A chip-implanted composite paper and its preparation process

Abstract

The present invention discloses a chip-implanted composite paper and its preparation process, which relates to the field of chip-implanted composite paper and includes a first layer of fiber paper, a chip, and a second layer of fiber paper; inner embedding grooves are provided on the mutually approaching surfaces of the first layer of fiber paper and the second layer of fiber paper; the depth of the inner embedding groove is half of the thickness of the chip, and the chip is fitted and installed in the inner embedding groove. In the present invention, the chip composite paper can absorb mechanical stress and improve the impact resistance; the chip composite paper can solve the heat dissipation problem during the operation of the chip through the graphene filler embedded in itself; the chip is fixed by using the pore structure on the chip composite paper itself, without the need for traditional adhesives, and can maintain flexibility, making the chip composite paper not easily brittle.

Description

Technical Field

[0001] The present invention relates to the field of chip-implanted composite paper, and particularly to a chip-implanted composite paper and its preparation process. Background Art

[0002] Chip-implanted composite paper is a cutting-edge application that combines electronic technology and new materials. Its typical structure includes a superposition combination of a diversion layer, a chip layer, and a functional material layer (such as absorbent paper, dust-free paper, etc.). For example, in sanitary products, a hierarchical design of "diversion layer + chip + composite core" is adopted to achieve functional zoning and signal conduction.

[0003] Chip-implanted composite paper is generally applied in the following fields:

[0004] 1. Information security and anti-counterfeiting:

[0005] In the field of classified documents, the composite paper with an implanted chip can detect illegal carrying behavior in real time. Even if the paper is torn into pieces larger than 2 mm, it can still be tracked and located through low-frequency signals, effectively preventing the leakage of sensitive information.

[0006] 2. Rapid detection carrier:

[0007] The composite paper enhanced with nano-chitin is used as the substrate of a microfluidic chip. Utilizing its biocompatibility and biodegradable characteristics, it enables rapid detection in the fields of medical diagnosis, environmental monitoring, etc. By optimizing the fiber arrangement and pore structure, the detection sensitivity and stability are improved.

[0008] 3. High-end packaging material:

[0009] The moisture-proof paper obtained by compounding DuPont paper and silica gel is used for the packaging of chip semiconductors. Through the moisture barrier of multi-layer composite materials, it protects precision electronic components. Such materials have both flexibility and high strength, meeting the industrial-level sealing requirements.

[0010] However, chip composite paper generally has the following defects during use:

[0011] First: Structural defects and manufacturing process problems. Bubbles are likely to be generated during the manufacturing process, resulting in a decline in mechanical properties; poor adhesion at the multi-layer composite interface may cause interlayer peeling.

[0012] Second: The surface of the material is easily worn, and it is prone to fracture when subjected to external force impact, reducing the service life; deformation or decomposition may occur under high temperature and high pressure environments.

[0013] Third: Using traditional adhesives to bond the chip to the surface of the composite paper, the overall flexibility becomes poor after the adhesive cures, resulting in the chip composite paper being prone to brittle fracture.

[0014] Therefore, it is necessary to propose a chip-embedded composite paper and its preparation process to solve the above problems. Summary of the invention

[0015] The object of the present invention is to provide a chip-embedded composite paper and a preparation process thereof, so as to solve the problems raised in the above-mentioned background technology.

[0016] To achieve the above object, the present invention provides the following technical solution: a chip-embedded composite paper, comprising a first layer of fiber paper, a chip and a second layer of fiber paper;

[0017] The first layer of fiber paper and the second layer of fiber paper are both provided with inner grooves on their adjacent sides;

[0018] The depth of the embedded groove is half the thickness of the chip, and the chip is embedded in the embedded groove;

[0019] The chip is externally fixed by pressing a first layer of fiber paper and a second layer of fiber paper.

[0020] The bottom surface of the embedded groove is provided with a plurality of protrusions;

[0021] The surface of the chip has protrusions;

[0022] The corresponding protrusions and protrusions are in contact with each other and clamped to achieve the positioning of the chip.

[0023] The surface of the second layer of fiber paper is also provided with a reserved groove;

[0024] The reserved groove is filled with graphene filler;

[0025] The reserved slots are provided in plurality, and the plurality of reserved slots are distributed at equal distances.

[0026] The first layer of fiber paper and the second layer of fiber paper are both soaked with wax oil.

