Embossed embroidery gold painting and processing method thereof

Abstract

The invention provides a relief embroidery gold painting and a processing method. The processing method comprises the following steps: coating a gold layer on a stamped substrate; coating and curing a photo-curing adhesive layer on the gold layer, and forming a first micropore with the diameter of 50-200 nanometers in the gold layer through laser penetrating through the photo-curing adhesive layer; the substrate with the first micropores formed in the photocuring adhesive layer and the gold layer is placed in an electrolyte solution to be electrolyzed, so that an oxidation reaction is generated on the inner wall of each first micropore to generate a gold trioxide layer; and the substrate in the electrolyte solution is taken out, and organic pigment is sprayed to the outer surface of the photocuring adhesive layer, so that the organic pigment permeates into the first micropores and is subjected to a bonding reaction with the gold trioxide layer on the inner walls of the first micropores, and the organic pigment is adsorbed on the inner walls of the first micropores. According to the invention, only the inner wall of the first micropore is subjected to electrolytic oxidation to form the gold trioxide layer, and the gold trioxide layer and the coated organic pigment layer are subjected to bonding reaction to adsorb the organic pigment layer into the first micropore, so that the adsorption capacity is enhanced.

Description

Technical Field

[0001] The present application relates to the technical field of gold painting processing, and in particular to a relief embroidery gold painting and a processing method thereof. Background Art

[0002] In the traditional production process of micro-carved gold paintings, because gold itself has a single color, ink pigments are often attached to the surface of gold so that the ink pigments and gold are combined to form a gold painting. The colors of gold and ink pigments complement each other, which can present a special visual effect and artistic beauty.

[0003] However, due to the smoothness of the gold surface and the extremely stable nature of gold, when the ink pigment is applied to the gold surface, the ink pigment will not adhere to the gold surface enough, resulting in the ink layer being unstable and falling off.

[0004] Therefore, in the prior art, such as the patent document CN212332260U, micropores are opened on the outer surface of the gold, and pigments are sprayed on the surface where the micropores are located, so that the pigments can penetrate into the micropores, thereby increasing the adhesion area between the pigment and the gold layer, thereby increasing its adsorption force. However, the method of increasing its adsorption force by increasing the contact area also has the problem of the pigment layer being unstable and falling off when the gold painting is subjected to external friction. Summary of the invention

[0005] In view of this, it is necessary to provide a kind of relief embroidery gold painting and processing method, to solve the above problems.

[0006] The embodiment of the present application provides a method for processing relief embroidery gold painting, comprising the following steps:

[0007] Apply a gold layer to the stamped substrate;

[0008] Coating and curing a light-curing adhesive layer on the gold layer, and penetrating the light-curing adhesive layer with a laser to open a first microhole with a diameter of 50-200 nanometers on the gold layer;

[0009] Placing the substrate with the first micropores formed on the photocurable adhesive layer and the gold layer in an electrolyte solution for electrolysis, so that an oxidation reaction occurs at the inner wall of each first micropore to form a gold trioxide layer;

[0010] The substrate in the electrolyte solution is taken out, and an organic pigment is sprayed onto the outer surface of the photocurable adhesive layer, so that the organic pigment penetrates into the first micropore and undergoes a bonding reaction with the gold trioxide layer on the inner wall of the first micropore, so as to be adsorbed on the inner wall of the first micropore.

[0011] In at least one embodiment of the present application, the step of “coating and curing a light-curing adhesive layer on the gold layer, and penetrating the light-curing adhesive layer with a laser to open a first microhole with a diameter of 50-200 nanometers on the gold layer” specifically includes the following steps:

[0012] A second microhole with a diameter of 200-1000 nanometers and a depth of 300-500 nanometers is formed on the photocurable adhesive layer and the gold layer and is coaxial with the first microhole;

[0013] Spraying and curing negative photoresist on the inner walls of the first microhole and the second microhole;

[0014] Use a photolithography machine with a numerical aperture of 0.85 and an ultraviolet wavelength of 193 nanometers to expose only the inner wall of the second microhole with the top edge of the second microhole in contact with the photocurable adhesive layer as the irradiation reference line, so that the negative photoresist on the inner wall of the second microhole and the photocurable adhesive layer forms a mask to prevent the electrolyte from penetrating into the outer surface of the gold layer;

[0015] The inner walls of the first micropore and the second micropore are cleaned with a developer to remove the photoresist on the inner wall of the first micropore.

