Electrochemical device and electric equipment

By setting a specific bonding structure between the housing and electrode assembly of the electrochemical device, the problems of electrochemical device squirting and damage to the outer ring electrode sheet are solved, and safety and reliability are improved.

CN119698725APending Publication Date: 2025-03-25DONGGUAN AMPEREX TECH
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Patent Information

Application Number
CN202380059113.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-12-01
Publication Date
2025-03-25

AI Technical Summary

Technical Problem

When existing electrochemical devices fall, there is a risk of failure due to the internal short circuit and top seal break due to the squirming of the internal electrode assembly.

Method used

By providing a specific adhesive structure between the housing and the electrode assembly, including a first adhesive layer, a second adhesive layer and a third adhesive layer, the electrode assembly is ensured that the electrode assembly does not fully bond to the housing when subjected to impact, thereby reducing the risk of twitching and damage to the outer ring electrode sheet.

Benefits of technology

It effectively reduces the risk of electrochemical devices moving when falling and damage to the outer ring pole sheet, and improves the safety and reliability of electrochemical devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses an electrochemical device and electric equipment. The electrochemical device comprises a shell, an electrode assembly and a bonding piece, the shell comprises a first side wall, the electrode assembly is arranged in the shell and comprises a first side face adjacent to the first side wall, and the first side face comprises a second area, a first area and a third area which are sequentially arranged in the first direction. The bonding member is located between the case and the electrode assembly. The bonding piece comprises a first side and a second side which are opposite, the first side comprises a first bonding area bonded with the first side wall, and the second side comprises a second bonding area bonded with the second area, a third bonding area bonded with the third area and a first non-bonding area located between the second bonding area and the third bonding area. In the second direction, the projection of the first bonding area is overlapped with the first non-bonding area, and the second direction is the direction in which the first side wall is opposite to the first side face. The first non-bonding area of the bonding piece is not bonded with the first side surface, so that the risk that the electrode assembly is damaged is reduced.
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Description

Technical Field

[0001] The present application relates to the field of energy storage technology, and in particular to an electrochemical device and an electrical equipment. Background Art

[0002] In order to improve the failure problems of internal short circuit, breaking of top seal, etc. caused by the movement of internal electrode components when electrochemical devices such as batteries fall, a double-sided adhesive layer is usually provided between the electrode assembly and the shell of the electrochemical device, with one side bonded to the shell and the other side bonded to the electrode assembly, so as to suppress the movement of the electrode assembly. This reduces the failure risk of the electrochemical device when it falls to a certain extent and improves the safety of the electrochemical device. Summary of the invention

[0003] However, the inventors of the present application have discovered that the existing structure of bonding the electrode assembly to the shell with double-sided tape can suppress the movement of the electrode assembly when the electrochemical device falls, but there is a risk of easily tearing the foil on the outer ring of the electrode assembly, causing an internal short circuit.

[0004] In view of this, the present application provides an electrochemical device and electrical equipment, which aim to suppress the movement of the electrode assembly relative to the shell while reducing the risk of damage to the outer foil of the electrode assembly, thereby improving the safety of the electrochemical device.

[0005] In a first aspect of the present application, an electrochemical device is provided, the electrochemical device comprising a housing, an electrode assembly and an adhesive. The housing comprises a first side wall, the electrode assembly is arranged in the housing, the electrode assembly comprises a first side surface adjacent to the first side wall, the first side surface comprises a first region, a second region and a third region, and along a first direction, the first region is located between the second region and the third region. The adhesive is located between the housing and the electrode assembly, the adhesive comprises a first side and a second side opposite to each other, the first side is adjacent to the housing, the second side is away from the housing, the first side comprises a first adhesive layer, the first adhesive layer comprises a first adhesive region bonded to the first side wall; the second side comprises a second adhesive layer and a third adhesive layer, the second adhesive layer comprises a second adhesive region bonded to the second region, the third adhesive layer comprises a third adhesive region bonded to the third region, the surface of the second side comprises a first non-adhesive region not bonded to the first region, the first non-adhesive region is located between the second adhesive region and the third adhesive region. Along the second direction, the projection of the first adhesive layer overlaps with the first non-adhesive region, and the second direction is the direction opposite to the first side wall and the first side surface.

[0006] The present application arranges an adhesive between the first side surface and the first side wall, and fixes the relative position of the shell and the electrode assembly through the first adhesive layer, the second adhesive layer and the third adhesive layer of the adhesive, which is beneficial to reducing the risk of movement of the electrode assembly when the electrochemical device is impacted, and a first non-bonding area that is not bonded to the first side surface is arranged on the adhesive, which is beneficial to reducing the impact force transmitted to the electrode assembly by the adhesive when the electrochemical device is impacted, thereby reducing the risk of damage to the outer ring electrode sheet of the electrode assembly.

[0007] In some embodiments, the adhesive member further comprises a substrate layer, the first adhesive layer is disposed on the surface of the substrate layer facing the housing, and the second adhesive layer and the third adhesive layer are disposed on the surface of the substrate layer facing the electrode assembly. Such an arrangement does not require a composite multi-layer adhesive tape to achieve bonding between the housing and the electrode assembly, thereby facilitating a reduction in the overall thickness of the electrochemical device and improving the energy density of the electrochemical device.

[0008] In some embodiments, the surface of the first side further includes a second non-bonding area and a third non-bonding area that are not bonded to the first side wall, and along the first direction, the first bonding area is located between the second non-bonding area and the third non-bonding area; along the second direction, the projection of the second non-bonding area overlaps with the second bonding area, and the projection of the third non-bonding area overlaps with the third bonding area. This arrangement reduces the pulling force of the adhesive on the first side when the electrochemical device is impacted, thereby reducing the risk of damage to the outer ring pole piece of the electrode assembly.

[0009] In some embodiments, along the second direction, the first non-adhesive area covers a projection of the first adhesive area, the projection of the second non-adhesive area covers the second adhesive area, and the projection of the third non-adhesive area covers the third adhesive area.

[0010] In some embodiments, along the first direction, the distance between the first bonding area and the second bonding area is greater than 0, and the distance between the first bonding area and the third bonding area is greater than 0. This arrangement allows the adhesive to have a part that is neither bonded to the first side wall nor to the first side surface. When the electrochemical device is impacted, the force of the shell is transmitted to the electrode assembly and is absorbed by the local deformation dissipation of the adhesive, thereby suppressing the relative position movement of the electrode assembly and the shell, and further reducing the force transmitted by the adhesive to the first side surface, thereby reducing the risk of damage to the outer ring electrode sheet of the electrode assembly.

[0011] In some embodiments, along the second direction, the projection of the first bonding area covers the first non-bonding area, the projection of the first bonding area overlaps with the second bonding area, and the projection of the first bonding area overlaps with the third bonding area. Such a configuration is conducive to increasing the bonding area between the adhesive and the shell, and also allows the adhesive to have a portion that is bonded to the first side wall and the first side surface at the same time, thereby facilitating the firmness of the bonding between the electrode assembly and the shell, further reducing the risk of relative position movement between the electrode assembly and the shell, and effectively reducing the force transmitted to the first side surface by the adhesive.