[0027] The present invention also discloses a preparation process of chip-embedded composite paper, comprising the following steps:

[0028] S1: preparing a first layer of fiber paper and a second layer of fiber paper, preparing a plurality of fiber composite papers of the same thickness and length and width, the fiber composite papers need to be soaked with wax oil in advance, and embedded grooves are processed on the surface of the fiber composite papers by using special equipment, and a part of the fiber composite papers are provided with reserved grooves;

[0029] S2: preparing a connection circuit, and filling the reserved groove with a graphene filler;

[0030] S3: Implant the chip. Place the chip in the corresponding embedded slot, then stack the first layer of fiber paper and the second layer of fiber paper on top of each other, and fix them by low-temperature hot pressing between the first layer of fiber paper and the second layer of fiber paper. Ensure that the excess air between the first layer of fiber paper and the second layer of fiber paper is discharged during hot pressing. The protrusions on the chip are squeezed and fitted with the corresponding protrusions to complete the preparation of the chip composite paper.

[0031] Preferably, the special equipment includes an upper substrate and a lower substrate;

[0032] A rotating shaft is arranged between the upper substrate and the lower substrate. A connecting cylinder is fixedly arranged on the rotating shaft, and pressing plates are arranged on both the upper and lower sides of the connecting cylinder;

[0033] On the surfaces of the upper substrate and the lower substrate that are close to each other, templates are fixedly arranged, and the upper and lower two pressing plates respectively correspond to the two templates one by one.

[0034] Preferably, triangular support frames are arranged at both ends of the rotating shaft, and the triangular support frames are rotatably connected to the rotating shaft.

[0035] Preferably, an electric push rod is arranged between the connecting cylinder and the pressing plate.

[0036] Preferably, capillary pores are arranged on the template;

[0037] Among them, air cavities are arranged inside the upper substrate and the lower substrate. A suction pump is connected to the air cavity, and the air cavity is communicated with the capillary pores.

[0038] Preferably, ribs for forming reserved grooves on the surface of the second layer of fiber paper are arranged on the upper template.

[0039] The technical effects and advantages of the present invention:

[0040] 1. This chip composite paper can absorb mechanical stress and improve the impact resistance;

[0041] 2. This chip composite paper can solve the heat dissipation problem during the operation of the chip through the graphene filler embedded in itself;

[0042] 3. The chip is fixed by using the pore structure on the chip composite paper itself, without the need for traditional adhesives, and can maintain flexibility, making the chip composite paper not easily brittle;

[0043] 4. The preparation process of the chip composite paper sets up a special preparation process flow and special equipment for this chip composite paper, enabling the mass production of the chip composite paper;

[0044] 5. After the first layer of fiber paper and the second layer of fiber paper are combined, the overall thickness is consistent, and there will be no problem of protrusion. Therefore, it is possible to reduce the problem of delamination between the chip and the first layer of fiber paper and the second layer of fiber paper caused by wear and external impact; it replaces the method in the prior art of directly pressing two first layer of fiber papers with the same thickness on both sides of the chip, which is prone to protrusion.

[0045] 6. Due to the electrical conductivity and thermal conductivity of the graphene filler, the graphene filler can not only connect between the chip and the external circuit, but also dissipate heat from the chip, solving the problem of insufficient heat dissipation capacity of the packaged chip.

[0046] 7. The first layer of fiber paper and the second layer of fiber paper are infiltrated with wax oil. The setting of the wax oil, on the one hand, increases the firmness during the low-temperature hot pressing and fixing of the first layer of fiber paper, the chip and the second layer of fiber paper, and also increases the hydrophobicity and insulation of the chip composite paper, improving the waterproof ability of the chip composite paper, preventing leakage, and having a smooth surface, not prone to problems such as wear. Due to the hydrophobicity of the wax oil, it also avoids the phenomenon of air entering and leaving the inside of the chip composite paper in the later stage, improving the service life of the chip composite paper.

[0047] 8. Since the wax oil fully penetrates the first layer of fiber paper and the second layer of fiber paper, when the first layer of fiber paper and the second layer of fiber paper are low-temperature hot pressed and fixed, the first layer of fiber paper and the second layer of fiber paper can be completely bonded and fixed, not prone to generating bubbles, and even less prone to delamination; and even if delamination occurs, due to the adhesiveness of the wax oil, the first layer of fiber paper or the second layer of fiber paper can be bonded and fixed again in the later stage, making the delamination phenomenon in the chip composite paper reparable.

