Furnace tube equipment

Abstract

The invention discloses furnace tube equipment, and relates to the field of semiconductor manufacturing equipment, and the furnace tube equipment comprises a process tube which is internally used for forming a process region; the flange piece is arranged below the process pipe and is used for bearing the process pipe; the wafer boat is used for bearing a plurality of substrates; the sealing cover is arranged below the wafer boat and the flange piece, the sealing cover comprises an air inlet channel and a blowing part, the air inlet channel is provided with an air inlet end and an air outlet end, the air inlet end is used for receiving inlet air, the air outlet end is communicated with the blowing part, the blowing part is provided with a plurality of air holes, and the air holes are communicated with the air inlet end and the air outlet end. The plurality of air holes are arranged towards the process area, and the purging part is close to the flange piece. Particle deposition on the surfaces of the flange piece and the sealing cover can be remarkably reduced through continuous blowing of the gas, so that the pollution risk is reduced, the cleanliness of the process environment is optimized, and the cleaning frequency of the flange piece and the sealing cover can be reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing equipment, and in particular to a furnace tube equipment. Background Art

[0002] In the semiconductor manufacturing process, furnace tube equipment is widely used in processes such as high-temperature oxidation, diffusion and chemical vapor deposition. Furnace tube equipment usually includes structures such as process tubes, flanges, wafer boats and sealing covers. In order to ensure the stability of the process and the clean environment of the process area, flanges and sealing covers are key components. However, the furnace tube equipment in the prior art still has the following problems in actual use: In existing furnace tube equipment, the reaction gas will produce particles when the process zone is running. These particles are easily deposited on the surfaces of the flange and the sealing cover. Under the influence of the airflow formed by the supply gas, these particles are easily floated upward and thus contaminate the wafer, affecting the processing quality of the wafer.

[0003] The flanges and sealing covers of existing furnace tube equipment usually lack effective airflow design, which easily causes particle accumulation. Summary of the invention

[0004] In order to solve the technical problem that particles are easily deposited on the surfaces of flanges and seals of furnace tube equipment, the present application proposes a furnace tube equipment, comprising: a process tube, the interior of the process tube is used to form a process zone; a flange, arranged below the process tube, and used to carry the process tube; a crystal boat, used to carry a plurality of substrates; a sealing cover, arranged below the crystal boat and the flange, the sealing cover comprising an air inlet channel and a purge part, the air inlet channel having an air inlet end and an air outlet end, the air inlet end being used to receive air, the air outlet end being connected to the purge part, the purge part being provided with a plurality of air holes, the plurality of air holes being arranged toward the process zone, and the purge part being close to the flange; a lifting mechanism, used to drive the crystal boat and the sealing cover to lift and lower in a vertical direction, so that the crystal boat can be moved into and out of the process zone, and when the crystal boat is moved into the process zone, the sealing cover and the flange jointly seal the process zone.

[0005] In one embodiment of the present application, the flange member includes an air supply port, and the sealing cover is configured as follows: when the wafer boat is moved into the process area, the upper end surface of the sealing cover contacts the lower end surface of the flange member to seal the process area, and the air inlet end of the air inlet channel is connected to the air supply port to supply air to the multiple air holes through the air supply port.

[0006] In one embodiment of the present application, the flange has an inner end surface facing the process zone, and the purge portion is located between the outer wall of the wafer boat and the inner end surface of the flange.

[0007] In one embodiment of the present application, the purge portion further includes an air supply cavity disposed below the plurality of air holes, and the plurality of air holes are connected to the air inlet channel through the air supply cavity.

[0008] In one embodiment of the present application, the plurality of air holes are evenly distributed in the purge portion.

[0009] In one embodiment of the present application, the outlet angles of the multiple air holes are vertically upward.

[0010] In one embodiment of the present application, the multiple air holes include a first group of air holes and a second group of air holes, the first group of air holes are arranged close to the inner end surface of the flange, the air outlet angle of the first group of air holes is toward the inner end surface of the flange, and the air outlet angle of the second group of air holes is vertically upward.

