Electronic equipment, heat dissipation assembly and heat conduction piece

Abstract

The invention provides electronic equipment, a heat dissipation assembly and a heat conduction piece. The heat conduction piece comprises a metal sheet, a grid structure and a liquid metal layer, the grid structure is fixedly arranged on the surface of the metal sheet, and the liquid metal layer covers the grid structure and is exposed out of the grid structure. According to the heat conduction piece provided by the embodiment of the invention, the high heat conduction metal and the liquid metal are compounded, the heat conduction piece has high heat conductivity, meanwhile, due to introduction of the liquid metal, the heat conduction piece also has extremely low interface thermal resistance, in addition, the grid structure is introduced, deviation of the liquid metal is restrained, and the heat conduction performance is improved. The risks of short circuit, corrosion and poor heat dissipation effect caused by the fact that liquid metal is prone to deviation are effectively overcome.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation structures of electronic equipment, and in particular to an electronic equipment, a heat dissipation component and a heat conducting member. Background Art

[0002] As the performance of electronic devices such as mobile phones improves, heat dissipation issues are becoming a major factor affecting user experience. For the heat dissipation structure of heat-generating components such as processors, conventional technical solutions generally use structures such as heat spreaders or graphite sheets to transfer heat to the middle frame or back cover for heat dissipation. However, the heat dissipation effect of the above solutions cannot meet the increasingly high heat dissipation performance requirements of electronic devices. Summary of the invention

[0003] A first aspect of an embodiment of the present application provides a heat conducting member, which includes a metal sheet, a grid structure and a liquid metal layer. The grid structure is fixed to the surface of the metal sheet, and the liquid metal layer covers the grid structure and is exposed from the grid structure.

[0004] In a second aspect, an embodiment of the present application provides a heat dissipation component, which includes a heat source device, a heat dissipation device, and the heat conductive member described in the above embodiment, wherein the heat conductive member is arranged between the heat source device and the heat dissipation device, and the two sides of the heat conductive member are respectively bonded to the heat source device and the heat dissipation device, for conducting the heat generated by the heat source device to the heat dissipation device.

[0005] In a third aspect, an embodiment of the present application provides an electronic device, comprising a heat source device, a heat dissipation shell, and the heat conductive member described in the above embodiment, wherein the heat conductive member is arranged between the heat source device and the heat dissipation shell, and two sides of the heat conductive member are respectively bonded to the heat source device and the heat dissipation shell, for conducting the heat generated by the heat source device to the heat dissipation shell.

[0006] The thermal conductive part provided in the embodiment of the present application is a composite of a high thermal conductivity metal and a liquid metal, which has both high thermal conductivity and extremely low interface thermal resistance due to the introduction of liquid metal. In addition, a grid structure is introduced to constrain the deviation of the liquid metal, effectively overcoming the risks of short circuit, corrosion and poor heat dissipation caused by the easy deviation of the liquid metal. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0008] Figure 1 is a schematic diagram of the cross-sectional structure of an embodiment of the heat conducting member of the present application;

[0009] Figure 2 This is a schematic diagram of the structure of the metal sheet and the grid structure in one embodiment of the present application;

[0010] Figure 3 yes Figure 2 A schematic cross-sectional view of the structure at AA in the embodiment;

[0011] Figure 4 is a schematic diagram of the cross-sectional structure of another embodiment of the heat conducting element of the present application;

[0012] Figure 5 is a schematic diagram of the cross-sectional structure of another embodiment of the heat conducting element of the present application;

[0013] Figure 6 It is a structural schematic diagram of an embodiment of a heat dissipation assembly of the present application;

[0014] Figure 7 It is a structural schematic diagram of an embodiment of the electronic device of the present application;

[0015] Figure 8 yes Figure 7 A schematic cross-sectional view of the structure of the electronic device at position BB in the embodiment;

[0016] Fig. 9 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0017] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0018] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

[0019] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0020] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0021] Liquid metal is a large class of multi-metal alloy materials that are liquid at room temperature and can achieve flexible conversion between solid and liquid phases. It has the characteristics of high thermal conductivity and controllable melting point. For the heat dissipation of consumer electronic products, the commonly used liquid metal is Ga-In alloy. However, due to its corrosiveness and conductivity, it is currently only used in fixed game consoles and laptops, and protection is required to prevent the flow of liquid metal. In order to reduce the risk of corrosion and short circuit of liquid metal on peripheral devices, there are currently three main solutions in academia and industry.