[0048] 9. Since the first layer of fiber paper and the second layer of fiber paper have a certain shaping effect after being penetrated by the wax oil, it also enables the first layer of fiber paper and the second layer of fiber paper to be shaped when low-temperature hot pressed and fixed, and not easily reset due to the curving effect of the first layer of fiber paper and the second layer of fiber paper itself. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a schematic structural diagram of the chip-implanted composite paper of the present invention.

[0050] Figure 2 It is a cross-sectional view of the chip-implanted composite paper of the present invention.

[0051] Figure 3 For the present invention Figure 2 The enlarged schematic diagram of the structure at A in

[0052] Figure 4 It is a schematic structural diagram of a perspective view of a special device for preparing the chip-implanted composite paper of the present invention.

[0053] Figure 5 Another perspective structural schematic diagram of the special equipment for preparing the chip-implanted composite paper of the present invention.

[0054] Figure 6 For the present invention Figure 5 The enlarged schematic diagram of the structure at B in

[0055] Figure 7 The front view of the special equipment for preparing the chip-implanted composite paper of the present invention.

[0056] Figure 8 The three-dimensional sectional view of the special equipment for preparing the chip-implanted composite paper of the present invention.

[0057] Figure 9 The state structural schematic diagram before the first layer of fiber paper and the second layer of fiber paper of the present invention are to be laminated.

[0058] Figure 10 The state structural schematic diagram after the first layer of fiber paper and the second layer of fiber paper of the present invention are laminated.

[0059] Figure 11 For the present invention Figure 10 The enlarged schematic diagram of the structure at C in

[0060] In the figure: 1. The first layer of fiber paper; 2. Chip; 3. The second layer of fiber paper; 4. Protrusion; 5. Embedded groove; 6. Protrusion; 7. Reserved groove; 8. Graphene filler; 9. Upper substrate; 10. Pressing plate; 11. Electric push rod; 12. Connecting cylinder; 13. Rotating shaft; 14. Template; 15. Lower substrate; 16. Capillary pore; 17. Triangular support frame; 18. Suction pump; 19. Upper and lower substrate connecting frame; 20. Hose; 21. Rib; 22. Air cavity. Detailed implementation manners

[0061] The present invention provides a chip-implanted composite paper and its preparation process as shown in Figures 1-11 , specifically discloses a chip composite paper that can absorb mechanical stress and improve impact resistance, and the chip composite paper can solve the heat dissipation problem during the operation of the chip 2 through the graphene filler 8 embedded in itself, and the chip 2 is fixed by using the pore structure on the chip composite paper itself, without the need for traditional adhesives, and can maintain flexibility, making the chip composite paper not easily brittle;

[0062] The preparation process of the chip composite paper sets a special preparation process flow and special equipment for the chip composite paper, so that the chip composite paper can be mass-produced.

[0063] Refer to Figure 1As shown in the figure, the chip composite paper includes a first layer of fiber paper 1, a chip 2 and a second layer of fiber paper 3. The first layer of fiber paper 1 and the second layer of fiber paper 3 are both provided with an embedded groove 5 on the side close to each other. The depth of the embedded groove 5 is half the thickness of the chip 2. In this way, when the chip 2 is pressed into the embedded groove 5, the overall thickness of the first layer of fiber paper 1 and the second layer of fiber paper 3 is consistent after being combined, and there will be no bulge problem. Therefore, the problem of interlayer peeling between the chip 2 and the first layer of fiber paper 1 and the second layer of fiber paper 3 caused by wear and external force impact can be reduced; instead of the method in the prior art where two first layers of fiber paper 1 of the same thickness are directly pressed on both sides of the chip 2, which is prone to bulges.

[0064] In the present invention, the first layer of fiber paper 1, the second layer of fiber paper 3 and the chip 2 are fixed by embedding, without the need for adhesive. The bottom surface of the embedded groove 5 is provided with a plurality of protrusions 6, and the surface of the chip 2 usually has densely arranged protrusions 4. Therefore, when the chip 2 is embedded in the embedded groove 5, the corresponding protrusions 4 and the protrusions 6 are mutually abutted and clamped, thereby realizing the positioning of the chip 2 and preventing the chip 2 from being moved out of the embedded groove 5.