[0011] In one embodiment of the present application, the furnace tube equipment also includes a rotating mechanism, the rotating mechanism has a rotating shaft, the sealing cover has an opening, the rotating shaft is configured to pass through the opening and be connected to the wafer boat, there is a gap between the outer wall of the rotating shaft and the inner wall of the opening, and the rotating mechanism is used to drive the wafer boat to rotate.

[0012] In one embodiment of the present application, the furnace tube equipment further includes a purge pipeline and a baffle, wherein the purge pipeline is used to supply gas into the gap, and the baffle is disposed on the sealing cover and is located between the outer wall of the wafer boat and the purge portion.

[0013] In one embodiment of the present application, the furnace tube equipment further includes a partition, which is arranged on the upper end surface of the sealing cover and is located below the wafer boat, and the baffle is arranged on the partition.

[0014] In an embodiment of the present application, the flange and the sealing cover are both made of metal.

[0015] In order to solve the above technical problems, the present application also proposes a furnace tube device, including: a process tube, the interior of the process tube is used to form a process zone; a flange member is arranged below the process tube and is used to support the process tube; a crystal boat is used to support multiple substrates; a sealing cover is arranged below the crystal boat and the flange member; a purge member is arranged on the upper end surface of the sealing cover, and the flange member is arranged around the purge member, the purge member includes a plurality of groups of air holes arranged at intervals along the extension direction of the purge member, and each group of air holes includes a plurality of air holes; a lifting mechanism is used to control the lifting and lowering of the crystal boat and the sealing cover in the vertical direction so that the crystal boat can be moved into and out of the process zone, and when the crystal boat is moved into the process zone, the sealing cover and the flange member jointly seal the process zone.

[0016] In one embodiment of the present application, the flange member includes an air supply port, the sealing cover includes an air inlet channel, the purge member is connected to the air inlet channel, and the sealing cover and the purge member are configured as follows: when the crystal boat is moved into the process area, the upper end surface of the sealing cover contacts the lower end surface of the flange member to seal the process area, and the air inlet end of the air inlet channel is connected to the air supply port to supply air to the purge member through the air supply port.

[0017] In one embodiment of the present application, the furnace tube device further includes an air supply component, which is disposed between the flange component and the sealing cover, and the air supply component is connected to the purge component for supplying air to the purge component.

[0018] In one embodiment of the present application, the flange has an inner end surface facing the process zone, and the purge range of the plurality of air holes covers the inner end surface of the flange.

[0019] In an embodiment of the present application, the purge component is disposed between an outer wall of the wafer boat and an inner end surface of the flange component.

[0020] The positive progress of the present application is that the purge part of the sealing cover is designed with multiple air holes, and the gas is supplied through the air inlet channel, so that the gas is purged upward from the multiple air holes, effectively forming an upward airflow. The purge part is arranged on the sealing cover and is close to the flange. The airflow formed by the multiple air holes can prevent particles from falling on the sealing cover and the flange. The continuous purge of the gas can significantly reduce the particle deposition on the surface of the flange and the sealing cover, thereby reducing the risk of pollution and optimizing the cleanliness of the process environment. In addition, the purged gas can also form a protective layer to reduce the risk of corrosion of the sealing cover and the flange by corrosive gases. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of the furnace tube equipment of Example 1 of the present application; Figure 2 A top view of the purge portion of Example 1 of the present application; Figure 3 This is a schematic structural diagram of the furnace tube equipment of Example 2 of the present application; Figure 4 This is a schematic structural diagram of the furnace tube equipment of Example 3 of the present application; Figure 5 This is a schematic structural diagram of the furnace tube equipment of Example 4 of the present application; Figure 6 It is a first schematic diagram of the local structure of the furnace tube device of Example 4 of the present application; Figure 7 This is the second schematic diagram of the local structure of the furnace tube equipment of Example 4 of the present application. DETAILED DESCRIPTION