[0016] In at least one embodiment of the present application, the first microholes are opened on the gold layer at equal intervals in a matrix manner.

[0017] In at least one embodiment of the present application, the first microholes are opened on the gold layer in an equilateral triangle grid.

[0018] In at least one embodiment of the present application, the organic pigment is a combination of one or more of a hydroxy compound pigment, an amino compound pigment, a thiol compound pigment, and a phosphate compound pigment.

[0019] A relief embroidery gold painting, using the relief embroidery gold painting processing method as described above, comprising:

[0020] substrate;

[0021] A gold layer is coated on the substrate;

[0022] A photocurable adhesive layer is coated on the outer surface of the gold layer, and the photocurable adhesive layer and the gold layer are jointly provided with first micropores with a diameter of 50-200 nanometers;

[0023] A gold trioxide layer is provided on the inner wall of the first micropore;

[0024] The organic pigment layer is partially bonded to the gold trioxide layer in the first micropore, and partially extends out of the first micropore and adheres to the surface of the photocurable adhesive layer.

[0025] In at least one embodiment of the present application, the photocurable adhesive layer and the gold layer are further provided with a second microhole with a diameter of 200-1000 nanometers and arranged coaxially with the first microhole;

[0026] A mask is also provided on the inner wall of the second micropore, and the mask covers the inner wall of the second micropore to isolate the electrolyte;

[0027] The gold trioxide layer is arranged on the inner wall of the first micropore and is used for bonding reaction with the organic pigment to adsorb the organic pigment.

[0028] In at least one embodiment of the present application, the depth of the second micropores ranges from 300 to 500 nanometers.

[0029] In at least one embodiment of the present application, a step surface is formed between the first micropore and the second micropore, and the gold trioxide layer is disposed on the inner wall of the first micropore and the step surface.

[0030] In at least one embodiment of the present application, the organic pigment is a combination of one or more of a hydroxy compound pigment, an amino compound pigment, a thiol compound pigment, and a phosphate compound pigment.

[0031] This application has at least the following beneficial effects:

[0032] 1. The present application first coats and fixes a light-curing adhesive layer on the gold layer, and then jointly opens a first micropore between the light-curing adhesive layer and the gold layer. Since the light-curing adhesive layer covers the surface of the gold layer, it can cover and stop the contact between the gold surface and the electrolyte, so that an oxidation reaction occurs and the gold surface turns black. In addition, only the inner wall of the first micropore is electrolytically oxidized to form a trioxide gold layer, so that a bonding reaction occurs with the subsequently coated organic pigment layer to adsorb the organic pigment layer into the first micropore. The bonding reaction enhances the adsorption force between the inner wall of the first micropore and the organic pigment, thereby increasing its stability.

[0033] 2. The present application forms a mask by opening a second microhole coaxial with the first microhole and exposing the photoresist coated on the inner wall of the second microhole, and the mask completely covers the photocurable adhesive layer and the gold layer, thereby preventing the electrolyte from penetrating between the photocurable adhesive layer and the gold layer during electrolysis in the electrolyte solution and causing oxidation reaction on the surface of the gold layer, thereby increasing the glossiness of the embossed gold. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a schematic diagram of the structure of the embossed embroidery gold painting in Example 1 of the present application.

[0035] Figure 2 for Figure 1The cross-section of the relief embroidery gold painting shown is when coated with negative photoresist.

[0036] Figure 3 for Figure 1 The cross-sectional view of the relief embroidery gold painting shown is when the mask is formed by exposure.

[0037] Figure 4 for Figure 1 The cross-sectional view of the embossed embroidery gold painting after the negative photoresist in the first microhole is removed.

[0038] Figure 5 for Figure 1 The cross-section of the relief embroidery gold painting shown is when it is exposed to oxidation to form gold trioxide.

[0039] Figure 6 for Figure 1 The cross-sectional view of the relief embroidery gold painting shown is when the mask is formed by exposure.

[0040] Figure 7 This is a flowchart of the relief embroidery gold painting processing method in Example 2 of the present application.