[0012] In some embodiments, a portion of the surface of the substrate layer facing the electrode assembly is exposed to form a first non-bonding area; a portion of the surface of the substrate layer facing the shell is exposed to form a second non-bonding area and a third non-bonding area. This arrangement does not require a composite multi-layer tape to achieve that a portion of the adhesive is not bonded to the shell, and a portion of the adhesive is not bonded to the first side, thereby helping to reduce the overall thickness of the electrochemical device and improve the energy density of the electrochemical device.

[0013] In some embodiments, the adhesive member also includes a first non-adhesive layer, a second non-adhesive layer and a third non-adhesive layer, the first non-adhesive layer is bonded to the surface of the second adhesive layer and / or the third adhesive layer to form a first non-adhesive area; the second non-adhesive layer is bonded to the side surface of the first adhesive layer facing away from the second area to form a second non-adhesive area; the third non-adhesive layer is bonded to the side surface of the first adhesive layer facing away from the third area to form a third non-adhesive area. In this way, after the first adhesive layer, the second adhesive layer and the third adhesive layer are directly coated on the substrate layer, the second non-adhesive area and the third non-adhesive area are formed by bonding the second non-adhesive layer and the third non-adhesive layer on the first adhesive layer, and the first non-adhesive area is formed by bonding the first non-adhesive layer on the second adhesive layer and / or the third adhesive layer. The area and position of the first non-adhesive area, the second non-adhesive area and the third non-adhesive area can be adjusted by adjusting the area and setting position of the first non-adhesive layer, the second non-adhesive layer and the third non-adhesive layer, so that the formation method and adjustment method of the non-adhesive area have the advantages of simple operation, high efficiency and low cost.

[0014] In some embodiments, the substrate layer includes a first substrate portion and a second substrate portion, the first substrate portion is provided with a second adhesive layer and a portion of the first adhesive layer, and the second substrate portion is provided with a third adhesive layer and a portion of the first adhesive layer. The first substrate portion and the second substrate portion are arranged along a first direction; or, the first substrate portion and the second substrate portion are arranged along a third direction, and the third direction is perpendicular to the first direction and the second direction.

[0015] In some embodiments, along the first direction, the width of the electrode assembly is W, and along the third direction, the length of the electrode assembly is L, and the third direction is perpendicular to the first direction and the second direction.

[0016] In some embodiments, along the first direction, the distance between the center of the first bonding area and the center of the first side surface is D1, satisfying: D1≤0.1W, which is conducive to promoting more uniform pulling of the shell on the electrode assembly, further suppressing the movement of the battery cell and reducing the risk of damage to the outer ring electrode of the electrode assembly.

[0017] In some embodiments, along the third direction, the distance between the center of the first bonding area and the center of the first side surface is D2, satisfying: D2≤0.1L, which is conducive to promoting more uniform pulling of the shell on the electrode assembly, further inhibiting the movement of the battery cell and reducing the risk of damage to the outer ring electrode of the electrode assembly.

[0018] In some embodiments, along the first direction, the width of the first bonding area is W1, satisfying: 0.3W≤W1≤0.8W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring pole piece of the electrode assembly.

[0019] In some embodiments, along the third direction, the length of the first bonding area is L1, satisfying: 0.4L≤L1≤0.8L. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0020] In some embodiments, along the first direction, the width of the second bonding area is w1, satisfying: 0.05W≤w1≤0.45W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0021] In some embodiments, along the first direction, the width of the third bonding area is w2, satisfying: 0.05W≤w2≤0.45W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring pole piece of the electrode assembly.

[0022] In some embodiments, along the third direction, the length of the first bonding area is L1, and the length of the second bonding area is l1, satisfying: l1≥0.4L1. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring pole piece of the electrode assembly.

[0023] In some embodiments, along the third direction, the length of the first bonding area is L1, and the length of the third bonding area is l2, satisfying: l2≥0.4L1. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring pole piece of the electrode assembly.

[0024] In some embodiments, the second bonding area includes a plurality of second sub-bonding areas spaced apart along the third direction, which is beneficial to further reduce the risk of the electrode assembly moving and the risk of the outer ring pole piece of the electrode assembly being damaged.

[0025] In some embodiments, the third bonding area includes a plurality of third sub-bonding areas spaced apart along the third direction, which is beneficial to further reduce the risk of the electrode assembly moving and the risk of the outer ring pole piece of the electrode assembly being damaged.

[0026] In some embodiments, along the first direction, the distance from the first bonding area to the edge of one side of the substrate layer is W2, satisfying: 0≤W2≤0.45W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0027] In some embodiments, along the first direction, the distance from the first bonding area to the edge of the other side of the substrate layer is W3, satisfying: 0≤W3≤0.45W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0028] In some embodiments, along the third direction, the distance from the first bonding area to the edge of one side of the substrate layer is L2, satisfying: 0≤L2≤0.4L1. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0029] In some embodiments, along the third direction, the distance from the first bonding area to the edge of the other side of the substrate layer is L3, satisfying: 0≤L3≤0.4L1. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0030] In some embodiments, along the first direction, the distance between the second bonding area and the first bonding area is H1, satisfying: H1≤0.25W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring pole piece of the electrode assembly.

[0031] In some embodiments, along the first direction, the distance between the third bonding area and the first bonding area is H2, satisfying: H2≤0.25W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring pole piece of the electrode assembly.

[0032] In some embodiments, along the second direction, the projection of the first bonding area has a first overlapping area with the second bonding area, and the width of the first overlapping area along the first direction is q1, q1≤0.32W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring pole piece of the electrode assembly.

[0033] In some embodiments, along the second direction, the projection of the first bonding area has a second overlapping area with the third bonding area, and the width of the second overlapping area along the first direction is q2, q2≤0.32W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring pole piece of the electrode assembly.

[0034] In some embodiments, the electrode assembly also includes a second side, a third side and a fourth side. The second side is arranged opposite to the first side along the second direction, the third side is arranged opposite to the fourth side along the first direction, and the second bonding layer is bonded to both the second region and the third side. Such a configuration enables the adhesive to transfer the force of the shell to the third side of the electrode assembly. When the electrode assembly is a winding structure, the pole piece located on the arc-shaped third side is more likely to disperse the force transferred by the adhesive, thereby helping to reduce the risk of damage to the outer ring pole piece of the electrode assembly; when the electrode assembly is a stacked structure, the adhesive is bonded to the edge of the diaphragm, positive pole piece or negative pole piece on the third side, which is not easy to cause damage to the pole piece of the electrode assembly and helps to inhibit the relative sliding between the diaphragm and the positive pole piece or the negative pole piece.

[0035] In some embodiments, the third adhesive layer is bonded to both the third region and the fourth side. This arrangement enables the adhesive to transfer the force of the shell to the fourth side of the electrode assembly. When the electrode assembly is a winding structure, the pole piece located on the arc-shaped fourth side can more easily disperse the force transferred by the adhesive, which is beneficial to reducing the risk of damage to the outer ring pole piece of the electrode assembly; when the electrode assembly is a stacked structure, the adhesive is bonded to the edge of the diaphragm, positive pole piece or negative pole piece on the fourth side, which is not easy to cause damage to the pole piece of the electrode assembly, and helps to inhibit the relative sliding between the diaphragm and the positive pole piece or the negative pole piece.