[0022] Solution 1: Liquid metal paste. That is, a blend of liquid metal, ceramic particles, and silicone oil. The work of the team of Fu Qiang and Wu Kai from Sichuan University is such a solution. Through mechanochemical methods, the colloidal liquid metal embeds dispersed aluminum nitride particles into gallium-based liquid metal. Under the action of asymmetric mechanical force, the liquid metal is forced to penetrate into the lattice of aluminum nitride, forming an effective coordination effect with the nitrogen atoms in aluminum nitride, thereby establishing a liquid-solid interface with gradient diffusion characteristics. This gradient structure not only significantly promotes the heat conduction at the interface between liquid metal and aluminum nitride, but also the stable liquid metal outer layer formed on the surface of aluminum nitride acts as a lubricant when the material is compressed, reducing the friction resistance of particle movement and ensuring the excellent thixotropy of colloidal liquid metal. In addition, studies have also shown that liquid metal has good wettability with silicone oil. Therefore, there is a solution to compound silicone oil, ceramic particles and liquid metal to obtain liquid metal paste. Liquid metal thermal paste inherits the advantages of liquid metal's high thermal conductivity and low thermal resistance, while also having the ease of use of ordinary thermal grease. It avoids the disadvantages of liquid metal's high surface tension, easy balling, and high fluidity, and its coating properties are greatly improved.

[0023] Solution 2: Liquid metal sheet. It uses a sandwich structure of composite liquid metal, with the upper and lower layers made of low-temperature alloy with a melting point of 60°C, and the middle layer is an indium sheet. When the temperature of the fuselage rises, the low-temperature alloy will be in a slightly melted state and attached to the indium base, which will not flow while ensuring thermal conductivity and taking safety into consideration.

[0024] Solution 3: Pure liquid metal. This solution is used in the heat dissipation structure of some game consoles. To avoid the deviation of liquid metal, a circle of foam is designed around the chip to physically organize the flow of liquid metal. Some laptops also use similar solutions.

[0025] The disadvantages of the three existing mainstream solutions are as follows.

[0026] plan Thermal conductivity Misalignment / corrosion risk Construction difficulty Liquid Metal Paste Low middle middle Liquid Metal Sheet middle middle Low Pure liquid metal high high high

[0027] Solution 1: Liquid metal paste solution. Although the risk of displacement / corrosion is reduced due to the constraints of silicone oil and ceramic particles, the thermal conductivity is seriously sacrificed due to the introduction of silicone oil and ceramic particles, and the thermal conductivity is about 10W / mK.

[0028] Solution 2: Liquid metal sheet solution. Although the theoretical thermal conductivity of this solution can reach 80W / mK, the melting point of the low-temperature liquid metal coated on both sides is 60°C. Considering that the temperature of the thermal pad position does not reach 60°C in most cases when the actual mobile phone product is working, the actual thermal conductivity effect is poor. The proposer of this solution found through actual testing that under normal scenarios, the chip junction temperature actually deteriorated. Therefore, in order to better take advantage of the high thermal conductivity of this solution, it is necessary to select liquid metal that matches the operating temperature of the entire machine to ensure that the liquid metal is in a melted state during operation to ensure low contact thermal resistance. However, at this time, the risk of corrosion and short circuit caused by the offset of the melted liquid metal is very high.

[0029] The pure liquid metal solution of solution 3 has high thermal conductivity, but the risk of corrosion, short circuit, or poor heat dissipation due to deviation is extremely high. It can basically be considered impossible to apply it to mobile devices such as mobile phones.

[0030] In view of this, an embodiment of the present application provides a structure of a heat conductive component, which has the characteristics of high thermal conductivity, low risk of displacement / corrosion and low construction difficulty, and can be used in mobile electronic devices such as mobile phones.

[0031] See also Figure 1 , Figure 1 It is a schematic diagram of the cross-sectional structure of an embodiment of the heat conductive component of the present application. The heat conductive component 100 in this embodiment includes a metal sheet 110, a grid structure 120 and a liquid metal layer 130, wherein the grid structure 120 is fixed on the surface of the metal sheet 110, and the liquid metal layer 130 covers the grid structure 120 and is exposed from the grid structure 120.