[0041] Main component symbols

[0042] 100, embossed embroidered gold painting; 10, substrate; 20, gold layer; 30, photocurable adhesive layer; 10a, first micropore; 10b, second micropore; 101, step surface; 40a, photoresist; 40b, mask; 50, gold trioxide layer; 60, organic pigment layer. DETAILED DESCRIPTION

[0043] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0044] It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a central component at the same time. When a component is considered to be "located on" another component, it may be directly located on the other component or there may be a central component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.

[0045] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0046] Embodiment 1

[0047] For easier understanding, see Figure 1-Figure 6, Embodiment 1 of the present application provides a relief embroidery gold painting 100, comprising: a substrate 10;

[0048] A gold layer 20 is coated on the substrate 10;

[0049] A photocurable adhesive layer 30 is coated on the outer surface of the gold layer 20, and the photocurable adhesive layer 30 and the gold layer 20 are provided with first micropores 10a with a diameter of 50-200 nanometers;

[0050] The gold layer 20 is further provided with a gold trioxide layer 50 on the inner wall of the first micropore 10a, and the gold trioxide layer 50 is provided with an organic pigment layer 60 adsorbed thereon by bonding reaction in the first micropore 10a.

[0051] Specifically, the organic pigment layer 60 is partially bonded to the gold trioxide layer 50 in the first micropore 10a, and partially extends out of the first micropore 10a and adheres to the surface of the photocurable adhesive layer 30, so that when the organic pigment layer 60 is coated, it can partially adhere to the first micropore 10a to increase the adsorption area and increase the chemical bonding force, thereby increasing its adsorption, and partially overflow and adhere to the photocurable adhesive layer 30 to show the color effect of the pigment.

[0052] It should be noted that the relief embroidery gold painting 100 referred to in the first embodiment is an embroidery pattern, which is created by coating a gold layer 20 and a pigment layer on a base (such as cardboard, plastic board or metal plate, etc.) to create an art work with the beauty of gold and pigment coexisting.

[0053] In a specific embodiment, the substrate 10 is a metal plate (such as an aluminum plate, etc.), which is placed in a specific cavity and punched through a pre-designed stamping die to produce an embroidery painting with a three-dimensional effect.

[0054] Since gold is a smooth inert metal with stable chemical properties and a smooth surface, when making the relief embroidery gold painting 100, the pigment layer is often difficult to adhere to the surface of the gold layer 20. Or when the pigment layer is attached to the surface of the gold layer 20, due to the smooth nature of gold, when the gold painting is subjected to external friction or impact, the pigment layer will often be detached from the gold layer 20. In order to solve the above problems, the prior art (such as patent document CN212332260U) opens micropores on the gold layer 20 and then sprays pigment on the surface of the gold layer 20 so that the pigment penetrates into the micropores, thereby increasing the contact area between the pigment layer and the gold layer 20, thereby increasing the physical adhesion between them. However, the method of increasing the stability of the pigment layer relative to the gold layer 20 by increasing the mutual adhesion between the gold layer 20 and the pigment layer, when subjected to a large external force, often because the pigment layer and the gold layer 20 are only physically attached, the relative adhesion between them is small, which also causes the problem of the pigment layer falling off.

[0055] Based on this, in the first embodiment, the gold layer 20 is coated on the substrate 10, and the first micropore 10a is opened on the gold layer 20 by laser, the gold trioxide layer 50 is arranged on the inner wall of the first micropore 10a, and the pigment is replaced with an organic pigment that can react with the gold trioxide layer 50. Therefore, when the pigment is sprayed on the surface of the gold layer 20 and the pigment penetrates into the micropore, the organic pigment reacts with the gold trioxide layer 50 to form a chemical connection, so as to increase the adhesion between the pigment layer and the gold layer 20, thereby increasing the stability of the pigment layer on the surface of the gold painting. In a specific embodiment, the gold trioxide layer 50 is generated by the oxidation reaction of the gold layer 20 in the first micropore 10a.