[0022] The present application is further described below by way of examples, but the present application is not limited to the scope of the examples. Example 1

[0023] like Figure 1 and Figure 2 As shown, this embodiment provides a furnace tube device, including a process tube 100, a flange 200, a wafer boat 300, a sealing cover 400 and a lifting mechanism. The interior of the process tube 100 is used to form a process area. The flange 200 is arranged below the process tube 100 and is used to carry the process tube 100. The wafer boat 300 is used to carry multiple substrates. The sealing cover 400 is arranged below the wafer boat 300 and the flange 200, and the sealing cover 400 includes a purge part 440 and an air inlet channel 410. The air inlet channel 410 has an air inlet end and an air outlet end, the air inlet end is used to receive the air inlet, and the air outlet end is connected to the purge part 440, and the purge part 440 is provided with a plurality of air holes 430, and the plurality of air holes 430 are arranged toward the process area. The purge part 440 is close to the flange 200. The lifting mechanism is used to drive the wafer boat 300 and the sealing cover 400 to rise and fall in the vertical direction so that the wafer boat 300 can be moved into and out of the process area. When the wafer boat 300 is moved into the process area, the sealing cover 400 and the flange 200 seal the process area together.

[0024] The purge part 440 of the sealing cover 400 is designed with a plurality of air holes 430, and gas is supplied through the air inlet channel 410, so that the gas is purged upward from the plurality of air holes 430, effectively forming an upward airflow. The purge part 440 is arranged on the sealing cover 400 and is close to the flange 200. The airflow formed by the plurality of air holes 430 can prevent particles from falling on the sealing cover 400 and the flange 200. The continuous purge of gas can significantly reduce the particle deposition on the surface of the flange 200 and the sealing cover 400, thereby reducing the risk of contamination and optimizing the cleanliness of the process environment. In addition, the purged gas can also form a protective layer to reduce the risk of the sealing cover 400 and the flange 200 being corroded by corrosive gases.

[0025] The gas supplied to the plurality of gas holes 430 may be nitrogen or an inert gas.

[0026] In some embodiments, the flange 200 includes an air supply port 220, and the sealing cover 400 is configured such that when the wafer boat 300 is moved into the process area, the upper end surface of the sealing cover 400 contacts the lower end surface of the flange 200 to seal the process area. In addition, the air inlet end of the air inlet channel 410 is connected to the air supply port 220 to supply air to the plurality of air holes 430 through the air supply port 220. By providing the air supply port 220 on the flange 200 for air supply, the flange 200 is fixed, and the air supply pipeline for supplying air to the air supply port 220 does not need to move up and down with the sealing cover 400, so that air supply is more convenient.

[0027] In some embodiments, the flange 200 has an inner end face 210 facing the process area, and the purge portion 440 is located between the outer wall of the wafer boat 300 and the inner end face 210 of the flange 200. This area is not blocked by the wafer boat 300, and particles are more likely to be deposited. The purge portion 440 is arranged in this area to reduce useless purge and improve the purge efficiency. Among them, the plurality of air holes 430 can cover the purge portion 440 in its entirety or partially.

[0028] In some embodiments, Figure 1 As shown, the purge portion 440 further includes an air supply cavity 420, which is disposed below the plurality of air holes 430, and the plurality of air holes 430 are connected to the air inlet channel 410 through the air supply cavity 420. By disposing the air supply cavity 420 below the plurality of air holes 430, the plurality of air holes 430 are connected to the air inlet channel 410 through the air supply cavity 420, and the air supply cavity 420 can play a role in gas distribution, and the air supply cavity 420 provides a more stable airflow, and the airflow pressures of the plurality of air holes 430 are substantially the same, thereby further improving the purge effect.

[0029] In some embodiments, Figure 2 As shown, a plurality of air holes 430 are evenly distributed in the purge portion 440. The evenly distributed air holes 430 can prevent the air flow from being lost in a local area, so that a uniform air flow is formed in the entire purge portion 440 to prevent particles from falling, and significantly reduce the deposition of particles on the flange 200 and the sealing cover 400.