[0036] In some embodiments, the second adhesive layer is bonded to the second side surface, thereby increasing the bonding area between the adhesive and the electrode assembly, thereby facilitating improving the firmness of the connection between the adhesive and the electrode assembly.

[0037] In some embodiments, the third adhesive layer is bonded to the second side surface, thereby increasing the bonding area between the adhesive and the electrode assembly, thereby facilitating improving the firmness of the connection between the adhesive and the electrode assembly.

[0038] In some embodiments, the first side further includes a fourth region and a fifth region, and along the third direction, the first region is located between the fourth region and the fifth region, and the second side further includes a fourth bonding layer and a fifth bonding layer, and the fourth bonding layer includes a fourth bonding area bonded to the fourth region; the fifth bonding layer includes a fifth bonding area bonded to the fifth region; along the third direction, the first non-bonding area is located between the fourth bonding area and the fifth bonding area, and the third direction is perpendicular to the first direction and the second direction. This is conducive to further reducing the risk of the electrode assembly moving when the electrochemical device is impacted and the risk of damage to the outer ring pole piece of the electrode assembly.

[0039] In some embodiments, the fourth bonding area includes a plurality of fourth sub-bonding areas spaced apart along the first direction, which is beneficial to further reduce the risk of the electrode assembly moving and the risk of the outer ring pole piece of the electrode assembly being damaged.

[0040] In some embodiments, the fifth bonding area includes a plurality of fifth sub-bonding areas spaced apart along the first direction, which is beneficial to further reduce the risk of the electrode assembly moving and the risk of the outer ring pole piece of the electrode assembly being damaged.

[0041] In some embodiments, the electrode assembly further includes a fifth side surface and a sixth side surface disposed opposite to each other along the third direction, and the fourth bonding layer is further bonded to the fifth side surface, which is beneficial to further reduce the risk of the electrode assembly moving and the risk of the outer ring pole piece of the electrode assembly being damaged.

[0042] In some embodiments, the fourth adhesive layer is also bonded to the second side surface, thereby increasing the bonding area between the adhesive and the electrode assembly, thereby facilitating improving the firmness of the connection between the adhesive and the electrode assembly.

[0043] In some embodiments, the fifth bonding layer is also bonded to the sixth side surface, which is helpful to further reduce the risk of the electrode assembly moving and the risk of the outer ring pole piece of the electrode assembly being damaged.

[0044] In some embodiments, the fifth adhesive layer is also bonded to the second side surface, thereby increasing the bonding area between the adhesive and the electrode assembly, thereby facilitating improving the firmness of the connection between the adhesive and the electrode assembly.

[0045] In a second aspect of the present application, an electrical device is provided, comprising the electrochemical device in any one of the above embodiments. The risk of the electrochemical device moving during a drop test and the risk of the electrode assembly being damaged are reduced, thereby improving the reliability of the electrical device. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 A schematic diagram of the structure of an electrochemical device provided in one embodiment of the present application.

[0047] Figure 2 for Figure 1Schematic diagram of the exploded electrochemical device.

[0048] Figure 3 A cross-sectional view of an electrochemical device provided in one embodiment of the present application.

[0049] Figure 4 A cross-sectional view of an adhesive and an electrode assembly provided in accordance with an embodiment of the present application.

[0050] Figure 5 A cross-sectional view of an adhesive and an electrode assembly provided in accordance with another embodiment of the present application.

[0051] Figure 6 A side view of an adhesive member provided in accordance with an embodiment of the present application.

[0052] Figure 7 A side view of an adhesive member provided according to another embodiment of the present application.

[0053] Figure 8 A side view of an adhesive member provided in yet another embodiment of the present application.

[0054] Fig. 9 A side view of an adhesive member provided in yet another embodiment of the present application.

[0055] Fig.10 A side view of an adhesive member provided in yet another embodiment of the present application.

[0056] Fig.11 A top view of an adhesive and an electrode assembly provided in accordance with an embodiment of the present application.

[0057] Fig.12 A top view of an adhesive and an electrode assembly provided in accordance with another embodiment of the present application.

[0058] Fig.13 A schematic diagram of an electrical device provided in accordance with an embodiment of the present application.

[0059] Main component symbols

[0060] Electrochemical device 100

[0061] Housing 10

[0062] The first side wall 11

[0063] Second side wall 12

[0064] The third side wall 13

[0065] Fourth side wall 14

[0066] Fifth side wall 15

[0067] Sixth side wall 16

[0068] Electrode assembly 20

[0069] First side 21

[0070] First Area 211

[0071] Second area 212

[0072] Third Area 213

[0073] Second side 22

[0074] The third side 23

[0075] Fourth side 24

[0076] Fifth side 25

[0077] Sixth side 26

[0078] Adhesive 30

[0079] First side 31

[0080] First adhesive layer 311

[0081] First bonding area 3111

[0082] Second non-bonding area 312

[0083] The third non-bonding area 313

[0084] Second side 32

[0085] The first non-adhesive area 321

[0086] Second adhesive layer 322

[0087] Second bonding area 3221

[0088] The third adhesive layer 323

[0089] The third bonding area 3231

[0090] First non-adhesive layer 33

[0091] The second non-adhesive layer 34

[0092] The third non-adhesive layer 35

[0093] First overlapping area 36

[0094] Second overlapping area 37

[0095] Base material layer 301

[0096] First substrate portion 3011

[0097] Second base material portion 3012

[0098] Tab 50

[0099] Equipment body 200

[0100] Electrical equipment 1000

[0101] First direction X

[0102] Second direction Y

[0103] The third direction Z DETAILED DESCRIPTION

[0104] The technical solutions in the embodiments of the present application will be described below. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0105] It should be noted that in this application, the center of a region refers to the center of gravity of the plane shape of the region when the region is a continuous whole. It can be understood that the center of gravity of the plane shape can be determined by the hanging method. The plane shape is suspended with a thin line, and a straight line is made in the vertical direction from the starting point of the thin line. The plane shape is suspended again with an endpoint different from the first time, and another straight line is made according to the previous method. The intersection of the two straight lines is the center of gravity of the plane shape. When the region is composed of multiple discrete regions, the center of the region is the center of the minimum circumscribed circle containing the multiple discrete regions. It can be understood that the minimum circumscribed circle is a circle containing the multiple discrete regions and having the smallest radius.

[0106] It is understood that when a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component. When a component is considered to be "disposed on" another component, it can be directly disposed on the other component or there may be an intermediate component. The terms "top", "bottom" and similar expressions used herein are for illustrative purposes only.

[0107] The terms "first", "second", etc. are only used to distinguish different objects and shall not be understood as indicating or implying relative importance or implying the quantity, specific order or primary and secondary relationship of the technical features indicated.

[0108] The term "perpendicular" is used to describe the ideal state between two parts. In actual production or use, the two parts may be approximately perpendicular to each other. The two parts described as "perpendicular" may not be absolutely straight lines or planes, but may be roughly straight lines or planes. From a macroscopic point of view, if the overall extension direction is a straight line or a plane, the parts can be considered "straight" or "plane".