[0056] Specifically, it is known from common knowledge that when metal undergoes oxidation reaction, the oxidized metal surface will turn black, thereby affecting the gloss of the gold painting. Based on this, in the first embodiment, before the first micropore 10a is opened in the gold layer 20, a photocurable adhesive layer 30 is coated on the surface of the gold layer 20 and cured by ultraviolet light irradiation. After the photocurable adhesive layer 30 is cured, the photocurable layer and the gold layer 20 are punched together by laser to form the first micropore 10a. After the photocurable adhesive layer 30 and the gold layer 20 have punched the first micropore 10a, they are placed in an electrolyte solution and energized for electrolysis (the conditions for gold electrolysis are common knowledge and will not be repeated here). At this time, since the inner surface area of ​​the first micropore 10a increases and the micropore is relatively narrow, according to the current concentration effect, the flow of the electrolyte in the first micropore 10a is blocked, resulting in the current being unable to be evenly distributed and mainly concentrated in the first micropore 10a. Therefore, the oxidation reaction in the electrolyte is mainly concentrated in the first micropore 10a. And because the photocurable adhesive layer 30 is coated on the outer surface of the gold layer 20, the electrolyte cannot penetrate into the surface of the gold layer 20 and cannot undergo oxidation reaction on the surface of the gold layer 20. Therefore, most of the oxidation of the gold layer 20 occurs in the first micropore 10a, and accordingly generates gold trioxide (not all of it is oxidized into gold trioxide, but other oxides can be ignored, which will not be listed here). The oxidation reaction on the outer surface of the gold layer 20 is almost negligible. Therefore, when gold trioxide is generated in the first micropore 10a, the outer surface of the gold layer 20 will not be oxidized and blackened, thereby ensuring the luster of the gold painting. Furthermore, since the inner wall of the first micropore 10a is oxidized to generate gold trioxide, when the organic pigment penetrates into the first micropore 10a, it will react chemically with the oxidized gold trioxide to increase its adsorption force. Since the micropores are not directly displayed to readers for viewing, the gold painting combined in the above manner not only has a good gold luster, but also has a strong adhesion between its pigment layer and the gold layer 20, and is not easy to cause the pigment layer to fall off due to external force.

[0057] Furthermore, the above solution can also facilitate the entry of pigment molecules by setting the diameter of the first micropore 10a to 50-200 nanometers, thereby avoiding the problem of low pigment permeability caused by micropores being too small.

[0058] For further information, see Figure 2-Figure 6 , Figure 2-Figure 6 The diagram shows the process of opening holes, oxidation, exposure and pigment penetration inside the gold layer 20. As can be seen from the above scheme, after the light-curing adhesive layer 30 is coated on the gold layer 20 and the light-curing adhesive layer 30 and the gold layer 20 are laser-punched together, there will be a gap between the light-curing adhesive layer 30 and the gold layer 20, so that during the electrolysis process, the electrolyte penetrates into the outer surface of the gold layer 20 through the gap between the light-curing adhesive layer 30 and the gold layer 20, so that the outer surface of the gold layer 20 undergoes oxidation reaction and turns black, affecting the gloss of the gold painting.

[0059] Based on this, in this embodiment, the photocurable adhesive layer 30 and the gold layer 20 are further provided with a second microhole 10b with a diameter of 200-1000 nanometers and arranged coaxially with the first microhole 10a;

[0060] The photocurable adhesive layer 30 and the gold layer 20 are further provided with a mask 40b on the inner wall of the first micropore 10a, and the mask 40b covers the inner wall of the second micropore 10b to isolate the electrolyte;

[0061] It should be noted that, in the process of forming the first microhole 10a and the second microhole 10b, a deeper first microhole 10a is first formed on the photocurable layer 30 and the gold layer 50. Then, on the basis of the first microhole 10a, a second microhole 10b is formed which is coaxial with the first microhole 10a but has a larger diameter. In this embodiment, the depth of the first microhole 10a is greater than the depth of the second microhole 10b.

[0062] Furthermore, since the second micro-hole 10b is opened after the photo-curing adhesive layer 30 and the gold layer 50 are attached, the second micro-hole 10b is a blind hole formed on the gold layer 50 by penetrating the photo-curing adhesive layer 30. That is, the gap between the photo-curing adhesive layer 30 and the gold layer 50 is located on the inner wall of the second micro-hole 10b. When the negative photoresist 40a is exposed at the inner wall of the second micro-hole 10b to generate the mask 40b, the mask can cover the gap between the photo-curing adhesive layer 30 and the gold layer 50 to block and prevent the electrolyte from entering through the gap and oxidizing the gold layer 50, thereby preventing the problem of the surface of the gold layer 50 being oxidized and blackened, thereby ensuring the gold luster.