[0030] In some embodiments, Figure 1 As shown, the outlet angle of the plurality of air holes 430 may be vertically upward.

[0031] In some embodiments, the outlet angles of the plurality of air holes 430 may also be obliquely upward.

[0032] In some embodiments, the flange 200 and the sealing cover 400 are both made of metal. Metal materials have excellent machinability and higher machining accuracy, which is conducive to improving the assembly accuracy and sealing performance of the furnace tube equipment. In addition, the use of metal materials has higher strength and is not easy to deform or break, ensuring that the furnace tube equipment has excellent structural stability.

[0033] The furnace tube device further includes a sealing ring, which is arranged on the lower end surface of the flange 200. The sealing performance of the furnace tube device can be further enhanced by adding the sealing ring. The flange 200 is annular and arranged below the process tube 100. The sealing ring can also be arranged between the flange 200 and the process tube 100. Example 2

[0034] The structure of the embodiment 2 is basically the same as that of the embodiment 1, except that Figure 3As shown, the plurality of air holes 430 include a first group of air holes and a second group of air holes. The first group of air holes is arranged near the inner end surface 210 of the flange 200, and the air outlet angle of the first group of air holes is toward the inner end surface 210 of the flange 200, and the air outlet angle of the second group of air holes is vertically upward. The first group of air holes is arranged near the inner end surface 210 of the flange 200, and its air outlet angle is toward the inner end surface 210 of the flange 200. The inner end surface 210 of the flange 200 is purged specifically by directional airflow, which can more effectively reduce the probability of particle deposition in the area. The air outlet angle of the second group of air holes is vertically upward, which can prevent particle deposition in the upper area of ​​the sealing cover 400. The furnace tube device of Example 2 can strengthen the purging effect at the flange 200 and further reduce particle deposition at the flange 200 by dividing the plurality of air holes 430 into two groups and supplying air to different areas respectively. The air outlet angles of the first group of multiple air holes 430 may include multiple different angles to cover the entire inner end surface 210 of the flange 200 to further improve the purging effect. Example 3

[0035] like Figure 4 As shown, in Example 3, the furnace tube device also includes a rotating mechanism 500, the rotating mechanism 500 has a rotating shaft 510, the sealing cover 400 has an opening, the rotating shaft 510 is configured to pass through the opening and connect with the wafer boat 300, and there is a gap between the rotating shaft 510 and the inner wall of the opening, and the rotating mechanism 500 is used to drive the wafer boat 300 to rotate.

[0036] The furnace tube device further includes a purge pipeline 600 and a baffle 720. The purge pipeline 600 is used to supply gas into the gap. The baffle 720 is disposed on the sealing cover 400 and is located between the outer wall of the wafer boat 300 and the purge portion 440. Specifically, the purge pipeline 600 passes through the rotating mechanism 500. The purge pipeline 600 and the rotating mechanism 500 are both raised and lowered synchronously with the wafer boat 300. When the upper end surface of the sealing cover 400 contacts the lower end surface of the flange 200, the air inlet of the purge pipeline 600 is connected to the air supply port 220.

[0037] By supplying air to the gap between the rotating shaft 510 and the sealing cover 400 through the purge pipeline 600, particles can be effectively prevented from entering the rotating mechanism 500 through the gap, thereby causing pollution to the rotating mechanism 500, and the service life of the rotating mechanism 500 can be effectively improved. In addition, the airflow formed by the purge pipeline 600 is located below the wafer boat 300, and has a certain purge effect on the area below the wafer boat 300, thereby reducing the probability of particles depositing in the area below the wafer boat 300. The baffle 720 can guide the airflow, so that the airflow changes from horizontal flow to upward flow, and thus does not interfere with the upward airflow at the air hole 430. In some embodiments, the baffle 720 is annular.