[0032] Specifically, the metal sheet 110 provides high thermal conductivity. The material can be aluminum, copper, silver, indium, etc., and in some embodiments, it can be an indium sheet. The melting point of indium is about 150°C, which is lower than the operating temperature of the mobile phone, and the shape can be maintained at all times; the thermal conductivity of indium is 80W / mK, which is much higher than the conventional thermal pad (about 3W / mK); the modulus of indium is 11GPa, and the Vickers hardness is about 0.9, which is much lower than copper and aluminum, and the contact between the heat source and the heat sink will be better.

[0033] It should be noted that when the metal sheet 110 is made of aluminum or copper, because the material of the liquid metal layer 130 (in this embodiment, gallium-indium alloy material is used as an example) has a corrosion reaction with such metals, it is necessary to plate a protective layer (not shown in the figure) on the surface, and the material of the protective layer can be nickel, tungsten, silicon, etc. In addition, in some embodiments, a connecting layer can be plated on the surface of the metal sheet 110 to increase the connection strength between the liquid metal layer 130 and the metal sheet. Among them, the material of the connecting layer is selected from materials that have a good adsorption relationship with both the metal sheet 110 and the liquid metal layer 130. The detailed features of the connecting layer are within the understanding of those skilled in the art and will not be repeated here.

[0034] Optionally, the thickness of the metal sheet 110 in this embodiment is between 0.05-0.5 mm, and the length and width are related to the actual applied heat source and are not restricted.

[0035] Please also read Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the structure of the metal sheet and the grid structure in one embodiment of the present application. Figure 3 yes Figure 2 The schematic diagram of the cross-sectional structure at AA in the embodiment, wherein the grid structure 120 is designed on the metal sheet 110, and its core function is to bind the low melting point liquid metal layer 130 in the grid to prevent the melted liquid metal from being displaced when the mobile phone is working. The material of the grid structure 120 can be the same material as the metal sheet 110 or a different material, and can be fixedly connected to the metal sheet 110 by hot pressing, welding, sintering and other processes.

[0036] See also Figure 4 , Figure 4 is a schematic diagram of the cross-sectional structure of another embodiment of the heat conducting element of the present application, and Figure 3 The difference between the embodiments is that the grid structure 120 and the metal sheet 110 in this embodiment are an integrated structure, and can be integrally formed by etching, CNC processing, or the like.

[0037] The mesh structure 120 may be Figure 2 The square grid shown in the figure, in some other embodiments, the shape of the grid structure 120 can also be a rhombus, triangle or other shape grid, as long as the melted liquid metal layer can be kept from shifting. In addition to the structure shown in the figure, the woven copper mesh, stainless steel mesh, and nickel mesh can also be attached to the metal sheet by welding, and the capillary force can also be used to constrain the liquid metal. Among them, the grid structure in the embodiment of the present application has a thickness of 0.01-1mm, and the aperture of the grid can be 0.05-5mm (the optimal aperture range obtained by the capillary force experiment constraint effect).

[0038] The surface of the metal sheet 110 and the grid structure 120 are filled with low-melting-point liquid metal to form a liquid metal layer 130. The filling amount is ensured to be slightly higher than the grid structure 120 so that the liquid metal can fully contact the heat source and the heat sink during mounting. The melting point of the liquid metal matches the operating temperature of the device to ensure that it can melt smoothly when the device is working, and the value is between 30-95°C. Optionally, the material composition of the liquid metal layer 130 in this embodiment can be a gallium-based or indium-based alloy, such as a gallium-indium alloy, a gallium-based alloy formed by doping at least one of indium, zinc, bismuth and tin metals, an indium-based alloy formed by doping at least one of gallium, zinc, bismuth and tin metals, etc., which is not specifically limited here.

[0039] The heat conducting member in the embodiment of the present application is a composite of a high thermal conductivity metal sheet and liquid metal, which has high thermal conductivity and extremely low interface thermal resistance due to the introduction of liquid metal. The heat conduction effect is more than 10 times that of conventional thermal conductive gels and thermal conductive pads. In addition, a grid structure is introduced to constrain the deviation of the liquid metal, effectively overcoming the risks of short circuit, corrosion and poor heat dissipation caused by the easy deviation of the liquid metal.

[0040] See also Figure 5 , Figure 5 1 is a schematic diagram of the cross-sectional structure of another embodiment of the heat conducting member of the present application, in which the heat conducting member 100 also includes a metal sheet 110, a grid structure 120 and a liquid metal layer 130, wherein the grid structure 120 is fixed on the surface of the metal sheet 110, and the liquid metal layer 130 covers the grid structure 120 and is exposed from the grid structure 120. Different from the above-mentioned embodiments, the metal sheet 110 in this embodiment is provided with a grid structure 120 and a liquid metal layer 130 on opposite sides.