[0063] The gold trioxide layer 50 is disposed on the inner wall of the first micropore 10a, and is used for bonding reaction with the organic pigment to adsorb the organic pigment.

[0064] Please refer to Figure 5, by setting a mask 40b on the inner wall of the second micropore 10b to cover the gold layer 20 and the photocurable adhesive layer 30, the gap between the photocurable adhesive layer 30 and the gold layer 20 is blocked, so that during the electrolysis process, the electrolyte is blocked and blocked, thereby ensuring that the outer surface of the gold layer 20 will not be blackened due to oxidation and affect the color of the gold painting. Further, by setting a gold trioxide layer 50 in the first micropore 10a, it is ensured that when the pigment flows through the first micropore 10a and the second micropore 10b, the pigment layer can react chemically with the gold trioxide layer 50 on the inner wall of the first micropore 10a to increase its adhesion. And because the first micropore 10a is deeper than the second micropore 10b, when the pigment layer undergoes a bonding reaction in the depth of the gold layer 20, the adhesion between the gold layer 20 and the pigment layer can be increased to a greater extent. The generation process of gold trioxide is not described here, please refer to the description of Example 2 for details.

[0065] Furthermore, by setting the diameter of the second micropore 10b to a range of 200-1000 nanometers, the pigment can enter easily, and the problem of small amount of pigment infiltration due to too small pore size can be avoided. Furthermore, by setting the diameter of the second micropore 10b to be larger than the first micropore 10a, the problem of economic loss caused by excessive concentration of current density due to too small diameter of the micropore can be avoided, which leads to large amount of gold being oxidized.

[0066] Furthermore, the depth of the second micropore 10b ranges from 300 to 500 nanometers. It should be noted that the above scheme sets the depth of the second micropore 10b to the above range to facilitate the entry of the organic pigment. Preferably, by setting the depth of the second micropore 10b to the above size, it is avoided that during the subsequent exposure operation, the negative photoresist 40a in the first micropore 10a is exposed to the mask 40b due to the small depth of the second micropore 10b, resulting in a small amount of gold trioxide generated in the first micropore 10a, resulting in insufficient adsorption between the organic pigment layer 60 and the gold layer 20, resulting in instability.

[0067] Furthermore, a step surface 101 is provided between the first micropore 10 a and the second micropore 10 b , and the gold trioxide layer 50 is provided on the inner wall of the first micropore 10 a and the step surface 101 .

[0068] It should be noted that the step surface 101 is formed between the first micropore 10a and the second micropore 10b due to the diameter difference between the first micropore 10a and the second micropore 10b. Preferably, the gold trioxide layer 50 is disposed on the inner wall of the first micropore 10a and the step surface 101 to increase the coating area of ​​the gold trioxide, thereby increasing the adsorption area of ​​the gold layer 20 and the organic pigment layer 60, and increasing the stability between the organic pigment layer 60 and the gold layer 20.

[0069] In a specific embodiment, the organic pigment is a combination of one or more of a hydroxy compound pigment, an amino compound pigment, a thiol compound pigment, and a phosphate compound pigment.

[0070] It should be noted that the hydroxyl group (-OH) in the hydroxy compound pigment can react with the metal oxide of gold trioxide to form a coordination bond or a hydrogen bond. The basic chemical equation of the reaction is as follows:

[0071] R-OH+Au2O3→RO-Au2O3+H2O

[0072] The amino group (-NH2) in the amino compound pigment can coordinate with the surface of gold trioxide to form a chemical bond between the amino group and the metal oxide. The basic equation of the reaction is as follows:

[0073] R-NH2+Au2O3→R-NH-Au2O3

[0074] The thiol group (-SH) in the thiol compound pigment can form a sulfur-metal bond with the metal center on the surface of gold trioxide. The basic chemical equation of the reaction is as follows:

[0075] R-SH+Au2O3→RS-Au2O3+H2O

[0076] The phosphate group (-PO4H2) in the phosphate compound pigment can form a coordination reaction with the surface of gold trioxide. The basic chemical equation of the reaction is as follows:

[0077] R-PO4H2+Au2O3→R-PO4Au2O3+H2O

[0078] Embodiment 2

[0079] Please refer to Figure 7 The second embodiment provides a method for processing a relief embroidery gold painting 100, which specifically includes the following steps:

[0080] S10: coating a gold layer 20 on the substrate 10 after stamping.