[0109] It should be recognized that the sizes and thicknesses of the components shown in the drawings are for better understanding and more convenient description, and the present application is not limited to the sizes and thicknesses shown in the drawings.

[0110] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0111] Some embodiments of the present application will be described below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0112] See also Figure 1 and Figure 2 The embodiment of the present application provides an electrochemical device 100, which includes a housing 10, an electrode assembly 20, and an adhesive 30. The electrode assembly 20 is disposed in the housing 10, and the adhesive 30 is disposed in the housing 10, and the adhesive 30 is located between the housing 10 and the electrode assembly 20, and the adhesive 30 bonds the housing 10 and the electrode assembly 20.

[0113] In some embodiments, see Figure 1 and Figure 2 The shell 10 includes a first side wall 11 and a second side wall 12 that are opposite to each other, and the electrode assembly 20 is located between the first side wall 11 and the second side wall 12 .

[0114] In some embodiments, see Figure 1 and Figure 2 The housing 10 further includes a third side wall 13, a fourth side wall 14, a fifth side wall 15 and a sixth side wall 16. The third side wall 13 and the fourth side wall 14 are arranged opposite to each other along the first direction X. The first side wall 11 and the second side wall 12 are arranged opposite to each other along the second direction Y. The fifth side wall 15 and the sixth side wall 16 are arranged opposite to each other along the third direction Z. The first direction X is perpendicular to the second direction Y and the third direction Z. The first side wall 11, the second side wall 12, the third side wall 13, the fourth side wall 14, the fifth side wall 15 and the sixth side wall 16 are arranged to form a space for accommodating the electrode assembly 20.

[0115] In some embodiments, the housing 10 is an aluminum-plastic film, and the housing 10 is not limited to the aluminum-plastic film.

[0116] In some embodiments, the electrode assembly 20 includes a positive electrode sheet, a negative electrode sheet and a separator. The positive electrode sheet, the negative electrode sheet and the separator can be stacked to form a laminate structure. The positive electrode sheet, the negative electrode sheet and the separator can also be stacked and then wound to form a wound structure.

[0117] In some embodiments, the positive electrode plate includes a positive electrode current collector and a positive electrode active material layer disposed on the positive electrode current collector; the negative electrode plate includes a negative electrode current collector and a negative electrode active material layer disposed on the negative electrode current collector.

[0118] In some embodiments, a portion of the positive electrode collector is provided with a positive electrode active material layer, and a portion of the positive electrode collector is not provided with a positive electrode active material layer; a portion of the negative electrode collector is provided with a negative electrode active material layer, and a portion of the negative electrode collector is not provided with a negative electrode active material layer.

[0119] Among them, the positive electrode collector and the negative electrode collector can be a metal layer. As an illustrative example, the positive electrode collector can be a metal layer including at least one of aluminum, nickel, tantalum, and titanium, such as aluminum foil. The positive electrode active material layer includes a positive electrode active material, and the positive electrode active material can include at least one of lithium cobalt oxide, lithium nickel cobalt manganese oxide, lithium nickel cobalt aluminum oxide, lithium iron phosphate, lithium manganese iron phosphate, or lithium manganese oxide. The negative electrode collector can be a metal layer including at least one of copper, nickel, tantalum, and titanium, such as copper foil. The negative electrode active material layer includes a negative electrode active material, and the negative electrode active material can include at least one of graphite, hard carbon, soft carbon, silicon, silicon-oxygen material, and silicon-carbon material.

[0120] In some embodiments, the outermost circle of the electrode assembly 20 has a positive electrode current collector layer without a positive electrode active material layer, and the positive electrode current collector is aluminum foil.

[0121] In some embodiments, see Figure 3 The electrode assembly 20 includes a first side surface 21 adjacent to the first side wall 11 . The first side surface 21 includes a first region 211 , a second region 212 , and a third region 213 . Along the first direction X, the first region 211 is located between the second region 212 and the third region 213 .

[0122] In some embodiments, see Figure 3 The electrode assembly 20 further includes a second side surface 22, a third side surface 23 and a fourth side surface 24. Along the second direction Y, the first side surface 21 is disposed opposite to the second side surface 22, and the first side surface 21 is adjacent to the first side wall 11 compared to the second side surface 22. The first side surface 21 is disposed opposite to the first side wall 11, and the second side surface 22 is away from the first side wall 11. The third side surface 23 and the fourth side surface 24 are disposed opposite to each other along the first direction X. When the electrode assembly 20 is a winding structure, the third side surface 23 and the fourth side surface 24 are arc-shaped side surfaces.

[0123] In some embodiments, see Figure 2 The electrode assembly 20 further includes a fifth side surface 25 and a sixth side surface 26 , and the fifth side surface 25 and the sixth side surface 26 are arranged opposite to each other along the third direction Z.

[0124] In some embodiments, see Figure 1and Figure 2 The electrochemical device 100 further includes a tab 50, which is connected to the electrode assembly 20. Along the third direction Z, the tab 50 extends out of the housing 10 from the fifth side 25 or the sixth side 26 of the electrode assembly 20 to lead out the polarity of the electrode assembly 20. When the tab 50 is connected to the positive electrode sheet of the electrode assembly 20, the tab 50 is a positive tab 50, and when the tab 50 is connected to the negative electrode sheet of the electrode assembly 20, the tab 50 is a negative tab 50. The tab 50 can be made of metal copper or metal aluminum, which is not specifically limited here.

[0125] In some embodiments, see Figure 3 The adhesive member 30 includes a first side 31 and a second side 32 that are oppositely arranged. The first side 31 is adjacent to the housing 10 compared to the second side 32, and the second side 32 is away from the housing 10. The first side 31 includes a first adhesive layer 311, the first adhesive layer 311 includes a first adhesive area 3111 bonded to the first side wall 11, the second side 32 includes a second adhesive layer 322 and a third adhesive layer 323, the second adhesive layer 322 includes a second adhesive area 3221 bonded to the second area 212, the third adhesive layer 323 includes a third adhesive area 3231 bonded to the third area 213, and the surface of the second side 32 includes a first non-adhesive area 321 that is not bonded to the first area 211, and the first non-adhesive area 321 is located between the second adhesive area 3221 and the third adhesive area 3231. Along the second direction Y, the projection of the first adhesive area 3111 overlaps with the first non-adhesive area 321. The second direction Y is a direction in which the first side wall 11 and the first side surface 21 are opposite to each other.

[0126] In the present application, an adhesive 30 is arranged between the first side surface 21 and the first side wall 11, and the shell 10 and the electrode assembly 20 are fixed in relative position by the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 of the adhesive 30, which is beneficial to reducing the risk of movement of the electrode assembly 20 when the electrochemical device 100 is impacted, and a first non-adhesive area 321 that is not bonded to the first side surface 21 is arranged on the adhesive 30, which is beneficial to reducing the impact force transmitted to the electrode assembly 20 by the adhesive 30 when the electrochemical device 100 is impacted, thereby reducing the risk of damage to the outer ring electrode sheet of the electrode assembly 20.

[0127] In some embodiments, the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 can be adhesive materials that are sticky at room temperature without activation; the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 can also be adhesive materials that are not sticky at room temperature but are activated after a hot pressing process.