[0041] Among them, the metal sheet 110 provides high thermal conductivity. The material can be aluminum, copper, silver, indium, etc., and in some embodiments it can be an indium sheet. The melting point of indium is about 150°C, which is lower than the working temperature of the mobile phone, and the shape can be maintained at all times; the thermal conductivity of indium is 80W / mK, which is much higher than the conventional thermal pad (about 3W / mK); the modulus of indium is 11GPa, and the Vickers hardness is about 0.9, which is much lower than copper and aluminum, and the contact between the heat source and the heat sink will be better. It should be noted that when the metal sheet 110 is made of aluminum or copper, because the material of the liquid metal layer 130 (in this embodiment, gallium-indium alloy material is used as an example) has a corrosion reaction with such metals, it is necessary to plate a protective layer on the surface (not shown in the figure), and the material of the protective layer can be nickel, tungsten, silicon, etc. In addition, in some embodiments, a connecting layer can be plated on the surface of the metal sheet 110 to increase the connection strength between the liquid metal layer 130 and the metal sheet. The material of the connection layer is selected from materials that have good adsorption relationships with the metal sheet 110 and the liquid metal layer 130. The detailed characteristics of the connection layer are within the understanding of those skilled in the art and will not be described here. Optionally, the thickness of the metal sheet 110 in this embodiment is between 0.05-0.5 mm, and the length and width are related to the actual applied heat source and are not restricted.

[0042] Among them, the grid structure 120 is designed on the metal sheet 110, and its core function is to constrain the low-melting-point liquid metal layer 130 in the grid to prevent the melted liquid metal from being offset when the mobile phone is working. The material of the grid structure 120 can be the same material as the metal sheet 110 or a different material. It can be fixedly connected to the metal sheet 110 through processes such as hot pressing, welding, sintering, or the grid structure 120 and the metal sheet 110 are an integral structure, and are integrally processed and formed by etching, CNC processing, etc. Among them, the appearance of the grid structure 120 can be a square grid, a diamond grid, a triangle grid, etc., as long as the melted liquid metal layer can be achieved without deviation. In addition to the illustrated structure, the woven copper mesh, stainless steel mesh, and nickel mesh can also be attached to the metal sheet by welding, and the function of constraining the liquid metal can also be achieved by capillary force. Among them, the grid structure thickness in the embodiment of the present application is 0.01-1mm, and the aperture of the grid is 0.1-1mm.

[0043] The surface of the metal sheet 110 and the grid structures 120 on both sides are filled with low-melting-point liquid metal to form a liquid metal layer 130. The filling amount is ensured to be slightly higher than the grid structure 120 so that the liquid metal can fully contact the heat source and the heat sink during mounting. The melting point of the liquid metal matches the operating temperature of the equipment to ensure that it can melt smoothly when the equipment is working, and the value is between 30-95°C. Optionally, the material composition of the liquid metal layer 130 in this embodiment can be a gallium-based or indium-based alloy, such as a gallium-indium alloy, a gallium-based alloy formed by doping at least one of indium, zinc, bismuth and tin metals, an indium-based alloy formed by doping at least one of gallium, zinc, bismuth and tin metals, etc., which is not specifically limited here.

[0044] In addition, the present application also provides a heat dissipation component, see Figure 6 , Figure 6 1 is a schematic diagram of the structure of an embodiment of a heat dissipation component of the present application, wherein the heat dissipation component includes a heat source device 200, a heat dissipation device 300 and a heat conductor 100, wherein the heat conductor 100 is disposed between the heat source device 200 and the heat dissipation device 300, and the two sides of the heat conductor 100 are respectively attached to the heat source device 200 and the heat dissipation device 300, and are used to conduct the heat generated by the heat source device 200 to the heat dissipation device 300. For the detailed structural features of the heat conductor 100, please refer to the relevant description of the aforementioned embodiment, which will not be repeated here.