[0081] See also Figure 1 , the substrate 10 is formed by stamping. After the substrate 10 is formed by stamping, the gold layer 20 is sprayed or coated on the surface of the substrate 10 to show the prominent morphological features of the substrate 10 and show the golden luster.

[0082] S20: coating and curing the photocurable adhesive layer 30 on the gold layer 20, and penetrating the photocurable adhesive layer 30 with a laser to open a first microhole 10a with a diameter of 50-200 nanometers on the gold layer 20.

[0083] It should be noted that, in order to place the mask 40b in the second microhole 10b where the photocurable adhesive layer 30 and the gold layer 20 are located, and to expose the gold layer 20 to the air in the first microhole 10a so as to generate gold trioxide by oxidation reaction, the following steps are specifically included after step S20:

[0084] S21: a second microhole 10b is formed on the photocurable adhesive layer 30 and the gold layer 20, and is coaxially arranged with the first microhole 10a, and has a diameter of 200-1000 nanometers and a depth of 300-500 nanometers;

[0085] S22: spraying and curing negative photoresist 40a on the inner walls of the first microhole 10a and the second microhole 10b;

[0086] S23: using a photolithography machine with a numerical aperture of 0.85 and an ultraviolet wavelength of 193 nanometers, taking the top edge of the second microhole 10b in contact with the photocurable adhesive layer 30 as the irradiation reference line, only the inner wall of the second microhole 10b is exposed, so that the negative photoresist 40a on the inner wall of the second microhole 10b and the photocurable adhesive layer 30 forms a mask 40b, which is used to prevent the electrolyte from penetrating into the outer surface of the gold layer 20;

[0087] S24: Using a developer to clean the inner walls of the first micropore 10a and the second micropore 10b to remove the photoresist 40a on the inner wall of the first micropore 10a.

[0088] It should be noted that the above scheme sets the diameter and depth of the second micropore 10b to the above ranges to facilitate the entry of the organic pigment. Preferably, by setting the depth of the second micropore 10b to the above dimensions, it is avoided that during the subsequent exposure operation, the negative photoresist 40a in the first micropore 10a is exposed to the mask 40b due to the small depth of the second micropore 10b, resulting in a small amount of gold trioxide generated in the first micropore 10a, resulting in insufficient adsorption between the organic pigment layer 60 and the gold layer 20 and instability.

[0089] It should be noted that the negative photoresist 40a is a type of photoresist 40a that undergoes chemical changes after exposure, which is different from the positive photoresist 40a. The main feature of the negative photoresist 40a is that after ultraviolet (UV) exposure, the photoresist 40a in the exposed area will become stronger through a cross-linking reaction, while the unexposed area will be dissolved by the developer.

[0090] Furthermore, the exposure device for the negative photoresist 40a is a photolithography machine. In a photolithography machine, the numerical aperture (NA) of the photolithography machine is a unitless quantity, which represents the focusing ability and optical resolution of the optical system, and is defined as: NA = n·sin(θ), where NA is the numerical aperture, n is the refractive index of the medium, for air, n≈1, and θ is the semi-aperture angle of the lens or optical element. The relationship between the depth of focus (DOF) of the photolithography machine and the wavelength and numerical aperture of the light source is as follows:

[0091]

[0092] In this embodiment, the numerical aperture NA=0.85 and the wavelength of the external light λ=193 nanometers are used. Substituting them into the above formula, it can be known that the focal depth DOF≈271.2 nanometers is obtained, and the focal depth represents the range in which the ultraviolet light of the photolithography machine can be clearly irradiated. Therefore, in this scheme, by setting the depth of the second micropore 10b to between 300-500 nanometers, when the photolithography machine is used for ultraviolet exposure, the ultraviolet light can only be irradiated on the inner wall of the second micropore 10b, but cannot be clearly irradiated on the inner wall of the first micropore 10a. Since the negative photoresist 40a will harden when exposed to ultraviolet light and will not be washed away by the developer. Therefore, when the negative photoresist 40a is sprayed on the inner walls of the first micropore 10a and the second micropore 10b, the negative photoresist 40a in the second micropore 10b is hardened by the ultraviolet light of the photolithography machine without being affected by the developer, while the negative photoresist 40a in the first micropore 10a is still a softened structure. After exposure, the softened negative photoresist 40a in the first micropore 10a is cleaned by a developer to produce Figure 4 The state shown in FIG. 1 is shown in FIG. 1 . At this time, the hardened negative photoresist 40a forms a Figure 4 The mask 40b is shown as shaped like a .