[0128] In some embodiments, the second bonding area 3221 includes a plurality of second sub-bonding areas spaced apart along the third direction Z. In some embodiments, the third bonding area 3231 includes a plurality of third sub-bonding areas spaced apart along the third direction Z. This is beneficial to further reduce the risk of the electrode assembly 20 moving and the risk of the outer ring pole piece of the electrode assembly 20 being damaged.

[0129] In some embodiments, see Figure 4 , the second adhesive layer 322 is bonded to both the second region 212 and the third side surface 23. Such a configuration enables the adhesive 30 to transfer the force of the housing 10 to the third side surface 23 of the electrode assembly 20. When the electrode assembly 20 is a winding structure, the pole piece located on the arc-shaped third side surface 23 is more likely to disperse the force transferred by the adhesive 30, thereby helping to reduce the risk of damage to the outer ring pole piece of the electrode assembly 20; when the electrode assembly 20 is a laminated structure, the adhesive 30 is bonded to the edge of the diaphragm, positive pole piece or negative pole piece on the third side surface 23, which is not easy to cause damage to the pole piece of the electrode assembly 20, and helps to inhibit the relative sliding between the diaphragm and the positive pole piece or the negative pole piece.

[0130] In some embodiments, see Figure 5 The second adhesive layer 322 is bonded to the second side surface 22 . This configuration increases the bonding area between the adhesive 30 and the electrode assembly 20 , thereby facilitating improving the firmness of the connection between the adhesive 30 and the electrode assembly 20 .

[0131] In some embodiments, see Figure 4 , the third adhesive layer 323 is bonded to both the third region 213 and the fourth side surface 24. Such a configuration enables the adhesive 30 to transfer the force of the housing 10 to the fourth side surface 24 of the electrode assembly 20. When the electrode assembly 20 is a winding structure, the pole piece located on the arc-shaped fourth side surface 24 is more likely to disperse the force transferred by the adhesive 30, which is beneficial to reduce the risk of damage to the outer ring pole piece of the electrode assembly 20; when the electrode assembly 20 is a laminated structure, the adhesive 30 is bonded to the edge of the diaphragm, positive pole piece or negative pole piece on the fourth side surface 24, which is not easy to cause damage to the pole piece of the electrode assembly 20, and helps to inhibit the relative sliding between the diaphragm and the positive pole piece or the negative pole piece.

[0132] In some embodiments, see Figure 5 The third adhesive layer 323 is bonded to the second side surface 22 . This configuration increases the bonding area between the adhesive 30 and the electrode assembly 20 , thereby facilitating improving the firmness of the connection between the adhesive 30 and the electrode assembly 20 .

[0133] In an embodiment where the second adhesive layer 322 is bonded to both the second region 212 and the third side 23, and the third adhesive layer 323 is bonded to both the third region 213 and the fourth side 24, the adhesive 30 transfers the force of the shell 10 to both sides of the electrode assembly 20 in the first direction X, which helps to improve the uniformity of the force on the electrode assembly 20.

[0134] In some embodiments, the first side surface 21 further includes a fourth region and a fifth region, and along the third direction Z, the first region 211 is located between the fourth region and the fifth region, and the second side 32 further includes a fourth bonding layer and a fifth bonding layer, and the fourth bonding layer includes a fourth bonding area bonded to the fourth region; the fifth bonding layer includes a fifth bonding area bonded to the fifth region; along the third direction Z, the first non-bonding area 321 is located between the fourth bonding area and the fifth bonding area, and the third direction Z is perpendicular to the first direction X and the second direction Y. This is conducive to further reducing the risk of the electrode assembly 20 moving when the electrochemical device is impacted and the risk of the outer ring pole piece of the electrode assembly 20 being damaged.

[0135] In some embodiments, the fourth bonding area includes a plurality of fourth sub-bonding areas spaced apart along the first direction X. In some embodiments, the fifth bonding area includes a plurality of fifth sub-bonding areas spaced apart along the first direction X. This is beneficial to further reduce the risk of the electrode assembly 20 moving and the risk of the outer ring pole piece of the electrode assembly 20 being damaged.

[0136] In some embodiments, the electrode assembly further includes a fifth side surface and a sixth side surface disposed opposite to each other along the third direction, and the fourth adhesive layer is further bonded to the fifth side surface. In some embodiments, the fifth adhesive layer is further bonded to the sixth side surface. This is conducive to further reducing the risk of the electrode assembly 20 moving and the risk of the outer ring pole piece of the electrode assembly 20 being damaged.

[0137] In some embodiments, the fourth adhesive layer is also bonded to the second side surface 22. In some embodiments, the fifth adhesive layer is also bonded to the second side surface 22. Such a configuration increases the bonding area between the adhesive member 30 and the electrode assembly 20, thereby facilitating the improvement of the firmness of the connection between the adhesive member 30 and the electrode assembly 20.

[0138] In some embodiments, see Figure 3 and Figure 6, the first side 31 also includes a second non-bonding area 312 and a third non-bonding area 313 that are not bonded to the first side wall 11. Along the first direction X, the first bonding area 3111 is located between the second non-bonding area 312 and the third non-bonding area 313. Along the second direction Y, the projection of the second non-bonding area 312 overlaps with the second bonding area 3221, and the projection of the third non-bonding area 313 overlaps with the third bonding area 3231. Such a configuration reduces the pulling force of the adhesive 30 on the first side surface 21 when the electrochemical device 100 is impacted, thereby reducing the risk of damage to the outer ring electrode sheet of the electrode assembly 20.

[0139] In some embodiments, see Figure 3 and Figure 6 Along the second direction Y, the first non-adhesive area 321 covers the projection of the first adhesive area 3111 , the projection of the second non-adhesive area 312 covers the second adhesive area 3221 , and the projection of the third non-adhesive area 313 covers the third adhesive area 3231 .

[0140] In some embodiments, see Figure 3 and Figure 6 , along the first direction X, the distance between the first bonding area 3111 and the second bonding area 3221 is greater than 0, and the distance between the first bonding area 3111 and the third bonding area 3231 is greater than 0. This arrangement allows the adhesive 30 to have a part that is neither bonded to the first side wall 11 nor to the first side surface 21. When the electrochemical device 100 is impacted, the force of the shell 10 is transmitted to the electrode assembly 20 and is dissipated and absorbed by the local deformation of the adhesive 30, thereby suppressing the relative position movement of the electrode assembly 20 and the shell 10, and further reducing the force transmitted to the first side surface 21 by the adhesive 30, thereby reducing the risk of damage to the outer ring electrode sheet of the electrode assembly 20.

[0141] In some other embodiments, see Figure 7 and Figure 8 , along the second direction Y, the projection of the first bonding area 3111 covers the first non-bonding area 321, the projection of the first bonding area 3111 overlaps with the second bonding area 3221, and the projection of the first bonding area 3111 overlaps with the third bonding area 3231. Such a configuration is conducive to increasing the bonding area between the adhesive 30 and the shell 10, and also enables the adhesive 30 to have a part that is bonded to the first side wall 11 and the first side surface 21 at the same time, thereby facilitating the firmness of the bonding between the electrode assembly 20 and the shell 10, further reducing the risk of relative position movement between the electrode assembly 20 and the shell 10, and effectively reducing the force transmitted to the first side surface 21 by the adhesive 30. It can be understood that in this embodiment, the second non-bonding area 312 and the third non-bonding area 313 may exist, or the second non-bonding area 312 and the third non-bonding area 313 may not exist.