[0045] Optionally, the heat source device 200 can be a chip, a camera, a fan, etc., and the heat dissipation device 300 can be a structure such as a housing, a middle frame, a temperature spreader, or a heat dissipation fin of an electronic device. A practical application scenario of the heat conductor 100 in this embodiment can be to replace conventional thermal conductive gel or thermal conductive gaskets. Attached to a heat source device 200 such as a chip, a camera, a fan, etc., the other side is in contact with a heat dissipation device 300 such as a middle frame or a temperature spreader. When the electronic device is working, heat is quickly conducted from the liquid metal layer 130-metal sheet 110-liquid metal layer 130 of the heat source device 200 (the structure in which liquid metal layers are provided on both sides of the metal sheet is used as an example for explanation) to a heat dissipation device 300 such as a middle frame or a temperature spreader.

[0046] Furthermore, the present application also provides an electronic device, which may include a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. Figure 7 and Figure 8 , Figure 7 is a structural diagram of an embodiment of the electronic device of the present application, Figure 8 yes Figure 7 The schematic cross-sectional view of the structure of the electronic device at position BB in the embodiment, the electronic device in this embodiment may include a display screen 30, a housing 10, a control circuit board 20, a middle frame 40 and a heat conductor 100.

[0047] Optionally, the display screen 30 in this embodiment cooperates with the housing 10 (which may be a back cover) and the middle frame 40 to form a receiving cavity 1000, and the control circuit board 20 is disposed in the receiving cavity 1000. The control circuit board 200 is electrically connected to the display screen 30 and is used to control the display surface (working state) of the display screen 30. Among them, a chip 21 may be provided on the control circuit board 20, and both the chip 21 and the display screen 30 may be heating devices (i.e., heat source devices) of the electronic device, and the heat conductor 100 is attached to the heat dissipation housing (which may be the housing 10 in this embodiment), and one end of the heat conductor 100 is in contact with the heat source device (in this embodiment, the chip 21 is used as the heat source device for explanation), so that the heat of the heat source device can be quickly and efficiently transferred to the (heat dissipation) housing 10.

[0048] See also Fig. 9 , Fig. 9 It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The mobile phone is used as an example in the diagram of this embodiment. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the chip 21 in the above embodiment) and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device 10.

[0049] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.

[0050] The electronic device in this embodiment has a thermally conductive component that compounds high thermal conductivity metal with liquid metal, which not only has high thermal conductivity, but also has extremely low interface thermal resistance due to the introduction of liquid metal. In addition, a grid structure is introduced to constrain the deviation of the liquid metal, effectively overcoming the risks of short circuit, corrosion and poor heat dissipation caused by the easy deviation of liquid metal, thereby greatly improving the heat dissipation efficiency of the electronic device, improving the user experience of the electronic device, and increasing product competitiveness.

[0051] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat conducting member, characterized in that: The heat conducting member comprises a metal sheet, a grid structure and a liquid metal layer. The grid structure is fixed on the surface of the metal sheet, and the liquid metal layer covers the grid structure and is exposed from the grid structure.

2. The heat conducting element according to claim 1, characterized in that: The material of the grid structure is metal and is the same as the material of the metal sheet.

3. The heat conducting element according to claim 2, characterized in that: The grid structure is integrally formed with the metal sheet.

4. The heat conducting member according to claim 1, characterized in that: The thickness of the grid structure is 0.01-1 mm.

5. The heat conducting member according to claim 1, characterized in that: The thickness of the metal sheet is 0.05-0.5 mm.

6. The heat conducting member according to claim 1, characterized in that: The surface of the metal sheet on which the grid structure is arranged is provided with a coating, and the coating is used to increase the connection strength between the liquid metal layer and the metal sheet or to isolate and protect the metal layer.

7. The heat conducting element according to claim 6, characterized in that: The grid structure and the liquid metal layer are provided on opposite sides of the metal sheet.

8. The heat conducting element according to claim 1, characterized in that: The liquid metal layer is a gallium-indium alloy material, and the melting point of the liquid metal layer is between 30-95°C.

9. A heat dissipation component, characterized in that: The heat dissipation assembly includes a heat source device, a heat dissipation device and the heat conductive member described in any one of claims 1 to 8, wherein the heat conductive member is arranged between the heat source device and the heat dissipation device, and two sides of the heat conductive member are respectively attached to the heat source device and the heat dissipation device, so as to conduct the heat generated by the heat source device to the heat dissipation device.

10. An electronic device, characterized in that: The electronic device comprises a heat source device, a heat dissipation shell and the heat conductive member according to any one of claims 1 to 8, wherein the heat conductive member is arranged between the heat source device and the heat dissipation shell, and two sides of the heat conductive member are respectively attached to the heat source device and the heat dissipation shell, so as to conduct the heat generated by the heat source device to the heat dissipation shell.

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