laser hole sequentially connects the PCB bottom layer, the second ground layer and the RF power layer, the fourth laser hole connects the PCB bottom layer and the second ground layer, and the digital blind hole sequentially connects the PCB bottom layer, the second ground layer, the RF power layer and the digital control-power layer; Laminating the second radiation patch layer, the coupling feed layer and the second stacked structure to form a third stacked structure, and drilling a first depth-controlled blind hole on the third stacked structure, wherein the first depth-controlled blind hole connects the second radiation patch layer, the coupling feed layer and the second stacked structure; Laminating the first radiation patch layer and the third stacked structure to form a fourth stacked structure, drilling a second depth-controlled blind hole on the fourth stacked structure, wherein the second depth-controlled blind hole connects the first radiation patch layer and the third stacked structure; A through hole is drilled on the fourth stacked structure, and the through hole sequentially connects the array element layer, the digital control-power supply layer, the RF power layer, the second ground layer and the PCB bottom layer. A back drilled hole is formed on the basis of the through hole to remove the stub dead area of ​​the array element layer.

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