[0093] For further details, please refer to Figure 2 and Figure 3 , the ultraviolet light emitted from the photolithography machine is a point light source, which is a circular purple aperture when irradiated into the second microhole 10b. In order to ensure the irradiation range of the purple light source, in a specific embodiment, the purple light source emitted from the photolithography machine uses the top edge of the second microhole 10b in contact with the photocurable adhesive layer 30 as the irradiation reference line to only expose the inner wall of the second microhole 10b. That is, the upper vertex of the circular purple light source irradiated on the second microhole 10b is tangent to the top edge of the second microhole 10b in contact with the photocurable adhesive layer 30. Combined with the cross-sectional view, it can be obtained that the vertex of the photocurable adhesive layer 30 is used as the starting point of irradiation, and the inner wall of the second microhole 10b is used as the irradiation range for exposure, so as to obtain the mask 40b structure only in the second microhole 10b.

[0094] Furthermore, the thickness of the photocurable adhesive layer 30 is smaller than the length of the mask 40 b , that is, after the mask 40 b is generated, the mask 40 b can cover the gap between the photocurable adhesive layer 30 and the gold layer 20 .

[0095] In a specific embodiment, the thickness of the photocurable adhesive layer 30 is less than 271.2 nanometers, that is, when a photolithography machine with a numerical aperture of 0.85 and an ultraviolet wavelength of 193 nanometers is used and the top edge of the second microhole 10b in contact with the photocurable adhesive layer 30 is used as the irradiation reference line to perform exposure processing only on the inner wall of the second microhole 10b, the mask 40b generated by the exposure can completely cover the gap between the photocurable adhesive layer 30 and the gold layer 20, thereby preventing the electrolyte from flowing into the gold layer 20 through the above-mentioned gap.

[0096] S30: The substrate 10 with the first micropores 10a formed on the photocurable adhesive layer 30 and the gold layer 20 is electrolyzed in an electrolyte solution so that an oxidation reaction occurs at the inner wall of each first micropore 10a to generate a gold trioxide layer 50.

[0097] It should be noted that after the above steps, the gold layer 20 in the first micropore 10a is directly exposed to the air. When the substrate 10, the gold layer 20 and the photocurable adhesive layer 30 are placed in an electrolyte solution for electrolysis, the electrolyte can directly enter the first micropore 10a and contact with the exposed gold layer 20 to undergo an oxidation reaction, thereby generating a gold trioxide layer 50 on the inner wall of the first micropore 10a.

[0098] S40: Take out the substrate 10 in the electrolyte solution, and spray an organic pigment onto the outer surface of the photocurable adhesive layer 30, so that the organic pigment penetrates into the first micropore 10a and reacts with the gold trioxide layer 50 on the inner wall of the first micropore 10a to be adsorbed on the inner wall of the first micropore 10a.

[0099] It should be noted that when the gold trioxide layer 50 is formed on the inner wall of the first micropore 10a, and the inner wall of the second micropore 10b is blocked between the photocurable adhesive layer 30 and the gold layer 20 by the mask 40b, the organic pigment penetrates into the first micropore 10a and reacts with the gold trioxide layer 50 in the first micropore 10a to adhere together. In the second micropore 10b, due to the shielding of the mask 40b, the electrolyte and the organic pigment cannot enter the surface of the gold layer 20 through the gap between the photocurable adhesive layer 30 and the gold layer 20, thereby preventing the problem of the gold painting being dark due to oxidation of the gold layer 20 surface, and maintaining the luster of gold.

[0100] In order to ensure that the organic pigment layer 60 can be subjected to stress at multiple locations to increase the stability of the organic pigment layer 60 after penetrating into the first micropores 10a and the second micropores 10b and curing, in a specific embodiment, the first micropores 10a are opened on the gold layer 20 in a matrix manner at equal intervals.

[0101] In another embodiment, the first micro-holes 10 a are opened on the gold layer 20 in an equilateral triangle grid.