[0065] It should be noted that the protrusions 4 on the surface of the chip 2 are usually bumps for circuit connection or metal layers produced by electroplating. The present invention fully utilizes the characteristics of the surface of the chip 2 to complete the packaging and fixation of the chip 2, which is highly practical and does not require high-temperature packaging to cause damage to the first layer of fiber paper 1, the chip 2, and the second layer of fiber paper 3.

[0066] A reserved groove 7 is also provided on the surface of the second layer of fiber paper 3. There are multiple reserved grooves 7. Both ends of the reserved groove 7 penetrate the embedded groove 5 and the outer circle of the second layer of fiber paper 3 respectively. The reserved groove 7 is used when the chip 2 is connected to an external circuit.

[0067] refer to Figure 2 and Figure 3 As shown in the figure, when the first layer of fiber paper 1 and the second layer of fiber paper 3 are overlapped with each other, they are fixed by low-temperature hot pressing or other methods, and the reserved groove 7 is filled with a graphene filler 8, one end of the graphene filler 8 is connected to the circuit on the chip 2, and the other end of the graphene filler 8 is arranged through the outer circle of the chip composite paper. Due to the electrical conductivity and thermal conductivity of the graphene filler 8, the graphene filler 8 can not only serve the purpose of connecting the chip 2 with the external circuit, but also dissipate the heat of the chip 2, thereby solving the problem of insufficient heat dissipation capacity of the packaged chip 2.

[0068] It is worth mentioning that in the present invention, both the first layer of fiber paper 1 and the second layer of fiber paper 3 are made by soaking with wax oil, so that the first layer of fiber paper 1 and the second layer of fiber paper 3 are infiltrated with wax oil. The setting of the wax oil, on the one hand, increases the firmness during the low-temperature hot pressing and fixing of the first layer of fiber paper 1, the chip 2 and the second layer of fiber paper 3, and also increases the hydrophobicity and insulation of the chip composite paper, improving the waterproof ability of the chip composite paper, preventing leakage of electricity, having a smooth surface and being not prone to problems such as abrasion. Due to the hydrophobicity of the wax oil, the phenomenon of air entering and leaving the interior of the chip composite paper in the later stage is also avoided, improving the service life of the chip composite paper. Since the wax oil fully soaks the first layer of fiber paper 1 and the second layer of fiber paper 3, when the first layer of fiber paper 1 and the second layer of fiber paper 3 are fixed by low-temperature hot pressing, the first layer of fiber paper 1 and the second layer of fiber paper 3 can be completely bonded and fixed, not easily generating bubbles and even less likely to occur delamination. And even if the delamination phenomenon occurs, due to the adhesiveness of the wax oil, the first layer of fiber paper 1 or the second layer of fiber paper 3 can be bonded and fixed again in the later stage, making the delamination phenomenon in the chip composite paper reparable.

[0069] The present invention also discloses a preparation process of a chip-implanted composite paper, which specifically includes the following steps:

[0070] The first step: Prepare the first layer of fiber paper 1 and the second layer of fiber paper 3. Prepare several pieces of composite paper with the same thickness, length and width dimensions, such as fiber paper, etc. The composite paper needs to be soaked with wax oil in advance. Use special equipment to process an embedded groove 5 on the surface of the composite paper. The bottom of the embedded groove 5 has a protrusion 6, and a reserved groove 7 is opened on a part of the composite paper, ensuring that the maximum thickness of the composite paper with the embedded groove 5, the protrusion 6 and the reserved groove 7 is still the same as the thickness of the composite paper before processing.

[0071] The second step: Prepare the connection circuit. Fill the reserved groove 7 with graphene filler 8.

[0072] The third step: Implant the chip 2. Place the chip 2 in the corresponding embedded groove 5, and then stack the first layer of fiber paper 1 and the second layer of fiber paper 3 on top of each other. The first layer of fiber paper 1 and the second layer of fiber paper 3 are fixed by low-temperature hot pressing at 40 to 60 degrees Celsius. When hot pressing and fixing, ensure that the excess air between the first layer of fiber paper 1 and the second layer of fiber paper 3 is discharged. The protrusion 4 on the chip 2 can be squeezed and fitted with the corresponding protrusion 6 to complete the preparation of the chip composite paper.

[0073] In practice, the protrusion 6 can also be set in shapes such as strips and squares according to actual needs, which is convenient for arranging according to the actual structure of the surface of the chip 2 and can be adjusted by those skilled in the art, so no further details are given here.