[0038] In some embodiments, the furnace tube device further includes a partition 710, which is disposed on the upper end surface of the sealing cover 400 and below the wafer boat 300, and a baffle 720 is disposed on the partition 710. The partition 710 can play a role in heat preservation. The rotating shaft 510 also passes through the partition 710, and there is a gap between the partition 710 and the rotating shaft 510. Example 4

[0039] like Figure 5 As shown, the furnace tube equipment in Example 4 is basically the same as that in Example 1. The furnace tube equipment in this embodiment includes: a process tube 100, a flange 200, a wafer boat 300, a sealing cover 400, a purge member 800 and a lifting mechanism, wherein the process tube 100, the flange 200, the wafer boat 300 and the lifting mechanism are the same as those in the furnace tube equipment in Example 1. The purge member 800 is arranged on the upper end surface of the sealing cover 400, the purge member 800 is annular, and the flange 200 is arranged around the purge member 800. The purge member 800 includes a plurality of groups of air holes 810 arranged at intervals along the extension direction of the purge member 800, that is, the circumferential direction, and each group of air holes 810 includes a plurality of air holes 810.

[0040] In some embodiments, the flange member 200 includes an air supply port 220, the sealing cover 400 includes an air inlet channel 410, and the purge member 800 is connected to the air inlet channel 410. The sealing cover 400 and the purge member 800 are configured as follows: when the wafer boat 300 is moved into the process area, the upper end surface of the sealing cover 400 contacts the lower end surface of the flange member 200 to seal the process area, and the air inlet end of the air inlet channel 410 is connected to the air supply port 220 to supply air to the purge member 800 through the air supply port 220. The purge member 800 is close to the flange member 200, and the air outlet angles of the multiple air holes 810 are toward the inner end surface 210 of the flange member 200. The purge member 800 is an annular structure, which is hollow inside and is used to supply air to the air holes 810. In some embodiments, the air supply method is not limited to this, such as Figure 6 As shown, an air supply component 900 may also be separately provided between the flange component 200 and the sealing cover 400 to directly supply air to the purge component 800 .

[0041] In some embodiments, Figure 5 As shown, the purge range of the plurality of air holes 810 covers the inner end surface 210 of the flange 200. The protection of the flange 200 can be enhanced. Specifically, the cross section of the purge member 800 is circular, and the air outlet angle range of each group of air holes 810 is 0°-60°. The plurality of air outlet angles of each group of air holes 810 can be set to 0°, 10°, 15°, 30°, 45°, and 60°, respectively. The air outlet angle is based on the horizontal line.

[0042] In some embodiments, Figure 7As shown, the cross section of the purge member 800 is a square, and the purge member 800 is disposed between the outer wall of the wafer boat 300 and the inner end surface 210 of the flange member 200. The distribution of the air holes 810 on the upper surface of the purge member 800 is similar to Figure 2 The distribution of the pores 430 is the same.

[0043] Although the specific implementation of the present application is described above, it should be understood by those skilled in the art that this is only for illustration. Those skilled in the art may make various changes or modifications to these implementations without departing from the principles and essence of the present application, but these changes and modifications all fall within the scope of protection of the present application.

Claims

1. A furnace tube device, characterized in that: include: A process pipe, the interior of which is used to form a process zone; A flange, disposed below the process pipe, for supporting the process pipe; A wafer boat, used to carry multiple substrates; A sealing cover is disposed below the wafer boat and the flange, the sealing cover comprises an air inlet channel and a purge portion, the air inlet channel has an air inlet end and an air outlet end, the air inlet end is used to receive air, the air outlet end is communicated with the purge portion, the purge portion is provided with a plurality of air holes, the plurality of air holes are arranged toward the process area, and the purge portion is close to the flange; The lifting mechanism is used to drive the wafer boat and the sealing cover to lift and lower in the vertical direction so that the wafer boat can be moved into and out of the process area. When the wafer boat is moved into the process area, the sealing cover and the flange jointly seal the process area.