[0142] In some embodiments, see Figure 3 , Figures 6 to 8 The adhesive member 30 further includes a substrate layer 301, a first adhesive layer 311 is disposed on the surface of the substrate layer 301 facing the housing 10, and a second adhesive layer 322 and a third adhesive layer 323 are disposed on the surface of the substrate layer 301 facing the electrode assembly 20. Such a configuration does not require a composite multi-layer adhesive tape to achieve bonding between the housing 10 and the electrode assembly 20, thereby helping to reduce the overall thickness of the electrochemical device 100 and improve the energy density of the electrochemical device 100.

[0143] It can be understood that the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 can be formed by coating an adhesive on a preset area of ​​the substrate layer 301; or the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 can be formed by coating the adhesive on both sides of the substrate layer 301 and then removing the adhesive from a part of the area.

[0144] In some embodiments, the material of the substrate layer 301 may include any one of PET (polyethylene terephthalate), PVC (polyvinyl chloride) or PI (polyimide).

[0145] In some embodiments, see Figure 3 , Figures 6 to 8 , a portion of the surface of the substrate layer 301 facing the electrode assembly 20 is exposed to form a first non-bonding area 321; a portion of the surface of the substrate layer 301 facing the housing 10 is exposed to form a second non-bonding area 312 and a third non-bonding area 313. In this way, it is possible to achieve that a portion of the adhesive member 30 is not bonded to the housing 10 and a portion of the adhesive member 30 is not bonded to the first side surface 21 without composite multi-layer adhesive tape, thereby reducing the overall thickness of the electrochemical device 100 and improving the energy density of the electrochemical device 100.

[0146] It is understandable that a covering material may be applied in advance to the preset surface of the substrate layer 301, and then an adhesive material may be applied to the substrate layer 301, so that the surface covered with the covering material forms the first non-adhesive area 321, the second non-adhesive area 312 and the third non-adhesive area 313 which are exposed without being coated with the adhesive material. Alternatively, the first non-adhesive area 321, the second non-adhesive area 312 and the third non-adhesive area 313 may be formed by coating the adhesive material on both sides of the substrate layer 301 and then removing the adhesive material from the local surface, so that the surface of the substrate layer 301 from which the adhesive material is removed is exposed.

[0147] In some embodiments, see Fig. 9The adhesive member 30 further includes a first non-adhesive layer 33, a second non-adhesive layer 34 and a third non-adhesive layer 35. The first non-adhesive layer 33 is bonded to the surface of the second adhesive layer 322 and / or the third adhesive layer 323 to form a first non-adhesive area 321. The second non-adhesive layer 34 is bonded to the surface of the first adhesive layer 311 on the side away from the second area 212 to form a second non-adhesive area 312. The third non-adhesive layer 35 is bonded to the surface of the first adhesive layer 311 on the side away from the third area 213 to form a third non-adhesive area 313. In this way, after the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 are directly coated on the substrate layer 301, the first non-adhesive area 321, the second non-adhesive area 312 and the third non-adhesive area 313 are formed by bonding the first non-adhesive layer 33, the second non-adhesive layer 34 and the third non-adhesive layer 35. The area and position of the first non-adhesive area 321, the second non-adhesive area 312 and the third non-adhesive area 313 can be adjusted by adjusting the area and setting position of the first non-adhesive layer 33, the second non-adhesive layer 34 and the third non-adhesive layer 35, so that the formation method and adjustment method of the non-adhesive area have the advantages of simple operation, high efficiency and low cost.

[0148] It can be understood that the first non-adhesive layer 33, the second non-adhesive layer 34 and the third non-adhesive layer 35 can be layers without adhesive substances on both sides. The first non-adhesive layer 33, the second non-adhesive layer 34 and the third non-adhesive layer 35 can also be layers with adhesive substances on one side and without adhesive substances on the other side. For example, the first non-adhesive layer 33 has adhesive substances on the side facing the first adhesive layer 311, and has no adhesive substances on the side of the first non-adhesive layer 33 facing away from the first adhesive layer 311.

[0149] In some embodiments, see Fig.10 The substrate layer 301 includes a first substrate portion 3011 and a second substrate portion 3012, the first substrate portion 3011 and the second substrate portion 3012 are both independent parts, the first substrate portion 3011 is provided with a second adhesive layer 322 and a portion of the first adhesive layer 311, and the second substrate portion 3012 is provided with a third adhesive layer 323 and a portion of the first adhesive layer 311. The first substrate portion 3011 and the second substrate portion 3012 are arranged along the first direction. This is conducive to reducing the risk of damage to the outer ring pole piece of the electrode assembly 20.

[0150] In some other embodiments, the first substrate portion 3011 and the second substrate portion 3012 are arranged along the third direction Z. This helps to reduce the risk of damage to the outer ring electrode piece of the electrode assembly 20 .

[0151] It can be understood that the surface of the first substrate portion 3011 facing the first region 211 and the surface of the second substrate portion 3012 facing the first region 211 jointly form the first non-adhesive region 321 .

[0152] In some embodiments, see Fig.11 Along the first direction X, the width of the electrode assembly 20 is W, along the third direction Z, the length of the electrode assembly 20 is L, and along the first direction X, the distance between the center of the first bonding area 3111 and the center of the first side surface 21 is D1, satisfying: D1≤0.1W, which is beneficial for the adhesive 30 to suppress the movement of the battery cell and reduce the risk of damage to the outer ring electrode of the electrode assembly 20.

[0153] In some embodiments, see Fig.11 Along the third direction Z, the distance between the center of the first bonding area 3111 and the center of the first side surface 21 is D2, satisfying: D2≤0.1L, which is beneficial for the adhesive 30 to suppress the movement of the battery cell and reduce the risk of damage to the outer ring electrode of the electrode assembly 20.

[0154] In order to verify the influence of each bonding area and non-bonding area of ​​the adhesive member 30 on the electrochemical device 100, the following test was conducted:

[0155] A lithium-ion soft-pack battery with a rectangular maximum projection surface is selected, wherein the length L of the wound electrode assembly 20 inside the lithium-ion soft-pack battery is 87 mm, the width W is 64 mm, and the thickness is 4.8 mm.

[0156] In Examples 1 to 20, the adhesive member 30 includes a first adhesive layer 311, a second adhesive layer 322, a third adhesive layer 323, and a first adhesive area 3111, a second adhesive area 3221, and a third adhesive area 3231. The first adhesive area 3111 coincides with the center of the first side surface 21. On the first side surface 21, along the first direction X, the distance from the first adhesive area 3111 to the edge of one side of the substrate layer 301 is W2, the distance from the first adhesive area 3111 to the edge of the other side of the substrate layer 301 is W3, the distance between the second adhesive area 3221 and the first adhesive area 3111 is H1, the distance between the third adhesive area 3231 and the first adhesive area 3111 is H2, and along the third direction Z, the distance from the first adhesive area 3111 to the edge of one side of the substrate layer 301 is L2, and the distance from the first adhesive area 3111 to the edge of the other side of the substrate layer 301 is L3.