[0074] Reference Figure 4 and Figure 5As shown, they are respectively structural schematic diagrams of a special device for preparing chip composite paper from two perspectives.

[0075] In Figure 4 , Figure 5 and Figure 8 it is shown that the special device includes an upper substrate 9, a pressing plate 10, an electric push rod 11, a connecting cylinder 12, a rotating shaft 13, a template 14 and a lower substrate 15. Among them, the upper substrate 9 and the lower substrate 15 are arranged up and down, and are connected by an upper and lower substrate connecting frame 19 between the upper substrate 9 and the lower substrate 15. The connecting cylinder 12 is arranged at the middle position between the upper substrate 9 and the lower substrate 15. The rotating shaft 13 is fixedly arranged on the connecting cylinder 12. Triangular support frames 17 are arranged at both ends of the rotating shaft 13. The triangular support frames 17 are rotatably connected to the rotating shaft 13. The electric push rod 11 is fixedly connected between the connecting cylinder 12 and the pressing plate 10. Templates 14 are fixedly arranged on the surfaces of the upper substrate 9 and the lower substrate 15 close to each other. A suction pump 18 is arranged on one side of the lower substrate 15. Air cavities 22 are arranged inside both the lower substrate 15 and the upper substrate 9. The suction pump 18 is communicated with the air cavity 22 through a hose 20. Multiple groups of capillary pores 16 are arranged on the surface of the template 14. The capillary pores 16 are communicated with the inside of the air cavity 22. When the suction pump 18 sucks air, a negative pressure adsorption effect is generated at the capillary pores 16, and the first layer of fiber paper 1 or the second layer of fiber paper 3 can be adsorbed and fixed on the template 14. Then, the electric push rod 11 is started to push the pressing plate 10 to move, and the pressing plate 10 thermally presses the first layer of fiber paper 1 or the second layer of fiber paper 3 at a low temperature on the corresponding template 14. Ribs 21 are arranged on the upper template 14, forming the first layer of fiber paper 1 with an embedded groove 5 and the second layer of fiber paper 3 with an embedded groove 5 and a reserved groove 7; the ribs 21 can be pressed on the second layer of fiber paper 3 to form a reserved groove 7.

[0076] It should be noted that the thickness of the template 14 is equal to the depth of the embedded groove 5, and the length and width dimensions of the pressing plate 10 are respectively larger than the length and width dimensions of the first layer of fiber paper 1 and the second layer of fiber paper 3. In this way, when the pressing plate 10 presses the first layer of fiber paper 1 and the second layer of fiber paper 3, the maximum thickness on the first layer of fiber paper 1 and the second layer of fiber paper 3 can be made equal to the original thickness of the first layer of fiber paper 1 and the second layer of fiber paper 3, that is, there is no convex part. In this way, when the chip 2 is embedded in the embedded groove 5 between the first layer of fiber paper 1 and the second layer of fiber paper 3, the thickness of the formed chip composite paper can be consistent and the surface is uniform, avoiding the increase of wear or impact with the outside due to the existence of convexities.

[0077] Since the first layer of fiber paper 1 and the second layer of fiber paper 3 have a certain shaping effect after being soaked with wax oil, it also enables the first layer of fiber paper 1 and the second layer of fiber paper 3 to be shaped when being thermally pressed and fixed at a low temperature, and is not easily reset due to the curving effect of the first layer of fiber paper 1 and the second layer of fiber paper 3 itself.

[0078] When laminating the first layer of fiber paper 1 and the second layer of fiber paper 3, due to the provision of a plurality of capillary pores 16, the structures on the first layer of fiber paper 1 and the second layer of fiber paper 3 will also be squeezed into the corresponding capillary pores 16 to form protrusions 6, thereby increasing the connection strength between the chip 2 and the first layer of fiber paper 1 and the second layer of fiber paper 3.

[0079] A motor for driving the rotation of the rotating shaft 13 is installed on one of the triangular support frames 17, and the motor is not shown in the figure. When the motor drives the rotation of the rotating shaft 13, the connecting cylinder 12, the electric push rod 11 and the pressing plate 10 will also rotate. After rotating 90°, it is convenient to take out the first layer of fiber paper 1 and the second layer of fiber paper 3 from the template 14, which is convenient to use.