[0102] In a specific embodiment, the organic pigment is a combination of one or more of a hydroxy compound pigment, an amino compound pigment, a thiol compound pigment, and a phosphate compound pigment.

[0103] The above is only an implementation method of the present application. It should be pointed out that a person skilled in the art can make improvements without departing from the inventive concept of the present application, but these improvements are within the scope of protection of the present application.

Claims

1. A method for processing relief embroidery gold painting, characterized in that: The steps include: Apply a gold layer to the stamped substrate; Coating and curing a light-curing adhesive layer on the gold layer, and penetrating the light-curing adhesive layer with a laser to open a first microhole with a diameter of 50-200 nanometers on the gold layer; Placing the substrate with the first micropores formed on the photocurable adhesive layer and the gold layer in an electrolyte solution for electrolysis, so that an oxidation reaction occurs at the inner wall of each first micropore to form a gold trioxide layer; The substrate in the electrolyte solution is taken out, and an organic pigment is sprayed onto the outer surface of the photocurable adhesive layer, so that the organic pigment penetrates into the first micropore and undergoes a bonding reaction with the gold trioxide layer on the inner wall of the first micropore, so as to be adsorbed on the inner wall of the first micropore.

2. The method for processing relief embroidery gold painting according to claim 1, characterized in that: The step of "coating and curing the photocurable adhesive layer on the gold layer, and penetrating the photocurable adhesive layer with a laser to open a first microhole with a diameter of 50-200 nanometers on the gold layer" specifically includes the following steps: A second microhole with a diameter of 200-1000 nanometers and a depth of 300-500 nanometers is formed on the photocurable adhesive layer and the gold layer and is coaxial with the first microhole; Spraying and curing negative photoresist on the inner walls of the first microhole and the second microhole; Use a photolithography machine with a numerical aperture of 0.85 and an ultraviolet wavelength of 193 nanometers to expose only the inner wall of the second microhole with the top edge of the second microhole in contact with the photocurable adhesive layer as the irradiation reference line, so that the negative photoresist on the inner wall of the second microhole forms a mask to prevent the electrolyte from penetrating into the outer surface of the gold layer; The inner walls of the first micropore and the second micropore are cleaned with a developer to remove the photoresist on the inner wall of the first micropore.

3. The method for processing relief embroidery gold painting according to claim 1, characterized in that: The first microholes are opened on the gold layer in a matrix manner at equal intervals.

4. The method for processing relief embroidery gold painting according to claim 1, characterized in that: The first microholes are opened on the gold layer in an equilateral triangle grid.

5. The method for processing relief embroidery gold painting according to claim 1, characterized in that: The organic pigment is a combination of one or more of a hydroxy compound pigment, an amino compound pigment, a thiol compound pigment, and a phosphate compound pigment.

6. A relief embroidery gold painting, using the relief embroidery gold painting processing method according to any one of claims 1 to 5, characterized in that: include: substrate; A gold layer is coated on the substrate; A photocurable adhesive layer is coated on the outer surface of the gold layer, and the photocurable adhesive layer and the gold layer are jointly provided with first micropores with a diameter of 50-200 nanometers; A gold trioxide layer is provided on the inner wall of the first micropore; The organic pigment layer is partially bonded to the gold trioxide layer in the first micropore, and partially extends out of the first micropore and adheres to the surface of the photocurable adhesive layer.

7. The relief embroidery gold painting according to claim 6, characterized in that: The photocurable adhesive layer and the gold layer are further provided with a second microhole with a diameter of 200-1000 nanometers and arranged coaxially with the first microhole; A mask is also provided on the inner wall of the second micropore, and the mask covers the inner wall of the second micropore to isolate the electrolyte; The gold trioxide layer is arranged on the inner wall of the first micropore and is used for bonding reaction with the organic pigment to adsorb the organic pigment.

8. The relief embroidery gold painting according to claim 7, characterized in that: The depth of the second micropores ranges from 300 to 500 nanometers.

9. The relief embroidery gold painting according to claim 7, characterized in that: A step surface is also formed between the first micropore and the second micropore, and the gold trioxide layer is arranged on the inner wall of the first micropore and the step surface.

10. The relief embroidery gold painting according to claim 6, characterized in that: The organic pigment is a combination of one or more of a hydroxy compound pigment, an amino compound pigment, a thiol compound pigment, and a phosphate compound pigment.

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