[0157] In Example 17, the second bonding area 3221 includes two second sub-bonding areas spaced apart along the third direction Z, and the interval between the two second sub-bonding areas is 4 mm; the third bonding area 3231 includes two third sub-bonding areas spaced apart along the third direction Z, and the interval between the two third sub-bonding areas is 4 mm.

[0158] In Example 18, please refer to Fig.12The bonding area between the adhesive 30 and the electrode assembly 20 is in the shape of a "U". The second side 32 includes a fourth bonding area and a fifth bonding area bonded to the first side surface 21. Along the third direction Z, the first non-bonding area 321 is located between the fourth bonding area and the fifth bonding area. The third direction Z is perpendicular to the first direction X and the second direction Y. The widths of the fourth bonding area and the fifth bonding area are equal to the width w1 of the second bonding area 322 or the width w2 of the third bonding area 3231.

[0159] In Example 19 and Example 20, along the second direction Y, the projection of the first bonding area 3111 and the second bonding area 3221 have a first overlapping area 36, ​​and the width of the first overlapping area 36 along the first direction X is q1. The projection of the first bonding area 3111 and the third bonding area 3221 have a second overlapping area 37, and the width of the second overlapping area 37 along the first direction X is q2.

[0160] The size parameters of the adhesive member 30 in the above embodiments are shown in Table 1 below.

[0161] In the comparative example, a double-sided tape with a length of 60.9 mm and a width of 38 mm is used to bond the first side wall 11 to the first side surface 21.

[0162] Take 20 batteries from each group for drop pass rate comparison experiment, set the batteries to be tested in the order of six sides and four corners, and the drop height is 1.8m. After the drop is completed, observe whether the shell 10 is broken or leaking, and count the number of batteries with broken or leaking shell 10; if the shell 10 is not broken or leaking, disassemble the lithium-ion soft-pack battery, observe whether the pole piece of the outer ring of the electrode assembly 20 is torn or damaged, and count the number of batteries with torn or damaged outer ring pole piece. Among them, if the shell 10 is not broken and leaking, and the outer ring pole piece is not torn or damaged, it is judged to pass the test; otherwise, it is judged to fail the test. Pass rate = pass number / 20×100%.

[0163] Table 1: Test results of dimensional changes of each adhesive layer in adhesive member 30

[0164]

[0165]

[0166] In some embodiments, see Fig.12 As shown in Table 1, along the first direction X, the width of the first bonding area 3111 is W1, which satisfies: 0.3W≤W1≤0.8W. As can be seen from Table 1, when the condition of 0.3W≤W1≤0.8W is met, the pass rate of the battery drop test is better, which is conducive to reducing the risk of the electrode assembly 20 moving and the risk of the outer ring electrode piece of the electrode assembly 20 being damaged.

[0167] In some embodiments, see Fig.12 As shown in Table 1, along the third direction Z, the length of the first bonding area 3111 is L1, which satisfies: 0.4L≤L1≤0.8L. As can be seen from Table 1, when the condition of 0.4L≤L1≤0.8L is met, the pass rate of the battery drop test is better, which is conducive to reducing the risk of the electrode assembly 20 moving and the risk of damage to the outer ring electrode piece of the electrode assembly 20.

[0168] In some embodiments, see Fig.12 As shown in Table 1, along the third direction Z, the length of the first bonding area 3111 is L1, the length of the second bonding area 3221 is l1, and the length of the third bonding area 3231 is l2, satisfying: l1≥0.4L1 and / or l2≥0.4L1. When the above conditions are met, the pass rate of the battery drop test is better, which is conducive to reducing the risk of the electrode assembly 20 moving and the risk of damage to the outer ring pole piece of the electrode assembly 20. In Examples 1 to 16 and Examples 19 to 20, l1=l2=L1. In Example 17, l1=l2=56mm, the length of l1 does not include the interval of 4mm between the two second sub-bonding areas, and the length of l2 does not include the interval of 4mm between the two third sub-bonding areas. Along the third direction Z, the length of each second sub-bonding area and the length of each third sub-bonding area are both 28mm. In Example 18, l1=l2=L1+L2+L3.

[0169] In some embodiments, see Fig.12 and Table 1, satisfying 0≤L2≤0.4L1 and / or 0≤L3≤0.4L1. When the above conditions are met, it can be seen from Table 1 that the pass rate of the battery drop test is better, which is beneficial to reduce the risk of the electrode assembly 20 moving when the electrochemical device is impacted and the risk of damage to the outer ring electrode piece of the electrode assembly 20.

[0170] In some embodiments, see Fig.12 As shown in Table 1, along the first direction X, the width of the second bonding area 3221 is w1, and the width of the third bonding area 3231 is w2, which satisfies: 0.05W≤w1≤0.45W and / or 0.05W≤w2≤0.45W. With such a configuration, the passing rate of the battery drop test is better, which is beneficial to reducing the risk of the electrode assembly 20 moving and the risk of damage to the outer ring electrode sheet of the electrode assembly 20. In Examples 10 to 15, the second bonding layer 322 is bonded to the second region 212, the third side 23 and / or the second side 22, and the third bonding layer 323 is bonded to the third region 213, the fourth side 24 and / or the second side 22.

[0171] In some embodiments, see Figure 3 , Fig.12and Table 1, satisfying: W2≤0.45W and / or W3≤0.45W. When this condition is met, it can be seen from Table 1 that the pass rate of the battery drop test is better, which is beneficial to reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer ring electrode piece of the electrode assembly 20.

[0172] In some embodiments, see Fig.12 and Table 1, satisfying: H1≤0.25W and / or H2≤0.25W. When this condition is met, it can be seen from Table 1 that the pass rate of the battery drop test is better, which is beneficial to reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer ring electrode piece of the electrode assembly 20.

[0173] In some embodiments, see Figure 8 , Fig.12 and Table 1, satisfying: q1≤0.32W and / or q2≤0.32W. When this condition is met, it can be seen from Table 1 that the pass rate of the battery drop test is better, which is conducive to reducing the risk of the electrode assembly 20 moving and the risk of the outer ring electrode piece of the electrode assembly 20 being damaged.

[0174] See also Fig.13 , the embodiments of the present application further provide an electrical device 1000 , which includes the electrochemical device 100 described above.

[0175] In some embodiments, see Fig.13 The electrical equipment 1000 further includes an equipment body 200 , and the electrochemical device 100 is installed on the equipment body 200 to supply power to the equipment body 200 .

[0176] In some embodiments, the power-consuming device 1000 may be a Bluetooth headset, a Bluetooth speaker, a mobile phone, a laptop computer, a tablet computer, an e-book player, an electric toy, a game console, a video recorder, a portable recorder, a radio, a smart watch, a lighting lamp, or a calculator, etc., which are not listed one by one here.

[0177] Since the electrical equipment 1000 adopts the technical solution in any of the above-mentioned embodiments of the electrochemical device 100, it at least has the beneficial effects brought by the technical solution in any of the above-mentioned embodiments of the electrochemical device 100, which will not be described one by one here.