[0080] Furthermore, the suction pump 18 can also inflate the air cavity 22 so that the gas is discharged from the capillary pores 16, which can assist the protrusions 6 to break away from the capillary pores 16 and achieve a demolding effect.

[0081] Therefore, the special equipment disclosed in the present invention can not only process the first layer of fiber paper 1 or the second layer of fiber paper 3 with the embedded groove 5 and the protrusion 6, but also facilitate demolding, taking and placing, and can shape the first layer of fiber paper 1 and the second layer of fiber paper 3, with strong practicability.

Claims

1. A chip-implanted composite paper, characterized in that: It includes a first-layer fiber paper (1), a chip (2), and a second-layer fiber paper (3); On the mutually approaching surfaces of the first-layer fiber paper (1) and the second-layer fiber paper (3), embedded grooves (5) are provided; Among them, the depth of the embedded groove (5) is half of the thickness of the chip (2), and the chip (2) is fitted and installed in the embedded groove (5); The outside of the chip (2) is fixed by pressing with the first-layer fiber paper (1) and the second-layer fiber paper (3); On the bottom surface of the embedded groove (5), a plurality of protrusions (6) are provided; On the surface of the chip (2), there are protrusions (4); The corresponding protrusions (4) and the protrusions (6) are in mutual contact and clamping to realize the positioning of the chip (2); On the surface of the second-layer fiber paper (3), a reserved groove (7) is further provided; In the reserved groove (7), a graphene filler (8) is filled; There are a plurality of the reserved grooves (7), and the plurality of reserved grooves (7) are equidistantly distributed; Both the first-layer fiber paper (1) and the second-layer fiber paper (3) are soaked with wax oil.

2. A preparation process of a chip-implanted composite paper, characterized in that: For preparing the chip-implanted composite paper described in claim 1, it includes the following steps: S1: Prepare the first-layer fiber paper (1) and the second-layer fiber paper (3). Prepare several fiber composite papers with the same thickness, length, and width dimensions. The fiber composite papers need to be soaked with wax oil in advance. Use special equipment to process embedded grooves (5) on the surface of the fiber composite papers, and on a part of the fiber composite papers, reserved grooves (7) are opened; S2: Prepare the connection circuit. Fill the reserved groove (7) with a graphene filler (8); S3: Implant the chip (2). Place the chip (2) in the corresponding embedded groove (5), and then stack the first-layer fiber paper (1) and the second-layer fiber paper (3) on top of each other. The first-layer fiber paper (1) and the second-layer fiber paper (3) are fixed by low-temperature hot pressing at 40 to 60 degrees Celsius. When hot pressing and fixing, ensure that the excess air between the first-layer fiber paper (1) and the second-layer fiber paper (3) is discharged. The protrusions (4) on the chip (2) and the corresponding protrusions (6) are mutually extruded and fitted and fixed to complete the preparation of the chip composite paper.

3. The preparation process of a chip-implanted composite paper according to claim 2, wherein: The special equipment includes an upper substrate (9) and a lower substrate (15); Between the upper substrate (9) and the lower substrate (15), a rotating shaft (13) is provided. On the rotating shaft (13), a connecting cylinder (12) is fixedly provided. On both the upper and lower sides of the connecting cylinder (12), pressing plates (10) are provided; On the mutually approaching surfaces of the upper substrate (9) and the lower substrate (15), templates (14) are fixedly provided, and the upper and lower two pressing plates (10) respectively correspond to the two templates (14).

4. The preparation process of a chip-implanted composite paper according to claim 3, characterized in that: At both ends of the rotating shaft (13), triangular support frames (17) are provided, and the triangular support frames (17) are rotatably connected to the rotating shaft (13).

5. The preparation process of a chip-implanted composite paper according to claim 3, characterized in that: Between the connecting cylinder (12) and the pressing plate (10), an electric push rod (11) is provided.

6. The preparation process of a chip-implanted composite paper according to claim 3, characterized in that: On the template (14), capillary pores (16) are provided; Wherein, air cavities (22) are provided inside the upper substrate (9) and the lower substrate (15), a suction pump (18) is connected to the air cavities (22), and the air cavities (22) communicate with the capillary pores (16).

7. The preparation process of a chip-implanted composite paper according to claim 3, characterized in that: Ribs (21) for forming reserved grooves (7) on the surface of the second-layer fiber paper (3) are provided on the upper template (14).

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