2. The furnace tube equipment according to claim 1, characterized in that: The flange member includes an air supply port, and the sealing cover is configured as follows: when the wafer boat is moved into the process area, the upper end surface of the sealing cover contacts the lower end surface of the flange member to seal the process area, and the air inlet end of the air inlet channel is connected to the air supply port to supply air to the multiple air holes through the air supply port.

3. The furnace tube equipment according to claim 1, characterized in that: The flange has an inner end surface facing the process area, and the purge portion is located between the outer wall of the wafer boat and the inner end surface of the flange.

4. The furnace tube equipment according to any one of claims 1 to 3, characterized in that: The purge portion further includes an air supply cavity disposed below the plurality of air holes, and the plurality of air holes are connected to the air inlet passage through the air supply cavity.

5. The furnace tube equipment according to claim 1, characterized in that: The plurality of air holes are evenly distributed in the purge portion.

6. The furnace tube equipment according to claim 1, characterized in that: The air outlet angles of the multiple air holes are vertically upward.

7. The furnace tube equipment according to claim 1, characterized in that: The plurality of air holes include a first group of air holes and a second group of air holes. The first group of air holes is arranged close to the inner end surface of the flange. The air outlet angle of the first group of air holes is toward the inner end surface of the flange. The air outlet angle of the second group of air holes is vertically upward.

8. The furnace tube equipment according to claim 1, characterized in that: The furnace tube equipment also includes a rotating mechanism, which has a rotating shaft. The sealing cover has an opening. The rotating shaft is configured to pass through the opening and be connected to the wafer boat. There is a gap between the outer wall of the rotating shaft and the inner wall of the opening. The rotating mechanism is used to drive the wafer boat to rotate.

9. The furnace tube equipment according to claim 8, characterized in that: The furnace tube equipment further includes a purge pipeline and a baffle. The purge pipeline is used to supply gas into the gap. The baffle is arranged on the sealing cover and is located between the outer wall of the wafer boat and the purge portion.

10. The furnace tube equipment according to claim 9, characterized in that: The furnace tube equipment further comprises a partition plate, which is arranged on the upper end surface of the sealing cover and is located below the wafer boat, and the baffle plate is arranged on the partition plate.

11. The furnace tube equipment according to claim 1, characterized in that: The flange and the sealing cover are both made of metal.

12. A furnace tube device, characterized in that: include: A process pipe, the interior of which is used to form a process zone; A flange, disposed below the process pipe, for supporting the process pipe; A wafer boat, used to carry multiple substrates; A sealing cover, disposed below the wafer boat and the flange; A purge member is arranged on the upper end surface of the sealing cover, and the flange member is arranged around the purge member, the purge member includes a plurality of groups of air holes arranged at intervals along the extension direction of the purge member, and each group of air holes includes a plurality of air holes; The lifting mechanism is used to control the lifting of the wafer boat and the sealing cover in the vertical direction so that the wafer boat can be moved into and out of the process area. When the wafer boat is moved into the process area, the sealing cover and the flange jointly seal the process area.

13. The furnace tube equipment according to claim 12, characterized in that: The flange member includes an air supply port, the sealing cover includes an air inlet channel, the purge member is connected to the air inlet channel, and the sealing cover and the purge member are configured as follows: when the wafer boat is moved into the process area, the upper end surface of the sealing cover contacts the lower end surface of the flange member to seal the process area, and the air inlet end of the air inlet channel is connected to the air supply port to supply air to the purge member through the air supply port.

14. The furnace tube equipment according to claim 12, characterized in that: The furnace tube equipment further comprises an air supply component, which is arranged between the flange component and the sealing cover, and the air supply component is connected to the purge component for supplying air to the purge component.

15. The furnace tube equipment according to any one of claims 12 to 14, characterized in that: The flange has an inner end surface facing the process zone, and the purge range of the plurality of air holes covers the inner end surface of the flange.

16. The furnace tube equipment according to any one of claims 12 to 14, characterized in that: The purge component is arranged between the outer wall of the wafer boat and the inner end surface of the flange component.

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