[0178] In addition, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not used to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An electrochemical device, characterized in that: include: a housing, the housing comprising a first side wall; an electrode assembly, the electrode assembly being disposed in the housing, the electrode assembly comprising a first side surface adjacent to the first side wall, the first side surface comprising a first region, a second region and a third region, and along a first direction, the first region is located between the second region and the third region; an adhesive member, the adhesive member being located between the shell and the electrode assembly, the adhesive member comprising a first side and a second side opposite to each other, the first side being adjacent to the shell, the second side being away from the shell, the first side comprising a first adhesive layer, the first adhesive layer comprising a first adhesive region bonded to the first sidewall; the second side comprising a second adhesive layer and a third adhesive layer, the second adhesive layer comprising a second adhesive region bonded to the second region, the third adhesive layer comprising a third adhesive region bonded to the third region, the surface of the second side comprising a first non-adhesive region not bonded to the first region, the first non-adhesive region being located between the second adhesive region and the third adhesive region; Along a second direction, a projection of the first bonding area overlaps with the first non-bonding area, and the second direction is a direction in which the first side wall is opposite to the first side surface.

2. The electrochemical device according to claim 1, characterized in that The adhesive member further includes a substrate layer. The first adhesive layer is disposed on a surface of the substrate layer facing the housing. The second adhesive layer and the third adhesive layer are disposed on a surface of the substrate layer facing the electrode assembly.

3. The electrochemical device according to claim 2, characterized in that The surface of the first side also includes a second non-bonding area and a third non-bonding area that are not bonded to the first side wall. Along the first direction, the first bonding area is located between the second non-bonding area and the third non-bonding area; along the second direction, the projection of the second non-bonding area overlaps with the second bonding area, and the projection of the third non-bonding area overlaps with the third bonding area.

4. The electrochemical device according to claim 3, characterized in that Along the second direction, the first non-adhesive area covers the projection of the first adhesive area, the projection of the second non-adhesive area covers the second adhesive area, and the projection of the third non-adhesive area covers the third adhesive area; Along the first direction, a distance between the first bonding area and the second bonding area is greater than 0, and a distance between the first bonding area and the third bonding area is greater than 0.

5. The electrochemical device according to claim 2, characterized in that Along the second direction, the projection of the first bonding area covers the first non-bonding area, the projection of the first bonding area overlaps with the second bonding area, and the projection of the first bonding area overlaps with the third bonding area.

6. The electrochemical device according to claim 3, characterized in that The adhesive meets any of the following conditions: (1) A portion of the surface of the substrate layer is exposed toward the electrode assembly to form the first non-adhesive area; a portion of the surface of the substrate layer is exposed toward the shell to form the second non-adhesive area and the third non-adhesive area; (2) The adhesive member further comprises a first non-adhesive layer, a second non-adhesive layer and a third non-adhesive layer, wherein the first non-adhesive layer is bonded to the surface of the second adhesive layer and / or the third adhesive layer to form the first non-adhesive area; The second non-adhesive layer is bonded to a surface of the first adhesive layer that is away from the second region to form the second non-adhesive region; The third non-adhesive layer is bonded to a surface of the first adhesive layer that is away from the third region to form the third non-adhesive area.

7. The electrochemical device according to claim 2, characterized in that The substrate layer includes a first substrate portion and a second substrate portion, the second adhesive layer and a portion of the first adhesive layer are provided on the first substrate portion, and the third adhesive layer and a portion of the first adhesive layer are provided on the second substrate portion; the substrate layer satisfies any one of the following conditions: (1) The first substrate portion and the second substrate portion are arranged along the first direction; (2) The first substrate portion and the second substrate portion are arranged along a third direction, and the third direction is perpendicular to the first direction and the second direction in pairs.

8. The electrochemical device according to claim 1, characterized in that The width of the electrode assembly along the first direction is W, and the length of the electrode assembly along the third direction is L, and the third direction is perpendicular to the first direction and the second direction in pairs; the electrochemical device satisfies at least one of the following conditions: (1) Along the first direction, the distance between the center of the first bonding area and the center of the first side surface is D1, satisfying: D1≤0.1W; (2) Along the third direction, the distance between the center of the first bonding area and the center of the first side surface is D2, satisfying: D2≤0.1L; (3) Along the first direction, the width of the first bonding area is W1, satisfying: 0.3W≤W1≤0.8W; (4) Along the third direction, the length of the first bonding area is L1, which satisfies: 0.4L≤L1≤0.8L; (5) Along the first direction, the width of the second bonding area is w1, satisfying: 0.05W≤w1≤0.45W; (6) Along the first direction, the width of the third bonding area is w2, satisfying: 0.05W≤w2≤0.45W; (7) Along the third direction, the length of the first bonding area is L1, and the length of the second bonding area is l1, satisfying: l1 ≥ 0.4L1; (8) Along the third direction, the length of the first bonding area is L1, and the length of the third bonding area is l2, satisfying: l2 ≥ 0.4L1; (9) the second bonding area includes a plurality of second sub-bonding areas spaced apart along the third direction; (10) The third bonding area includes a plurality of third sub-bonding areas spaced apart from each other along the third direction.

9. The electrochemical device according to claim 8, characterized in that The adhesive member further comprises a substrate layer, the first adhesive layer is disposed on a surface of the substrate layer facing the housing, and the second adhesive layer and the third adhesive layer are disposed on a surface of the substrate layer facing the electrode assembly; Along the first direction, the distance from the first bonding area to the edge of one side of the substrate layer is W2, the distance from the first bonding area to the edge of the other side of the substrate layer is W3, the distance between the second bonding area and the first bonding area is H1, the distance between the third bonding area and the first bonding area is H2, along the third direction, the distance from the first bonding area to the edge of one side of the substrate layer is L2, and the distance from the first bonding area to the edge of the other side of the substrate layer is L3; The adhesive meets at least one of the following conditions: (1)W2≤0.45W; (2)W3≤0.45W; (3)L2≤0.4L1: (4)L3≤0.4L1; (5)H1≤0.25W; (6)H2≤0.25W; (7) Along the second direction, the projection of the first bonding area and the second bonding area have a first overlapping area, and the width of the first overlapping area along the first direction is q1, q1≤0.32W; (8) Along the second direction, the projection of the first bonding area and the third bonding area have a second overlapping area, and the width of the second overlapping area along the first direction is q2, q2≤0.32W.

10. The electrochemical device according to claim 1, characterized in that The electrode assembly further includes a second side surface, a third side surface, and a fourth side surface, the second side surface and the first side surface are arranged opposite to each other along the second direction, the third side surface and the fourth side surface are arranged opposite to each other along the first direction, and at least one of the following conditions is satisfied: (1) The second adhesive layer is bonded to both the second region and the third side surface; (2) The third adhesive layer is bonded to both the third region and the fourth side surface.

11. The electrochemical device according to claim 10, characterized in that At least one of the following conditions is met: (1) The second adhesive layer is bonded to the second side surface; (2) The third adhesive layer is bonded to the second side surface.

12. An electrical equipment, characterized in that: An electrochemical device comprising any one of claims 1 to 11.

Citation Information

Cited By

  • Electrochemical device and electric equipment

    CN119013816A

  • Electrochemical devices and electrical equipment

    CN119013816B